JP2004056745A - Compposite high frequency component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To miniaturize a high frequency component in which baluns (balanced to unbalance transducer) and filters are integrated. <P>SOLUTION: The high frequency component is provided with baluns 2a and 2b for mutually converting balanced line signals and unbalanced line signals and filters 3a and 3b electrically connected to the baluns 2a and 2b for passing or attenuating predetermined frequency components. Then, electrode layers 15a-22a, 25a, 41, 42, and 43 comprising electrode patterns of the baluns 2a and 2b, the filters 3a and 3b and the like and dielectric layers 30-39 are laminated and integrated. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to: The present invention relates to a composite high-frequency component used for a wireless circuit such as a mobile phone terminal and a communication device using the same.
[0002]
[Prior art]
Mobile phone terminals are rapidly becoming smaller with higher performance. In order to reduce the size of mobile phone terminals, miniaturization of each high-frequency component used in a wireless circuit has been promoted.
[0003]
As a conventional high-frequency component used in a wireless circuit, there is a balanced to unbalanced transducer (hereinafter abbreviated as balun). A balun is a device that has a function of converting an unbalanced line signal into a balanced line signal and a function of converting a balanced line signal into an unbalanced line signal. Hereinafter, an example of the configuration of the balun will be described. FIG. 13 shows a chip type transformer which is an example of a balun.
[0004]
The chip type transformer has a structure in which dielectric substrates 54a to 54e are stacked. Shield electrode layers 56 and 70 are formed on one main surface of dielectric substrates 54a and 54e. Connection electrode layer 60 is formed on one main surface of dielectric substrate 54b. A first strip line 62 is formed on one main surface of dielectric substrate 54c. The first strip line 62 includes spiral first and second portions 64a and 64b. Spiral second and third strip lines 66 and 68 are formed on one main surface of the dielectric substrate 54d. The second and third strip lines 66 and 68 are electromagnetically coupled to the portions 64a and 64b of the first strip line 62, respectively.
[0005]
As described above, the size of the conventional balun including the chip type transformer shown in FIG. 13 has been reduced. Further, filters having a function of selectively passing or attenuating only a predetermined frequency with respect to a high-frequency signal to be supplied to the balun or a high-frequency signal output from the balun have been reduced in size.
[0006]
[Problems to be solved by the invention]
However, the conventional balun and filter are mounted on separate circuit boards, respectively. Such a configuration of the balun and the filter causes an increase in the number of components, which is an adverse effect on cost reduction. Further, such a configuration not only makes it difficult to reduce the size of a wireless circuit in which the balun and the filter are incorporated, but also makes it difficult to reduce the size of communication devices such as a mobile phone terminal in which the wireless circuit is incorporated.
[0007]
Therefore, an object of the present invention is to reduce the size of a high-frequency component in which a balun and a filter are incorporated, and further to reduce the size of a communication device such as a mobile phone terminal in which the high-frequency component is incorporated. .
[0008]
[Means for Solving the Problems]
The present invention is summarized as follows.
[0009]
In order to solve the above-mentioned problems, a composite high-frequency component according to the present invention includes a balun for mutually converting a balanced line signal and an unbalanced line signal, and a predetermined frequency component that is electrically connected to the balun and passes or attenuates. A composite high-frequency component comprising a filter for causing In such a composite high-frequency component, the present invention includes an electrode layer and a dielectric layer that constitute the electrode pattern of the balun or the filter, and the dielectric layer and the electrode layer are laminated and integrated.
[0010]
If a communication device is configured with such a composite high-frequency component, a communication device having excellent characteristics and having a reduced size can be obtained.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, details of the present invention will be described based on embodiments shown in the drawings.
[0012]
(First Embodiment)
FIG. 1 shows composite high-frequency components 1a and 1b according to a first embodiment of the present invention and a communication device 4 using the same. The communication device 4 is a mobile phone terminal, and includes a baseband unit 5, an oscillation unit 6, a frequency conversion unit 7, a composite high-frequency component 1a, a power amplifier 8, an antenna duplexer 9, and an antenna 10. , A low-noise amplifier 11, a composite high-frequency component 1b, a frequency converter 12, and a filter 13.
[0013]
The composite high-frequency component 1a includes a filter 3a and a balun 2a. The composite high-frequency component 1a is a component in which the filter 3a and the balun 2a are integrated in a laminated structure. Similarly, the composite high-frequency component 1b includes a filter 3b and a balun 2b. The composite high-frequency component 1b is a component in which the filter 3b and the balun 2b are integrated in a laminated structure.
[0014]
The baseband unit 5 modulates a baseband signal during transmission and outputs the modulated baseband signal, while demodulating a modulated wave into a baseband signal during reception.
[0015]
The frequency converter 7 generates a transmission signal by frequency-converting the baseband modulation signal.
[0016]
The balun 2a converts a transmission signal output from the frequency conversion unit 7 as a balanced line signal into an unbalanced line signal.
[0017]
The filter 3a reduces unnecessary frequency components in the transmission signal converted into the unbalanced line signal by the balun 2a.
[0018]
The power amplifier 8 amplifies the transmission signal from which unnecessary frequency components have been reduced by the balun 2a.
[0019]
Antenna duplexer 9 separates a transmission signal and a reception signal.
[0020]
The antenna 10 transmits a transmission signal as a transmission wave, and receives a reception wave as a reception signal.
[0021]
The oscillating unit 6 oscillates a high-frequency signal used in the frequency conversion unit 7 to perform frequency conversion of the modulation signal into a transmission signal during transmission. On the other hand, at the time of reception, the oscillating unit 6 oscillates a high-frequency signal used in the frequency conversion unit 12 to convert a received signal into a frequency suitable for output to the baseband unit 5.
[0022]
The low noise amplifier 11 amplifies the received signal with low noise.
[0023]
The filter 3b reduces unnecessary frequency components from the amplified reception signal output from the low noise amplifier 11.
[0024]
The balun 2b converts the amplified reception signal output from the filter 3b as an unbalanced line signal into a balanced line signal.
[0025]
The frequency converter 12 converts the balanced line signal output from the balun 2b into a frequency suitable for output to the baseband unit 5.
[0026]
The filter 13 reduces unnecessary frequency components from the signal whose frequency has been converted by the frequency converter 12.
[0027]
Hereinafter, the operation of the communication device 4 will be described.
[0028]
First, the transmission operation will be described. The baseband unit 5 modulates a baseband signal, which is an audio signal input from a microphone or the like, and outputs a modulated signal. The frequency conversion unit 7 converts the frequency of the modulated signal into a transmission signal by mixing the modulated signal modulated by the baseband unit 5 with the carrier signal input from the oscillation unit 6.
[0029]
The baseband unit 5, the frequency conversion unit 7, and the oscillation unit 6 function as a balanced line. Therefore, the transmission signal output from the frequency converter 7 is a balanced line signal. The balun 2a converts the transmission signal output from the frequency converter 7 into an unbalanced line signal. The filter 3a reduces unnecessary frequency components of the transmission signal. Power amplifier 8 amplifies the output signal of filter 3a and outputs it as a transmission signal. The antenna duplexer 9 guides a transmission signal to the antenna 10 and causes the antenna 10 to output the transmission signal as a transmission wave.
[0030]
The filter 3a, the power amplifier 8, the antenna duplexer 9, and the antenna 10 function as an unbalanced line.
[0031]
Next, the receiving operation will be described. The antenna 10 receives a reception wave. The antenna duplexer 9 guides the received signal received by the antenna 10 to the low-noise amplifier 11 on the receiving side. The low noise amplifier 11 amplifies the received signal. The filter 3 b reduces unnecessary frequency component signals from the output signal of the low noise amplifier 11.
[0032]
The antenna 10, the antenna duplexer 9, the low noise amplifier 11, and the filter 3b function as an unbalanced line. Therefore, the signal output from the filter 3b is an unbalanced line signal. The balun 2b converts a signal output from the filter 3b into a balanced line signal. The frequency conversion unit 12 mixes the carrier for frequency conversion supplied from the oscillation unit 6 with the output signal output from the balun 2 b and converts it into a frequency signal of the baseband unit 5. The filter 13 reduces unnecessary frequency components of the frequency-converted signal. The baseband unit 5 demodulates the output signal of the filter 13. The demodulated signal is output as sound from a speaker or the like (not shown). Note that the oscillation unit 6, the frequency conversion unit 12, the filter 13, and the baseband unit 5 function as a balanced line.
[0033]
Hereinafter, the composite high-frequency components 1a and 1b incorporated in the communication device 4 will be described.
[0034]
FIG. 2 shows an equivalent circuit of the composite high-frequency components 1a and 1b. In the equivalent circuit of FIG. 2, the filters 3 a and 3 b include an unbalanced terminal 14, input / output coupling capacitors 15 and 17, interstage coupling capacitors 16, and resonators 18 and 19.
[0035]
Each of the baluns 2a and 2b includes a first transmission line 20, a second transmission line 21, a third transmission line electrode layer 22, balanced terminals 23 and 24, and a coupling capacitance 25.
[0036]
One end face electrode of the input / output coupling capacitor 15 is connected to the unbalanced terminal 14. The other end face electrode of the input / output coupling capacitance 15 is connected to one end face electrode of the interstage coupling capacitance 16. The other end surface electrode of the inter-stage coupling capacitance 16 is connected to one end surface electrode of the input / output coupling capacitance 17. Thus, the input / output coupling capacitance 15, the inter-stage coupling capacitance 16, and the input / output coupling capacitance 17 are connected in series to the unbalanced terminal 14 in this order.
[0037]
The other end face electrode of the input / output coupling capacitance 15 and one end face electrode of the interstage coupling capacitance 16 are connected to the resonator 18. The other end surface electrode of the interstage coupling capacitance 15 and one end surface electrode of the input / output coupling capacitance 17 are connected to the resonator 19.
[0038]
The other end face electrode of the input / output coupling capacitor 17 is connected to one end of the first transmission line 20. The other end of the first transmission line 20 is connected to one end face electrode of the coupling capacitance 25. The other end face electrode of the coupling capacitor 25 is grounded.
[0039]
The balanced terminal 23 is connected to one end of the second transmission line 21. The other end of the second transmission line 21 is grounded. The balanced terminal 24 is connected to one end of the third transmission line 22. The other end of the third transmission line 22 is grounded.
[0040]
The filters 3a and 3b may be notch filters, low-pass filters, or high-pass filters. Further, as the circuit configuration of the baluns 2a and 2b, other circuit configurations other than those described above may be used.
[0041]
The composite high-frequency components 1a and 1b may not have the coupling capacitance 25. That is, FIG. 3 shows an equivalent circuit of such a composite high-frequency component 1a, 1b. As is clear from FIG. 3, the other end of the first transmission line 20 is open because the coupling capacitance 25 is not connected.
[0042]
FIG. 4 is an exploded perspective view of the composite high-frequency components 1a and 1b. As shown in FIG. 4, the composite high-frequency component 1a, 1b includes a plurality of dielectric layers 30 to 39 and electrode layers 15a to 22a, 25a, 41 to 43 that are sequentially stacked. Each of the dielectric layers 30 to 39 has a rectangular shape of 3.2 mm × 2.5 mm × 1.3 mm. Each of the dielectric layers 30 to 39 has a relative dielectric constant ε _r = 58 Bi-Ca-Nb-O-based material. The electrode layers 15a to 22a, 25a, 41 to 43 are made of a material containing silver or copper as a main component. The electrode layers 15a to 22a, 25a, 41 to 43 are formed on the dielectric layers 30 to 39 by a method such as printing.
[0043]
The laminate composed of the dielectric layers 30 to 39 has a cubic shape. End electrodes 44, 45 and end electrodes 14a, 23a, 24a, 40 are formed on the side surfaces of the laminate.
[0044]
The laminate has a pair of side surfaces facing each other (hereinafter, referred to as a pair of opposed side surfaces). The end face electrode 44 and the end face electrode 45 are provided on each of the side faces forming one of the pair of opposed side faces of the laminate. The end electrodes 44 and 45 are connected to a ground terminal (not shown). The end face electrodes 14a, 23a, 24a, and 40 are provided on the other pair of opposite side surfaces of the laminate. Specifically, the end face electrodes 14a and 24a are provided on one of the side surfaces forming the other pair of the opposite side surfaces. The end surface electrodes 23a and 40 are provided on the other side surface forming the other pair of the opposite side surfaces.
[0045]
First to third shield electrode layers 41, 42, 43 are formed on the upper surfaces of the dielectric layers 30, 34, 38, respectively. The first to third shield electrode layers 41, 42, 43 are connected to end face electrodes 44, 45, respectively.
[0046]
On the upper surface of the dielectric layer 31, a second transmission line electrode layer 21a and a coupling capacitance electrode layer 25a are formed. One end of the second transmission line electrode layer 21a is connected to the end face electrode 23a. The other end of the second transmission line electrode layer 21a is connected to the end face electrode 45. The coupling capacitance electrode layer 25a is connected to the end face electrode 45.
[0047]
The first transmission line electrode layer 20a is formed on the upper surface of the dielectric layer 32. One end of the first transmission line electrode layer 20a is connected to the end face electrode 40. The other end of the first transmission line electrode layer 20a is open.
[0048]
The third transmission line electrode layer 22a is formed on the upper surface of the dielectric layer 33. One end of the third transmission line electrode layer 22a is connected to the end face electrode 24a. The other end of the third transmission line electrode layer 22a is connected to the end face electrode 45.
[0049]
On the upper surface of the dielectric layer 35, input / output coupling capacitance electrode layers 15a and 17a are formed. One end of the input / output coupling capacitance electrode layer 15a is connected to the end face electrode 14a. One end of the input / output coupling capacitance electrode layer 17 a is connected to the end face electrode 40.
[0050]
The resonator electrode layers 18a and 19a are formed on the upper surface of the dielectric layer 36. One end of each of the resonator electrode layers 18a and 19a is connected to an end face electrode 44.
[0051]
The inter-stage coupling capacitance electrode layer 16a is formed on the upper surface of the dielectric layer 37.
[0052]
Next, the operation of the composite high frequency components 1a and 1b will be described.
[0053]
The portions of the dielectric layers 35 to 37 function as the filter 3a or the filter 3b in FIG. That is, the end face electrode 14a functions as the unbalanced terminal 14. The input / output coupling capacitance electrode layer 15a connected to the end face electrode 14a functions as one capacitance electrode of the input / output coupling capacitance 15. The input / output coupling capacitance 15 is formed by capacitive coupling between the input / output capacitance electrode layer 15a and the resonator electrode layer 18a.
[0054]
The resonator electrode layers 18a and 19a function as resonators 18 and 19, respectively. The resonator electrode layers 18a and 19a are formed on the dielectric layer 36 close to each other. As a result, the resonator electrode layer 18a and the resonator electrode layer 19a are electromagnetically coupled to each other.
[0055]
The inter-stage coupling capacitance electrode layer 16a is capacitively coupled to the resonator electrode layer 18a and the resonator electrode layer 19a, respectively. Thereby, the inter-stage coupling capacitance 16 is formed. The input / output capacitance electrode layer 17a is capacitively coupled to the resonator electrode layer 19a. Thereby, the input / output coupling capacitance 17 is formed.
[0056]
Thus, the laminated portion of the dielectric layers 35 to 37 functions as a two-stage bandpass filter.
[0057]
The stacked portions of the dielectric layers 31 to 33 function as the baluns 2a and 2b in FIG. That is, the first transmission line electrode layer 20a, the second transmission line electrode layer 21a, and the third transmission line electrode layer 22a are respectively composed of the first transmission line 20, the second transmission line 21, and the third transmission line. Functions as 22.
[0058]
The end face electrode 23a connected to one end of the second transmission line electrode layer 21a functions as one balanced terminal 23. The end face electrode 24a connected to one end of the third transmission line electrode layer 22a functions as the other balanced terminal 24. The coupling capacitance electrode layer 25a is capacitively coupled to the other end of the first transmission line electrode layer 20a. Thereby, the coupling capacitance 25 is formed. The second transmission line electrode layer 21a and the third transmission line electrode layer 22a are respectively electromagnetically coupled to the first transmission line electrode layer 20a.
[0059]
The second transmission line electrode layer 21a is formed on the dielectric layer 31. The third transmission line electrode layer 22a is formed on the dielectric layer 33. Forming the second transmission line electrode layer 21a and the third transmission line electrode layer 22a on different dielectric layers 31 and 33 has the following advantages. Unnecessary electromagnetic field coupling between the second transmission line electrode layer 21a and the third transmission line electrode layer 22a is suppressed. This prevents the characteristics of the baluns 2a and 2b from deteriorating due to unnecessary electromagnetic field coupling.
[0060]
Further, by providing the coupling capacitance electrode layer 25A, it is possible to add one capacitance whose capacitance value can be arbitrarily changed. Therefore, the degree of freedom in designing the composite high-frequency components 1a and 1b is increased by the addition of the capacitor having such a function.
[0061]
The resonator electrode layers 18a and 19a, which are the main components of the baluns 2a and 2b, and the first to third transmission line electrode layers 20a to 22a which are the main components of the filters 3a and 3b, They are arranged separately from each other via 35. Therefore, unnecessary electromagnetic field coupling between the baluns 2a and 2b and the filters 3a and 3b is suppressed. This prevents the characteristics of the baluns 2a and 2b and the filters 3a and 3b from deteriorating due to unnecessary electromagnetic field coupling. Such an effect of suppressing unnecessary electromagnetic field coupling is more effective when the shield electrode layer 42 is provided on the dielectric layer 34.
[0062]
The end face electrode 40 connects the filters 3a, 3b and the baluns 2a, 2b by connecting the input / output coupling capacitance electrode layer 17a and the first transmission line electrode layer 20a. As described above, the filters 3a, 3b and the baluns 2a, 2b are connected by the end face electrode 40, which is a connection structure that can be formed relatively easily.
[0063]
The layered portion of the dielectric layers 35 to 37 has a structure sandwiched between the third shield electrode layer 43 of the dielectric layer 38 and the second shield electrode layer 42 of the dielectric layer 34.
[0064]
The laminated portion of the dielectric layers 31 to 33 has a structure sandwiched between the second shield electrode layer 42 of the dielectric layer 34 and the first shield electrode layer 41 of the dielectric layer 30.
[0065]
The composite high-frequency components 1a and 1b have the following advantages by having the sandwiching structure by the shield electrode layer described above. The composite high-frequency components 1a and 1b can eliminate the influence of external noise and prevent electromagnetic coupling between the filters 3a and 3b and the baluns 2a and 2b. Thereby, deterioration of the characteristics can be suppressed.
[0066]
The composite high frequency components 1a and 1b are manufactured by laminating the dielectric layers 30 to 39 and integrally firing them. Thereby, the composite high frequency components 1a and 1b have a laminated integrated structure. Therefore, the composite high-frequency components 1a and 1b are smaller in size than when the balun and the filter are separately mounted on a circuit board.
[0067]
Further, in the composite high-frequency components 1a and 1b, since the baluns 2a and 2b and the filters 3a and 3b are integrated, the number of components of the radio circuit can be reduced. Therefore, when the composite high-frequency components 1a and 1b having such features are mounted on the communication device 4, miniaturization and cost reduction can be achieved. Furthermore, by reducing the number of components, the efficiency of the manufacturing operation of the communication device 4 can be increased.
[0068]
The composite high frequency components 1a and 1b are formed by laminating and integrating baluns 2a and 2b and filters 3a and 3b. Therefore, the composite high-frequency components 1a and 1b can easily match the impedance between the baluns 2a and 2b and the filters 3a and 3b. Specifically, the dielectric constants of the dielectric layers 30 to 39 at the portions where the baluns 2a and 2b are formed and the dielectric constants of the dielectric layers 30 to 39 at the portions where the filters 3a and 3b are formed are arbitrarily set (different from each other). By doing so, the impedance between the baluns 2a and 2b and the filters 3a and 3b can be easily matched.
[0069]
This eliminates the need to use a matching element for matching the impedance. This also makes it possible to further reduce the number of parts. Therefore, the composite high frequency components 1a and 1b can be further reduced in size.
[0070]
In the composite high-frequency components 1a and 1b, the dielectric layers 30 to 39 are used as components of the capacitors constituting the baluns 2a and 2b and the filters 3a and 3b. Therefore, it is not necessary to separately prepare a dielectric serving as a component of these capacitors and incorporate it into the dielectric layers 30 to 39. Accordingly, the size of the composite high frequency components 1a and 1b can be reduced.
[0071]
The composite high-frequency components 1a, 1b are connected to the dielectric layers 30 to 39 by the end electrodes 14a, 23a, 24a, 40 and the end electrodes 44, 45 formed on the side surfaces of the laminated body composed of the dielectric layers 30 to 39. The connection between the body layers and the connection between the baluns 2a and 2b and the filters 3a and 3b are performed. The end face electrode is a connection structure that can be formed relatively easily. Therefore, in the composite high-frequency components 1a and 1b in which the connection is performed by the end face electrodes, the structure required for the connection is simplified, and the manufacturing cost can be reduced.
[0072]
Also, by trimming the end face electrodes 14a, 23a, 24a, 40, etc., the electrical characteristics of the baluns 2a, 2b and the filters 3a, 3b can be easily adjusted.
[0073]
The composite high-frequency components 1a and 1b make it easier to adjust the electrical characteristics of the filters 3a and 3b in the following points.
[0074]
When mounting the composite high-frequency components 1a and 1b on a circuit board, the composite high-frequency components 1a and 1b can be mounted on the circuit board with the dielectric layer 30 facing the circuit board. With such a mounting configuration, the filters 3a and 3b are arranged at positions farthest from the circuit board. In such a case, the influence of other electric elements on the filters 3a and 3b is minimized. If trimming is performed on the end face electrodes 14a, 23a, 24a, 40, the third shield electrode layer 43, and the like in this state, the adjustment of the electrical characteristics of the filters 3a, 3b can be more easily adjusted. .
[0075]
The composite high-frequency component of the present invention is not limited to the communication device 4 as a mobile phone terminal, but can be incorporated in a mobile phone terminal, a PHS terminal, and a wireless base station for these terminals. In short, the present invention can be implemented as long as the communication device includes a balun and a filter in a part of the circuit configuration.
[0076]
The materials and sizes of the dielectric layers 30 to 39 constituting the composite high-frequency components 1a and 1b are not limited to those described in the present embodiment, but may be other materials or other sizes. That is, the relative dielectric constant ε _r However, even if the dielectric layers 30 to 39 are formed of a material different from that of the present embodiment, the same effect as that of the above-described embodiment can be obtained. Further, the size of each of the dielectric layers 30 to 39 may be different from that described in the above embodiment. Furthermore, in the present invention, each of the dielectric layers 30 to 39 does not necessarily have to be formed using the same material, and the relative dielectric constant ε of at least two of the dielectric layers 30 to 39 is not required. _r Is possible. Relative permittivity ε _r The composite high-frequency components 1a and 1b having different dielectric layers 30 to 39 can be manufactured by different kinds of lamination techniques.
[0077]
Further, as shown in FIG. 5, the dielectric layer 33 may be omitted, and the second transmission line electrode layer 21a and the third transmission line electrode layer 22a may be provided on the dielectric layer 31. Conversely, as shown in FIG. 6, the second transmission line electrode layer 21a and the third transmission line electrode layer 22a may be provided on the dielectric layer 33 after omitting the dielectric layer 31.
[0078]
When the second transmission line electrode layer 21a and the third transmission line electrode layer 22a are formed on the same dielectric layer, the electromagnetic field between the second transmission line electrode layer 21a and the third transmission line electrode layer 22a Although the characteristics of the baluns 2a and 2b are slightly deteriorated by the coupling, the number of dielectric layers constituting the composite high-frequency components 1a and 1b can be reduced. As a result, it is possible to promote a reduction in manufacturing cost and a reduction in size of the composite high frequency components 1a and 1b.
[0079]
Furthermore, the composite high-frequency components 1a and 1b have the following advantages when mounted. That is, in the configuration of the composite high-frequency components 1a and 1b of the present embodiment, the composite high-frequency components 1a and 1b are mounted on the circuit substrate A with the filters 3a and 3b facing the circuit substrate A as shown in FIG. can do. Specifically, the outer surface of the dielectric layer 30 can be a mounting surface for the circuit board A.
[0080]
In such a mounting structure, the grounding state can be strengthened. In this case, the second transmission line electrode layer 21a and the third transmission line electrode layer 22a may be formed on the same dielectric layer, or may be formed on different dielectric layers.
[0081]
Conversely, the composite high-frequency components 1a, 1b can be mounted on the circuit board A with the baluns 2a, 2b facing the circuit board A. Specifically, the outer surface of the dielectric layer 39 can be a mounting surface for the circuit board A.
[0082]
Further, as shown in FIG. 7, ground electrodes 50 and 51 may be provided on the side surfaces of the stacked body including the dielectric layers 30 to 39. In this case, a ground electrode 50 is provided on the side surface of the stacked body on which the end face electrodes 14a and 24a are provided. A ground electrode 51 is provided on a side surface of the laminate on which the end surface electrodes 23a and 40 are provided. Further, ground electrodes 50 and 51 are respectively provided between the end surface electrodes (14a, 24a) and (23a, 40) provided on the same side surface.
[0083]
One of the end surface electrodes (14a, 24a) and (23a, 40) provided on the same side surface is connected to the baluns 2a and 2b, and the other is connected to the filters 3a and 3b. Therefore, in order to improve the characteristics of the composite high frequency components 1a and 1b, it is preferable to electrically separate the end electrodes (14a, 24a) and (23a, 40) on the same side surface.
[0084]
In the configuration shown in FIG. 7, ground electrodes 50 and 51 are provided between end face electrodes (14a, 24a) and (23a, 40) provided on the same side. Therefore, electrical separation between these end electrodes (14a, 24a) and (23a, 40) is ensured, and the characteristics of the composite high-frequency components 1a, 1b are improved.
[0085]
Further, in the configuration shown in FIG. 7, the width w1 of the end face electrodes 44 and 45 is smaller than the width w2 of the side surface of the laminate (w1 <w2). Therefore, the volume of the connection member (solder, conductive adhesive, or the like) that contacts the side electrodes 44 and 45 during mounting can be reduced. As a result, the area required for mounting one composite high frequency component on the circuit board A can be reduced, and the mounting structure of the composite high frequency components 1a and 1b can be reduced accordingly.
[0086]
Setting w1 <w2 also has the following advantages. In the configuration of the composite high-frequency components 1a and 1b shown in FIG. 7, the end electrodes 23a and 24a may be further drawn out in the direction of the end electrodes 44. Such an extraction electrode pattern is provided on the mounting substrate of the composite high frequency component 1a, 1b.
[0087]
If the end face electrode 44 is formed on the entire side surface of the stacked body, the above-mentioned lead electrode pattern is forced to have a pattern shape in which the end face electrode 44 is drawn out in a certain direction while temporarily avoiding the end face electrode 44. However, in such a pattern configuration, the length of the extraction electrode pattern is increased by the provision of the avoidance pattern.
[0088]
On the other hand, in the configuration shown in FIG. 7, regions where the end face electrodes 44 are not formed exist at both ends of the side surface of the laminate. Therefore, it is structurally possible for the extraction electrode pattern to pass through the region where the end face electrode 44 is not formed. Accordingly, the extraction electrode pattern can be a pattern that is linearly extracted toward a certain direction of the end surface electrode 44 without avoiding the end surface electrode 44. In such a pattern configuration, the length of the extraction electrode pattern is shortened because there is no need to provide the avoidance pattern.
[0089]
7, one of the baluns 2a and 2b and the filters 3a and 3b may be connected to the end face electrodes 14a and 24a, and the other may be connected to the end face electrodes 23a and 40. Then, the input / output terminals of the baluns 2a, 2b and the input / output terminals of the filters 3a, 3b are separately arranged on the mutually facing side surfaces of the laminate. Then, electrical separation between the baluns 2a and 2b and the filters 3a and 3b is ensured, and the characteristics of the composite high-frequency component are improved.
[0090]
Further, the connection between the dielectric layers of the dielectric layers 30 to 39 may be performed by using a via electrode. The via electrode is formed as follows. Through holes are formed in any of the dielectric layers 30 to 39, and the formed through holes are filled with a conductive paste containing silver or copper as a main component. Then, these via electrodes are formed by integrally firing the dielectric layers 30 to 39.
[0091]
In general, forming a via electrode can reduce the manufacturing cost, rather than forming an end face electrode. Therefore, by connecting any one of the dielectric layers 30 to 39 with the via electrode, the manufacturing cost is reduced.
[0092]
Further, the filters 3a and 3b have the same effect even if they are notch filters, low-pass filters, and high-pass filters.
[0093]
Further, the composite high-frequency components 1a and 1b may be composed of another number of dielectric layers depending on the circuit configuration.
[0094]
Furthermore, the composite high-frequency components 1a and 1b may not be integrally fired with the dielectric layers 30 to 39, and the balun and the filter may be integrated into the circuit board without being separately mounted on the circuit board. It only needs to be implemented.
[0095]
As described above, in this embodiment, a wireless circuit using a balun or a filter and a communication device such as a mobile phone terminal using the wireless circuit can be further reduced in size.
[0096]
(Second embodiment)
FIG. 8 shows a transmission-side wireless circuit section of a communication device using the composite high-frequency component 100 according to the second embodiment of the present invention. The communication device according to the present embodiment is a mobile phone terminal, and FIG. 8 is a block diagram of a transmission-side wireless circuit unit.
[0097]
The transmitting-side wireless circuit unit according to the present embodiment includes a composite high-frequency component 100, input terminals 104a and 104b, a frequency conversion unit 105, a power amplifier 106, an output terminal 107, and an auxiliary connection terminal 108.
[0098]
The composite high-frequency component 100 includes a balun 102 and a filter 103. The balun 2 and the filter 3 are laminated and integrated. The balun 102 is provided with second and third connection terminals 102a and 102b and a first connection terminal 102c. The balun 102 converts a transmission frequency signal output from the power amplifier 106 as a signal on the balanced line into a signal on the unbalanced line. A transmission frequency signal, which is a signal of a balanced line, is input to the balun 102 from the second and third connection terminals 102a and 102b. The output of the balun 102, which is an unbalanced line signal, is output from the first connection terminal 102c.
[0099]
The filter 103 reduces unnecessary frequency component signals among the signals converted into unbalanced line signals by the balun 102. The frequency conversion unit 105 converts the frequency of the modulated signal into a transmission signal. Power amplifier 106 amplifies the transmission signal. Although not shown in FIG. 8, each part from the input terminals 104a and 104b to the output terminal 107 is connected via a matching circuit element such as a capacitor or an inductor.
[0100]
Next, the operation of the transmission-side wireless circuit unit according to the present embodiment thus configured will be described.
[0101]
The frequency conversion unit 105 mixes a modulation signal input from the input terminals 104a and 104b with a carrier signal input from an oscillation unit (not shown). Thereby, frequency conversion section 105 frequency-converts the modulated signal into a transmission signal. Power amplifier 106 amplifies the output signal of frequency conversion section 105 and outputs it as a transmission signal. The frequency conversion unit 105 and the power amplifier 106 function as a balance circuit. Therefore, the transmission frequency signal output from the power amplifier 106 is a balanced line signal.
[0102]
The balun 102 converts a transmission signal output from the power amplifier 106 into an unbalanced line signal. The filter 103 reduces unnecessary frequency components of the transmission signal. The filter 103 outputs the transmission signal to an antenna or an antenna switch (not shown) via the output terminal 107. The filter 103 functions as an unbalanced circuit.
[0103]
The power amplifier 106 is connected to the auxiliary connection terminal 108 of the composite high-frequency component 100. The power of the power amplifier 106 is supplied from the power supply unit 200 via the auxiliary connection terminal 108. Power is supplied to the power amplifier 106 via the balun 102 and a signal line connecting the balun 102 and the power amplifier 106.
[0104]
Next, the composite high-frequency component 100 constituting a part of the circuit of the transmission-side wireless circuit section will be described.
[0105]
FIG. 9 shows an internal circuit configuration of the composite high-frequency component 100.
[0106]
In the circuit of FIG. 9, the filter 103 is constituted by the output terminal 107 which is an unbalanced type terminal, input / output coupling capacitances 115 and 117, interstage coupling capacitance 116, and resonators 118 and 119.
[0107]
The first transmission line 120A, the second transmission line 121, the third transmission line 120B, the fourth transmission line 122, the second and third connection terminals 102a and 102b, which are balanced terminals, and the unbalanced terminal. The balun 102 is configured by a certain first connection terminal 102c, the ground capacitance 125, and the auxiliary connection terminal 108. The first transmission line 120A and the third transmission line 120B are combined with each other to form an integrated transmission line. The first transmission line 120A and the second transmission line 121 form a pair of transmission line pairs electromagnetically coupled to each other. The third transmission line 120B and the fourth transmission line 122 constitute a pair of transmission line pairs electromagnetically coupled to each other.
[0108]
One capacitance electrode of the input / output coupling capacitance 115 is connected to the output terminal 107. One capacitance electrode of the inter-stage coupling capacitance 116 is connected to the other capacitance electrode of the input / output coupling capacitance 115. One capacitor electrode of the input / output coupling capacitor 117 is connected to the other capacitor electrode of the interstage coupling capacitor 116. Thus, the input / output coupling capacitance 115, the inter-stage coupling capacitance 116, and the input / output coupling capacitance 117 are connected in series to the output terminal 107 in this order.
[0109]
A resonator 118 is connected to the other capacitance electrode of the input / output coupling capacitance 115 and one capacitance electrode of the interstage coupling capacitance 116. A resonator 119 is connected to the other capacitance electrode of the inter-stage coupling capacitance 116 and one capacitance electrode of the input / output coupling capacitance 117. The first connection terminal 102c of the balun 102 is connected to the other capacitance electrode of the input / output coupling capacitance 117.
[0110]
One end of the first transmission line 120A is connected to the first connection terminal 102c. The other end of the first transmission line 102A and one end of the third transmission line 120B are connected to each other. The other end of the third transmission line 120B is open. One end of the second transmission line 121 is connected to the second connection terminal 102a of the balun 102. The other end of the second transmission line 121 is grounded via a ground capacitance 125 and is connected to the auxiliary connection terminal 108. One end of the fourth transmission line 122 is connected to the third connection terminal 102b of the balun 102. The other end of the fourth transmission line 122 is grounded via a capacitor 125 and is connected to the auxiliary connection terminal 108.
[0111]
FIG. 10 is an exploded perspective view of the composite high-frequency component 100. The composite high-frequency component 100 includes dielectric layers 130 to 140 and electrode layers 120Aa, 120Ba,... Each of the dielectric layers 130 to 140 has a rectangular shape of 3.2 mm × 2.5 mm × 1.3 mm. Each of the dielectric layers 130 to 140 has a relative dielectric constant ε _r = 58 Bi-Ca-Nb-O-based material. The electrode layers 120Aa, 120Ba,... Are made of a material containing silver or copper as a main component. The electrode layers 120Aa, 120Ba,... Are formed on the dielectric layers 130 to 140 by a technique such as printing.
[0112]
The laminate composed of the dielectric layers 130 to 140 has a cubic shape. End electrodes 144 to 149 and end electrodes 114a, 123a, 124a, 126a are formed on the side surfaces of the laminate.
[0113]
The laminate has a pair of side surfaces facing each other (hereinafter, referred to as a pair of opposed side surfaces). The end surface electrodes 144 to 146 are provided on each of the side surfaces constituting one pair of the opposing side surfaces of the laminate. Specifically, the end surface electrode 144 is provided on one side surface of the one side surface pair. The end surface electrodes 145 and 146 are provided on the other side surface forming one pair of the opposite side surfaces. The end electrodes 144 to 146 are connected to a ground terminal (not shown).
[0114]
The end surface electrodes 147 to 149 are provided on the respective side surfaces constituting the other pair of opposed side surfaces of the laminate. Specifically, the end surface electrodes 147 and 148 are provided on one side surface of the other pair of the opposite side surfaces. The end surface electrode 149 is provided on the other side surface forming the other pair of the opposite side surfaces.
[0115]
The end surface electrodes 114a and 124a are provided on another side surface (the side surface on which the end surface electrode 149 is formed) of the other opposing side surface pair. The end face electrode 123a is provided on one side face (the side face on which the end face electrodes 147, 148 are formed) of the other opposing side face pair. The end face electrode 126a is provided on the other side face (the side face on which the end face electrodes 145, 146 are formed) of the one opposing side face pair.
[0116]
First to third shield electrode layers 141 to 143 are formed on the upper surfaces of the dielectric layers 130, 135, and 139, respectively. The first to third shield electrode layers 141 to 143 are connected to end surface electrodes 144 to 146, respectively.
[0117]
The coupling capacitance electrode layer 125a is formed on the upper surface of the dielectric layer 131. The coupling capacitance electrode layer 125a is connected to the end face electrode 126a.
[0118]
The second transmission line electrode layer 121a is formed on the upper surface of the dielectric layer 132. One end of the second transmission line electrode layer 121a is connected to the end face electrode 123a. The other end of the second transmission line electrode layer 121a is connected to the end face electrode 126a.
[0119]
The first and third transmission line electrode layers 120Aa and 120Ba are formed on the upper surface of the dielectric layer 133. One end of the first transmission line electrode layer 120Aa is connected to the end face electrode 147. The other end of the first transmission line 120Aa is connected to one end of the third transmission line electrode layer 120Ba. The other end of the third transmission line electrode layer 120Ba is open.
[0120]
The fourth transmission line electrode layer 122a is formed on the upper surface of the dielectric layer 134. One end of the fourth transmission line electrode layer 122a is connected to the end face electrode 124a. The other end of the fourth transmission line electrode layer 122a is connected to the end face electrode 126a. The end face electrode 126a is connected to the auxiliary connection terminal 108 not shown in FIG.
[0121]
On the upper surface of the dielectric layer 136, input / output coupling capacitance electrode layers 115a and 117a are formed. One end of the input / output coupling capacitance electrode layer 115a is connected to the end face electrode 114a. One end of the input / output coupling capacitance electrode layer 117a is connected to the end face electrode 147.
[0122]
On the upper surface of the dielectric layer 137, resonator electrode layers 118a and 119a formed of an electrode pattern are formed. One end of each of the resonator electrode layers 118a and 119a is connected to the end face electrode 144.
[0123]
On the upper surface of the dielectric layer 138, an inter-stage coupling capacitance electrode layer 116a is formed.
[0124]
Next, the operation of the composite high-frequency component 100 will be described.
[0125]
The laminated portion of the dielectric layers 136 to 138 functions as the filter 103. That is, the end face electrode 114a functions as the output terminal 107 which is an unbalanced terminal. The input / output coupling capacitance electrode layer 115a connected to the end face electrode 114a functions as one capacitance electrode of the input / output coupling capacitance 115. The input / output coupling capacitance electrode layer 115a and the resonator electrode layer 118a function as the input / output coupling capacitance 115 by being capacitively coupled to each other with the dielectric layer 137 interposed therebetween.
[0126]
The resonator electrode layers 118a and 119a function as resonators 118 and 119, respectively. The resonator electrode layer 118a and the resonator electrode layer 119a are formed close to each other on the dielectric layer 137. As a result, the resonator electrode layer 118a and the resonator electrode layer 119a are electromagnetically coupled to each other.
[0127]
The inter-stage coupling capacitance electrode layer 116a is capacitively coupled to the resonator electrode layer 118a and the resonator electrode layer 119a, respectively. As a result, an inter-stage coupling capacitance 116 is formed. The input / output coupling capacitance electrode layer 117a is capacitively coupled to the resonator electrode layer 119a. Thereby, the input / output coupling capacitance 117 is formed.
[0128]
As described above, the laminated portion of the dielectric layers 135 to 137 functions as a two-stage bandpass filter.
[0129]
The laminated portion of the dielectric layers 131 to 134 functions as the balun 102. That is, the end face electrode 123a is connected to the second transmission line electrode layer 121a, and functions as the second connection terminal 102a that is a balanced terminal. The end face electrode 124a is connected to the fourth transmission line electrode layer 122a, and functions as the third connection terminal 102b that is a balanced terminal.
[0130]
The second transmission line electrode layer 121a is electromagnetically coupled to the first transmission line electrode layer 120Aa. The fourth transmission line electrode layer 122a is electromagnetically coupled to the third transmission line electrode layer 120Ba.
[0131]
The coupling capacitance electrode layer 125a and the first shield electrode layer 141 are capacitively coupled via the dielectric layer 131. As a result, a ground capacitance 125 is formed. The end face electrode 126a functions as the auxiliary connection terminal 108.
[0132]
The power supply current component supplied from the end face electrode 126a as the auxiliary connection terminal 108 passes through the second transmission line electrode layer 121a and the fourth transmission line electrode layer 122a. Therefore, the second and fourth transmission line electrode layers 121a and 122a function as choke inductors for the power supply current component. This eliminates the need for an external inductor.
[0133]
When the choke inductor component is insufficient in the second and fourth transmission lines 121 and 122, as shown in FIG. 11A, the portion between the second and fourth transmission lines 121 and 122 and the auxiliary connection terminal 108 is formed. What is necessary is just to connect and arrange the inductor 127. Then, the values of the second and fourth transmission lines 121 and 122 need only be smaller than the originally required inductor value, which is advantageous for miniaturization.
[0134]
In the structure shown in FIG. 10, the coupling capacitance electrode layer 125a is connected to the end face electrode 126a. The coupling capacitance electrode layer 125a is connected to the second transmission line electrode layer 121a and the fourth transmission line electrode layer 122a via the end face electrode 126a. As a result, the second and fourth transmission line electrode layers 121a and 122a are grounded via the ground capacitance 125. Therefore, the power supply current supplied from the end face electrode 126a functioning as the auxiliary connection terminal 108 is prevented from flowing to the ground potential. Therefore, the balun 102 can be used as a power supply line of an active element (such as the power amplifier 106) connected to the second and third connection terminals 102a and 102b. In addition, since the ground capacitance 125 is formed in the laminate, an increase in the number of components can be prevented.
[0135]
In the internal circuit configuration of the composite high-frequency component 100 shown in FIG. 9, both the second transmission line 121 and the fourth transmission line 122 are connected to one ground capacitance 125. However, the configuration of the present invention is not limited to this. The second transmission line 121 and the fourth transmission line 122 may be connected to two different coupling capacitors and grounded. That is, as shown in FIG. 11B, the second transmission line 121 is grounded via the first ground capacitance 125b. The second transmission line 121 is connected to the auxiliary connection terminal 108a. The fourth transmission line 122 is grounded via a second ground capacitance 125c. Further, the fourth transmission line 122 is connected to the auxiliary connection terminal 108b. In this configuration, ground capacitors 125b and 125c and auxiliary connection terminals 108a and 108b are provided for the second and fourth transmission lines 121 and 122, respectively.
[0136]
In this case, the second transmission line 121 is formed on the dielectric layer 132. The fourth transmission line 122 is formed on the dielectric layer 134. As described above, by forming the second transmission line 121 and the fourth transmission line 122 on different dielectric layers, an unnecessary electromagnetic field between the second transmission line 121 and the fourth transmission line 122 is formed. Bonding can be suppressed. Therefore, deterioration of the characteristics of the balun 102 due to unnecessary electromagnetic field coupling can be prevented.
[0137]
The stacked portion of the dielectric layers 136 to 138 is sandwiched between the third shield electrode layer 143 on the upper surface of the dielectric layer 139 and the second shield electrode layer 142 on the upper surface of the dielectric layer 135. have. Further, the stacked portion of the dielectric layers 131 to 134 is sandwiched between the second shield electrode layer 142 on the upper surface of the dielectric layer 135 and the first shield electrode layer 141 on the upper surface of the dielectric layer 130. It has a structure.
[0138]
The composite high-frequency component 100 has the following advantages by having the above-described sandwiching structure with the shield electrode layer. That is, the composite high-frequency component 100 can eliminate the influence of noise from the outside and prevent the filter 103 and the balun 102 from performing electromagnetic field coupling. Thereby, the deterioration of the characteristics of the composite high-frequency component 100 can be suppressed.
[0139]
The composite high-frequency component 100 is manufactured by laminating the respective dielectric layers of the dielectric layers 130 to 140 and integrally firing them. Thereby, the composite high-frequency component 100 has a laminated integrated structure. Therefore, the composite high-frequency component 100 is smaller than when the balun 102 and the filter 103 are separately mounted on a circuit board.
[0140]
In the composite high-frequency component 100, since the balun 102 and the filter 103 are integrated, the number of components of the wireless circuit can be reduced. Therefore, when the composite high-frequency component 100 having such characteristics is mounted on the transmission-side wireless circuit unit, size reduction and cost reduction can be achieved. Furthermore, by reducing the number of components, the efficiency of the manufacturing operation of the communication device 4 can be increased.
[0141]
The composite high frequency component 100 is obtained by laminating and integrating a balun 102 and a filter 103. Therefore, composite high-frequency component 100 can easily match the impedance between balun 102 and filter 103. It is not necessary to use a matching element for matching the impedance. This also makes it possible to further reduce the number of parts. Therefore, the size of the communication device can be further reduced.
[0142]
The material and size of the dielectric layers 130 to 140 constituting the composite high-frequency component 100 are not limited to those described in the present embodiment, but may be other materials or other sizes. That is, the relative dielectric constant ε _r However, even if the dielectric layers 130 to 140 are formed of a material different from that of the present embodiment, the same effect as that of the above-described embodiment can be obtained. Further, the size of each of the dielectric layers 130 to 140 may be different from that described in the above embodiment. Further, according to the present invention, it is not always necessary to form each of the dielectric layers 130 to 140 using the same material, and the relative dielectric constant of at least two of the dielectric layers 130 to 140 SUB> R Is possible.
[0143]
In the present embodiment, the second transmission line electrode layer 121a and the fourth transmission line electrode layer 122a are described as being formed on different dielectric layers. However, the present invention is not limited to this. The electrode layer 121a and the fourth transmission line 122a may be formed on the same dielectric layer. For example, as shown in FIG. 12A, the fourth transmission line electrode layer 122a is formed on the upper surface of the dielectric layer 132 where the dielectric layer 134 is not provided and the second transmission line electrode layer 121a is formed. It does not matter. Alternatively, although not shown, the dielectric layer 132 may not be provided, and the second transmission line electrode layer 121a and the fourth transmission line electrode layer 122a may be provided on the upper surface of the dielectric layer 134.
[0144]
When the second transmission line electrode layer 121a and the fourth transmission line electrode layer 122a are formed on the same dielectric layer as described above, the second transmission line electrode layer 121a and the fourth transmission line electrode layer 122a are formed. Although the characteristics of the balun 102 are slightly deteriorated due to the electromagnetic field coupling between the balun 102 and the balun 102, the number of dielectric layers constituting the composite high-frequency component 100 can be reduced.
[0145]
Further, the second transmission line electrode layer 121a and the fourth transmission line electrode layer 122a may be formed on the same dielectric layer as the first transmission line electrode layer 120a. For example, as shown in FIG. 12B, even if the dielectric layers 132 and 134 are not provided, the second transmission line electrode layer 121a and the fourth transmission line electrode layer 122a are formed on the upper surface of the dielectric layer 133. I do not care.
[0146]
In the dielectric layer 133, the first and third transmission line electrode layers 120Aa and 120Ba are already formed. When the second transmission line electrode layer 121a and the fourth transmission line electrode layer 122a are formed on the same dielectric layer as the first and third transmission line electrode layers 120Aa and 120Ba, the following advantages are obtained. . The coupling of the first and third transmission line electrode layers 120Aa and 120Ba slightly reduces the characteristics of the balun 102, but can further reduce the number of dielectric layers. Therefore, the manufacturing cost of the composite high-frequency component 100 can be reduced, and the composite high-frequency component 100 can be further downsized.
[0147]
In the composite high-frequency component 100, by connecting the power amplifier 106 to the balun 102 and the power supply unit 200 to the auxiliary connection terminal 108, power is supplied from the power supply unit 200 to the power amplifier 106 via the balun 102. be able to.
[0148]
Since the composite high frequency component 100 has the laminated configuration shown in FIG. 10, the high frequency component of the present invention can be configured with a relatively simple configuration.
[0149]
In the composite high-frequency component 100, the second transmission line electrode layer 121a and the fourth transmission line electrode layer 122a are connected via an end face electrode 126a. Therefore, it is possible to consolidate the configuration for connecting these transmission line electrode layers 121a and 122a to the outside, and the configuration is simplified.
[0150]
In the composite high-frequency component 100, an end face electrode 126a serving as the auxiliary connection terminal 108 is connected to a connection end between the second transmission line electrode layer 121a and the fourth transmission line electrode layer 122a. Therefore, the connection configuration between the auxiliary connection terminal 108 and the second and fourth transmission line electrode layers 121a and 122a can be integrated into one, and the configuration is simplified.
[0151]
In the present embodiment, when the composite high-frequency component 100 is mounted on a circuit board, it has been described that the balun 102 is located on the substrate facing surface side and the filter 103 is located on the substrate non-facing surface side. However, in the present embodiment, the filter 103 may be located on the substrate facing surface side, and the balun 102 may be located on the substrate non-facing surface side. By arranging the filter 103 on the substrate facing surface side in this way, the grounding state can be strengthened. In this case, the second transmission line 121 and the fourth transmission line 122 may be formed on the same dielectric layer, or may be formed on different dielectric layers.
[0152]
In this embodiment, the connection between the dielectric layers of the dielectric layers 130 to 140 is performed by the end surface electrodes 114a, 123a, 124a and the end surface electrodes 148 formed on the side surfaces of the dielectric layers 130 to 140. However, the present invention is not limited to this, and connection between the dielectric layers of the dielectric layers 130 to 140 may be performed using a via electrode instead of the end face electrode or the end face electrode.
[0153]
In general, forming a via electrode is less costly than forming an end face electrode or an end face electrode. Therefore, by connecting any one of the dielectric layers 130 to 140 with the via electrode, the manufacturing cost can be reduced.
[0154]
Further, the same effect can be obtained even if the filter 103 is a notch filter, a low-pass filter, or a high-pass filter.
[0155]
The composite high-frequency component 100 according to the present embodiment has been described as being composed of eleven dielectric layers of the dielectric layers 130 to 140. However, the present invention is not limited to this. Depending on the circuit configuration of the composite high-frequency component 100, the composite high-frequency component 100 may include another number of dielectric layers.
[0156]
The communication device of the present invention can be implemented without being limited to the transmitting-side wireless circuit of the mobile phone terminal in each of the above-described embodiments. For example, the present invention can be applied to a Bluetooth wireless module, a PHS terminal, and the like. In short, the communication device of the present invention only needs to be a communication device using the high-frequency component of the present invention for a part of its circuit.
[0157]
【The invention's effect】
As described above, according to the present invention, it is possible to reduce the size of a high-frequency component in which a balun and a filter are incorporated, and to further reduce the size of a communication device such as a mobile phone terminal in which the high-frequency component is incorporated. it can.
[Brief description of the drawings]
FIG. 1 is a block diagram illustrating a configuration of a communication device according to a first embodiment of the present invention.
FIG. 2 is an equivalent circuit diagram of the composite high-frequency component according to the first embodiment.
FIG. 3 is another equivalent circuit diagram of the composite high-frequency component according to the first embodiment.
FIG. 4 is an exploded perspective view showing the structure of the composite high-frequency component according to the first embodiment.
FIG. 5 is an exploded perspective view showing another structure of the composite high-frequency component according to the first embodiment.
FIG. 6 is an exploded perspective view showing another structure of the composite high-frequency component according to the first embodiment.
FIG. 7 is a perspective view illustrating an example of an external shape of the composite high-frequency component according to the first embodiment.
FIG. 8 is a block diagram illustrating a configuration of a transmission-side wireless circuit unit of a communication device according to a second embodiment of the present invention.
FIG. 9 is an equivalent circuit diagram showing an internal circuit configuration of the composite high-frequency component according to the second embodiment.
FIG. 10 is an exploded perspective view showing the structure of the composite high-frequency component according to the second embodiment.
FIG. 11A is an equivalent circuit diagram illustrating another structure of the composite high-frequency component according to the second embodiment, and FIG. 11B is another configuration of the composite high-frequency component according to the second embodiment. It is an equivalent circuit diagram.
FIG. 12A is an exploded perspective view illustrating another configuration of the composite high-frequency component according to the second embodiment, and FIG. 12B is a diagram illustrating another configuration of the composite high-frequency component according to the second embodiment. It is an exploded perspective view.
FIG. 13 is an exploded perspective view showing an example of a conventional balun.
[Explanation of symbols]
1a, 1b composite high frequency component 2a balun
2b balun 3a filter
3b filter 4 communication equipment
5 baseband section 6 oscillation section
7 frequency converter 8 power amplifier
9 antenna duplexer 9 10 antennas
11 Low noise amplifier 12 Frequency conversion unit
13 filter 14 unbalanced terminal
14a end face electrode 15, 17 input / output coupling capacitance
15a input / output coupling capacitance electrode layer 16a interstage coupling capacitance electrode layer
17a input / output coupling capacitance electrode layer 40 end face electrode
16-stage coupling capacitance 18, 19 resonator
18a, 19a resonator electrode layer 20 first transmission line
20a first transmission line electrode layer 21 second transmission line
21a second transmission line electrode layer 22 third transmission line
22a third transmission line electrode layer 23 balanced terminal
23a end face electrode 24 balanced terminal
24a end face electrode 25 coupling capacity
25a coupling capacitance electrode layer 30-39 dielectric layer
40 end face electrode 41 first shield electrode layer
42 second shield electrode layer 43 third shield electrode layer
44,45 end face electrode 100 composite high frequency parts
102 balun 102a second connection terminal
102b third connection terminal 102c first connection terminal
103 filter 104a, 104b input terminal
105 frequency converter 106 power amplifier
107 output terminal 108 auxiliary connection terminal
108a, 108b auxiliary connection terminal 114a end face electrode
115 input / output coupling capacitance 115a, 117a input / output coupling capacitance electrode layer
116-stage coupling capacitance 116a inter-stage coupling capacitance electrode layer
117 input / output coupling capacitance 117a input / output coupling capacitance electrode layer
118 resonator 118a resonator electrode layer
119 resonator 119a resonator electrode layer
120A first transmission line 120Aa first transmission line electrode layer
120B third transmission line 120Ba third transmission line electrode layer
121 second transmission line 121a second transmission line electrode layer
122 fourth transmission line 122a fourth transmission line electrode layer
123a end face electrode 124a end face electrode
125 ground capacitance 125a coupling capacitance electrode layer
125b first ground capacitance 125c second ground capacitance
126a end face electrode 130-140 dielectric layer
141 first shield electrode layer 142 second shield electrode layer
143 third shield electrode layer 144-149 end face electrode
200 power supply

Claims (35)

A balun for converting between balanced line signals and unbalanced line signals,
A filter electrically connected to the balun to pass or attenuate a predetermined frequency component,
A composite high-frequency component comprising:
An electrode layer constituting an electrode pattern of the balun and the filter,
A dielectric layer;
With
A composite high-frequency component in which the dielectric layer and the electrode layer are laminated and integrated. The composite high-frequency component according to claim 1, further comprising a plurality of the electrode layers, wherein the electrode layers are stacked with the dielectric layer interposed therebetween. 3. The composite high-frequency component according to claim 2, wherein the dielectric constant of the dielectric layer at the filter forming part and the dielectric constant of the dielectric layer at the balun forming part are set to different values. The composite high-frequency component according to claim 1, wherein the electrode layer forming the balun electrode pattern and the electrode layer forming the filter electrode pattern are laminated with the dielectric layer interposed therebetween. The composite high-frequency component according to claim 1, wherein the dielectric layer functions as a circuit component of the balun or the filter. 2. The composite high-frequency component according to claim 1, wherein the electrode layer forming the balun electrode pattern and the electrode layer forming the filter electrode pattern are arranged at different lamination positions of the dielectric layer. 3. The composite high-frequency component according to claim 6, wherein a shield electrode layer is provided between the electrode layer forming the balun electrode pattern and the electrode layer forming the filter electrode pattern. The composite high-frequency component according to claim 7, wherein an end face electrode connected to the shield electrode layer is provided on a side surface of the composite high-frequency component. 9. The composite high-frequency component according to claim 8, wherein the width of the end face electrode is smaller than the width of the side face. 7. The composite high-frequency component according to claim 6, wherein the balun is provided on a mounting surface side of the composite high-frequency component, and the filter is provided on a non-mounting surface facing the mounting surface. 7. The composite high-frequency component according to claim 6, wherein the filter is provided on a mounting surface side of the composite high-frequency component, and the balun is provided on a non-mounting surface facing the mounting surface. The composite high-frequency component according to claim 1, wherein an end surface electrode is provided on a side surface of the composite high-frequency component, and the filter and the balun are connected through the end surface electrode. The composite high-frequency component according to claim 1, wherein an end surface electrode connected to the balun and an end surface electrode connected to the filter are provided on one side surface of the composite high-frequency component. 14. The composite high-frequency component according to claim 13, wherein a ground electrode is provided on the one side surface of the composite high-frequency component, and the ground electrode is disposed between the electrodes on both end surfaces. An end face electrode is provided on each of the side faces constituting one pair of opposed side faces of the composite high-frequency component, an input / output end of the balun is connected to one end face electrode, and an input / output end of the filter is connected to the other end face electrode. Item 7. The composite high-frequency component according to Item 1. The dielectric layer has first to tenth dielectric layers sequentially stacked and arranged,
The electrode layer,
A first shield electrode layer disposed between the first dielectric layer and the second dielectric layer;
A second transmission line electrode layer disposed between the second dielectric layer and the third dielectric layer;
A coupling capacitor electrode layer disposed between the second dielectric layer and the third dielectric layer;
A first transmission line electrode layer disposed between the third dielectric layer and the fourth dielectric layer;
A third transmission line electrode layer disposed between the fourth dielectric layer and the fifth dielectric layer;
A second shield electrode layer disposed between the fifth dielectric layer and the sixth dielectric layer;
An input / output coupling capacitance electrode layer disposed between the sixth dielectric layer and the seventh dielectric layer;
A plurality of resonator electrode layers disposed between the seventh dielectric layer and the eighth dielectric layer;
A coupling capacitor electrode layer disposed between the eighth dielectric layer and the ninth dielectric layer;
A third shield electrode layer disposed between the ninth dielectric layer and the tenth dielectric layer,
Has,
2. The composite high-frequency component according to claim 1, wherein an end face electrode for connecting the input / output coupling capacitance electrode layer and the first transmission line electrode layer is provided on a side surface of the first to tenth dielectric layers. 17. The composite high-frequency component according to claim 16, wherein the resonator electrode layers are electromagnetically coupled to each other. The first transmission line electrode layer and the second transmission line electrode layer are electromagnetically coupled to each other, and the first transmission line electrode layer and the third transmission line electrode layer are electromagnetically coupled to each other. The composite high-frequency component according to claim 16, wherein: The dielectric layer has first to ninth dielectric layers sequentially stacked and arranged,
The electrode layer,
A first shield electrode layer disposed between the first dielectric layer and the second dielectric layer;
A second transmission line electrode layer disposed between the second dielectric layer and the third dielectric layer;
A third transmission line electrode layer disposed between the second dielectric layer and the third dielectric layer;
A first transmission line electrode layer disposed between the third dielectric layer and the fourth dielectric layer;
A second shield electrode layer disposed between the fourth dielectric layer and the fifth dielectric layer;
An input / output coupling capacitance electrode layer disposed between the fifth dielectric layer and the sixth dielectric layer;
A plurality of resonator electrode layers disposed between the sixth dielectric layer and the seventh dielectric layer;
A coupling capacitor electrode layer disposed between the seventh dielectric layer and the eighth dielectric layer;
A third shield electrode layer disposed between the eighth dielectric layer and the ninth dielectric layer,
Has,
2. The composite high-frequency component according to claim 1, wherein an end face electrode for connecting the input / output coupling capacitance electrode layer and the first transmission line electrode layer is provided on a side surface of the first to tenth dielectric layers. 20. The composite high-frequency component according to claim 19, wherein the resonator electrode layers are electromagnetically coupled to each other. The first transmission line electrode layer and the second transmission line electrode layer are electromagnetically coupled to each other, and the first transmission line electrode layer and the third transmission line electrode layer are electromagnetically coupled to each other. 20. The composite high-frequency component according to claim 19, wherein The dielectric layer has first to ninth dielectric layers sequentially stacked and arranged,
The electrode layer,
A first shield electrode layer disposed between the first dielectric layer and the second dielectric layer;
A first transmission line electrode layer disposed between the second dielectric layer and the third dielectric layer;
A second transmission line electrode layer disposed between the third dielectric layer and the fourth dielectric layer;
A third transmission line electrode layer disposed between the third dielectric layer and the fourth dielectric layer;
A second shield electrode layer disposed between the fourth dielectric layer and the fifth dielectric layer;
An input / output coupling capacitance electrode layer disposed between the fifth dielectric layer and the sixth dielectric layer;
A plurality of resonator electrode layers disposed between the sixth dielectric layer and the seventh dielectric layer;
A coupling capacitor electrode layer disposed between the seventh dielectric layer and the eighth dielectric layer;
A third shield electrode layer disposed between the eighth dielectric layer and the ninth dielectric layer,
Has,
2. The composite high-frequency component according to claim 1, wherein an end face electrode for connecting the input / output coupling capacitance electrode layer and the first transmission line electrode layer is provided on a side surface of the first to tenth dielectric layers. 23. The composite high-frequency component according to claim 22, wherein the resonator electrode layers are electromagnetically coupled to each other. The first transmission line electrode layer and the second transmission line electrode layer are electromagnetically coupled to each other, and the first transmission line electrode layer and the third transmission line electrode layer are electromagnetically coupled to each other. 23. The composite high-frequency component according to claim 22, wherein: A capacitor provided between the balun and ground;
An auxiliary connection terminal provided between the capacitor and the balun;
The composite high-frequency component according to claim 1, comprising: A power supply unit connected to the auxiliary connection terminal;
An active element connected to the balun and supplied with power from the power supply unit;
26. The composite high-frequency component according to claim 25, comprising: The balun has two transmission line pairs,
One transmission line pair has first and second transmission lines electromagnetically coupled to each other,
A first connection terminal provided at one end of the first transmission line, and a second connection terminal provided at one end of the second transmission line;
The other transmission line pair has third and fourth transmission lines electromagnetically coupled to each other,
A third connection terminal is provided at one end of the fourth transmission line,
A balanced terminal is constituted by the second connection terminal and the third connection terminal;
Coupling the other end of the first transmission line and one end of the third transmission line,
The other ends of the second and fourth transmission lines are grounded via the capacitors,
26. The composite high-frequency component according to claim 25, wherein the auxiliary connection terminal is provided between the other ends of the second and fourth transmission lines and the capacitor. 28. The composite high-frequency component according to claim 27, wherein the other end of the second transmission line and the other end of the fourth transmission line are connected to each other. 29. The composite high-frequency component according to claim 28, wherein the auxiliary connection terminal is connected to a connection end between the second transmission line and the fourth transmission line. 26. The composite high-frequency component according to claim 25, wherein the auxiliary connection terminal is connected to the balun via an inductance. 26. The composite high-frequency component according to claim 25, wherein the capacitor is constituted by the dielectric layer and the electrode layer. Providing an inductance between the auxiliary connection terminal and the balun,
26. The composite high-frequency component according to claim 25, wherein the inductance, the dielectric layer, and the electrode layer are laminated and integrated. Arranging the transmission line pairs of each set on the same plane,
A composite high-frequency component according to claim 27. 28. The composite high-frequency component according to claim 27, wherein each pair of the transmission line pairs is constituted by transmission lines disposed to face each other via the dielectric layer. A communication device comprising the composite high-frequency component according to claim 1.

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