CN115181395B - Thermosetting resin composition and application thereof - Google Patents
Thermosetting resin composition and application thereof Download PDFInfo
- Publication number
- CN115181395B CN115181395B CN202210975494.XA CN202210975494A CN115181395B CN 115181395 B CN115181395 B CN 115181395B CN 202210975494 A CN202210975494 A CN 202210975494A CN 115181395 B CN115181395 B CN 115181395B
- Authority
- CN
- China
- Prior art keywords
- resin composition
- thermosetting resin
- epoxy resin
- parts
- combination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
Abstract
The invention relates to a thermosetting resin composition and application thereof, wherein the thermosetting resin composition comprises the following components in parts by weight: 100 parts of thermosetting resin, 30-150 parts of spherical talcum powder, 1-30 parts of curing agent and 0.01-5 parts of accelerator; the specific surface area of the spherical talcum powder is 16-22m 2 And/g. The resin composition has the characteristics of small viscosity, large interlayer adhesive force of the prepared metal-clad laminate, good consistency of plates and excellent punching processability.
Description
Technical Field
The invention relates to the technical field of copper-clad plates, in particular to a thermosetting resin composition and application thereof.
Background
The inorganic powder has the advantages of high thermal decomposition temperature and small size expansion and shrinkage at high temperature, and is widely applied to the production formula of the copper-clad laminated board.
CN102875982a discloses a halogen-free flame retardant thermoplastic engineering plastic composition prepared by in-situ modification and a preparation method thereof. The disclosed composition mainly uses polyester or polyamide as a base material, and adds a reactive halogen-free flame retardant phosphaphenanthrene compound to achieve the purpose of halogen-free flame retardance. The preparation method is mainly characterized in that the reactive flame retardant reacts with the molecular chain end groups or other functional groups of the thermoplastic polymer in the melt blending process to improve the dispersibility and compatibility between the flame retardant and the material, reduce the consumption of the flame retardant, and ensure that the material has excellent flame retardant property and high heat resistance and does not release a large amount of toxic gas and smoke in the combustion process.
CN112898763a discloses a thermosetting resin composition with low dielectric properties, and the raw materials for preparing the thermosetting resin composition comprise the following components in parts by weight: 70-120 parts of vinyl-terminated polyphenyl ether resin, 15-30 parts of petroleum resin, 35-55 parts of bismaleimide resin, 10-20 parts of polystyrene-butadiene resin, 20-50 parts of triallyl triisocyanate, 1-7 parts of catalyst, 5-20 parts of flame retardant, 100-150 parts of spherical silicon dioxide, 0.01-0.5 part of silane coupling agent, 100-120 parts of butanone and 100-120 parts of toluene. The raw materials disclosed by the method comprise vinyl-terminated polyphenyl ether resin, petroleum resin, bismaleimide resin, polystyrene-butadiene resin, triallyl triisocyanate, a catalyst, a flame retardant, spherical silicon dioxide, a silane coupling agent, butanone and toluene, and the components are matched for use, so that the dielectric property of the thermosetting resin composition can be obviously reduced, and the preparation requirements of the copper-clad plate are met.
In the prior art, the inorganic filler has a plurality of defects when applied to the copper-clad plate formula. First, many inorganic fillers cause a rapid increase in the viscosity of the resin, filler and solvent mixture system, typically by adding adjuvants or large amounts of solvents to the system; secondly, the copper-clad laminate is formed by hot pressing prepregs with a multi-layer laminated structure, the finished product has more interlayer bonding interfaces, and a plurality of inorganic fillers can obviously reduce the bonding force of the interlayer interfaces, so that the quality of the copper-clad laminate is reduced, and the addition amount is limited; finally, the copper-clad laminate is easy to delaminate between layers after being processed by punching or drilling processes, so that the circuit board is scrapped.
In view of the above, it is important to develop a resin composition having a low viscosity, which further forms a metal clad laminate having a high interlayer adhesion and excellent punching workability.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a resin composition and application thereof, wherein the resin composition has small viscosity, and the prepared metal-clad laminate has the characteristics of large interlayer adhesive force, good consistency of plates and excellent punching processability.
To achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides a thermosetting resin composition, which comprises the following components in parts by weight:
the specific surface area of the spherical talcum powder is 16-22m 2 /g, e.g. 16.5m 2 /g、17m 2 /g、14.5m 2 /g、18m 2 /g、18.5m 2 /g、19m 2 /g、19.5m 2 /g、20m 2 /g、20.5m 2 /g、21m 2 /g、21.5m 2 /g, etc.
In the invention, the thermosetting resin composition is added with the spherical talcum powder with specific surface area, so that the formed resin composition has small viscosity, good fluidity and better permeability to reinforcing materials compared with other fillers; the metal-clad laminate prepared by the method has the characteristics of large interlayer adhesive force, good consistency of plates and excellent punching processability; compared with lamellar talc powder, the spherical talcum powder can solve the defects of high glue viscosity, small interlayer adhesive force, poor punching processing and the like caused by the conventional lamellar talcum powder.
In the invention, based on 100 parts by weight of the thermosetting resin,
the weight parts of the spherical talcum powder are 30-150 parts, such as 40 parts, 50 parts, 60 parts, 70 parts, 80 parts, 90 parts, 100 parts, 110 parts, 120 parts, 130 parts, 140 parts and the like.
The curing agent is 1-30 parts by weight, for example 5 parts, 10 parts, 15 parts, 20 parts, 25 parts, etc.
The accelerator is 0.01-5 parts by weight, for example 0.1 part, 0.5 part, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, etc.
Preferably, the D10 particle size of the spherical talc is 0.06-0.25 μm, e.g., 0.08 μm, 0.10 μm, 0.12 μm, 0.15 μm, 0.18 μm, 0.20 μm, 0.22 μm, 0.24 μm, etc.
Preferably, the D100 particle size of the spherical talc is 5.0-20 μm, e.g., 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 14 μm, 16 μm, 18 μm, etc.
In the present invention, D10 and D100 refer to respectively: the particle size of the powder with the mass fraction of 10% and 100% is below the corresponding measured value, and the testing method is a laser particle size analyzer.
In the invention, the particle size distribution of the spherical talcum powder is in a specific range, which is more beneficial to improving the fluidity of the resin composition and has better permeability to reinforcing materials; while ensuring the consistency of the further formed metal clad laminate.
Preferably, the thermosetting resin comprises any one or a combination of at least two of epoxy resin, phenolic resin, cyanate ester, reactive ester, polyphenylene ether resin, maleimide resin, silicone resin, polybenzoxazole resin, polyimide resin, hydrocarbon resin or acrylate resin, wherein typical but non-limiting combinations include: combinations of epoxy resin and phenolic resin, combinations of cyanate ester, active ester and polyphenylene ether resin, combinations of silicone resin, polybenzoxazole resin, polyimide resin, hydrocarbon resin and acrylate resin, and the like, and combinations of epoxy resin and phenolic resin are further preferred.
Preferably, the epoxy resin comprises one or a combination of at least two of bisphenol a type epoxy resin, bisphenol F type epoxy resin, phosphorous containing epoxy resin, isocyanate modified epoxy resin, phenolic epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene containing epoxy resin, or cycloaliphatic epoxy resin, wherein typical but non-limiting combinations include: bisphenol a type epoxy resin and bisphenol F type epoxy resin, phosphorus containing epoxy resin and isocyanate modified epoxy resin, phosphorus containing epoxy resin, isocyanate modified epoxy resin, phenolic epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene containing epoxy resin and alicyclic epoxy resin, and the like.
Preferably, the phenolic resin comprises one or a combination of at least two of bisphenol a type phenolic resin, phenol type phenolic resin, biphenyl type phenolic resin, dicyclopentadiene type phenolic resin, or naphthol containing aldehyde resin, wherein typical but non-limiting combinations include: a combination of bisphenol a type phenol resin and phenol type phenol resin, a combination of phenol type phenol resin, biphenyl type phenol resin and dicyclopentadiene type phenol resin, a combination of phenol type phenol resin, biphenyl type phenol resin, dicyclopentadiene type phenol resin and naphthol-containing aldehyde resin, and the like.
Preferably, the curing agent comprises any one or a combination of at least two of an amine curing agent, an anhydride curing agent, a phenolic resin curing agent, an isocyanate curing agent, or a polythiol curing agent, wherein typical but non-limiting combinations include: the combination of an amine-based curing agent and an acid anhydride-based curing agent, the combination of a phenolic resin-based curing agent, an isocyanate-based curing agent and a polythiol-based curing agent, the combination of an amine-based curing agent, an acid anhydride-based curing agent, a phenolic resin-based curing agent, an isocyanate-based curing agent and a polythiol-based curing agent, and the like, and the amine-based curing agent and/or the phenolic resin-based curing agent are further preferable.
Preferably, the accelerator comprises any one or a combination of at least two of imidazole, boron trifluoride amine complex, 2-methylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole, triphenylphosphine or 4-dimethylaminopyridine, wherein typical but non-limiting combinations include: combinations of imidazole and boron trifluoride amine complexes, combinations of 2-methylimidazole, 2-phenylimidazole and 2-ethyl-4-methylimidazole, combinations of 2-methylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole, triphenylphosphine and 4-dimethylaminopyridine, and the like.
Preferably, the thermosetting resin composition further comprises other fillers.
Preferably, the other filler comprises an organic filler and/or an inorganic filler.
Preferably, the morphology of the other filler is any one or a combination of at least two of spherical, irregular granular, rod-like, or lamellar, wherein typical but non-limiting combinations include: spherical and irregular granular combinations, irregular granular, rod-like and lamellar combinations, spherical, irregular granular, rod-like and lamellar combinations, etc.
Preferably, the organic filler comprises any one or a combination of at least two of polytetrafluoroethylene, polyphenylene sulfide, polyetherimide, melamine cyanurate, polyphenylene oxide, or polyethersulfone, wherein typical but non-limiting combinations include: combinations of polytetrafluoroethylene and polyphenylene sulfide, combinations of polyetherimide and melamine cyanurate, and the like.
Preferably, the inorganic filler comprises any one or a combination of at least two of silica, glass frit, aluminum nitride, boron nitride, silicon carbide, silicon aluminum carbide, aluminum hydroxide, magnesium hydroxide, titanium dioxide, strontium titanate, barium titanate, zinc oxide, zirconium oxide, aluminum oxide, beryllium oxide, magnesium oxide, barium sulfate, talc, clay, calcium silicate, wollastonite, calcium carbonate, ammonium polyphosphate, aluminum hypophosphite, or mica, wherein typical but non-limiting combinations include: a combination of crystalline silica and fused silica, a combination of spherical silica, angular silica, hollow silica and glass frit, a combination of boron nitride, silicon carbide, silicon aluminum carbide, aluminum hydroxide, magnesium hydroxide, titanium dioxide and strontium titanate, a combination of barium sulfate, talc, clay, calcium silicate, wollastonite, calcium carbonate and mica, and the like.
The silica in the present invention may be selected from crystalline silica or fused silica according to the preparation process, and may be selected from spherical silica, angular silica or hollow silica according to the morphology.
Preferably, the other filler is present in an amount of 0 to 100 parts by weight and is not equal to, for example, 5 parts, 10 parts, 15 parts, 20 parts, 30 parts, 40 parts, 50 parts, 60 parts, 70 parts, 80 parts, 90 parts, etc.
Preferably, the thermosetting resin composition further comprises any one or a combination of at least two of a flame retardant, a cross-linking agent or an antioxidant, wherein typical but non-limiting combinations include: a combination of a flame retardant and a crosslinking agent, a combination of a crosslinking agent and an antioxidant, a combination of a flame retardant, a crosslinking agent and an antioxidant, and the like.
In a second aspect, the present invention provides a glue solution, wherein the glue solution comprises the resin composition according to the first aspect and a solvent;
the solids content of the dope is 60% -80%, such as 62%, 64%, 66%, 68%, 70%, 72%, 74%, 76%, 78%, etc.
In the invention, the spherical talcum powder is arranged, the viscosity of the resin composition is smaller, the solid content is high, and the viscosity of the resin composition can meet the punching processing requirement without adding a large amount of solvent into the system.
In a third aspect, the present invention provides a prepreg comprising a reinforcing material and the resin composition according to the first aspect attached thereto after drying by impregnation.
In a fourth aspect, the present invention provides a metal foil-clad laminate comprising at least one (e.g. 2, 5, 10, 15, 20, etc.) laminated prepreg according to the second aspect and a metal foil coated on one or both sides of the laminated prepreg.
In a fifth aspect, the present invention provides a printed circuit board comprising at least one (e.g., 2, 5, 10, 15, 20, etc.) metal foil-clad laminate according to the fourth aspect.
Compared with the prior art, the invention has the following beneficial effects:
(1) The resin composition has small viscosity and good permeability to reinforcing materials, and the further prepared copper clad laminate has large interlayer peeling strength and small punching halo.
(2) The viscosity of the resin composition is between 36 and 72Pa.s, the penetrating effect on reinforcing materials is excellent, the interlayer peeling strength of the prepared copper clad laminate is more than 1.09N/mm, and the size of a punched halo is within 0.36 mm.
Detailed Description
The technical scheme of the invention is further described by the following specific embodiments. It will be apparent to those skilled in the art that the examples are merely to aid in understanding the invention and are not to be construed as a specific limitation thereof.
The information on the partial raw materials of each example and comparative example of the present invention is as follows:
a1: thermosetting resin: brominated bisphenol a epoxy resin: purchased from Shandong Shengquan group and having the brand SQEB-452A80;
a2: thermosetting resin: phenolic epoxy resin: purchased from Shandong Shengquan group and having the brand SQEB-358M80;
a3: thermosetting resin: phosphorus-containing epoxy resin: purchased from Shandong Shengquan group and having the brand SQEB-358K75;
b: curing agent: dicyandiamide;
c: and (3) an accelerator: 2-methylimidazole;
d1: spherical talcum powder: specific surface area of 16m 2 And/g, particle size distribution is: d10 is 0.25 μm, D100 is 20 μm, purchased from Jinsheng New Material Co., ltd, and the brand is MD-1;
d2: spherical talcum powder: specific surface area of 18m 2 And/g, particle size distribution is: d10 is 0.16 μm, D100 is 12.5 μm, purchased from Jinsheng New Material Co., ltd, and the brand is MD-2;
d3: spherical talcum powder: specific surface area of 22m 2 And/g, particle size distribution is: d10 is 0.06 mu m, D100 is 5 mu m, purchased from Jinsheng New Material Co., ltd, and the brand is MD-3;
d4: spherical talcum powder: specific surface areaThe product is 17.2m 2 And/g, particle size distribution is: d10 is 0.03 mu m, D100 is 25.8 mu m, and the product is purchased from Jinsheng New Material Co., ltd, and the brand is MD-4;
d5: spherical talcum powder: specific surface area of 14.3m 2 And/g, particle size distribution is: d10 is 0.14 μm, D100 is 19.20 μm, purchased from Jinsheng New Material Co., ltd, and the brand is MD-5;
d6: spherical talcum powder: specific surface area of 22.7m 2 And/g, particle size distribution is: d10 is 0.08 mu m, D100 is 18.0 mu m, purchased from Jinsheng New Material Co., ltd, and the brand is MD-6;
e: other fillers
E1: lamellar talc powder: the particle size distribution is as follows: d10 is 0.72 μm and D100 is 18.4 μm; e2: aluminum hydroxide: the particle size distribution is as follows: d10 is 1.22 μm and D100 is 25.6 μm;
e3: silicon micropowder: the particle size distribution is as follows: d10 is 1.14 μm and D100 is 19.7 μm;
e4: spherical silica: the particle size distribution is as follows: d10 was 0.84 μm and D100 was 20.6. Mu.m.
Examples 1 to 7 and comparative examples 1 to 4
The formulation compositions of the thermosetting resin compositions of examples 1 to 7 and comparative examples 1 to 4 are shown in tables 1 to 2.
TABLE 1
TABLE 2
Note that: the dimensionless components in the table are all in parts by weight.
The thermosetting resin compositions described in examples 1 to 7 and comparative examples 1 to 4 were prepared as copper clad laminates prepared by the following method: the glass fiber cloth reinforced material is soaked in the resin composition, and is subjected to drying, lamination and copper foil coating, and then hot pressing in a vacuum state.
Mixing the thermosetting resin composition with a solvent to prepare a glue solution with the solid content of 70%, soaking the glass fiber cloth reinforcing material in the resin composition, drying, laminating, and hot-pressing in a vacuum state to obtain the copper foil clad laminate.
Performance testing
1. The following tests were carried out on the glue solutions having a solids content of 70% prepared from the thermosetting resin compositions described in examples 1 to 7 and comparative examples 1 to 4:
(1) Viscosity: 4# Cai Enbei.
(2) Soaking effect: and (5) observing the degree of the apparent patterns of the plate after hot pressing.
2. The following test was conducted on the copper clad laminates prepared from the glue solutions having a solid content of 70% formulated with the thermosetting resin compositions described in examples 1 to 7 and comparative examples 1 to 4:
(1) Interlayer peel strength: according to IPC-TM-650 standard;
(2) Punching halo size: the depth of the lesion was measured with a light microscope under magnification.
The test results are summarized in table 3.
TABLE 3 Table 3
As can be seen from the data in Table 3, the resin composition of the present invention has a viscosity of 36 to 72Pa.s, an excellent penetration effect into a reinforcing material, and the copper-clad laminate thus produced has an interlayer peel strength of 1.09N/mm or more and a punched halo size of 0.36mm or less. The resin composition has small viscosity and good permeability to reinforcing materials, and the further prepared copper clad laminate has large interlayer peeling strength and small punching halo.
As can be seen from an analysis of comparative example 1 and example 1, comparative example 1 has inferior properties to example 1, and in the present invention, the resin composition formed of spherical talc has better properties than lamellar talc.
Analysis of comparative example 2 and example 1 shows that comparative example 2 does not perform as well as example 1, and that the resin composition formed from spherical talc exhibits better properties than other spherical fillers in the present invention.
As can be seen from the analysis of comparative examples 3-4 and example 1, comparative examples 3-4 are inferior to example 1 in performance, demonstrating that the specific surface area of the spherical talc is 16-22m 2 The resin composition formed in the range of/g is more excellent in performance.
Analysis of example 2 and example 1 shows that the performance of example 2 is somewhat degraded, but still at a relatively high level, demonstrating that the invention can be used with other fillers optionally, but that the resin composition formed from the spherical talc is better.
Analysis of example 4 and example 1 shows that example 4 does not perform as well as example 1, and that in the present invention, the particle size distribution of the spherical talc is: d10 The resin composition formed by the method has better performance, wherein the thickness of the resin composition is 0.06-0.25 mu m, and the thickness of the resin composition is 5.0-20 mu m.
The present invention is described in detail by the above examples, but the present invention is not limited to the above detailed methods, i.e., it does not mean that the present invention must be practiced depending on the above detailed methods. It should be apparent to those skilled in the art that any modification of the present invention, equivalent substitution of raw materials for the product of the present invention, addition of auxiliary components, selection of specific modes, etc., falls within the scope of the present invention and the scope of disclosure.
Claims (14)
1. The thermosetting resin composition is characterized by comprising the following components in parts by weight:
the specific surface area of the spherical talcum powder is 16-22m 2 /g；
The particle diameter D10 of the spherical talcum powder is 0.06-0.25 mu m, and the particle diameter D100 is 5.0-20 mu m;
the thermosetting resin is epoxy resin;
the curing agent is an amine curing agent.
2. The thermosetting resin composition of claim 1, wherein the epoxy resin comprises one or a combination of at least two of bisphenol a type epoxy resin, bisphenol F type epoxy resin, phosphorous containing epoxy resin, isocyanate modified epoxy resin, phenolic epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene containing epoxy resin, or cycloaliphatic epoxy resin.
3. The thermosetting resin composition of claim 1, wherein the accelerator comprises any one or a combination of at least two of imidazole, boron trifluoride amine complex, 2-methylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole, triphenylphosphine, or 4-dimethylaminopyridine.
4. The thermosetting resin composition of claim 1, wherein the thermosetting resin composition further comprises other fillers.
5. The thermosetting resin composition according to claim 4, wherein the other filler comprises an organic filler and/or an inorganic filler.
6. The thermosetting resin composition according to claim 4, wherein the morphology of the other filler is any one or a combination of at least two of spherical, irregular granular, rod-like or lamellar.
7. The thermosetting resin composition of claim 5, wherein the organic filler comprises any one or a combination of at least two of polytetrafluoroethylene, polyphenylene sulfide, polyetherimide, melamine cyanurate, polyphenylene oxide, or polyethersulfone.
8. The thermosetting resin composition of claim 5, wherein the inorganic filler comprises any one or a combination of at least two of silica, glass frit, aluminum nitride, boron nitride, silicon carbide, silicon aluminum carbide, aluminum hydroxide, magnesium hydroxide, titanium dioxide, strontium titanate, barium titanate, zinc oxide, zirconium oxide, aluminum oxide, beryllium oxide, magnesium oxide, barium sulfate, talc, clay, calcium silicate, wollastonite, calcium carbonate, ammonium polyphosphate, aluminum hypophosphite, or mica.
9. The thermosetting resin composition according to claim 4, wherein the other filler is 0 to 100 parts by weight and is not equal to 0.
10. The thermosetting resin composition of claim 1, further comprising any one or a combination of at least two of a flame retardant, a cross-linking agent, or an antioxidant.
11. A dope comprising the resin composition according to any one of claims 1 to 10 and a solvent;
the solid content of the glue solution is 60% -80%.
12. A prepreg comprising a reinforcing material and the resin composition according to any one of claims 1 to 10 attached thereto after drying by impregnation.
13. A metal foil-clad laminate comprising at least one laminated prepreg according to claim 12 and metal foil coated on one or both sides of the laminated prepreg.
14. A printed circuit board comprising at least one metal foil-clad laminate of claim 13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210975494.XA CN115181395B (en) | 2022-08-15 | 2022-08-15 | Thermosetting resin composition and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210975494.XA CN115181395B (en) | 2022-08-15 | 2022-08-15 | Thermosetting resin composition and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115181395A CN115181395A (en) | 2022-10-14 |
| CN115181395B true CN115181395B (en) | 2023-10-10 |
Family
ID=83522677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210975494.XA Active CN115181395B (en) | 2022-08-15 | 2022-08-15 | Thermosetting resin composition and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115181395B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7327879B1 (en) * | 2023-01-31 | 2023-08-16 | 大和化学工業株式会社 | Flame retardant composition for thermosetting resin and fiber-reinforced thermosetting resin |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1207485A (en) * | 1982-08-13 | 1986-07-08 | Susumu Iwato | Chip-resistant filled polyester and aminoplast intermediate coating |
| JPH0881584A (en) * | 1994-09-12 | 1996-03-26 | Mizusawa Ind Chem Ltd | Compounding additive composition for resin |
| JPH0959457A (en) * | 1995-08-18 | 1997-03-04 | Mitsui Toatsu Chem Inc | Propylene-ethylene random copolymer composition for biaxially oriented film and biaxially oriented film produced therefrom |
| JP2000034393A (en) * | 1998-05-15 | 2000-02-02 | Shin Etsu Chem Co Ltd | Epoxy resin composition for sealing semiconductor and semiconductor apparatus |
| JP2003160639A (en) * | 2001-11-27 | 2003-06-03 | Matsushita Electric Works Ltd | Epoxy resin composition and semiconductor device |
| JP2009298981A (en) * | 2008-06-17 | 2009-12-24 | Sumitomo Bakelite Co Ltd | Resin composition, prepreg and printed wiring board using the same |
| JP2010100803A (en) * | 2008-09-24 | 2010-05-06 | Sekisui Chem Co Ltd | Epoxy resin composition, sheet-like form, prepreg, cured product, laminated board, and multilayered laminated board |
| JP2011136508A (en) * | 2009-12-28 | 2011-07-14 | Sony Corp | Thermal transfer sheet |
| CN102753481A (en) * | 2010-02-09 | 2012-10-24 | 东亚合成株式会社 | Spherical hydrotalcite compound and resin composition for electronic component encapsulation |
| CN104558688A (en) * | 2014-12-26 | 2015-04-29 | 广东生益科技股份有限公司 | Filler composition and application thereof |
| CN106134296A (en) * | 2014-04-08 | 2016-11-16 | 松下知识产权经营株式会社 | Resin composition for printed circuit board, prepreg, metal-coated laminated board, printed circuit board (PCB) |
| CN109135319A (en) * | 2018-06-25 | 2019-01-04 | 广东格瑞新材料股份有限公司 | A kind of high intensity LCP composite material and preparation method |
| CN109575522A (en) * | 2018-12-04 | 2019-04-05 | 中科院广州化学有限公司南雄材料生产基地 | A kind of epoxy resin is composite porous and its preparation method and application |
| CN112961571A (en) * | 2021-02-08 | 2021-06-15 | 浙江工业大学 | Epoxy zinc-rich anticorrosive paint containing graphene oxide/black talc composite material and preparation method thereof |
| CN114181496A (en) * | 2021-12-25 | 2022-03-15 | 广东盈骅新材料科技有限公司 | Epoxy resin composite material, prepreg and laminated board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7283274B2 (en) * | 2019-07-02 | 2023-05-30 | 味の素株式会社 | resin composition |
-
2022
- 2022-08-15 CN CN202210975494.XA patent/CN115181395B/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1207485A (en) * | 1982-08-13 | 1986-07-08 | Susumu Iwato | Chip-resistant filled polyester and aminoplast intermediate coating |
| JPH0881584A (en) * | 1994-09-12 | 1996-03-26 | Mizusawa Ind Chem Ltd | Compounding additive composition for resin |
| JPH0959457A (en) * | 1995-08-18 | 1997-03-04 | Mitsui Toatsu Chem Inc | Propylene-ethylene random copolymer composition for biaxially oriented film and biaxially oriented film produced therefrom |
| JP2000034393A (en) * | 1998-05-15 | 2000-02-02 | Shin Etsu Chem Co Ltd | Epoxy resin composition for sealing semiconductor and semiconductor apparatus |
| JP2003160639A (en) * | 2001-11-27 | 2003-06-03 | Matsushita Electric Works Ltd | Epoxy resin composition and semiconductor device |
| JP2009298981A (en) * | 2008-06-17 | 2009-12-24 | Sumitomo Bakelite Co Ltd | Resin composition, prepreg and printed wiring board using the same |
| JP2010100803A (en) * | 2008-09-24 | 2010-05-06 | Sekisui Chem Co Ltd | Epoxy resin composition, sheet-like form, prepreg, cured product, laminated board, and multilayered laminated board |
| JP2011136508A (en) * | 2009-12-28 | 2011-07-14 | Sony Corp | Thermal transfer sheet |
| CN102753481A (en) * | 2010-02-09 | 2012-10-24 | 东亚合成株式会社 | Spherical hydrotalcite compound and resin composition for electronic component encapsulation |
| CN106134296A (en) * | 2014-04-08 | 2016-11-16 | 松下知识产权经营株式会社 | Resin composition for printed circuit board, prepreg, metal-coated laminated board, printed circuit board (PCB) |
| CN104558688A (en) * | 2014-12-26 | 2015-04-29 | 广东生益科技股份有限公司 | Filler composition and application thereof |
| CN109135319A (en) * | 2018-06-25 | 2019-01-04 | 广东格瑞新材料股份有限公司 | A kind of high intensity LCP composite material and preparation method |
| CN109575522A (en) * | 2018-12-04 | 2019-04-05 | 中科院广州化学有限公司南雄材料生产基地 | A kind of epoxy resin is composite porous and its preparation method and application |
| CN112961571A (en) * | 2021-02-08 | 2021-06-15 | 浙江工业大学 | Epoxy zinc-rich anticorrosive paint containing graphene oxide/black talc composite material and preparation method thereof |
| CN114181496A (en) * | 2021-12-25 | 2022-03-15 | 广东盈骅新材料科技有限公司 | Epoxy resin composite material, prepreg and laminated board |
Non-Patent Citations (1)
| Title |
|---|
| Zhang, YC and Jia, CC.High-performance cyanate ester composites with plasma-synthesized MgSiO3-SiO2-hBN powders for thermally conductive and dielectric properties.《CERAMICS INTERNATIONAL 》.2019,第45卷(第5期),全文. * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115181395A (en) | 2022-10-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3053963B1 (en) | Halogen-free resin composition and uses thereof | |
| EP2770025B1 (en) | Halogen-free low-dielectric resin composition, and prepreg and copper foil laminate made by using same | |
| US8581107B2 (en) | Halogen-free flame-retardant epoxy resin composition, and prepreg and printed circuit board using the same | |
| WO2015127860A1 (en) | Halogen-free flame retardant type resin composition | |
| CN106810820B (en) | Thermosetting alkyl polyol glycidyl ether resin composition and application thereof | |
| KR20130125383A (en) | Halogen-free resin composition and method for fabricating halogen-free copper clad laminate using the same | |
| KR101730283B1 (en) | Thermosetting resin composition and use thereof | |
| CN108676533B (en) | Resin composition and resin-coated copper foil produced therefrom | |
| CN109851997B (en) | Thermosetting resin composition, and prepreg, laminated board and metal foil-clad laminated board using same | |
| WO2016119356A1 (en) | Halogen-free resin composition, and prepreg and laminated board manufactured therefrom | |
| EP3412722B1 (en) | Halogen-free thermosetting resin composition, prepreg containing same, laminate, and printed circuit board | |
| KR20100134313A (en) | Resin composition for printed circuit board and printed circuit board using the same | |
| CN111635616A (en) | Halogen-free flame-retardant thermosetting resin composition, prepreg for printed circuit, and metal-clad laminate | |
| CN114621559A (en) | Thermosetting resin composition, and prepreg, laminated board and high-frequency circuit substrate comprising thermosetting resin composition | |
| KR101754464B1 (en) | Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the same | |
| CN115181395B (en) | Thermosetting resin composition and application thereof | |
| CN109651763B (en) | Thermosetting resin composition, and prepreg, laminated board and metal foil-clad laminated board using same | |
| JP5165639B2 (en) | Polyphenylene ether resin composition, prepreg, metal-clad laminate, and printed wiring board | |
| WO2018120472A1 (en) | Halogen-free flame-retardant resin composition, and prepreg and copper clad laminate prepared from same | |
| KR101641824B1 (en) | Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the same | |
| US20110284276A1 (en) | Epoxy resin composition, and prepreg and printed circuit board using the same | |
| CN109608828B (en) | Thermosetting resin composition, and prepreg, laminated board and metal foil-clad laminated board using same | |
| EP3156451B1 (en) | Halogen-free resin composition, and prepreg and laminated board for printed circuit using same | |
| CN108192281B (en) | Halogen-free thermosetting resin composition, and prepreg, laminated board, metal foil-clad laminated board and printed circuit board using same | |
| CN111605269A (en) | FR4 copper-clad plate with high relative tracking index and high heat resistance and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |