JP2003133109A - Manufacturing method for multi-chip resistor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a multi-chip resistor in which no defective resistance value due to solder erosion is generated and no defective conduction due to solder wet failure is generated when the multi-chip resistor is mounted by soldering. SOLUTION: Before a process wherein a plating 22 is applied to a through hole electrode 12 and an upper surface electrode 11 formed in a plurality of recessed parts in a substrate piece that is made by secondary division 18, polishing 19 using emery powder, etc., and cleaning 20 are performed. By this, scattered low molecular resin, which is generated at curing of a second protective layer 16 and sticks to the through hole electrode 12 formed in a plurality of through holes, is removed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a multiple chip resistor used in various electronic devices.

[0002]

2. Description of the Related Art A conventional multiple chip resistor of this type has been manufactured based on a manufacturing process diagram shown in FIG.

First, a plurality of pairs of upper surface electrodes 1 containing silver as a main component are formed by screen printing on the periphery of each through hole and the inner wall of the through hole in a sheet-like insulating substrate having a large number of through holes and vertical and horizontal dividing grooves. The through-hole electrode 2 and the through-hole electrode 2 are formed so as to be electrically connected to each other, and are baked with a baking profile having a peak temperature of 850 ° C. And Next, a ruthenium oxide-based resistor 3 is formed between the pair of upper surface electrodes 1 by a screen printing method so as to be electrically connected to the upper surface electrode 1, and is baked with a baking profile having a peak temperature of 850 ° C. By doing so, the resistor 3 becomes a stable film. Next, the first protective layer 4 containing a plurality of glasses as a main component is formed by a screen printing method so as to cover the plurality of resistors 3, and the glass is baked by a baking profile having a peak temperature of 600 ° C. The first protective layer 4 containing the main component is a stable film. Then, trimming 5 is performed by a laser trimming method in order to correct the resistance value of the resistor 3 between the pair of upper surface electrodes 1 to a constant value.

Next, a plurality of second glass containing a resin as a main component is formed by a screen printing method so as to cover the first protective layer 4 containing a plurality of glass as a main component and overlap a part of the upper surface electrode 1. The second protective layer 6 is formed by forming the protective layer 6 and curing it with a curing profile having a peak temperature of 200 ° C.
Is a stable film. Next, a plurality of strip-shaped substrates are formed by performing a primary division 7 in which the through holes are divided from the sheet-shaped insulating substrate by one of vertical and horizontal division grooves. Next, by performing the secondary division 8 of the strip-shaped substrate by either the other of the vertical and horizontal division grooves formed on the strip-shaped substrate, an individual substrate having a plurality of pairs of through-hole electrodes 2 is formed. . And finally, a first plating layer made of nickel plating or the like and the first plating layer are formed so as to cover the through-hole electrodes 2 and the upper surface electrodes 1 formed in the plurality of recesses in the individual substrate. The multiple chip resistor is manufactured by forming the plating 9 having the second plating layer made of solder or tin or the like for covering.

[0005]

In the above-mentioned conventional multiple chip resistor, the screen is formed so as to cover the first protective layer 4 containing a plurality of glasses as a main component and to overlap a part of the upper surface electrode 1. A plurality of second protective layers 6 containing a resin as a main component are formed by a printing method. Since the second protective layers 6 are cured by a curing profile having a peak temperature of 200 ° C., a stable film is formed. When the second protective layer 6 is cured, scattered particles of a low molecular weight resin are generated. When the scattered particles adhere to the through hole electrodes 2, the through hole electrodes 2 and the upper surface electrode 1 are covered. When the plating 9 is formed on the surface of the through hole electrode 2, the plating 9 does not adhere to the scattered matter adhered on the through hole electrode 2.
As a result, when this multiple chip resistor is mounted by soldering, there is a problem in that a resistance value defect occurs due to solder squeeze or a conduction defect occurs due to unwetting of the solder.

The present invention solves the above-mentioned conventional problems. When a multiple chip resistor is mounted by soldering, a resistance value failure due to solder squeeze occurs or a conduction failure due to solder non-wetting occurs. It is an object of the present invention to provide a method for manufacturing a multiple chip resistor that does not generate.

[0007]

In order to achieve the above object, the present invention has the following constitution.

According to a first aspect of the present invention, a top electrode and a through hole electrode are provided around each through hole and an inner wall of the through hole in a sheet-like insulating substrate having a large number of through holes and vertical and horizontal dividing grooves. A step of forming them so as to be electrically connected, a step of forming a resistor between the pair of upper surface electrodes so as to be electrically connected to the upper surface electrode, and a step of covering at least the resistor. A step of forming a protective layer made of resin by printing and curing, and a step of dividing the sheet-like insulating substrate into a strip-shaped substrate by dividing the through hole by either one of vertical and horizontal dividing grooves; Subdividing into individual substrates having a plurality of pairs of through-hole electrodes by the other of the vertical and horizontal directions after division, and the plurality of secondary divided individual substrates. And a step of performing plating on the through-hole electrodes and the top electrode is formed in the recess,
Prior to the step of applying the plating, a low-molecular-weight resin that is generated when the protective layer is cured by polishing and cleaning with emery powder and is attached on the through-hole electrodes formed in the plurality of through-holes According to this manufacturing method, the step of plating the through-hole electrode and the upper surface electrode formed in the plurality of recesses in the second-divided individual substrate is performed. In front of the,
By polishing and cleaning with emery powder, etc., it is possible to remove the scattered particles of the low-molecular-weight resin that are generated when the protective layer is cured and adhere to the through-hole electrodes formed in the multiple through-holes. Therefore, when performing plating on the through-hole electrodes and the upper surface electrodes formed in the plurality of recesses in the second-divided individual substrate,
The scattered substances of the low molecular weight resin have been removed from the through-hole electrodes, and this makes it possible to reliably plate the through-hole electrodes, so this multiple chip resistor was mounted by soldering. In this case, there is an effect that the problem that the resistance value defect due to the solder breakage or the conduction defect due to the non-wetting of the solder occurs unlike the conventional case is eliminated.

According to a second aspect of the present invention, there is provided a step of forming an upper surface electrode between the through holes located on an upper surface of a sheet-like insulating substrate having a large number of through holes and vertical and horizontal dividing grooves. Forming a resistor between the pair of upper electrodes so as to be electrically connected to the upper electrode; performing trimming to adjust the resistance value of the resistor; A step of forming a protective layer so as to cover, a step of dividing the sheet-shaped insulating substrate into a strip substrate by dividing the through hole and the upper surface electrode by one of vertical and horizontal dividing grooves, and this primary division. A step of forming an end face electrode on a convex portion located between a plurality of concave portions of the strip-shaped substrate so as to be electrically connected to the upper surface electrode; A step of secondary division into individual substrates having poles, and a step of plating on a plurality of pairs of end face electrodes in the individual substrate obtained by the secondary division, before the step of applying the plating, By scrubbing and cleaning with emery powder etc., it is designed to remove scattered matter that occurs during trimming and adheres in a large number of through holes. An end face electrode is formed on a convex portion located between a plurality of concave portions of the strip substrate so as to be electrically connected to the upper surface electrode, and the strip substrate is subdivided to have a plurality of pairs of end face electrodes. Before the step of plating the substrate in the form of a plate and plating a plurality of pairs of end face electrodes in the individual substrate, polishing and cleaning with emery powder etc. occur at the time of trimming,
Since the scattered substances adhering to a large number of through holes are removed, when plating is performed on a plurality of pairs of end face electrodes on the secondary divided individual substrate, it occurs during trimming. Scattered substances containing metals such as ruthenium are removed from the through holes, which causes the scattered substances adhering in the through holes to be plated, and this plating causes a gap between adjacent resistors. This has the effect of being able to solve the problem of causing a short circuit.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION (Embodiment 1) Hereinafter, a method of manufacturing a multiple chip resistor according to Embodiment 1 of the present invention will be described with reference to the drawings.

FIG. 1 is a process diagram showing a method of manufacturing a multiple chip resistor according to Embodiment 1 of the present invention, and FIG. 2 is a top view showing an internal structure of the multiple chip resistor. 1 and 2
Based on this, a method of manufacturing the multiple chip resistor according to the first embodiment of the present invention will be described.

In FIGS. 1 and 2, first, silver is used as a main component on the periphery of each through hole and the inner wall of the through hole in a sheet-shaped insulating substrate having a large number of through holes and vertical and horizontal dividing grooves by a screen printing method. A plurality of pairs of upper surface electrodes 11 and through-hole electrodes 12
1 and 12 are formed so as to be electrically connected to each other, and fired with a firing profile having a peak temperature of 850 ° C.,
A plurality of pairs of upper surface electrodes 11 and through-hole electrodes 12 are stable films. Next, between the pair of upper surface electrodes 11,
A ruthenium oxide-based resistor 13 is formed by a screen printing method so as to be electrically connected to the upper surface electrode 11, and is fired with a firing profile having a peak temperature of 850 ° C. to form the resistor 13 as a stable film. . Next, the first protective layer 14 containing a plurality of glasses as a main component is formed by a screen printing method so as to cover the plurality of resistors 13, and the glass is fired with a firing profile having a peak temperature of 600 ° C. The first protective layer 14 containing the main component is a stable film. Next, trimming 15 is performed by the laser trimming method in order to correct the resistance value of the resistor 13 between the pair of upper surface electrodes 11 to a constant value.

Next, while covering the first protective layer 14 containing a plurality of glasses as a main component and overlapping with a part of the upper surface electrode 11, a plurality of second main components containing a resin by a screen printing method are used. Protective layer 16 is formed and peak temperature 200
The second protective layer 16 is made into a stable film by curing with a curing profile of ° C. Next, a plurality of strip-shaped substrates are formed by performing primary division 17 in which the through holes are divided from the sheet-shaped insulating substrate by one of vertical and horizontal division grooves. Next, by performing the secondary division 18 of the strip-shaped substrate by either the other of the vertical and horizontal division grooves formed on the strip-shaped substrate, an individual substrate having a plurality of pairs of through-hole electrodes 12 is formed. .

Next, polishing 19 with emery powder or the like is performed. The polishing 19 is performed when the second protective layer 16 is hardened, and has a function of polishing scattered particles of the low molecular weight resin adhered onto the through-hole electrodes 12 formed in the plurality of through holes. Is. Here, the emery powder is a mixture of corundum and magnetite and has a particle size of 0.3 mm or less.

Next, washing 20 is performed with water or a combination of water washing and alcohol substitution. This wash 2
0 serves to wash away and remove the scattered substances of the low molecular weight resin polished by the polishing 19.

Finally, a first plating layer made of nickel plating or the like is formed so as to cover the through-hole electrodes 12 and the upper surface electrodes 11 formed in the plurality of recesses 21 in the individual substrate, and the first plating layer. The multiple chip resistor is manufactured by forming the plating 22 having the second plating layer made of solder or tin or the like, which covers the plating layer.

In the first embodiment of the present invention described above, on the through-hole electrode 12 and the upper surface electrode 11 formed in the plurality of recesses 21 in the individual substrate formed by performing the secondary division 18. Before the step of applying the plating 22, polishing 19 with emery powder and cleaning 20 are performed, so that the through-hole electrodes 12 formed at the time of curing the second protective layer 16 and formed in the plurality of through-holes 12 are formed.
Since the scattered substances of the low molecular weight resin adhering to the above are removed, the through-hole electrodes formed in the plurality of recesses 21 in the individual substrate configured by performing the secondary division 18 When the plating 22 is applied on the upper surface electrode 12 and the upper surface electrode 11, the scattered substances of the low molecular resin are in a state of being removed from the through hole electrode 12, which ensures the plating 22 on the through hole electrode 12. Therefore, when this multiple chip resistor is mounted by soldering, there is a problem that resistance value failure due to solder squeezing occurs as in the past or conduction failure due to non-wetting of solder occurs. It has the effect of disappearing.

(Second Embodiment) A method of manufacturing a multiple chip resistor according to a second embodiment of the present invention will be described below with reference to the drawings.

FIG. 3 is a process diagram showing a method of manufacturing a multiple chip resistor according to the second embodiment of the present invention, and FIG. 4 is a top view showing an internal structure of the multiple chip resistor. 3 and 4
Based on this, a method of manufacturing a multiple chip resistor according to the second embodiment of the present invention will be described.

In FIG. 3 and FIG. 4, first, silver is the main component between the through holes located on the upper surface of a sheet-like insulating substrate having a large number of through holes and vertical and horizontal dividing grooves, by a screen printing method. By forming a plurality of pairs of upper surface electrodes 31 and firing with a firing profile having a peak temperature of 850 ° C., the plurality of pairs of upper surface electrodes 31 are stable films.
Next, the upper surface electrode 3 is formed between the pair of upper surface electrodes 31.
1, a ruthenium oxide resistor 32 is formed by a screen printing method so as to be electrically connected to the resistor 1, and is fired with a firing profile having a peak temperature of 850 ° C., thereby forming the resistor 32 as a stable film. Next, a first protective layer 33 containing a plurality of glasses as a main component is formed by a screen printing method so as to cover the plurality of resistors 32, and the peak temperature 6
By firing with a firing profile of 00 ° C., the first protective layer 33 containing glass as a main component is a stable film.
Next, in order to correct the resistance value of the resistor 32 between the pair of upper surface electrodes 31 to a constant value, trimming 34 is performed by the laser trimming method.

Next, while covering the first protective layer 33 containing a plurality of glasses as a main component and overlapping a part of the upper surface electrode 31, a plurality of second main components containing a resin by a screen printing method are used. A protective layer 35 is formed and a peak temperature of 200
The second protective layer 35 is made into a stable film by curing with a curing profile of ° C. Next, a plurality of strip-shaped substrates are formed by performing a primary division 36 that divides the sheet-shaped insulating substrate into the through hole and the upper surface electrode 31 by using one of vertical and horizontal dividing grooves.

Next, an epoxy containing Ni and C as conductive components is electrically connected to the upper surface electrode 31 at the convex portion 38 located between the plurality of concave portions 37 of the primary-divided strip-shaped substrate. The resin paste material is printed by roller transfer and dried, and the peak temperature is 165.
The end face electrode 39 is formed by curing with a curing profile of ° C.

Next, the strip-shaped substrate is subjected to the secondary division 40 by either the other of the vertical and horizontal division grooves formed in the strip-shaped substrate, whereby an individual substrate having a plurality of pairs of end face electrodes 39 is obtained. Form.

Next, polishing 41 with emery powder or the like is performed. The polishing 41 serves to polish the scattered matter, which is generated by performing the trimming 34 and adheres to a large number of through holes, and which contains metal such as ruthenium.

Next, a cleaning 42 is carried out by washing with water or a combination of washing with water and alcohol substitution. This wash 4
The reference numeral 2 serves to wash away and remove the scattered matter containing the metal such as ruthenium polished by the polishing 41.

Finally, a plurality of pairs of end face electrodes 3 on the individual substrate formed by performing the secondary division 40.
By forming a plating 43 having a first plating layer made of nickel plating or the like so as to cover 9 and a second plating layer made of solder or tin covering the first plating layer, a multiple chip is formed. It manufactures resistors.

In the second embodiment of the present invention described above, the upper surface electrode 3 is formed on the convex portion 38 located between the plurality of concave portions 37 in the strip-shaped substrate formed by performing the primary division 36.
1. An end face electrode 39 is formed so as to be electrically connected to 1.
Then, by performing the secondary division 40 of the strip-shaped substrate, an individual substrate having a plurality of pairs of end face electrodes 39 is obtained, and plating 4 is performed on the plurality of pairs of end face electrodes 39 in the individual substrate.
Before the step of applying No. 3, polishing 41 with emery powder or the like,
By performing the cleaning 42, it is possible to remove scattered matter including metal such as ruthenium, which is generated when the trimming 34 is performed and adheres in a large number of through holes. When the plating 43 is applied on the end face electrode 39 of No. 3, the scattered matter containing a metal such as ruthenium generated when the trimming 34 is performed is removed from the through hole. Plating 43 is applied to the scattered matter that has adhered to the inside of the hole, and this plating 43 can solve the problem that a short circuit occurs between the adjacent resistors 32.

[0028]

As described above, according to the method of manufacturing a multiple chip resistor of the present invention, plating is performed on the through-hole electrode and the upper surface electrode formed in the plurality of recesses in the second-divided individual substrate. Before the step of applying, by polishing and cleaning with emery powder etc., the low molecular weight resin that is generated when the protective layer is cured and adheres on the through-hole electrodes formed in the multiple through-holes Since the scattered substances are removed, when plating is applied to the through-hole electrodes and the upper surface electrodes formed in the plurality of recesses in the individual substrate divided by the secondary division, the scattering of low-molecular resin Since the object has been removed from the through-hole electrode, and this makes it possible to reliably plate the through-hole electrode, this multiple chip resistor was mounted by soldering. If those having effect that conventional or generate the resistance failure due solder leaching as, or defective conduction due to non wetting of the solder is no longer a problem occurs.

[Brief description of drawings]

FIG. 1 is a process diagram showing a method of manufacturing a multiple chip resistor according to a first embodiment of the present invention.

FIG. 2 is a top view showing the internal structure of the multiple chip resistor.

FIG. 3 is a process diagram showing a method of manufacturing a multiple chip resistor according to a second embodiment of the present invention.

FIG. 4 is a top view showing the internal structure of the multiple chip resistor.

FIG. 5 is a process diagram showing a method of manufacturing a conventional multiple chip resistor.

[Explanation of symbols]

11,31 Top electrode 12 Through-hole electrode 13,32 resistor 14,33 First protective layer 15,34 Trimming 16,35 Second protective layer 17,36 Primary division 18,40 Secondary division 19,41 polishing 20,42 wash 21 recess 22,43 plating 37 recess 38 convex 39 Edge electrode

Claims (2)

[Claims] 1. An upper surface electrode and a through-hole electrode are electrically connected to the periphery of each through-hole and an inner wall of the through-hole in a sheet-shaped insulating substrate having a large number of through-holes and vertical and horizontal dividing grooves so that both are electrically connected. Forming step, forming a resistor between the pair of upper electrodes so as to be electrically connected to the upper electrodes, and printing / curing a protective layer made of resin so as to cover at least the resistors. And a step of dividing the sheet-like insulating substrate into strip-shaped substrates by dividing the through-hole by one of vertical and horizontal dividing grooves, and a plurality of vertical or horizontal other ones after the primary dividing. Secondary dividing into individual substrates having a pair of through-hole electrodes, and through holes formed in a plurality of recesses in the secondary individual substrates. A step of plating on the upper electrode and the upper electrode, and by polishing and cleaning with emery powder before the step of applying the plating, the protective layer is generated at the time of curing and is formed in a plurality of through holes. Method for producing a multiple chip resistor in which scattered particles of low molecular weight resin adhering to the through-hole electrodes are removed. 2. A step of forming an upper surface electrode between the through holes located on the upper surface of a sheet-like insulating substrate having a large number of through holes and vertical and horizontal dividing grooves, and the upper surface between the pair of upper surface electrodes. A step of forming a resistor so as to be electrically connected to an electrode, a step of trimming for adjusting a resistance value of the resistor, and a step of forming a protective layer so as to cover at least the resistor. A step of dividing the sheet-shaped insulating substrate into strip-shaped substrates by dividing the through-hole and the upper surface electrode by one of vertical and horizontal dividing grooves, and between the plurality of recesses in the strip-shaped substrates that are primary-divided. A step of forming an end face electrode so as to be electrically connected to the upper surface electrode on the convex portion located, and a secondary division into individual substrates having a plurality of pairs of end face electrodes by the other of the vertical and horizontal division grooves. And a step of plating on a plurality of pairs of end face electrodes in the secondary-divided individual substrate, by performing polishing and cleaning with emery powder before the plating step. A method for manufacturing a multiple chip resistor, which removes scattered matter generated during trimming and adhering to a large number of through holes.