WO2005054345A1

WO2005054345A1 - Production process tape for film-shaped wiring board

Info

Publication number: WO2005054345A1
Application number: PCT/JP2004/017046
Authority: WO
Inventors: Arihiro Kanada
Original assignee: Sumitomo Bakelite Co., Ltd.
Priority date: 2003-12-05
Filing date: 2004-11-17
Publication date: 2005-06-16
Also published as: CN1886448A; TW200518932A; JPWO2005054345A1; KR101146967B1; CN101358035A; KR20060126683A

Abstract

A production process tape for film-shaped wiring board that exhibits high heat resistance, mechanical properties, moldability and dimensional stability and that excels in productivity and workability, realizing low cost. There is provided a production process tape for film-shaped wiring board, which consists of a sheet comprising at least one thermoplastic resin, the thermoplastic resin selected from among a polysulfone resin, a thermoplastic polyimide resin and a polyether aromatic ketone resin, and a plate filler, which sheet exhibits an antiflexing strength (JIS P8155: tension 250 g, flexing rate 175 times/min, and flexing surface 0.38R) of 10 times or more and a linear expansion coefficient of 50 ppm/°C or below.

Description

Specification

Tape for production process of film wiring board

Technical field

The present invention relates to a tape for a production process of a film-like wiring board that requires excellent heat resistance and mechanical strength. Background art

[0002] Hitherto, polyether aromatic resins have been widely and widely known as engineering plastics having excellent heat resistance, mechanical properties, and the like. Further, in order to expand the use of these resins, attempts have been made to improve the properties of super engineering plastics such as polyether aromatic ketone resin, thermoplastic polyimide resin and the like by adding fillers. For example, it has been proposed to add various inorganic fiber fillers to improve the mechanical strength and heat resistance (JP-A-63-22854).

[0003] Examples of film-like wiring boards (hereinafter simply referred to as boards) required for electronic components include FPC (flexible wiring board), TAB (tape-automated bonding), and COF (chip-on). There is something called 'film). Production process tapes such as lead tapes and space tapes are used in the production and shipping processes of these film substrates. As the material used for these production process tapes, various metallic resins are employed in consideration of the heat resistance temperature, mechanical properties, cost, and the like in the process.

[0004] As an example of the production of TAB, which is one of the film-like substrates, TAB products themselves can be used as lead tapes in predetermined processes during processing and production on reels "1", or TAB semi-finished products. May be used. In this case, expensive TAB products will be defective and productivity will be reduced.

[0005] In addition, expensive thermosetting polyimide resin sheets are sometimes used in the TAB production process. When a thermosetting polyimide sheet is used, it is necessary to use a relatively thick sheet to satisfy mechanical strength, which is not preferable in terms of production cost. Since thermosetting polyimide resin sheets are produced by a solvent casting method, the productivity of relatively thick sheets is low and the production cost is high. [0006] As another process tape used in the production process of a film-like substrate, there is a space tape for preventing products from sticking to each other. Examples of the space tape requiring heat resistance include metal such as SUS and a relatively thick thermosetting polyimide resin sheet. However, all of these sheets are expensive and the production cost increases. In addition, metal space tapes are heavy and reduce productivity. If exceptional heat resistance is not required, a polyethylene terephthalate sheet or the like may be used.

[0007] As described above, process tapes used in the production process of a film-like substrate require heat resistance and mechanical strength. However, the use of the product itself as a lead tape causes a decrease in yield, There is a problem that the use of an expensive and thick thermosetting polyimide resin sheet causes an increase in product cost.

Patent Document 1: JP-A-63-22854

Disclosure of the invention

Problems to be solved by the invention

[0008] The present invention solves the above problems, and provides a low-cost resin composition for a film or sheet that is excellent in heat resistance and mechanical properties, has high sheet productivity and high productivity, and is low in cost. is there. Further, the present invention provides a film-like tape for a substrate production process, which is produced using the film or sheet. Hereinafter, in this specification, the “sheet” includes a film.

Means for solving the problem

That is, the present invention is a sheet comprising at least one thermoplastic resin selected from polysulfone resin, thermoplastic polyimide resin and polyether aromatic ketone resin, and a plate-shaped filler. , Its folding endurance ([IS P 8155: tension 250g, bending speed; 175 times per minute, bending surface 0.38R) is 10 times or more, and the linear expansion coefficient is 50ppmZ ° C or less. An object of the present invention is to provide a tape for a wiring board production process. The average particle diameter of the plate-like filler is preferably 0.1 to 20 μm, and the aspect ratio is preferably 5 or more. The amount of the plate-shaped filler is preferably 5 to 60 parts by weight based on 100 parts by weight of the thermoplastic resin. The plate-like filler is preferably at least one filler selected from metal oxides such as silicon, aluminum, and magnesium. The invention's effect

[0010] The process tape of the present invention can be produced by a melt extrusion method with high production efficiency. In addition to improving the yield of film-like substrate products, which is a conventional problem, and avoiding the cost increase due to the use of expensive thermosetting polyimide resin sheets, it is suitable as an industrial film-like substrate production tape. It is.

BEST MODE FOR CARRYING OUT THE INVENTION

[0011] The polysulfone resin used in the present invention is not particularly limited, but a polysulfone resin having a repeating unit represented by (!) In formula (1)-(8) is particularly preferred.

[0012] [Formula 1]

[Chemical 2]

The thermoplastic polyimide resin used in the present invention is not particularly limited, but those having a repeating unit represented by the formula (9)-(11) are particularly preferable. An example of such a structure is ULTEM (trade name) manufactured by US GE. In addition, there is SILTEM (trade name) manufactured by GE, which has flexibility by silicone modification to improve bending strength.

[0014] [Formula 3]

[0015] The thermoplastic polyether aromatic ketone resin used in the present invention is not particularly limited, but preferably has a repeating unit represented by the formulas (12) to (13). VICTREX's PEEK (trade name registered) has such a structure.

[0016] [Formula 4]

[0017] The addition amount of the plate-like filler in the present invention is 5 to 60 parts by weight, preferably 10 to 40 parts by weight, based on 100 parts by weight of the thermoplastic resin. If the amount is less than the above range, the heat resistance and dimensional stability of the obtained resin composition are not sufficient. If the amount is more than the above range, the moldability of the resin composition will be reduced.

[0018] The plate-shaped filler used in the present invention preferably has an average particle diameter of 0.1 to 20 m. More preferably, the average particle size is 0.5-10 m, most preferably 2-8 m.

If the average particle size of the plate-shaped filler is smaller than the above range, the process tape has insufficient properties such as heat resistance and dimensional stability. In addition, the fluidity during resin processing is poor and processing becomes difficult, which is not preferable. When the average particle diameter of the plate-shaped filler is larger than the above range, the appearance of the molded product is not preferable, and it is difficult to obtain smoothness of the surface. Absent.

In the process tape of the present invention, the mechanical strength and dimensional stability of the resin composition are dramatically improved by the plate-like filler. This plate-shaped filler suppresses the linear expansion inherent to the resin particularly when the process tape is used in a high-temperature region, and reduces the dimensional change due to the softening of the resin, thereby improving the mechanical strength and the dimensional stability.

[0021] The plate-shaped filler used in the present invention has excellent dispersibility in the base resin and can be uniformly dispersed in the resin, so that the entire resin composition imparts uniformly good dimensional stability. it can. The resin composition of the present invention desirably has a uniform mixture of the resin and the plate-like filler. Yes.

[0022] The plate-like filler used in the present invention preferably has an aspect ratio of 5 or more. Here, the aspect ratio of the plate-shaped filler is represented by the average particle diameter Z and the average thickness of the plate-shaped filler. If the particles have a spherical shape and an aspect ratio of less than 5, linear expansion is not sufficiently reduced, which is not preferable. In addition, if the particles have an aspect ratio of 100 or more and are close to fibrous, the melt fluidity of the resin will decrease, and the resin will be oriented in the flow direction. A sheet having characteristics cannot be obtained.

[0023] The material of the plate-shaped filler used in the present invention is not particularly limited, but a material mainly composed of a metal oxide such as silicon, aluminum, or magnesium can be used. . These may be used alone or in combination.

[0024] The resin sheet for a process tape of the present invention may include a fiber reinforcing material (glass fiber, carbon fiber, potassium titanate fiber, ceramic fiber, aramide fiber, Boron fiber, etc.), granular or irregular reinforcing materials (calcium carbonate, clay, turquoise, my strength, graphite carbon, molybdenum disulfide, etc.), conductivity improving materials (carbon, zinc oxide, titanium oxide, etc.) ), Thermal conductivity improvers (such as powdered metal oxides), antioxidants, heat stabilizers, antistatic agents, ultraviolet absorbers, lubricants, mold release agents, dyes, pigments, and other thermoplastic resins ( Polyamide type, polycarbonate type, polyacetanol type, PET type, PBT type, polyphenylene sulfide type, polyarylate type, fluorine type, polyether-tolyl type, liquid crystal polymer type, etc.), thermosetting resin (phenol type, Epoxy-based, silicon-based, polyamide-imide, etc.) may be used in combination. Further, a surface treatment may be performed on each filler.

(Manufacture of production process tape)

In the present invention, the method of adding and mixing the resin component and the plate-shaped filler is not particularly limited, and various mixing and mixing means are used. For example, when a filler is added to a thermoplastic resin, each may be separately supplied to a melt extruder and mixed. Alternatively, only the powder raw material may be dry-preliminarily mixed using a mixer such as a Henschel mixer, a ball mixer, a blender, or a tumbler, and then melt-mixed using a melt mixer.

As a method for forming the sheet, a forming method suitable for the resin used as the base material can be used. For example, injection molding, melt extrusion molding, casting molding, compression molding, sintering molding, powder coating, etc. A seed molding method may be used. In order to manufacture a process tape from the obtained sheet, secondary processing such as slitting to a predetermined width, forming of a concave and convex mold, application of a surface conductive layer, and an antistatic layer may be performed.

[0026] In the production of the process tape of the present invention, it is preferable that the raw resin is melt-extruded and formed into a sheet. The method of extrusion and the method of taking over are not particularly limited. The sheet may have either a single-layer structure or a multilayer structure, and is not particularly limited.

For example, in order to produce a sheet having a multilayer structure comprising a thermoplastic resin layer and a thermosetting polyimide resin layer, a thermoplastic resin layer is produced by melt extrusion, and then a thermosetting polyimide resin layer is formed. You may laminate | stack by solvent application. Alternatively, a thermosetting polyimide resin sheet may be laminated and laminated by a lamination method during melt extrusion of a thermoplastic resin. In this case, the number of laminations and the lamination method are not particularly limited, but a heat-sealing lamination or a lamination method using an adhesive can be used. The thermoplastic resin layer of the present invention may be combined to form a multilayer structure.

The tape for the production process of the present invention needs to have heat resistance. In particular, when used as a spacer during a heating step such as drying or baking, it is preferred that the difference in dimensional change during heating between the film-shaped substrate and the spacer tape be as small as possible. If the values of the respective coefficients of linear expansion are significantly different, the film-like substrate and the spacer tape for producing the film-like substrate come into contact during the heating process, and the function of the spacer cannot be obtained. Generally, the film-shaped substrate is made of thermosetting polyimide / copper foil, and their linear expansion coefficient is 20-30 ppmZ ° C. Therefore, the tape for process of the present invention is desired to have a linear expansion coefficient of 50 ppmZ ° C or less. It is preferably 45 ppmZ ° C or less, more preferably 40 ppmZ ° C or less, and even more preferably 35 ppmZ ° C or less. However, the appropriate range of such physical properties depends on the relative value between the tape for the production process and the film-like substrate used, so generally 50 ppm / ° C or less is practically used in most cases. Often there is no problem. On the other hand, when the linear expansion coefficient of the sheet in the present invention is larger than 50 ppm / ° C, the difference in dimensional change between the sheet and the film-like substrate during the heating step becomes too large to cause a problem during the step.

[0028] It is desirable that the process-step tape of the present invention has a bending strength of 10 times or more. Film substrate When processing in the form of S-reel, it is necessary that these process lead tapes and space tapes are also reel-shaped. If the bending strength is less than 10 times, it is easy to break during roll-to-roll line transfer for calorie in a reel shape, and there is a problem in use.

. The value of the bending strength (times) is preferably as large as possible, and more preferably 10 times or more. It is particularly preferably at least 15 times, more preferably at least 20 times.

Example

Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples. The present invention is not limited thereto. Raw materials used in Examples and Comparative Examples are as follows.

* 1: Polysulfone resin

UDEL P—1700NT (trade name) manufactured by Solvay Advanced Polymers

* 2: Thermoplastic polyimide resin

GE ULTEM CRS 5001-1000

* 3: Polyether aromatic ketone resin

VICTREX PEEK450G (product name)

* 4: Glass fiber (fibrous)

Asahi Glass RES—TP29 Aspect ratio: 100 or more

* 5: Alumina particles (particulate)

Admatex AO-502 Aspect ratio: 1

* 6: Plate talc (plate)

Nippon Talc MS-1 Aspect ratio: 17 Average particle size: 13 m

* 7: Plate talc (plate)

N-Talc L-1 aspect ratio: 25 Average particle size: 5 / ζ πι

[0030] Each material was supplied to a twin-screw extruder with the composition shown in Table 1 and Table 2, and melt-blended to produce a bellet. In the table, the numerical values of the blending amounts in the respective Examples and Comparative Examples are parts by weight. The pellets thus produced were melt-extruded using a single screw extruder and a Τ die to obtain a sheet-like sample. For Comparative Example 5, a sheet-like sample was obtained by hot pressing. [0031] Various evaluations were performed based on the following.

(1) Folding strength: Folding strength is measured using a 0.2 mm thick sheet sample

(Based on JIS P 8155).

(2) Coefficient of linear expansion: The coefficient of linear expansion of the sample was measured using a thermomechanical analysis measuring tester (in accordance with JIS K 7196).

(3) Heat resistance: Judgment of dimensional change behavior of the sample: Heated to 200 ° C. Regarding the change in sample shape before and after heating, the sample with no deformation was rated as 〇, the sample with little deformation was rated as △, and the sample with deformation was rated as X It was decided.

(4) Formability: The appearance of a sample obtained by performing strand processing and sheet processing with a twin-screw mixer and a single-screw mixer was visually evaluated. Those with good appearance were rated as “A”, and those with no stable molded product were rated as “X”.

(5) Those that can be used satisfactorily without any problems under the TAB production process conditions are marked with 〇, and those that have problems with dimensional change or sheet wavy bending are marked with X. If the sheet was brittle and could not be evaluated due to cracking during work, it was rated XX.

[Table 1]

[0033] [Table 2] Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Polysulfone resin (* 1) 20 0 20 20 20 Thermoplastic polyimide resin (* 2) 50 0 50 50 70 Polyether aromatic ketone resin (* 3) 30 100 30 30 10 Formulation

Glass fiber (* 4) 0 0 10 0 0 (parts by weight)

Alumina particles (* 5) 0 0 0 10 20 Plate-like filler (* 6) 0 0 0 0 0 Plate-like filler (* 7) 0 0 0 0 0 Folding strength [times] 28 120 2 9 7 lines expansion coefficient _{[P pmZ ° C] 55 55} 48 54 48 properties heat resistance X厶〇 O △ moldability OO 〇 XX

Evaluation under TAB production process conditions X X X X X X X X Industrial applicability

According to the present invention, a tape for a production process of a low-cost film-shaped substrate excellent in heat resistance, mechanical properties, moldability, dimensional stability, and workability can be obtained.

Claims

The scope of the claims

[1] A sheet containing at least one thermoplastic resin selected from a polysulfone resin, a thermoplastic polyimide resin, and a polyether aromatic ketone resin, and a plate-like filler. Folding strength ([IS P 8155: tension 250g, bending speed; 175 times per minute, bending surface 0.38R) is 10 times or more, and the coefficient of linear expansion is 50ppmZ ° C or less. Production process tape.

[2] The tape according to claim 1, wherein the average diameter of the plate-shaped filler is 0.1 to 20 m.

[3] The tape according to claim 1, wherein the plate-like filler has an aspect ratio of 5 or more.

[4] The tape according to claim 1, wherein the amount of the plate-shaped filler is 5 to 60 parts by weight based on 100 parts by weight of the thermoplastic resin.