JP2003101432A - Wireless communication module and wireless communication equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wireless communication module which is small-sized by reducing an area occupied by chip components on a substrate, and wireless communication equipment using the same. SOLUTION: This equipment is provided with a multilayer substrate 101 and a receiving front end IC 102 packaged on one principal surface of the multilayer substrate 101 and has a low noise amplifier, a mixer, a bias circuit, a matching circuit and an LC filter at least, one part of a receiving system including the low noise amplifier, the mixer and the bias circuit at least is provided in the receiving front end IC 102, and the other part including the LC filter at least is provided in the multilayer substrate 101.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency composite component and a wireless device using the same, and particularly to a wireless communication module used for transmission and reception of a plurality of communication systems operating in different frequency bands, and a wireless communication module using the same. Related to wireless communication equipment.

[0002]

2. Description of the Related Art A sales system for portable terminal devices was introduced in April 1994, and at the same time, a personal digital cellular (PDC) service was started. This PD
The specified frequency of C differs depending on the operator, and currently 8 in Japan.
The 00 MHz band and the 1500 MHz band are specified. In addition, since July 1995, a personal handy phone system (PHS) has been put into service, and a mobile terminal device compatible with a dual band of PDC and PHS has been commercialized, and mobile communication has become popular with explosive momentum.

In recent years, the number of users of mobile phones has increased explosively, and the congestion of users has become a problem particularly in urban areas. In order to solve this problem, there are currently multiple frequency bands, such as 800 MHz band and 1.5 GH.
Development of PDC and the like compatible with the z-band dual band structure is also underway. Due to such circumstances, there is an increasing need for miniaturization and high performance, and the components used therefor are also strongly desired to be small and high performance.

FIG. 9 is a block diagram of a part of a high frequency front end section of a general transmitting / receiving section in a wireless device compatible with two communication systems using high frequencies. The reception system front-end unit includes a high frequency switch 122, a duplexer 123 of the first communication system, a duplexer 124 of the second communication system, and a low noise amplifier 11 of the first communication system.
4, low noise amplifier 117 of second communication system, LC filter 115a of first communication system, LC filter 118a of second communication system, mixer 116 of first communication system, mixer 119 of second communication system , Is provided.

The front end of the transmission system includes an isolator 127 of the first communication system, an isolator 129 of the second communication system, a power amplifier 128 of the first communication system, and a power amplifier 13 of the second communication system.
0, the LC filter 115b of the first communication system and the LC filter 1 of the second communication system that pass the transmission signals up-converted by the mixers (not shown) corresponding to the first and second communication systems, respectively.
18b, and local amplifiers 407a and 407b for amplifying the input from the VCO (not shown) and outputting them to the mixer 119 and the mixer 116, respectively.

The received signal from the antenna 121 is the first
And the low-noise amplifier 114 or 113 through the duplexer 123 or 124 for selectively passing the desired band signal through the high frequency switch 122 of the second communication system.
Is amplified in. Further, the received signal passes through an LC filter 115a or 118a for dropping an adjacent channel, and is down-converted into an IF frequency signal by the mixer 116 or 119 by the input of the local amplifier 407a or 407b. The received signal converted into the IF frequency is demodulated by the demodulation circuit and is converted into the baseband LS.
In I, the digital signal is converted into voice, image data, or the like.

In the transmission system, transmission data such as voice and image is digitized by a baseband LSI, converted into an IQ (composed of in-phase component and quadrature component) signal, and then IF.
After being modulated by the quadrature modulator in the band, it is RF by the mixer
The band is up-converted (a configuration for performing the above operation is not shown), is amplified by the power amplifier 128 or 130 via the LC filter 115b or 118b, and isolators 127 or 129 and duplexers 123 or 124.
Then, the signal is transmitted through the antenna 121 via the high frequency switch 122.

Although not shown, the conventional LC filter 1
15a, 115b, 118a or 118b, low noise amplifiers 114 and 117, mixers 116 and 119, isolators 127 and 129, power amplifiers 128 and 130, and chip elements used for their matching circuits are glass epoxy. It has a structure to be mounted on a substrate (not shown). In the above configuration, the local amplifiers 407a and 407b may be replaced with a single local amplifier, and the output destination may be switched for each operation of each communication system.

[0009]

However, as described above, in a wireless device or the like that operates in a plurality of different frequency bands, an LC filter, a low noise amplifier, a mixer, an isolator, and a power amplifier which are composed of chip parts. Since the local amplifier, the local amplifier, and the matching circuit are each mounted on the glass epoxy board, the increase in the area occupied by the chip components on the board causes an increase in the area of the board, and as a result, a large-sized wireless communication device equipped with the same. There was a problem that it caused the change.

The present invention has been made in view of the above problems, and an object of the present invention is to obtain a small wireless communication module and a wireless communication device using the same by reducing the area occupied by chip components on a substrate. .

[0011]

In order to achieve the above object, the first invention (corresponding to claim 1) of the present invention corresponds to a corresponding RF (Radio) of a plurality of communication systems operating at different frequencies. A wireless communication module of a reception system of a processing unit for processing a frequency signal, comprising a multi-layer laminate and an integrated circuit mounted on one main surface of the multi-layer substrate, wherein the reception system is at least low. A part including a noise amplifier, a mixer, a bias circuit, a matching circuit, a local amplifier and an LC filter, and a part including at least the low noise amplifier, the mixer, the bias circuit and the local amplifier in the reception system in the integrated circuit. Is provided, and another part including at least the LC filter is provided in the multilayer substrate.

The second invention (corresponding to claim 2)
Corresponds to a corresponding RF (Radio Frequency) of a plurality of communication systems operating at different frequencies.
y) A wireless communication module of a transmission system of a processing unit that processes a signal, comprising a multilayer laminate and an integrated circuit mounted on one main surface of the multilayer substrate, and the transmission system includes at least an isolator. , Power amplifier, matching circuit and LC
A filter is provided, a part of the transmission system including at least the isolator and the power amplifier is provided in the integrated circuit, and at least the LC is provided in the multilayer substrate.
The wireless communication module is provided with another part including a filter.

A third aspect of the present invention (corresponding to claim 3)
Corresponds to a corresponding RF (Radio Frequency) of a plurality of communication systems operating at different frequencies.
y) A wireless communication module of a transmission / reception system of a processing unit that processes a signal, comprising a multilayer laminate and an integrated circuit mounted on one main surface of the multilayer substrate, and the transmission / reception system transmits the signal. The side has at least a low noise amplifier, a mixer, a bias circuit, a matching circuit and an LC filter, and the receiving side has at least an isolator, a power amplifier, a matching circuit, a local amplifier and an LC filter, in the integrated circuit. A part including at least the isolator on the transmitting side and the power amplifier, and a part including at least the low noise amplifier on the receiving side, the mixer, the bias circuit, and the local amplifier,
In the wireless communication module, at least another part including the LC filter on the transmission side and the reception side is provided in the multilayer substrate.

A fourth invention (corresponding to claim 4)
Is the wireless communication module according to any one of the first to third aspects of the present invention, wherein all or part of the matching circuit is provided in the multilayer substrate.

A fifth aspect of the present invention (corresponding to claim 5)
Includes a first to third electric wiring layer further provided between the integrated circuit and the multi-layer substrate, in which electric wiring of the reception system, the transmission system, or the transmission / reception system is formed. It is one of the wireless communication modules of the present invention.

A sixth aspect of the present invention (corresponding to claim 6)
Is a BGA (Ball) on the other main surface of the multilayer substrate.
Grid Array) and a part of the matching circuit, the wireless communication module according to any one of the first to third aspects of the present invention.

A seventh aspect of the present invention (corresponding to claim 7)
Is a wireless communication module according to any one of the first to third aspects of the present invention, wherein wiring of a communication system having a high frequency among the plurality of communication systems is shorter than wiring of a communication system having a low frequency.

The eighth invention (corresponding to claim 8)
In the multi-layer substrate, the first wiring in which the local signal is excited and the second wiring in which the reception frequency and / or the transmission frequency in the communication system are excited are
The wireless communication module according to any one of the first to third aspects of the present invention, which is formed in different layers.

The ninth invention (corresponding to claim 9)
In the multi-layer substrate, the first wiring in which the local signal is excited and the second wiring in which the reception frequency and / or the transmission frequency in the communication system are excited are
The first wiring and the second wiring are formed on the same layer.
The wireless communication module according to any one of the first to third aspects of the present invention, in which a third wiring for applying a ground or a bias is formed between the wiring and the wiring.

According to a tenth aspect of the present invention (corresponding to claim 10), the width of the input wiring of the low noise amplifier is larger or thicker than that of other electrical wiring. The wireless communication module according to any one of the third aspect of the present invention.

The eleventh aspect of the present invention (corresponding to claim 11) includes: a baseband section; an IF signal processing section for inputting and outputting an IF signal to and from the baseband section; and an IF signal processing section. A wireless communication device including at least an RF signal processing unit for inputting and outputting an RF signal, and using the wireless communication module according to any one of the first to tenth aspects of the present invention in the RF signal processing unit.

The present invention as described above, as an example thereof,
A low noise amplifier corresponding to the first and second communication systems having different frequency bands in the receiving system of the wireless communication device,
A part of a receiving circuit element such as a mixer and a local amplifier and a matching circuit such as the low noise amplifier and the mixer is provided in the first and second parts.
It is characterized in that it is mounted on the upper surface or the upper and lower surfaces of a multi-layer laminated plate having a built-in LC filter compatible with the communication system of FIG.
Further, in the transmission system, a part of a transmission circuit element such as an isolator and a power amplifier corresponding to the first and second communication systems and a matching circuit of the isolator and power amplifier are provided in the first and second communication systems. It is characterized in that it is mounted on the upper surface or the upper and lower surfaces of a multilayer laminated plate in which a corresponding LC filter and a part of a matching circuit such as the isolator and power amplifier are built.

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 shows a first embodiment of the present invention, which operates in frequency bands different from each other.
And RF of the second communication system (Radio Freq
FIG. 3 shows an example of a schematic view of an RF reception front-end laminated module corresponding to the front end part.

In FIG. 1, reference numeral 101 denotes a multi-layer laminated board, which has a LC filter compatible with the first and second communication systems and a part of a matching circuit such as a low noise amplifier and a mixer. 102 is a reception front-end IC,
It contains a low noise amplifier, mixer, local amplifier and their bias circuits. Reference numeral 103 denotes a passive element such as a capacitor, an inductor and a resistor, which is used for a matching circuit such as a low noise amplifier, a local amplifier and a mixer. 10
4 is an external connection terminal, 105 is a ground terminal, 106 is a ground terminal group composed of a plurality of ground terminals 105, and 107 is a connection terminal of the passive element 103.

FIG. 4 is an example of an equivalent circuit diagram of the RF reception front-end laminated module in FIG.
In the figure, 108 is the receiving system of the first communication system, 10
Reference numeral 9 is a reception system of the second communication system, 110 is an IF matching circuit shared by the first and second communication systems, 111 is a local signal input section shared by the first and second communication systems, and 11
2 is a matching circuit, 113a and 113b are built in the reception front-end IC 102, a bias circuit on the reception system 108 side of the first communication system, 113c and 113d are built in the reception front-end IC 102, and a second communication system Bias circuit on the receiving system 108 side, 114 is built in the receiving front-end IC 102 and is a low noise amplifier compatible with the first communication system, 115 is an LC filter compatible with the first communication system, and 116 is the receiving front-end IC 102. Mixer for the first communication system, 117 for the reception front-end IC 102, a low noise amplifier for the second communication system, 118 for an LC filter for the second communication system, 119 Is built into the reception front-end IC 102, and the second communication system It represents the mixer corresponding to the beam. Further, 406 is a bias circuit 113a, 113.
b, 113c and 113c respectively represent high-pass capacitors, and 407a and 407b respectively represent a local amplifier of the first communication system and a local amplifier of the second communication system. However, similar to the conventional example, in the above configuration, the local amplifiers 407a, 407a,
07b may be replaced with a single local amplifier, and the mixer as the output destination may be switched for each operation of each communication system. The LC filters 115 and 118 are
Either a low-pass filter or a high-pass filter may be used depending on the application.

The external connection terminal 104 shown in FIG.
RF input 401 of receiving system 108 of the first communication system
a, inputs 402a and 403a for applying bias voltage to the bias circuits 113a and 113b, an RF input 401b of the receiving system 109 of the second communication system, inputs 402b and 403b for applying bias voltage to the bias circuits 113c and 113d, respectively. The input 404 for applying a voltage to the IF matching circuit 110 and the I of the IF matching circuit 11
It corresponds to the F output 405, and the ground portion in FIG. 4 corresponds to the ground terminal group 106 shown in FIG.

FIG. 10 is an exploded perspective view showing the layer structure of the multilayer laminate 101 of the RF reception front-end laminated module of FIG. 1, which is a part of the matching circuit 112 and the receiving circuit. A second layer 1002 provided with a surface layer on which the front-end IC 102 is mounted, which is the first layer 1001, and a wiring for a portion where a high frequency is transmitted and a wiring for a portion where a low frequency is transmitted, and a local signal input unit 1
A transmission line and a low noise amplifier 114 connected to
A first wiring layer having a third layer 1003 provided with a transmission wiring serving as an RF input to 117, a third layer 1004 serving as a first ground layer provided with a ground electrode, and LC filters 115 and 118. And a filter forming layer having fifth to thirteenth layers each having an electrode forming a second electrode, and a fourteenth layer 1 serving as a second ground layer provided with a ground electrode.
004 and a fifteenth layer having the same structure as the second layer 1004
The second wiring layer to be the layer 1006 and the external connection terminal 104
And the 16th layer 10 on which the ground terminal group 106 is formed
16 and a back layer.

The first layer 1001 is formed by a glass epoxy substrate, and the second layer 1002 to the 16th layer 1016 are sinter-formed by a ceramic green sheet on which an electrode pattern is formed, and baked together with the first layer 1001. By laminating the second layer 1002 to the 16th layer 1016 which are formed by bonding, the multilayer laminated board 101 is formed, and the chip element and the front end IC which are a part of the matching circuit 112 are formed on the main surface of the surface layer 1001. Implement. The other part of the matching circuit is provided in the reception front-end IC. Further, the first layer 1001 is also formed of a green sheet, and the second layer 1
Sintering molding may be performed simultaneously with the 002 to 16th layers 1016.

Further, FIG. 11 shows another embodiment of the layer structure of the multilayer laminate 101 of the RF reception front-end laminate module of FIG.

11 is different from the configuration shown in FIG. 10 in that any one of low noise amplifiers 131 and 118 and mixers 116 and 119 is used as the first wiring layer instead of the second layer 1002 and the third layer 1003. The second layer 1021 provided with a capacitor which is the matching circuit 112 and a transmission wiring connected to the local signal input unit 111, and the matching circuit 112 of any of the low noise amplifiers 131 and 118 and the mixers 116 and 119. The point is that the second layer 1022 provided with the transmission wiring that serves as an RF input to the certain inductor and the low noise amplifiers 114 and 117 is provided. In the embodiment shown in FIG. 11, in addition to the LC filters 115 and 118, a part of the matching circuit 122 is also incorporated in the multilayer laminate 101.

Next, FIG. 5 shows a case where the RF reception front-end laminated module of FIG. 1 is used as a part of the reception front-end part of a simplified portable telephone which is an example of a wireless device corresponding to two transmission / reception frequencies. Shows an example of a block diagram of
In FIG. 5, reference numeral 125 is a part realized by the front-end laminated module of the receiving system of the present embodiment described above.

As shown in FIG. 1, FIG. 4, FIG. 10 and FIG. 11, among the components constituting the receiving system of the first and second communication systems operating in a plurality of different frequency bands, a low noise amplifier, A reception front-end IC including a mixer, a local amplifier, etc. is arranged on one main surface of the multi-layer laminated board, and LC
By incorporating the filter as a laminated filter and the matching circuit as a capacitor or an inductor electrode in the multilayer laminated plate, the area occupied by the chip components on the substrate is reduced, and the wireless communication device can be further downsized.

(Embodiment 2) FIG. 2 shows a first embodiment of the present invention, which operates in frequency bands different from each other.
And an example of a schematic view of an RF reception front-end laminated module formed by a part of a low noise amplifier, a mixer, a local amplifier, etc. corresponding to the second communication system and matching circuits thereof. Note that the function of the RF front-end laminated module of the present embodiment is the same as that of the first embodiment, and its equivalent circuit diagram is common to that of the first embodiment, so FIG. 4 is used for the description.

In FIG. 2, the same or corresponding parts as those in FIG. 1 are designated by the same reference numerals, and detailed description thereof will be omitted. Further, the multilayer laminated board 200 is mounted on the upper surface of the multilayer laminated board 100, and the reception front-end IC 102 is mounted on the upper surface thereof.

FIG. 12 is an exploded perspective view showing the layer structure of the multi-layer laminate 101 and the multi-layer laminate 20 of the RF reception front-end laminate module of FIG. Corresponding parts are designated by the same reference numerals, and detailed description will be omitted.

The multilayer laminated board 200 includes a first layer 201 for mounting the reception front-end IC 102, a wiring layer having a second layer 202 and a third layer 203 provided with electric wiring, and a multilayer laminated board. A connection terminal 20 for connecting to a connection terminal (not shown) on the first layer 1001 of 101.
5 and the fourth layer 204 is provided.

The second layer 202 to the fourth layer 204 may be formed by sinter-molding with a ceramic green sheet having an electrode pattern formed thereon, but a glass epoxy substrate having an electrode pattern formed thereon is laminated. You may shape by. Also, the first layer 1001 may be formed of a green sheet, and may be sintered and formed simultaneously with the second layer 202 to the fourth layer 204. Further, all layers constituting the multi-layer laminated plate 101 and the multi-layer laminated plate 200 may be made of green sheets and integrally sintered.

As shown in FIG. 2, FIG. 4 and FIG. 12, a low noise amplifier, a mixer, as a RF front end laminated module of the first and second communication system reception systems operating in a plurality of different frequency bands. By arranging the reception front-end IC including the local amplifier and the like on one main surface of the multilayer laminated plate and incorporating the LC filter as a laminated filter in the multilayer laminated plate, the area occupied by the chip components on the substrate is reduced. The size of the wireless communication device can be reduced and the wireless communication device can be further downsized.

Furthermore, by providing another multilayer laminated plate having only the electrical wiring layer of the reception front-end IC built in between the receiving front-end IC and the multilayer laminated plate, a multilayer having an LC filter built-in is provided. It is possible to suppress deterioration of high frequency characteristics inside the laminated plate.

(Third Embodiment) FIG. 3 shows a first embodiment according to the third embodiment of the present invention, which operates in different frequency bands.
And low-noise amplifier compatible with the second communication system, LC
1 shows an RF receiver front-end stacked module formed by filters, mixers, local amplifiers, etc. and some of their matching circuits. Note that the function of the RF front-end laminated module of the present embodiment is the same as that of the first embodiment, and its equivalent circuit diagram is common to that of the first embodiment, so FIG. 4 is used for the description.

In FIG. 3, the same or corresponding parts as those in FIG. 1 are designated by the same reference numerals, and detailed description thereof will be omitted. 1
Reference numeral 20 represents a BGA for connecting to the external connection terminal 104 and for connecting to an external substrate.

As shown in FIG. 3, according to the present embodiment, in addition to the effects of the first and second embodiments, since the external connection with the external substrate is made by the BGA, the lower surface of the multilayer laminated plate 101 is Also makes it possible to implement part of the matching circuit 122.

As a result, the reception front-end IC 10
The area occupied by the chip components on the substrate on which the 2 is mounted is reduced, and the wireless communication device can be further downsized.

(Embodiment 4) FIG. 6 shows a first embodiment of the present invention which operates in frequency bands different from each other according to Embodiment 4 of the present invention.
And an example of the layer structure of the multilayer laminate of the RF front-end laminate module corresponding to the receiving system of the second communication system. Note that the function of the RF front-end laminated module of the present embodiment is the same as that of the first embodiment, and its equivalent circuit diagram is common to that of the first embodiment, so FIG. 4 is used for the description.

In FIG. 6, 131 is an internal connection via and 13
2 is the input wiring layer of the low noise amplifier 114 of the first communication system, and 133 is the low noise amplifier 11 of the second communication system.
7 is an input wiring layer, and 134 is bias circuits 113a and 11
Wiring layers for input to 3b, 113c, 113c, 1
Reference numeral 35 represents a local input wiring layer.

Here, the layer structure of the multilayer laminated plate 101 shown in FIG. 6 will be briefly described. On the surface layer (first layer 1601) of the multilayer laminate 101, the low noise amplifiers 114 and 117 of the reception systems 108 and 111 corresponding to the first and second communication systems, the mixers 116 and 119, and reception system elements such as local amplifiers. And some of the mounting terminals of the matching circuit 112 for those elements are formed, and the wiring layer (second layer 1602,
In the third layer 1603 and the fifteenth layer 1615), the electrical connection wiring of the receiving system element is formed.

In the second layer 1602, the low noise amplifier 11
The input wirings 132 and 133 of 4 and 117 are formed thicker or thicker than the other wirings, and as a result, the reduction of loss is realized, and the effect of reducing the deterioration of the noise characteristics inside the multilayer laminate 101 is obtained. .

In the second layer 1602, a wiring for exciting the RF signal and a wiring for exciting the local (LO) signal are formed, and the input wiring 132 of the low noise amplifiers 114 and 117 for exciting the RF signal is formed. And 133
And a wiring 135 connected to the local signal input unit 111 and for exciting a local signal, a wiring 1 for biasing.
34 are formed. By providing the bias wiring 134, the effect of improving the isolation between the local signal wiring and the RF signal wiring can be obtained. At this time, instead of the bias wiring, a ground wiring may be provided between the local signal wiring 135 and the RF signal wirings 132 and 133.

Further, the second layer 1602 and the third layer which are wiring layers
In the layer 1603 and the fifteenth layer 1615, the second communication system with a high frequency (in the case of the example shown in FIG.
The frequency used in the communication system of the first communication system is higher than the frequency used in the first communication system). The wiring 132 of the reception system 109 has a first communication system whose frequency is lower than that of the second communication system. It is formed to be shorter and less than the wiring 133 of the receiving system 108. The loss is reduced by making the high frequency wiring shorter and shorter than the low frequency wiring.

A ground layer is formed on the fourth layer 1604 and the fourteenth layer 1614, and these are second layers which are wiring layers.
The layer 1602, the third layer 1603, and the fifteenth layer 1615 are the fifth layer.
It is formed so as not to affect the characteristics of the LC filters 115 and 118 formed in the layers 1605 to 1313. Further, in the center of the sixteenth layer 1616, which is an external connection terminal layer, a ground terminal group 106 configured by providing a plurality of ground terminals 105 for connecting to an external ground is provided. By providing the ground terminal group 106, the ground of the multilayer laminated board 101 can be strengthened, and the effect of improving the isolation between the wiring layers can be obtained.

Next, FIG. 7 shows another example of the structure of the multilayer laminated plate 101. In the configuration example shown in FIG. 7, the first layer 1701
~ 16th layer 1717 is the first layer 1 in FIG.
It has a function equivalent to that of the 601st to 16th layers 1617, and provides the same effect as that of the multilayer laminate of FIG. However, according to the third embodiment, the external connection terminal layer 1717 is similar to the matching circuit 122.
Is different in that a connection terminal 107 capable of arranging is provided.

In this configuration example, the input wiring 13 to the low noise amplifiers 114 and 117 in which the RF signal formed in the same layer (second layer 1602) in FIG. 6 is excited.
2, 133 are formed on the second layer 1702, and the transmission wiring 135 connected to the local signal input unit 111 is the third layer 1
703, ie in separate layers. Since the wiring for exciting the RF signal and the wiring for exciting the local signal are formed in different layers, the effect of improving the isolation between the wiring for the RF signal and the wiring for the local signal can be obtained.

(Embodiment 5) FIGS. 8A, 8B and 8C.
And an example of a schematic view of an RF transmission front-end laminated module corresponding to the transmission systems of the first and second communication systems of different frequency bands operating in different frequency bands according to the fifth embodiment of the present invention. Show.

FIG. 5 shows the RF of FIGS. 8 (a) (b) (c).
FIG. 126 is an example of a block diagram in the case where the transmission front-end laminated module is used as a part of the reception front-end portion of a simplified mobile phone which is an example of a wireless device compatible with two transmission / reception frequencies, and 126 is the present embodiment. 2 shows a transmission system laminated module realized by the RF front end laminated module of FIG.

In FIG. 8A, 136 is a transmission system isolator 127 and 129 corresponding to the first and second communication systems shown in FIG. 5, and power amplifiers 128 and 1.
The transmission system elements such as 30 are shown.

The internal structure of the multilayer laminated plate 101 is similar to that of the RF reception front-end laminated module shown in FIG. 10 or FIG. 11, and LC filters 115 and 118 as laminated filters and the transmission system element 1 described above.
A part of the matching circuit 36 (not shown in FIG. 5) is incorporated.

As shown in FIG. 8A, among the components constituting the transmission system of the first and second communication systems operating in a plurality of different frequency bands, a transmission system element including a power amplifier, an isolator, etc. Is placed on one main surface of the multilayer laminate,
By incorporating the LC filter as a laminated filter and the matching circuit as a capacitor or an inductor electrode in the multilayer laminated plate, the area occupied by the chip components on the substrate is reduced, and the wireless communication device can be further miniaturized. .

Further, FIG. 8B shows a case where the transmission system element 136 is mounted on the multilayer laminated plates 101 and 200 of the second embodiment, and the internal configuration of the multilayer laminated plate 101 is the RF reception front shown in FIG. Similar to the end laminated module, with LC filters 115 and 1 as laminated filters.
18, and a part (not shown in FIG. 5) of the matching circuit of the transmission system element 136 described above is incorporated, and the electrical wiring layer of the transmission system element 136 is incorporated in the multilayer laminate 200. ing.

As a result, in addition to the effect similar to that of FIG. 8A, it is possible to obtain the effect of suppressing the deterioration of the high-frequency characteristics inside the multilayer laminate 101.

Further, FIG. 8C shows a transmission system element 136 mounted on the multilayer laminate 101 of the third embodiment.
In addition, the BGA 120 externally connects the multilayer laminated plate 101 and the glass epoxy substrate to each other, and
By mounting a part of the matching circuit of the transmission system element on the lower surface of the device, the area occupied by the chip components on the glass epoxy substrate is reduced, and the wireless communication device can be further downsized. In the fifth embodiment described above, the LC filter may be any filter such as a high pass filter, a band pass filter, a low pass filter, etc. depending on the application.

In each of the above embodiments, RF
The reception front-end laminated module corresponds to the wireless communication module of the first invention, and the RF transmission front-end laminated module corresponds to the wireless communication module of the second invention.

Although the RF front end portion of one of the reception system and the transmission system of the communication system is described as an RF transmission or reception front end laminated module in each of the above-described embodiments, the present invention is described below. The transmission system and the reception system are configured as a single transmission / reception system in the same integrated circuit, and LC filters used for the transmission system and the reception system are provided in the multilayer laminated plate, or the LC filter and the transmission system and the reception system are combined. The control circuit used may be realized as a wireless communication module of a transmission / reception system, which is provided in a multilayer laminate.

The reception front-end IC 102 and the transmission system element 136 correspond to the integrated circuit of the present invention.

The matching circuit 112 and the bypass capacitor 406 correspond to the matching circuit of the present invention.

Further, in each of the above-described embodiments, the description has been made assuming that the first and second communication systems operate at frequencies different from each other, but the present invention is applicable to three or more communication systems. You may implement.

Further, according to the present invention, a baseband section, an IF signal processing section for inputting / outputting a signal to / from the baseband section, and an RF for inputting / outputting a signal to / from the IF signal processing section.
It may be realized as a wireless communication device including at least a signal processing unit and using the wireless communication module of the present invention in the RF signal processing unit.

The present invention as described above is an example of R.
According to the F reception front-end laminated module, reception system elements such as low noise amplifiers, mixers and local amplifiers corresponding to the first and second communication systems in different frequency bands and matching of low noise amplifiers, mixers, local amplifiers, etc. Part of the circuit is L corresponding to the first and second communication systems.
By mounting the C filter and a part of the matching circuit such as the low noise amplifier and the mixer on the upper surface of the multilayer laminate, the area occupied by the chip components on the substrate is reduced, and the wireless communication device is further miniaturized. Is possible.

Further, according to the RF receiving front-end laminated module as an example of the present invention, the receiving system element and a part of its matching circuit are mounted on the upper surface of the multilayer laminated board to occupy the board. The area occupied by the chip parts is reduced, and the wireless communication device can be further downsized. Further, by mounting on the multi-layer laminate a multi-layer laminate having only electrical wiring layers for rewiring so that high-frequency characteristics are not deteriorated as much as possible inside the multi-layer laminate having the receiving element mounted on the upper surface. It is possible to suppress deterioration of high-frequency characteristics in a multi-layer laminated board in which a part of a matching circuit such as the LC filter and the low noise amplifier and mixer corresponding to the first and second communication systems is incorporated.

According to the RF receiving front-end laminated module, which is one example of the present invention, the receiving system element and a part of its matching circuit are mounted on the upper surface of the multilayer laminated board, and a substrate is formed by BGA. By externally connecting the chip, it is possible to mount a part of the receiving system element and its matching circuit on the lower surface of the multilayer laminated board, thereby reducing the area occupied by the chip component on the substrate, and thereby enabling wireless communication. Further downsizing of the device becomes possible.

Further, according to the RF receiving front-end laminated module as an example of the present invention, loss is reduced by making the wiring layer having a high frequency shorter and the wiring layer having a lower frequency inside the multilayer laminated board. The effect is obtained.

Further, according to the RF receiving front-end laminated module as an example of the present invention, a bias line is formed between the wiring in which the RF signal is excited and the wiring in which the LO signal is excited in the multilayer laminated board. Form or R
By forming the wiring layer in which the F signal is excited and the wiring layer in which the LO signal is excited in different layers, the LO wiring layer and the R wiring layer are formed.
The effect that the isolation of the F wiring layer is improved can be obtained.

According to the RF receiving front-end laminated module as an example of the present invention, the input wiring of the low noise amplifiers of the first and second communication systems is thickened or thickened in the multilayer laminated board. By forming it, loss can be reduced, and the effect of reducing the deterioration of noise characteristics inside the multilayer laminated plate can be obtained.

Further, according to the RF receiving front-end laminated module as an example of the present invention, by providing a ground terminal group for connecting to an external ground at the center of the external connection terminal layer in the multilayer laminated board, It is possible to obtain an effect that the ground in the multilayer laminated board can be strengthened and the isolation between wiring layers inside the multilayer laminated board is improved.

Further, according to the RF transmission front-end laminated module as an example of the present invention, a part of the LC filter corresponding to the first and second communication systems and the matching circuit such as the isolator and the power amplifier. The area occupied by the chip components on the board by mounting a part of the matching circuit such as the isolator and the transmission system element including the power amplifier, the isolator, and the power amplifier on the top and bottom surfaces of the multi-layer laminate Is reduced, and the wireless device can be further downsized.

[0076]

As is apparent from the above description, according to the present invention, it is possible to obtain a compact wireless communication module by reducing the area occupied by chip components on the substrate.

[Brief description of drawings]

FIG. 1 is a schematic view of an RF reception front-end laminated module according to a first embodiment of the present invention.

FIG. 2 is a schematic view of an RF reception front-end laminated module according to Embodiment 2 of the present invention.

FIG. 3 is a schematic view of an RF reception front-end laminated module according to a third embodiment of the present invention.

FIG. 4 is an equivalent circuit of the RF reception front-end laminated module according to the first to third embodiments of the present invention.

FIG. 5 is a part of a block diagram of a wireless device corresponding to two different frequency bands when the RF reception front-end laminated module according to the first to third embodiments of the present invention is used.

FIG. 6 is a diagram showing a layer structure of a multilayer laminate of an RF receiver front-end laminate module according to a fourth embodiment of the present invention.

FIG. 7 is a diagram showing another configuration example of the layer structure of the multilayer laminate of the RF reception front-end laminate module according to the fourth embodiment of the present invention.

FIG. 8A is a schematic view of an RF transmission front-end laminated module according to a fifth embodiment of the present invention. (B) A schematic view of an RF transmission front-end laminated module according to a fifth embodiment of the present invention. (C) A schematic view of an RF transmission front-end laminated module according to a fifth embodiment of the present invention.

FIG. 9 is a part of a general block diagram of a wireless device supporting two different frequency bands.

FIG. 10 is a diagram showing an internal configuration of an RF reception front-end laminated module according to the first embodiment of the present invention.

FIG. 11 is a diagram showing another configuration example of the internal configuration of the RF reception front-end laminated module according to the first embodiment of the present invention.

FIG. 12 is a diagram showing an internal configuration of the RF reception front-end laminated module according to the first embodiment of the present invention.

[Explanation of symbols]

101, 200 Multilayer Laminated Plate 102 Reception Front End IC 103 Passive Element 104 External Connection Terminal 105 Ground Terminal 106 Ground Terminal Group 107 Passive Element Connection Terminal 108 First Communication System Reception System 109 Second Communication System Reception System 110 1st and 2nd communication system shared IF matching circuit 111 1st and 2nd communication system shared local signal input section 112 Matching circuit 113 Bias circuit 114 Low noise amplifier 115 of 1st communication system 115 of 1st communication system LC filter 116 Mixer 117 of first communication system Low noise amplifier 118 of second communication system LC filter 119 of second communication system 120 Mixer 120 of second communication system BGA 121 Antenna 122 High frequency switch 123 First communication system The sharing device 124 Communication system duplexer 125 reception system layered module unit 126 transmission system layered module unit 127 first communication system isolator 128 first communication system power amplifier 129 second communication system isolator 130 second communication system Power amplifier 131 Internal connection via 132 Low noise amplifier input wiring 133 of the first communication system Input wiring 133 of low noise amplifier of the second communication system 134 Bias wiring layer 135 Local input wiring layer 136 Transmission system element

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Tsutomu Matsumura             55-12 Ohsumihama, Kyotanabe City, Kyoto Prefecture Matsushita Nittoden             Ware corporation F term (reference) 5E346 AA12 AA13 AA15 BB02 BB04                       CC09 CC16 EE01 EE21 HH22                 5K011 AA16 BA04 JA01 KA00

Claims (12)

[Claims] 1. Corresponding RF (Radio Freq) of a plurality of communication systems operating at mutually different frequencies.
wireless communication module of a reception system of a processing unit that processes a signal, comprising: a multilayer laminate and an integrated circuit mounted on one main surface of the multilayer substrate, wherein the reception system is at least A part including a noise amplifier, a mixer, a bias circuit, a matching circuit, a local amplifier and an LC filter, and a part including at least the low noise amplifier of the reception system, the mixer, the bias circuit and the local amplifier in the integrated circuit. Is provided, and the other part including at least the LC filter is provided in the multilayer substrate. 2. Corresponding RF (Radio Freq) of a plurality of communication systems operating at mutually different frequencies.
wireless communication module of a transmission system of a processing unit that processes a signal, comprising: a multilayer laminated board; and an integrated circuit mounted on one main surface of the multilayer substrate, wherein the transmission system includes at least an isolator. A power amplifier, a matching circuit, and an LC filter, a part including at least the isolator and the power amplifier of the transmission system is provided in the integrated circuit, and at least the LC filter is provided in the multilayer substrate. A wireless communication module provided with other parts including. 3. Corresponding RF (Radio Freq) of a plurality of communication systems operating at mutually different frequencies.
wireless communication module of a transmission / reception system of a processing unit that processes a signal, comprising: a multi-layer laminate and an integrated circuit mounted on one main surface of the multi-layer substrate, wherein the transmission / reception system transmits the signal. The side has at least a low noise amplifier, a mixer, a bias circuit, a matching circuit and an LC filter, and the receiving side has at least an isolator, a power amplifier, a matching circuit, a local amplifier and an LC filter, in the integrated circuit A part including at least the isolator on the transmitting side and the power amplifier, and a part including at least the low noise amplifier on the receiving side, the mixer, the bias circuit and the local amplifier, A wireless communication module in which at least another part including the LC filter on the transmitting side and the receiving side is provided in the substrate. Jules. 4. The wireless communication module according to claim 1, wherein all or part of the matching circuit is provided in the multilayer substrate. 5. The electrical wiring layer, which is provided between the integrated circuit and the multi-layer substrate and has electrical wiring for the receiving system, the transmitting system, or the transmitting / receiving system formed thereon. The wireless communication module according to any one of 1 to 3. 6. A BGA is provided on the other main surface of the multilayer substrate.
The wireless communication module according to claim 1, wherein (Ball Grid Array) and a part of the matching circuit are provided. 7. The wireless communication module according to claim 1, wherein wiring of a communication system having a high frequency is shorter than wiring of a communication system having a low frequency among the plurality of communication systems. 8. In the multi-layer substrate, a first wiring for exciting a local signal and a second wiring for exciting a reception frequency and / or a transmission frequency in the communication system are formed in different layers. The wireless communication module according to any one of claims 1 to 3, 9. In the multi-layer substrate, a first wiring for exciting a local signal and a second wiring for exciting a reception frequency and / or a transmission frequency in the communication system are formed in the same layer. The wireless communication module according to any one of claims 1 to 3, wherein a third wiring for applying a ground or a bias is formed between the first wiring and the second wiring. 10. The wireless communication module according to claim 1, wherein the input wiring of the low noise amplifier has a width larger or thicker than other electrical wiring. 11. The wireless communication module according to claim 1, wherein a terminal for connecting to an external ground is provided at the center of the other main surface of the multilayer laminated plate. 12. A baseband section and an IF for inputting and outputting an IF signal to and from the baseband section.
A signal processing unit and an RF for inputting and outputting an RF signal to and from the IF signal processing unit
A wireless communication device comprising at least a signal processing unit, wherein the RF signal processing unit uses the wireless communication module according to any one of claims 1 to 10.