JPH07211504A - Terminal electrode for surface-mounting type electronic parts and its production - Google Patents
Terminal electrode for surface-mounting type electronic parts and its productionInfo
- Publication number
- JPH07211504A JPH07211504A JP6281306A JP28130694A JPH07211504A JP H07211504 A JPH07211504 A JP H07211504A JP 6281306 A JP6281306 A JP 6281306A JP 28130694 A JP28130694 A JP 28130694A JP H07211504 A JPH07211504 A JP H07211504A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- substrate
- electrodes
- face
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は、チップ抵抗器等、絶
縁製基板の端部に表面実装用の電極が形成された表面実
装型電子部品の端子電極とその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal electrode of a surface mount type electronic component such as a chip resistor having a surface mount electrode formed on an end of an insulating substrate and a method of manufacturing the same.
【0002】[0002]
【従来の技術】従来、例えば、表面実装用のチップ抵抗
器の電極構造は、ガラスをバインダに用いてAg−Pt
等を成分とするいわゆるメタルグレーズペーストを塗布
し焼成して形成したものであった。この電極の製造方法
は、特開昭61-268001号公報に開示されている
ように、大型の基板を短冊状に分割し、各電極端面が側
面に露出し、多数のチップが一列に並んだ状態に分割
し、その端面に導電性塗料を塗布し、この後、個々のチ
ップ部品に分割しているものであった。2. Description of the Related Art Conventionally, for example, the electrode structure of a surface mounting chip resistor uses Ag-Pt as a binder.
It was formed by applying a so-called metal glaze paste containing the above components as a component and firing it. In this electrode manufacturing method, as disclosed in Japanese Patent Laid-Open No. 61-268001, a large substrate is divided into strips, each electrode end face is exposed on a side surface, and a large number of chips are arranged in a line. The chip was divided into individual parts, the end face of which was coated with a conductive paint, and then divided into individual chip parts.
【0003】[0003]
【発明が解決しようとする課題】上記従来の技術の場
合、個々のチップ部品に分割する前に、端面の電極を印
刷している。従って、個々のチップに分割する際に、電
極に亀裂が生じたりする問題があった。さらに、個々に
分割する前に端面に電極を形成しているので、電極は、
チップ基板の端面にのみ印刷され、機械的強度も弱いも
のであった。In the case of the above-mentioned conventional technique, the electrodes on the end faces are printed before dividing into individual chip parts. Therefore, there is a problem that cracks may occur in the electrodes when divided into individual chips. Furthermore, since the electrodes are formed on the end faces before the individual division, the electrodes are
It was printed only on the end face of the chip substrate and had a weak mechanical strength.
【0004】この発明は、上記従来の問題点に鑑みてな
されたもので、電極の機械的強度が高く、高温に対する
耐久性もあり、接続不良が生じにくい表面実装型電子部
品の端子電極とその製造方法を提供することを目的とす
る。The present invention has been made in view of the above-mentioned problems of the prior art, and has a high mechanical strength of the electrode, durability against high temperature, and a terminal electrode of a surface mount type electronic component in which poor connection is unlikely to occur, and the same. It is intended to provide a manufacturing method.
【0005】[0005]
【課題を解決するための手段】この発明は、絶縁体の基
板表面の端部に第1電極を設け、この第1電極とは基板
をはさんで反対側の基板裏面にも第2電極を設け、さら
に上記第1,2電極間の上記基板端面及び2側面を直接
覆い上記第1,2電極に接触した第3電極を設け、この
第3電極は導電性塗料により形成され、上記第2電極の
一部を上記基板端面側から所定の厚さで覆っている表面
実装型電子部品の端子電極である。According to the present invention, a first electrode is provided on an end portion of a substrate surface of an insulator, and a second electrode is provided on the back surface of the substrate opposite to the first electrode with the substrate interposed therebetween. And a third electrode that directly covers the substrate end surface and the two side surfaces between the first and second electrodes and is in contact with the first and second electrodes. The third electrode is formed of a conductive paint, and the second electrode is formed. It is a terminal electrode of a surface mount electronic component in which a part of the electrode is covered with a predetermined thickness from the end face side of the substrate.
【0006】上記基板端面は、上記基板裏面の中央部側
から端面側に向かって、上記第2電極及び上記第3電極
が階段状に突出して形成されている。さらに、上記第
1,2電極は、メタルグレーズ系電極材料により形成さ
れ、上記第3電極はAg−レジン系導電性塗料により形
成されており、外部に露出する上記第1,2,3電極が
全てNiメッキ及びハンダメッキで覆われているもので
ある。The substrate end surface is formed by projecting the second electrode and the third electrode stepwise from the central portion side of the back surface of the substrate toward the end surface side. Furthermore, the first and second electrodes are formed of a metal glaze-based electrode material, the third electrode is formed of Ag-resin-based conductive paint, and the first, second, and third electrodes exposed to the outside are formed. All are covered with Ni plating and solder plating.
【0007】またこの発明は、各チップ部ごとに分割す
る多数の分割溝が縦横に形成された絶縁体の大型の基板
を設け、この絶縁基板表面の個々のチップ部の両端部
に、第1電極を各々形成し、この第1電極とは基板をは
さんで反対側の基板裏面にも第2電極を形成し、上記基
板を上記分割溝に沿って個々のチップ部に分割し、分割
された上記基板の上記第1,2電極間の3方の面を直接
覆い上記第1,2電極に接触するとともに上記第2電極
の一部を上記基板端面側から所定の厚さで覆う第3電極
を形成する表面実装型電子部品の端子電極の製造方法で
ある。Further, according to the present invention, a large substrate of an insulator in which a large number of dividing grooves for dividing each chip portion are formed vertically and horizontally is provided, and the first substrate is provided at both ends of each chip portion on the surface of the insulating substrate. An electrode is formed on each side, and a second electrode is formed on the backside of the substrate opposite to the first electrode, and the substrate is divided into individual chip parts along the dividing grooves. A third surface that directly covers the three surfaces of the substrate between the first and second electrodes and is in contact with the first and second electrodes and covers a part of the second electrode from the substrate end surface side with a predetermined thickness. It is a manufacturing method of a terminal electrode of a surface mount electronic component for forming an electrode.
【0008】[0008]
【作用】この発明の表面実装型電子部品の端子電極とそ
の製造方法は、基板端部の3方に第3電極が印刷形成さ
れ、端子電極の5面が電極として形成されているもので
あり、第3電極の強度が高く、接続不良も生じにくいも
のである。In the terminal electrode of the surface mount type electronic component and the method of manufacturing the same according to the present invention, the third electrode is formed by printing on three sides of the substrate end, and the five surfaces of the terminal electrode are formed as electrodes. The strength of the third electrode is high, and poor connection is unlikely to occur.
【0009】[0009]
【実施例】以下、この発明の一実施例について図面に基
づいて説明する。この実施例の表面実装型電子部品の端
子電極は、図1に示すように、チップ抵抗器1について
ももので、セラミックの基板2の表面に凸型の抵抗体3
が印刷形成され、この両端に電極4が設けられている。
抵抗体3は、酸化ルテニウムを約10μの厚みに設け、
レーザー又はサンドブラストにより凸型の底辺から上方
に向かってトリミング溝5を形成し、抵抗値のトリミン
グが成されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. As shown in FIG. 1, the terminal electrode of the surface mount type electronic component of this embodiment is also for the chip resistor 1, and the convex resistor 3 is provided on the surface of the ceramic substrate 2.
Are formed by printing, and electrodes 4 are provided on both ends thereof.
The resistor 3 is provided with ruthenium oxide in a thickness of about 10 μ,
A trimming groove 5 is formed upward from the bottom of the convex shape by laser or sandblasting to trim the resistance value.
【0010】このチップ抵抗器1の電極4は、抵抗体3
の両端部が直接に接続している第1電極6と、この第1
電極6と基板2をはさんで対向して基板2の裏面側に突
出して形成された第2電極7を有し、この第1、第2電
極6,7は、Ag−Pd、Ag−Pt等のメタルグレー
ズペーストを印刷形成したものである。さらに、第1、
第2電極6,7の間の基板2の端面2a及び側面2b
に、キシレン又はエポキシフェノール樹脂にAgを混入
したAg−レジン系の導電性塗料のペーストによる第3
電極8が設けられている。この第3電極8は、第1、第
2電極6,7を基板2の端面側から一部所定の厚さで被
覆するように設けられ、両者の導通を図っている。これ
により、基板2の裏面の中央部側から端面側に向かっ
て、第2電極7及び第3電極8が、階段状に突出するよ
うに形成されている。The electrode 4 of the chip resistor 1 is a resistor 3
The first electrode 6 whose both ends are directly connected to each other, and
The second electrode 7 is formed so as to face the electrode 6 and the substrate 2 and to project to the back surface side of the substrate 2. The first and second electrodes 6 and 7 are Ag-Pd and Ag-Pt. It is formed by printing a metal glaze paste such as. In addition, the first,
The end surface 2a and the side surface 2b of the substrate 2 between the second electrodes 6 and 7
And a paste of Ag-resin-based conductive paint, in which xylene or epoxyphenol resin is mixed with Ag.
An electrode 8 is provided. The third electrode 8 is provided so as to partially cover the first and second electrodes 6 and 7 from the end face side of the substrate 2 with a predetermined thickness, and achieves electrical continuity between them. As a result, the second electrode 7 and the third electrode 8 are formed so as to project in a stepwise manner from the central portion side of the back surface of the substrate 2 toward the end surface side.
【0011】そして、外部に露出するこの第1、第2、
第3電極6,7,8全体を覆って、Niメッキ9及びハ
ンダメッキ10が順次施され、ハンダメッキ10が施さ
れた後の基板2の裏面側の電極4の形状も、基板2の裏
面の中央部側から端面側に向かって階段状に突出して形
成されている。また、抵抗体3の表面には、ガラスコー
ト11及びレジンコート12が施され保護されている。The first, second, and
Ni plating 9 and solder plating 10 are sequentially applied to cover the entire third electrodes 6, 7 and 8, and the shape of the electrode 4 on the back surface side of the substrate 2 after the solder plating 10 is applied is also the back surface of the substrate 2. Is formed so as to project in a stepwise manner from the central portion side toward the end face side. The surface of the resistor 3 is protected by a glass coat 11 and a resin coat 12.
【0012】次にこの実施例の表面実装型電子部品の端
子電極の製造方法について、図3(A)ないし(F)に
基づいて説明する。先ず、図3(A)に示すように、分
割される大型の基板であるセラミック板13の分割溝で
あるスリット14をはさんで所定間隔で、第1電極6と
なるメタルグレーズペーストを複数列印刷し、900℃
近い温度で焼成する。さらに同様にして第2電極7も、
セラミック板13の裏面に、第1電極6と対向する位置
に形成する。次に、図3(B)に示すように、第1電極
6の間のセラミック板13上にマトリクス状に多数の抵
抗体3を印刷形成し、平均850℃の温度で焼成する。
そして、図3(C)に示すように、抵抗体3の表面にガ
ラスコート11を施し平均650℃の温度で焼成する。
この後、セラミック板13を、各チップ抵抗器1毎に縦
横に設けられたスリット14に沿って個々に分割し、図
3(D)に示すように、基板2の端面にAg−レジン系
の導電性塗料の第3電極8を約20μの厚みに塗布し、
200℃程度の温度で硬化させる。そして図3(E)、
(F)に示すように、Niメッキ9、ハンダメッキ10
を各々順次施し、外部に露出した第1、第2、第3電極
6,7,8を被覆する。Next, a method of manufacturing the terminal electrodes of the surface mount type electronic component of this embodiment will be described with reference to FIGS. 3 (A) to 3 (F). First, as shown in FIG. 3 (A), a plurality of rows of metal glaze paste to be the first electrodes 6 are arranged at predetermined intervals with a slit 14 which is a dividing groove of a ceramic plate 13 which is a large substrate to be divided. Print, 900 ° C
Bake at near temperature. Similarly, the second electrode 7 also
It is formed on the back surface of the ceramic plate 13 at a position facing the first electrode 6. Next, as shown in FIG. 3 (B), a large number of resistors 3 are printed and formed in a matrix on the ceramic plate 13 between the first electrodes 6 and fired at a temperature of 850 ° C. on average.
Then, as shown in FIG. 3C, the surface of the resistor 3 is coated with the glass coat 11 and fired at a temperature of 650 ° C. on average.
After that, the ceramic plate 13 is individually divided along the slits 14 vertically and horizontally provided for each chip resistor 1, and as shown in FIG. Apply the third electrode 8 of conductive paint to a thickness of about 20μ,
It is cured at a temperature of about 200 ° C. And FIG. 3 (E),
As shown in (F), Ni plating 9 and solder plating 10
Are sequentially applied to cover the first, second, and third electrodes 6, 7, and 8 exposed to the outside.
【0013】最後に、各チップ抵抗器の抵抗体3をトリ
ミングして抵抗値を調整する。また、抵抗体3の表面に
エポキシ樹脂等のレジンコート12を施し、200℃付
近の温度で硬化させる。Finally, the resistor 3 of each chip resistor is trimmed to adjust the resistance value. Further, a resin coat 12 such as an epoxy resin is applied to the surface of the resistor 3 and cured at a temperature near 200 ° C.
【0014】なお、トリミングは、図3(C)の状態で
行なうこともあり、この場合はその後レジンコート12
を施して図3(D)以下の工程を行なう。これによっ
て、セラミック板13をチップ毎に分離しない状態で抵
抗値のトリミングを行なうので効率良くトリミング作業
を行なうことができ、しかもレジンコート12によっ
て、後のメッキ作業時にも抵抗体に悪影響を与えること
もない。The trimming may be performed in the state shown in FIG. 3C. In this case, the resin coat 12 is then used.
Then, the steps following FIG. 3D are performed. As a result, the resistance value is trimmed without separating the ceramic plate 13 into chips, so that the trimming work can be performed efficiently, and the resin coat 12 adversely affects the resistor during the subsequent plating work. Nor.
【0015】この実施例の表面実装型電子部品の端子電
極によれば、個々のチップ抵抗器1に分割した後に、A
g−レジン系の第3電極8を印刷形成しているので、第
1,2電極7,8の表面、基板端面2a及び側面2bの
5方の面に、第3電極8が印刷形成され、端子電極の5
面が電極4として形成されているものである。従って、
第3電極8は、キャップ状に基板端部に覆い被さり、機
械的強度が高く、クラックも生じにくく、接続不良が発
生しにくいものとなる。特に、第3電極8をエポキシフ
ェノール樹脂の導電性塗料を用いて形成することによ
り、より耐久性が高いものにすることができる。また分
割した基板端面は、粗い面に立っているが、この荒い面
を、導電性塗料の第3電極8で覆うことにより、第3電
極が確実に基板端面に付着し、端面電極をより機械的電
気的信頼性の高いものにしている。According to the terminal electrode of the surface mount type electronic component of this embodiment, after dividing into the individual chip resistors 1,
Since the third electrode 8 of the g-resin system is formed by printing, the third electrode 8 is formed by printing on the surfaces of the first and second electrodes 7, 8, the substrate end surface 2a and the side surface 2b. Terminal electrode 5
The surface is formed as the electrode 4. Therefore,
The third electrode 8 covers the end portion of the substrate like a cap, has high mechanical strength, is less prone to cracks, and is less likely to cause poor connection. In particular, by forming the third electrode 8 using a conductive coating material of epoxyphenol resin, it is possible to make it more durable. Further, the divided substrate end surface stands on a rough surface, but by covering this rough surface with the third electrode 8 of conductive paint, the third electrode surely adheres to the substrate end surface, and the end surface electrode is more mechanically attached. The electrical and electrical reliability is high.
【0016】また、ハンダ付けの際に回路基板との間
で、第2電極7が独立のランドとして機能し、ハンダ付
け時には、第2電極7と回路基板との間にハンダが表面
張力より侵入し、ハンダ付け領域が制限され、絶縁効果
が高いとともに、回路基板に対する固着力も極めて強い
ものである。また、ハンダが第2電極7の下方に吸い付
けられるので、電極間距離を短くすることができ、表面
実装型電子部品の端子電極の小型化及び回路基板の高密
度実装を可能にするものである。さらには、この第2電
極7間の回路基板表面に、回路パターンを通すことも可
能であり、ハンダの不要な広がりが防止されることによ
る実装密度の向上効果は極めて大きい。Further, the second electrode 7 functions as an independent land with the circuit board during soldering, and the solder penetrates between the second electrode 7 and the circuit board due to surface tension during soldering. However, the soldering area is limited, the insulation effect is high, and the adhesion to the circuit board is extremely strong. In addition, since the solder is sucked below the second electrode 7, the distance between the electrodes can be shortened, and the size of the terminal electrode of the surface mount electronic component and the high density mounting of the circuit board can be achieved. is there. Furthermore, it is also possible to pass a circuit pattern on the surface of the circuit board between the second electrodes 7, and the effect of improving the mounting density by preventing unnecessary spread of the solder is extremely large.
【0017】また、チップ抵抗器の裏面部分が階段状に
突出し、その先端部分で基板にハンダ付けされるので、
位置決めが正確に成され、抵抗値の測定等も確実に可能
なものである。さらに、第3電極8及び表面に露出して
第1,2電極6,7は、Niメッキ9及びハンダメッキ
10により覆われているので、銀原子のマイグレーショ
ンガなく、ハンダ付け性も良好なものである。Since the back surface of the chip resistor projects in a stepwise manner and is soldered to the substrate at its tip,
The positioning is accurately performed, and the resistance value can be surely measured. Furthermore, since the third electrode 8 and the first and second electrodes 6 and 7 exposed on the surface are covered with the Ni plating 9 and the solder plating 10, there is no migration of silver atoms and solderability is also good. Is.
【0018】尚、この発明のチップ抵抗器の抵抗体は、
金属被膜抵抗体、炭素被膜抵抗体等その用途に合わせて
適宜選定し得るものである。またメタルグレーズペース
ト、Ag−レジン系導電性ペーストの成分は、適宜他の
添加物が入っていても良く、この実施例のものに限定さ
れるものではない。The resistor of the chip resistor of the present invention is
A metal film resistor, a carbon film resistor, or the like can be appropriately selected according to its use. Further, the components of the metal glaze paste and the Ag-resin-based conductive paste may appropriately contain other additives, and are not limited to those of this embodiment.
【0019】[0019]
【発明の効果】この発明の表面実装型電子部品の端子電
極とその製造方法は、表面実装型電子部品の端子電極の
5面を第3電極で覆い、第3電極の強度を高めるととも
に、クラック等の発生を防止し、電気的信頼性を高いも
のにしている。さらに、第2電極と第3電極を階段状に
形成することにより、ハンダ付け領域が確実に制限さ
れ、回路基板に対する固着力も極めて強いものである。As described above, the terminal electrode of the surface mount type electronic component and the method for manufacturing the same according to the present invention cover the five surfaces of the terminal electrode of the surface mount type electronic component with the third electrode to enhance the strength of the third electrode and to prevent cracks. Etc. are prevented and the electrical reliability is high. Furthermore, by forming the second electrode and the third electrode in a stepwise manner, the soldering area is surely limited, and the adhesion force to the circuit board is extremely strong.
【図1】この発明の表面実装型電子部品の端子電極の一
実施例を示す平面図である。FIG. 1 is a plan view showing an embodiment of a terminal electrode of a surface mount electronic component of the present invention.
【図2】図1のA−A断面図である。FIG. 2 is a sectional view taken along line AA of FIG.
【図3】各(A)(B)(C)(D)(E)(F)はこの実施
例の表面実装型電子部品の端子電極の製造工程を示す縦
断面図である。3 (A), (B), (C), (D), (E), and (F) are vertical cross-sectional views showing the manufacturing process of the terminal electrode of the surface-mounted electronic component of this embodiment.
1 チップ抵抗器 2 基板 2a 端面 2b 側面 3 抵抗体 4 電極 6 第1電極 7 第2電極 8 第3電極 9 Niメッキ 10 ハンダメッキ 1 chip resistor 2 substrate 2a end face 2b side face 3 resistor 4 electrode 6 first electrode 7 second electrode 8 third electrode 9 Ni plating 10 solder plating
───────────────────────────────────────────────────── フロントページの続き (72)発明者 小原 陽三 富山県上新川郡大沢野町下大久保3158番地 北陸電気工業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yozo Ohara 3158 Shimookubo, Osawano-cho, Kamishinagawa-gun, Toyama Prefecture Hokuriku Electric Industry Co., Ltd.
Claims (7)
け、この第1電極とは基板をはさんで反対側の基板裏面
にも第2電極を設け、さらに上記第1,2電極間の上記
基板端面及び2側面を直接覆い上記第1,2電極に接触
した第3電極を設け、この第3電極は、導電性塗料によ
り形成され上記第2電極の一部を上記基板端面側から所
定の厚さで覆っている表面実装型電子部品の端子電極。1. A first electrode is provided on an end portion of a surface of a substrate of an insulator, and a second electrode is provided on a back surface of the substrate opposite to the first electrode with the substrate interposed therebetween. A third electrode is provided which directly covers the substrate end face and the two side faces between the electrodes and is in contact with the first and second electrodes. The third electrode is formed of a conductive paint and a part of the second electrode is formed on the substrate end face. Terminal electrodes for surface-mounted electronic components that are covered with a specified thickness from the side.
側から端面側に向かって、上記第2電極及び上記第3電
極が階段状に突出して形成されている請求項1記載の表
面実装型電子部品の端子電極。2. The surface mounting according to claim 1, wherein the end face of the substrate is formed by projecting the second electrode and the third electrode stepwise from the central portion side of the back face of the substrate toward the end face side. Type electronic component terminal electrode.
電極材料により形成され、上記第3電極はAg−レジン
系導電性塗料により形成されている請求項1又は2記載
の表面実装型電子部品の端子電極。3. The surface mount type electron according to claim 1, wherein the first and second electrodes are formed of a metal glaze-based electrode material, and the third electrode is formed of an Ag-resin-based conductive paint. Terminal electrodes of parts.
エポキシフェノール系樹脂である請求項3記載の表面実
装型電子部品の端子電極。4. The Ag-resin-based conductive resin coating material,
The terminal electrode of the surface mount electronic component according to claim 3, which is an epoxyphenol resin.
が縦横に形成された絶縁体の大型の基板を設け、この絶
縁基板表面の個々のチップ部の端部に、第1電極を各々
形成し、この第1電極とは基板をはさんで反対側の基板
裏面にも第2電極を形成し、上記基板を上記分割溝に沿
って個々のチップ部に分割し、分割された上記基板の上
記第1,2電極間の3方の面を直接覆い上記第1,2電
極に接触するとともに上記第2電極の一部を上記基板端
面側から所定の厚さで覆う第3電極を形成する表面実装
型電子部品の端子電極の製造方法。5. A large-sized substrate made of an insulating material, in which a large number of dividing grooves are formed vertically and horizontally for dividing each chip portion, is provided, and a first electrode is provided at an end portion of each chip portion on the surface of the insulating substrate. A second electrode is also formed on the back surface of the substrate opposite to the first electrode with the substrate sandwiched, and the substrate is divided into individual chip parts along the dividing grooves, and the divided substrate is formed. Forming a third electrode that directly covers the three surfaces between the first and second electrodes and is in contact with the first and second electrodes, and covers a part of the second electrode from the substrate end surface side with a predetermined thickness. A method of manufacturing a terminal electrode of a surface mount electronic component.
され、この印刷時に、上記第1,2電極の一部及びこの
第1,2電極間の上記基板側面にも導電性塗料が塗布さ
れる請求項5記載の表面実装型電子部品の端子電極の製
造方法。6. The third electrode is directly printed on the end surface of the substrate, and at the time of printing, a conductive paint is applied to a part of the first and second electrodes and the side surface of the substrate between the first and second electrodes. The method for manufacturing a terminal electrode of a surface-mounted electronic component according to claim 5.
全てNiメッキ及びハンダメッキで覆う請求項6記載の
表面実装型電子部品の端子電極の製造方法。7. The method of manufacturing a terminal electrode of a surface-mounted electronic component according to claim 6, wherein all of the first, second and third electrodes exposed to the outside are covered with Ni plating and solder plating.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6281306A JP2939425B2 (en) | 1994-10-19 | 1994-10-19 | Surface mount type resistor and its manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6281306A JP2939425B2 (en) | 1994-10-19 | 1994-10-19 | Surface mount type resistor and its manufacturing method |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6180814A Division JP2866808B2 (en) | 1994-07-08 | 1994-07-08 | Manufacturing method of chip resistor |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26105397A Division JP3167968B2 (en) | 1987-10-22 | 1997-09-08 | Manufacturing method of chip resistor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07211504A true JPH07211504A (en) | 1995-08-11 |
JP2939425B2 JP2939425B2 (en) | 1999-08-25 |
Family
ID=17637248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6281306A Expired - Lifetime JP2939425B2 (en) | 1994-10-19 | 1994-10-19 | Surface mount type resistor and its manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2939425B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001035702A (en) * | 1999-07-22 | 2001-02-09 | Rohm Co Ltd | Structure of film-type resistor |
CN107086097A (en) * | 2016-02-15 | 2017-08-22 | 三星电机株式会社 | Chip-R element and Chip-R component element |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5830118A (en) * | 1981-08-14 | 1983-02-22 | ティーディーケイ株式会社 | Electronic part, and method and apparatus for producing same |
JPS61210601A (en) * | 1985-03-14 | 1986-09-18 | 進工業株式会社 | Chip resistor |
JPH01109702A (en) * | 1987-10-22 | 1989-04-26 | Hokuriku Denki Kogyo Kk | Chip resistor |
-
1994
- 1994-10-19 JP JP6281306A patent/JP2939425B2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5830118A (en) * | 1981-08-14 | 1983-02-22 | ティーディーケイ株式会社 | Electronic part, and method and apparatus for producing same |
JPS61210601A (en) * | 1985-03-14 | 1986-09-18 | 進工業株式会社 | Chip resistor |
JPH01109702A (en) * | 1987-10-22 | 1989-04-26 | Hokuriku Denki Kogyo Kk | Chip resistor |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001035702A (en) * | 1999-07-22 | 2001-02-09 | Rohm Co Ltd | Structure of film-type resistor |
CN107086097A (en) * | 2016-02-15 | 2017-08-22 | 三星电机株式会社 | Chip-R element and Chip-R component element |
CN107086097B (en) * | 2016-02-15 | 2019-06-04 | 三星电机株式会社 | Chip-R element and Chip-R component element |
Also Published As
Publication number | Publication date |
---|---|
JP2939425B2 (en) | 1999-08-25 |
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