JP2003128931A - Resin composition and molded material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin composition suppressing the reduction of flexibility such as a bending property and elongation property while improving mechanical strength, heat resistance and linear expansion coefficient at the same time in spite of blending a scale-shaped inorganic filler with a thermoplastic resin, and a molded material of the same composition. SOLUTION: This resin composition is obtained by blending the scale-shaped inorganic filler consisting mainly of an acidic magnesium metasilicate, containing calcium as a small amount component and exhibiting <=100 ppm amount of elution of magnesium and <=100 ppm amount of elution of calcium on dispersing it in water with the thermoplastic resin having >=300 deg.C melting temperature, and the molded material is obtained by molding the resin composition.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a resin composition and a molded article. More specifically, the present invention comprises a resin composition containing an acidic magnesium metasilicate as a main component, and a flaky inorganic filler showing a specific magnesium and calcium elution amount, and a thermoplastic resin, and the resin composition The present invention relates to a molded product.

[0002]

2. Description of the Related Art Molded products obtained by molding a resin composition are widely used, for example, as automobile parts, machine parts, electric / electronic parts, etc. Among them, a film made of the resin composition is a copper clad laminate. It is preferably used as a flexible base material for a printed wiring board such as.

Various structures have been proposed for such a printed wiring board. Among them, copper foil is laminated on one or both sides of a base material to form a copper clad laminate, and a circuit pattern is formed on the copper foil. The formed product has extremely high reliability and is widely used in all electric and electronic devices. In order to respond to the recent rapid increase in the amount of information, such as ultra-high-speed computing of computers and the remarkable spread of mobile communication devices such as mobile phones and personal computers, further enhancement of performance and miniaturization Is required.

Conventionally, a so-called glass epoxy substrate, which is obtained by impregnating a glass cloth, a glass nonwoven fabric, a glass mat or the like with an epoxy resin, has been mainly used as a base material of a copper clad laminate. Glass epoxy substrate has electrical characteristics (dielectric breakdown voltage, dielectric constant, dielectric loss tangent, volume resistance, etc.), mechanical strength, heat resistance, adhesive workability with copper foil, thermal expansion coefficient, linear expansion coefficient, molding shrinkage. Sex,
While maintaining various properties required for the base material of the copper clad laminate at a high level in a well-balanced manner, there are problems in terms of moldability, etc.
We cannot fully meet the demand for further miniaturization.

For this reason, various attempts have been made to use a film made of a thermoplastic resin as a base material of a copper clad laminate, paying attention to the excellent moldability of the thermoplastic resin. However, although miniaturization can be achieved by adopting a thermoplastic resin, the thermoplastic resin alone has a problem that mechanical strength and heat resistance are insufficient and long-term durability and reliability are lacking.

In view of such problems, it has been conventionally practiced to blend a scale-like inorganic filler with a thermoplastic resin. Also in the field of copper-clad laminates, for example, a film for a base material formed by molding a resin composition obtained by mixing a talc in a mixed resin of polyetherimide and polyetherketone, a flaky inorganic filler such as mica is proposed. In this way, the mechanical strength and heat resistance of the film are improved. Further, in order to prevent the film from curling, when the copper foil is laminated on the film, the compounding amount of the scale-like inorganic filler is appropriately selected, and the linear expansion coefficient of the film is adjusted to the same level as the copper foil. Has also been carried out (Japanese Patent Laid-Open No. 62-149436). That is, it is known that a base film having excellent mechanical strength and heat resistance and a linear expansion coefficient similar to that of a copper foil can be obtained by blending a scale-like inorganic filler with a thermoplastic resin.

[0007]

However, the blending of the scale-like inorganic filler into the thermoplastic resin is represented by the flexibility of the molded article formed by molding the thermoplastic resin, particularly flexural bending, tensile elongation and the like. It causes deterioration of flexural properties and elongation properties. Particularly in a film for a base material of a copper clad laminate, if a scale-like inorganic filler is blended so that the linear expansion coefficient is about the same as that of the copper foil, the flexibility of the film is further impaired, and plastic deformation easily occurs. However, there is a problem that long-term durability and reliability, which are essential for a base material for a copper-clad laminate, cannot be obtained.

The present invention has been made in view of the above problems, and an object thereof is to improve mechanical strength, heat resistance, and linear expansion coefficient even if a scale-like inorganic filler is blended with a thermoplastic resin. At the same time, it is to provide a resin composition and a molded article that suppress deterioration in flexibility such as flexibility and elongation characteristics.

[0009]

As a result of intensive studies, the present inventor succeeded in obtaining a novel resin composition capable of solving the above problems, and completed the present invention.

That is, according to the present invention, a thermoplastic resin having a melting temperature of 300 ° C. or higher contains acidic magnesium metasilicate as a main component and calcium as a trace component, and the elution amount of magnesium when dispersed in water is 100 ppm or less and calcium. The present invention relates to a resin composition containing a scale-like inorganic filler having an elution amount of 100 ppm or less, and a molded article formed by molding the resin composition. In the present invention, the elution amount of magnesium and calcium means the value measured by the method described later.

According to the present invention, when an acidic magnesium metasilicate is contained as a main component and calcium is contained as a trace component, and when dispersed in water, 100 ppm of magnesium is obtained.
A molded product obtained by molding a resin composition in which a specific scale-like inorganic filler is mixed with a thermoplastic resin, in which the following or 100 ppm or less of calcium is eluted, has improved mechanical strength, heat resistance, and the like, and also has flexibility characteristics. It is possible to suppress deterioration of flexibility such as elongation property.

The molded product of the present invention can be formed in any shape. For example, since the film-shaped molded product has the above-mentioned various characteristics, warping, twisting, etc. are less likely to occur, and the molded product can be bent or bent. Also, deterioration due to plastic deformation is unlikely to occur. Therefore, when the film-shaped molded product of the present invention is used as a heat-resistant flexible base material for a printed wiring board such as a copper clad laminate, its linear expansion coefficient is adjusted to the same level as that of a metal conductor such as copper foil. However, the flexibility is not impaired.
Therefore, the copper-clad laminate and the like have excellent durability that lasts for a long period of time and can realize extremely high reliability. Further, the molded product of the present invention is not limited to use as a base material of a printed wiring board such as a copper clad laminate, but can be used as other electric / electronic parts, automobile parts, mechanical parts and the like.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, a thermoplastic resin having a melting temperature of 300 ° C. or higher is used as a resin serving as a matrix of a resin composition. The type of the thermoplastic resin is not particularly limited, and any known one can be used, and examples thereof include polyketone resins, polyether nitrile, polybenzimidazole, polyether sulfone, polysulfone, thermoplastic polyimide, polyetherimide. , Polyarylate, polyphenylene sulfide,
Examples thereof include polyphenylene ether, polyamide imide, polyaromatic resin, liquid crystal polymer and the like. Among these, polyketone resins, polysulfones, polyetherimides, thermoplastic polyimides, polyarylates, liquid crystal polymers and the like are preferable. The polyketone-based resin includes polyetherketone, polyetheretherketone, polyetherketoneketone, polyetheretherketoneketone, and the like, among which,
Polyetherketone and polyetheretherketone are preferred. The polyaromatic resin is a polymer in which an aromatic component (phenylene group etc.) is a main constituent unit and the aromatic component is directly bonded. For example, 1,4-
Examples thereof include polyphenylene. Commercially available products can also be used, and examples thereof include trade name: Poly-X (manufactured by Maxdem), trade name: Parmax (manufactured by Mississippi Polymer Technology).

The thermoplastic resins having a melting temperature of 300 ° C. or higher can be used alone or in combination of two or more if necessary. In the case of using two or more kinds in combination, it is preferable to use one of them as a polyketone resin from the viewpoint of obtaining good secondary processability. For example, a combination of a polyketone resin and a polyetherimide, a polyketone resin is preferable. The resin and polyphenylene sulfide can be used in combination, the polyketone resin and polyarylate can be used in combination, the polyketone resin, polyetherimide, and polyarylate can be used in combination, and among these, polyketone resin and polyetherimide can be used. Combination of (polyketone resin 30 to 7
0% by weight, preferably 35 to 65% by weight, with the balance being polyetherimide), combined use of polyketone resin and polyphenylene sulfide (3% of polyketone resin)
0 to 70% by weight, preferably 35 to 65% by weight,
The rest is polyphenylene sulfide) and the like are particularly preferable. A commercial item can also be used as a thermoplastic resin.

The blending amount of the thermoplastic resin having a melting temperature of 300 ° C. or higher is not particularly limited, and the type of the thermoplastic resin to be used, the blending amount and particle diameter of the scaly acidic magnesium metasilicate, the resin composition to be obtained. It may be appropriately selected from a wide range according to various conditions such as the mechanical properties and other properties of the product, the shape and intended use of the molded product to be obtained, but usually 50 to 95 wt% of the total amount of the resin composition of the present invention %, Preferably 6
It may be 0 to 90% by weight.

By using a thermoplastic resin having a melting temperature of 300 ° C. or higher, mechanical properties are not deteriorated when solder reflow is performed.

The scale-like inorganic filler used in the present invention contains, as a main component, acidic magnesium metasilicate and calcium as a trace component, and when dispersed in water, the elution amount of magnesium is 100 ppm or less, preferably The amount used is 80 ppm or less, and the elution amount of calcium is 100 ppm or less, preferably 80 ppm or less.

In the present invention, the elution amount of magnesium and calcium means that at room temperature, 1 g of the scale-like inorganic filler is added to 100 ml of distilled water and stirred for 1 hour, and the scale-like substance is filtered out (trade name: No. 5C. , Advantech Toyo Corp.
It is a numerical value measured by an ICP emission spectrophotometer (trade name: SPS1500R, manufactured by Seiko Denshi Kogyo Co., Ltd.) after filtering off the water.

When the elution amount of magnesium and calcium exceeds the above-specified range, the flexibility of the obtained film becomes large when the resin composition of the present invention is formed into a film, so that the copper-clad laminate and the like are deteriorated. It becomes unsuitable as a flexible substrate for printed wiring boards.

The content of acidic magnesium metasilicate in the flaky inorganic filler is preferably 97% by weight or more, more preferably about 99% by weight. However,
The content here is an elemental analysis value obtained by fluorescent X-ray analysis for the total amount of silica and magnesium in terms of oxide. If it is less than 97% by weight, the desired effect may not be exhibited. The content of calcium as an impurity is 0.01 to 0.1 wt% in terms of oxide based on the elemental analysis value by fluorescent X-ray analysis, and other impurities such as aluminum and iron may be included. . The total amount of these impurities (including calcium) is usually 0.1 to
It is about 3.0% by weight.

The particle size of the scale-like inorganic filler is not particularly limited, but is usually about 0.1-50 μm, preferably 0.5-.
It may be about 30 μm. In addition, although there are a major axis and a minor axis due to the shape characteristics of the scale-like inorganic filler, the major axis is meant in the present specification.

The scale-like inorganic filler can be appropriately selected and used from commercial products. In addition, the scale-like inorganic filler mainly composed of acidic magnesium metasilicate is washed with water, pickled with an inorganic acid such as hydrochloric acid, nitric acid, sulfuric acid, or alkali washed with potassium hydroxide, sodium hydroxide, sodium hydrogen carbonate, etc. It is also possible to use those prepared so as to be within the range of the above-mentioned elution amount and content by appropriate application.

The scale-like inorganic filler prepared as described above so as to be within the range of the present invention can be used as it is, and it is about 550 to 900 ° C., preferably 600.
It may be used after firing at a temperature of about 800 ° C. for about 2 to 6 hours, preferably about 3 to 5 hours.

The compounding amount of the scale-like inorganic filler is not particularly limited, and the kind and amount of the thermoplastic resin used, the mechanical strength and other characteristics of the resin composition to be obtained, the molded product to be obtained It may be appropriately selected from a wide range according to various conditions such as the shape and use of the resin composition.
It may be 0% by weight, preferably 10 to 40% by weight.

The resin composition of the present invention contains, for example, fibrous inorganic fillers such as potassium titanate fibers and wollastonite, scales such as mica, boron nitride, and scale-like alumina as long as the preferable characteristics are not impaired. One or more selected from powdery inorganic fillers, powdered inorganic fillers such as alumina, silica, titanium dioxide, calcium carbonate and the like may be contained.

Further, the resin composition of the present invention may contain, for example, a heat stabilizer, a lubricant, and
One or more known resin additives such as release agents, pigments, dyes, ultraviolet absorbers, light stabilizers, flame retardants and plasticizers may be contained.

The resin composition of the present invention has a melting temperature of 300.
It can be produced by mixing or kneading a thermoplastic resin having a temperature of not less than 0 ° C., the above-mentioned specific flaky inorganic filler, and, if necessary, other resin additives according to a known method. For example, the resin composition of the present invention in the form of pellets, for example, can be obtained by mixing or kneading the components in the form of powder, flakes or pellets using a known extruder, kneader or the like. The extruder is not particularly limited, but for example, 1
Examples thereof include a twin-screw extruder, a twin-screw extruder, and a multi-screw extruder. The kneader is not particularly limited, and examples thereof include a cokneader, a Banbury mixer, a pressure kneader, and two rolls.

Further, in the molded article according to the present invention, the resin composition prepared as described above is molded into an arbitrary shape by a known resin molding method such as an injection molding method, a compression molding method and an extrusion molding method. Can be obtained by

The film, which is one embodiment of the molded product according to the present invention, is molded by, for example, an extrusion molding method. More specifically, a casting method (T die method) in which the resin composition of the present invention is melted, extruded into a film form from a T die, and the film is cast on a roll surface and cooled, the resin composition of the present invention Can be obtained as a non-stretched film by a tubular method in which the resin is melted and extruded into a tube shape from a ring die by air cooling or water cooling.

As another embodiment of the molded article according to the present invention, the unstretched film obtained as described above is used in an amount of 50-18.
A stretched film can be obtained by uniaxially or biaxially stretching at a temperature of about 0 ° C. and heat-setting at a temperature lower than the melting point if necessary. At this time, the thickness of the film is not particularly limited, but when the film is used as a flexible substrate for a printed wiring board such as a copper clad laminate, it is usually about 5 to 200 μm, preferably about 20 to 150 μm. Good.

By laminating this film and the conductor layer, a printed wiring board such as a copper clad laminate can be obtained. More specifically, for example, a conductor layer may be laminated on one side or both sides of the film, or a multilayer structure of four layers or more may be formed. The conductor layer is a layer made of a good electrical conductor, and the good electrical conductor is not particularly limited, but copper is generally used. The thickness of the conductor layer is not particularly limited, but is usually about 5 to 50 μm, preferably 10 to 4 per conductor layer.
It may be about 0 μm.

The method for laminating the conductor layer on the film is not particularly limited, and any known method can be adopted. For example, a conductor metal foil such as a copper foil is 200 ° C. or higher, preferably 2
Examples thereof include a method of pressure bonding under heating at 10 to 250 ° C., a method of forming a conductor layer on the film surface by vapor deposition or electroless plating, a method of laminating a film and a conductor layer via an adhesive layer, and the like. Further, the film formation and the conductor layer lamination can be performed at the same time.

The molded article of the present invention includes various electric / electronic parts (for example, housings of electric / electronic devices, mechanical parts, etc.) other than the above-mentioned base material of the printed wiring board, automobile parts (for example, interior parts, bumpers). Etc., etc.), machine parts (for example, mechanical parts of machinery, etc.), etc.

[0034]

The resin composition and molded article of the present invention have higher mechanical strength, dimensional accuracy, and heat resistance, and at the same time, are excellent in flexibility such as elongation characteristics and bending characteristics. Also, without impairing the original characteristics of the thermoplastic resin,
It has excellent workability for bonding to metal conductors such as copper foil, solderability, etc., good electrical properties such as dielectric breakdown voltage, dielectric constant, dielectric loss tangent, volume resistance, etc., molding shrinkage, etc., and coefficient of thermal expansion. It has various favorable characteristics of being low. In addition, since the resin composition of the present invention uses a thermoplastic resin having a high moldability as a matrix, it has an advantage that a molded product having a fine and complicated shape can be easily manufactured.

The molded product of the present invention may have any shape. For example, since the film-shaped molded product of the present invention has the above-mentioned various characteristics, warping, twisting and the like are less likely to occur, and bending and bending are difficult. Even if it is done, deterioration due to plastic deformation is unlikely to occur. Therefore, when the film-shaped molded product of the present invention is used as a heat-resistant flexible film for a base material of a printed wiring board such as a copper clad laminate, its linear expansion coefficient is adjusted to the same level as that of a metal conductor such as copper foil. However, the flexibility is not impaired. Therefore, the copper-clad laminate has excellent durability over a long period of time and can realize extremely high reliability.

[0036]

EXAMPLES The present invention will be specifically described with reference to Examples and Comparative Examples below. Each component used in this example,
It is as follows.

[Matrix resin] (1) Polyether ether ketone: trade name 450G,
Victrex, melting temperature 360 ℃, below "PEE
K ”. (2) Polyetherimide: trade name Ultem 1000-
1000, manufactured by Japan GE Plastics Co., Ltd., melting temperature 330 ° C., hereinafter referred to as “PEI”. (3) Polyphenylene sulfide: Product name Ryton M2
888, manufactured by Toray Industries, Inc., melting temperature 310 ° C., hereinafter “PP
"S".

[Inorganic filler] (1) Inventive product 1: Scale-like acidic magnesium metametasilicate, magnesium elution amount 82 ppm, calcium elution amount 33 ppm, particle size 1.5 to 22 μm (2) Inventive product 2: scaly form A product obtained by firing acidic magnesium metasilicate (1) at 900 ° C. for 2 hours. (3) Comparative product 1: scaly acidic magnesium metasilicate,
Elution amount of magnesium 110ppm, elution amount of calcium 2
95 ppm, particle size 2.9 to 14 μm (4) Comparative product 2: natural mica, particle size range 0.6 to 13 μm
m

Examples 1 to 3 and Comparative Example 1 38.5 parts by weight of PEEK and 38.5 parts by weight of PEI were charged into the main hopper of a twin-screw extruder (trade name: KTX46, manufactured by Kobe Steel, Ltd.). Then, after melt-kneading at 350 ° C., 23 parts by weight of scale-like acidic magnesium metasilicate shown in Table 1 was added and further melt-kneaded to produce pelletized resin composition of the present invention and comparative resin composition. did.

[0040]

[Table 1]

The pellets of the resin composition of the present invention and the comparative resin composition obtained above were used in a mold for making JIS test pieces (mold temperature 1
Injection molding machine (product name: JS75, equipped with 30 ° C)
It was put into a Japan Steel Works, Ltd., cylinder temperature: 330 ° C.) and injection-molded to manufacture various JIS test pieces, which were then subjected to the following performance tests.

(1) Tensile strength (MPa) and elongation at break (%): Measured according to JIS K 7113. (2) Bending strength (MPa), bending elastic modulus (GPa) and bending deflection (%): Measured according to JIS K 7171. (3) Notched Izod impact value (hereinafter "IZOD")
J / m): According to JIS K7110, the No. 1 test piece was evaluated. The tensile strength, elongation at break, bending strength, bending deflection and IZOD were respectively measured for the untreated test piece and the test piece after heat treatment (heat treatment at 230 ° C. for 90 minutes). The measurement items (1) to (3) described above are indicators of mechanical strength. (4) Molding shrinkage rate (%): 90.01 × 49.99 ×
A molded product was manufactured with a film gate in a 3.20 mm mold, and calculated according to the following formula. Molding shrinkage rate (%) = [(mold size-molded product size) / mold size] × 100 (5) Knee point (MPa): JIS K7171
It was determined from the stress-strain diagram created according to (bending test method). The knee point means a point at which bending occurs in the stress-strain diagram, that is, a point at which a completely elastic state transitions to a plastic deformation and a viscoelastic state. The knee point is a physical property that is an index of flexibility, and the lower the knee point, the better the flexibility. The results are shown in Table 2.

[0043]

[Table 2]

From Table 2, from the viewpoint of mechanical strength, there is no significant difference between the product of the present invention (Examples 1 and 2) and the comparative product (Comparative Example 1), but the knee point is greatly different, and the product of the present invention is significantly different. Is clearly flexible.

Example 3 and Comparative Example 2 The resin composition of the present invention of Example 1 and the comparative resin composition of Comparative Example 1 were extruded with a coat hanger die extruder to produce a film having a thickness of 75 μm. did. The obtained film was evaluated by the following methods. The results are shown in Table 3.

(1) Film extrudability: The molten resin drawn down from the T-die is wound up and processed into a film, ◯; when it can be taken, it has a poor appearance or large air bubbles, and is not taken. Was designated as x. (2) Flexibility: The film was bent 180 degrees and examined for brittle fracture. The glass-like cracks and those in which the bent portion was partially or wholly broken were marked with X, and those without cracks or breaks were marked with O. (3) Cu Lamicle Curling Property: The electrolytic Cu foil 35 μm and the film were press-bonded under pressure of 10 kg / cm ² at 210 ° C. for 30 minutes, and the curling property of the obtained Cu laminated film was measured. A radius of curvature of 200 mm or more is ○, 10
0 to 200 mm was evaluated as Δ, and 100 mm or less was evaluated as x. (4) Coefficient of linear expansion: TAM120 thermomechanical analyzer (trade name: SSC5200H disk station, manufactured by Seiko Instruments Inc.), 20 to 130 ° C.
The linear expansion coefficient was measured. The take-up direction was MD and the perpendicular direction was TD. The larger the TD / MD, the larger the anisotropy. (5) TAM elongation: TAM120 thermomechanical analyzer (SS
C5200H disk station), 5 x 2
The elongation (%) was measured on a 5 mm (thickness: 0.1 mm) strip-shaped test piece under a tensile load of 50 g at a temperature rising rate of 20 to 250 ° C. and 5 ° C./min. (6) Solder heat resistance: The film was immersed in a solder bath at 260 ° C. for 10 seconds to examine the modification of the film. A sample with a large deformation was marked with X, a sample with deformation was marked with Δ, and a sample with no or slight deformation was marked with ◯.

[0047]

[Table 3]

From Table 3, it is clear that the product of the present invention is excellent in various film properties, and in particular, has a very good Cu laminar property as compared with the comparative product. That is, the film of the present invention, despite having a linear expansion coefficient of the same degree as the copper foil, does not cause curl even when laminated with the copper foil,
Furthermore, it is clear that it has good spreadability, excellent solder heat resistance, and excellent adhesion processability with copper foil.

Example 4 Pellets of the resin composition of the present invention were produced in the same manner as in Example 1 except that PPS was used instead of PEI.

Comparative Example 3 Pellets of a resin composition for comparison were produced in the same manner as in Example 4 except that natural mica was used instead of the scaly acidic magnesium metasilicate (1).

Using the pellets obtained in Example 4 and Comparative Example 3, JIS test pieces were prepared and subjected to various performance tests. The results are shown in Table 4.

[0052]

[Table 4]

From Table 4, the invention product of Example 4 is about the same as the conventional product of Comparative Example 3 in terms of various mechanical strengths, but the knee point is extremely good and the flexibility is excellent. It is clear to have

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Kenjiro Otsuka             463 Kagasuno, Kawauchi Town, Tokushima City, Tokushima Prefecture             Tokushima Research Institute (72) Inventor Minoru Aki             463 Kagasuno, Kawauchi Town, Tokushima City, Tokushima Prefecture             Tokushima Research Institute F-term (reference) 4F071 AA02 AA51 AA56 AA60 AA61                       AB26 AD05 AH07 AH12 AH17                       BA01 BB03 BB05 BB06 BC01                       BC03                 4J002 AA011 CB001 CE001 CF161                       CH001 CH071 CH091 CM021                       CM041 CN011 CN031 DJ006                       FA016 FA047 GM00 GN00                       GQ00

Claims (4)

[Claims] 1. A thermoplastic resin having a melting temperature of 300 ° C. or higher contains acidic magnesium metasilicate as a main component and calcium as a trace component, and has a magnesium elution amount of 100 ppm or less and a calcium elution amount when dispersed in water. A resin composition containing a scale-like inorganic filler of 100 ppm or less. 2. The thermoplastic resin is polyketone-based resin, polyether nitrile, polybenzimidazole,
One or more resins selected from polyethersulfone, polysulfone, thermoplastic polyimide, polyetherimide, polyarylate, polyphenylene sulfide, polyphenylene ether, polyamideimide, polyaromatic resin and liquid crystal polymer. The resin composition according to. 3. The blending amount of the thermoplastic resin is 50 to 95.
The resin composition according to claim 1 or 2, wherein the blending amount of the flaky inorganic filler is 5 to 50% by weight. 4. A molded product obtained by molding the resin composition according to claim 1.