JP2003115657A - Printed wiring board and transporting method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To produce an efficient printed wiring board without the occurrence of waste in a material due to throw-off after solder is fixed and without complicated work such as the change of the width of a transport guide on a transport device side. SOLUTION: In the printed wiring board 1, electronic parts 4 where connectors 3 protrude outward from outer edges are disposed on a surface. Jig boards 50 and 50 for preventing solder and/or flux from bonding to the connectors 3 from the rear side of the printed wiring board 1 can be fitted to the side end face of a side where the connectors 3 protrude.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention makes it possible to improve the quality and efficiency of a printed wiring board suitable for an automatic machine such as an automatic soldering apparatus, especially in a soldering or flux applying step which is a pre-step of the soldering operation. And a method of transporting the same.

[0002]

2. Description of the Related Art Conventionally, when an electronic component is mounted on a dip-type printed wiring board with a connector or the like protruding outward from the outer edge of the printed wiring board, a soldering fixing step and a flux applying step which is a preceding step thereof In the above, it is necessary to provide a protection member for protecting the protruding portion from adhesion of excess solder or flux. Hereinafter, an example of the structure of the protective member will be described with reference to FIGS. 6 and 7.

In FIG. 6, two electronic components 2 are arranged on a flat printed wiring board 1 at approximately the center in the width direction. Further, in the vicinity of the outer edge of the printed wiring board 1, the electronic component 4 is attached so that the connector 3 projects to the outside of the outer edge. In order to mount the electronic components 2 and 4 and other components on the front surface (front surface in FIG. 6) of the printed wiring board 1 at both ends of the printed wiring board 1 in the width direction, When the board 1 is inserted into a flux tank or a solder tank, protection portions 5 and 5 are connected to prevent excess flux and solder from adhering to the exposed portion of the connector 3 from the back side of the paper in FIG. Has been done.

As shown in FIG. 7, grooves 6 and 6 having a V-shaped cross section are formed at the boundaries between the printed wiring board 1 and the protective portions 5 and 5. These grooves 6 and 6 are provided for cutting the protective parts 5 and 5 from the printed wiring board 1 after the electronic components 2 and 4 are fixed to the printed wiring board 1 by soldering. That is, the protective portions 5 and 5 are provided after the electronic components 2 and 4 are soldered on the printed wiring board 1.
Using the low-strength grooves 6 and 6, the protective portions 5 and 5 are folded on the surface side (X direction in FIG. 7) opposite to the side where the grooves 6 and 6 are provided, and the printed wiring board 1 Disconnect from.

[0005]

As described above, conventionally, in the dip type printed wiring board 1 to which the electronic parts 4 are attached so that the connectors 3, 3 and the like project outward from the outer edges, in the flux applying step and soldering. In order to protect the exposed portions of the connectors 3 and 3 from solder and flux during the attaching and fixing process, protective portions 5 and 5 that can be later discarded are provided. However, when the protective portions 5 and 5 are removed from the printed wiring board 1 by utilizing the above-described grooves 6 and 6 after fixing by soldering, the connectors 3 and 3 protruding from the printed wiring board 1 interfere with the disconnecting work. . Therefore, there arises a problem that it is difficult to divide the protection units 5 and 5.

Further, since the protective portions 5 and 5 are discarded after being fixed by soldering, there is a problem in terms of effective utilization of materials. Naturally, it also leads to an increase in the manufacturing cost of the product.

It is also possible to protect the connectors 3 and 3 from solder and flux by a method other than the example shown in FIG. For example, a protective film called a flux guard may be applied to the connectors 3 and 3 or a masking tape may be attached. However, even when such a method is adopted, the protective film and the masking tape after use cannot be reused, and as a result, the material is not effectively used, which further increases the manufacturing cost. In addition, since Flux Guard is a dangerous material, import / export may be restricted by international regulations.

Further, conventionally, when the printed wiring board 1 is transported to a flux tank or a dipping machine (soldering device) for fixing by soldering with a transporting device, it is guided by a carrier with both end faces being guided by a transport guide. The printed wiring board 1 is moved. But,
When it becomes necessary to convey printed wiring boards 1 with different widths due to changes in specifications, etc., the width of the conveyance guide of the conveyance device or the conveyance section in the dip machine is changed to the optimum width according to the specifications of the printed wiring board 1. Need to do. As a result, the number of man-hours is increased by the work of adjusting the guide width of the transport guide, which causes a problem that productivity is reduced.

An object of the present invention is to solve the above-mentioned problems, to prevent waste of material due to cutting and discarding after fixing by soldering, and to change the width of the transfer guide on the transfer device side. It is an object of the present invention to provide a printed wiring board and a transportation method capable of efficient production without the complicated work.

[0010]

In order to achieve such an object, a printed wiring board of the present invention is a printed wiring board provided with an electronic component projecting outside from an outer edge on a front surface, wherein the electronic component is projected. It is characterized in that a jig plate for preventing solder and / or flux from adhering to the electronic component from the back surface side of the printed wiring board can be attached to the side end surface of the side where the jig is attached.

In addition to the above-mentioned invention, the printed wiring board of another invention is characterized in that the jig plate can be attached by high-temperature solder.

In addition to the above invention, the printed wiring board according to another aspect of the present invention has, in addition to the above-described invention, a fitting portion that fits in a concave portion or a convex portion provided on the jig plate on the side end face, and the concave portion or the convex portion is fitted. It is characterized in that the jig plate can be attached by fitting it in the joint part.

In addition to the above-mentioned invention, a printed wiring board of another invention is provided with a groove or a recess on a side end surface, and the groove or the recess serves as a mounting portion for mounting a mounting member mounted on a jig plate. The jig plate can be attached by inserting an attachment member into the groove or recess.

Further, the printed wiring board carrying method of the present invention is a printed wiring board carrying method in which an electronic component protruding outward from an outer edge is provided on a front surface, and a side end surface on the side where the electronic component is projected and The step of attaching a jig plate for preventing solder and / or flux from adhering to the electronic component from the back surface side of the printed wiring board on the side end surface facing the side end surface, respectively, and Holding the jig plate from the outside and inserting the back surface of the printed wiring board into the solder bath or the flux bath while sliding the printed wiring board by the transportation means along the transportation guide that guides the slide movement, and the jig plate. Is removed from the printed wiring board.

In addition to the above-mentioned invention, a method for carrying a printed wiring board according to another invention is characterized in that a jig plate having a width corresponding to a gap between the carrying guide and the printed wiring board is used. There is.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION A first embodiment of the present invention will be described in detail below with reference to FIGS. It should be noted that members having the same configurations as those of the conventional technique shown in FIGS. 6 and 7 will be described using the same reference numerals as those in FIGS. 6 and 7.

FIG. 1 is a plan view showing a printed wiring board according to the first embodiment of the present invention. In addition, FIG.
FIG. 6 is a schematic plan view for explaining a transfer unit that transfers the printed wiring board shown in FIG. 1 to a flux tank or a solder tank.

In the printed wiring board 1 according to the first embodiment of the present invention, there is one near the right end in FIG. 1 (near the front end in the carrying direction) and approximately in the center in the width direction, near the left end in FIG. The IC chip 2 which is two electronic components, one near the rear end in the carrying direction) and near the lower end in FIG. 1 in the width direction (near the right end in the carrying direction).
0 and 20 are arranged respectively. An electronic component 4 is attached near the outer edge on one side of the printed wiring board 1 (the outer edge on the upper end side in FIG. 1) so that the connector 3 projects to the outside of the outer edge.

When the printed wiring board 1 is inserted into a flux bath or a solder bath, the side end surfaces on both sides in the width direction of the printed wiring board 1 are located on the back side of the paper in FIG. 1 (the back side of the printed wiring board 1). ) Excess flux and solder from the electronic component 4, which is mounted on the front side surface in FIG.
Protective jig plates 50, 50 are attached to prevent the connectors 4 and 3 from being attached to the exposed portions. That is, the jig plates 50, 50 are attached so as to hide the connectors 3, 3 when viewed from the back surface side of the printed wiring board 1.

The jig plate 50 is adhesively fixed to the printed wiring board 1 by high-temperature solder from the back surface side of the printed wiring board 1 which is the solder fixing surface in FIG. 1 (FIG. 1).
Then, the high temperature solder fixing part is indicated by the symbol F). The temperature at which the high temperature solder melts is higher than the temperature of the solder for fixing the electronic component to the printed wiring board 1 by soldering. Therefore, when the printed wiring board 1 is immersed in a solder bath for fixing the electronic components by soldering, the printed wiring board 1 is not melted. Therefore, the fixed portion due to the high-temperature solder is peeled off during the fixing by soldering, and the jig plate 50 is printed wiring. It does not come off from the substrate 1.

As shown in FIG. 1, the jig plates 50, 50 are fixed to the printed wiring board 1 by high-temperature solder at several places, specifically, at three places on each side, for example. After completion of soldering and fixing the electronic components in the solder bath, the jig plates 50, 50 can be removed from the printed wiring board 1 by melting the high temperature solder fixing portions of the jig plates 50, 50 with a soldering iron or the like. it can. Moreover, it is possible to reuse the jig plates 50, 50 after the removal. That is, the jig plates 50, 50 for protecting the connectors 3, 3 from the flux and the solder may not be discarded after being removed from the printed wiring board 1 like a cleaving portion of a conventional cleaving type board. Instead, it can be reused. As a result, it is possible to reduce the waste of materials and reduce the manufacturing cost.

FIG. 2 shows the printed wiring board 1 as described above.
It is the figure which showed typically the conveyance part 8 which conveys the printed wiring board 1 to a flux tank or a solder tank in the state which attached the jig plates 50 and 50 to both end surfaces, respectively.

As shown in FIG. 2, the carrying section 8 includes jig plates 50 and 5 attached to both end surfaces of the printed wiring board 1.
Both carrier guides 80, 80 for gripping the outer end of 0, and a plurality of (only one is shown in FIG. 2) rotating disk-shaped carriers 9 arranged along these carrier guides 80, 80.
It consists of 0 and 90. Protrusions 90a, 90a are attached to the outer peripheral edges of the carriers 90, 90 at substantially equal intervals. Carriers 90, 90 are respectively Y,
The jig plate 50 in which the projections 90a and 90a are attached to both end surfaces of the printed wiring board 1 while rotating in the Y'direction,
The printed wiring board 1 is abutted against 50.
Carrier 90 is conveyed in the direction of arrow G in FIG.
The protrusion 90a serves as a transport unit that transports the printed wiring board 1.

Both the transport guides 80, 80 of the transport unit 8
The width W1 between them is configured to be wider than the width W2 of the printed wiring board 1 including the outer end portion of the connector 3 protruding from the printed wiring board 1 with the jig plates 50 and 50 removed. Therefore, the printed wiring board 1
The connector 3 protruding in the width direction from the both transfer guides 80
Protrusions 90a, 9 of the carriers 90, 90 entering the inside of the
The printed wiring board 1 is conveyed along the conveyance guides 80, 80 without hitting 0a or the like.

The width W4 of the printed wiring board 1 varies depending on the specifications of the printed wiring board 1. conventionally,
It was necessary to change the setting of the width W1 between the transport guides 80, 80 in accordance with the change of the width W4 accompanying the model change, etc., but according to the present invention, the width W between the transport guides 80, 80 is changed.
It is possible to cope with a change in the width W4 of the printed wiring board 1 due to a model change or the like without changing 1.

That is, in the present invention, a plurality of kinds of jig plates 50, 50 to be attached to both end surfaces of the printed wiring board 1 are prepared, and are appropriately used according to the width W4 of only the printed wiring board 1 excluding the connector 3. By doing so, it is possible to cope with a change in the width W4 of the printed wiring board 1 due to a model change or the like. Therefore, it is not necessary to set the width W1 between the transport guides 80, 80 in accordance with a model change or the like, and the width W1 of the transport guides 80, 80 can always be kept constant.

The above-described first embodiment is an example of a preferred embodiment of the present invention, but the present invention is not limited to this, and various modifications can be made without departing from the gist of the present invention. It is possible. For example, in the above-described embodiment, the jig plates 50, 50 are detachably attached to the printed wiring board 1 by high-temperature solder, but they may be attached by another method. The respective examples will be referred to as second and third embodiments, and with reference to FIGS. 3, 4 and 5,
This will be described below.

The printed wiring board 10 according to the second embodiment of the present invention will be described with reference to FIG. The same components as those in the first embodiment of the present invention described above will be briefly described, and different components will be mainly described.
Further, when the same components as those of the above-described first embodiment of the present invention are shown, the same symbols are used.

An electronic component 4 is attached near the upper edge of the printed wiring board 10 in FIG. 3 so that the connector 3 protrudes outside the outer edge. Then, when the printed wiring board 10 is inserted into a flux bath or a solder bath, the side end surfaces on both sides in the width direction of the printed wiring board 10 are on the back side of the paper in FIG. 3 (the back side of the printed wiring board 10).
3 is a protective jig plate 51 for preventing excess flux and solder from adhering to exposed portions of the connectors 3 and 3 of the electronic components 4 and 4 mounted on the front surface in FIG. , 51 are attached. That is, the jig plates 51, 51 are attached so as to hide the connectors 3, 3 when viewed from the back surface side of the printed wiring board 10.

The side surfaces of the jig plates 51, 51 are provided with projections 51a, 51a. On the other hand, the side end surface of the printed wiring board 10 is provided with concave portions 10a and 10a which are fitting portions with the convex portions 51a and 51a.
The jig plates 51, 51 are attached to the side end surfaces of the printed wiring board 10 by fitting the convex portions 51a, 51a into the concave portions 10a, 10a of the printed wiring board 10, respectively. The jig plate 5 attached in this way
1, 51 can be removed from the printed wiring board 10 by removing the fitting, and can be attached to another printed wiring board again, that is, reused. Therefore, also in the second embodiment of the present invention,
The printed wiring board 10 can be efficiently produced at low cost without waste of materials.

In the second embodiment of the present invention, the jig plates 51, 51 are provided with the convex portions 51a, 51a, and the printed wiring board 10 is provided with the concave portions 10a, 10a, respectively. The part and the recess may be provided in reverse. That is, a concave portion may be provided on the jig plate 51 side and a convex portion may be provided on the printed wiring board 10 side.

Next, a printed wiring board 11 according to a third embodiment of the present invention will be described with reference to FIGS. 4 and 5. The same components as those of the first and second embodiments of the present invention described above will be briefly described, and mainly different components will be described. Further, when the same components as those in the above-described first and second embodiments of the present invention are shown, the same reference numerals are used.

In the vicinity of the upper edge of the printed wiring board 11 in FIG. 4, an electronic component 4 is attached so that the connector 3 protrudes outside the outer edge. Then, when the printed wiring board 11 is inserted into a flux bath or a solder bath, the side end surfaces on both sides in the width direction of the printed wiring board 11 are on the back side of the paper in FIG. 4 (the back side of the printed wiring board 11).
4 is a protective jig plate for preventing excess flux and solder from adhering to exposed portions of the connectors 3 and 3 of the electronic components 4 and 4 mounted on the front surface in FIG. 52, 52 are attached. That is, the jig plates 52, 52 are attached so as to hide the connectors 3, 3 when viewed from the back surface side of the printed wiring board 11.

It should be noted that the jig plates 52, 52 are formed at the corners between the end faces on both sides of the jig plates 52, 52 in the carrying direction (left and right direction in FIG. 4) and the lower end in the width direction (vertical direction in FIG. 4).
A hole 52 for inserting an adapter member 53, which serves as a mounting member for fixing 52 to the printed wiring board 11.
a and 52a are provided. On the other hand, like the jig plates 52, 52, the mounting portions for inserting and mounting the adapter members 53 are also provided at the four corners of the both end surfaces in the width direction of the printed wiring board 11 and the both end surfaces in the transport direction. The concave portions 11a, 11a are provided. The recesses 11a may be grooves.

Then, in a state where the inner side end faces of the jig plates 52, 52 are in contact with both end faces in the width direction of the printed wiring board 11, in the carrying direction or in the direction opposite to the carrying direction. Substantially rectangular flat plate-shaped adapter member 53
Jigs 52 and 52 are fixed to both end surfaces in the width direction of the printed wiring board 11, respectively. Although four adapter members 53 are used in FIG. 4, grooves are provided along both contact surfaces of the printed wiring board 11 and the jig plate 52, and one adapter member 53 on one side is used. The jig plate 52 may be attached to the printed wiring board 11.

The jig plate 5 attached in this way
2, 52 are pulled in the direction opposite to the direction in which each adapter member 53 is inserted, and each recess 11a and hole 52
By removing from a, it can be removed from the printed wiring board 11. Moreover, it can be attached to another printed wiring board again, that is, reused. Therefore, also in the third embodiment of the present invention,
The printed wiring board 11 can be efficiently produced at low cost without waste of material.

According to the embodiments of the present invention described above,
The jigs 50, 51 and 52 can protect the connector 3 from solder and flux. Moreover, the jig plate 5
Since 0, 51, 52 can be removed from the printed wiring boards 1, 10, 11 and reused, no waste of material occurs. In addition, in each of the above-described embodiments, the jig plate 5 is used.
Connector 3 from solder or flux by 0, 51, 52
However, even if the portion protruding from the printed wiring board 1 is a member other than the connector, the protruding portion is protected from solder and flux.
The present invention is adapted.

Further, according to each embodiment of the present invention, a plurality of jig plates 50, 51, 52 having different widths are prepared, and the widths of the printed wiring boards 1, 10, 11 and the carrying guide 80 on the carrying device side are provided. , A plurality of jig plates 50, 5 depending on the width between
By appropriately using 1, 52, it becomes unnecessary to change the width between the conveyance guides 80, 80. Therefore,
It becomes possible to more efficiently produce the printed wiring boards 1, 10 and 11.

[0039]

As described above, according to the present invention,
Efficient production of printed wiring boards without waste of material due to cutting after soldering and fixing, and without the complicated work of changing the width between the transfer guides on the transfer device side. be able to.

[Brief description of drawings]

FIG. 1 is a plan view showing a printed wiring board according to a first embodiment of the present invention.

FIG. 2 is a schematic plan view for explaining a transfer unit that transfers the printed wiring board shown in FIG. 1 to a flux tank or a solder tank.

FIG. 3 is a plan view showing a printed wiring board according to a second embodiment of the present invention.

FIG. 4 is a plan view showing a printed wiring board according to a third embodiment of the present invention.

5 is a side view of FIG. 4 viewed from the direction of arrow V. FIG.

FIG. 6 is a plan view showing a conventional printed wiring board.

FIG. 7 is a side view of FIG. 6 viewed from the arrow VII.

[Explanation of symbols]

1,10,11 Printed wiring board 3 connectors 4 electronic components 10a Recess (fitting part) 11a Recessed part (mounting part) 50, 51, 52 jig plate 51a convex part 53 Adapter member (mounting member)

Claims (6)

[Claims] 1. A printed wiring board having an electronic component on its front surface, the electronic component projecting outward from an outer edge, wherein solder and / or solder is applied to the side end surface on the side where the electronic component projects from the rear surface side of the printed wiring board. Alternatively, a printed wiring board can be attached with a jig plate for preventing the flux from adhering to the electronic component. 2. The printed wiring board according to claim 1, wherein the jig plate can be attached by high temperature soldering. 3. The jig plate is provided with a fitting portion that fits into a concave portion or a convex portion provided on the jig plate, and the concave portion or the convex portion is fitted into the fitting portion. The printed wiring board according to claim 1, wherein the printed wiring board can be attached. 4. A groove or a recess is provided on the side end surface, and the groove or the recess is used as a mounting portion for mounting a mounting member mounted on the jig plate, and the mounting member is inserted into the groove or the recess. The printed wiring board according to claim 1, wherein the jig plate can be attached. 5. A method of transporting a printed wiring board, comprising a front surface having an electronic component projecting outward from an outer edge, wherein a side end surface on which the electronic component is projected and a side end surface facing the side end surface. And a jig plate for preventing solder and / or flux from adhering to the electronic component from the back surface side of the printed wiring board, and holding the jig plate from the outside of the jig plate. In addition, a step of inserting the back surface of the printed wiring board into a solder bath or a flux bath while sliding the printed wiring board by a transporting means along a transport guide that guides the slide movement; And a step of removing the printed wiring board from the board. 6. The method of carrying a printed wiring board according to claim 5, wherein the jig plate having a width corresponding to a gap between the carrying guide and the printed wiring board is used.