JP2003086911A - Structure of terminal connecting part for electric wire and connecting method thereof - Google Patents
Structure of terminal connecting part for electric wire and connecting method thereofInfo
- Publication number
- JP2003086911A JP2003086911A JP2001278302A JP2001278302A JP2003086911A JP 2003086911 A JP2003086911 A JP 2003086911A JP 2001278302 A JP2001278302 A JP 2001278302A JP 2001278302 A JP2001278302 A JP 2001278302A JP 2003086911 A JP2003086911 A JP 2003086911A
- Authority
- JP
- Japan
- Prior art keywords
- connection
- terminal
- electric wire
- common pad
- wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電線の端末接続部
構造および接続方法に係り、特に、パソコンの液晶ディ
スプレイや超音波診断装置のディスプレイの周辺などの
ように、極細ケーブル又は極細同軸ケーブルを狭いピッ
チで接続することが要求される部分における、電線の端
末接続部構造および接続方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric wire terminal connecting portion structure and a connecting method, and more particularly, to an ultrafine cable or an ultrafine coaxial cable such as a peripheral of a liquid crystal display of a personal computer or a display of an ultrasonic diagnostic apparatus. The present invention relates to an electric wire terminal connecting portion structure and a connecting method in a portion that is required to be connected at a narrow pitch.
【０００２】[0002]
【従来の技術】従来から、ノート型パソコンなどに使用
される液晶ディスプレイ（ＬＣＤ）の配線材としてフレ
キシブルプリント基板（ＦＰＣ）が使用されている。2. Description of the Related Art Conventionally, a flexible printed circuit board (FPC) has been used as a wiring material of a liquid crystal display (LCD) used in a notebook personal computer or the like.
【０００３】ところで、近年、ノート型パソコンの薄型
化、小型化、軽量化および高画質化に対する要求が非常
に高くなってきており、それに伴って、液晶ディスプレ
イ（ＬＣＤ）の周辺配線として、複数の極細ケーブルあ
るいは極細同軸ケーブルを上述したフレキシブルプリン
ト基板（ＦＰＣ）に対して極狭いピッチで接続するよう
になってきている。By the way, in recent years, the demand for thinning, downsizing, weight saving and high image quality of a notebook type personal computer has become extremely high, and accordingly, a plurality of peripheral wirings of a liquid crystal display (LCD) are required. Ultrafine cables or ultrafine coaxial cables have been connected to the above-mentioned flexible printed circuit boards (FPC) at an extremely narrow pitch.
【０００４】従来、例えば、図７に示すようなピッチｐ
＝０．５ｍｍで整列された複数の接続端子３１，３１…
が設けられたＦＰＣ３０に対して複数の極細ケーブルを
接続する場合、まず、図８に示すように、複数本の極細
ケーブル３３，３３…を、接続すべき各接続端子３１に
対応させて配列し、その上下（紙面前後方向）から粘着
テープ３４を貼り合わせて極細ケーブル３３を固定す
る。そして、極細ケーブル３３の端部の粘着テープ３４
および絶縁体３５を除去して各極細ケーブル３３の導体
３６を露出させる。このとき、各導体３６は、図に示す
ように不整線の状態となっている。Conventionally, for example, a pitch p as shown in FIG.
= A plurality of connection terminals 31, 31 ...
When connecting a plurality of ultrafine cables to the FPC 30 provided with, first, as shown in FIG. 8, arrange a plurality of ultrafine cables 33, 33 ... Corresponding to each connection terminal 31 to be connected. Then, the ultrafine cable 33 is fixed by adhering the adhesive tape 34 from above and below (the front-back direction of the paper surface). Then, the adhesive tape 34 at the end of the ultrafine cable 33
Then, the insulator 35 is removed to expose the conductor 36 of each ultrafine cable 33. At this time, each conductor 36 is in an irregular line state as shown in the figure.
【０００５】次に、図９に示すように、各極細ケーブル
３３の導体３６をＦＰＣ３０の接続端子３１に合わせて
所定ピッチ（０．５ｍｍ）で整線した後、図１０に示す
ように、各極細ケーブル３３の導体３６を接続すべき接
続端子３１に対してはんだ付け等によって接続するよう
にしていた。Next, as shown in FIG. 9, the conductors 36 of the respective ultrafine cables 33 are aligned with the connection terminals 31 of the FPC 30 at a predetermined pitch (0.5 mm), and then, as shown in FIG. The conductor 36 of the ultrafine cable 33 is connected to the connection terminal 31 to be connected by soldering or the like.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、このよ
うな従来の端末接続構造および接続方法では、極細の導
体を整線する作業に時間がかかり、生産効率が悪くなる
問題があった。また、極狭いピッチではんだ接続を行う
ため、短絡等の電気的不良が多発しやすいという問題も
あった。However, in such a conventional terminal connection structure and connection method as described above, there is a problem in that the work of aligning the extra fine conductor takes time and the production efficiency is deteriorated. Further, since solder connection is performed at an extremely narrow pitch, there is a problem that electrical defects such as short circuits are likely to occur frequently.
【０００７】これらの問題は、フレキシブルプリント基
板（ＦＰＣ）のみに限られず、極細ケーブルあるいは極
細同軸ケーブルを、プリント基板（ＰＣＢ）やコネクタ
端子等に接続する場合にも生じていた。These problems are not limited to the flexible printed circuit board (FPC), but have also occurred when connecting a microfine cable or a microcoaxial cable to a printed circuit board (PCB), a connector terminal or the like.
【０００８】そこで、本発明の目的は、上記課題を解決
し、電線の導体を整線する作業が必要無く容易かつ迅速
に接続できると共に、電気的不良が生じない良好な接続
を可能とする電線の端末接続部構造および接続方法を提
供することにある。Therefore, an object of the present invention is to solve the above-mentioned problems and to easily and quickly connect the conductors of the electric wires without the need for arranging the conductors of the electric wires, and to make an excellent electric connection without causing an electrical defect. To provide a terminal connecting part structure and a connecting method.
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するため
に本発明は、複数本の電線をそれぞれ接続端子に接続す
るための端末接続部構造において、上記各接続端子に、
その各端部を一括して連結する接続用共通パット部を形
成し、上記複数本の電線を、接続すべき各接続端子に対
応させて配列すると共に、その端部の絶縁体を除去して
導体を露出させ、その複数本の電線の導体を上記接続用
共通パット部に接続した後、接続用共通パット部を、各
接続端子および各電線同士の間に位置する部分を切断除
去して隣接する接続端子と電線との接続部を電気的に絶
縁するようにしたものである。In order to achieve the above-mentioned object, the present invention provides a terminal connecting portion structure for connecting a plurality of electric wires to respective connecting terminals, wherein
A common pad portion for connection that collectively connects the respective end portions is formed, and the plurality of electric wires are arranged corresponding to each connection terminal to be connected, and the insulator at the end portion is removed. After exposing the conductor and connecting the conductors of the plurality of electric wires to the common pad portion for connection, the common pad portion for connection is removed by cutting off the portion located between each connection terminal and each electric wire. The connecting portion between the connecting terminal and the electric wire is electrically insulated.
【００１０】この構成によれば、各極細ケーブルの導体
を整線することなく一括して接続用共通パット部に接続
することができるため、導体の整線作業が必要なくな
り、容易かつ迅速に接続を行うことができる。また、極
細ケーブルの導体を接続用共通パット部に接続した後
に、各接続端子および各電線同士の間に位置する部分を
切断除去して電気的に絶縁するため、短絡などの電気的
不良が生じることがなく、良好な接続を行うことができ
る。According to this structure, the conductors of the respective ultrafine cables can be collectively connected to the common pad portion for connection without arranging the conductors, so that the conductor arranging work is not required and the connection can be made easily and quickly. It can be performed. Also, after connecting the conductor of the ultrafine cable to the common pad for connection, the portion located between each connection terminal and each electric wire is cut off and electrically insulated, so that an electrical defect such as a short circuit occurs. And a good connection can be made.
【００１１】また、上記電線の導体を、上記接続用共通
パッド部に対して、はんだ付け、溶接、あるいは熱圧着
によって接続するようにしても良い。Further, the conductor of the electric wire may be connected to the common pad portion for connection by soldering, welding, or thermocompression bonding.
【００１２】また、上記接続用共通パット部をレーザー
光を照射することによって切断除去するようにしても良
い。The common pad for connection may be cut and removed by irradiating it with a laser beam.
【００１３】更に本発明は、複数本の電線をそれぞれ接
続端子に接続するための端末接続方法において、上記各
接続端子に、その各端部を一括して連結する接続用共通
パット部を形成し、上記複数本の電線を、接続すべき各
接続端子に対応させて配列すると共に、その端部の絶縁
体を除去して導体を露出させ、その複数本の電線の導体
を上記接続用共通パット部に接続した後、接続用共通パ
ット部を、各接続端子および各電線同士の間に位置する
部分を切断除去して隣接する接続端子と電線との接続部
を電気的に絶縁するようにしたものである。Further, the present invention provides a terminal connecting method for connecting a plurality of electric wires to respective connecting terminals, wherein each connecting terminal is formed with a connecting common pad portion for collectively connecting the respective end portions thereof. , Arranging the plurality of electric wires so as to correspond to each connection terminal to be connected, removing the insulator at the end to expose the conductor, and connecting the conductors of the plurality of electric wires to the common pad for connection. After connecting to the connection part, the common pad part for connection is cut and removed at the part located between each connection terminal and each electric wire to electrically insulate the connection part between the adjacent connection terminal and the electric wire. It is a thing.
【００１４】[0014]
【発明の実施の形態】以下、本発明の好適な一実施形態
を添付図面に基づいて詳述する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
【００１５】図１〜図６は、本実施形態に係る電線の端
末接続部構造および接続方法を説明するための説明図で
あり、複数の極細ケーブルをフレキシブルプリント基板
（ＦＰＣ）に対して接続するものである。FIGS. 1 to 6 are explanatory views for explaining the structure of a terminal connecting portion of an electric wire and a connecting method according to this embodiment, in which a plurality of ultrafine cables are connected to a flexible printed circuit board (FPC). It is a thing.
【００１６】先ず、図１を用いて、本実施形態の極細ケ
ーブル（電線）を説明する。First, the ultrafine cable (electric wire) of this embodiment will be described with reference to FIG.
【００１７】図１は、極細ケーブル１の断面を示してお
り、極細ケーブル１は直径ｄ１＝０．０３ｍｍの錫メッ
キ銅合金線２を７本撚り合わせて形成された導体３（直
径ｄ２＝０．０９ｍｍ）を厚さ０．０８ｍｍのフッ素系
樹脂（ＰＦＡ）からなる絶縁層４で被覆したものであ
り、その外径Ｄは０．２５ｍｍである。FIG. 1 shows a cross section of an ultrafine cable 1. The ultrafine cable 1 is a conductor 3 (diameter d2 = 0) formed by twisting seven tin-plated copper alloy wires 2 having a diameter d1 = 0.03 mm. 0.09 mm) is coated with an insulating layer 4 made of a fluororesin (PFA) having a thickness of 0.08 mm, and its outer diameter D is 0.25 mm.
【００１８】一方、この極細ケーブル１を接続するフレ
キシブルプリント基板（ＦＰＣ）７は図２に示すよう
に、絶縁体からなる基板８上に配線された各配線部９，
９…と、その各配線部９の端部に形成された接続端子１
０，１０…と、その各接続端子１０の端部を一括して連
結する接続用共通パット部１１とを備えている。配線部
９、接続端子１０および接続用共通パット部１１は同一
の材料で一体に成形されたものであり、例えば、薄い銅
板等の伝導体で形成される。本実施形態では、接続端子
１０はピッチＰ１＝０．５ｍｍで配列されている。On the other hand, as shown in FIG. 2, the flexible printed circuit board (FPC) 7 to which the ultrafine cable 1 is connected has wiring portions 9 arranged on a substrate 8 made of an insulating material.
9 and connection terminals 1 formed at the ends of the respective wiring parts 9
0, 10 ..., And the common pad part 11 for connection which connects the end part of each connection terminal 10 collectively. The wiring portion 9, the connection terminal 10 and the connection common pad portion 11 are integrally formed of the same material, and are formed of a conductor such as a thin copper plate, for example. In this embodiment, the connection terminals 10 are arranged at a pitch P1 = 0.5 mm.
【００１９】さて、このようなＦＰＣ７の各接続端子１
０に図１に示した極細ケーブル１を接続する場合、先
ず、図３に示すように、接続端子１０と同数本（例え
ば、１２本）の極細ケーブル１，１…を接続すべき接続
端子１０にそれぞれ対応させて接続端子１０と等しいピ
ッチＰ２＝０．５ｍｍで並列に配列し、その上下（紙面
前後方向）から粘着テープ１５を貼り合わせて各極細ケ
ーブル１を一体的に固定する。このようにして得られた
テープ状のケーブル１６を、例えば長さＬ＝３００ｍｍ
に切断する。次にケーブル１６の両端部から各々所定距
離ｌ＝２ｍｍ隔てた位置でケーブル１６の幅方向にＣＯ
2 レーザー光を照射してスリットを入れ、ケーブル１６
の端部の粘着テープ１５および極細ケーブル１の絶縁層
４を剥離・除去して各極細ケーブル１の導体３，３…を
露出させる。このとき、各導体３は図に示すように整線
されていない状態である。Now, each connection terminal 1 of such an FPC 7
When connecting the ultrafine cables 1 shown in FIG. 1 to 0, first, as shown in FIG. 3, the connection terminals 10 to which the same number (for example, 12) of the ultrafine cables 1, 1 ... In parallel with the connection terminals 10 at a pitch P2 = 0.5 mm, and the adhesive tapes 15 are attached from above and below (in the front-back direction of the paper) to integrally fix the respective ultrafine cables 1. The tape-shaped cable 16 thus obtained is, for example, length L = 300 mm.
Disconnect. Next, in the width direction of the cable 16, CO is provided at a position separated by a predetermined distance l = 2 mm from both ends of the cable 16.
2 Irradiate a laser beam and make a slit,
The adhesive tape 15 and the insulating layer 4 of the ultrafine cable 1 at the end of are separated and removed to expose the conductors 3, 3, ... At this time, the conductors 3 are not aligned as shown in the figure.
【００２０】そして、露出した各導体３をはんだバスに
浸漬し、予備はんだを施す。このとき、導体間を連結す
るブリッジが発生しても構わない。Then, each exposed conductor 3 is dipped in a solder bath and pre-soldered. At this time, a bridge connecting the conductors may be generated.
【００２１】次に、図４に示すように、上記極細ケーブ
ル１の各導体３を不整線のまま、ＦＰＣ７の接続用共通
パット部１１に、ヒートパルス一括はんだ装置等を用い
て一括はんだ付け（接続）する。Next, as shown in FIG. 4, the conductors 3 of the extra-fine cable 1 are collectively soldered to the connecting common pad portion 11 of the FPC 7 by using a heat pulse batch soldering device or the like while leaving the conductor 3 in an irregular shape ( Connecting.
【００２２】そして、各極細ケーブル１の導体３がはん
だ接続された接続用共通パット部１１を、図５に斜線部
分Ａで示すように、各接続端子１０および各電線１同士
の間に位置する部分、および幅方向両端部に位置する部
分にレーザー光を照射して、その部分Ａに位置する接続
用共通パット部１１、はんだ材料および導体３を切断除
去する。その結果、図６に示すように、各接続端子１０
と各電線１同士とをそれぞれ接続する接続部２０を有す
る端末接続部構造が形成され、隣接する各接続部同士は
電気的に絶縁される。本実施形態では、接続部２０の幅
ｗは０．３ｍｍ、ピッチＰ３は０．５ｍｍ、各接続部間
の間隔Ｈは０．２ｍｍである。The common pad portion 11 for connection, to which the conductor 3 of each extra-fine cable 1 is soldered, is located between each connection terminal 10 and each electric wire 1, as shown by the hatched portion A in FIG. The portion and the portions located at both ends in the width direction are irradiated with laser light to cut and remove the common pad portion 11 for connection, the solder material and the conductor 3 located in the portion A. As a result, as shown in FIG.
And a terminal connecting portion structure having a connecting portion 20 for connecting the electric wires 1 with each other is formed, and the adjacent connecting portions are electrically insulated from each other. In this embodiment, the width w of the connecting portion 20 is 0.3 mm, the pitch P3 is 0.5 mm, and the distance H between the connecting portions is 0.2 mm.
【００２３】このように、本発明の電線の端末接続部構
造および接続方法によれば、各極細ケーブル１の導体３
を整線することなく一括して接続用共通パット部１１に
接続することができるため、導体３の整線作業が必要な
くなり、容易かつ迅速に接続を行うことができる。As described above, according to the electric wire terminal connecting portion structure and the connecting method of the present invention, the conductor 3 of each ultrafine cable 1 is used.
Since it is possible to collectively connect to the common pad portion 11 for connection without arranging the wires, it is not necessary to arrange the conductors 3, and the connection can be performed easily and quickly.
【００２４】また、極細ケーブル１の導体３を接続用共
通パット部１１に接続した後に、各接続端子１０および
各電線１同士の間に位置する部分を切断除去して電気的
に絶縁するため、短絡などの電気的不良が生じることが
なく、良好な接続を行うことができる。なお、導体１の
中には、例えば、図５において上から二番目の電線の導
体３のように、隣接する接続部２０を跨って位置するも
のがあるが、このような導体３は上記レーザー光を照射
することによって接続端子１０と電線１同士の間に位置
する部分Ａが切断されるため、短絡が生じることはな
い。In addition, after connecting the conductor 3 of the ultrafine cable 1 to the common pad portion 11 for connection, a portion located between each connection terminal 10 and each electric wire 1 is cut and removed to electrically insulate. Good connection can be achieved without causing an electrical defect such as a short circuit. It should be noted that some of the conductors 1 are located across the adjacent connecting portion 20, for example, like the conductor 3 of the second electric wire from the top in FIG. By irradiating light, the portion A located between the connection terminal 10 and the electric wire 1 is cut off, so that no short circuit occurs.
【００２５】以上のことから本発明によれば、接続加工
時間の短縮、生産性向上および歩留りの向上がはかれ、
品質の良い低コストな電線加工品を提供できる。From the above, according to the present invention, it is possible to shorten the connection processing time, improve the productivity, and improve the yield.
We can provide high quality and low cost processed electric wire products.
【００２６】これまで、極細ケーブルについて説明して
きたが、本発明はこの点において限定されず、極細同軸
ケーブルなど、他のタイプの電線にも適用できるもので
ある。Although the ultrafine cable has been described above, the present invention is not limited in this respect, and can be applied to other types of electric wires such as a microcoaxial cable.
【００２７】また、極細ケーブルをフレキシブルプリン
ト基板（ＦＰＣ）に対して接続する場合を説明してきた
が、本発明は、電線をプリント基板（ＰＣＢ）やコネク
タ等に接続する場合にも適用できるものである。Further, although the case where the ultrafine cable is connected to the flexible printed circuit board (FPC) has been described, the present invention is also applicable to the case where the electric wire is connected to the printed circuit board (PCB), the connector or the like. is there.
【００２８】また、接続用共通パット部をレーザー光を
照射して切断除去するとして説明したが、本発明は接続
用共通パット部の切断方法に制約はなく、レーザー加工
機、切断用金型あるいは研磨機などを使用して切断して
も良い。Although the connection common pad portion is described as being cut and removed by irradiating it with a laser beam, the present invention is not limited to the method for cutting the connection common pad portion, and a laser processing machine, a cutting die or You may cut using a grinder etc.
【００２９】更に、電線の導体を、はんだ付けによって
接続用共通パット部に接続するとして説明してきたが、
本発明はこの点においても制約はなく、熱圧着や溶接な
ど他の接続方法を用いても良いものである。Further, it has been explained that the conductor of the electric wire is connected to the common pad for connection by soldering.
The present invention is not limited in this respect as well, and other connection methods such as thermocompression bonding and welding may be used.
【００３０】[0030]
【発明の効果】以上要するに本発明によれば、以下に示
すごとく優れた効果を発揮するものである。In summary, according to the present invention, excellent effects are exhibited as shown below.
【００３１】１）導体の整線作業が必要なく容易かつ迅
速に接続を行うことができるため生産効率が良い。1) The production efficiency is good because the conductors can be connected easily and promptly without the need to arrange the conductors.
【００３２】２）短絡などの電気的不良が生じることが
なく、良好な接続を行うことができる。2) A good connection can be made without causing an electrical defect such as a short circuit.
【図１】本発明の一実施形態に係る電線の断面図であ
る。FIG. 1 is a sectional view of an electric wire according to an embodiment of the present invention.
【図２】本発明の一実施形態に係るＦＰＣの構造を示す
平面図である。FIG. 2 is a plan view showing the structure of an FPC according to an embodiment of the present invention.
【図３】本発明の一実施形態において、電線を配列して
固定し、両端部の導体を露出させた状態を示す説明図で
ある。FIG. 3 is an explanatory view showing a state in which electric wires are arranged and fixed, and conductors at both ends are exposed, in an embodiment of the present invention.
【図４】本発明の一実施形態において、各電線の導体を
ＦＰＣの接続用共通パット部に接続した状態を示す説明
図である。FIG. 4 is an explanatory diagram showing a state in which the conductors of the electric wires are connected to a common pad part for connection of the FPC in the embodiment of the present invention.
【図５】本発明の一実施形態において、接続用共通パッ
ト部の切断除去部分を示す説明図である。FIG. 5 is an explanatory view showing a cut-and-removed portion of the common pad portion for connection in the embodiment of the present invention.
【図６】本発明の一実施形態において、接続用共通パッ
ト部を切断除去して各電線と接続端子との接続部を形成
した状態を示す説明図である。FIG. 6 is an explanatory view showing a state in which a connection common pad portion is cut and removed to form a connection portion between each electric wire and a connection terminal in the embodiment of the present invention.
【図７】従来の電線端末接続部構造におけるＦＰＣの構
造を示す平面図である。FIG. 7 is a plan view showing a structure of an FPC in a conventional electric wire terminal connecting portion structure.
【図８】従来の電線端末接続部構造において、電線を配
列して固定し、両端部の導体を露出させた状態を示す説
明図である。FIG. 8 is an explanatory view showing a state in which electric wires are arranged and fixed, and conductors at both end portions are exposed in a conventional electric wire terminal connecting portion structure.
【図９】従来の電線端末接続部構造において、電線の導
体を整線した状態を示す説明図である。FIG. 9 is an explanatory view showing a state in which conductors of electric wires are arranged in a conventional electric wire terminal connecting portion structure.
【図１０】従来の電線の端末接続部構造を示す説明図で
ある。FIG. 10 is an explanatory view showing a structure of a conventional terminal connecting portion of an electric wire.
１ 電線 ３ 導体 ４ 絶縁体 １０ 接続端子 １１ 接続用共通パット部 ２０ 接続部 1 electric wire 3 conductors 4 insulator 10 connection terminals 11 Common pad part for connection 20 connection
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｒ 43/02 Ｈ０５Ｋ 3/00 Ｎ Ｈ０５Ｋ 3/00 3/22 Ｅ 3/22 3/40 Ｃ 3/40 Ｈ０１Ｒ 9/09 Ｚ Ｆターム(参考） 5E051 KA00 KB03 LA01 LA06 LB04 5E077 BB03 BB06 BB32 BB37 DD01 DD03 JJ18 JJ20 JJ21 5E085 BB02 BB04 BB09 CC03 DD01 DD03 HH35 JJ38 5E317 AA07 AA11 AA30 BB01 BB12 CC15 CC60 GG17 GG20 5E343 BB09 BB24 DD75 FF21 FF30 GG11 GG20 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) H01R 43/02 H05K 3/00 N H05K 3/00 3/22 E 3/22 3/40 C 3/40 H01R 9/09 ZF term (reference) 5E051 KA00 KB03 LA01 LA06 LB04 5E077 BB03 BB06 BB32 BB37 DD01 DD03 JJ18 JJ20 JJ21 5E085 BB02 BB04 BB09 CC03 DD01 DD75 HBB35 JJ38 5E317 AA07BB20EBBA20 ABB15A20 AA15 AA11 AA11 AA15 AA15 AA15 AA11 AA15 AA11 AA15 AA11 FF30 GG11 GG20
Claims (4)
するための端末接続部構造において、 上記各接続端子に、その各端部を一括して連結する接続
用共通パット部を形成し、 上記複数本の電線を、接続すべき各接続端子に対応させ
て配列すると共に、その端部の絶縁体を除去して導体を
露出させ、 その複数本の電線の導体を上記接続用共通パット部に接
続した後、接続用共通パット部を、各接続端子および各
電線同士の間に位置する部分を切断除去して隣接する接
続端子と電線との接続部を電気的に絶縁するようにした
ことを特徴とする電線の端末接続部構造。1. A terminal connecting portion structure for connecting a plurality of electric wires to connecting terminals, respectively, wherein a common pad portion for connection is formed on each of the connecting terminals, the connecting common pad portion connecting the respective end portions together. Arrange a plurality of electric wires corresponding to each connection terminal to be connected, remove the insulator at the end to expose the conductor, and connect the conductors of the plurality of electric wires to the common pad part for connection. After connecting, the common pad part for connection is cut and removed at the part located between each connection terminal and each electric wire to electrically insulate the connection part between the adjacent connection terminal and the electric wire. Characteristic electric wire terminal connection part structure.
ド部に対して、はんだ付け、溶接、あるいは熱圧着によ
って接続するようにした請求項１記載の電線の端末接続
部構造。2. The end connecting portion structure of an electric wire according to claim 1, wherein the conductor of the electric wire is connected to the common pad portion for connection by soldering, welding, or thermocompression bonding.
照射することによって切断除去するようにした請求項１
又は２記載の電線の端末接続部構造。3. The connecting and removing pad part is cut and removed by irradiating the common pad part with laser light.
Or the structure of the terminal connecting portion of the electric wire according to 2.
するための端末接続方法において、 上記各接続端子に、その各端部を一括して連結する接続
用共通パット部を形成し、 上記複数本の電線を、接続すべき各接続端子に対応させ
て配列すると共に、その端部の絶縁体を除去して導体を
露出させ、 その複数本の電線の導体を上記接続用共通パット部に接
続した後、接続用共通パット部を、各接続端子および各
電線同士の間に位置する部分を切断除去して隣接する接
続端子と電線との接続部を電気的に絶縁するようにした
ことを特徴とする電線の端末接続方法。4. A terminal connecting method for connecting each of a plurality of electric wires to a connecting terminal, wherein each connecting terminal is formed with a connecting common pad portion for collectively connecting each end portion thereof. The electric wires of the electric wires are arranged corresponding to the respective connection terminals to be connected, and the insulators at the ends are removed to expose the conductors, and the conductors of the plural electric wires are connected to the common pad portion for connection. After that, the common pad portion for connection is characterized in that the portion located between each connection terminal and each electric wire is cut and removed to electrically insulate the connection portion between the adjacent connection terminal and the electric wire. How to connect the end of the electric wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001278302A JP4281271B2 (en) | 2001-09-13 | 2001-09-13 | Electric wire terminal connection structure and connection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001278302A JP4281271B2 (en) | 2001-09-13 | 2001-09-13 | Electric wire terminal connection structure and connection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003086911A true JP2003086911A (en) | 2003-03-20 |
| JP4281271B2 JP4281271B2 (en) | 2009-06-17 |
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ID=19102692
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001278302A Expired - Fee Related JP4281271B2 (en) | 2001-09-13 | 2001-09-13 | Electric wire terminal connection structure and connection method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008204879A (en) * | 2007-02-22 | 2008-09-04 | Shizuki Electric Co Inc | Method of manufacturing electric component |
| JP2008537288A (en) * | 2005-04-07 | 2008-09-11 | スリーエム イノベイティブ プロパティズ カンパニー | Cable harness body |
| JP2012064869A (en) * | 2010-09-17 | 2012-03-29 | Toshiba Hokuto Electronics Corp | Method of manufacturing flexible printed wiring board |
| JP2013165207A (en) * | 2012-02-13 | 2013-08-22 | Denso Corp | Circuit board with conductor and manufacturing method therefor |
| CN113597108A (en) * | 2021-07-28 | 2021-11-02 | 恒赫鼎富(苏州)电子有限公司 | Cable wire made of FPC (flexible printed circuit) material and manufacturing process thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6317929B2 (en) * | 2014-01-17 | 2018-04-25 | 矢崎総業株式会社 | Flat cable with connector and flat cable |
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2001
- 2001-09-13 JP JP2001278302A patent/JP4281271B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008537288A (en) * | 2005-04-07 | 2008-09-11 | スリーエム イノベイティブ プロパティズ カンパニー | Cable harness body |
| JP2008204879A (en) * | 2007-02-22 | 2008-09-04 | Shizuki Electric Co Inc | Method of manufacturing electric component |
| JP2012064869A (en) * | 2010-09-17 | 2012-03-29 | Toshiba Hokuto Electronics Corp | Method of manufacturing flexible printed wiring board |
| JP2013165207A (en) * | 2012-02-13 | 2013-08-22 | Denso Corp | Circuit board with conductor and manufacturing method therefor |
| CN113597108A (en) * | 2021-07-28 | 2021-11-02 | 恒赫鼎富(苏州)电子有限公司 | Cable wire made of FPC (flexible printed circuit) material and manufacturing process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4281271B2 (en) | 2009-06-17 |
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