JP2003125294A - Camera module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a camera module with a small size, low profile that can easily be manufactured at a low cost. SOLUTION: The camera module is provided with a lens integrated substrate 11 on one side of which a wiring section 13 is formed and where a non-wiring section is processed for a lens; and a sensor 14 the light receiving section 16 of which is opposed to the lens and that is bump-connected to the wiring section 13.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a compact camera module using a substrate on which a sensor chip is assembled.

[0002]

2. Description of the Related Art In recent years, an ultra-small camera module is often mounted on a small-sized information terminal (PDA), a mobile phone, a mobile PC, etc., and accordingly, competition for miniaturization of the camera module is intensifying.

Conventionally, a structure as shown in FIG. 3 is known as a camera module using a CMOS sensor. This camera module includes a substrate 31, a wire 32, a lens holder 33, a sensor 34 having a light receiving section 36, a lens 35, and a wiring section 37.

The sensor 34 is connected to the substrate 31 by the wire 32.
The lens holder 33 is prepared to electrically connect with the wire of FIG. 1 to avoid contact with the wire 32 and to attach the lens 35 to the upper portion of the light receiving portion 36. Recently, some of the sensors 34 have a signal processing unit built-in, and some have a camera function independently.

[0005]

However, in the above conventional structure, when the camera module is made thin, the thickness of the substrate, the height of the lens portion, the height of the wires, etc. have been obstacles to the thinning.

Further, recently, as shown in FIG. 4, a hole is formed only in the light receiving portion 46 of the substrate 41, the sensor 44 is connected to the wiring portion 43 by the bump 42 from the back, and the optical filter 47 and the lens are provided on the surface of the substrate 41. A module in which 45 is arranged to reduce the size has also appeared, but further downsizing is required, and easy manufacture and low cost are also required.

[0007]

According to the present invention, there is provided a light transmitting substrate having a wiring portion formed on one surface and a lens formed in a non-wiring portion, and a sensor having a light receiving portion. Is opposed to the lens portion, and the sensor is bump-connected to the wiring portion.

For this reason, it is possible to suppress an increase in thickness due to the wire portion, and since the lens and the lens folder portion are built in the substrate, it is possible to suppress an increase in module height due to an increase in thickness for the substrate. You can

Further, since the number of lens-related parts such as the lens holder can be reduced, the ease of production, the reduction of man-hours and the production cost can be suppressed.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1A is a plan view of a camera module according to an embodiment of the present invention, and FIG. 1B is a sectional view.

In FIG. 1, 11 is a light-transmissive lens-integrated substrate having a lens formed in a non-wiring portion, 12 is a bump, 13 is a wiring portion formed on one surface of the lens-integrated substrate 11, and 14 is a wiring portion. A sensor, 15 is a lens processing unit, and 16 is a light receiving unit that receives light from the lens processing unit 15.

As shown in the figure, the lens-integrated substrate 11 is
For example, it is made by a plastic lens manufacturing technique or a glass substrate processing technique, and the wiring base and the lens portion are integrally molded.

A wiring portion 13 is prepared on a portion other than the lens portion on the back surface of the substrate. This wiring portion 13 is made of, for example, Al
(Aluminum) evaporation, etching, or
It is formed by attaching a multilayer wiring film.

The sensor 14 having the light receiving portion 16 has the bump 1
It is connected to the wiring portion 13 by the bump connection by 2 and at the same time, this bump connection also serves as the alignment between the light receiving portion 16 and the lens processing portion 15.

The camera lens of the lens processing section 15 is processed so that the light receiving section 16 of the sensor 14 is bump-connected so as to have an optimum focal length.

If the sensor 14 is a recent one, it is possible to output a camera signal by attaching an accessory 17, for example, a signal processing LSI.

As described above, according to this embodiment, the wiring part is formed on one surface, and the lens integrated substrate having the lens formed in the non-wiring part and the light receiving part of the sensor are opposed to the lens part. By connecting the sensor to the wiring part by bump, it is possible to suppress the increase in thickness due to the wire part, and since the lens and the lens folder part are built in the substrate, the thickness for the substrate increases. It is possible to suppress an increase in the height of the module due to.

Further, since the number of lens-related parts such as the lens holder can be reduced, the ease of production, the reduction of man-hours and the production cost can be suppressed.

Although an optical filter (for example, an infrared cut filter) is attached to the surface portion, as shown in FIG.
The optical filter 18 shown in FIG. 1 can be eliminated by using a material having an optical filter function as the material of the substrate itself or coating only the lens portion with the optical filter.

FIG. 2A is a plan view of a camera module according to the second embodiment of the present invention which uses the substrate having the optical filter function described above, and FIG. 2B is a schematic sectional view of the same. In FIG. 2, reference numeral 21 denotes a substrate having an optical filter function, 22
Is a bump, 23 is a wiring part, 24 is a sensor, 25 is a lens processing part, 26 is a light receiving part, and 27 is an accessory.

In the present embodiment, since the substrate 21 having an optical filter function is used and an optical filter is not required separately, it is possible to make the device even thinner and reduce the manufacturing cost.

Further, the camera device using the above camera module can be made thinner, lower in cost and lighter in weight.

[0024]

As described above, according to the present invention,
A structure in which a wiring part is formed on one surface and a lens is built in the non-wiring part, and the light receiving part of the sensor is opposed to the lens part, and the sensor is bump-connected to the wiring part. As a result, the configuration of the lens portion is simple, the alignment of the sensor and the lens is easy, and the manufacturing cost can be suppressed. Further, since the substrate and the lens unit are integrated, it is possible to make the device thinner.

[Brief description of drawings]

1A is a plan view of a camera module according to a first embodiment of the present invention, and FIG. 1B is a schematic sectional view of FIG.

2A is a plan view of a camera module according to a second embodiment of the present invention, and FIG. 2B is a schematic sectional view of FIG.

FIG. 3 is a schematic sectional view showing an example of a conventional camera module.

4A is a plan view showing another example of a conventional camera module, and FIG. 4B is a schematic sectional view of FIG. 4A.

[Explanation of symbols]

11 Lens integrated substrate 12 bumps 13 Wiring part 14 sensors 15 Lens processing section 16 Light receiving part 17 accessories 18 Optical filter 21 Substrate with optical filter function 22 bump 23 Wiring part 24 sensors 25 Lens processing section 26 Light receiving part 27 accessories

Claims (5)

[Claims] 1. A light-transmissive substrate having a wiring portion formed on one surface and a lens formed in a non-wiring portion, and a sensor having a light receiving portion for receiving light from the lens, A camera module, wherein the light receiving part is opposed to the lens part and bump-connected to a wiring part. 2. The camera module according to claim 1, wherein an optical filter is arranged on the upper surface of the lens processing portion. 3. The camera module according to claim 1, wherein the material of the substrate is a material having an optical filter function. 4. The camera module according to claim 1, wherein the wiring portion is formed of a multilayer film and is attached to the substrate. 5. A lens-integrated substrate in which a wiring portion is formed on one surface and a lens processing portion is integrally formed on a non-wiring portion, and a sensor having a light-receiving portion for receiving light from the lens, A camera device having a camera module in which the light receiving unit faces the lens portion and is electrically connected to the wiring portion.