JP2003127274A - Glass epoxy copper-clad laminated plate - Google Patents

Glass epoxy copper-clad laminated plate

Info

Publication number
JP2003127274A
JP2003127274A JP2001323311A JP2001323311A JP2003127274A JP 2003127274 A JP2003127274 A JP 2003127274A JP 2001323311 A JP2001323311 A JP 2001323311A JP 2001323311 A JP2001323311 A JP 2001323311A JP 2003127274 A JP2003127274 A JP 2003127274A
Authority
JP
Japan
Prior art keywords
epoxy resin
epoxy
copper
glass
laminated plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001323311A
Other languages
Japanese (ja)
Inventor
Hiroteru Kamiya
博輝 神谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Chemical Corp
Original Assignee
Kyocera Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Chemical Corp filed Critical Kyocera Chemical Corp
Priority to JP2001323311A priority Critical patent/JP2003127274A/en
Publication of JP2003127274A publication Critical patent/JP2003127274A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a copper-clad laminated plate having a low dielectric constant and a low dielectric tangent by a glass epoxy substrate, and is easy of production, molding, adhesion, multi-layer processing, processability, etc., in relation to a polytertrafluoroethylene substrate and a PPE substrate. SOLUTION: When the glass epoxy copper-clad laminated plate is produced by laminating a plurality of prepregs in which a glass base material is impregnated with an epoxy resin composition and dried and integrally molding the prepregs with copper foil laid at least on one side of the laminate to overlap each other, an epoxy resin varnish containing the epoxy resin (A), a curing agent (B), and a fullerene or its homologue (C60 , C70 , a carbon nanometer tube, etc.), (C) as indispensable components in a ratio of 5-50% of (C) to [(A)+(B)] is used.

Description

【発明の詳細な説明】 【０００１】 【発明の属する技術分野】本発明は、低誘電率、低誘電
正接のガラスエポキシ銅張積層板であり、既存のガラス
エポキシ製造装置で製造可能であり、成形性、接着性、
多層化、加工性等にも優れたガラスエポキシ銅張積層板
に関する。 【０００２】 【従来の技術】電子機器における情報処理の高速化は際
限なく進行しているが、高速の伝搬速度を安定に保つに
は、伝搬周波数の高周波化が必要となる。その際、導電
体を支持する絶縁体の電気特性が重要なファクターとな
り、具体的には、絶縁体の誘電率および誘電正接が低い
ほど良い。従来、この用途の絶縁体には、テフロンや熱
硬化型ポリフェニレンエーテル（ＰＰＥ）等が使用され
てきた。しかし、これらを用いた基板は、いわゆるガラ
スエポキシ基板に対して、特別な製造設備が必要な他、
加工特性にも劣り、広く使用されるには多くの障害があ
った。 【０００３】 【発明が解決しようとする課題】本発明は、上記の事情
に鑑みてなされたもので、低誘電率、低誘電正接の銅張
積層板をガラスエポキシ基板で実現したものであり、テ
フロン基板やＰＰＥ基板に対して製造性、成形性、接着
性、多層化、加工性等が容易である銅張積層板を提供す
るものである。 【０００４】 【課題を解決するための手段】本発明者は、上記の目的
を達成しようと鋭意研究をすすめた結果、エポキシ樹脂
組成物中にフラーレンもしくはその同族体を添加するこ
とにより、上記目的が達成できることを見いだし、本発
明を完成したものである。 【０００５】即ち、本発明は、ガラス織布、ガラス不織
布等のガラス基材にエポキシ樹脂組成物を含浸、乾燥さ
せたプリプレグを複数枚積層し、その少なくとも片面に
銅箔を重ね合わせて一体に成形するガラスエポキシ銅張
積層板を製造するにあたり、上記エポキシ樹脂組成物と
して、（Ａ）エポキシ樹脂、（Ｂ）硬化剤および（Ｃ）
フラーレンもしくはその同族体を必須成分とし、（Ａ）
成分と（Ｂ）成分の合計量［（Ａ）＋（Ｂ）］に対して
（Ｃ）フラーレンもしくはその同族体を５〜５０重量％
の割合で含有するエポキシ樹脂ワニスを用いることを特
徴とするガラスエポキシ銅張積層板である。 【０００６】以下、本発明を詳細に説明する。 【０００７】本発明のエポキシ樹脂組成物（ワニス）
は、（Ａ）エポキシ樹脂、（Ｂ）硬化剤および（Ｃ）フ
ラーレンもしくはその同族体（Ｃ60、Ｃ70、カーボンナ
ノチューブ等）を必須成分とするものである。 【０００８】本発明に用いる（Ａ）エポキシ樹脂として
は、特に制限なく広く使用することができ、エポキシ当
量が１７０〜１０００のビスフェノールＡ型エポキシ樹
脂やノボラック型エポキシ樹脂が好適である。ビスフェ
ノールＡ型エポキシ樹脂は臭素化されたものでもよく、
単独または２種以上混合して使用することができる。ビ
スフェノールＡ型エポキシ樹脂は、一般にエポキシ当量
が１７０以上であり、また、１０００を超えると含浸性
が低下して好ましくない。 【０００９】また、ノボラック型エポキシ樹脂として
は、フェノールノボラック型、クレゾールノボラック
型、ビスフェノールＡノボラック型等のものが挙げら
れ、これらは単独または２種以上混合して使用すること
ができる。 【００１０】本発明に用いる（Ｂ）硬化剤としては、特
に制限はなく、通常エポキシ樹脂の硬化剤に使用されて
いる化合物でよく、アミン硬化系としては、ジシアンジ
アミド、芳香族アミン等が挙げられ、またフェノール硬
化系としては、フェノールノボラック樹脂、クレゾール
ノボラック樹脂、ビスフェノールＡ型ノボラック樹脂等
が挙げられ、これらは単独または２種以上混合して使用
することができる。 【００１１】本発明には、必要に応じて難燃剤を加え
る。難燃剤としては、特に制限はなく、そのうち無機系
充填型難燃剤として、タルク、シリカ、アルミナ、水酸
化アルミニウム、水酸化マグネシウム等が挙げられ、こ
れらは単独または２種以上混合して使用することができ
る。有機系充填型難燃剤として、テトラブロモビスフェ
ノールＡまたはこのエポキシ変性物等のハロゲン系難燃
剤、トリフェニルフォスフィン等のリン酸エステル系難
燃剤、フェノキシフォスファゼン類等が挙げられる。難
燃剤の配合割合は、樹脂組成物全体の０〜５０重量部の
割合で配合することが好ましい。 【００１２】本発明に用いる（Ｃ）フラーレンもしくは
その同族体としては、Ｃ60（６０個のＳＰ2 炭素が３２
面体構造をなすもの）、Ｃ70（３７面体構造）、カーボ
ンナノチューブ等が挙げられ、これらは複数の炭素がＳ
Ｐ3 とＳＰ2 結合によりなる分子である。 【００１３】上記（Ｃ）フラーレンなどは、対称性の非
常に高い化学結合であり、内部に化学的空間を有する。
従って、（Ｃ）成分を含むことにより、樹脂組成物は誘
電率・誘電正接が低くなる。また、（Ｃ）成分は、吸水
率が低く耐湿性をおとさず、また難燃物でありさらに絶
縁体でもある。 【００１４】（Ｃ）成分の配合割合は、［（Ａ）＋
（Ｂ）］合計量に対して５〜５０重量％とする。５重量
％未満では、低誘電率・低誘電正接の効果をもたらすこ
とができず、５０重量％を超えると増粘により製造上の
不具合が生じる。従って樹脂組成物における［（Ａ）＋
（Ｂ）］合計量に対して５〜５０重量％とすることが好
ましい。 【００１５】本発明に用いるガラス織布、ガラス不織布
等のガラス基材および銅箔は、通常ガラスエポキシ銅張
積層板に使用されるものであれば特に制限なく使用する
ことができる。 【００１６】本発明の銅張積層板の製造工程は、上述の
ようにして作られたワニスによりプリプレグをを作製
し、このプリプレグ複数枚と、銅箔を重ねて加熱加圧一
体に成形してガラスエポキシ銅張積層板を製造すること
ができる。 【００１７】 【作用】本発明は、フラーレンもしくはその同族体を配
合することを特徴としており、製造性、成形性、接着
性、多層化、加工性等が良好な低誘電率・低誘電正接の
ガラスエポキシ銅張積層板を製造することができたもの
である。 【００１８】 【発明の実施の形態】次に、本発明を実施例によって説
明するが、本発明はこれらの実施例によって限定される
ものではない。以下の実施例および比較例において、
「部」とは「重量部」を意味する。 【００１９】実施例１ 臭素化エポキシ樹脂（エポキシ当量４９０、固形分７５
重量％）６３７部、クレゾールノボラックエポキシ樹脂
（エポキシ当量２１０、固形分７０重量％）７６部、ジ
シアンジアミド１３部、和光純薬社製のフラーレン（Ｃ
60）１１０部および２−エチル−４メチルイイミダゾー
ル０．１部をジメチルホルムアミドに溶解して樹脂固形
分６５重量％のエポキシ樹脂ワニスを調製した。 【００２０】実施例２ クレゾールノボラックエポキシ樹脂（エポキシ当量２１
０、固形分７０重量％）２８２部、フェノール樹脂（水
酸基価１１８、固形分７０重量％）１８５部、縮合型リ
ン酸エステル１００部、和光純薬社製のフラーレン（Ｃ
60）２４５部および２−エチル−４メチルイイミダゾー
ル０．１部をシクロヘキサノンに溶解して樹脂固形分６
５重量％のエポキシ樹脂ワニスを調製した。 【００２１】実施例３ ビスフェノールＡ型エポキシ樹脂（エポキシ当量４５
６、固形分７０重量％）２８０部、クレゾールノボラッ
クエポキシ樹脂（エポキシ当量２１０、固形分７０重量
％）７０部、フェノール樹脂（水酸基価１１８、固形分
７０重量％）１３０部、水酸化アルミニウム７５部、フ
ェノキシフォスファゼンオリゴマー６０部、カーボンナ
ノチューブ１９０部および２−エチル−４メチルイイミ
ダゾール０．１部をシクロヘキサノンに溶解して樹脂固
形分６５重量％のエポキシ樹脂ワニスを調製した。 【００２２】比較例１ 臭素化エポキシ樹脂（エポキシ当量４９０、固形分７５
重量％）７６０部、クレゾールノボラックエポキシ樹脂
（エポキシ当量２１０、固形分７０重量％）９０部、ジ
シアンジアミド１５部および２−エチル−４メチルイイ
ミダゾール０．１部をジメチルホルムアミドに溶解して
樹脂固形分６５重量％のエポキシ樹脂ワニスを調製し
た。 【００２３】実施例１〜３および比較例１で調製したエ
ポキシ樹脂ワニスを用いてガラス織布に連続的に含浸塗
布し、１６０℃の温度で乾燥しプリプレグを作製した。
このプリプレグ８枚を重ね合わせ、その両面に厚さ３５
μｍまたは１８μｍの銅箔を重ね合わせて、１７０℃，
圧力４０ｋｇ／ｃｍで９０分間、加熱加圧一体に成形し
て板厚１．６ｍｍのガラスエポキシ銅張積層板と多層板
を製造した。 【００２４】これらの銅張積層板について、誘電率、誘
電正接等を試験したので、その結果を表１に示した。参
考として、熱硬化型ＰＰＥ樹脂の銅張積層板と多層板の
結果も付記する。本発明における誘電特性は優れてお
り、本発明の効果を確認することができた。 【００２５】 【表１】＊１：ＪＩＳ−Ｃ−６４８１に準じて測定、 ＊２：ＪＩＳ−Ｃ−６４８１に準じて測定。銅箔は３５
μｍ、 ＊３：ＪＩＳ−Ｃ−６４８１に準じて測定。２６０℃の
半田槽に試験片を１２０秒浮かべ、外観の変化を観察し
た、 ＊４：多層成形後のボイトとカスレの有無を観察した。
○印…ボイドなし、△印…一部有り、×印…全面に有
り。 【００２６】 【発明の効果】以上の説明及び表１から明らかなよう
に、本発明は、フラーレンもしくはその同族体を配合す
ることを特徴としており、製造性、成形性、接着性、多
層化、加工性等が良好な、低誘電率・低誘電正接なガラ
スエポキシ銅張積層板を製造することができたものであ
る。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass epoxy copper-clad laminate having a low dielectric constant and a low dielectric loss tangent, which can be manufactured by an existing glass epoxy manufacturing apparatus. Formability, adhesion,
The present invention relates to a glass epoxy copper-clad laminate excellent in multilayering and workability. 2. Description of the Related Art Although the speed of information processing in electronic devices has been increasing without limit, it is necessary to increase the propagation frequency in order to stably maintain a high propagation speed. At that time, the electrical characteristics of the insulator supporting the conductor are important factors. Specifically, the lower the dielectric constant and the dielectric loss tangent of the insulator, the better. Conventionally, Teflon, thermosetting polyphenylene ether (PPE), or the like has been used as an insulator for this purpose. However, substrates using these require special manufacturing equipment for so-called glass epoxy substrates,
It also has poor processing characteristics and has had many obstacles to its widespread use. SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and is to realize a copper-clad laminate having a low dielectric constant and a low dielectric loss tangent using a glass epoxy substrate. An object of the present invention is to provide a copper-clad laminate that is easy to manufacture, mold, adhere, multilayer, process, and the like for a Teflon substrate or a PPE substrate. Means for Solving the Problems The present inventors have made intensive studies to achieve the above object, and as a result, by adding fullerene or a homolog thereof to an epoxy resin composition, the above object was achieved. Can be achieved, and the present invention has been completed. [0005] That is, the present invention is to laminate a plurality of prepregs impregnated and dried with an epoxy resin composition on a glass base material such as a glass woven fabric or a glass nonwoven fabric, and superimpose a copper foil on at least one surface thereof to form an integral body. In producing the glass epoxy copper clad laminate to be molded, the epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, and (C)
Fullerene or a homolog thereof is an essential component, and (A)
(C) Fullerene or a homolog thereof in an amount of 5 to 50% by weight based on the total amount of the component and the component (B) [(A) + (B)].
The glass epoxy copper-clad laminate is characterized by using an epoxy resin varnish containing at a ratio of: Hereinafter, the present invention will be described in detail. The epoxy resin composition of the present invention (varnish)
Are those containing (A) an epoxy resin, (B) a curing agent, and (C) fullerene or a homolog thereof (C 60 , C 70 , carbon nanotube, etc.) as essential components. The epoxy resin (A) used in the present invention can be widely used without any particular limitation, and a bisphenol A epoxy resin or a novolak epoxy resin having an epoxy equivalent of 170 to 1,000 is preferable. Bisphenol A type epoxy resin may be brominated,
They can be used alone or in combination of two or more. The bisphenol A type epoxy resin generally has an epoxy equivalent of 170 or more, and if it exceeds 1,000, the impregnation property is undesirably lowered. The novolak type epoxy resin includes phenol novolak type, cresol novolak type, bisphenol A novolak type and the like, and these can be used alone or in combination of two or more. The curing agent (B) used in the present invention is not particularly limited, and may be a compound usually used as a curing agent for an epoxy resin. Examples of the amine curing system include dicyandiamide and aromatic amine. Examples of the phenol curing system include a phenol novolak resin, a cresol novolak resin, and a bisphenol A type novolak resin, and these can be used alone or in combination of two or more. In the present invention, a flame retardant is added as required. The flame retardant is not particularly limited. Among them, talc, silica, alumina, aluminum hydroxide, magnesium hydroxide and the like can be mentioned as inorganic-filled flame retardants. These may be used alone or in combination of two or more. Can be. Examples of the organic filled flame retardant include halogen-based flame retardants such as tetrabromobisphenol A or an epoxy-modified thereof, phosphate-based flame retardants such as triphenylphosphine, and phenoxyphosphazenes. It is preferable that the compounding ratio of the flame retardant is 0 to 50 parts by weight of the whole resin composition. As the (C) fullerene or a homolog thereof used in the present invention, C 60 (60 SP 2 carbon atoms of 32
(Having a planar structure), C 70 (37-hedral structure), carbon nanotube and the like.
It is a molecule consisting of P 3 and SP 2 bonds. The (C) fullerene or the like is a chemical bond having a very high symmetry, and has a chemical space inside.
Therefore, by containing the component (C), the resin composition has a low dielectric constant and dielectric loss tangent. In addition, the component (C) has a low water absorption rate and does not maintain moisture resistance, is a flame retardant, and is also an insulator. The mixing ratio of the component (C) is [(A) +
(B)] 5 to 50% by weight based on the total amount. If the amount is less than 5% by weight, the effects of low dielectric constant and low dielectric loss tangent cannot be obtained. If the amount is more than 50% by weight, there is a problem in production due to thickening. Therefore, [(A) +
(B)] The content is preferably 5 to 50% by weight based on the total amount. The glass substrate such as a glass woven fabric and a glass nonwoven fabric and a copper foil used in the present invention can be used without any particular limitation as long as they are generally used for a glass epoxy copper clad laminate. In the manufacturing process of the copper-clad laminate of the present invention, a prepreg is prepared from the varnish prepared as described above, and a plurality of the prepregs and a copper foil are laminated and molded integrally by heating and pressing. Glass epoxy copper clad laminates can be manufactured. The present invention is characterized in that fullerene or a homolog thereof is compounded, and has a low dielectric constant and a low dielectric loss tangent, which are excellent in manufacturability, moldability, adhesiveness, multilayering, workability and the like. A glass epoxy copper clad laminate could be manufactured. Next, the present invention will be described with reference to examples, but the present invention is not limited to these examples. In the following Examples and Comparative Examples,
"Parts" means "parts by weight". Example 1 A brominated epoxy resin (epoxy equivalent: 490, solid content: 75
637 parts, cresol novolak epoxy resin (epoxy equivalent 210, solid content 70% by weight) 76 parts, dicyandiamide 13 parts, fullerene (C
60 ) 110 parts and 0.1 part of 2-ethyl-4-methylimidazole were dissolved in dimethylformamide to prepare an epoxy resin varnish having a resin solid content of 65% by weight. Example 2 Cresol novolak epoxy resin (epoxy equivalent 21
0, solid content 70% by weight) 282 parts, phenol resin (hydroxyl value 118, solid content 70% by weight) 185 parts, condensed phosphate ester 100 parts, Wako Pure Chemical Industries fullerene (C
60 ) 245 parts and 0.1 part of 2-ethyl-4-methylimidazole were dissolved in cyclohexanone to obtain a resin solid content of 6%.
A 5% by weight epoxy resin varnish was prepared. Example 3 Bisphenol A type epoxy resin (Epoxy equivalent: 45)
6, 280 parts of solid content 70% by weight), 70 parts of cresol novolac epoxy resin (epoxy equivalent 210, solid content 70% by weight), 130 parts of phenol resin (hydroxyl value 118, solid content 70% by weight), 75 parts of aluminum hydroxide , 60 parts of a phenoxyphosphazene oligomer, 190 parts of carbon nanotubes and 0.1 part of 2-ethyl-4-methylimidazole were dissolved in cyclohexanone to prepare an epoxy resin varnish having a resin solid content of 65% by weight. Comparative Example 1 Brominated epoxy resin (epoxy equivalent: 490, solid content: 75
760 parts), 90 parts of cresol novolak epoxy resin (epoxy equivalent: 210, solid content: 70% by weight), 15 parts of dicyandiamide and 0.1 part of 2-ethyl-4-methylimidazole are dissolved in dimethylformamide to obtain a resin solid content. A 65% by weight epoxy resin varnish was prepared. Using the epoxy resin varnish prepared in Examples 1 to 3 and Comparative Example 1, a glass woven fabric was continuously impregnated and coated, and dried at a temperature of 160 ° C. to prepare a prepreg.
Eight sheets of this prepreg are superimposed, and a thickness of 35
μm or 18μm copper foil, 170 ℃,
The glass epoxy copper-clad laminate having a thickness of 1.6 mm and the multilayer board were manufactured by integrally molding under pressure and pressure of 40 kg / cm for 90 minutes. These copper clad laminates were tested for dielectric constant, dielectric loss tangent, etc., and the results are shown in Table 1. For reference, the results of the thermosetting PPE resin copper-clad laminate and the multilayer board are also appended. The dielectric properties in the present invention were excellent, and the effect of the present invention could be confirmed. [Table 1] * 1: Measured according to JIS-C-6481, * 2: Measured according to JIS-C-6481. Copper foil is 35
μm, * 3: Measured according to JIS-C-6481. The test piece was floated in a solder bath at 260 ° C. for 120 seconds, and the change in appearance was observed. * 4: The presence or absence of voids and burrs after multilayer molding was observed.
○: no void, △: some, x: all over. As is apparent from the above description and Table 1, the present invention is characterized by blending fullerene or a homolog thereof, and is characterized by its manufacturability, moldability, adhesiveness, multilayer structure, A low-permittivity, low-dielectric tangent glass epoxy copper-clad laminate having good workability and the like can be produced.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｃ０８Ｌ 63/00 Ｃ０８Ｌ 63/00 Ｃ Ｈ０５Ｋ 1/03 ６１０ Ｈ０５Ｋ 1/03 ６１０Ｌ ６１０Ｓ Ｆターム(参考） 4F100 AA37A AB17B AB17C AB33B AB33C AD11A AG00A AH03 AK33 AK34 AK53 AK53A AL06 BA02 BA03 BA06 BA10B BA10C BA13 CA02A DH01A EJ82A EJ86A GB43 JG05 JL01 JL02 JL11 YY00A 4J002 CD001 CD051 CD061 DA016 FA006 FD016 GT00 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) C08L 63/00 C08L 63/00 C H05K 1/03 610 H05K 1/03 610L 610S F-term (reference) 4F100 AA37A AB17B AB17C AB33B AB33C AD11A AG00A AH03 AK33 AK34 AK53 AK53A AL06 BA02 BA03 BA06 BA10B BA10C BA13 CA02A DH01A EJ82A EJ86A GB43 JG05 JL01 JL02 JL11 YY00A 4J002 CD001 CD051 CD061 DA016 FA

Claims (1)

【特許請求の範囲】 【請求項１】 ガラス基材にエポキシ樹脂組成物を含
浸、乾燥させたプリプレグを複数枚積層し、その少なく
とも片面に銅箔を重ね合わせて一体に成形するガラスエ
ポキシ銅張積層板を製造するにあたり、上記エポキシ樹
脂組成物として、（Ａ）エポキシ樹脂、（Ｂ）硬化剤お
よび（Ｃ）フラーレンもしくはその同族体を必須成分と
し、（Ａ）成分と（Ｂ）成分の合計量［（Ａ）＋
（Ｂ）］に対して（Ｃ）フラーレンもしくはその同族体
を５〜５０重量％の割合で含有するエポキシ樹脂ワニス
を用いることを特徴とするガラスエポキシ銅張積層板。Claims: 1. A glass-epoxy-copper clad in which a plurality of prepregs impregnated with an epoxy resin composition on a glass substrate and dried are laminated, and a copper foil is laminated on at least one side thereof and integrally molded. In manufacturing the laminate, the epoxy resin composition contains (A) an epoxy resin, (B) a curing agent, and (C) fullerene or a homolog thereof as essential components, and a total of the components (A) and (B). Amount [(A) +
(C) A glass epoxy copper clad laminate characterized by using an epoxy resin varnish containing (C) fullerene or a homolog thereof in an amount of 5 to 50% by weight.
JP2001323311A 2001-10-22 2001-10-22 Glass epoxy copper-clad laminated plate Pending JP2003127274A (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
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Publication Number Publication Date
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Family

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Country Link
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005105152A (en) * 2003-09-30 2005-04-21 Toho Tenax Co Ltd Fullerene-containing prepreg
WO2007060929A1 (en) 2005-11-28 2007-05-31 Toray Industries, Inc. Biaxially oriented film laminated board, electrical insulation board and machine part

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005105152A (en) * 2003-09-30 2005-04-21 Toho Tenax Co Ltd Fullerene-containing prepreg
WO2007060929A1 (en) 2005-11-28 2007-05-31 Toray Industries, Inc. Biaxially oriented film laminated board, electrical insulation board and machine part

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