JP2003133227A - Illuminator and projection aligner using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an illuminator suitable for manufacturing a semiconductor device which can illuminate the surface being irradiated uniformly while utilizing an illumination luminous flux effectively and an projection aligner using the same. SOLUTION: The illuminator comprises a diffraction optical element forming a light pattern having a desired illuminance distribution on a predetermined plane by using the luminous flux from a light source, and a focus optical system for projecting the light pattern formed on the plane on a prescribed plane wherein the image formation optical system has a variable magnification.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an illuminator and a projection exposure apparatus using the same, for example, IC, LSI, CC.
D, a liquid crystal panel, a so-called stepper, which is an apparatus for manufacturing various devices such as a magnetic head, an original plate such as a photomask or reticle uniformly illuminated with ultraviolet light from an illumination device or exposure light in the far ultraviolet region or vacuum ultraviolet region ( This is suitable when a device is manufactured by projecting and transferring a circuit pattern on a "reticle") onto a wafer surface coated with a photosensitive agent.

[0002]

2. Description of the Related Art In a projection exposure apparatus for manufacturing semiconductor elements, a light beam from an illumination device illuminates a reticle on which an electronic circuit pattern is formed, and the electronic circuit pattern is projected and exposed on a wafer surface by a projection optical system. There is. At this time, in order to achieve high resolution, it is necessary to illuminate the illumination range of the reticle surface or the wafer surface so that the illuminance distribution becomes uniform.

For example, in the projection exposure apparatus called stepper described above, an illuminator having an optical integrator in which a plurality of minute lenses are arranged at a predetermined pitch and a collimator lens is used, and a reticle surface or a wafer surface which is an illuminated surface is used. The exposure light is evenly applied to the.

By using such an optical integrator in the illuminating device, a plurality of secondary light sources corresponding to the number of minute lenses are formed, and the illuminated surface is illuminated by the light flux from each of the secondary light sources. The illumination is superposed from a plurality of directions to make the illuminance distribution uniform.

Further, there is known an illuminating device in which the uniformity of the illuminance distribution is improved by using the internal reflection type integrator and the amplitude division type integrator (for example, Patent Documents 1 to 3).

FIG. 9 is proposed by the present applicant (Patent Document 4).
It is a partial schematic diagram of the illuminating device which uses each integrator of an internal reflection type and an amplitude division type.

In the figure, the laser light emitted from the laser light source 101 is once converged by the lens system 107 just before the light incident surface of the light pipe 110 which is an internal reflection type integrator, and then diverges to the light pipe 110. , Is incident on the inner reflection surface at a predetermined divergence angle.

Since the divergent laser light incident on the light pipe 110 propagates while being reflected on the inner surface of the light pipe 110, the light pipe 110 is a plane perpendicular to the optical axis, for example, plane 1.
A plurality of virtual images of the laser light source 101 are formed on 13.

At the light exit surface 110 'of the light pipe 110,
A plurality of virtual images, that is, a plurality of laser light fluxes that appear as if they were emitted from a plurality of apparent light sources are superposed. Therefore, a surface light source having a uniform intensity distribution is formed on the light exit surface 110 ′ of the light pipe 110.

Condenser lens 105 and aperture stop 111
The optical system having the field lens 112 and the light exit surface 110 ′ of the light pipe 110 and the light incident surface 106 of the fly-eye lens 114, which is an amplitude division type integrator, are in an optically conjugate relationship. As a result, a surface light source having a uniform intensity distribution on the light exit surface 110 ′ is imaged on the light incident surface 106 of the fly-eye lens 114, and light having a uniform cross-sectional intensity distribution is formed on the light incident surface 106 of the fly-eye lens 114. Is incident. The fly-eye lens 114 forms a plurality of light sources (secondary light sources) on its light exit surface, and a condenser lens system (not shown) superimposes light fluxes from the plurality of light sources on a reticle (not shown) to form a pattern of the reticle. The whole is illuminated with a uniform light intensity.

LF in FIG. 9 is an optical system (105, 111,
112), and NA represents the numerical aperture on the light exit side of this optical system.

Further, the shape of the light pipe 110 is determined in consideration of the divergence angle of the laser light by the lens system 107 and the length and width of the light pipe 110, and each light source advances to each point on the light incident surface 106. The optical path length difference of the laser light is set to be equal to or longer than the coherent lens length of the laser light. By lowering the temporal coherence lens than this, generation of speckles (interference fringes) on the light incident surface 106 is suppressed.

[Patent Document 1] Japanese Patent Laid-Open No. 1-295216

[Patent Document 2] Japanese Patent Laid-Open No. 1-271718

[Patent Document 3] Japanese Unexamined Patent Publication No. 2-48627

[Patent Document 4] Japanese Patent Application No. 9-69671

[0013]

In the recent manufacture of highly integrated semiconductor devices such as VLSIs, it is required that the uniformity of the illuminance distribution required when printing a circuit pattern is extremely high. ing. There is also a demand for increasing the transmittance of the entire optical system to reduce the decrease in the amount of exposure light.

However, in the illuminating device shown in FIG. 9, in order to form a uniform surface light source on the exit surface of the light pipe, it is preferable that the number of internal reflections of the divergent light beam is large. For that purpose, the diameter may be fixed and the length of the light pipe may be lengthened, but if it is lengthened, the transmittance decreases due to absorption. For this reason, the length cannot be increased beyond a certain level.

That is, if the uniformity of the illuminance distribution is prioritized, the transmittance will decrease, and a surface light source having a desired light quantity cannot be obtained.
If priority is given to the transmittance, the length becomes insufficient, and as a result it becomes difficult to obtain a uniform surface light source.

It is an object of the present invention to provide an illuminating device and a projection device which can form a light pattern having a uniform light intensity distribution in a cross section of a light beam without significantly reducing the transmittance of an optical system.

[0017]

The illumination device according to the first aspect of the present invention includes a diffractive optical element that forms a light pattern having a desired illuminance distribution on a predetermined plane by using a light beam from a light source, An image forming optical system for projecting the light pattern formed on the plane onto a predetermined plane, and the image forming optical system is variable in magnification.

An illumination device according to a second aspect of the present invention is the illumination device according to the first aspect of the present invention, wherein the width of the light beam incident on the diffractive optical element is changed in accordance with the change of the image forming magnification of the image forming optical system. Is characterized by.

An illumination device according to a third aspect of the present invention is the illumination device according to the first aspect, wherein the emission angle preserving optical element for ejecting the luminous flux from the light source at a constant divergence angle, and the luminous flux from the emission angle preserving optical element. And a condensing optical system for guiding the light to the diffractive optical element.

An illumination device according to a fourth aspect of the present invention is the illumination device according to the third aspect, wherein the emission angle of which the divergence angle is different from that of the emission angle preserving optical element according to the change of the image forming magnification of the image forming optical system. The width of the light beam incident on the diffractive optical element is changed by switching to the storage optical element.

A lighting device of a fifth invention is the lighting device of the first invention, wherein the predetermined plane is a light incident surface of the multi-beam generation means and is formed on a light emission surface of the multi-beam generation means. It is characterized in that the light flux from each of the plurality of secondary light sources is overlapped and irradiated onto the surface to be irradiated via the irradiation means.

In the illumination device of the sixth invention, the light from the light source is made incident on the multi-beam generation means to form a plurality of secondary light sources by the multi-beam generation means, and a plurality of the second optical systems.
In a lighting device having a second optical system that irradiates a surface to be illuminated with light fluxes from each of the secondary light sources, the first optical system provides a desired illuminance distribution corresponding to the plurality of secondary light sources. A diffractive optical element that forms a light pattern that it has on a predetermined plane, and an imaging optical system that projects the light pattern that is formed on the plane onto the light incident surface of the multi-beam generation means,
The imaging optical system is characterized in that the magnification is variable.

A lighting device of a seventh invention is the lighting device of the first or sixth invention, wherein the lighting device has a plurality of the diffractive optical elements in which the shapes of the light patterns are different from each other. One is selectively disposed in the optical path of the light from the light source.

An illumination device of an eighth invention is the illumination device of the first or sixth invention, characterized in that the light pattern is formed on the predetermined plane through a relay optical system.

An illumination device according to a ninth aspect of the invention is characterized in that, in the illumination device according to the first or sixth aspect, the diffractive optical element is a phase type or amplitude type computer generated hologram.

A projection exposure apparatus of a tenth aspect of the invention illuminates a pattern of an original plate with a light beam from the illumination device of any one of the first to ninth aspects of the invention, and the pattern of the original plate is passed through a projection optical system to a substrate. It is characterized by projecting on.

The device manufacturing method of the eleventh invention comprises exposing the substrate with the pattern of the original plate using the projection exposure apparatus of the tenth invention, and developing the exposed substrate. And

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic view of a main part of a first embodiment of a lighting device of the present invention. This drawing shows the case where the illumination apparatus is applied to a reduction type projection exposure apparatus for manufacturing semiconductor elements (device), which is called a stepper, as an example.

In the figure, reference numeral 1 is a light source such as a high-intensity ultra-high pressure mercury lamp or an excimer laser which emits ultraviolet rays or far ultraviolet rays.

Reference numeral 2 denotes an exit angle preserving optical element, which emits an incident light beam with a constant exit angle. Reference numeral 3 denotes a condensing optical system, which condenses the light flux emitted from the emission angle preserving optical element 2 at a desired emission angle 2b and guides it to the diffractive optical element 4.

A relay optical system 41 guides the light flux from the diffractive optical element 4 to an aperture 42 which is a field stop. As a result, a light pattern having a desired shape is formed on the aperture 42 with a desired illuminance distribution as described later. Note that the light beam from the diffractive optical element 4 may be directly guided to the aperture 42 without using the relay optical system 41, and an optical pattern having a desired illuminance distribution may be formed on the surface thereof.

A zoom optical system 5 has an aperture 42.
The light pattern on the aperture 42 can be projected onto the light incident surface 7a of the multi-beam generating means 7 such as a fly-eye lens at various magnifications to form an image. The multi-beam generation means 7 forms a light source image 6 having a shape corresponding to the above-mentioned light pattern image having a uniform illuminance distribution on its light exit surface 7b. Denoted at 8 is an irradiation means including a condenser lens, etc.
The light flux from the light source is condensed to illuminate the irradiation surface 9 such as a mask or a reticle (hereinafter referred to as "reticle"). Each element from the condensing optical system 3 to the multi-beam generation means 7 constitutes a first optical system, and the condenser lens 8 constitutes a second optical system.

The pattern drawn on the reticle arranged on the irradiation surface 9 is reduced and projected onto the wafer, which is a photosensitive substrate, by a projection optical system (not shown).

Next, the configuration of each element shown in FIG. 1 will be described.

The exit angle preserving optical element 2 comprises an aperture 21 and a lens system 22 as shown in FIG. Even if the incident light beam is slightly displaced from the light beam 27 (optical axis 27aa) to the light beam 28 (optical axis 28a) in a direction orthogonal to the optical axis, the incident angle 29a of the light beam emitted from the element 2 changes. Instead, it always has a constant optical property.

Further, the exit angle preserving optical element 2 is shown in FIG.
As shown in (B), a fly-eye lens including a plurality of minute lenses 23 may be used. In this case, the emission angle 29b of the light beam is determined by the shape of the fly-eye lens 23. Also in this case, the optical axis of the incident light beam slightly changes and the light beam 27
Even if the state changes from the (optical axis 27a) to the state of the light beam 28 (optical axis 28a) and enters, the emission angle 29b of the emitted light beam does not change and is always constant.

The diffractive optical element 4 is designed in advance so as to generate a light pattern having a desired illuminance distribution, such as a circle or an annular zone, at the position of the aperture 42 through the relay optical system 41 for the incident light beam, It consists of computer generated holograms and uses amplitude distribution type and phase distribution type kinoforms.

3A and 3B show diffractive optical element 4 respectively.
FIG. The diffractive optical element shown in FIG. 3A is a phase-generated computer hologram (Computer Generated Hologram, C
This is an example using GH), and the phase distribution is expressed as a grayscale distribution. The computer generated hologram is a hologram created by calculating an interference fringe pattern, which is obtained by the interference between the object light and the reference light, and directly outputting the result by a drawing device. The interference fringe shape for obtaining a desired illuminance distribution as reproduction light can be easily obtained by optimizing it by iterative calculation by a computer. The diffractive optical element shown in FIG. 3B is an example using a phase type CGH,
The example of the cross-sectional shape is typically shown. As described above, the semiconductor element manufacturing technique can be applied to the fabrication of the stepwise cross section, and the fabrication of the element having fine pitch irregularities is relatively easily realized. Here, the light pattern of a desired illuminance distribution generated at the position of the aperture 42 by the diffractive optical element 4 has, for example, a circle shown in FIG.
Alternatively, it includes a distribution suitable for exposure using various reticles, such as an annular zone shown in FIG. 4B or a pattern called a quadrupole shown in FIG. 4C. These are projected in a desired size on the entrance surface 7a of the multi-beam generation optical system 7 by the zoom optical system 5 described later. Further, in the apparatus of FIG. 1, a plurality of diffractive optical elements that form these different light patterns are mounted by switching means such as a turret (not shown) and switched to change various illumination conditions. There is.

The light beam incident on the diffractive optical element 4 undergoes predetermined amplitude modulation or phase modulation and is diffracted, and the intensity is uniform in the pattern at the position of the aperture 42 via the relay optical system 41. A light pattern having a desired shape as shown by is formed. Here, the positions of the diffractive optical element 4 and the aperture 42 are arranged so that they have a Fourier transform plane relationship with each other.

Next, a change in magnification of the zoom optical system 5 will be described. The light pattern 4a having a uniform light intensity distribution formed by the diffractive optical element 4 is projected by the zoom optical system 5 onto the light incident surface 7a of the multi-beam generation optical system 7 at a desired magnification. To project as. The desired magnification here is a magnification for setting the uniform light source image 6 of a size such that the incident angle 19 of the irradiation light beam on the irradiation surface 9 becomes an optimum value for exposure.

Now, for the desired magnification m, the zoom optical system 5
NA 'is the incident side numerical aperture determined by the incident angle 15
If the numerical aperture on the exit side determined by the exit angle 16 is NA ″, then NA ′ = m · NA ″ (1) holds. Here, it is desirable that the exit angle 16 be as close as possible within the range not exceeding the incident side numerical aperture of the multi-beam generation means 7, from the viewpoint of illumination efficiency.
The value of the emission angle 16 is set to the optimum angle depending on the multi-beam generation means 7. Therefore, as shown by the equation (1), when the optimum magnification for exposure under a certain condition is determined, the optimum angle of the exit angle 15 from the aperture 42 is also determined.

In this embodiment, the value of the incident angle 15 to the zoom optical system depends on the size of the irradiation area 4b of the light beam incident on the diffractive optical element 4, and the size thereof is the exit angle preserving optical element. This is achieved by changing the size of the irradiation region 4b by changing the illumination condition of the emission angle preserving optical element 2 by utilizing the fact that it depends on the emission angle 2a of 2. This will be described later with reference to FIG.

The multi-beam generation means 7 is composed of a fly-eye lens composed of a plurality of minute lenses, a fiber bundle, etc., and the surface light source 6 composed of a plurality of point light sources (secondary light sources) is formed on the light exit surface 7b thereof. There is. In the present embodiment, the multi-beam generation means 7 has a plurality of optical axes, and has a small area having a finite area with each optical axis as a center, and one light beam is generated in each area. An optical element that can be specified. A fly-eye lens is an example of this type of element.

When the light source image 6 having a uniform light intensity distribution is projected on the light incident surface 7a of the multi-beam generation means 7, the illuminance distribution of the incident surface is directly transferred to the light exit surface 7b and the same. A light source (image) 6 is formed. Then, the emitted light beam from each small area (for example, a lens element) of the emission surface 7b of the multi-beam generation means 7 is irradiated by the irradiation means 8 on the surface 9 to be irradiated.
By superimposing and irradiating the surface, the surface to be irradiated 9 is illuminated so as to have a uniform illuminance distribution as a whole.

The light exit surface 7b of the multi-beam generation means 7 is conjugate with the entrance pupil of a projection lens (not shown) for projecting the pattern on the reticle surface placed on the illuminated surface 9 onto the wafer surface. ing.

Next, switching control of the above-mentioned exit angle preservation optical element 2 will be described in detail with reference to FIGS. 5 (A) and 5 (B). In each figure, reference numeral 12a is an emission angle conservation optical element having a small emission angle 12aa, and 12b is an emission angle conservation optical element having a large emission angle 12ba. Others are the same as those described in FIG.

Generally, in an illuminating device used in a semiconductor device manufacturing apparatus, it is required to set the incident angle of a light beam incident on the surface 9 to be illuminated to a desired angle. In the present embodiment, a plurality of exit angle preserving optical elements 2 are prepared, and these are switched using a means such as a turret to set the incident angle to the irradiated surface 9 to a desired angle.

FIG. 5A shows the case where the incident angle 19a of the light beam incident on the surface 9 to be illuminated is relatively small (this is referred to as a small σ value). In order to reduce the σ value in this embodiment, the incident surface 7a of the multi-beam generation means 7 is
Above, the light pattern 4 formed on the aperture 42
It is necessary to form the image 6a of a at a small magnification. This is achieved by changing the magnification of the zoom optical system 5. As described above, the value of the emission angle 16a is set to the optimum angle depending on the multi-beam generation means 7.

Therefore, as shown by the equation (1), when the magnification for obtaining the desired σ value is determined, the diffractive optical element 4
The divergence angle 15a of the light flux from the aperture 42 is also uniquely determined based on the light pattern 4a formed by Since the divergence angle 15a is determined by the width 4ab of the light beam incident on the diffractive optical element 4, the divergence angle 15a is determined by the exit angle preservation optical element 12a.
The light flux width 14ab is controlled to be narrowed by switching to a small emission angle 12aa.

As described above, illumination is performed with high illumination efficiency and a small incident angle 19a (that is, a small σ value).

FIG. 5B shows an embodiment in which the incident angle 19b is large (that is, the σ value is large). In this case, by switching to the emission angle storage optical element 12b having a large emission angle 12ba, the emission angle 1ba
2ba is increased, thereby increasing the width 14bb of the light beam incident on the diffractive optical element 4, and the aperture 42 is formed based on the light pattern 4a formed by the diffractive optical element 4.
The angle 15b of the light beam diverging from is increased. Then, the image 6b of the light pattern 4a is magnified with a large magnification to generate the multiple light fluxes
The projection angle 16b can be made substantially the same as the above-mentioned angle 16b from the relationship of the expression (1) even when the projection is performed on the screen. As described above, the illumination efficiency is high and the emission angle 19b is large (that is, the σ value is large).

At this time, the divergence angle of the light beam diverging from the diffractive optical element 4 is the angle 14 in FIG.
a and the angle 14b in FIG. 5B are the same, the size of the light pattern 4a is the same as that of the exit angle preservation optical element 2.
It does not change even if you switch. In accordance with the switching of the σ value, if necessary, the diffractive optical element 4 also uses a switching means (not shown) such as a turret, and the angle preservation optical element 12
You may switch simultaneously with the switching of a and b.

Further, for example, as described with reference to FIG.
Even if the light beam from the laser light source 1 is slightly displaced by disturbance, the emission angle of the light beam from the emission angle storage optical element 2 is preserved, so that the width 4b of the incident light beam to the diffractive optical element 4 in FIG. 1 varies. In addition, there is almost no variation when the entire light source image in the microlens 51 of the multi-beam generation means 7 is viewed macroscopically. Therefore, the influence on the illuminance distribution on the illuminated surface 9 is small enough to be ignored.

This shows the advantage that the present invention is a system which is very stable against fluctuations in the luminous flux from the laser light source.

FIG. 6 is a schematic view of a main part of a second embodiment of a projection exposure apparatus for manufacturing a semiconductor device using the illumination device of the present invention. In the figure, the same elements as those shown in FIG. 1 are designated by the same reference numerals.

In the figure, reference numeral 91 is a light beam shaping optical system for shaping the coherent light beam from the laser light source 1 into a desired beam shape. Reference numeral 92 denotes an incoherent optical system for making a coherent laser light beam incoherent. Further, 93 is a projection optical system of the exposure apparatus, and 94 is a photosensitive substrate such as a wafer coated with a photosensitive material. Description of the same numbers as in FIG. 1 is omitted.

The light beam emitted from the laser light source 1 enters a light beam shaping optical system 91 through a light beam routing optical system (not shown) including a mirror and a relay lens. The light flux shaping optical system 91 is composed of a plurality of cylindrical lenses or a beam expander, and converts the aspect ratio of the light flux cross-sectional shape into a desired value.

The light beam shaped by the light beam shaping optical system 91 is for the purpose of preventing the light from interfering with each other on the wafer surface 94 to generate speckles.
It is incident on the beam 2, and is converted into an incoherent light beam.

As the incoherent optical system 92, for example, as disclosed in Japanese Patent Laid-Open No. 3-215930, an incident light beam is split into at least two light beams (for example, p-polarized light and s-polarized light) on a light splitting surface. After that, one of the light fluxes is given an optical path length difference of at least the coherence length of the light fluxes through an optical member, and then is re-guided to the dividing surface, and is superposed on the other light flux and emitted. Is used to form a plurality of mutually incoherent light beams.

The light beam thus made incoherent is incident on the exit angle preserving optical element 2.

By the procedure already described with reference to FIG. 1, the luminous fluxes emitted from the respective minute regions of the multiple luminous flux generation means 7 are irradiated onto the reticle R on the surface 9 to be irradiated by the irradiation means 8 so as to be superposed and irradiated. The irradiation surface 9 is illuminated so as to have a uniform illuminance distribution as a whole.

Then, the light flux having information such as the circuit pattern on the reticle R surface formed on the irradiated surface 9 is projected and imaged on the photosensitive substrate 94 by the projection optical system 93 at an optimum magnification for exposure. Then, the circuit pattern is exposed.

The photosensitive substrate is fixed to a photosensitive substrate stage (not shown) by vacuum suction or the like, and has a function of moving in parallel up, down, front, back, left and right of the paper surface, and the movement is also measured by a laser interferometer (not shown). It is controlled by the vessel.

Next, an embodiment of a method for manufacturing a semiconductor device using the above-described projection exposure apparatus will be described.

FIG. 7 shows a semiconductor device (semiconductor chip such as IC or LSI, liquid crystal panel or CCD magnetic head).
2 shows a flow of manufacturing.

In step 1 (circuit design), the circuit of the semiconductor device is designed. In step 2 (mask manufacturing), a mask having the designed circuit pattern is manufactured.

On the other hand, in step 3 (wafer manufacturing), a wafer is manufactured using a material such as silicon. Step 4
The (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer.

The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer manufactured in step 4, including an assembly process (dicing, bonding), a packaging process (chip encapsulation). Etc. are included.

In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. Through these steps, the semiconductor device is completed and shipped (step 7).

FIG. 8 shows a detailed flow of the wafer process. In step 11 (oxidation), the surface of the wafer is oxidized. In step 12 (CVD), an insulating film is formed on the wafer surface.

In step 13 (electrode formation), electrodes are formed on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted in the wafer. Step 15
In (resist processing), a photosensitive agent is applied to the wafer. In step 16 (exposure), the circuit pattern of the mask is printed and exposed on the wafer by the above-described exposure apparatus.

In step 17 (development), the exposed wafer is developed. In step 18 (etching), parts other than the developed resist are scraped off. In step 19 (resist stripping), the resist that is no longer needed after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. By using the manufacturing method of this embodiment, it is possible to easily manufacture a highly integrated semiconductor device, which has been difficult to manufacture in the past.

[0073]

According to the present invention, by increasing the uniformity of the light intensity distribution within the light flux, the illuminance distribution on the surface to be illuminated is made uniform, and at the same time, the light-collecting efficiency of the semiconductor device is improved. An illumination device suitable for a manufacturing apparatus and a projection exposure apparatus using the same can be provided.

This is achieved by using a diffractive optical element having a thin glass material, a uniform light intensity distribution, and capable of generating a light pattern of a desired shape, instead of the pipe (internal reflection type integrator). is doing. Therefore, an effect such as a highly efficient illumination device can be obtained even in the vacuum ultraviolet region.

[Brief description of drawings]

FIG. 1 is a schematic view of a main part of a first embodiment of a lighting device of the present invention.

FIG. 2 is an explanatory diagram of a part of the first embodiment.

FIG. 3 is an explanatory diagram of a part of the first embodiment.

4 is an explanatory diagram of an illuminance distribution on the aperture plane of FIG.

FIG. 5 is an explanatory diagram when a part of the first embodiment is replaced.

FIG. 6 is a schematic diagram of a main part of a second embodiment of a projection exposure apparatus using the illumination device of the present invention.

FIG. 7 is a flowchart of a device manufacturing method of the present invention.

FIG. 8 is a flowchart of a wafer process.

FIG. 9 Illumination device according to the applicant's previous proposal

[Explanation of symbols]

1: Laser light source 2: Exit angle preservation optical element 3: Condensing optical system 4: Diffractive optical element 5: Zoom optical system 7: Multi-beam generation optical system 8: Irradiation means 9: Irradiated surface 41: Relay optical system 42: Aperture

Claims (6)

[Claims] 1. A diffractive optical element for forming a light pattern having a desired illuminance distribution on a predetermined plane by using a light beam from a light source, and a projection for projecting the light pattern formed on the plane onto a predetermined plane. And an image optical system, wherein the image forming optical system has a variable magnification. 2. A first optical system for making light from a light source incident on a multi-beam generation means to form a plurality of secondary light sources by the multi-beam generation means, and a light beam from each of the plurality of secondary light sources. And a second optical system for irradiating the surface to be illuminated with the second optical system, the first optical system predetermining a light pattern having a desired illuminance distribution corresponding to the plurality of secondary light sources. The image forming optical system has a diffractive optical element formed on a plane and an image forming optical system for projecting the light pattern formed on the plane onto a light incident surface of the multi-beam generation means, and the image forming optical system has a variable magnification. A lighting device characterized by being present. 3. A plurality of diffractive optical elements each having a different shape of the light pattern, wherein one of the plurality of diffractive optical elements is selectively arranged in an optical path of light from the light source. The lighting device according to claim 1, wherein the lighting device is a lighting device. 4. The illumination device according to claim 1, wherein the light pattern is formed on the predetermined plane via a relay optical system. 5. A pattern of an original plate is illuminated with a light beam from the illumination device according to claim 1, and the pattern of the original plate is projected onto a substrate through a projection optical system. Projection exposure device. 6. A device manufacturing method comprising: a step of exposing a substrate with a pattern of an original plate using the projection exposure apparatus according to claim 5; and a step of developing the exposed substrate.