JPS6454792A - Film carrier tape - Google Patents

Film carrier tape

Info

Publication number
JPS6454792A
JPS6454792A JP21030687A JP21030687A JPS6454792A JP S6454792 A JPS6454792 A JP S6454792A JP 21030687 A JP21030687 A JP 21030687A JP 21030687 A JP21030687 A JP 21030687A JP S6454792 A JPS6454792 A JP S6454792A
Authority
JP
Japan
Prior art keywords
carrier tape
laminated
film
copper
film carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21030687A
Other languages
Japanese (ja)
Inventor
Eiji Ogawa
Masaharu Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP21030687A priority Critical patent/JPS6454792A/en
Publication of JPS6454792A publication Critical patent/JPS6454792A/en
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To reduce a linear expansion coefficient to the same degree as that of copper, to eliminate a curl generated when copper foil is laminated, to form an inorganic filler in a plate shape, and to improve workability by containing 14-40wt.% of the filler in a film carrier tape. CONSTITUTION:After one side face of a film carrier tape is coated with an adhesive, sprocket device holes are opened, a copper foil is laminated on the adhesive coating surface except the holes, and a wiring circuit is formed by etching on the film or a sheet. The film or the sheet is formed in a composition of 85-60wt.% of polyether ketone resin, 15-40wt.% of inorganic filler. The filler is formed in a plate shape, its linear expansion coefficient is reduced to the same degree as that of copper to eliminate a curl which disturbs for use when the foil is laminated to suppress decreases in the punching workability and thermal shrinkage to the degrees not becoming a problem.
JP21030687A 1987-08-26 1987-08-26 Film carrier tape Pending JPS6454792A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21030687A JPS6454792A (en) 1987-08-26 1987-08-26 Film carrier tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21030687A JPS6454792A (en) 1987-08-26 1987-08-26 Film carrier tape

Publications (1)

Publication Number Publication Date
JPS6454792A true JPS6454792A (en) 1989-03-02

Family

ID=16587224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21030687A Pending JPS6454792A (en) 1987-08-26 1987-08-26 Film carrier tape

Country Status (1)

Country Link
JP (1) JPS6454792A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005054345A1 (en) * 2003-12-05 2005-06-16 Sumitomo Bakelite Co., Ltd. Production process tape for film-shaped wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005054345A1 (en) * 2003-12-05 2005-06-16 Sumitomo Bakelite Co., Ltd. Production process tape for film-shaped wiring board
JPWO2005054345A1 (en) * 2003-12-05 2007-06-28 住友ベークライト株式会社 Film circuit board production process tape

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