JP2003092471A5 - - Google Patents

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Publication number
JP2003092471A5
JP2003092471A5 JP2002188664A JP2002188664A JP2003092471A5 JP 2003092471 A5 JP2003092471 A5 JP 2003092471A5 JP 2002188664 A JP2002188664 A JP 2002188664A JP 2002188664 A JP2002188664 A JP 2002188664A JP 2003092471 A5 JP2003092471 A5 JP 2003092471A5
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JP
Japan
Prior art keywords
resin film
multilayer wiring
copper foil
conductive paste
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002188664A
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Japanese (ja)
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JP2003092471A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2002188664A priority Critical patent/JP2003092471A/en
Priority claimed from JP2002188664A external-priority patent/JP2003092471A/en
Priority to TW091115224A priority patent/TW569653B/en
Priority to US10/190,496 priority patent/US6768064B2/en
Priority to CNB021261636A priority patent/CN1301045C/en
Priority to KR10-2002-0039998A priority patent/KR100522385B1/en
Publication of JP2003092471A publication Critical patent/JP2003092471A/en
Priority to US10/832,436 priority patent/US6914200B2/en
Priority to US10/832,433 priority patent/US7122746B2/en
Publication of JP2003092471A5 publication Critical patent/JP2003092471A5/ja
Pending legal-status Critical Current

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Claims (16)

熱硬化性の樹脂からなる接着性を有する樹脂フィルムの一方の面に銅箔が貼り付けられると共に、前記銅箔及び樹脂フィルムを貫通するように貫通孔が形成された銅張樹脂フィルムと、
この銅張樹脂フィルムの貫通孔に、前記銅箔側から先端が前記樹脂フィルム側に突出するように埋め込まれた導電ペーストと
を備えてなることを特徴とする多層配線用基材。A copper foil is attached to one surface of an adhesive resin film made of a thermosetting resin, and a copper-clad resin film having a through-hole formed so as to penetrate the copper foil and the resin film;
A substrate for multilayer wiring, comprising: a conductive paste embedded in a through hole of the copper-clad resin film so that a tip protrudes from the copper foil side to the resin film side. 前記導電ペーストは、前記銅箔の貫通孔の開口部周辺にはみ出るように前記貫通孔に埋め込まれていることを特徴とする請求項１記載の多層配線用基材。The conductive paste, the copper foil multilayer wiring substrate according to claim 1, characterized in that it is embedded in the through hole so as to extend to the outside of the periphery of an opening of the through hole of the. 請求項１，２のいずれか１項記載の多層配線用基材を、前記導電ペーストの先端が隣接する多層配線用基材の銅箔又は導電ペーストと接続されるように複数積層してなる多層配線板。A multilayer formed by laminating a plurality of the multilayer wiring substrates according to any one of claims 1 and 2 so that the tip of the conductive paste is connected to a copper foil or a conductive paste of the multilayer wiring substrate adjacent to each other. Wiring board. 熱硬化性の樹脂からなる接着性を有する樹脂フィルムの一方の面に銅箔が貼り付けられた銅張樹脂フィルムに、前記銅箔及び樹脂フィルムを貫通する貫通孔を形成する工程と、
前記貫通孔に、前記銅箔側から先端が前記樹脂フィルム側に突出するように導電ペーストを埋め込む工程と
を備えてなることを特徴とする多層配線用基材の製造方法。Forming a through-hole penetrating the copper foil and the resin film on the copper-clad resin film in which the copper foil is bonded to one surface of the resin film having adhesiveness made of thermosetting resin;
And a step of embedding a conductive paste in the through-hole so that a tip protrudes from the copper foil side to the resin film side. 熱硬化性の樹脂からなる接着性を有する樹脂フィルムの一方の面に銅箔が貼り付けられた銅張樹脂フィルムに、前記銅箔をエッチングして所定の回路パターンを形成する工程と、
前記回路パターンが形成された銅張樹脂フィルムの前記樹脂フィルム側にマスク層を形成する工程と、
前記銅箔、樹脂フィルム及びマスク材を貫通する貫通孔を形成する工程と、
前記貫通孔に、前記銅箔側から導電ペーストを埋め込む工程と、
前記マスク材を除去する工程と
を備えてなることを特徴とする多層配線用基材の製造方法。A step of etching the copper foil to form a predetermined circuit pattern on a copper-clad resin film having a copper foil attached to one surface of an adhesive resin film made of a thermosetting resin; and
Forming a mask layer on the resin film side of the copper-clad resin film on which the circuit pattern is formed;
Forming a through-hole penetrating the copper foil, resin film and mask material;
Embedding the conductive paste from the copper foil side into the through hole;
And a step of removing the mask material. A method for producing a multilayer wiring substrate. 請求項１，２のいずれか１項記載の多層配線用基材を、前記導電ペーストの先端が隣接する多層配線用基材の銅箔又は導電ペーストと接続されるように複数積層して前記接着性を有する樹脂フィルムによって貼り合わせるようにしたことを特徴とする多層配線板の製造方法。A multilayer wiring substrate according to any one of claims 1 and 2 , wherein a plurality of the wiring paste base materials are laminated so that a tip of the conductive paste is connected to a copper foil or a conductive paste of the adjacent multilayer wiring substrate. A method for producing a multilayer wiring board, wherein the resin film is bonded together with a resin film. 前記接着性を有する樹脂フィルムは、熱硬化型のポリイミドからなることを特徴とする請求項１，２，４又は５記載の多層配線用基材および多層配線用基材の製造方法。The resin film having adhesiveness, the method according to claim 1, 2, 4 or multilayer wiring substrate 5 described and multilayer wiring substrate characterized by comprising the thermosetting polyimide. 前記接着性を有する樹脂フィルムは、ガラエポのプリプレグからなることを特徴とする請求項１，２，４又は５記載の多層配線用基材および多層配線用基材の製造方法。The resin film having adhesiveness, the method according to claim 1, 2, 4 or multilayer wiring substrate 5 described and multilayer wiring substrate characterized by comprising the prepreg glass epoxy. 前記接着性を有する樹脂フィルムは、アラミドのプリプレグからなることを特徴とする請求項１，２，４又は５記載の多層配線用基材および多層配線用基材の製造方法。The resin film having adhesiveness, the method according to claim 1, 2, 4 or multilayer wiring substrate 5 described and multilayer wiring substrate characterized by comprising the aramid prepreg. 熱硬化機能を付与した熱可塑性の樹脂からなる接着性を有する樹脂フィルムの一方の面に銅箔が貼り付けられると共に、前記銅箔及び樹脂フィルムを貫通するように貫通孔が形成された銅張樹脂フィルムと、
この銅張樹脂フィルムの貫通孔に、前記銅箔側から先端が前記樹脂フィルム側に突出するように埋め込まれた導電ペーストと
を備えてなることを特徴とする多層配線用基材。Copper with a copper foil attached to one surface of an adhesive resin film made of a thermoplastic resin having a thermosetting function, and a through hole formed so as to penetrate the copper foil and the resin film A tension resin film;
A substrate for multilayer wiring, comprising: a conductive paste embedded in a through hole of the copper-clad resin film so that a tip protrudes from the copper foil side to the resin film side. 前記導電ペーストは、前記銅箔の貫通孔の開口部周辺にはみ出るように前記貫通孔に埋め込まれていることを特徴とする請求項１０記載の多層配線用基材。The base material for multilayer wiring according to claim 10 , wherein the conductive paste is embedded in the through hole so as to protrude around the opening of the through hole of the copper foil. 請求項１０，１１のいずれか１項記載の多層配線用基材を、前記導電ペーストの先端が隣接する多層配線用基材の銅箔又は導電ペーストと接続されるように複数積層してなる多層配線板。A multilayer formed by laminating a plurality of the multilayer wiring substrates according to any one of claims 10 and 11 so that the tip of the conductive paste is connected to the copper foil or conductive paste of the adjacent multilayer wiring substrate. Wiring board. 前記樹脂フィルムが可撓性を有する材料からなることを特徴とする請求項１，１０のいずれか１つに記載の多層配線用基材。The base material for multilayer wiring according to claim 1 , wherein the resin film is made of a flexible material. 前記樹脂フィルムがリジット材料からなることを特徴とする請求項１，１０のいずれか１つに記載の多層配線用基材。The multilayer wiring substrate according to claim 1 , wherein the resin film is made of a rigid material. 前記樹脂フィルムが可撓性を有する材料からなることを特徴とする請求項３あるいは１２に記載の多層配線板。The multilayer wiring board according to claim 3 or 12 , wherein the resin film is made of a flexible material. 前記樹脂フィルムがリジット材料からなることを特徴とする請求項３あるいは１２に記載の多層配線板。The multilayer wiring board according to claim 3 or 12 , wherein the resin film is made of a rigid material.
JP2002188664A 2001-07-10 2002-06-27 Multi-layer wiring board, base material for multi-layer wiring and manufacturing method therefor Pending JP2003092471A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2002188664A JP2003092471A (en) 2001-07-10 2002-06-27 Multi-layer wiring board, base material for multi-layer wiring and manufacturing method therefor
TW091115224A TW569653B (en) 2001-07-10 2002-07-09 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
US10/190,496 US6768064B2 (en) 2001-07-10 2002-07-09 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
CNB021261636A CN1301045C (en) 2001-07-10 2002-07-10 Multilayer terminal plate assembly, multilayer terminal plate assembly unit and its manufacturing method
KR10-2002-0039998A KR100522385B1 (en) 2001-07-10 2002-07-10 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
US10/832,436 US6914200B2 (en) 2001-07-10 2004-04-27 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
US10/832,433 US7122746B2 (en) 2001-07-10 2004-04-27 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-209595 2001-07-10
JP2001209595 2001-07-10
JP2002188664A JP2003092471A (en) 2001-07-10 2002-06-27 Multi-layer wiring board, base material for multi-layer wiring and manufacturing method therefor

Publications (2)

Publication Number Publication Date
JP2003092471A JP2003092471A (en) 2003-03-28
JP2003092471A5 true JP2003092471A5 (en) 2005-09-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002188664A Pending JP2003092471A (en) 2001-07-10 2002-06-27 Multi-layer wiring board, base material for multi-layer wiring and manufacturing method therefor

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JP (1) JP2003092471A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6027372B2 (en) * 2012-08-29 2016-11-16 住友電工プリントサーキット株式会社 Double-sided printed wiring board and manufacturing method thereof

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