JP2003092471A5 - - Google Patents

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Publication number
JP2003092471A5
JP2003092471A5 JP2002188664A JP2002188664A JP2003092471A5 JP 2003092471 A5 JP2003092471 A5 JP 2003092471A5 JP 2002188664 A JP2002188664 A JP 2002188664A JP 2002188664 A JP2002188664 A JP 2002188664A JP 2003092471 A5 JP2003092471 A5 JP 2003092471A5
Authority
JP
Japan
Prior art keywords
resin film
multilayer wiring
copper foil
conductive paste
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002188664A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003092471A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002188664A priority Critical patent/JP2003092471A/ja
Priority claimed from JP2002188664A external-priority patent/JP2003092471A/ja
Priority to US10/190,496 priority patent/US6768064B2/en
Priority to TW091115224A priority patent/TW569653B/zh
Priority to CNB021261636A priority patent/CN1301045C/zh
Priority to KR10-2002-0039998A priority patent/KR100522385B1/ko
Publication of JP2003092471A publication Critical patent/JP2003092471A/ja
Priority to US10/832,433 priority patent/US7122746B2/en
Priority to US10/832,436 priority patent/US6914200B2/en
Publication of JP2003092471A5 publication Critical patent/JP2003092471A5/ja
Pending legal-status Critical Current

Links

JP2002188664A 2001-07-10 2002-06-27 多層配線板、多層配線用基材及びその製造方法 Pending JP2003092471A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2002188664A JP2003092471A (ja) 2001-07-10 2002-06-27 多層配線板、多層配線用基材及びその製造方法
US10/190,496 US6768064B2 (en) 2001-07-10 2002-07-09 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
TW091115224A TW569653B (en) 2001-07-10 2002-07-09 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
CNB021261636A CN1301045C (zh) 2001-07-10 2002-07-10 多层接线板组件制造方法及多层接线板组件
KR10-2002-0039998A KR100522385B1 (ko) 2001-07-10 2002-07-10 다층 회로 기판 어셈블리, 다층 회로 기판 어셈블리 부품및 그들의 제조 방법
US10/832,433 US7122746B2 (en) 2001-07-10 2004-04-27 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
US10/832,436 US6914200B2 (en) 2001-07-10 2004-04-27 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-209595 2001-07-10
JP2001209595 2001-07-10
JP2002188664A JP2003092471A (ja) 2001-07-10 2002-06-27 多層配線板、多層配線用基材及びその製造方法

Publications (2)

Publication Number Publication Date
JP2003092471A JP2003092471A (ja) 2003-03-28
JP2003092471A5 true JP2003092471A5 (cg-RX-API-DMAC10.html) 2005-09-08

Family

ID=26618449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002188664A Pending JP2003092471A (ja) 2001-07-10 2002-06-27 多層配線板、多層配線用基材及びその製造方法

Country Status (1)

Country Link
JP (1) JP2003092471A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6027372B2 (ja) * 2012-08-29 2016-11-16 住友電工プリントサーキット株式会社 両面プリント配線板及びその製造方法

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