JP2003089001A - Method and device for processing array shape, component for molding array element, and array element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and device for processing array shapes, components for molding array elements, for forming array shapes such as spherical, nonspherical, etc., with enhanced accuracy by aligning array positions on the work accurately and quickly, and an array element. SOLUTION: The processing device 1 processes the work 5 provided in advance with aligning grooves 6 showing the relative position to the center of the array surface to be formed at the array forming surface at a certain pitch, and the work 5 is mounted on a rotary main shaft 3, and the aligning grooves 6 are sensed by a groove sensor 15 or groove position detector 30, and coordination of the aligning grooves 6 with the rotary main shaft 3 is performed, and the work 5 is positioned, and the array surface processing is made to the array forming surface. This allows precise positioning of the work 5 with the rotary main shaft 3, and the array surface can be processed accurately and quickly.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an array shape processing method, an array shape processing apparatus, an array element molding product, and an array element, and more particularly, when forming an array shape such as a spherical surface or an aspherical surface on a workpiece. The present invention relates to an array shape processing method, an array shape processing apparatus, an array element molding article, and an array element, which are capable of accurately and quickly aligning an array of a workpiece to form an array shape with good shape accuracy.

[0002]

2. Description of the Related Art In recent years, solid-state writing units using a microlens array have been studied, and this system has advantages such as higher speed and smaller size than conventional LD raster writing units.

The microlens array has a plurality of axisymmetric spherical surfaces or aspherical surfaces, and when processing a microlens array having a plurality of axisymmetric spherical surfaces or aspherical surfaces, generally, as shown in FIG. This is done using a processing machine. In FIG. 11, the rotary spindle 100 of the processing machine
On the surface (processing surface) on which the machining of
The workpiece 101 is attached according to the rotation center 100a of the
d is sequentially set to a position that coincides with the rotation center 100a of the rotating spindle 100, and as shown by the arc arrows in FIG.
The array surface machining is performed on the workpiece 101 with the cutting tool 102 while rotating the rotary spindle 100.

Then, processing of one array surface, for example,
When the array surface is processed at the array surface processing position 102a shown by hatching in FIG. 12A, as shown in FIG. 12B, the array surface processing position to be processed next, for example, FIG. By shifting the set position of the workpiece 101 on the rotary spindle 100 to the array surface machining position 102b shown by hatching in b), the array surface axis to be formed at the next array surface machining position and the rotation center 100a of the rotary spindle 100 are formed. Then, the next array surface is processed. Thereafter, this work procedure is sequentially repeated to perform array-shaped processing on all array surface processing positions 101a to 101d of the workpiece 101.

As described above, in processing the array shape, the array surface processing position 101a of the workpiece 101 is processed.
It is necessary to perform the alignment work for matching the rotation center 100a of the main spindle 100 with the rotation axis 101 to 101d. Conventionally, this alignment work is performed by moving the workpiece 101 while detecting the position of the workpiece 101 with a probe or the like. , The position is adjusted.

[0006]

However, in the conventional array shape processing method, the alignment work for matching the array surface processing positions 101a to 101d of the workpiece 101 and the rotation center 100a of the rotary spindle 100 is performed. Thing 1
Since the workpiece 101 is moved while detecting the position of 01 with a probe or the like and the position is adjusted,
There is a problem in that the alignment accuracy becomes unstable, the alignment takes a long time, and the workability is poor.

That is, when the array surface is machined at the array surface machining positions 101a to 101d at the same pitch on the workpiece 101, the position of the workpiece 101 on the rotary spindle 100 is adjusted to the pitch of the array surface machining positions 101a to 101d. It is necessary to adjust the position at the same pitch, but in the above-mentioned conventional method, there are many cases where an error occurs in the pitch or a vertical position shift occurs. To prevent such a pitch error or position shift, In addition, there is a problem that it requires a long time position adjustment work.

In such a case, as a method of aligning the center of rotation of the main spindle with the center of the array processing position, a circular marker whose center is aligned with the center of the array processing position (array surface) is used as a workpiece. It is possible to use a method in which the marker is formed at the array processing position, the center position of the marker is aligned with the rotation center of the rotation spindle, and the position is adjusted.

However, this method is superior in that it can detect a circular marker in two dimensions,
If the surface on which the circular marker is made has poor surface roughness,
As shown in FIG. 13A, a marker 1 with good contour accuracy
03a is requested, while FIG.
A marker 103b having poor contour accuracy as shown in (c),
However, there is a problem in that the detection accuracy is deteriorated.

Further, as shown in FIG.
In forming the array surface 105 on the substrate, in order to facilitate the positional adjustment between the rotation spindle and the array processing position, as shown in FIGS. 15 and 16, the indenter is pressed against the workpiece 104 to produce the marker 106. The depth d of the array surface 105
(See FIG. 14), as shown in FIG.
When the depth is larger than the depth of the marker 106 formed at the array processing position of, there is no problem, but as shown in FIG.
Markers 10 to be formed at array processing positions of the work piece 104
When the depth is less than 6, the marker 106 cannot be removed by processing the array surface 105, and the processing accuracy of the array surface 105 deteriorates.

Therefore, according to the first aspect of the present invention, the workpiece attached to the rotary spindle is rotated around the center of rotation of the rotary spindle to machine the array surface, and then the workpiece is subjected to the next machining. Move to the center position of the array surface until the center of rotation of the rotation spindle is located, rotate the workpiece around the center of rotation, and perform the process of processing the next array surface. When sequentially processing an array surface such as a spherical surface or an aspherical surface, a positioning groove that indicates a relative position with respect to the center position of the array surface formed on the processing surface is formed in advance on the processing surface of the workpiece with a desired pitch distance. By adjusting the position of the alignment groove and the rotary spindle to position the workpiece in the array direction and processing the array surface on the processing surface, the surface roughness of the array forming surface is affected. Without Also, by forming a positioning groove that is shallower than the indentation due to the pressing of the indenter when forming a circular marker, the workpiece and the rotary spindle can be accurately positioned, and even a deeper array surface can be formed. An object of the present invention is to provide an array shape processing method capable of processing an array surface with high accuracy and speed without being affected by positioning grooves.

According to a second aspect of the present invention, the positioning groove is formed at a position on the processed surface of the workpiece that does not affect the formation of the array surface in a direction orthogonal to the array direction of the array surface. The degree of freedom of shape and groove depth is increased, positioning grooves can be formed easily and appropriately, the workpiece and rotating spindle can be positioned more accurately, and the array surface can be processed with higher accuracy and speed. It is an object of the present invention to provide an array shape processing method capable of performing the above.

According to the third aspect of the present invention, the positioning groove is formed in a V-shaped cross section, so that the positioning groove is detected more accurately, and the workpiece and the rotary spindle are positioned more accurately. An object of the present invention is to provide an array shape processing method capable of processing an array surface with higher accuracy and speed.

According to a fourth aspect of the present invention, the positioning groove is formed with a single crystal diamond tool having a tool tip radius of 2 μm or less, so that the positioning groove can be more accurately detected with an accuracy of ± 1 μm or less, and a workpiece It is an object of the present invention to provide an array shape processing method capable of processing an array surface with higher accuracy and speed by performing more accurate positioning with respect to a rotating spindle.

According to a fifth aspect of the present invention, the positioning groove is formed in a direction which passes through the center position of each array surface formed on the array forming surface and extends in the array direction, and the positioning groove in the array direction is formed. By adjusting the position of the work piece in the direction orthogonal to the array direction by adjusting the position with respect to the work spindle, the work piece can be easily and accurately positioned in the direction orthogonal to the array direction. It is an object of the present invention to provide an array shape processing method capable of processing the array surface more accurately and swiftly with even higher accuracy.

According to a sixth aspect of the present invention, the positioning groove is formed up to the end position of the array forming surface of the workpiece by detecting the positioning groove from the axial direction of the rotary spindle and adjusting the position of the workpiece. For the purpose of providing an array shape processing method capable of accurately detecting a positioning groove at low cost, accurately positioning a workpiece and a rotary spindle, and processing an array surface with high accuracy and speed. There is.

According to a seventh aspect of the present invention, the positioning groove is detected from a plane direction parallel to the machining surface of the workpiece, and the position of the workpiece is adjusted to detect the position in the array direction and simultaneously rotate the workpiece. Detects the displacement of the spindle in the normal direction,
An object of the present invention is to provide an array shape processing method capable of processing an array surface more accurately and promptly by positioning a workpiece and a rotary spindle more accurately.

According to an eighth aspect of the present invention, the axial position of the rotating main shaft of the workpiece is also detected and the axial position of the workpiece is also adjusted, so that the workpiece is simultaneously detected in the array direction. Array shape processing method that can detect the positional deviation of the rotating spindle in the direction of the normal line, position the workpiece and the rotating spindle more accurately, and process the array surface with higher precision and speed Is intended to provide.

According to a ninth aspect of the present invention, the positioning groove is imaged and the image of the positioning groove is image-processed to detect the position of the positioning groove. (EN) Provided is an array shape processing method capable of processing an array surface with higher accuracy and speed by automatically detecting the time and positioning the workpiece and the rotary spindle more accurately and quickly. Is intended.

According to a tenth aspect of the present invention, the workpiece mounted on the rotary spindle is rotated around the center of rotation of the rotary spindle to machine the array surface, and then the workpiece is subjected to the next machining. The step of moving the rotation center of the rotation spindle to the center position of the surface, rotating the workpiece around the rotation center to process the next array surface is sequentially repeated, and the workpiece has a spherical surface, When sequentially processing an array surface such as an aspherical surface, a positioning groove that indicates a relative position to the center position of the array shape to be formed on the processing surface of the workpiece with a desired pitch distance is formed in advance, By detecting the alignment groove by the groove position detecting means, adjusting the position of the alignment groove and the rotary spindle, positioning the workpiece in the array direction, and processing the array shape on the processing surface. , That Positioning between the workpiece and the rotary spindle can be performed without being affected by the surface roughness of the forming surface and by forming a positioning groove that is shallower than the indentation due to the pressing of the indenter when forming the circular marker. It is an object of the present invention to provide an array shape processing apparatus which can perform an array surface with a high precision and speed, without being affected by the positioning groove even when the array surface having a smaller depth is accurately performed.

According to an eleventh aspect of the present invention, the array shape machining apparatus performs position adjustment between the alignment groove and the rotary spindle by using the array shape machining method according to any one of the second to ninth aspects. By positioning the workpiece in the array direction and processing the array shape on the processing surface,
Positioning of the workpiece and rotating spindle without being affected by the surface roughness of the array forming surface, and by forming positioning grooves that are shallower than the indentation due to the pressing of the indenter when forming the circular marker It is possible to provide an array shape processing apparatus capable of more accurately and swiftly processing an array surface with higher accuracy and without being affected by positioning grooves even on a shallower array surface. Has an aim.

According to a twelfth aspect of the present invention, there is provided an array element molding article for molding an optical component, the array shape processing method according to any one of the first to ninth aspects or the tenth aspect.
Alternatively, by providing the array shape processing apparatus according to claim 11 for processing the array shape, it is possible to provide a highly accurate and inexpensive array element forming article capable of easily forming a highly accurate array element. It is an object.

According to a thirteenth aspect of the present invention, the array element molded by the array element molded product is transferred by molding the array element using the array element molded product to mold the array element. It is intended to provide a wide array element.

[0024]

According to an array shape processing method of the present invention, an array surface is processed by rotating a workpiece attached to a rotary spindle about a rotation center of the rotary spindle. After that, the workpiece is moved to the center position of the array surface for the next processing until the rotation center of the rotation spindle is located, and the workpiece is rotated around the rotation center to process the next array surface. In the array shape processing method for sequentially processing the array surface such as a spherical surface or aspherical surface on the workpiece by sequentially repeating the step of performing, a desired pitch distance is formed on the processed surface of the workpiece to form on the processed surface. A positioning groove that indicates a relative position to the center position of the array surface is formed in advance, the position of the positioning groove and the rotary spindle is adjusted, and the workpiece is positioned in the array direction. By performing the processing of the array plane of the surface, it has achieved the above objects.

According to the above construction, the workpiece mounted on the rotary spindle is rotated around the rotation center of the rotary spindle to process the array surface, and then the workpiece is processed on the array surface for the next processing. Move the center of rotation to the center of rotation of the main spindle, rotate the workpiece around the center of rotation and process the next array surface. When sequentially processing the array surface such as, etc., form a positioning groove in advance indicating the relative position to the center position of the array surface formed on the processing surface with a desired pitch distance on the processing surface of the workpiece, and perform the positioning. By adjusting the position of the groove and the rotating spindle, positioning the workpiece in the array direction, and processing the array surface on the processing surface, without being affected by the surface roughness of the array forming surface,
In addition, by forming a positioning groove that is shallower than the indentation due to the pressing of the indenter when forming the circular marker, the workpiece and the rotary spindle can be accurately positioned, and the array with a shallower depth is formed. The array surface can be processed with high precision and speed without being affected by the positioning groove.

In this case, for example, as described in claim 2, the positioning groove is arranged on the processing surface of the workpiece at a position that does not affect the formation of the array surface and in the array direction of the array surface. It may be formed in a direction orthogonal to each other.

According to the above structure, the positioning groove is formed in the processing surface of the workpiece at a position that does not affect the formation of the array surface in the direction orthogonal to the array direction of the array surface. The degree of freedom of the depth can be increased, and the positioning groove can be formed easily and appropriately, the workpiece and the rotary spindle can be positioned more accurately, and the array surface can be processed more accurately and quickly. be able to.

Further, for example, as described in claim 3, the positioning groove may be formed in a V-shaped cross section.

According to the above construction, since the positioning groove is formed in a V-shaped cross section, the positioning groove can be detected more accurately and the workpiece and the rotary spindle can be positioned more accurately. Therefore, the array surface can be processed more accurately and promptly.

Further, for example, as described in claim 4, the positioning groove may be formed by a single crystal diamond tool having a tool tip radius of 2 μm or less.

According to the above construction, since the positioning groove is formed by the single crystal diamond tool having a tool tip radius of 2 μm or less, the positioning groove can be detected more accurately with an accuracy of ± 1 μm or less, and the machining is performed. The array surface can be processed with higher accuracy and speed by more accurately positioning the object and the rotary spindle.

Further, for example, as described in claim 5, the positioning groove is also formed in a direction extending through the center position of each array surface formed on the array forming surface and in the array direction. The position of the alignment groove in the array direction and the rotational spindle may be adjusted to position the workpiece in the direction orthogonal to the array direction.

According to the above construction, the positioning groove is also formed in a direction that passes through the center position of each array surface formed on the array forming surface and extends in the array direction, and the positioning groove in the array direction and the rotary spindle. Since the position of the workpiece is aligned in the direction perpendicular to the array direction, the workpiece can be positioned in the direction orthogonal to the array direction easily and accurately. It is possible to process the array surface more accurately and swiftly by performing more accurate positioning.

Further, for example, as described in claim 6, in the array shape machining method, the position of the workpiece may be adjusted by detecting the positioning groove from the axial direction of the rotary spindle.

According to the above construction, the positioning groove is detected from the axial direction of the rotary main shaft to adjust the position of the workpiece.
The positioning groove can be detected at low cost without forming the positioning groove to the end position of the array forming surface of the workpiece, and the workpiece and the rotary spindle can be accurately positioned, with high accuracy and speed. The array surface can be processed.

Further, for example, as described in claim 7, in the array shape processing method, the positioning groove is detected from a plane direction parallel to the processing surface of the workpiece,
The position of the workpiece may be adjusted.

According to the above construction, the positioning groove is detected from the plane direction parallel to the machining surface of the workpiece to adjust the position of the workpiece. Therefore, simultaneously with the position detection in the array direction, the rotational spindle of the workpiece is measured. The positional deviation in the line direction can be detected, the workpiece and the rotary spindle can be positioned more accurately, and the array surface can be processed with higher accuracy and speed.

Further, for example, as described in claim 8, in the array shape machining method, the position of the workpiece in the axial direction is also adjusted by detecting the axial position of the rotary spindle. You may also go.

According to the above configuration, the array shape machining method detects the axial position of the rotary main shaft of the workpiece and also adjusts the axial position of the workpiece. At the same time, it is possible to detect the positional deviation of the rotary spindle of the workpiece in the direction of the normal line, so that the workpiece and the rotary spindle can be positioned more accurately, and the array surface can be processed with even higher precision and speed. You can

Further, for example, as described in claim 9, in the array shape processing method, an image of the positioning groove is imaged and an image of the imaged positioning groove is image-processed to detect the position of the positioning groove. You can go.

According to the above construction, the positioning groove is imaged, and the image of the positioning groove thus picked up is image-processed to detect the position of the positioning groove. It is possible to more accurately and swiftly perform the positioning of the workpiece and the rotary spindle, and it is possible to process the array surface with even higher precision and speed.

According to a tenth aspect of the present invention, there is provided an array shape machining apparatus, wherein a workpiece mounted on a rotary spindle is rotated around a rotation center of the rotary spindle to machine an array surface, and then the workpiece is machined. The process of moving the next main surface to the center of the array surface to be processed until the center of rotation of the rotary spindle is located, rotating the workpiece around the center of rotation, and processing the next array surface is sequentially repeated. In an array shape processing device for sequentially processing an array shape such as a spherical surface or an aspherical surface on the work piece, a center of the array shape formed on the work surface with a desired pitch distance on the work surface of the work piece. A registration groove that indicates a relative position to the position is formed in advance, and the registration groove is detected by the groove position detection means,
The above-mentioned object is achieved by adjusting the position of the alignment groove and the rotation main shaft, positioning the workpiece in the array direction, and processing the array shape on the processing surface.

According to the above arrangement, the workpiece attached to the rotary spindle is rotated around the center of rotation of the rotary spindle to process the array surface, and then the workpiece is processed to the next array surface. Move the center of rotation to the center of rotation of the main spindle, rotate the workpiece around the center of rotation and process the next array surface. When sequentially processing the array surface such as, etc., a positioning groove is formed in advance that indicates the relative position to the center position of the array shape formed on the processing surface of the workpiece with a desired pitch distance, and the alignment is performed. The groove is detected by the groove position detection means, the position of the alignment groove and the rotary spindle are adjusted, the workpiece is positioned in the array direction, and the array surface is formed on the processed surface. Face table Without being affected by the roughness,
In addition, by forming a positioning groove that is shallower than the indentation due to the pressing of the indenter when forming the circular marker, the workpiece and the rotary spindle can be accurately positioned, and the array with a shallower depth is formed. The array surface can be processed with high precision and speed without being affected by the positioning groove.

In this case, for example, as described in claim 11, the array shape processing device uses the array shape processing method according to any one of claims 2 to 9 to form the alignment groove. The position of the workpiece may be adjusted in the array direction by adjusting the position with respect to the main spindle, and the array surface may be machined on the machined surface.

According to the above configuration, the array shape processing apparatus performs position adjustment between the alignment groove and the rotary spindle by using the array shape processing method according to any one of claims 2 to 9 to perform processing. Since the object is positioned in the array direction and the array shape is processed on the processed surface, it is not affected by the surface roughness of the array forming surface, and by pressing the indenter when forming the circular marker. By forming a positioning groove that is shallower than the indentation, the workpiece and rotary spindle can be positioned more accurately, and even the array surface with a shallower depth is not affected by the positioning groove. The array surface can be processed with higher accuracy and speed.

According to a twelfth aspect of the present invention, an array element molding product is an array element molding product for molding an optical component, and the array shape processing method or the above-mentioned claim Claim 10 or Claim 1
The above-mentioned object is achieved by processing the array shape with the array shape processing apparatus described in item 1.

According to the above structure, the array element processing article according to any one of claims 1 to 9 or the array shape processing according to claim 10 or 11 is used as an array element molding article for molding an optical component. Since the array shape is processed by the device, a highly accurate array element can be easily molded, and the array element molding product can be highly accurate and inexpensive.

An array element according to a thirteenth aspect of the present invention is an array element molded by an array element molded product, and the array shape is transferred and molded by using the array element molded product of the twelfth aspect. Therefore, the above-mentioned object is achieved.

According to the above structure, in the invention described in claim 13, the array element molded by the array element molded product is molded by transferring the array shape using the array element molded product described in claim 12. Therefore, a highly accurate array element can be molded at low cost.

[0050]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The embodiments described below are preferred embodiments of the present invention, and therefore have various technically preferable limitations. However, the scope of the present invention refers to the present invention particularly in the following description. Unless otherwise stated, the present invention is not limited to these embodiments.

1 to 10 are views showing an embodiment of an array shape processing method, an array shape processing apparatus, an array element molding article and an array element of the present invention, and FIG. 1 is an array shape of the present invention. 1 is a perspective view of a processing apparatus 1 to which an embodiment of a processing method, an array shape processing apparatus, an array element molding product, and an array element is applied.

In FIG. 1, a processing apparatus (array shape processing apparatus) 1 has a base 2 on which a rotary spindle 3 rotates about the Z axis and a rotation center 3a.
The positioning jig 4 is detachably fixed to the central portion of the flat surface (working surface) of the tip of the rotary spindle 3. The positioning jig 4 holds the workpiece 5 to be machined on the machining surface of the rotary spindle 3 so as to be movable and adjustable in the X direction, and also uses the reference surface 4a, which is a holding surface that holds the workpiece 5, to be machined. Positioning 5 in the Y direction is performed.

As shown in FIG. 3, the workpiece 5 has a processed surface (array forming surface) that forms an array surface of the workpiece 5.
Positioning grooves 6 are formed in advance at positions where the array surface is formed at a pitch interval that forms the array surface in 5a. The positioning groove 6 is formed in a direction perpendicular to the array direction, which is the array surface forming direction. ing. The positioning groove 6 is a single crystal diamond tool having a tool tip radius of 2 μm or less, is formed in a portion of the array forming surface that does not affect the formation of the array surface, and is formed in a V groove shape.

Referring again to FIGS. 1 and 2, a pair of moving mechanisms for moving the workpiece 5 held by the positioning jig 4 on the base 2 in the array direction thereof, that is, in the X direction in FIG. The parts 7a and 7b are provided to move the workpiece 5 in the array direction along the reference surface 4a of the positioning jig 4 when the position of the workpiece 5 is adjusted.

On the other hand, a holding frame 10 is fixed to the base 2, and the holding plate 10 is arranged on the holding frame 10 in the X direction.
1 is attached so as to be movable in the Z direction. Holding plate 1
1, a tool base 12 and a detector holding plate 13 are arranged at a predetermined interval, and a tool 14 is attached to the tool base 12 in a positionable state on the rotation center 3a of the rotary spindle 3. . Further, a groove position detector 15 for detecting the positioning groove 6 formed in the workpiece 5 is attached to the detector holding plate 13.

The tool base 12 and the detector holding plate 13 are
It moves in the X direction along the upper frame of the holding plate 11, and when the positioning groove 6 is detected, the groove position detector (groove position detecting means) 15 of the detector holding plate 13 is on the extension line of the rotation center 3a of the rotary spindle 3. Move to the position of, and at the time of machining, the tool 1 of the tool base 12
4 moves to a position on the extension line of the rotation center 3a of the rotation main shaft 3.

Although the cutting tool is attached to the tool 4, the tool 14 is not limited to the cutting tool, and a grindstone spindle 20 may be attached as shown in FIG. In FIG. 4, the tool spindle 20 is
The tool spindle 20 is attached to the tool base 12.
The grindstone 21 is attached to the.

A groove position detector (groove position detecting means) 30 is arranged on the base 2, and the groove position detector 30 is provided.
Is for detecting the positioning groove 6 formed on the array forming surface 5a of the workpiece 5 on the rotary spindle 3 in a direction parallel to the array forming surface 5a.

The groove position detector 30 is attached to the moving mechanism section 31 and is moved by the moving mechanism section 31 in the three axial directions of X, Y and Z with respect to the rotary spindle 3. The groove position detector 30 is moved by the moving mechanism unit 31 to move the rotary spindle 3
The positioning groove 6 formed on the array forming surface 5a of the workpiece 5 is detected at a position orthogonal to the rotation center 3a of the.

However, in order for the groove position detector 30 to detect the positioning groove 6 formed on the array forming surface 5a of the workpiece 5, the positioning groove 6 is a groove on the array forming surface 5a as shown in FIG. It needs to be formed up to the end face on the position detector 30 side.

Next, the operation of this embodiment will be described. The processing apparatus 1 according to the present embodiment has an array forming surface 5 of a workpiece 5.
The positioning groove 6 is formed at a position corresponding to the formation position of the array surface of a and does not affect the formation of the array surface, and the positioning groove 6 is formed by the groove position detector 15 or the groove position detector 30. The feature is that the position of the workpiece 5 is detected and adjusted easily and accurately, and highly accurate processing is performed at low cost.

That is, the processing apparatus 1 is arranged to process the workpiece 5 as shown in FIG. 3 or 5 prior to processing the workpiece 5.
Positioning grooves 6 are formed on the array formation surface at positions where the array surface is formed in the array direction for each pitch of the array surface and do not affect the array formation.

First, the case where the groove position detector 15 detects the positioning groove 6 of the workpiece 5 will be described below.

In this case, the workpiece 5 in which the positioning groove 6 is formed is attached to the positioning jig 4, and the rotary spindle 3 is rotated in the direction of arrow C, that is, around the Z axis, and the positioning jig 4 is rotated.
The plane direction of the reference plane 4a is aligned with the X direction. The rotating spindle 3 is rotated so that the moving direction of the workpiece 5 and the forming direction of the array surface coincide with each other. In this state, the moving mechanism parts 7a, 7b
Then, the workpiece 5 is moved along the positioning jig 4, and the positioning groove 6 corresponding to the position where the array surface is first formed is positioned near the rotation center 3a of the rotary spindle 3.

Next, as shown in FIG. 6, the groove position detector 15 in which the positioning groove 6 formed on the workpiece 5 is moved to the rotation center of the rotary spindle 3 is used to rotate the rotation center 3 of the rotary spindle 3.
Based on the detection result of the groove position detector 15, the moving mechanism portions 7a and 7b finely adjust the workpiece 5 in the X direction, that is, the array direction of the array surface to be formed, and the positioning groove 6 is detected. And the rotation center 3a of the rotation main shaft 3 are matched.
At this time, the workpiece 5 is positioned in the Y direction by the reference surface 4a of the positioning jig 4.

When the positioning groove 6 of the workpiece 5 is aligned with the rotation center 3a of the rotary spindle 3, the rotation center 3a of the rotary spindle 3 is made.
Then, the tool 14 is moved to rotate the rotary spindle 3 to form an array surface at the position of the workpiece 5 positioned by the positioning groove 6.

That is, the positioning groove 6 formed in the workpiece 5 is the n-th positioning groove 6 shown in FIG.
The n-th array surface An formed on the array-formed surface 5a of the workpiece 5 as indicated by Gn + 1 for the first positioning groove 6
Is formed at a position that coincides with the center position Anc of the position n and the center position An + 1c of the (n + 1) th array surface An + 1 in the Y direction.

Therefore, by aligning the positioning groove 6 with the center of rotation 3a of the rotary spindle 3, the positioning groove 6 is previously prepared.
The array surface An can be accurately and promptly formed at the array formation position set by the (positioning groove Gn).

When one array surface An is formed, the workpiece 5 is fixed to the rotary spindle 3, that is, the fixing by the positioning jig 4 is released, and the array surface An is formed as shown in FIG. From the finished state (FIG. 8A), the positioning groove Gn + 1 for the array surface An + 1 to be processed next
The workpiece 5 is moved by the moving mechanism portions 7a and 7b in the array direction shown by the arrow in FIG. 8B until is on a straight line Yc that is parallel to the Y-axis and passes through the rotation center 3a of the rotary spindle 3. Let

At this time, the array surface An + 1 to be formed next
The groove Gn + 1 for use is on the line Yc, and the array surface An + 1
And the center of rotation 3a of the rotary spindle 3 are coincident with each other.

When the positioning groove Gn + 1 for the array surface An + 1 to be processed next comes on the line Yc, the workpiece 5 is fixed, and the array surface An + 1 is processed as shown in FIG. 8C. .

Next, the case where the positioning groove 6 of the workpiece 5 is detected by the position detector 30 from the plane direction of the array forming surface 5a of the workpiece 5 will be described.

In this case, at least the positioning groove 6 is formed up to the end surface on the groove position detector 30 side of the array forming surface 5a of the workpiece 5, as shown in FIG.

Such a positioning groove 6 is provided in the groove position detector 3
To detect at 0, as shown in FIG. 2, the groove position detector 30 is moved in the X, Y, and Z directions so that the detection position passes through the center of the rotary spindle 3 and the array of workpieces 5 is detected. The positioning groove 6 is located at a position substantially parallel to the forming surface 5a and suitable for detecting the positioning groove 6.

The subsequent steps are the same as in the case where the groove position detector 15 is used to detect the positioning groove 6.

When the positioning groove 6 is detected using this groove position detector 30, as shown in FIG. 9, the groove shape of the positioning groove 6 is used together with the position Xv of the workpiece 5 in the array direction. , The position Zv in the direction perpendicular to the array direction can also be detected.

To detect the positioning groove 6, the positioning groove 6 is picked up by the groove position detector 15 or the groove position detector 30, and the image of the picked-up positioning groove 6 is processed by a computer (not shown). When detected, the positioning groove 6 can be detected with high accuracy and speed.

As described above, the processing apparatus 1 of this embodiment
Attaches the workpiece 5 attached to the rotary spindle 3 to the rotary spindle 3
After processing the array surface by rotating it about the rotation center 3a, the workpiece 5 is moved until the rotation center 3a of the rotary spindle 3 is located at the center position of the array surface for the next processing. The step of rotating the workpiece 5 around the rotation center 3a and processing the next array surface is sequentially repeated to process the array surface such as a spherical surface or aspherical surface on the workpiece 5 in sequence. An alignment groove 6 indicating a relative position to the center position of the array surface formed on the array formation surface 5a is formed in advance on the array formation surface 5a, which is the processing surface, at a desired pitch distance, and the alignment groove 6 and the alignment groove 6 are rotated. The position of the workpiece 5 is adjusted in the array direction by adjusting the position with respect to the spindle 3, and the array surface is processed into the array forming surface 5a.

Therefore, the positioning groove 6 is formed without being affected by the surface roughness of the array forming surface 5a and having a shape shallower than the indentation caused by the pressing of the indenter when forming the circular marker. The object 5 and the rotary spindle 3 can be accurately positioned, and the array surface having a shallower depth can be processed with high accuracy and speed without being affected by the positioning groove 6. .

Further, in the processing apparatus 1 of this embodiment, the positioning groove 6 is orthogonal to the array direction of the array surface at a position on the array forming surface 5a of the workpiece 5 that does not affect the formation of the array surface. Forming in the direction.

Therefore, the degree of freedom of the groove shape and the groove depth can be increased, and the positioning groove 6 can be formed easily and appropriately, and the workpiece 5 and the rotary spindle 3 can be positioned more accurately. The array surface can be processed with higher accuracy and speed.

Further, in the processing apparatus 1 of the present embodiment, the positioning groove 6 has a V-shaped cross section.

Therefore, the positioning groove 6 can be detected more accurately, the workpiece 5 and the rotary spindle 3 can be positioned more accurately, and the array surface can be processed with higher accuracy and speed. .

Further, in the processing apparatus 1 of the present embodiment, the positioning groove 6 is formed by a single crystal diamond tool having a tool tip radius of 2 μm or less.

Therefore, the positioning groove 6 can be more accurately detected with an accuracy of ± 1 μm or less, the workpiece 5 and the rotary spindle 3 can be positioned more accurately, and the array surface can be swiftly and highly accurately. Can be processed.

Furthermore, in the machining apparatus 1 of the present embodiment, the positioning groove 6 is formed in the groove position detector 15 from the axial direction of the rotary spindle 3.
Then, the position of the workpiece 5 is adjusted.

Therefore, without forming the positioning groove 6 to the end position of the array forming surface 5a of the workpiece 5, the positioning groove 6 can be detected at a low cost to accurately position the workpiece 5 and the rotary spindle 3. It is possible to process the array surface with high precision and speed.

Further, in the machining apparatus 1 of the present embodiment, the positioning groove 6 is detected by the groove position detector 30 from the plane direction parallel to the machining surface 5a of the workpiece 5, and the position of the workpiece 5 is adjusted. ing.

Therefore, it is possible to detect the positional deviation in the normal direction of the rotary spindle 3 of the workpiece 5 at the same time as detecting the position in the array direction, so that the workpiece 5 and the rotary spindle 3 can be positioned more accurately. The array surface can be processed with higher accuracy and speed.

Further, the processing apparatus 1 of the present embodiment also detects the axial position of the rotary spindle 3 of the workpiece 5 and also adjusts the axial position of the workpiece 5.

Therefore, it is possible to detect the positional deviation in the normal direction of the rotary spindle 3 of the workpiece 5 at the same time as detecting the position in the array direction, and the workpiece 5 and the rotary spindle 3 can be positioned more accurately. The array surface can be processed with higher accuracy and speed.

Further, the processing apparatus 1 of the present embodiment detects the position of the positioning groove 6 by imaging the positioning groove 6 and image-processing the image of the positioning groove 6 thus imaged.

Therefore, the positioning groove 6 can be detected more accurately and automatically in a short time, and the workpiece 5
It is possible to more accurately and promptly perform the positioning between the rotary spindle 3 and the rotary spindle 3, and to process the array surface with even higher precision and speed.

In the above description, the positioning groove 6 is formed at a position that does not affect the formation of the array surface of the array forming surface 5a of the workpiece 5 and is in the direction orthogonal to the array direction. The alignment groove 6 is formed at the center position of the surface only in the direction (Y direction) orthogonal to the array direction and the array surface to be formed is positioned in the X direction.
Are not limited to those formed only in the direction orthogonal to the array direction, and for example, as shown in FIG. 10, the positioning groove 6a is formed in the X direction passing through the center position in the Y direction of the array surface to be formed. You may form.

By doing so, the positioning in the direction perpendicular to the array direction (Y direction) can be performed easily and with high accuracy.

Although the invention made by the present inventor has been specifically described based on the preferred embodiments, the present invention is not limited to the above and various modifications can be made without departing from the scope of the invention. It goes without saying that it is possible.

[0097]

According to the array shape machining method of the invention described in claim 1, after the workpiece mounted on the rotary spindle is rotated around the rotation center of the rotary spindle to machine the array surface, Move the workpiece to the center of the array surface for the next machining until the center of rotation of the rotating spindle is positioned, and rotate the workpiece around the rotation center to process the next array surface. Indicates the relative position with respect to the center position of the array surface formed on the processed surface with a desired pitch distance on the processed surface of the workpiece when sequentially processing array surfaces such as spherical surface and aspherical surface on the processed object by repeating Since the alignment groove is formed in advance, the position of the alignment groove and the rotary spindle are adjusted, the workpiece is positioned in the array direction, and the array surface is machined to the machined surface. Affected by roughness In addition, a positioning groove with a shape shallower than the indentation due to the pressing of the indenter when forming the circular marker can be formed, and the workpiece and the rotary spindle can be accurately positioned, resulting in a deeper depth. It is possible to process the array surface with high precision and speed without being affected by the positioning groove even on the shallow array surface.

According to the array shape processing method of the second aspect of the present invention, the positioning groove is formed in a position orthogonal to the array direction of the array surface at a position that does not affect the formation of the array surface on the processed surface of the workpiece. Since it is formed in the groove, the degree of freedom of the groove shape and groove depth can be increased, and the positioning groove can be formed easily and appropriately, and the workpiece and the rotary spindle can be positioned more accurately, resulting in higher accuracy. The array surface can be processed quickly and quickly.

According to the array shape machining method of the third aspect of the present invention, since the positioning groove is formed in a V-shaped cross section, the positioning groove can be detected more accurately, and the workpiece and the rotary spindle. Can be positioned more accurately, and the array surface can be processed with higher accuracy and speed.

According to the array shape processing method of the present invention, since the positioning groove is formed by a single crystal diamond tool having a tool tip radius of 2 μm or less, ± 1 μm
The positioning groove can be detected more accurately with the following accuracy, the workpiece and the rotary spindle can be positioned more accurately, and the array surface can be processed with higher accuracy and speed.

According to the array shape processing method of the fifth aspect of the present invention, the positioning groove is formed also in the direction extending through the center position of each array surface formed on the array forming surface in the array direction. Since the positioning of the alignment groove in the array direction and the rotary spindle is adjusted to perform positioning in the direction orthogonal to the array direction of the workpiece, positioning of the workpiece in the direction orthogonal to the array direction is also performed easily and accurately. It is possible,
The workpiece and the rotary spindle can be positioned more accurately, and the array surface can be processed with higher accuracy and speed.

According to the method of machining an array shape of the invention, the position of the workpiece is adjusted by detecting the positioning groove from the axial direction of the rotary spindle, so that the positioning groove is formed on the array forming surface of the workpiece. The positioning groove can be inexpensively detected without forming the end position, and the workpiece and the rotary spindle can be accurately positioned, and the array surface can be processed with high accuracy and speed.

According to the array shape processing method of the present invention, the position of the workpiece is adjusted by detecting the positioning groove from the plane direction parallel to the surface of the workpiece. At the same time, it is possible to detect the positional deviation in the normal direction of the rotary spindle of the workpiece, and more accurately position the workpiece and the rotary spindle to process the array surface with even higher precision and speed. be able to.

According to the array shape processing method of the present invention, the array shape processing method also detects the axial position of the rotating main shaft of the workpiece and adjusts the axial position of the workpiece. Since it is possible to detect the position in the array direction, it is possible to detect the positional deviation in the normal direction of the rotating main axis of the workpiece,
The workpiece and the rotary spindle can be positioned more accurately, and the array surface can be processed with higher accuracy and speed.

According to the array shape processing method of the present invention, the positioning groove is imaged, and the image of the imaged positioning groove is image-processed to detect the position of the positioning groove. More accurately and automatically detected in a short time, positioning the workpiece and rotating spindle more accurately and quickly, and processing the array surface with even higher precision and speed. You can

According to the array shape processing apparatus of the tenth aspect of the present invention, the workpiece mounted on the rotary spindle is rotated around the rotation center of the rotary spindle to machine the array surface, and then the workpiece is processed. Move to the center position of the array surface for the next processing until the center of rotation of the rotating spindle is located, and rotate the workpiece around the rotation center to process the next array surface. When sequentially processing an array surface such as a spherical surface or an aspherical surface on a workpiece, aligning the relative position with the center position of the array shape formed on the surface of the workpiece with a desired pitch distance. Grooves are formed in advance, the alignment groove is detected by the groove position detection means, the position of the alignment groove and the rotary spindle are adjusted, the workpiece is positioned in the array direction, and the array is formed on the processing surface. Of shape Since the work is performed, it is not affected by the surface roughness of the array forming surface, and a positioning groove having a shape shallower than the indentation due to the pressing of the indenter when forming the circular marker is formed, and The positioning with respect to the rotating spindle can be accurately performed, and the array surface having a shallower depth can be processed with high accuracy and speed without being affected by the positioning groove.

According to the array shape processing apparatus of the invention described in claim 11, the array shape processing apparatus uses the array shape processing method according to any one of claims 2 to 9 to align the alignment groove and the rotary spindle. The position of the workpiece is aligned in the array direction and the array shape is machined on the machined surface, so it is not affected by the surface roughness of the array forming surface, and it is a circular marker. By forming a positioning groove that is shallower than the indentation due to the pressing of the indenter when forming the workpiece, the workpiece and the rotary spindle can be positioned more accurately, and the array surface with a shallower depth can also be positioned. The array surface can be processed with higher accuracy and speed without being affected by the grooves.

The array element molding article of the invention according to claim 12 is the array element molding article for molding an optical component according to claim 1.
Since the array shape is processed by the array shape processing method according to claim 9 or the array shape processing apparatus according to claim 10 or 11, it is possible to easily form a highly accurate array element. You can
Further, the array element molding product can be made highly accurate and inexpensive.

According to the array element of the thirteenth aspect of the present invention, in the invention of the thirteenth aspect, the array element molded by the array element molded article is formed into an array shape by using the array element molded article of the twelfth aspect. Since it is transferred and molded, a highly accurate array element can be molded at low cost.

[Brief description of drawings]

FIG. 1 is a perspective view of a processing apparatus to which an embodiment of an array shape processing method, an array shape processing apparatus, an array element molding product, and an array element of the present invention is applied.

FIG. 2 is an enlarged perspective view of a main part of the processing apparatus shown in FIG.

FIG. 3 is an enlarged plan view of a workpiece in which the positioning groove of FIG. 1 is formed.

FIG. 4 is an enlarged perspective view of a tool portion when the cutting tool in FIG. 1 is changed to a grindstone spindle.

FIG. 5 is an enlarged plan view of a workpiece when the positioning groove of FIG. 1 is formed at the end of the array formation surface.

6 is an enlarged perspective view of an essential part of a state in which a groove position detector detects the positioning groove of the workpiece on the rotary spindle in FIG. 1 from the normal direction.

7 is an enlarged plan view showing the positional relationship between the positioning groove formed on the array forming surface of the workpiece of FIG. 3 and the array surface to be formed.

FIG. 8 (a) after forming an array on the array forming surface of the workpiece by the processing apparatus of FIG. 1 (b), moving the workpiece (b), and positioning in the positioning groove at the next array surface forming position (c); The figure which shows the process to do.

FIG. 9 is an enlarged front view of a main portion of the positioning groove of FIG. 5 in a state where the groove position detector simultaneously detects the array direction and the axial direction of the rotary spindle from the plane direction.

FIG. 10 is an enlarged plan view of a work piece in which positioning grooves in the X direction are further formed on the array forming surface of the work piece in which positioning grooves in the Y direction of FIG. 3 are formed.

FIG. 11 is a perspective view of a main part of a processing apparatus as an example of a conventional array processing method.

FIG. 12 is a state in which array surface processing is performed at the array surface processing position at the right end of the workpiece by the conventional processing apparatus of FIG. 11 (a).
And a front view of the rotary spindle portion in a state (b) in which processing is performed at the second array surface processing position from the right end.

FIG. 13 is a view showing a case where the contour accuracy of a circular marker formed on an array forming surface of a conventional workpiece is good (a), and cases where the contour accuracy is bad (b) and (c).

FIG. 14 is an enlarged front cross-sectional view of a conventional work piece on which an array surface is formed.

FIG. 15 is an enlarged front cross-sectional view of a workpiece when an array surface is formed deeper than a conventional marker.

FIG. 16 is an enlarged front cross-sectional view of a workpiece when an array surface is formed shallower than a conventional marker.

[Explanation of symbols]

1 Processing device 2 bases 3 rotating spindle 3a Rotation center 4 Positioning jig 4a Reference plane 5 Processed products 5a Array formation 6,6a Positioning groove 7a, 7b moving mechanism section 10 holding frame 11 holding plate 12 Tool stand 13 Detector holding plate 14 tools 15 Groove position detector 20 tool spindle 21 grindstone 30 Groove position detector 31 Moving mechanism section An, An + 1 array surface Gn, Gn + 1 positioning groove Center position of Anc and An + 1c

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 3C029 AA02                 3C045 BA02 BA40 CA30                 3C049 AA02 AB08 AB09 CA01

Claims (13)

[Claims] 1. An array surface is machined by rotating a workpiece attached to a rotary spindle about a rotation center of the rotary spindle, and then the workpiece is placed at the center position of the array surface for the next machining. The step of moving the rotation main shaft until the rotation center is located, rotating the workpiece around the rotation center to perform the processing of the next array surface is sequentially repeated, and the workpiece is spherical or aspherical. In the array shape processing method for sequentially processing the array surface such as the above, a positioning groove showing a relative position with respect to the center position of the array surface formed on the processing surface with a desired pitch distance on the processing surface of the processing object is formed. Formed in advance, position adjustment of the alignment groove and the rotary spindle, positioning of the workpiece in the array direction,
An array shape processing method characterized in that the array surface is processed on the processed surface. 2. The positioning groove is formed in a position orthogonal to the array direction of the array surface at a position that does not affect the formation of the array surface on the processed surface of the workpiece. The array shape processing method according to claim 1. 3. The array shape processing method according to claim 1, wherein the positioning groove has a V-shaped cross section. 4. The positioning groove has a tool tip radius of 2 μm.
The array shape processing method according to claim 3, wherein the array shape processing method is performed by the following single crystal diamond tool. 5. The positioning groove is also formed in a direction extending in the array direction by passing through a central position of each array surface formed on the array forming surface, and the alignment groove and the rotation in the array direction. The array shape processing method according to any one of claims 1 to 4, wherein the position of the workpiece is adjusted in a direction orthogonal to the array direction by adjusting the position of the workpiece. 6. The array shape processing method according to claim 1, wherein the positioning groove is detected in the axial direction of the rotary spindle to adjust the position of the workpiece.
5. The array shape processing method according to any one of 1. 7. The array shape processing method according to claim 1, wherein the positioning groove is detected from a plane direction parallel to the processing surface of the workpiece to adjust the position of the workpiece. The array shape processing method according to claim 5. 8. The array shape processing method also detects the axial position of the rotary spindle of the workpiece to adjust the axial position of the workpiece.
The described array shape processing method. 9. The array shape processing method according to claim 1, wherein the positioning groove is imaged, and an image of the imaged positioning groove is image-processed to detect the position of the positioning groove. Item 9. The array shape processing method according to any one of Items 8. 10. An array surface is machined by rotating a workpiece attached to a rotary spindle about the center of rotation of the rotary spindle, and then the workpiece is placed at the center position of the array surface for the next machining. The process of moving the rotating spindle until the center of rotation is positioned, rotating the workpiece around the center of rotation, and processing the next array surface is sequentially repeated to make the workpiece spherical or aspherical. In an array shape processing apparatus for sequentially processing array shapes such as, an alignment groove showing a relative position with respect to a center position of the array shape formed on the processed surface with a desired pitch distance on the processed surface of the workpiece. Preformed, the alignment groove is detected by the groove position detection means, the position of the alignment groove and the rotary spindle is adjusted, and the workpiece is positioned in the array direction,
An array shape processing apparatus, which processes the array shape on the processing surface. 11. The array shape processing apparatus adjusts the position of the alignment groove and the rotary spindle by using the array shape processing method according to claim 2, Position the workpiece in the array direction,
The array shape processing apparatus according to claim 10, wherein the array shape processing is performed on the processing surface. 12. An array element molding article for molding an optical component, comprising the array shape processing method according to any one of claims 1 to 9 or the array shape processing according to claim 10 or 11. An array element molding product, wherein the array shape is processed by an apparatus. 13. An array element molded by an array element molded product, wherein the array shape is transferred and molded by using the array element molded product according to claim 12.