JP2003218661A - Package for piezoelectric vibrator storage - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for piezoelectric vibrator storage which enables a piezoelectric vibrator to accurately operate by stably and tightly supporting the piezoelectric vibrator on a piezoelectric vibrator support. <P>SOLUTION: The package for piezoelectric vibrator storage comprises an insulating base body 1 which has a metallized wire 4 bonded and formed by a thick-film method and a lid body 2 and is provided with the piezoelectric vibrator support 5, electrically connected to the metallized wire 4, on the top surface of the insulating base 1; and the piezoelectric vibrator support 5 comprises a lower metallized layer 5a and an upper metallized layer 5b which is so laminated on the lower metallized layer 5a while having its outer circumferential part projected from on the metallized layer 5a above the insulating base body 1, the both being formed by a thick-film method. <P>COPYRIGHT: (C)2003,JPO

Description

Description: BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a package for accommodating a piezoelectric vibrator. [0002] Conventionally, a package for accommodating a piezoelectric vibrator for accommodating a piezoelectric vibrator such as a crystal vibrator is made of a ceramic such as an aluminum oxide sintered body as shown in a sectional view of FIG. And a concave portion 11a for forming a space for accommodating the piezoelectric vibrator 15 is formed at the center of the upper surface,
The metallized wiring 12 was drawn out from the bottom surface to the lower surface of the concave portion 11a and formed of a high melting point metal powder such as tungsten formed by a thick film technique, and was adhered to the metallized wiring 12 on the bottom surface of the concave portion 11a so as to be electrically connected thereto. An insulating substrate 11 having a piezoelectric vibrator support base 13 formed by laminating metallized layers 13a and 13b made of a high melting point metal powder such as tungsten formed by a thick film method, and a lid for closing a concave portion 11a of the insulating substrate 11 And a piezoelectric vibrator 15 on the piezoelectric vibrator support 13.
The electrodes of the piezoelectric vibrator 15 and the piezoelectric vibrator support 13
Are electrically connected to each other, and are adhered and supported via a conductive adhesive 16 such as a conductive resin or solder, and a lid 14 is provided on the outer periphery of the upper surface of the insulating base 11 with a sealing material such as solder or resin. To connect the piezoelectric vibrator 15 to the insulating base 11.
A piezoelectric vibrating device is provided by being hermetically housed in a container consisting of In such a piezoelectric vibrating device, a metallized wiring 12 led out to a lower surface of an insulating base 11 is connected to a wiring conductor of an external electric circuit board via a conductive adhesive such as solder, thereby forming the insulating base 11 and a lid. Thus, the piezoelectric vibrator 15 housed in the container consisting of 14 is electrically connected to an external electric circuit. The insulating substrate 11 of such a package for accommodating a piezoelectric vibrator is generally manufactured by a ceramic green sheet laminating method. Specifically, first, an appropriate organic binder, a solvent and the like are added to a ceramic raw material powder and mixed. The slurry is formed into a slurry-like ceramic slurry, and the ceramic slurry is formed into a sheet shape by employing a conventionally known doctor blade method to obtain a plurality of ceramic green sheets. Next, the ceramic green sheets are appropriately punched. Apply and metallization wiring 12
And, a metal paste to be the piezoelectric vibrator support 13 is printed and applied in a predetermined pattern by using a thick film technique such as a screen printing method, and finally, the ceramic green sheets are vertically stacked to form a ceramic green sheet laminate. It is manufactured by firing at a high temperature and sintering and integrating the ceramic green sheet and the metal paste. The thickness of the piezoelectric vibrator support 13 is increased by laminating, for example, two lower metallized layers 13a and an upper metallized layer 13b formed by a thick film method. In addition, by making the upper metallized layer 13b smaller than the lower metallized layer 13a,
a, and a step portion is formed between the upper metallization layer 13b and the upper surface of the metallized layer 13b, so that when the electrodes of the piezoelectric vibrator 15 are joined on the piezoelectric vibrator support base 13 via a conductive adhesive, the piezoelectric vibrator A pool of the conductive adhesive 16 is formed between the support 13 and the piezoelectric vibrator 15 so that the piezoelectric vibrator 15 and the piezoelectric vibrator support 13 are firmly joined. However, according to the conventional package for accommodating the piezoelectric vibrator, when the size of the package becomes small, the concave portion 1 of the insulating base 11 is not provided.
The area for providing the piezoelectric vibrator support 13 on the bottom surface 1a is reduced, and the piezoelectric vibrator support 15 needs to be reduced accordingly. Therefore, in such a package, the area of the metallized layer 13b on the upper layer of the piezoelectric vibrator support 13 becomes extremely small, and when the piezoelectric vibrator 15 is mounted thereon, the area of the metallized layer 13b on the extremely small upper layer is reduced. It is difficult to stably support the piezoelectric vibrator 15, and as a result, a problem has been caused in that the piezoelectric vibrator 15 cannot generate accurate vibration. SUMMARY OF THE INVENTION The present invention has been made in view of such a conventional problem, and has as its object to enable a piezoelectric vibrator to be stably and firmly supported on a piezoelectric vibrator support table, It is an object of the present invention to provide a package for storing a piezoelectric vibrator capable of operating a vibrator accurately. The present invention comprises an insulating base having a metallized wiring formed by a thick film technique and a lid, and the upper surface of the insulating base is electrically connected to the metallized wiring. A piezoelectric vibrator housing package provided with a piezoelectric vibrator support base connected to the piezoelectric vibrator support, wherein the piezoelectric vibrator support base has a lower metallized layer and a lower metallized layer formed by a thick film method. An outer peripheral portion is formed on the layer and includes an upper metallized layer laminated so as to protrude from the lower metallized layer onto the insulating base. According to the package for accommodating a piezoelectric vibrator of the present invention, the piezoelectric vibrator support base has a lower metallized layer formed by a thick film method and an outer peripheral portion on the lower metallized layer. Since the upper metallized layer is formed so as to protrude from the metallized layer onto the insulating substrate, the area of the upper metallized layer should be large even if the size of the package is small. As a result, the piezoelectric vibrator can be stably supported on the upper metallized layer. In addition, when the piezoelectric vibrator is bonded and supported on such a piezoelectric vibrator support via a conductive adhesive, the conductive adhesive is bonded to the insulating base and the upper metallized layer overhanging the insulating base during bonding. Since the piezoelectric vibrator is penetrated and fitted, the piezoelectric vibrator can be extremely firmly fixed via the conductive adhesive. Therefore, accurate vibration can be generated in the piezoelectric vibrator. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail with reference to the accompanying drawings. FIG. 1 shows an embodiment of a package for accommodating a piezoelectric vibrator according to the present invention, wherein 1 is an insulating base, and 2 is a lid. The insulating base 1 and the lid 2 constitute a container for hermetically containing the piezoelectric vibrator 3 therein. The insulating substrate 1 is made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, and a glass-ceramic. A concave portion 1a serving as a space for accommodating the piezoelectric vibrator is formed.
The piezoelectric vibrator 3 is accommodated in a. When the insulating substrate 1 is made of, for example, a sintered body of aluminum oxide, an appropriate organic binder, a solvent, a plasticizer, a dispersant, etc. are added to ceramic raw material powder such as aluminum oxide, silicon oxide, calcium oxide, and magnesium oxide. Along with the addition and mixing to form a slurry-like ceramic slurry, the ceramic slurry is formed into a sheet by employing a conventionally known doctor blade method to obtain a plurality of ceramic green sheets, and then to the ceramic green sheets. While performing appropriate punching processing,
They are laminated one above the other to form a ceramic green sheet laminate, and finally the ceramic green sheet laminate is fired in a reducing atmosphere at a temperature of about 1600 ° C. The insulating substrate 1 has a plurality of metallized wirings 4 formed thereon from the bottom surface to the lower surface of the concave portion 1a. The metallized wiring 4 is made of, for example, a high melting point metal powder such as tungsten or molybdenum, and functions as a conductive path for electrically connecting the piezoelectric vibrator 3 housed inside to the outside. For the metallized wiring 4, a metal paste obtained by adding an appropriate organic binder and a solvent to a high melting point metal powder such as tungsten, molybdenum or the like is mixed by a conventionally known thick film method such as a screen printing method. In this way, a predetermined pattern is printed and applied to the ceramic green sheet serving as the insulating base 1 and fired together with the ceramic green sheet laminate serving as the insulating base 1 to be drawn from the bottom surface to the lower surface of the concave portion 1a of the insulating base 1. It is formed in a manner as described above. Further, the piezoelectric vibrator includes a lower metallization layer 5a electrically connected to the metallization wiring 4 on the bottom surface of the concave portion 1a and an upper metallization layer 5b laminated thereon. The support base 5 is formed by being adhered. The piezoelectric vibrator support 5 functions as a support member for supporting the piezoelectric vibrator 3, and the piezoelectric vibrator 3 is electrically connected on its upper surface to its electrodes and the piezoelectric vibrator support 5. In this manner, it is bonded and fixed via a conductive adhesive 6 made of a conductive resin, solder, or the like. The piezoelectric vibrator support 5 is made of a high melting point metal powder such as tungsten or molybdenum as in the case of the metallized wiring layer 4 and has a thick film method similar to that of the metallized wiring 4, that is, the ceramic green for the insulating substrate 1. A metal paste obtained by adding a suitable organic binder and a solvent to a high melting point metal powder such as tungsten or molybdenum and mixing the same on the surface of the sheet is printed twice by employing a conventionally known thick film method such as a screen printing method. And apply it to the insulating substrate 1
Of the metallized wiring layer 4 on the bottom surface of the concave portion of the insulating substrate 1 by firing together with the ceramic green sheet laminate for use.
And is formed so as to be electrically connected to the substrate. In this case, since the piezoelectric vibrator support 5 is formed by the thick film method similarly to the metallized wiring 4, the piezoelectric vibrator support 5 is simultaneously attached when the metallized wiring 4 is formed on the insulating base 1. Can be formed. Further, since the piezoelectric vibrator support 5 is formed by a thick film method such as a screen printing method, the position of the piezoelectric vibrator support 5 becomes extremely accurate. As a result, the piezoelectric vibrator support 5 is placed on the piezoelectric vibrator support 5. The piezoelectric vibrator 3 can be accurately supported. Further, the upper metallized layer 5b of the piezoelectric vibrator support 5 is extended from the lower metallized layer 5a onto the insulating base 1 so as to extend over the lower metallized layer 5a.
a, which is important. As described above, the upper metallization layer 5b is replaced with the lower metallization layer 5b.
a, the area of the upper metallized layer 5b is increased even when the size of the package is small, since it is laminated on the lower metallized layer 5a so as to protrude onto the insulating base 1 from above. can do. As a result, the piezoelectric vibrator 3 can be stably supported on the upper metallized layer 5b. Also, the piezoelectric vibrator support 5
When the piezoelectric vibrator 3 is adhered and supported via the conductive adhesive 6, the conductive adhesive 6 penetrates between the insulating base 1 and the upper metallized layer 5b projecting thereon. As a result, the piezoelectric vibrator 3 can be extremely firmly fixed on the piezoelectric vibrator support base 5 via the conductive adhesive 6. As a result, according to the package for accommodating the piezoelectric vibrator of the present invention, the piezoelectric vibrator 3 can generate accurate vibration. The protrusion width of the upper metallized layer 5b projecting from the lower metallized layer 5a onto the insulating substrate 1 is 5 mm.
When the thickness is less than 0 μm, the area of the upper metallized layer 5 b cannot be made sufficiently large, and it tends to be difficult to stably support the piezoelectric vibrator 3 on the piezoelectric vibrator support 5. On the other hand, if it exceeds 100 μm, the outer peripheral portion of the metal paste for the upper metallized layer 5a hangs down when the metal paste for the upper metallized layer 5b is printed and applied on the metal paste for the lower metallized layer 5a. It tends to be difficult to form the overhang of the upper metallization layer 5b. Therefore, the protrusion width of the upper metallization layer 5b from the lower metallization layer 5a is preferably in the range of 50 to 100 mm. Further, a lid 2 made of a metal such as an iron-nickel-cobalt alloy or an iron-nickel alloy or a ceramic material such as an aluminum oxide sintered body is provided with a brazing material or a resin on the outer peripheral portion of the upper surface of the insulating base 1. The piezoelectric vibrator 3 is hermetically accommodated in a container including the insulating base 1 and the lid 2 through a sealing material made of the same. When the lid 2 is made of, for example, an iron-nickel-cobalt alloy, the cover 2 is formed into a predetermined shape by subjecting a wide-area plate made of an iron-nickel-cobalt alloy to a conventionally known punching process. . When the lid 2 is made of a ceramic material, a ceramic green sheet for the lid 2 is prepared, and the ceramic green sheet is punched into a predetermined shape by a punching die. By firing at a high temperature. Thus, according to the package for accommodating the piezoelectric vibrator of the present invention, the piezoelectric vibrator 3 is mounted on the upper surface of the piezoelectric vibrator support 5 composed of the metallized layer formed in the recess 1a of the insulating base 1. The electrodes of the piezoelectric vibrator 3 and the piezoelectric vibrator support base 5 are electrically connected and fixed via a conductive adhesive 6. Thereafter, a lid is attached to the outer peripheral portion of the upper surface of the insulating base 1. 2 is bonded via a sealing material such as resin or solder to hermetically seal the piezoelectric vibrator 3 in a container formed of the insulating base 1 and the lid 2, thereby providing a piezoelectric vibrating device as a final product. Become. The piezoelectric vibration device is mounted on the external electric circuit board by electrically connecting the metallized wiring 4 led out to the lower surface of the insulating base 1 to the wiring conductor of the external electric circuit board, and the piezoelectric vibrating device accommodated therein. The vibrator 3 is electrically connected to an external electric circuit. According to the package for accommodating the piezoelectric vibrator of the present invention, the piezoelectric vibrator support base has a lower metallized layer formed by a thick film method and an outer peripheral surface on the lower metallized layer. Since the portion is composed of an upper metallized layer laminated so as to protrude onto the insulating base from the lower metallized layer, even if the size of the package is small, the area of the upper metallized layer is small. Can be increased, and as a result, the piezoelectric vibrator can be stably supported on the upper metallized layer. In addition, when the piezoelectric vibrator is bonded and supported on such a piezoelectric vibrator support base via a conductive adhesive, the bonding between the conductive adhesive and the upper metallized layer overhangs the insulating base during bonding. Since the piezoelectric vibrator is penetrated and fitted, the piezoelectric vibrator can be extremely firmly fixed through the conductive adhesive. Therefore, it is possible to generate accurate vibration in the piezoelectric vibrator.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing an example of an embodiment of a package for accommodating a piezoelectric vibrator according to the present invention. FIG. 2 is a sectional view showing a conventional package for storing a piezoelectric vibrator. [Description of Signs] 1 ... Insulating base 2 ... Lid 3 ... Piezoelectric vibrator 4 ... Metalized wiring 5 ... Piezo Transducer support base 5a Lower metallized layer 5b Upper metallized layer

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 41/18 H01L 41/18 101A H03H 9/10 23/12 F

Claims (1)

Claims: 1. A piezoelectric device comprising: an insulating base having a metallized wiring formed by a thick-film method; and a lid, and a piezoelectric member electrically connected to the metallized wiring on an upper surface of the insulating base. A piezoelectric vibrator storage package provided with a vibrator support, wherein the piezoelectric vibrator support has a lower metallized layer formed by a thick film method and an outer peripheral portion on the lower metallized layer. And an upper metallization layer laminated so as to protrude from the lower metallization layer onto the insulating substrate.