JP2003091705A - Ic card and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card capable of reducing a rejection rate and its manufacturing method. SOLUTION: In this IC card 1 provided with a board 2, an IC chip 3 mounted on the board 2, IC terminals 5, 6 mounted on the IC chip 3, and an antenna 4 connected to the IC terminals 5, 6 and mounted on the board 2, a separated part 10d formed by partially separating the insulating coating of a conductor is formed in advance in a process of supplying the conductor with an insulating coating, the conductor 10 is placed on the board 2 to form the antenna 4, and the separated part 10d is conducted to the IC terminals 5, 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contactless IC card for wirelessly transmitting and receiving information signals and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, a non-contact type IC card which transmits and receives information between an IC card and a terminal device using electromagnetic waves as a medium has become widespread.

Conventionally, as this type of IC card, for example, Japanese Patent No. 2810547 discloses one in which a conductive wire forming an antenna is joined or embedded in the surface of a substrate by ultrasonic vibration or the like.

[0004]

However, in such a conventional IC card, when a conductive wire having an insulating coating is used as an antenna, the insulating coating is removed from the substrate when the conductive wire is conducted to the IC terminal. It was necessary to do so, and at that time, there was a possibility that problems such as disconnection might occur.

There is also a method of heating a conductor wire while pressing it against an IC terminal by using a fusing head or the like, and fusing the conductor wire to the IC terminal while destroying the insulating coating by heat. The IC chip may be affected by heat and the IC card may be defective.

The present invention has been made in view of the above problems, and it is an object of the present invention to provide an IC card and a method of manufacturing the same that can suppress the defective product generation rate to a low level.

[0007]

A first invention is a substrate,
It is applied to an IC card provided with an IC chip provided on this substrate, an IC terminal provided on this IC chip, and an antenna connected to this IC terminal.

Then, in the process of supplying the conductive wire having the insulating coating, a peeling portion is formed in advance by partially peeling off the insulating coating, and the conductive wire is arranged on the substrate to form an antenna.
The peeled portion is electrically connected to the IC terminal.

A second aspect of the present invention comprises a substrate, an IC chip provided on the substrate, an IC terminal provided on the IC chip, and an antenna connected to the IC terminal.
Applies to C card manufacturing method.

Then, in the process of supplying the conductive wire having the insulating coating, a peeling step of forming a peeling portion where the insulating coating is partially peeled off in advance, and a conductive wire arrangement for arranging the conductive wire on a substrate to form an antenna. And the peeling process
It is characterized in that it is electrically connected to the terminal.

[0011]

According to the first and second inventions,
Since the insulating coating is partially peeled off in advance in the process of supplying the conductive wire and then mounted on the substrate, it is not necessary to remove the insulating coating on the substrate, and it is possible to avoid the occurrence of defects such as disconnection, and to generate defective IC cards. The rate can be lowered.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the accompanying drawings.

As shown in FIG. 1, an IC card 1 has a substrate 2 formed in a substantially rectangular shape, an IC chip 3 disposed on the substrate 2, and an IC chip 3 electrically disposed on the substrate 2. And an exterior film 7 attached on the substrate 2.

The IC chip 3 includes a transmission / reception circuit for exchanging information signals, a power supply circuit, an arithmetic processing circuit, a memory circuit, etc.
Electric power is supplied to and from the card reader / writer using electromagnetic waves as a medium, and information is exchanged.

The substrate 2 has a thin plate-shaped card body 15 made of various resins or paper, and a fusion layer 16 formed by coating the surface of the card body 15 with a thermoplastic resin.

The antenna 4 is a conducting wire 1 provided on the substrate 2.
0, and the antenna coil portion 10c arranged in a substantially rectangular coil shape, and the IC terminal 5 of the IC chip 3
6 and terminal portions 10a and 10b connected to the terminal 6.

FIG. 2 shows a wiring device 20 for mounting the antenna 4 on the substrate 2. The wiring device 20 includes a conductor 10
And a conductor 10 for feeding ultrasonic waves and vibrating ultrasonically.
A cutter 22 for cutting the substrate, a drive mechanism (not shown) for moving these in the three-dimensional direction on the substrate 2, and the like.

The melting head 21 presses the conductive wire 10 on the substrate 2 and moves while vibrating ultrasonically. As a result, the fusion layer 16 of the substrate 2 is melted, and the melting head 21 embeds and fixes the conductor wire 10 on the substrate 2 along the locus thereof.
In this way, the wiring device 20 carries out the conductor arranging step of mounting the conductor 10 on the substrate 2.

The conductive wire 10 has an insulating coating on its surface. In order to reduce the defective product generation rate, the gist of the present invention is to preliminarily form a peeling portion 10d in which the insulating coating is partially peeled in the process of supplying the conductive wire 10.

As shown in FIG. 2, the stripping device 30 is provided in the path for supplying the conductive wire 10 from the wire material supply source 40 to the wiring device 20.
Is provided. The peeling device 30 preliminarily forms a peeling portion 10d in which the insulating coating is partially peeled at the front and rear ends of the antenna 4 in the process of feeding the conductive wire 10. The peeling device 3
A specific configuration of 0 is disclosed in, for example, Japanese Patent Application No. 2001-92455 filed by the present applicant.

In this way, the peeling device 30 is used by the peeling device 30.
The peeling step of forming d is performed, and the peeling portion 10d is arranged on the substrate 2 by the wiring device 20.
It becomes the terminal portions 10a and 10b of the antenna 4.

The IC chip 3 is arranged at a predetermined position on the substrate 2 by a robot hand or the like, and is fixed to the substrate 2 by an adhesive agent bonded on the substrate 2. The IC chip 3 has a pair of IC terminals 5 and 6, and the IC terminals 5 and 6 are connected to the terminal portions 10a and 10b of the antenna 4 by using cream solder or the like. In this way, the peeling portion 10d is connected to the IC terminals 5, 6
The conducting step of conducting to is easily performed.

With the above configuration, the IC chip 3 constitutes a transmission / reception circuit via the antenna 4, and exchanges information signals with electromagnetic waves as a medium.

Since the insulating coating is partially peeled off in advance in the process of supplying the conductive wire 10, it is attached to the substrate 2,
It is not necessary to remove the insulating coating on the top, and it is possible to avoid a problem such as disconnection.

Further, it is not necessary to fuse the conductive wire 10 to the IC terminals 5 and 6 while destroying the insulating coating by heat using a fusing head or the like, and the IC chip 3 is prevented from being affected by heat.

Further, in the present embodiment, since the IC chip 3 is attached after the conductor wire 10 is attached on the substrate 2, it is possible to manufacture the substrate 2 with the antenna as a component separately from the IC chip 3. Productivity can be improved.

The present invention is not limited to the above embodiment, but may be applied to a combination type IC card capable of exchanging information through either an antenna or an external electrode terminal, and its technical idea. Obviously, various modifications can be made within the range.

[Brief description of drawings]

FIG. 1 is a plan view and a side view of an IC card showing an embodiment of the present invention.

FIG. 2 is a configuration diagram of a manufacturing apparatus.

[Explanation of symbols]

1 IC card 2 substrates 3 IC chips 4 antenna 5,6 IC terminal 10 conductors 10a, 10b terminal part 10c Antenna coil part 10d peeling part 20 wiring equipment 30 peeling device 40 wire rod supply source

Claims (2)

[Claims] 1. An IC card including a substrate, an IC chip provided on the substrate, an IC terminal provided on the IC chip, and an antenna electrically connected to the IC terminal, wherein a conductor having an insulating coating is provided. In the process of supplying, a peeling part where the insulating coating is partially peeled off is formed in advance, the conducting wire is arranged on the substrate to form the antenna, and the peeling part is electrically connected to the IC terminal. The characteristic IC card. 2. A method of manufacturing an IC card, comprising: a substrate; an IC chip provided on the substrate; an IC terminal provided on the IC chip; and an antenna electrically connected to the IC terminal. A peeling step of preliminarily forming a peeling portion that partially peels off the insulating coating in the process of supplying the conducting wire, and a conducting wire arranging step of arranging the conducting wire on the substrate to form the antenna, A method of manufacturing an IC card, wherein the peeling portion is electrically connected to the IC terminal.