JP2003142792A - Electronic circuit unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a smaller electronic circuit unit by raising the mounting density of chip components. SOLUTION: A first wiring pattern 4 comprising a land 4a is formed on the surface of a rigid board 1 of hard insulating material to which one end of a flexible board 2 is secured. A second wiring pattern 5 comprising a land 5a is formed on one surface of the flexible board 2, and the second wiring pattern 5 is soldered (6) to the first wiring pattern 4 of the rigid board 1 for electrical continuation. A chip component 3 is disposed upright between the rigid board 1 and the flexible board 2, and both electrodes 3a and 3b of the chip component 3 are soldered to the lands 4a and 5a of the first and second wiring patterns 4 and 5, respectively. Since the upper space of the rigid board 1 is effectively utilized 3-dimensionally as a component mounting area, the mounting density of the chip components 3 is raised much for smaller electronic circuit unit.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit unit having a plurality of chip parts mounted on a substrate.

[0002]

2. Description of the Related Art Generally, an electronic circuit unit of this type is constructed by mounting a plurality of chip components such as chip resistors and chip capacitors on a substrate, and if necessary, the component mounting surface of the substrate. It is also known that the shield is covered with a shield. Here, the chip component has a pair of electrodes at both ends, and by soldering these electrodes to the land portion of the wiring pattern provided on the substrate, the chip component is arranged in parallel on the substrate. Has been done.

[0003]

By the way, in recent years, the technology for miniaturizing chip components has made remarkable progress, and for example, ultra-compact chip resistors and chip capacitors having external dimensions of about 0.6 × 0.9 mm have been put into practical use. . Therefore, even in the conventional electronic circuit unit described above, if such ultra-small chip components are used and these chip components are mounted on the substrate in a state where the pitch between the components is narrowed, the electronic circuit unit can be made to some extent. It is possible to reduce the size. However, there is a limit to miniaturization of chip parts, and moreover, when mounting a plurality of chip parts on a substrate, it is necessary to prevent short-circuiting of soldering parts of each chip part. It has been a factor preventing further miniaturization of the circuit unit.

The present invention has been made in view of the circumstances of the prior art as described above, and an object thereof is to provide an electronic circuit unit suitable for miniaturization by increasing the mounting density of chip components.

[0005]

In order to achieve the above object, the electronic circuit unit of the present invention comprises a rigid substrate having a first wiring pattern formed thereon and a flexible substrate having a second wiring pattern formed thereon. , A plurality of chip components having electrodes on both ends, the chip component is erected on the rigid substrate, and the flexible substrate fixed to the rigid substrate is extended above the rigid substrate, Both electrodes were connected to the land portions of the first and second wiring patterns, respectively.

According to this structure, by arranging a plurality of chip components in a standing state between the rigid substrate and the flexible substrate, the space above the rigid substrate can be effectively used three-dimensionally as a component mounting area. Therefore, the mounting density of the chip components is significantly increased, and the electronic circuit unit can be downsized. At that time, other chip components arranged in parallel on the substrate may be mounted. With this configuration, among the plurality of chip components mounted on the same substrate, the chip component arranged in the upright state. Is connected to each wiring pattern of the rigid substrate and the flexible substrate, and the chip components arranged in parallel are connected to the wiring pattern on the substrate, so that the degree of freedom in circuit design can be increased.

In order to achieve the above object, the electronic circuit unit of the present invention includes a substrate on which a wiring pattern is formed, a chip component having electrodes on both ends, and a shield cover for covering the component mounting surface of the substrate. The chip component is arranged in an upright state between the substrate and the shield cover, and both electrodes of the chip component are connected to the land portion of the wiring pattern and the shield cover, respectively.

According to this structure, by arranging the chip component in a standing state between the substrate and the shield cover, the space above the substrate can be effectively used three-dimensionally as a component mounting area. The packaging density can be remarkably increased and the electronic circuit unit can be downsized. At that time, it is preferable to mount other chip components arranged in parallel on the substrate. With this configuration, among the plurality of chip components mounted on the same substrate, the chip component arranged in the upright state. Is grounded through a shield cover, and the chip parts arranged in parallel are connected to the wiring pattern on the substrate, so that the degree of freedom in circuit design can be increased.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of an electronic circuit unit according to a first embodiment, and FIG. 2 is a sectional view of the electronic circuit unit. Is.

As shown in these figures, the electronic circuit unit according to this embodiment includes a rigid substrate 1 made of a hard insulating material such as alumina or glass epoxy resin, and a PET.
A flexible substrate 2 made of a flexible insulating film such as (polyethylene terephthalate) or polyimide, and a plurality of chip parts 3 made of chip resistors, chip capacitors, etc.
It consists of and.

A first wiring pattern 4 having a land portion 4a is formed on the surface of the rigid substrate 1, and a part of the first wiring pattern 4 extends to the end face of the rigid substrate 1 and an end face electrode 4b. Has become. Flexible board 2
Second wiring pattern 5 having land 5a on one side of
Is formed, and a ground pattern (not shown) may be formed on the opposite surface of the flexible substrate 2 if necessary. One end of the flexible substrate 2 is fixed to the surface of the rigid substrate 1 with an adhesive or the like, and at this fixing portion, the first wiring pattern 4 and the second wiring pattern 5 are solder 6 or a conductive adhesive. Have been conducted.

The chip component 3 has a rectangular parallelepiped shape, and has a pair of electrodes 3a and 3b formed at both ends in the longitudinal direction thereof. The chip component 3 is arranged so that its major axis is orthogonal to the rigid substrate 1 by soldering one electrode 3a to the land portion 4a of the first wiring pattern 4. Then, the flexible substrate 2 is bent so as to extend above the rigid substrate 1, and the other electrode 3b located on the upper end side of the chip component 3 is soldered 8 to the land portion 5a of the second wiring pattern 5. Thereby, the chip component 3 is mounted between the rigid substrate 1 and the flexible substrate 2 in an upright state. Although only two chip components 3 are shown in FIGS. 1 and 2 for simplification of description, even when three or more chip components 3 are mounted according to the circuit design, all the chip components 3 are mounted. 3 may be mounted in an upright state between the rigid substrate 1 and the flexible substrate 2.

In the electronic circuit unit according to the above-described first embodiment, the chip component 3 is placed between the rigid substrate 1 and the flexible substrate 2 in an upright state, and both electrodes 3a and 3b of the chip component 3 are placed in the upright state. Since the lands 4a and 5a of the first and second wiring patterns 4 and 5 are respectively soldered, the space above the rigid substrate 1 can be effectively used three-dimensionally as a component mounting area, and the chip component 3 can be used accordingly. The packaging density can be remarkably increased, and miniaturization of the electronic circuit unit can be promoted. Further, when the ground pattern is formed on the entire surface of the flexible substrate 2, there is an additional effect that the flexible substrate 2 can have a shield function.

FIG. 3 is a sectional view of the electronic circuit unit according to the second embodiment, in which the portions corresponding to those in FIGS.

The electronic circuit unit according to the present embodiment differs from the above-described first embodiment in that the flexible substrate 2 is omitted and the component mounting surface of the rigid substrate 1 is covered with a shield cover 9 so that the electronic circuit unit stands up. The electrode 3b on the upper end side of the chip component 3 arranged in 1 is soldered to the shield cover 9 and the chip component 3 is mounted on the rigid substrate 1 in a state parallel to the standing state.

That is, the lower end side electrodes 3a of one or more chip components 3 among the plurality of chip components 3 mounted on the rigid substrate 1 are soldered 7 to the land portion 4a of the first wiring pattern 4. By soldering the upper end side electrode 3b to the shield cover 9, the chip component 3 is mounted in an upright state between the rigid substrate 1 and the shield cover 9. Further, the remaining electrodes 1a, 2 or more of the electrodes 3a and 3b of the chip component 3 are connected to the first wiring pattern 4
The chip component 3 is mounted in parallel on the rigid substrate 1 by soldering 7 to the land portion 4a. Here, the shield cover 9 is formed of a conductive metal plate in a frame shape, and its lower end is connected to an earth pattern (not shown) formed on the rigid substrate 1. Therefore, the chip component 3 arranged in the upright state is grounded via the shield cover 9, and for example, in the case of a circuit configuration including a bypass capacitor,
The chip component 3 for the bypass capacitor may be mounted in the upright state.

In the second embodiment having such a configuration, among the circuit components required for the electronic circuit unit, some of the chip components 3 to be grounded are connected to the rigid substrate 1 and the shield cover 9. Since the electrodes 3a and 3b of the chip component 3 are soldered to the land portion 4a of the first wiring pattern 4 and the shield cover 9 respectively, all the chip components 3 are rigid substrates. As compared with the conventional technique in which the chip components 3 are mounted in parallel with each other, the mounting density is increased by the amount of mounting the chip components 3 in the upright state, and the electronic circuit unit can be downsized.

In the electronic circuit unit according to the first embodiment, the case where all the chip components 3 are mounted in a standing state between the rigid board 1 and the flexible board 2 has been described. Similar to the example, a plurality of chip components 3 may be mounted on the rigid substrate 1 in a standing state and in a parallel state. In this case, among the plurality of chip components 3 mounted on the rigid substrate 1, one or more chip components 3 are arranged in an upright state between the rigid substrate 1 and the flexible substrate 2, and Both electrodes 3a,
3b are soldered to the lands 4a and 5a of the first and second wiring patterns 4 and 5, respectively, and the electrodes 3a and 3b of the remaining one or more chip components 3 are connected to the first wiring pattern 4 respectively. The chip component 3 may be mounted in parallel on the rigid substrate 1 by soldering 7 to the land portion 4a.

[0019]

The present invention is carried out in the form as described above, and has the following effects.

By arranging the chip component in a standing state between the rigid substrate and the flexible substrate or the shield cover, the space above the rigid substrate can be effectively used three-dimensionally as a component mounting area. The packaging density can be remarkably increased and the electronic circuit unit can be downsized.

[Brief description of drawings]

FIG. 1 is a perspective view of an electronic circuit unit according to a first exemplary embodiment of the present invention.

FIG. 2 is a sectional view of the electronic circuit unit.

FIG. 3 is a sectional view of an electronic circuit unit according to a second exemplary embodiment of the present invention.

[Explanation of symbols]

1 rigid board 2 Flexible substrate 3 chip parts 3a, 3b electrodes 4 First wiring pattern 4a Land part 4b End surface electrode 5 Second wiring pattern 5a Land section 6,7,8 solder 9 Shield cover

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Kanako Yokoyama             1-7 Aki, Otsuka-cho, Yukiya, Ota-ku, Tokyo             Su Electric Co., Ltd. F-term (reference) 5E321 AA02 CC12 GG05                 5E336 AA04 AA11 AA16 BB05 BB12                       BC21 CC31 CC32 CC42 CC43                       CC51 EE01 EE17 GG05 GG30                 5E344 AA01 AA10 AA26 BB02 BB04                       CD21 CD23 DD02 EE13 EE23                       EE26

Claims (3)

[Claims] 1. A rigid substrate having a first wiring pattern formed thereon, a flexible substrate having a second wiring pattern formed thereon, and a plurality of chip components having electrodes on both ends thereof, wherein the chip component is the rigid substrate. The flexible substrate fixed to the rigid substrate was erected on the substrate and extended above the rigid substrate, and both electrodes of the chip component were connected to the land portions of the first and second wiring patterns, respectively. An electronic circuit unit characterized by the above. 2. A substrate on which a wiring pattern is formed, a chip component having electrodes on both ends, and a shield cover for covering a component mounting surface of the substrate, the chip component being provided between the substrate and the shield cover. An electronic circuit unit characterized in that it is arranged in an upright state, and both electrodes of the chip component are respectively connected to the land portion of the wiring pattern and the shield cover. 3. The electronic circuit unit according to claim 1, wherein another chip component arranged in parallel is mounted on the substrate.