JPS6454792A - Film carrier tape - Google Patents
Film carrier tapeInfo
- Publication number
- JPS6454792A JPS6454792A JP21030687A JP21030687A JPS6454792A JP S6454792 A JPS6454792 A JP S6454792A JP 21030687 A JP21030687 A JP 21030687A JP 21030687 A JP21030687 A JP 21030687A JP S6454792 A JPS6454792 A JP S6454792A
- Authority
- JP
- Japan
- Prior art keywords
- carrier tape
- laminated
- film
- copper
- film carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 4
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 239000011889 copper foil Substances 0.000 abstract 2
- 239000000945 filler Substances 0.000 abstract 2
- 239000011256 inorganic filler Substances 0.000 abstract 2
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000007423 decrease Effects 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 239000011888 foil Substances 0.000 abstract 1
- 229920001643 poly(ether ketone) Polymers 0.000 abstract 1
- 238000004080 punching Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE:To reduce a linear expansion coefficient to the same degree as that of copper, to eliminate a curl generated when copper foil is laminated, to form an inorganic filler in a plate shape, and to improve workability by containing 14-40wt.% of the filler in a film carrier tape. CONSTITUTION:After one side face of a film carrier tape is coated with an adhesive, sprocket device holes are opened, a copper foil is laminated on the adhesive coating surface except the holes, and a wiring circuit is formed by etching on the film or a sheet. The film or the sheet is formed in a composition of 85-60wt.% of polyether ketone resin, 15-40wt.% of inorganic filler. The filler is formed in a plate shape, its linear expansion coefficient is reduced to the same degree as that of copper to eliminate a curl which disturbs for use when the foil is laminated to suppress decreases in the punching workability and thermal shrinkage to the degrees not becoming a problem.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21030687A JPS6454792A (en) | 1987-08-26 | 1987-08-26 | Film carrier tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21030687A JPS6454792A (en) | 1987-08-26 | 1987-08-26 | Film carrier tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6454792A true JPS6454792A (en) | 1989-03-02 |
Family
ID=16587224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21030687A Pending JPS6454792A (en) | 1987-08-26 | 1987-08-26 | Film carrier tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6454792A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005054345A1 (en) * | 2003-12-05 | 2005-06-16 | Sumitomo Bakelite Co., Ltd. | Production process tape for film-shaped wiring board |
-
1987
- 1987-08-26 JP JP21030687A patent/JPS6454792A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005054345A1 (en) * | 2003-12-05 | 2005-06-16 | Sumitomo Bakelite Co., Ltd. | Production process tape for film-shaped wiring board |
| JPWO2005054345A1 (en) * | 2003-12-05 | 2007-06-28 | 住友ベークライト株式会社 | Film circuit board production process tape |
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