JP2003132941A - Solid electrolyte secondary battery having capacitors formed integrally therewith - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solid electrolyte secondary battery having capacitors formed integrally therewith by which the capacitors required to be used together to respond to a larger current discharge such as a pulse discharge are not required to be mounted separately from the battery, and electronic equipment and circuit boards or the like can be downsized. SOLUTION: An oxidation film (b) is provided on a silicon substrate (a), upon which cells (g, i, l, n and p) are constituted and then the silicon substrate (a) and the cells' upper metal current collector (p) are connected electrically so that a lower metal current collector (g) may be served also as electrodes of the capacitors (a, b and g). As the electrodes and the capacitors are integrally formed, traditional capacitors to be mounted separately from the battery are not required, and the electronic equipment can be downsized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a capacitor-integrated solid electrolyte secondary battery that coexists with a capacitor.

[0002]

2. Description of the Related Art As electronic devices have become smaller and lighter, there has been a strong demand for smaller and lighter batteries. Up to now, there are some fields such as semiconductor chips that have been drastically reduced in size, while there are fields such as batteries that have not been gradually reduced in size. In order to miniaturize the battery, solid electrolyte secondary batteries manufactured by using a dry process have been attracting attention, and some patent disclosures have been made. For example, US Pat. Nos. 5,567,660 and 5,512,
No. 147, Japanese Examined Patent Publication No. 61-165965, JP-A 6-1
No. 53412, JP-A-10-284130, JP-A-20
00-106366 and the like. However, these solid electrolyte secondary batteries cannot be expected to have high rate characteristics, and have a problem that they are not suitable for large-current discharge such as pulse discharge. For this reason,
Combined use with a capacitor is essential.

[0003]

However, the capacitor is an external component, which hinders miniaturization of electronic equipment. By using a solid electrolyte, a secondary battery can be manufactured by a semiconductor process, and since it is a dry process, fine processing can be performed and a battery can be miniaturized. However, the use of external components hinders the miniaturization of electronic devices.

An object of the present invention is to provide a capacitor-integrated solid electrolyte secondary battery capable of overcoming such problems and downsizing electronic devices, circuit boards and the like.

[0005]

A solid electrolyte secondary battery integrated with a capacitor according to claim 1, wherein a substrate, a capacitor element laminated on the substrate, and a capacitor element on the substrate are laminated on the substrate. And a generated power generation element.

According to the solid electrolyte secondary battery integrated with a capacitor of claim 1, since the capacitor and the solid electrolyte secondary battery are laminated and formed on the same substrate, the external attachment of the capacitor is unnecessary. , Downsizing of electronic devices,
It can contribute to downsizing of the circuit board. Especially when a capacitor and a solid electrolyte secondary battery are connected in parallel,
High-rate discharge characteristics that cannot be obtained by a solid electrolyte secondary battery alone can be obtained.

According to a second aspect of the present invention, in the solid electrolyte secondary battery integrated with a capacitor, an insulating film serving as a dielectric is provided on a metal substrate, and a lower metal current collector film, a first active material layer, and a solid electrolyte are provided thereon. A power generation element including a layer, a second active material layer, and an upper metal current collector film, the metal substrate and the upper metal current collector are electrically connected, and the lower metal current collector is a capacitor. The feature is that it also serves as an electrode.

According to another aspect of the solid electrolyte secondary battery integrated with a capacitor, an insulating film is provided on a metal substrate, a battery is formed on the insulating film, and the metal substrate and an upper metal collector of the battery are electrically connected. Since the lower metal current collector also functions as a capacitor electrode, the battery and capacitor can be integrated, eliminating the need for conventional external capacitor components and enabling miniaturization of electronic devices. .

In this capacitor, a metal substrate and an insulating film formed on the metal substrate, for example, a lower metal current collector film on an oxide film are formed as electrodes. By controlling the thickness and area of the oxide film, the capacitance of the capacitor is increased. Is decided. Further, since this capacitor can also be formed by laminating an oxide film and a metal film, it is possible to freely set an increase in capacitance.

According to a third aspect of the solid electrolyte secondary battery integrated with a capacitor, a first insulating film serving as a dielectric is provided on a metal substrate, a metal film is provided on the first insulating film, and a dielectric is further provided on the first insulating film. A second insulating film is provided, and a power generating element including a lower metal current collector film, a first active material layer, a solid electrolyte layer, a second active material layer, and an upper metal current collector film is further formed on the second insulating film. The metal substrate and the lower metal current collector are electrically connected, the lower metal current collector also serves as an electrode of a capacitor, and the upper metal current collector and the metal film are electrically connected. It is characterized by that.

According to the solid electrolyte secondary battery integrated with a capacitor described in claim 3, pulse discharge larger than that in claim 2 is possible.

According to a fourth aspect of the present invention, in the solid electrolyte secondary battery integrated with a capacitor, the insulating film is an oxide film.

According to the solid electrolyte secondary battery integrated with a capacitor described in claim 4, the same effect as in claim 2 or 3 can be obtained.

According to a fifth aspect of the present invention, in the capacitor-integrated solid electrolyte secondary battery according to the second or third aspect, the insulating film is a nitride film.

According to the solid electrolyte secondary battery integrated with a capacitor described in claim 5, the same effect as in claim 2 or 3 can be obtained.

According to a sixth aspect of the present invention, in the solid electrolyte secondary battery integrated with a capacitor according to the second or third aspect, the insulating film is a resin film.

According to the solid electrolyte secondary battery integrated with a capacitor described in claim 6, the same effect as in claim 2 or 3 can be obtained.

The solid electrolyte secondary battery integrated with a capacitor according to claim 7 is the solid electrolyte secondary battery according to claim 2 or 3, wherein the insulating film is a ceramic film.

According to the solid electrolyte secondary battery integrated with a capacitor described in claim 7, the same effect as in claim 2 or 3 can be obtained.

According to an eighth aspect of the present invention, in the solid electrolyte secondary battery integrated with a capacitor, in the second or third aspect, the metal substrate is a semiconductor substrate.

According to the solid electrolyte secondary battery integrated with a capacitor described in claim 8, the same effect as in claim 2 or 3 can be obtained.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, a capacitor and a solid electrolyte secondary battery can be integrated by providing an oxide film on a metal substrate and stacking a power generation element on this oxide film, for example. It is possible to reduce the size and cost of an electronic device that uses both a capacitor and a battery.

In the manufacturing process of the present invention, an insulating film such as an oxide film, a nitride film, a resin film or a ceramic film is formed on any one of a metal substrate and a semiconductor substrate by a thermal oxidation method, a CVD method, coating or the like. A step of forming a predetermined thickness and area, further vapor deposition method, a step of forming a thin film of a metal film by a sputtering method, and the like, a first active material layer on the metal film, a solid electrolyte layer,
The second active material layer and the upper metal current collector film are formed by a coating method, a vapor deposition method, a sputtering method or a CVD method (including a patterning step).

The metal film formed on the insulating film layer forming the capacitor serves as an electrode on one side of the capacitor and also as a lower current collector of the battery. The film forming process requiring the annealing treatment is limited to the process before the solid electrolyte layer.

When a non-conductive substrate is used, it is necessary to form a metal thin film on the substrate. Since these steps are almost the same as the semiconductor process, an integrated laminated body of the capacitor and the solid electrolyte secondary battery can be formed on the semiconductor substrate on which the integrated circuit which is the semiconductor device is formed. As the thin film material of the solid electrolyte layer used here, a silver ion conductive solid electrolyte, a copper ion conductive solid electrolyte,
A lithium ion conductive solid electrolyte or a proton conductive solid electrolyte can be used.

Uses a lithium ion conductive solid electrolyte thin film
If it is present, the electrode material thin film is Li_xCoO₂，
Li_xNiO₂, Li_xMn₂O_Four, Li_xTiS₂, Li_xM
oS ₂, Li_xMoO₂, Li_xV₂O_Five, Li_xV₆O₁₃,Money
Genus lithium, Li_3/4Ti_5/3O_FourEtc. to normal lithium battery
Combination of compounds used depending on desired battery voltage
Can be used.

Lithium ion conductive solid electrolytes include Li ₂ S-SiS ₂ and Li ₃ PO ₄ -Li ₂ S-Si.
_{S 2, LiI-Li 2 S} -SiS 2, LiI, LiI-A
_{l 2 O 3, Li 3 N} , Li 3 N-LiI-LiOH, Li 2
_{O-SiO 2, Li 2 O} -B 2 O 3, LiI-Li 2 S-P 2
_{O 5, LiI-Li 2 S} -B 2 S 3, Li 3.6 Si 0.6 P 0.4
_{O 4, LiI-Li 3 PO} 4 -P 2 S 5 or the like can be used.

When a copper ion conductor is used for the solid electrolyte thin film, metal Cu, Cu ₂ S, Cu _x TiS ₂ ,
Cu ₂ Mo ₆ S _7.8 or the like can be used. As the copper ion conductive solid electrolyte, RbCu ₄ I _1.5 Cl _3.5 , C
_{uI-Cu 2 O-MoO 3} , Rb 4 Cu 16 I 7 Cl 13 and the like can be used.

A silver ion conductor was used for the solid electrolyte thin film.
In case of metal Ag, Ag_0.7V₂O _Five, Ag_xTiS₂etc
Can be used. Α-A as a silver ion conductor
gI, Ag₆I_FourWO_Four, C₆H_FiveNHAg_FiveI₆, AgI-
Ag₂O-MoO₃, AgI-Ag₂OB₂O₃, AgI
-Ag₂O-V₂O_FiveEtc. can be used.

Further, when the proton conductive solid electrolyte is used and the battery formed is a nickel hydrogen battery,
TiFe, ZnMn ₂ , ZrV ₂ , ZrNi ₂ , C on the negative electrode
aNi ₅ , LaNi ₅ , MmNi ₅ , Mg ₂ Ni, Mg ₂ C
u and Ni (OH) ₂ can be used for the positive electrode. As the proton conductor, LaMg _0.5 Ce _0.5 O ₃ , La ₂ Z
r ₂ O ₇ , α-Al ₂ O ₃ or the like can be used.

[0031]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIGS. 1 to 5 show sectional views in order of steps of a forming method according to the present invention. Figure 1 (1)
Indicates a silicon substrate a having a size of 3 cm × 3 cm. First, as shown in FIG. 1B, a silicon oxide film b of 50 Å is formed by thermal oxidation. Thermal oxidation is carried out in an electric furnace at 1200 ° C. with an oxygen gas flow rate of 100 cc / min. A photosensitive resist is applied thereon with a film thickness of 2000Å using a spin coater (1500 rpm), and baked at 100 ° C. for 30 minutes to form a resist film c (FIG. 1).
(3)). Next, using a quartz mask d patterned as shown in FIG. 1D, PLA (Parallel) is used.
A short wavelength light beam e is irradiated by a line aligner exposure device. Then, the resist film c is dipped in a developing solution to complete the patterning of the resist film c (FIG. 2A). Next, RIE
Using a (Reactive Ion Etching) dry etching apparatus, the silicon oxide film b in a portion not covered with the resist film c is etched (FIG. 2).
(2)). Dry etching is RF13.56MHz,
The etching gas is CHF ₃ . Finally, the resist film c is immersed in a resist stripping solution and removed (FIG. 2).
(3)), thereby forming a silicon oxide film b having a thickness of 50 cm and a size of 2.5 cm × 2.5 cm as an insulating film serving as a dielectric. Next, using a metal mask d (SUS304) patterned as shown in FIG. 2 (4), aluminum metal f is deposited by a vacuum deposition apparatus (10 mT).
orr). Aluminum metal was used as a lower metal current collector that also served as an electrode for a capacitor, and was a thin film g having a thickness of 1 μm and a size of 2.5 cm × 2.5 cm. After that, FIG.
Metal mask d patterned as shown in (1)
(SUS304) is used to sputter LiCoO ₂ h. Sputtering conditions are 200 W power, Ar / O ₂
= 3/1 is 20 sccm and 20 mTorr. Li
CoO ₂ was used as the first active material layer and was a thin film i having a thickness of 5 μm and a size of 2 cm × 2 cm. After that, FIG.
Metal mask d patterned as shown in (2)
(SUS304), Li ₂ S-SiS ₂ -Li ₃
Sputter k of PO ₄ . The sputtering conditions are a power of 35 W, an N ₂ atmosphere, and a vacuum state of 20 mTorr. Li ₂ S—SiS ₂ —Li ₃ PO ₄ was used as a solid electrolyte layer with a thickness of 1 μm and a film size of 2 cm × 2 cm. After that, using a metal mask d (SUS304) patterned as shown in FIG. 3C, m of metal Li is deposited (10 mTorr). The metal Li is used as the second active material layer and has a thickness of 1 μm and a size of 2 cm ×
The film n was 2 cm. Next, using a metal mask d (SUS304) patterned as shown in FIG. 4A, copper metal o is deposited by a vacuum deposition apparatus (10).
mTorr). The copper metal was used as an upper metal current collector, and a film p having a thickness of 10 μm and a size of 2.5 cm × 2.5 cm was formed in consideration of step coverage. Since part of the film p extends to the silicon substrate a, the silicon substrate a and the film p
Becomes electrically conductive. Finally, using a metal mask d (SUS304) patterned as shown in FIG. 4B, the epoxy resin q is spin-coated (500 rp).
Apply in m). Resin (manufactured by Hitachi Chemical: SN9000S-
3) has a thickness of 5 μm and a size of 2.2 cm × 2.2 c
The film r of m was used.

The battery thus produced is shown in FIG. 5 and was able to be charged and discharged normally. The battery capacity is 0.7 mAh and 10 mA / 2 mse by connecting the capacitors in parallel.
The pulse discharge of c was performed. When the capacitor was not connected, discharge of 10 mA was not possible at all.

(Embodiment 2) FIG. 6 shows the structure of a capacitor-integrated solid electrolyte secondary battery of Embodiment 2. First 3c
A silicon oxide film of 50 Å is formed by thermal oxidation on a silicon substrate a having a size of m × 3 cm and a thickness of 500 μm. Thermal oxidation is carried out in an electric furnace at 1200 ° C with an oxygen gas flow rate of 100 cc
/ Min. A photosensitive resist is applied thereon to a film thickness of 2000Å using a spin coater (1500 rpm) and baked at 100 ° C. for 30 minutes to form a resist film. Next, a patterned quartz mask (S
US 304) using PLA (Parallel Li)
A short wavelength light beam is irradiated by a ne Aliener exposure device. Then, the resist film is dipped in a developing solution to complete the patterning of the resist film. Next, RIE (Reactive I)
on Etching) dry etching apparatus is used to etch the silicon oxide film in the portion not covered with the resist film. RF 13.56 for dry etching
MHz and etching gas is CHF ₃ . Finally, the resist film is immersed in a resist stripping solution and removed. As a result, a silicon oxide film b1 having a thickness of 50Å and a size of 2.5 cm × 2.5 cm is formed. Using a patterned metal mask (SUS304) thereon, aluminum metal is vapor-deposited by a vacuum vapor deposition device (10 mTorr).
r). Aluminum metal has a thickness of 1 μm and a size of 2.5
A thin film g1 of cm × 2.5 cm was prepared . Further, a patterned metal mask (SUS304) is placed on it,
Plasma CVD (Chemical Vapor De)
A silicon oxide film is formed by the position method. The reaction gas was SiH ₄ and N ₂ O, and the growth temperature was 38.
At 0 ° C., plasma is generated at 50 kHz and 4 kW. Then, the patterned metal mask is removed, and the thickness 5
0Å, silicon oxide film of 2.0 cm x 2.0 cm size
b2 is obtained. Using a patterned metal mask (SUS304) thereon, aluminum metal is vapor-deposited by a vacuum vapor deposition device (10 mTorr). Aluminum metal is used as a lower metal current collector that doubles as a capacitor electrode.
Thin film g with a thickness of m and a size of 2.5 cm x 2.5 cm
It was set to 2. A part of the thin film g1 extends to the film g1 'formed on the silicon substrate a when the thin film g1 is deposited, and the silicon substrate a and the thin film g
2 becomes electrically conductive. Then, LiCoO ₂ is sputtered using a patterned metal mask (SUS304). Sputtering conditions are 200 W power, Ar /
O ₂ = 3/1 is set to 20 sccm and 20 mTorr.
LiCoO ₂ has a thickness of 5 μm and a size of 2 cm × 2 c
A thin film i of m was used. Thereafter, using the patterned metal mask _{(SUS304), Li 2 S-} SiS 2 -L
Sputter i ₃ PO ₄ . The sputtering conditions are a power of 35 W, an N ₂ atmosphere, and a vacuum state of 20 mTorr.
Li ₂ S—SiS ₂ —Li ₃ PO ₄ was a film 1 having a thickness of 1 μm and a size of 2 cm × 2 cm. After that, metal Li is vapor-deposited (10 mTorr) using a patterned metal mask (SUS304). Metal Li is 1μ
A film n having a thickness of m and a size of 2 cm × 2 cm was used. Next, using a patterned metal mask (SUS304), copper metal is vapor-deposited by a vacuum vapor deposition device (10 m).
Torr). The copper metal has a thickness of 10 μm in consideration of step coverage and has a size of 2.5 cm × 2.5 cm. Part of it extends to the thin film g1, and the film p that is the upper metal current collector and the film g1 that is the metal film are electrically connected. Finally patterned metal mask (SUS3
04) was used to spin the epoxy resin into a spin coater (5
(00 rpm). Resin (manufactured by Hitachi Chemical: SN90)
00S-3) has a thickness of 5 μm and a size of 2.2 cm ×
The film was 2.2 cm.

The battery thus prepared could be charged and discharged normally. The battery capacity was 0.7 mAh, and by connecting the capacitors in parallel, pulse discharge of 20 mA / 2 msec was possible. When the capacitor was not connected, the discharge of 20 mA was not possible at all.

(Embodiment 3) The structure (shape, film thickness, structure) and manufacturing method of the battery are the same as in Embodiment 1, and the negative electrode is made of C.
u, RbCuI _{1.5 Cl3.5} as the solid electrolyte, T as the positive electrode
A solid electrolyte secondary battery was produced using iS ₂ . The rate characteristic was lower than that of the Li-based material of Example 1, but the cycle life was the same. Also, by mixing the capacitor and the battery, a discharge of 10 mA / 2 msec was possible.

Another Cu-based solid electrolyte is Rb._FourC
u₁₆I₇Cl₁₃, Rb_FourCu₁₆I₇Cl ₁₃, CuI-Cu₂
O-MoO₃Etc. were also effective.

(Embodiment 4) The same constitution (shape, film thickness, structure) and manufacturing method as in Embodiment 2 was used, except that A was used as the negative electrode.
g, Ag ₆ I ₄ WO ₄ as the solid electrolyte and V ₂ O ₅ as the positive electrode were used to prepare a solid electrolyte secondary battery. The rate characteristic was lower than that of the Li-based material of Example 1, but the cycle life was the same. Also, by mixing the capacitor and the battery, discharge of 20 mA / 2 msec was possible.

Other Ag-based solid electrolytes include AgI-
Ag₂O-MoO₃, Α-AgI, C ₆H_FiveNHAg_FiveI₆,
AgI-Ag₂OB₂O₃, AgI-Ag₂O-V₃O_Fiveetc
Was also effective.

(Embodiment 5) The structure (shape, film thickness, structure) and manufacturing method of the battery were the same as in Embodiment 1, and the capacitor insulating film was effective even if silicon nitride was used. The thickness of those inorganic compounds including silicon oxide is 50 Å or more (100 Å, 5
00Å) was also effective.

Example 6 The battery configuration (shape, film thickness, structure) and manufacturing method are the same as in Example 1, and the insulating film of the capacitor is effective even if it is an epoxy resin, polyester resin, phenol resin or polyimide resin. there were.

(Embodiment 7) The configuration (shape, film thickness, structure) and manufacturing method of the battery are the same as those in Embodiment 1, and a plurality of substrates are provided with a distance from each other in advance on the substrate in order to enhance mass productivity. After forming a capacitor and a solid electrolyte secondary battery, forming a protective film on the entire surface, cut with a diamond cutter along the intervals provided between the solid electrolyte batteries of each capacitor integrated type (dicing method), A solid electrolyte battery of each capacitor type was obtained. At that time, since a constant distance was provided between the laminated bodies of the capacitor-integrated solid electrolyte battery, the laminated bodies could be cut without damage. Further, it is possible to prevent the intrusion of water from the cut surface, to obtain a mass-produced, inexpensive, thin, and reliable capacitor-integrated solid electrolyte battery. The battery produced in this way is
It was able to charge and discharge normally. The battery capacity was 0.7 mAh, and 10 mA / 2 msec pulse discharge could be performed by connecting the capacitors in parallel. 1 if no capacitor is connected
The discharge of 0 mA was not possible at all (Example 8). The capacitor-integrated solid electrolyte battery completed in Example 1 was bonded onto a lead frame used in a semiconductor device with a silver paste and heat-cured at 200 ° C. for 15 minutes. After that, the hybrid chip of the integrated circuit and the battery and the outer lead were connected with a gold wire using a wire bonder. After that, transfer molding was performed using an epoxy resin (manufactured by Hitachi Chemical Co., Ltd.) so as to package the semiconductor chip. Alternatively,
Butyl rubber resin (manufactured by Nitto Denko: LSS810) was dipped. Alternatively, the outer leads are sandwiched between liquid crystal polymer films (made by Kuraray) so that they serve as external terminals.
A 0 ° C. heat seal was performed. 10m in any of these cases
A / 2 msec discharge was possible, and the solid electrolyte secondary battery could be normally charged and discharged.

[0043]

According to the solid electrolyte secondary battery integrated with a capacitor according to the first aspect of the present invention, the capacitor and the solid electrolyte secondary battery are laminated and formed on the same substrate, thereby eliminating the need for external attachment of the capacitor. Therefore, it is possible to contribute to downsizing of electronic devices and downsizing of circuit boards. In particular, when the capacitor and the solid electrolyte secondary battery are connected in parallel, high rate discharge characteristics that cannot be obtained by the solid electrolyte secondary battery alone can be obtained.

According to another aspect of the solid electrolyte secondary battery with a built-in capacitor, the insulating film is provided on the metal substrate, the battery is formed on the insulating film, and the metal substrate and the upper metal collector of the battery are electrically connected. Since the lower metal current collector also functions as a capacitor electrode, the battery and capacitor can be integrated, eliminating the need for conventional external capacitor components and enabling miniaturization of electronic devices. .

In this capacitor, a metal substrate and an insulating film formed on the metal substrate, for example, a lower metal current collector film on an oxide film are formed as electrodes. By controlling the thickness and area of the oxide film, the capacitance of the capacitor is reduced. Is decided. Further, since this capacitor can also be formed by laminating an oxide film and a metal film, it is possible to freely set an increase in capacitance.

According to the capacitor-integrated solid electrolyte secondary battery of the third aspect, a larger pulse discharge than that of the second aspect becomes possible.

The capacitor-integrated solid electrolyte secondary battery according to any one of claims 4 to 8 has the same effect as that of claim 2 or claim 3.

[Brief description of drawings]

1 is a cross-sectional view showing a part of a manufacturing process of a battery of Example 1 of a capacitor-integrated solid electrolyte secondary battery of the present invention.

FIG. 2 is a cross-sectional view of the manufacturing process following FIG.

FIG. 3 is a cross-sectional view of the manufacturing process subsequent to FIG.

FIG. 4 is a cross-sectional view of the manufacturing process following FIG.

FIG. 5 is a cross-sectional view of a manufactured solid electrolyte secondary battery.

FIG. 6 is a cross-sectional view of a capacitor-integrated solid electrolyte secondary battery of Example 2.

[Explanation of symbols]

a silicon substrate b silicon oxide film c photoresist film d mask e short wavelength light beam f aluminum deposition g aluminum metal film h LiCoO ₂ sputter i LiCoO ₂ thin film k Li ₂ S-SiS ₂ -Li ₃ PO ₄ sputter l Li ₂ S- SiS ₂ -Li ₃ PO ₄ thin film m Li metal deposition n Li metal thin o copper deposition p copper metal film q resin deposition r resin protective film

Continued front page    (72) Inventor Shuji Ito             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Kazuya Iwamoto             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Hiroshi Higuchi             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Masaya Uga             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Yasuyuki Shibano             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F-term (reference) 5H011 AA03 AA05 AA06 AA07 CC02                       CC05 DD22 GG04 HH02 JJ15                 5H017 AA03 AA04 AS06 AS08 BB00                       CC01 DD05 EE05                 5H029 AJ00 AJ14 AK02 AK03 AK05                       AL11 AL12 AM11 AM12 AM13                       BJ04 BJ12 CJ24 DJ02 DJ07                       DJ11 EJ00 EJ01 EJ05 HJ12

Claims (8)

[Claims] 1. A solid electrolyte secondary battery integrated with a capacitor, comprising a substrate, a capacitor element laminated on the substrate, and a power generating element laminated on the substrate at the position of the capacitor element. 2. An insulating film serving as a dielectric is provided on a metal substrate, and a lower metal current collector film, a first active material layer, a solid electrolyte layer, a second active material layer, and an upper metal current collector film are provided on the insulating film. And a lower metal current collector also functions as an electrode of a capacitor. Solid electrolyte secondary battery. 3. A first insulating film serving as a dielectric is provided on a metal substrate, a metal film is provided thereon, and a second insulating film serving as a dielectric is further provided thereon, and a lower portion is further provided thereon. A power generation element including a metal current collector film, a first active material layer, a solid electrolyte layer, a second active material layer, and an upper metal current collector film is configured, and the metal substrate and the lower metal current collector are electrically connected to each other. The capacitor-integrated solid electrolyte is electrically connected, and the lower metal current collector also serves as an electrode of a capacitor, and the upper metal current collector and the metal film are electrically connected. Next battery. 4. The solid electrolyte secondary battery integrated with a capacitor according to claim 2, wherein the insulating film is an oxide film. 5. The capacitor-integrated solid electrolyte secondary battery according to claim 2, wherein the insulating film is a nitride film. 6. The solid electrolyte secondary battery integrated with a capacitor according to claim 2 or 3, wherein the insulating film is a resin film. 7. The solid electrolyte secondary battery integrated with a capacitor according to claim 2 or 3, wherein the insulating film is a ceramic film. 8. The solid electrolyte secondary battery integrated with a capacitor according to claim 2, wherein the metal substrate is a semiconductor substrate.