JP2003100146A - Conductive paste and manufacturing method of wiring board using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a wiring board by using conductive paste capable of forming a stable via hole conductor or the like, with excellent shape-keeping capability and embedding-filling capability by the conductive paste without deterioration of an insulation property by permeating of a resin constituent into an insulation board even if it is used as a filler of the via hole conductor or the like by improving wettability between metal particles and the resin constituent. SOLUTION: The via hole conductor 13 or the like in the wiring board is formed by using this conductive paste containing triallyl isocyanurate, a derivative such as 1-(2-hydroxypropyl)-3,5-di-2-propenyl-isocyanurate or 1,3-bis(2- hydroxypropyl)-5-(2-propenyl)-isocyanurate having a cyanuric acid skeleton containing a hydroxyl group as a substituted group and conductive powder comprising at least one kind selected from a group of gold, silver, palladium, copper, nickel, tin and lead.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a conductive paste suitable for a conductor wiring layer of a wiring board in which a conductor wiring layer such as a wiring circuit or a via-hole conductor is formed inside an insulating substrate, and at least an organic resin using the same. The present invention relates to a method for manufacturing a wiring board containing the same.

[0002]

2. Description of the Related Art In recent years, so-called printed boards, in which a conductor wiring layer is formed on the surface of an insulating substrate containing a thermosetting resin such as an epoxy resin or a phenol resin, have been applied to a circuit board or a package having a semiconductor element mounted thereon. There is. In such a printed circuit board, as a method of forming the conductor wiring layer, a method of forming a wiring circuit by adhering a copper foil to the surface of the insulating substrate and then etching the copper foil, or a method of forming a copper circuit on the wiring circuit A method of transferring the foil to the insulating substrate, a method of forming a circuit on the surface of the insulating substrate by a metal plating method, and the like are used.

Further, a via-hole conductor for electrically connecting a conductor wiring layer and a conductor wiring layer between different layers is often used,
As the via-hole conductor, there has been proposed a method of applying or filling a conductive paste in which metal powder such as silver or copper is mixed with triallyl isocyanurate or a liquid epoxy resin and a curing agent.

On the other hand, as the conductive paste, for example,
As described in JP-A-4-91111, a mixture of polyphenylene ether and triallyl isocyanurate, or chloroform and the like are added and dissolved, and a metal powder of silver, copper or the like is added to the solution. It is described that a sheet-shaped conductor is produced using a solution obtained by adding and mixing.

[0005]

However, the heat resistance of the conventional conductive paste containing epoxy resin or the like is as low as about 200 ° C., and the epoxy resin in the conductor wiring layer is used when the wiring board is mounted by soldering. There was a risk that it would deteriorate.

Further, in a conductive paste using triallyl isocyanurate, when a predetermined amount of triallyl isocyanurate is added in order to obtain a viscosity necessary for the paste, the triallyl isocyanurate in the paste is insulated from the via-hole conductor. When the insulating substrate heats and cures, the content of triallyl isocyanurate increases locally at the conductor wiring of the insulating substrate, especially at the part that contacts the via-hole conductor. Or the residual triallyl isocyanurate after curing causes swelling in the insulating substrate when solder mounting is performed at a high temperature of 200 ° C. or higher, or voids occur in the insulating substrate to deteriorate the insulation resistance. There was a problem of reducing reliability.

Further, in the solution containing the polyphenylene ether and triallyl isocyanurate disclosed in JP-A-4-91111, the polyphenylene ether remains in a solid state due to the high melting point of the polyphenylene ether, resulting in low homogeneity of the solution. Further, in order to dissolve this, a specific solvent such as chloroform must be added, and there is a problem that workability is poor because the solvent is limited.

Therefore, the present invention has been made in order to solve the above-mentioned problems. Specifically, when the wettability between a metal powder and a resin component is improved and it is used as a filling material for via-hole conductors, etc. However, leaching of resin into the insulating substrate does not impair the insulating properties, and the conductive paste is excellent in shape retention and filling filling in via holes etc., and stable via hole conductors, etc. can be formed. It is an object to provide a conductive paste and a method for manufacturing a wiring board using the conductive paste.

[0009]

Means for Solving the Problems As a result of repeated studies on the above problems, the present inventor replaced triallyl isocyanurate with a specific ratio in a conductive paste containing a conductive powder as a main component. By including a derivative having a cyanuric acid skeleton containing a hydroxyl group as a group, it has high heat resistance, does not impair the insulating property of the insulating substrate, and enhances the shape retention of the paste and the filling properties into via holes. It was found that the resulting conductive paste has excellent properties.

That is, the conductive paste of the present invention is characterized by containing triallyl isocyanurate, a derivative having a cyanuric acid skeleton containing a hydroxyl group as a substituent, and a conductive powder.

As the conductive powder, at least one selected from the group consisting of gold, silver, palladium, copper, nickel, tin and lead is desirable from the viewpoint of lowering resistance.

As the above-mentioned derivative, 1- (2-hydroxypropyl) -3,5-di-2-propenyl-isocyanurate or 1,3-bis (2-hydroxypropyl) -5- (2-propenyl) is used. ) -Isocyanurate is desirable, and these are added and contained at a ratio of 5 to 50 parts by mass in a total of 100 parts by mass with triallyl isocyanurate, and the triallyl isocyanurate is contained at 7 to 20 parts by mass in the total amount. % Is suitable.

Further, according to the present invention, in addition to the above components, a triallyl isocyanurate prepolymer is added in an amount of 5 to 4 in 100 parts by mass in total with triallyl isocyanurate.
The shape retention of the paste can be improved by adding and containing it in an amount of 0 parts by mass. In particular, the triallyl isocyanurate prepolymer preferably has a weight average molecular weight of 1500 to 70,000 in order to control the viscosity of the paste.

The method of manufacturing a wiring board according to the present invention comprises a step of forming a via-hole conductor by filling a conductive paste into a via-hole formed in an uncured or semi-cured insulating sheet containing at least an organic resin. And a step of forming a conductor wiring layer on the surface of the insulating sheet including the via-hole conductor forming portion, and a step of stacking and integrating the insulating sheets and heating the organic resin to a curing temperature to collectively cure the insulating sheet. A method of manufacturing a wiring board, comprising: a triallyl isocyanurate, a derivative having a cyanuric acid skeleton containing a hydroxyl group as a substituent, and a conductive paste containing a conductive powder is applied or filled. The via hole conductor and / or the conductor wiring layer are formed.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION The conductive paste of the present invention contains triallyl isocyanurate, a derivative having a cyanuric acid skeleton containing a hydroxyl group as a substituent, and a conductive powder.

That is, by adding a derivative having a cyanuric acid skeleton containing a hydroxyl group as a substituent, the wettability with the conductive powder can be improved, the shape retention of the paste can be improved, and oozing and bleeding can be prevented. It is possible to suppress it and to enhance the filling property into the via hole. Furthermore, since the derivative itself having a cyanuric acid skeleton has excellent heat resistance,
The heat resistance of the conductive paste can be improved.

As the derivative having a cyanuric acid skeleton containing a hydroxyl group as a substituent, 1- (2-hydroxypropyl) -3,5-di-2-propenyl-isocyanurate or 1,3-bis (2- Hydroxypropyl) -5- (2-propenyl) -isocyanurate is preferred.

That is, since the derivative having a cyanuric acid skeleton has both a hydroxyl group and an allyl group, it is possible to enhance the wettability with the conductive powder and to polymerize it with triallyl isocyanurate. A highly reliable conductive paste can be provided.

Further, the above-mentioned derivative secures sufficient wettability with the conductive powder in 100 parts by weight in total with triallyl isocyanurate and enhances the shape retention of the paste to cause bleeding and bleeding. 5 to effectively prevent
It is desirable that the amount is not less than parts by mass, and a derivative having a cyanuric acid skeleton containing a hydroxyl group as a substituent is sufficiently reacted with triallyl isocyanurate, without remaining as a monomer, and a solder heat resistance test or a solder reflow test. In order to obtain high reliability without volatilization at the time, it is desirable that the amount is 50 parts by mass or less. Therefore,
The derivative has a total of 1 with triallyl isocyanurate.
It is desirable to add 5 to 50 parts by mass, especially 10 to 30 parts by mass to 00 parts by mass.

The conductor powder in the present invention is at least one selected from the group consisting of gold, silver, palladium, copper, nickel, tin and lead in order to reduce the resistance, and the total amount is 70 to 90% by mass. It is desirable to contain the above metal in a ratio of, specifically, the above-mentioned pure metals and alloys or mixtures thereof, and the core of a metal selected from the above, coated with another metal can be used. In particular,
It is preferable to contain copper from the viewpoint of no migration to the insulating substrate and low cost, and in consideration of chemical stability, silver-coated copper powder is most suitable. Further, when a low melting point metal such as solder containing tin is added to copper, it is desirable to precipitate Cu ₃ Sn to improve heat resistance.

Further, the conductive paste of the present invention contains triallylisoianurate in an amount of 7 to 20% by mass based on the total amount. That is, if the content of triallyl isocyanurate is less than 7% by mass, the viscosity of the paste is too high and the embeddability in the via hole is likely to deteriorate, and the resistance of the conductor wiring may increase. 2 on the contrary
If the content is more than 0% by mass, the viscosity of the paste will be low and the shape retention will be reduced, which may cause the paste to bleed from the surface of the insulating substrate, and the content of conductive particles in the paste will be reduced to reduce the resistance of the via-hole conductor. May increase. The optimum amount of triallyl isocyanurate is 8 to 15% by mass.

The triallyl isocyanurate is a monomer having a molecular weight of about 250. By adding the triallyl isocyanurate prepolymer obtained by polymerizing the triallyl isocyanurate in a predetermined ratio, It enhances the shape retention of the paste and exudes,
It is possible to suppress bleeding and improve the filling filling in via holes, and at the time of curing the insulating substrate, the triallyl isocyanurate and triallyl isocyanurate prepolymer in the via hole conductor form a cured product and after curing. The shape retention of the via-hole conductor can also be improved.

In this case, it is desirable to add the triallyl isocyanurate prepolymer in an amount of 5 to 40 parts by mass based on 100 parts by mass of the triallyl isocyanurate.

This is because when the content of triallyl isocyanurate prepolymer is less than 5 parts by mass, the force for adhering the particles of triallyl isocyanurate in the paste to each other is reduced and the via hole is filled with the conductive paste. After that, triallyl isocyanurate existing near the upper surface of the via hole is settled by gravity, and voids are formed between the conductive particles on the upper surface, and a part of the conductive particles is handled by an operation such as handling or vibration. As a result of being scattered on the surface,
This is because if the scattered conductive particles are interposed between the adjacent via holes, the insulation resistance is deteriorated, which may adversely affect the reliability, or may cause a short circuit in some cases.

In addition, when screen printing or the like is performed, only the triallyl isocyanurate in the paste is preferentially flowed out and the viscosity changes continuously because the force of adhesion between the conductive powders of triallyl isocyanurate is low. This is because it cannot be printed.

On the contrary, if the content of triallyl isocyanurate prepolymer is more than 40 parts by mass, the triallyl isocyanurate prepolymer cannot be completely dissolved and the homogeneity of the paste is deteriorated, resulting in poor workability. This is because A particularly desirable range of the triallyl isocyanurate prepolymer is 8 parts by mass or more and 30 parts by mass or less, and 10 to 20 parts by mass is particularly suitable.

Further, the viscosity of the paste is set within a predetermined range,
In order to improve shape retention and filling properties into via holes, etc., and to suppress separation of triallyl isocyanurate and conductive particles, and to improve shape retention properties as paste and filling filling properties into via holes, tri- The weight average molecular weight of the allyl isocyanurate prepolymer is 1500 to 70.
000 is desirable.

In the present invention, in addition to the triallyl isocyanurate and the triallyl isocyanurate prepolymer, it is also possible to mix and use trimethallyl isocyanurate or triallyl cyanurate.

Further, it is possible to add a thermosetting resin, a curing agent, a curing accelerator and the like in a ratio of 15 parts by mass or less per 100 parts by mass of the conductive powder. The thermosetting resin is not particularly limited, and epoxy resin, polyimide resin, polyester resin or the like can be used. The curing agent and the curing accelerator are not particularly limited as long as they are used in epoxy resins and the like, and as the curing agent, phenol novolac resin, dicyandiamide, aromatic amines, diaminomaleonitrile,
Hydrazide, etc. as a curing accelerator, imidazoles,
Examples thereof include benzyldimethylamine.

Further, as radical polymerization initiators having effects as these curing agents and curing accelerators, organic peroxides such as hydroperoxide, dialkyl peroxide and diallyl peroxide are contained in an amount of 0.25 to 3% by mass based on the total amount. It can also be blended in a ratio. Since this organic peroxide accelerates the curing of triallyl isocyanurate, the curing temperature can be lowered by 30 ° C. or higher, particularly 50 ° C. or higher.

It is desirable not to add a radical reaction inhibitor or the like to the paste because it suppresses the curing of triallyl isocyanurate in the conductor wiring.

Further, in order to adjust the viscosity, a slight amount of isopropyl alcohol, theopineol, 2-octal, butyl carbitol acetate, etc. may be added to the conductive paste, but the insulating substrate and the conductor wiring may be heated. Since the solvent component volatilizes during curing, the packing density in the conductor wiring decreases, and there is a problem that the insulating layer swells due to the volatile gas, it is desirable that the solvent is not substantially contained.

In order to prepare the conductive paste, the above composition can be kneaded with a stirring and defoaming machine, a planetary mixer, a rotary mill, a triple roll or the like to prepare a conductive paste having a predetermined viscosity.

Regarding the viscosity of the conductive paste mixed by the above mixing method, a fine-pitch via-hole conductor can be formed without sagging or bleeding when printed, and the paste is embedded in the via-hole. In order to improve the filling capacity, 2 at shear rate = 100 s ^-1
It is desirable that the pressure is 0 to 1000 Pa · s.

Next, a method for producing a wiring board using the above conductive paste will be described. First, FIG. 1 (a)
As shown in, via holes 12 are formed in the uncured or semi-cured soft insulating sheet 11 by laser processing, a micro drill, or the like.

The insulating sheet 11 is made of an insulating material containing at least a thermosetting resin. Specifically, examples of the organic resin include PPE (polyphenylene ether), BT resin (bismaleimide triazine), and epoxy resin. Synthetic resins such as polyimide, polyimide resin, fluororesin, phenol resin and the like can be used, but PPE is particularly preferable because it has good dielectric properties and low water absorption.
It is desirable to contain (polyphenylene ether).

In addition, a filler may be compounded in the organic resin in order to increase the strength of the entire substrate. As the filler, SiO ₂ , Al ₂ O ₃ , Zr
O ₂ , TiO ₂ , AlN, SiC, BaTiO ₃ , SrT
Inorganic fillers such as iO ₃ , zeolite and CaTiO ₃ are preferably used. Alternatively, a non-woven fabric or a woven fabric made of glass or aramid resin may be impregnated with the above resin before use. When compounding with the filler in this way, it is desirable that the organic resin and the filler are compounded at a volume ratio of 30:70 to 70:30.

Then, as shown in FIG. 1B, the shear rate = 1 in the via hole 12 as described above.
At 00 s ⁻¹ , the conductive paste prepared to 20 to 1000 Pa · s is filled by screen printing or the like to form the via hole conductor 13. According to the conductive paste of the present invention, it is possible to prevent the conductive paste from flowing out from the via hole 12 and improve the filling and filling property of the paste into the via hole 12. In addition, if the viscosity of the conductive paste is within the above range, the paste filled in the via holes 12 can be formed so that a part of the upper surface thereof protrudes from the surface of the insulating sheet 11, and this can be formed into a conductor wiring layer described later. At the time of stacking or when the insulating sheet 11 is laminated, the connectivity between the via-hole conductor 13 and the conductor wiring layer can be improved.

After filling the paste, if desired,
By cooling to below the melting point of the organic binder, the viscosity of the conductive paste in the via hole 12 is reduced to a shear rate of 1
At 00 s ⁻¹ , the shape retention of the paste in the via hole 12 can be enhanced by increasing it to 760 to 2500 Pa · s, and the sagging of the paste from the via hole 12 and the bleeding can be prevented.

In addition, an excessive amount of triallyl isocyanurate in the paste filled in the via hole 12 which does not hinder the shape retention in the paste filled in the via hole 12 by vacuum suction on the opposite surface of the via hole 12 at the time of filling the paste. By removing the resin component such as the triallyl isocyanurate prepolymer and the like, the resistance of the via-hole conductor 13 can be reduced and the filling density of the conductive particles can be increased, which has the effect of improving the connection reliability.

Next, the conductor wiring layer 14 is formed on the surface of the insulating sheet 11 on which the via-hole conductor 13 is formed. As the conductor wiring layer 14, at least one kind selected from copper, aluminum, gold, and silver, or an alloy of two or more kinds,
In particular, a thickness of 5-40 μm made of copper or an alloy containing copper
By forming the via-hole conductor 13 from the metal foil of m, the both ends of the via-hole conductor 13 can be sealed and the influence of the outside air can be prevented, and the via-hole conductor 13 formed by filling the conductive paste.
Most desirable because it has excellent electrical connectivity with.

The conductor wiring layer 14 is formed of this metal foil by a) a method in which a metal foil is attached to the surface of the insulating sheet 11 and then etched to form a circuit pattern,
b) A method in which a resist is formed on the surface of the insulating sheet 11 and a metal foil layer is formed by plating, c) A metal foil is attached to the surface of the transfer sheet, and then an etching treatment is performed to form a circuit pattern. A method of transferring the circuit pattern of the foil to the surface of the insulating sheet 11 may be mentioned. Among them, it is not necessary to immerse the insulating sheet 11 in an etching or plating solution and prevent chemicals from entering the via-hole conductor 13. For this purpose, the transfer method of c) is most desirable.

Therefore, the description will be given below with reference to c) a conductor wiring layer formed by the transfer method. As shown in FIG. 1C, the conductor wiring layer 14 made of a metal foil is formed on the surface of the transfer sheet 15. The conductor wiring layer 14 is formed by adhering a metal foil to the surface of the transfer sheet 15 with an adhesive, applying a resist in a circuit pattern on the surface of the metal foil, and then performing etching treatment and resist removal. . At this time, the exposed surface of the conductor wiring layer 14 made of a metal foil has a surface roughness (Ra) of 0.1 to 5 μm, particularly 0.
It is desirable that the surface is roughened to about 2 to 4 μm.

Then, as shown in FIG. 1D, the transfer sheet 15 having the conductor wiring layer 14 formed thereon is aligned with the surface of the soft insulating sheet 11 having the via-hole conductor 13 formed thereon and pressed. After stacking, the transfer sheet 15 is peeled off and the conductor wiring layer 14 is transferred to the insulating sheet 11 to form the wiring layer a.

At this time, since the insulating sheet 11 is in the soft state, the conductor wiring layer 14 is embedded in the surface of the insulating sheet 11, and the surface of the insulating sheet 11 and the conductor wiring layer 1 are substantially formed.
4 is pressure-laminated so that the surfaces of 4 are flush with each other. The pressure laminating conditions at this time are a pressure of 2 MPa or more and a temperature of 60.
A temperature of ~ 240 ° C is suitable.

Then, one unit of the wiring layer a manufactured as described above and one unit of the wiring layers b and c manufactured in the same manner are laminated and pressure-bonded as shown in FIG. By heating to a temperature to completely cure the thermosetting resin in the insulating sheet 11, a multilayer wiring board can be manufactured.

According to the manufacturing method of the circuit transfer from the transfer sheet 15 described above, the formation and lamination of the via holes 12 in the insulating sheet 11 and the step of forming the conductor wiring layer 14 can be performed in parallel. The manufacturing time for the wiring board can be significantly reduced.

In the above manufacturing method, the insulating sheet 1 is used.
The complete curing of No. 1 and the heat treatment of the via-hole conductor 13 were collectively performed after forming the multilayer structure. This heat treatment should be performed on each insulating sheet 11 before being laminated and cured, and then laminated to form multiple layers. Is also possible.

Although the above-mentioned conductive paste is used for forming the via-hole conductor 13, the present invention is not limited to this, and the conductive paste of the present invention is used for the conductor wiring layer 14. You can also In this case, the conductive wiring layer 14 can be formed by printing a conductive paste on the surface of the insulating sheet 11 by a screen printing method or the like. Even in such a case, the conductive paste of the present invention has the effect of improving the shape retention of the conductor wiring layer 14.

[0050]

[Example] (Preparation of conductive paste) First, the average particle size is 5μ.
m conductive powder (silver content 3% by mass for Ag-coated Cu powder), triallyl isocyanurate, and 1- (2-hydroxypropyl) -3 as a derivative having a cyanuric acid skeleton containing a hydroxyl group as a substituent. , 5-di-2
-Propenyl-isocyanurate (HDPIC) or 1,3-bis (2-hydroxypropyl) -5- (2
-Propenyl) -isocyanurate (BHPIC),
Was prepared at the ratio shown in Table 1. The average molecular weight is 30
000 to 60,000 triallyl isocyanurate prepolymer (TAICPP) was added at a ratio shown in Table 1 and diallyl peroxide was added at a ratio of 1% by mass, and the mixture was kneaded with a three-roll to prepare a conductive paste. Also, using a cone type viscometer with a diameter of 20 mm, a shear rate of 10
The viscosity at ^{0 s -1} was measured and is shown in Table 1. (Fabrication of Wiring Board) On the other hand, the diameter of the micro-drill was 200 μm with respect to the B-stage insulating sheet composed of 40% by volume of polyphenylene ether resin and 60% by volume of silica.
m via hole, the distance between the center of the via hole is 500 μm
And two conductive pastes prepared as described above were filled in the via holes.

Then, a conductor wiring layer made of a copper foil having a thickness of 12 μm is attached to both sides of the B-stage insulating sheet in which the conductive paste is embedded by a transfer method so as to sandwich both ends of the via-hole conductor. At 200 ° C
Curing treatment was performed at a pressure of 2 MPa for 60 minutes to produce a single-layer wiring board.

The volume resistivity (described as via resistance in the table) of the via-hole conductor in the obtained wiring board was measured and is shown in Table 1. The measurement of the volume resistivity is
This is a measurement of resistance between conductor wiring layers made of metal foil sandwiching a via hole conductor from both sides.

Also, after the wiring board after curing is heated to 200 ° C. and cooled, the state of leaching of the insulating board around the via-hole conductor forming portion is observed, and the maximum bleeding width around the via-hole conductor is measured. did. Moreover, the surface of the via-hole conductor was observed to observe the wet state of the metal particles and the resin component. As a result of the observation, a state where the entire surface of the metal particles is wet with the resin component and the space between the particles and the particles are densely filled with the resin component is 〇, a part of the metal particles is wet with the resin component, and a part of the metal particles is The state where the shape can be clearly observed and a part of voids are observed between the metal particles is △, the resin is present on the surface of the metal particles and the individual particles are independently present, and the voids are present between the particles. The results are shown in Table 1 with the state of being marked as x.

[0054]

[Table 1]

As is clear from the results of Table 1, when the derivative was not contained (Nos. 1 and 7), bleeding was large,
Moreover, the via-hole conductor has no wettability between particles and resin,
There were many pores in the via-hole conductor.

On the other hand, by including a derivative having a cyanuric acid skeleton containing a hydroxyl group as a substituent, bleeding is reduced, and at the same time, the via-hole conductor is completely wetted with particles and resin, so that the inside of the via-hole conductor is almost free. There were no pores. Particularly good results were obtained when the amount of the derivative was 5 to 50 parts by mass in the ratio with the triallyl isocyanurate.

[0057]

As described in detail above, the conductive paste of the present invention effectively prevents bleeding of triallyl isocyanurate on an insulating substrate even when used as a filling material for via-hole conductors, etc. It is possible to realize stable formation of via-hole conductors and the like without impairing the insulating property of the substrate, excellent in shape retention by the conductive paste, and filling and filling in via-holes.

[Brief description of drawings]

FIG. 1 is a process drawing for explaining an example of a method for manufacturing a wiring board according to the present invention.

[Explanation of symbols]

11 Insulation sheet 12 beer hall 13 Via hole conductor 14 Conductor wiring layer 15 Transfer sheet

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 3/46 H05K 3/46 GN F term (reference) 4E351 AA01 BB01 BB24 BB26 BB31 BB49 CC11 DD04 DD05 DD06 DD12 DD19 DD20 EE02 EE03 EE11 EE28 GG09 GG11 5E317 AA24 BB01 BB11 BB12 BB13 BB14 BB15 CC25 CD21 CD32 GG01 GG01 GG11 GG22 BB22 BB22 BB22 BB22 HH07 5G301 DA03 DA05 DA06 DA10 DA11 DA13 DA42 DD01

Claims (14)

[Claims] 1. A conductive paste containing triallyl isocyanurate, a derivative having a cyanuric acid skeleton containing a hydroxyl group as a substituent, and a conductive powder. 2. The derivative is 1- (2-hydroxypropyl) -3,5-di-2-propenyl-isocyanurate or 1,3-bis (2-hydroxypropyl)-.
The conductive paste according to claim 1, which is 5- (2-propenyl) -isocyanurate. 3. The conductive powder is gold, silver, palladium,
The conductive paste according to claim 1 or 2, which is at least one selected from the group consisting of copper, nickel, tin and lead. 4. The conductive material according to claim 1, wherein the derivative is added in a ratio of 5 to 50 parts by mass in a total of 100 parts by mass with the triallyl isocyanurate. paste. 5. The conductive paste according to claim 1, wherein the triallyl isocyanurate is contained in a proportion of 7 to 20 mass% in the total amount. 6. The triallyl isoiyanurate prepolymer is added in an amount of 5 to 40 parts by mass in a total of 100 parts by mass with the triallyl isocyanurate prepolymer. The conductive paste according to any one of the above. 7. The conductive paste according to claim 6, wherein the triallyl isocyanurate prepolymer has a weight average molecular weight of 1500 to 70,000. 8. A step of filling a via hole formed in an uncured or semi-cured insulating sheet containing at least an organic resin with a conductive paste to form a via hole conductor, and the insulating including the via hole conductor forming portion. A method of manufacturing a wiring board, comprising: a step of forming a conductor wiring layer on a surface of a sheet; and a step of stacking and integrating the insulating sheets and heating them to a curing temperature of the organic resin to collectively cure them. A conductive paste containing triallyl isocyanurate, a derivative having a cyanuric acid skeleton containing a hydroxyl group as a substituent, and a conductive powder is applied or filled to form the via-hole conductor and / or the conductor wiring layer. A method for manufacturing a wiring board, comprising: 9. The derivative in the conductive paste is 1-
It is (2-hydroxypropyl) -3,5-di-2-propenyl-isocyanurate or 1,3-bis (2-hydroxypropyl) -5- (2-propenyl) -isocyanurate. Item 9. A method for manufacturing a wiring board according to item 8. 10. The conductive powder in the conductive paste is at least one selected from the group consisting of gold, silver, palladium, copper, nickel, tin and lead. Item 10. A method for manufacturing a wiring board according to Item 9. 11. The derivative in the electroconductive paste is added to triallyl isocyanurate in a total amount of 100 parts by mass to give 5
The method for manufacturing a wiring board according to claim 8, wherein the amount is added in an amount of ˜50 parts by mass. 12. The method of manufacturing a wiring board according to claim 8, wherein the triallylisoianurate in the conductive paste is added in an amount of 7 to 20% by mass based on the total amount. 13. The conductive paste containing 5 to 40 parts by mass of triallyl isoiyanurate prepolymer is added to 100 parts by mass of the triallyl isocyanurate prepolymer. The method for manufacturing a wiring board according to claim 12. 14. The method for producing a wiring board according to claim 13, wherein the triallyl isocyanurate prepolymer has a weight average molecular weight of 1500 to 70,000.