JP2003126748A - Method and apparatus for applying viscous material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a viscous material applying technique by which a viscous material is surely applied on a work. SOLUTION: The viscous material is stored in a supply vessel 10. The work W is placed flatly on a flattening stage 30. After the inside of the supply vessel 10 is pressurized at an initial pressure (a 1st pressure) to discharge the viscous material 5 from through holes 12, the pressure of the inside of the supply vessel 10 is reduced to a transfer pressure (a 2nd pressure) of lower pressure than the 1st pressure to lighten the flexure of a penetrating plate 11. The viscous material 5 is transferred on the work W by making the flatten stage 30 close to the penetrating plate 11 to bring the discharged viscous material into contact with the work W, then moving the flatten stage 30 downward to make the work W away from the penetrating plate 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a viscous substance applying method and apparatus for applying a viscous substance such as a solder paste or an adhesive to a work such as a liquid crystal glass substrate, a semiconductor substrate or a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, a printing method using a mask has been adopted as one of the methods for applying a viscous substance such as solder paste to a work such as a semiconductor substrate or a printed circuit board. In this method, a viscous substance is supplied to the upper portion of a mask having a through hole having a predetermined pattern, the viscous substance is pushed out from the through hole, and the viscous substance is applied to the work by bringing the mask and the work close to each other. It is a thing. The printing method using such a mask has an advantage that a viscous substance having a considerable thickness can be collectively applied to a work in a predetermined pattern.

As a method of extruding the viscous substance from the above-mentioned through hole, there is a method of pressurizing the viscous substance as proposed in, for example, Japanese Patent Laid-Open No. 9-29163, in addition to the conventional method using a squeegee. . If the viscous substance is pressed and pushed out from the through hole, the amount of the viscous substance to be wasted is reduced as compared with the case of using the squeegee, and the yield of the viscous substance can be improved.

[0004]

However, conventionally, when the viscous substance is pressurized, the mask itself bends due to the pressure. In order to suppress the bending of the mask, it is sufficient to increase the thickness of the mask itself, but if the thickness of the mask is increased, it becomes difficult to push out the viscous substance from the through hole. In particular, when solder bump processing is performed on the chip electrodes of the semiconductor substrate for flip chip bonding, the pattern of the through holes in the mask is so fine that if the mask is thickened, it will be impossible to extrude viscous substances. Therefore, the thickness of the mask must be reduced. Therefore, the mask may be largely bent when the viscous substance is pressed.

If the mask bends when the viscous substance is applied to the work, the application position shifts depending on the degree of the bend, or if the degree of the bend is large, the application in the vicinity of the center of the mask is possible. Even at the peripheral portion of the mask, there was even a phenomenon that viscous substances did not adhere to the work.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a viscous substance application technique capable of reliably applying a viscous substance to a work.

[0007]

In order to solve the above-mentioned problems, the invention of claim 1 is a viscous substance applying method for applying a viscous substance to a work, wherein the supply container is provided with a through plate having a through hole of a predetermined shape. A storing step of storing a viscous substance, a cueing step of pressurizing the inside of the supply container with a first pressure to cue the viscous substance from the through hole, and a cueing step of the viscous substance from the through hole A contact step of bringing the penetrating plate and the work into close proximity to each other to bring the cueed viscous substance into contact with the work, and transferring the cueed viscous substance by leaving the work in the work. And a transfer step.

Further, in the invention of claim 2, in the viscous substance coating method according to the invention of claim 1, the inside of the supply container is more than the first pressure between the cueing step and the contacting step. A depressurizing step of bringing the low pressure to the second pressure is provided.

According to a third aspect of the invention, in the viscous substance coating method according to the second aspect of the invention, the second pressure is lower than the atmospheric pressure around the supply container.

According to a fourth aspect of the invention, in the viscous substance coating method according to any one of the first to third aspects of the invention, in the transferring step, the through plate and the work are relatively separated from each other. The viscous substance that has been cued up is left on the work.

According to a fifth aspect of the present invention, in the viscous substance applying method according to any one of the first to fourth aspects of the present invention, the cueing detection is performed to detect that the viscous substance is cueed from the through hole. The process is further equipped.

According to a sixth aspect of the present invention, there is provided a viscous substance applying device for applying a viscous substance to a work, the supply container having a through plate having a through hole having a predetermined shape, for storing the viscous substance, and the supply container. A stage for mounting a work on one side, a moving unit for moving the stage relatively close to and away from the through plate, and the inside of the supply container in which a viscous substance is stored are set to a first pressure. Pressure adjusting means for pressurizing the viscous substance from the through-hole to press the viscous substance through the through hole, and the moving means relatively brings the through plate and the workpiece into close contact with each other to bring the viscous substance that has been ejected into contact with the workpiece. And a transfer means for transferring the cueed viscous substance by allowing it to remain on the work.

Further, in a seventh aspect of the invention, in the viscous substance coating apparatus according to the sixth aspect of the invention, the pressure adjusting means pressurizes the inside of the supply container with the first pressure to remove the pressure from the through hole. After the viscous substance is squeezed out, the inside of the supply container is further made to have a second pressure lower than the first pressure.

According to the invention of claim 8, in the viscous substance coating device according to the invention of claim 7, the second pressure is set lower than the atmospheric pressure around the supply container.

According to a ninth aspect of the invention, in the viscous substance coating device according to any one of the sixth to eighth aspects, the transfer means relatively separates the penetrating plate from the work. The viscous substance that has been exposed is left on the work.

Further, the invention of claim 10 is the viscous substance coating device according to any one of claims 6 to 9, further comprising cue detection means for detecting that the viscous substance is cueed from the through hole. I have it.

In this specification, the work means a semiconductor substrate, a glass substrate for a liquid crystal display device, a printed circuit board and the like.

The viscous substance means a solder paste, a conductive paste, an adhesive or the like.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings.

<1. Structure of viscous substance coating device>
It is a figure which shows the principal part structure of the viscous substance coating device 1 which concerns on this invention. The viscous substance coating device 1 is a device for coating the viscous substance 5 on the work W. In the present embodiment, SnAg paste (tin-silver-based lead-free solder paste) is applied to the semiconductor substrate.
Is a device for applying an electrode (solder bump) on a chip in a semiconductor substrate.

The viscous substance coating device 1 mainly comprises a supply container 10 for storing the viscous substance 5, a pressure adjusting mechanism 20 for adjusting the atmospheric pressure in the supply container 10, a flattening stage 30 for mounting a work W, and a flattening stage. A stage elevating unit 40 for elevating the conversion stage 30, a cue detector 50, and a controller 60 for controlling the entire apparatus are provided.

A through plate 11 is provided at the bottom of the supply container 10. The through plate 11 is provided with a through hole 12 having a predetermined shape. The shape of the through hole 12 can be various shapes depending on the application pattern of the viscous substance 5,
For example, it may be a round hole or a slit. Further, the number of through holes 12 provided in the through plate 11 may be arbitrary. The pattern of the viscous substance 5 applied to the work W by the viscous substance applying device 1 is defined by the shape of the through hole 12, and in other words, the through plate 11 functions as a mask for applying the viscous substance.

A viscous substance 5 (here, SnAg solder paste) can be supplied to the inside of the supply container 10 from a viscous substance supply mechanism (not shown). The supplied viscous substance 5 is stored inside the supply container 10. here,
The through hole 11 is provided in the through plate 11 at the bottom of the supply container 10, and the wall surface of the through hole 12 and the through hole 1
Due to the relationship with the surface tension of the gas-liquid interface of the viscous substance 5 located at position 2, the viscous substance 5 does not leak from the through hole 12 only by supplying the viscous substance 5 inside the supply container 10.
The viscous substance 5 is reliably stored in the supply container 10. Then, by storing the viscous substance 5, the supply container 10
The space 8 inside and above the viscous substance 5 is a closed space. The material of the supply container 10 is preferably one that does not react with the viscous substance 5 and has good peelability from the viscous substance 5.

The pressure adjusting mechanism 20 is a pressure regulator 2
2, a decompression regulator 21, and a vent 25. The ventilation port 25 is provided in the supply container 10 so as to communicate with the space 8. The ventilation port 25 and the nitrogen gas supply source 24 are connected to each other by a pipe, and the pressure regulator 22 is provided in the middle of the route of the pipe. Further, the ventilation port 25 and the exhaust pump 23 are also connected by a pipe, and the decompression regulator 21 is provided in the middle of the route of the pipe. The pressure regulator 22 and the decompression regulator 21 are electrically connected to the controller 60.

The nitrogen gas supply source 24 continues to supply nitrogen gas at a predetermined pressure. The pressure regulator 22 is
For example, the controller 60 is provided with a needle valve.
Open and close the needle valve according to the control signal from
The supply flow rate of the nitrogen gas supplied from the nitrogen gas supply source 24 into the supply container 10 via the pipe and the vent hole 25 is adjusted. Thereby, the pressure regulator 22 adjusts the pressure (atmospheric pressure) in the supply container 10 (space 8). When the pressure regulator 22 is completely closed, the supply of nitrogen gas to the supply container 10 is stopped.

The exhaust pump 23 can exhaust the atmosphere in the supply container 10 (space 8). The decompression regulator 21 includes, for example, a needle valve, and opens and closes the needle valve according to a control signal from the controller 60. When the decompression regulator 21 is opened while operating the exhaust pump 23, the atmosphere in the supply container 10 is exhausted to the outside of the device by the exhaust pump 23 via the ventilation port 25 and the pipe. Decompression regulator 2 at this time
1 adjusts the pressure (atmospheric pressure) in the supply container 10 (space 8) by adjusting the exhaust flow rate. When the decompression regulator 21 is completely closed, the exhaust from the supply container 10 is stopped.

A barometer 29 is attached to the supply container 10. The barometer 29 can measure the atmospheric pressure of the space 8 in the supply container 10. The barometer 29 is electrically connected to the controller 60 and transmits the measurement result to the controller 60.

The flattening stage 30 is provided below the supply container 10 and can place the work W (here, a semiconductor substrate) in a horizontal posture. The upper surface of the flattening stage 30 is a flat surface, and a plurality of suction holes 31 are provided on the flat surface. Each of the plurality of adsorption holes 31 is connected to a vacuum pump 32 by a pipe, and an adsorption valve 33 is provided on the way of the pipe.
The adsorption valve 33 is electrically connected to the controller 60. When the controller 60 opens the suction valve 33 while placing the work W on the flattening stage 30 and operating the vacuum pump 32, the work W is vacuum-sucked on the flat surface of the flattening stage 30. As a result, the work W is placed on the flattening stage 30 without bending. Further, when the controller 60 closes the suction valve 33, the vacuum suction state for the work W is opened.

The stage elevating / lowering section 40 is constructed by using an air cylinder, and is electrically connected to the controller 60. The stage elevating unit 40 is a controller 60.
As indicated by an arrow AR1 in FIG. 1, the flattening stage 30 is provided with a standby position (a position shown by a solid line in FIG. 1) and a transfer position (a position shown by a chain double-dashed line in FIG. 1) based on an instruction from It is possible to raise and lower along the vertical direction between. The standby position is a position where the work W is delivered to the flattening stage 30, and the transfer position is a position where the viscous substance 5 described later is transferred to the work W. The stage lifting unit 40 is not limited to the air cylinder,
Various well-known actuators incorporating a pulse motor can be used.

The cue detector 50 is composed of a CCD camera and is electrically connected to the controller 60. The cue detector 50 is provided below the penetrating plate 11 of the supply container 10, and at least the penetrating plate 1 is provided.
The lower surface side of 1 can be photographed. Further, the cue detector 50 has a built-in image processing unit that performs image processing on the captured image, and the viscous substance 5 is cueed from the through hole 12 of the through plate 11 in a predetermined range by the image processing. It is possible to detect whether or not there is, and the detection result is transmitted to the controller 60.

The controller 60 is constructed by using a computer, and as described above, the decompression regulator 2 is used.
1, the pressure regulator 22, the barometer 29, the cue detector 50, the adsorption valve 33, and the stage elevating / lowering unit 40, and the decompression regulator 21 based on the detection results from the barometer 29 and the cue detector 50. , The pressure regulator 22, the stage elevating part 40, and the like are controlled. In addition to the above, the viscous substance coating device 1 includes a through plate 1
A gap measuring mechanism that measures the distance between the workpiece 1 and the work W, a clogging detection mechanism that detects clogging of the through holes 12, an alignment mechanism that adjusts the horizontal positional relationship between the through plate 11 and the work W, and the like. It is provided.

At least the work W and the supply container 10
An atmosphere control mechanism for controlling the atmosphere in the space between and may be provided. This is useful in preventing the viscous substance 5 located in the through-hole 12 or the viscous substance 5, which will be described later, from touching the outside air and changing the physical properties, particularly the viscosity, due to volatilization of the solvent. In the case of solder or conductive paste, it is useful for preventing oxidation.

For example, the entire viscous substance coating device 1 is installed in a closed chamber, N ₂ or a solvent is filled therein, and the atmospheric pressure is controlled to suppress the evaporation of the solvent. Further, it is preferable to provide a mechanism for maintaining the viscosity by controlling the room temperature as an atmosphere control mechanism.

<2. Operation of Viscous Substance Coating Device> Next, the operation of the viscous substance coating device 1 having the above configuration will be described. FIG. 2 is a flowchart showing the procedure of applying the viscous substance.

First, a predetermined amount of the viscous substance 5 is stored inside the supply container 10 (step S1). The viscous substance 5 may be stored by supplying the viscous substance 5 into the supply container 10 from the viscous substance supply mechanism described above, or may be manually performed by the operator of the apparatus. FIG. 3 is a diagram showing a state in which the viscous substance 5 is stored inside the supply container 10. As described above, if only the viscous substance 5 is supplied to the supply container 10, due to the relationship between the wall surface of the through hole 12 and the surface tension of the gas-liquid interface of the viscous substance 5 located in the through hole 12, The viscous substance 5 does not leak out.
The space 8 is a closed space when a predetermined amount of the viscous substance 5 is stored in the supply container 10, and the atmospheric pressure is almost the same as the atmospheric pressure around the supply container 10. Further, prior to the storage of the viscous substance 5, the work W aligned at a position facing the through plate 11 is vacuum-adsorbed on the upper surface of the flattening stage 30 without bending.

Next, in step S2, the pressure adjusting mechanism 20 pressurizes the inside of the supply container 10 at a predetermined indexing pressure (first pressure). FIG. 4 is a diagram showing a state in which the inside of the supply container 10 is pressurized by the cueing pressure. In particular,
The controller 60 opens the pressurizing regulator 22 and supplies nitrogen gas to the space 8 in the supply container 10 to bring the space 8 to a preset cue pressure equal to or higher than the atmospheric pressure around the supply container 10. At this time, the controller 60 controls the pressurization regulator 22 based on the measurement result by the barometer 29 so that the space 8 is always maintained at a constant cue pressure. Note that the cueing pressure is a pressure at which the viscous substance 5 can be crawled out from the through hole 12, and it depends on various parameters such as the viscosity and surface tension of the viscous substance 5, the aspect ratio of the through hole 12, and the material of the through plate 11. The optimum value is determined. Therefore, it is preferable to obtain the optimum value of the cueing pressure by an experiment in advance and set the value in the controller 60.

Here, the "cueing" is a phenomenon in which the viscous substance 5 under pressure passes through the through hole 12 and bulges below the through plate 11. FIG. 5 is a diagram showing a state in which the viscous substance 5 is exposed from the through hole 12. The viscous substance 5 is gradually pushed out from the through hole 12 by maintaining the space 8 in the supply container 10 at the cue pressure, and eventually the cue portion 6 is formed below the through hole 12. Since surface tension acts on the cue portion 6, when the cue portion 6 has a certain size or less (more strictly, the surface tension acting on the cue portion 6 is larger than the gravity. If it is large, it does not drip onto the work W.

Next, in step S3, the cue detector 50 detects a cue. The cue detector 50 images the lower part of the predetermined through hole 12, performs a predetermined image processing on the acquired image, recognizes the cue portion 6, and determines whether or not the through hole 12 reaches a predetermined size. Then, it is detected that the viscous substance 5 has been cued.

However, if the space 8 in the supply container 10 is maintained at the heading pressure, the viscous substance 5 stored at that pressure is retained.
A pressure having a value obtained by adding the above pressure acts on the through plate 11. Depending on the pattern shape of the through hole 12, the through plate 1
There is no choice but to reduce the thickness of No. 1, and in this case, as shown in FIG. 5, the penetrating plate 11 is largely bent downward. When the penetrating plate 11 bends downward, a displacement in the height direction occurs especially near the central portion of the penetrating plate 11, so the cue detector 5
It is difficult to detect the cue by 0. On the other hand, even when the penetrating plate 11 is bent downward, the positional deviation in the height direction is relatively small in the peripheral portion of the penetrating plate 11. Therefore, the cue detector 5 is placed in the through hole 12 located at the peripheral edge of the through plate 11.
It is preferable that 0 is focused and the cue detection is performed. In addition, a through hole 12 dedicated to the cue detection is formed in the peripheral portion of the through plate 11 at a position not facing the work W placed on the flattening stage 30, and the cue detector 50 penetrates the through hole 12. The cue detection may be performed by focusing on the hole 12.

Next, the process proceeds to step S4, and if the cueing detector 50 detects cueing of the viscous substance 5 within a predetermined range, the process proceeds to step S5. On the other hand, viscous substance 5
If the cueing is not detected, the process returns to step S3, and the cueing detection by the cueing detector 50 is continued while the space 8 in the supply container 10 is maintained at the cueing pressure. That is, the space 8 in the supply container 10 is continuously maintained at the heading pressure until the viscous substance 5 is headed out from the through hole 12.

When the cueing detector 50 detects cueing of the viscous substance 5 in a predetermined range, the pressure adjusting mechanism 20 applies a predetermined transfer pressure (second pressure) to the inside of the supply container 10. Press (step S5). The transfer pressure is lower than the above-mentioned indexing pressure. That is, step S5
In the above, the pressure adjusting mechanism 20 relatively reduces the pressure in the supply container 10 from the cueing pressure to the transfer pressure. Here, the transfer pressure may be less than the atmospheric pressure (usually atmospheric pressure) around the supply container 10 as long as it is lower than the cueing pressure. Specifically, the controller 60 closes the pressure regulator 22 and opens the decompression regulator 21 to evacuate the space 8 in the supply container 10 to evacuate the space 8 and preset transfer below the head pressure. Make it pressure. At this time, the controller 60 controls the depressurization regulator 21 and the pressurization regulator 22 based on the measurement result by the barometer 29 so that the space 8 is always maintained at a constant transfer pressure.

FIG. 6 is a view showing a state in which the inside of the supply container 10 is pressurized by the transfer pressure. By setting the transfer pressure in the space 8 in the supply container 10 to be lower than the cueing pressure, the above-described bending of the through plate 11 is reduced. That is,
The bending of the through plate 11 is determined by the atmospheric pressure of the space 8, the pressure of the viscous substance 5 in the supply container 10, the restoring force of the through plate 11 itself due to elasticity, and the atmospheric pressure acting from the outside of the supply container 10. When the pressure of the through plate 11 is reduced to the transfer pressure, the bending of the penetrating plate 11 is in the state of FIG.
Is less than the cue pressure).

For the purpose of reducing the bending of the through plate 11 and flattening it, the transfer pressure is applied to the supply container 10.
It may be set to be slightly lower than the ambient pressure, and strictly speaking, the sum of the transfer pressure and the pressure of the viscous substance 5 may be set to be equal to the ambient pressure around the supply container 10. However, if the transfer pressure is set too low, a suction force acts on the viscous substance 5 that has been cued to flow back through the through-hole 12, and the cue portion 6 is sucked into the through-hole 12 and the minimum amount of head needed for transfer. The height (thickness) may not be obtained or may disappear. The condition that the cue portion 6 is sucked into the through hole 12 is defined by various parameters such as the viscosity and surface tension of the viscous substance 5, the aspect ratio of the through hole 12, the material of the through plate 11, and the like.
It is preferable to set the transfer pressure as low as possible within a range in which the cue portion 6 is not sucked by the through hole 12. And
The optimum value of such transfer pressure may be obtained in advance by an experiment or the like, and the value may be set in the controller 60.

After the space 8 in the supply container 10 is maintained at the transfer pressure to reduce the bending of the through plate 11, the process proceeds to step S6, where the flattening stage 30 is raised to the transfer position, and the through plate 11 and the work W are separated from each other. And the work W are brought into contact with each other. FIG. 7 is a diagram showing a state in which the flattening stage 30 is raised and the indexing portion 6 and the work W are in contact with each other. Specifically, the controller 60 controls the stage elevating unit 40 to place the work W on the flattening stage 30.
To the transfer position. Here, the transfer position is a position for transferring the viscous substance 5 to the work W, and is a position where the work W contacts the cue portion 6 and does not contact the through plate 11. The work W is not brought into contact with the through plate 11 because the contaminants attached to the through plate 11 are not transferred to the work W.

At this time, if the penetrating plate 11 is brought closer than necessary, the viscous substance 5 spreads in the gap between the work W and the penetrating plate 11 due to the capillary phenomenon and appears as a bleed of the work W. Therefore, this transfer position is also set to a value obtained in advance by experiments or the like.

Next, in step S7, the flattening stage 30 is lowered to the original standby position again, and the through plate 11
And the work W are separated from each other. Specifically, the controller 60 controls the stage elevating unit 40 to control the flattening stage 3
Lower 0 to the standby position. FIG. 8 is a diagram showing a state in which the flattening stage 30 is lowered to the standby position again. When the penetrating plate 11 and the work W are separated from each other, the indexing portion 6 contacted in step S6 adheres to the work W and the viscous substance 5 is transferred. At this time, the through plate 1
When the 1 and the work W are rapidly separated, the separation (remaining) of the viscous substance 5 does not meet the same condition, and there is a possibility that transfer failure may occur. Therefore, the controller 60 lowers the flattening stage 30 at a minute speed. The stage elevating part 40 is controlled as described above.

The structure in which the flattening stage 30 is lowered in order to adhere and remain on the work W corresponds to the transfer means of the present invention.

When the flattening stage 30 is lowered to the original standby position, the viscous substance coating process is completed, and the transfer portion 7 is formed on the work W along the shape of the through hole 12.

By doing so, the viscous substance 5 can be collectively applied to the work W along the pattern of the through holes 12, and the amount of the viscous substance 5 wastefully discarded due to the pressurizing method. Can be reduced.

After the inside of the supply container 10 is pressurized by the heading pressure to head out the viscous substance 5 from the through hole 12, the inside of the supply container 10 is depressurized to a transfer pressure lower than that, and the penetrating plate 11 is pressed. Since the viscous substance 5 is transferred after the deflection of the viscous substance is reduced, the viscous substance 5 can be reliably applied to the work W. That is, in the state where the space 8 in the supply container 10 is maintained at the indexing pressure (the state of FIG. 5), the penetration plate 1
When the viscous substance 5 is transferred by bringing 1 and the work W close to each other, the viscous substance 5 can be transferred in the vicinity of the central portion of the through plate 11 because the through plate 11 is largely bent.
When the position shift occurs at the time of transfer at the peripheral portion or the through plate 11 is bent more than the height of the cue portion 6, the cue portion 6
Even the contact with the work W becomes impossible. In particular, when the solder paste is applied to the semiconductor substrate as in the present embodiment, the through-hole 11 itself has a small thickness and the viscous substance 5 is cued because the through-hole 12 has a complicated and fine shape. There is a high possibility that the penetrating plate 11 may be largely bent more than the height of the cue portion 6.

According to this embodiment, the viscous substance 5 is transferred after the inside of the supply container 10 is depressurized to a transfer pressure lower than the indexing pressure to reduce the bending of the penetrating plate 11. Therefore, even if the through plate 11 itself is thin, the viscous substance 5 can be reliably applied to the work W.

In the application where the bending of the penetrating plate 11 due to the first pressure is small and the variation of the transfer of the viscous substance 5 by the cue portion 6 is allowed, the first pressure is not applied and the first pressure is not applied. The transfer may be performed under the pressure of.

<3. Modifications> Although the embodiments of the present invention have been described above, the present invention is not limited to the above examples. For example, in the above-described embodiment, the inside of the supply container 10 is pressurized by supplying the nitrogen gas, but the pressurizing method is not limited to this, and the viscous substance 5 may be uniformly pressed. As long as it is possible, pressurization with other gas (for example, air) may be applied, or pressurization with a fluid containing a liquid may be applied,
Alternatively, the viscous substance 5 may be heated to be pressurized.

Further, in the above embodiment, the cue detector 5 is used.
Although the cueing of the viscous substance 5 is detected by 0, and the pressure inside the supply container 10 is reduced to the transfer pressure based on the detection result, the optimum cueing pressure can be set with good reproducibility. If so, the cue detector 50 is not essential. That is, by pressurizing the inside of the supply container 10 with an optimum cueing pressure according to the viscosity of the viscous substance 5 and the like, the cueing pressure and gravity acting on the cueing portion 6, surface tension, cueing portion 6, The interfacial tension acting between the viscous substance 5 and the penetrating plate 11 is balanced, and the extrusion of the viscous substance 5 from the through hole 12 is stopped when the cue portion 6 has an appropriate size. Under such conditions, the cueing portion 6 having an appropriate size can be formed by cueing for a predetermined time without the cueing detector 50, and then the inside of the supply container 10 reaches the transfer pressure. The pressure may be reduced.

Further, in the above-mentioned embodiment, the transfer means moves the flattening stage 30 up and down to bring the work W and the through plate 11 close to or away from each other, but the present invention is not limited to this. , Supply container 1
The work W and the penetrating plate 11 may be brought close to or separated from each other by moving 0 up and down. That is,
Various methods can be adopted as long as the work W and the penetrating plate 11 are relatively close to or apart from each other.

That is, the transfer means may be constructed as follows.

(1) The distance between the work W and the through plate 11 is
Although one of them is separated at the same time at the same time, for example, the through plate 11 or the work W (flattening stage 3
0), or both the through plate 11 and the work W may be separated by sequentially peeling them from the side.

(2) Further, the ultrasonic wave generating means is arranged in contact with the penetrating plate 11, the penetrating plate 11 is vibrated by the oscillation of the ultrasonic wave generating means, and this vibration separates the cue portion 6 of the viscous substance 5. By doing so, the work W is left. By doing so, the transfer process is performed while the flattening stage 30 remains at the transfer position.

(3) Further, in separating the head portion 6 of the viscous substance 5, the viscous substance 5 may be left in the work W by sucking back the viscous substance 5 in the supply container 10. This is because when the inner pressure in the supply container 10 is made lower than that at the time of cueing and the cueing portion 6 is sucked through the through hole 12, the cueing portion 6 opposes the surface tension with the work W and the force of descending due to gravity. The cue portion 6 is separated.

Further, in the above embodiment, the work W
Although the semiconductor substrate is used as the semiconductor substrate, the application target of the viscous substance coating device according to the present invention is not limited to the semiconductor substrate and may be a glass substrate for a liquid crystal display device, a printed circuit board, or the like.

The viscous substance 5 is not limited to the SnAg paste, but may be another solder paste (for example, lead-tin solder paste), or a resist such as an EL resist or a phosphor for PDP. It may be present, or may be a conductive paste such as silver paste or an adhesive.

Further, even when the viscosity of the viscous substance 5 is considerably low, the viscous substance application technique according to the present invention can be applied by selecting the material of the through plate 11 and the shape of the through hole 12. The viscous substance 5 can be applied to the work W. Therefore, the viscous substance 5 is used as ink and the work W
The viscous substance coating technique according to the present invention can be applied even in the case of printing on a sheet.

[0063]

As described above, according to the first aspect of the invention, after the viscous substance is cued from the through hole, the viscous substance is cued by bringing the through plate and the work piece relatively close to each other. Since the viscous substance and the work are brought into contact with each other and the cueed viscous substance is transferred to the work by being left on the work, the viscous substance can be surely applied to the work.

Further, according to the second aspect of the invention, since the inside of the supply container is set to the second pressure which is lower than the first pressure, the bending of the through plate due to the first pressure is reduced and flattened. Therefore, the viscous substance can be surely applied to the work.

Further, according to the third aspect of the invention, since the second pressure is lower than the atmospheric pressure around the supply container, it is possible to sufficiently prevent the penetration plate from bending.

Further, according to the invention of claim 4, since the viscous substance which is cued out is left on the work by relatively separating the through plate and the work, the transfer step can be performed with a simple structure. .

Further, according to the invention of claim 5, since the cue detection step of detecting that the viscous substance is couched out from the through hole is provided, the switching from the first pressure to the second pressure is surely performed. Can be done.

According to the sixth aspect of the present invention, the penetrating plate and the work are brought relatively close to each other to bring the viscous substance that has been cued into contact with the work, and then the viscous substance that has been cued out is moved to the work. Since it is transferred by being left on the work, the viscous substance can be surely applied to the work.

Further, according to the invention of claim 7, after the inside of the supply container is pressurized with the first pressure to expose the viscous substance from the through hole, the inside of the supply container is further lower than the first pressure. Since the second pressure is applied, the bending of the through plate due to the first pressure can be reduced and flattened, and the viscous substance can be reliably applied to the work.

Further, according to the invention of claim 8, since the second pressure is lower than the atmospheric pressure around the supply container, the bending of the through plate can be sufficiently prevented.

According to the ninth aspect of the invention, since the transfer means relatively separates the penetrating plate and the work and the viscous substance that has been indexed remains on the work, the transfer means has a simple structure. be able to.

Further, according to the tenth aspect of the present invention, since the cueing detection means for detecting that the viscous substance has crawled out from the through hole is provided, the switching from the first pressure to the second pressure is surely performed. Can be done.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of main parts of a viscous substance coating device according to the present invention.

FIG. 2 is a flowchart showing a procedure for applying a viscous substance.

FIG. 3 is a diagram showing a state in which a viscous substance is stored inside a supply container.

FIG. 4 is a diagram showing a state in which the inside of the supply container is pressurized with a cueing pressure.

FIG. 5 is a diagram showing a state in which a viscous substance is cued from a through hole.

FIG. 6 is a diagram showing a state in which the inside of the supply container is pressurized with a transfer pressure.

FIG. 7 is a diagram showing a state in which the flattening stage is raised and the indexing portion and the workpiece are in contact with each other.

FIG. 8 is a diagram showing a state in which the flattening stage is lowered to the standby position again.

[Explanation of symbols]

1 Viscous substance application device 5 viscous substances 10 supply containers 11 Through plate 12 through holes 20 Pressure adjustment mechanism 30 flattening stage 40 Stage lift 50 cue detector 60 controller W work

Front page continuation (51) Int.Cl. ⁷ identification code FI theme code (reference) H05K 3/34 505 H01L 21/92 604E (72) Inventor Rifumi Kawagoe 4-chome Tenjin, Horikawa-doji, Kamigyo-ku, Kyoto No. 1 in Kitamachi Dai Nippon Screen Manufacturing Co., Ltd. (72) Inventor Hiroyuki Yashiki 4-chome, Tenjin, Horikawa-dori Teranouchi, Kamigyo-ku, Kyoto Tenjin Kitamachi No. 1 Dai Nippon Screen Manufacturing Co., Ltd. F term (reference) ) 4D075 AC06 AC07 BB56Y BB93Y CA13 CA22 CA47 DA06 DA31 DB13 DC21 DC24 EA07 EA31 EA35 4F041 AA02 AA05 AA06 AB01 BA04 BA13 BA21 BA34 BA38 5E319 AA03 AC01 BB05 CC22 CC61 CD25 CD27 GG15

Claims (10)

[Claims] 1. A viscous substance applying method for applying a viscous substance to a work, comprising: a storing step of storing the viscous substance in a supply container having a through plate having a through hole of a predetermined shape; A cueing step of cueing the viscous substance from the through hole by pressurizing with a pressure of, and after the viscous substance is cueed from the through hole, relatively bring the through plate and the work into close proximity to each other, A viscous substance applying method comprising: a contacting step of bringing the cueed viscous material into contact with the work; and a transfer step of transferring the cueed viscous material by allowing the cueed viscous material to remain in the work. 2. The method for applying a viscous substance according to claim 1, wherein the pressure inside the supply container is reduced to a second pressure lower than the first pressure between the cueing step and the contacting step. A method of applying a viscous substance, further comprising: 3. The viscous substance coating method according to claim 2, wherein the second pressure is lower than the atmospheric pressure around the supply container. 4. The viscous substance applying method according to claim 1, wherein in the transferring step, the viscous substance is cued out by relatively separating the through plate and the work. A method for applying a viscous substance, characterized in that the viscous substance is left on the work. 5. The viscous substance application method according to claim 1, further comprising a cue detection step of detecting that a viscous substance is cueed from the through hole. How to apply viscous substance. 6. A viscous substance applying device for applying a viscous substance to a work, comprising a through-hole plate having a through-hole having a predetermined shape, a supply container for storing the viscous substance, and one side of the supply container. A stage on which a work is placed; a moving means for moving the stage relatively close to and away from the through plate; and a pressure inside the supply container storing a viscous substance at a first pressure, A pressure adjusting means for cueing the viscous substance from the through-hole, the moving means relatively brings the through plate and the work relatively close to each other, and after bringing the crawled viscous substance that has been cue and the work into contact with each other, A viscous substance coating device, comprising: a transfer unit that transfers the cueed viscous substance by leaving it on the work. 7. The viscous substance coating device according to claim 6, wherein the pressure adjusting unit pressurizes the inside of the supply container with the first pressure to expose the viscous substance from the through hole, and further. The viscous substance coating device is characterized in that the inside of the supply container is set to a second pressure that is lower than the first pressure. 8. The viscous substance coating device according to claim 7, wherein the second pressure is lower than the atmospheric pressure around the supply container. 9. The viscous substance applying apparatus according to claim 6, wherein the transfer unit separates the penetrating plate and the work from each other and removes the viscous substance from the head. A viscous substance coating device characterized by being left on the work. 10. The viscous substance application device according to claim 6, further comprising a cue detection unit that detects that a viscous substance is cueed from the through hole. Viscous substance coating device.