JP2003110038A - Container for electronic part - Google Patents
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- JP2003110038A JP2003110038A JP2001298657A JP2001298657A JP2003110038A JP 2003110038 A JP2003110038 A JP 2003110038A JP 2001298657 A JP2001298657 A JP 2001298657A JP 2001298657 A JP2001298657 A JP 2001298657A JP 2003110038 A JP2003110038 A JP 2003110038A
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【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は、圧電振動子や表面
弾性波素子や半導体素子等の電子部品を気密に収容する
ための電子部品収納用容器に関するものである。
【０００２】
【従来の技術】従来、例えば圧電振動子や表面弾性波素
子や半導体素子等の電子部品を収容するための電子部品
収納用容器は、図２に断面図で示すように、例えば酸化
アルミニウム質焼結体等のセラミックス材料から成り、
上面に電子部品23が搭載される略平板状の絶縁基板24の
上面に電子部品23を取り囲む枠状の絶縁枠体25を積層し
て成る絶縁基体21と、ガラス等の透光性材料や鉄−ニッ
ケル−コバルト合金等の金属材料から成り、絶縁基体21
の絶縁枠体25上面に低融点ガラスや半田等の封止材26を
介して接合されることにより絶縁基体21との間の空間に
電子部品23を収容する略平板状の蓋体22とから主として
構成されており、絶縁基板24の上面に電子部品23を搭載
するとともに絶縁枠体25の上面に蓋体22を封止材26を介
して接合することにより絶縁基体21と蓋体22との間の空
間に電子部品23が収容されることとなる。
【０００３】また、絶縁基板24には、絶縁基体21と蓋体
22との間の空間を真空に排気するための貫通孔27がその
上面から下面にかけて途中に段差部27ａを有するように
して形成されており、絶縁基体21と蓋体22とから成る容
器内部に電子部品23を収容した後、絶縁基板24に形成さ
れた貫通孔27を介して電子部品23を収容する空間を真空
に排気し、しかる後、この貫通孔27内に例えば銅合金等
の金属から成る球状の封止用金属部材28を鉛−錫合金等
から成る半田を介して取着させてこの貫通孔27を封止す
ることにより、電子部品収納用容器内部に電子部品23が
気密に収容された電子装置となる。
【０００４】なお、絶縁基体21に形成された貫通孔27内
に鉛−錫合金等の半田を介して封止用金属部材28を取着
させてこの貫通孔27を封止するには、貫通孔27の途中の
段差部27ａの表面にタングステンやモリブデン粉末等の
高融点金属メタライズから成る金属層29を被着させてお
くとともにこの金属層29の表面にろう材との濡れ性に優
れるニッケルや金等のめっき金属層（不図示）を被着さ
せておき、この貫通孔27内に半田および封止用金属部材
28を段差部27ａで留まるようにして入れるとともに、半
田を加熱溶融させることにより封止用金属部材28と金属
層29とを半田を介して接合することにより封止する方法
が採用されている。この場合、封止用金属部材28および
半田は貫通孔27内の段差部27ａで留まって、貫通孔27内
に良好に位置決めされるとともに絶縁基体21と蓋体22と
の間の空間内に落ち込むことが有効に防止される。
【０００５】また、絶縁基体21は、例えば酸化アルミニ
ウム等のセラミック原料粉末に適当な有機バインダ・溶
剤等を添加混合して泥漿状のセラミックスラリとなすと
ともにこのセラミックスラリをシート状となすことによ
り絶縁基板24用および絶縁枠体25用の複数枚のセラミッ
クグリーンシートを用意し、次にこれらのセラミックグ
リーンシートに貫通孔27となる貫通孔および電子部品23
を収容するための貫通穴を穿孔し、次にこれらのセラミ
ックグリーンシートを上下に積層して積層体となし、最
後にこれを約1600℃の温度で焼成することによって製作
される。
【０００６】なお、貫通孔27の途中に段差部27ａを形成
するには、絶縁基板24用のセラミックグリーンシートと
して上層用のセラミックグリーンシートと下層用セラミ
ックグリーンシートとの２枚のセラミックグリーンシー
トを準備するとともに、これらの２枚のセラミックグリ
ーンシートに貫通孔27用の貫通孔をその直径が下層用の
セラミックグリーンシートで大きくなるように互いに異
なる直径で穿孔し、これらのセラミックグリーンシート
を積層することによって貫通孔27の途中に段差部27ａを
形成する方法が採用されている。
【０００７】
【発明が解決しようとする課題】しかしながら、この従
来の電子部品収納用容器によると、絶縁基体21の絶縁基
板24の上面から下面にかけて形成された貫通孔27の途中
に段差部27ａを設けるために絶縁基板24用のセラミック
グリーンシートとして上層用のセラミックグリーンシー
トと下層用のセラミックグリーンシートとの２枚のセラ
ミックグリーンシートを用意して、上層用のセラミック
グリーンシートに貫通孔27となる小さな孔を、下層用の
セラミックグリーンシートには貫通孔27となる大きな孔
をそれぞれ別々に形成してこの２枚のセラミックグリー
ンシートを上下に積層する必要があった。そのため、絶
縁基板24の厚みがセラミックグリーンシート２枚分の厚
みとなり、絶縁基体21を薄くすることができず、近年ま
すます要求されている電子装置の低背化が困難であると
ともに絶縁基体21の製造工程が非常に煩雑であるという
問題点を有していた。
【０００８】本発明はかかる従来の問題点に鑑み案出さ
れたものであり、その目的は、絶縁基体の厚みを薄いも
のとして電子装置の低背化を可能とするとともに絶縁基
体の製造が極めて簡便な電子部品収納用容器を提供する
ことにある。
【０００９】
【課題を解決するための手段】本発明の電子部品収納用
容器は、上面に電子部品が搭載される略平板状の絶縁基
板上に前記電子部品を取り囲む枠状の絶縁枠体が積層さ
れて成るとともに前記絶縁基板の上面から下面にかけて
前記絶縁枠体の内側に開口する排気用の貫通孔が形成さ
れた絶縁基体と、前記絶縁枠体上に接合されて前記絶縁
基体との間の空間に前記電子部品を封止する蓋体とから
成る電子部品収納用容器であって、前記貫通孔は、その
大きさが前記絶縁基板の上面から下面にかけて略同じで
あり、かつその上端が前記絶縁枠体で部分的に塞がれて
いることを特徴とするものである。
【００１０】本発明の電子部品収納用容器によれば、絶
縁基板に形成された排気用の貫通孔は、その大きさが絶
縁基板の上面から下面にかけて略同じであり、かつその
上端の一部が絶縁枠体により部分的に塞がれるようにし
て形成されていることから、貫通孔内に封止用金属部材
を入れると、その封止用金属部材は貫通孔の上端を部分
的に塞ぐ絶縁枠体で留まって位置決めされる。したがっ
て、貫通孔内に段差部を設けることなく封止用金属部材
を貫通孔内に位置決めすることができるので、絶縁基板
を１枚のセラミックグリーンシートから形成して薄型化
することができるとともに絶縁基体の製造を簡略化する
ことができる。
【００１１】
【発明の実施の形態】次に、本発明の電子部品収納用容
器を添付の図面を基に詳細に説明する。図１は本発明の
電子部品収納用容器の実施の形態の一例を示す断面図で
あり、１は絶縁基体、２は蓋体、３は電子部品である。
そして主として絶縁基体１と蓋体２とで本発明の電子部
品収納用容器が構成され、この電子部品収納用容器内に
電子部品３を気密に封止することによって電子装置が形
成される。
【００１２】電子部品収納用容器を構成する絶縁基体１
は、その上面に電子部品３が搭載される略四角平板状の
絶縁基板４の上面に電子部品３を取り囲む略四角枠状の
絶縁枠体５が積層されて成り、絶縁枠体５で囲まれた絶
縁基板４上面には電子部品３が搭載される。
【００１３】この絶縁基体１は酸化アルミニウム質焼結
体や窒化アルミニウム質焼結体・炭化珪素質焼結体・窒
化珪素質焼結体・ムライト質焼結体・ガラスセラミック
ス等の電気絶縁材料から成る。例えば酸化アルミニウム
質焼結体から成る場合には、酸化アルミニウムおよび酸
化珪素・酸化カルシウム・酸化マグネシウム等の原料粉
末に適当な有機バインダ・溶剤・可塑剤・分散剤等を添
加混合して泥漿状のセラミックスラリとなすとともに、
このセラミックスラリを従来周知のドクタブレード法等
を採用してシート状となすことにより絶縁基板４および
絶縁枠体５用の複数枚のセラミックグリーンシートを得
て、次にこれらのセラミックグリーンシートに後述する
貫通孔７および電子部品３を収容するための打ち抜き孔
を穿孔するとともに上下に積層して絶縁基体１用のセラ
ミックグリーンシートの積層体を得て、最後にこれを還
元雰囲気中約1600℃の温度で焼成することによって製作
される。
【００１４】なお、絶縁基体１は、一般には例えばその
幅が２〜５ｍｍ程度・長さが５〜10ｍｍ程度、厚みが0.
3〜0.6ｍｍ程度であり、凹状の搭載部１ａの幅が１〜４
ｍｍ程度・長さが４〜９ｍｍ程度・深さが0.2〜0.5ｍｍ
程度である。そして、圧電振動子の小型化・薄型化の要
求に伴い、その小型化・薄型化がますます進んでいる。
【００１５】また、絶縁基体１には絶縁基板４の一端側
から絶縁基板４の下面にかけて導出する配線導体６が被
着形成されており、この配線導体６で絶縁基板４の上面
の一端側に導出した部位に電子部品３の電極が銀−ポリ
イミド樹脂や銀−エポキシ樹脂・銀−シリコーン樹脂等
の導電性接着剤11を介して接着固定される。そして、配
線導体６で絶縁基板４の下面に導出した部位を図示しな
い外部回路基板等の配線導体に半田等の導電性接着剤を
介して接合することにより、電子部品３の各電極が外部
回路基板等に接続されることとなる。
【００１６】配線導体６は、タングステンやモリブデン
・銀・銅等の金属粉末メタライズから成り、タングステ
ン等の金属粉末に適当な有機バインダや溶剤等を添加混
合して得た金属ペーストを絶縁基板４となるセラミック
グリーンシートに予め所定のパターンに印刷塗布してお
くとともに、これを絶縁基体１となるセラミックグリー
ンシート積層体とともに焼成することによって、絶縁基
体１の絶縁基板４の上面の一端側から絶縁基板４の下面
に導出するようにして被着形成される。
【００１７】また、絶縁基体１の絶縁基板４には絶縁枠
体５の内周にかかる位置に絶縁基板４の上面から下面に
かけてその大きさが略同じ貫通孔７が形成されている。
貫通孔７は、絶縁基体１と蓋体２とから成る容器の内部
に電子部品３を収容した後、この電子部品３を収容する
空間を真空に排気するための排気孔として機能し、その
上端が絶縁枠体５で部分的に塞がれているとともにその
内壁には封止用金属部材８を半田を介して取着するため
の金属層９が被着されている。
【００１８】そして貫通孔７は、絶縁基体１と蓋体２と
の間の空間に電子部品３を収容した後に、この電子部品
３を収容する空間を真空に排気し、しかる後、貫通孔７
内に半田および封止用金属部材８を入れるとともに半田
を加熱溶融させて金属層９に封止用金属部材８を半田を
介して取着することにより気密に封止される。なお、絶
縁基体１の貫通孔７を封止する封止用金属部材８は、例
えば銅等の金属から成る球体であり、また封止用金属部
材８を金属層９に取着している半田は、例えば鉛90重量
％−錫10重量％から成る鉛−錫合金である。
【００１９】このとき、貫通孔７内に入れた半田および
封止用金属部材８は貫通孔７の上端を部分的に塞ぐ絶縁
枠体５により貫通孔７内に留まり、貫通孔７内に良好に
位置決めされるとともに絶縁基体１と蓋体２との間の空
間内に落ちることはない。
【００２０】この場合、貫通孔７は、その大きさが絶縁
基板４の上面から下面にかけて略同じなので、このよう
な貫通孔７を有する絶縁基板４を形成するためのセラミ
ックグリーンシートは１枚だけ準備すればよく、したが
って、絶縁基板４の厚みをセラミックグリーンシート１
枚分の厚みとして絶縁基体１の厚みを薄いものとするこ
とができる。その結果、本発明の電子部品収納用容器に
よれば、電子装置の低背化を実現することができる。ま
た同時に、絶縁基板４を形成するためのセラミックグリ
ーンシートは１枚だけ準備すればよいので、打ち抜き孔
の穿孔や積層の工程がその分少なく、絶縁基体１を極め
て簡便に製作することができる。
【００２１】なお、貫通孔７は好ましくは円形の孔であ
り、その直径は0.1〜１ｍｍ程度が好ましい。貫通孔７
が円形以外の場合、その内壁に金属層９を設けにくくな
るとともに貫通孔７内に半田や封止用金属部材８を効率
良く入れることが困難となる傾向がある。また、貫通孔
７の直径が0.1ｍｍ未満では、貫通孔７内に半田および
封止用金属部材８を入れにくくなる傾向にあり、他方、
１ｍｍを超えると、そのような貫通孔７を封止するため
に多量の半田と大きな封止用金属部材８が必要となる。
また、貫通孔７はその上端の面積の５〜95％が絶縁枠体
５により覆われることが好ましい。貫通孔７が絶縁枠体
５により覆われる面積がその上端の面積の５％未満で
は、貫通孔７内に半田および封止用金属部材８を入れた
際にこれらの半田および封止用金属部材８が絶縁枠体５
により貫通孔７内に良好に留められなくなる危険性があ
り、他方、95％を超えると、絶縁基体１と蓋体２との間
の空間を効率良く排気することが困難となってしまう傾
向にある。但し、貫通孔７は必ずしも円形である必要は
なく、三角形や四角形あるいはその他の形状であっても
よい。
【００２２】なお、貫通孔７を封止する封止用金属部材
８が取着される金属層９は、タングステンやモリブデン
・銀・銅等の金属粉末メタライズから成り、ろう材との
濡れ性を良好なものとするためにその表面に必要に応じ
てニッケルや金等から成るめっき金属層を被着させてい
る。
【００２３】このような金属層９は、絶縁基板４用のセ
ラミックグリーンシートに設けた貫通孔７用の打ち抜き
孔の内壁にタングステン等の金属粉末を含有するメタラ
イズペーストを塗布するとともに、これを絶縁基体１用
のセラミックグリーンシート積層体とともに焼成するこ
とによって貫通孔７の内壁に被着形成される。
【００２４】電子部品収納用容器を構成する蓋体２は、
例えば鉄−ニッケル−コバルト合金等の金属や酸化アル
ミニウム質焼結体等のセラミックスから形成されてお
り、ろう材または低融点ガラス等からなる封止材10を介
して絶縁基体１の上面に接合される。蓋体２は、鉄−ニ
ッケル−コバルト合金等の金属から成る場合であれば、
鉄−ニッケル−コバルト合金等の金属板を蓋体２に対応
した形状に打ち抜くことによって形成され、ガラスやサ
ファイアから成る場合であれば、蓋体２の厚みに対応し
た厚みのガラスやサファイアから成る広面積の板材を所
定の大きさ・形状に切断したり、あるいは断面が蓋体２
に対応した大きさ・形状のガラスやサファイアから成る
棒材を所定厚さに切断することにより製作される。
【００２５】かくして本発明の電子部品収納用パッケー
ジによれば、絶縁基体１の絶縁基板４上に電子部品３を
搭載するとともに絶縁枠体５の上面に蓋体２を接合させ
た後、絶縁基体１と蓋体２との間の空間を真空に排気
し、しかる後、貫通孔７を半田を介して封止用金属部材
８で封止することによって製品としての電子装置とな
る。
【００２６】なお、本発明は上述の実施の形態の例に限
定されるものではなく、本発明の要旨を逸脱しない範囲
であれば種々の変更は可能である。
【００２７】
【発明の効果】本発明の電子部品収納用容器によれば、
絶縁基板に形成された排気用の貫通孔は、その大きさが
絶縁基板の上面から下面にかけて略同じであり、かつそ
の上端の一部が絶縁枠体により部分的に塞がれるように
して形成されていることから、貫通孔内に封止用金属部
材を入れると、その封止用金属部材は貫通孔の上端を部
分的に塞ぐ絶縁枠体で留まって位置決めされる。したが
って、貫通孔内に段差部を設けることなく封止用金属部
材を貫通孔内に位置決めすることができるので、絶縁基
板を１枚のセラミックグリーンシートから形成して薄型
化することができ、そのため、得られる電子装置を低背
化することができるとともに絶縁基体の製造を簡便なも
のとすることができる。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component storage container for hermetically storing electronic components such as a piezoelectric vibrator, a surface acoustic wave device, and a semiconductor device. It is. 2. Description of the Related Art Conventionally, as shown in a sectional view of FIG. 2, for example, an electronic component storage container for storing an electronic component such as a piezoelectric vibrator, a surface acoustic wave device, or a semiconductor device is manufactured by using an It is made of ceramic material such as aluminum sintered body,
An insulating base 21 formed by stacking a frame-shaped insulating frame 25 surrounding the electronic component 23 on the upper surface of a substantially flat insulating substrate 24 on which the electronic component 23 is mounted, and a light-transmitting material such as glass or iron. An insulating substrate 21 made of a metal material such as a nickel-cobalt alloy;
And a substantially flat lid 22 accommodating an electronic component 23 in a space between the insulating base 21 and the insulating frame body 25 by being joined to the upper surface of the insulating frame 25 via a sealing material 26 such as low-melting glass or solder. The electronic component 23 is mounted on the upper surface of the insulating substrate 24, and the lid 22 is joined to the upper surface of the insulating frame 25 via the sealing material 26 to form the insulating base 21 and the lid 22. The electronic component 23 is accommodated in the space between them. The insulating substrate 24 includes an insulating base 21 and a lid.
A through hole 27 for evacuating the space between the space 22 and the space 22 is formed so as to have a step 27a in the middle from the upper surface to the lower surface, and is formed inside the container comprising the insulating base 21 and the lid 22. After accommodating the electronic component 23, the space accommodating the electronic component 23 is evacuated through the through-hole 27 formed in the insulating substrate 24, and then, in the through-hole 27, a metal such as a copper alloy The electronic component 23 is hermetically housed inside the electronic component storage container by attaching a spherical sealing metal member 28 made of lead-tin alloy or the like via solder and sealing the through hole 27. Electronic device. In order to seal the through-hole 27 by attaching a sealing metal member 28 to the through-hole 27 formed in the insulating base 21 via solder such as a lead-tin alloy, it is necessary to use a through-hole. A metal layer 29 made of a refractory metal such as tungsten or molybdenum powder is deposited on the surface of the step portion 27a in the middle of the hole 27. A plating metal layer (not shown) of gold or the like is adhered, and solder and a sealing metal member
A method is adopted in which the sealing metal member 28 and the metal layer 29 are joined by soldering by heating and melting the solder while soldering the solder 28 so as to be retained at the step 27a. In this case, the sealing metal member 28 and the solder stay at the step 27 a in the through hole 27, are well positioned in the through hole 27, and fall into the space between the insulating base 21 and the lid 22. Is effectively prevented. The insulating substrate 21 is formed by adding a suitable organic binder, a solvent, etc. to a ceramic raw material powder such as aluminum oxide to form a slurry-like ceramic slurry and forming the ceramic slurry into a sheet-like shape. A plurality of ceramic green sheets for the substrate 24 and the insulating frame 25 are prepared, and then these ceramic green sheets are provided with through holes 27 serving as through holes 27 and electronic components 23.
Then, these ceramic green sheets are stacked one on top of another to form a laminate, and finally, this is fired at a temperature of about 1600 ° C. In order to form the step 27a in the middle of the through hole 27, two ceramic green sheets, an upper ceramic green sheet and a lower ceramic green sheet, are used as the ceramic green sheets for the insulating substrate 24. In preparation, these two ceramic green sheets are perforated with through holes for the through holes 27 with diameters different from each other so that the diameter of the through holes 27 becomes larger with the lower ceramic green sheet, and these ceramic green sheets are laminated. Thus, a method of forming a step 27a in the middle of the through hole 27 is adopted. However, according to this conventional electronic component storage container, a step 27a is formed in the middle of a through hole 27 formed from the upper surface to the lower surface of the insulating substrate 24 of the insulating base 21. In order to provide, two ceramic green sheets, an upper ceramic green sheet and a lower ceramic green sheet, are prepared as ceramic green sheets for the insulating substrate 24, and through holes 27 are formed in the upper ceramic green sheet. It was necessary to separately form a small hole and a large hole serving as the through hole 27 in the lower ceramic green sheet, and to stack the two ceramic green sheets one above the other. For this reason, the thickness of the insulating substrate 24 is equal to the thickness of two ceramic green sheets, and the thickness of the insulating substrate 21 cannot be reduced. Has a problem that the manufacturing process is very complicated. SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems. It is an object of the present invention to reduce the thickness of an insulating substrate so as to reduce the height of an electronic device and to manufacture an insulating substrate extremely. An object of the present invention is to provide a simple electronic component storage container. According to the present invention, there is provided a container for storing electronic components, wherein a frame-like insulating frame surrounding the electronic component is provided on a substantially flat insulating substrate on which the electronic component is mounted. An insulating base formed by laminating and having a through hole for exhaust formed inside the insulating frame from the upper surface to the lower surface of the insulating substrate; and an insulating base joined to the insulating frame and connected to the insulating base. And a lid for sealing the electronic component in the space, wherein the through hole has substantially the same size from the upper surface to the lower surface of the insulating substrate, and the upper end thereof has The insulating frame is partially closed. According to the electronic component storage container of the present invention, the size of the exhaust through hole formed in the insulating substrate is substantially the same from the upper surface to the lower surface of the insulating substrate, and a part of the upper end thereof. Is formed so as to be partially closed by the insulating frame, so that when the sealing metal member is put into the through hole, the sealing metal member partially closes the upper end of the through hole. The positioning is performed by stopping at the insulating frame. Therefore, the metal member for sealing can be positioned in the through-hole without providing a step in the through-hole, so that the insulating substrate can be formed from a single ceramic green sheet to reduce the thickness and to achieve insulation. The manufacture of the substrate can be simplified. Next, a container for accommodating an electronic component according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a cross-sectional view showing an example of an embodiment of an electronic component storage container according to the present invention, wherein 1 is an insulating base, 2 is a lid, and 3 is an electronic component.
The electronic component storage container of the present invention is mainly constituted by the insulating base 1 and the lid 2, and an electronic device is formed by hermetically sealing the electronic component 3 in the electronic component storage container. Insulating base 1 constituting electronic component storage container
Is formed by laminating a substantially square frame-like insulating frame 5 surrounding the electronic component 3 on the upper surface of a substantially square flat insulating substrate 4 on which the electronic component 3 is mounted, and is surrounded by the insulating frame 5. The electronic component 3 is mounted on the upper surface of the insulating substrate 4. The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, a mullite sintered body, and a glass ceramic. Become. For example, in the case of a sintered body of aluminum oxide, a suitable organic binder, solvent, plasticizer, dispersant, etc. are added to raw material powders such as aluminum oxide and silicon oxide / calcium oxide / magnesium oxide and mixed to form a slurry. Along with ceramic slurry,
A plurality of ceramic green sheets for the insulating substrate 4 and the insulating frame 5 are obtained by forming the ceramic slurry into a sheet by employing a conventionally known doctor blade method or the like. Punching holes for accommodating the through-holes 7 and the electronic components 3 to be formed and laminated one above the other to obtain a laminate of ceramic green sheets for the insulating substrate 1, and finally, to a temperature of about 1600 ° C. It is manufactured by firing at a temperature. The insulating substrate 1 generally has, for example, a width of about 2 to 5 mm, a length of about 5 to 10 mm, and a thickness of about 0.3 mm.
3 to 0.6 mm, and the width of the concave mounting portion 1a is 1 to 4
About mm, length about 4-9mm, depth 0.2-0.5mm
It is about. With the demand for smaller and thinner piezoelectric vibrators, the size and thickness of the piezoelectric vibrators have been increasingly reduced. A wiring conductor 6 extending from one end of the insulating substrate 4 to the lower surface of the insulating substrate 4 is formed on the insulating base 1. The wiring conductor 6 is connected to one end of the upper surface of the insulating substrate 4 by the wiring conductor 6. The electrode of the electronic component 3 is bonded and fixed to the derived portion via a conductive adhesive 11 such as a silver-polyimide resin, a silver-epoxy resin, and a silver-silicone resin. Then, a portion of the wiring component 6 led out to the lower surface of the insulating substrate 4 is joined to a wiring conductor such as an external circuit board (not shown) via a conductive adhesive such as solder so that each electrode of the electronic component 3 is connected to the external circuit. It will be connected to a substrate or the like. The wiring conductor 6 is made of metallized metal powder such as tungsten, molybdenum, silver or copper. A metal paste obtained by adding a suitable organic binder or solvent to a metal powder such as tungsten is mixed with the insulating substrate 4. The ceramic green sheet is preliminarily printed and applied in a predetermined pattern, and is fired together with the ceramic green sheet laminate serving as the insulating base 1, so that the insulating substrate 1 is insulated from one end of the upper surface of the insulating substrate 4. 4 so as to be led out to the lower surface. In the insulating substrate 4 of the insulating base 1, a through hole 7 having the same size from the upper surface to the lower surface of the insulating substrate 4 is formed at a position corresponding to the inner periphery of the insulating frame 5.
The through hole 7 functions as an exhaust hole for accommodating the electronic component 3 in a container including the insulating base 1 and the lid 2 and then evacuating the space accommodating the electronic component 3 to a vacuum. Is partially closed by an insulating frame 5 and a metal layer 9 for attaching a sealing metal member 8 via solder is adhered to the inner wall thereof. After the electronic component 3 is accommodated in the space between the insulating base 1 and the lid 2, the space accommodating the electronic component 3 is evacuated to a vacuum.
The solder and the sealing metal member 8 are put into the inside, and the solder is heated and melted, and the sealing metal member 8 is attached to the metal layer 9 via the solder, whereby airtight sealing is achieved. The sealing metal member 8 for sealing the through hole 7 of the insulating base 1 is a sphere made of a metal such as copper, for example, and a solder for attaching the sealing metal member 8 to the metal layer 9. Is, for example, a lead-tin alloy composed of 90% by weight of lead and 10% by weight of tin. At this time, the solder and the sealing metal member 8 put in the through-hole 7 are retained in the through-hole 7 by the insulating frame 5 that partially covers the upper end of the through-hole 7, and are good in the through-hole 7. And does not fall into the space between the insulating base 1 and the lid 2. In this case, since the size of the through hole 7 is substantially the same from the upper surface to the lower surface of the insulating substrate 4, only one ceramic green sheet for forming the insulating substrate 4 having such a through hole 7 is provided. Therefore, the thickness of the insulating substrate 4 can be adjusted by the ceramic green sheet 1.
The thickness of the insulating substrate 1 can be reduced as the thickness of the insulating substrate. As a result, according to the electronic component storage container of the present invention, the height of the electronic device can be reduced. At the same time, since only one ceramic green sheet for forming the insulating substrate 4 needs to be prepared, the number of steps of punching holes and lamination is reduced, and the insulating substrate 1 can be manufactured extremely easily. The through hole 7 is preferably a circular hole, and its diameter is preferably about 0.1 to 1 mm. Through hole 7
Is not circular, it tends to be difficult to provide the metal layer 9 on the inner wall and it is difficult to efficiently insert the solder or the sealing metal member 8 into the through hole 7. If the diameter of the through-hole 7 is less than 0.1 mm, it tends to be difficult to put the solder and the sealing metal member 8 into the through-hole 7,
If it exceeds 1 mm, a large amount of solder and a large sealing metal member 8 are required to seal such a through hole 7.
In addition, it is preferable that the through-hole 7 be covered with the insulating frame 5 at 5 to 95% of the area of the upper end thereof. If the area where the through hole 7 is covered by the insulating frame 5 is less than 5% of the area of the upper end thereof, when the solder and the sealing metal member 8 are put in the through hole 7, the solder and the sealing metal member 8 is the insulating frame 5
Therefore, there is a risk that the space between the insulating base 1 and the lid 2 cannot be efficiently exhausted if the amount exceeds 95%. is there. However, the through-hole 7 does not necessarily have to be circular, but may be triangular, quadrangular or other shapes. The metal layer 9 to which the sealing metal member 8 for sealing the through-hole 7 is attached is made of metal powder of metal such as tungsten, molybdenum, silver, copper, etc., and has good wettability with the brazing material. In order to improve the quality, a plated metal layer made of nickel, gold, or the like is applied to the surface as necessary. The metal layer 9 is formed by applying a metallizing paste containing a metal powder such as tungsten to the inner wall of a punched hole for the through hole 7 provided in the ceramic green sheet for the insulating substrate 4 and insulating the metallized paste. By firing together with the ceramic green sheet laminate for the base 1, it is formed on the inner wall of the through hole 7. The lid 2 constituting the electronic component storage container is
For example, it is formed of a metal such as an iron-nickel-cobalt alloy or a ceramic such as an aluminum oxide sintered body, and is joined to the upper surface of the insulating base 1 via a sealing material 10 made of a brazing material or a low-melting glass. You. If the lid 2 is made of a metal such as an iron-nickel-cobalt alloy,
It is formed by punching a metal plate such as an iron-nickel-cobalt alloy into a shape corresponding to the lid 2, and if it is made of glass or sapphire, it is made of glass or sapphire having a thickness corresponding to the thickness of the lid 2. A wide area plate is cut into a predetermined size and shape, or the cross section is
It is manufactured by cutting a rod made of glass or sapphire having a size and shape corresponding to a predetermined thickness into a predetermined thickness. According to the electronic component housing package of the present invention, the electronic component 3 is mounted on the insulating substrate 4 of the insulating base 1 and the lid 2 is joined to the upper surface of the insulating frame 5. The space between the cover 1 and the cover 2 is evacuated to a vacuum, and then the through-hole 7 is sealed with a sealing metal member 8 via solder, thereby providing an electronic device as a product. The present invention is not limited to the above-described embodiment, and various changes can be made without departing from the scope of the present invention. According to the electronic component storage container of the present invention,
The exhaust through-hole formed in the insulating substrate has substantially the same size from the upper surface to the lower surface of the insulating substrate, and is formed such that a part of the upper end is partially closed by the insulating frame. Therefore, when the metal member for sealing is put in the through hole, the metal member for sealing is stopped and positioned by the insulating frame body partially covering the upper end of the through hole. Therefore, the sealing metal member can be positioned in the through-hole without providing a step portion in the through-hole, so that the insulating substrate can be formed from one ceramic green sheet and thinned. In addition, the height of the obtained electronic device can be reduced, and the manufacture of the insulating substrate can be simplified.
【図面の簡単な説明】
【図１】本発明の電子部品収納用容器の実施の形態の一
例を示す断面図である。
【図２】従来の電子部品収納用容器の実施の形態の一例
を示す断面図である。
【符号の説明】
１・・・絶縁基体
２・・・蓋体
３・・・電子部品
４・・・絶縁基板
５・・・絶縁枠体
７・・・貫通孔BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view showing an example of an embodiment of an electronic component storage container according to the present invention. FIG. 2 is a sectional view showing an example of an embodiment of a conventional electronic component storage container. [Description of Signs] 1 ... Insulating base 2 ... Lid 3 ... Electronic component 4 ... Insulating substrate 5 ... Insulating frame 7 ... Through hole
Claims (1)
絶縁基板上に前記電子部品を取り囲む枠状の絶縁枠体が
積層されて成るとともに前記絶縁基板の上面から下面に
かけて前記絶縁枠体の内側に開口する排気用の貫通孔が
形成された絶縁基体と、前記絶縁枠体上に接合されて前
記絶縁基体との間の空間に前記電子部品を封止する蓋体
とから成る電子部品収納用容器であって、前記貫通孔
は、その大きさが絶縁基板の上面から下面にかけて略同
じであり、かつその上端が前記絶縁枠体で部分的に塞が
れていることを特徴とする電子部品収納用容器。Claims 1. A frame-shaped insulating frame surrounding an electronic component is laminated on a substantially flat insulating substrate on which an electronic component is mounted on an upper surface. An insulating base having an exhaust through-hole formed on the lower surface thereof and opening inside the insulating frame; a lid joined to the insulating frame to seal the electronic component in a space between the insulating base and the insulating base; An electronic component storage container comprising a body, wherein the size of the through hole is substantially the same from the upper surface to the lower surface of the insulating substrate, and the upper end thereof is partially closed by the insulating frame. A container for storing electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001298657A JP4570301B2 (en) | 2001-09-27 | 2001-09-27 | Electronic component storage container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001298657A JP4570301B2 (en) | 2001-09-27 | 2001-09-27 | Electronic component storage container |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003110038A true JP2003110038A (en) | 2003-04-11 |
| JP4570301B2 JP4570301B2 (en) | 2010-10-27 |
Family
ID=19119526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001298657A Expired - Fee Related JP4570301B2 (en) | 2001-09-27 | 2001-09-27 | Electronic component storage container |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4570301B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006093372A (en) * | 2004-09-24 | 2006-04-06 | Nichia Chem Ind Ltd | Semiconductor device |
| JP2009273145A (en) * | 2009-08-10 | 2009-11-19 | Seiko Epson Corp | Piezoelectric device |
| JP2010124494A (en) * | 2010-03-05 | 2010-06-03 | Seiko Epson Corp | Piezoelectric oscillator, electronic apparatus and method of manufacturing piezoelectric oscillator |
| JP2010154565A (en) * | 2010-03-24 | 2010-07-08 | Seiko Epson Corp | Piezoelectric oscillator, electronic apparatus, and method of manufacturing zoelectric oscillator |
| JP2011249424A (en) * | 2010-05-24 | 2011-12-08 | Daishinku Corp | Sealing member of electronic component package, electronic component package, and method of manufacturing sealing member of electronic component package |
| JP2015119165A (en) * | 2013-11-12 | 2015-06-25 | セイコーエプソン株式会社 | Method for manufacturing wiring board, wiring board, package for element housing, electronic device, electronic equipment, and mobile body |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000106515A (en) * | 1998-09-28 | 2000-04-11 | Kyocera Corp | Package for piezoelectric vibrator, piezoelectric vibrator and its manufacture |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5343477A (en) * | 1976-09-30 | 1978-04-19 | Nec Corp | Semiconductor device |
| JPH05283549A (en) * | 1992-03-31 | 1993-10-29 | Toshiba Corp | Manufacture of glass-sealed ceramic vessel |
-
2001
- 2001-09-27 JP JP2001298657A patent/JP4570301B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000106515A (en) * | 1998-09-28 | 2000-04-11 | Kyocera Corp | Package for piezoelectric vibrator, piezoelectric vibrator and its manufacture |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006093372A (en) * | 2004-09-24 | 2006-04-06 | Nichia Chem Ind Ltd | Semiconductor device |
| JP4661147B2 (en) * | 2004-09-24 | 2011-03-30 | 日亜化学工業株式会社 | Semiconductor device |
| JP2009273145A (en) * | 2009-08-10 | 2009-11-19 | Seiko Epson Corp | Piezoelectric device |
| JP2010124494A (en) * | 2010-03-05 | 2010-06-03 | Seiko Epson Corp | Piezoelectric oscillator, electronic apparatus and method of manufacturing piezoelectric oscillator |
| JP2010154565A (en) * | 2010-03-24 | 2010-07-08 | Seiko Epson Corp | Piezoelectric oscillator, electronic apparatus, and method of manufacturing zoelectric oscillator |
| JP2011249424A (en) * | 2010-05-24 | 2011-12-08 | Daishinku Corp | Sealing member of electronic component package, electronic component package, and method of manufacturing sealing member of electronic component package |
| JP2015119165A (en) * | 2013-11-12 | 2015-06-25 | セイコーエプソン株式会社 | Method for manufacturing wiring board, wiring board, package for element housing, electronic device, electronic equipment, and mobile body |
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| Publication number | Publication date |
|---|---|
| JP4570301B2 (en) | 2010-10-27 |
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