JP2011086460A - Terminal processed cable array and method of connecting it with printed-circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a terminal processed cable array in which the pitch of an extra-fine coaxial cable array can be maintained until the completion time of connection work and connection work to various circuit boards can be made without using an additional connector member, and a method of connecting it with a printed-circuit board. <P>SOLUTION: The terminal processed cable array is provided with a plurality of cables and a terminal holding material which is constructed of a molded thermosetting resin that is not thermally cured. The cables are arranged with a specific pitch spacing by arranging terminals and terminal-side conductors constituting the cables are exposed, and the exposed conductors are fixed with the specific pitch spacing by the terminal holding material. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a terminal-processed cable array and a method for connecting it to a printed wiring board, and in particular, a liquid crystal display for a personal computer, an ultrasonic diagnostic apparatus that requires high resolution, and a display for a mobile phone, etc., where resolution is increasing. The present invention relates to a terminal processing cable array using an ultrafine coaxial cable used as a peripheral wiring material, and a method for connecting it to a printed wiring board.

  Conventionally, an FPC (flexible printed circuit board) has been mainly used as a peripheral wiring material for LCDs (liquid crystal displays) used in notebook personal computers, ultrasonic diagnostic apparatuses, mobile phones, and the like.

  However, with the recent trend toward higher image quality of LCDs, it has become necessary to increase the speed of image signals. To meet this demand, instead of FPC, ultra-fine coaxial cables are applied to wiring materials around LCDs. became.

  Furthermore, LCD panels of recent mobile phones and notebook computers have a keyboard portion and an LCD portion that can be folded via a hinge portion, and the hinge portion has a rotation 3 from a conventional two-dimensional folding configuration. It has a dimensional structure. In this case, an ultrafine coaxial cable advantageous for three-dimensional movement is applied.

  FIG. 8 shows a configuration of a general micro coaxial cable. FIG. 8A is a perspective view showing the configuration of the micro coaxial cable, and FIG. 8B is a ZZ cross-sectional view of the micro coaxial cable shown in FIG.

  The micro coaxial cable 2 shown in FIG. 8 includes a center conductor 21, an insulator 22, an external conductor 23, and a jacket 24. The central conductor 21 is formed by twisting a plurality of strands made of a conductive metal. An insulator 22 is provided around the center conductor 21. An outer conductor 23 is disposed around the insulator 22. A jacket 24 is disposed around the outer conductor 23.

  The insulator 22 is made of an insulating material, and usually a fluorine resin such as PFA is used. The outer conductor 23 is made of a Cu alloy.

  The dimensions of a general micro coaxial cable are AWG # 46, the outer diameter of the jacket 24 is 0.2 mm, the outer diameter of the outer conductor 23 is 0.15 mm, the outer diameter of the insulator 23 is 0.11 mm, and the center conductor 21 is The outer diameter is 0.048 mm. In the case of AWG # 46, the center conductor 21 is configured by twisting seven strands having an outer diameter of 0.016 mm.

  When using an extra-fine coaxial cable, when connecting to various circuit boards such as FPC and PCB (printed circuit board) or connector terminals, for example, soldering to the above-mentioned extra-fine conductor and electrode pattern on the board or connector terminal Therefore, there is a problem that a large amount of labor is required for the connection work to ensure the reliability of the connection portion.

  For flat-type conductors such as FPC, connectors for directly inserting flat-type conductors have been developed, and easy connection work has been realized. However, the connector for the micro coaxial cable uses two types of members, the plug side and the receptacle side, the receptacle side must be installed on the board side, and the plug side member must be connected to the micro coaxial cable side. Even using a connector is not an easy task.

  Patent Document 1 describes a cable processed product in which FPCs are provided on both ends in the longitudinal direction of a micro coaxial cable.

  In Patent Document 2, in a micro coaxial cable array, a dielectric layer constituting a micro coaxial cable is shifted in a peeling direction in a predetermined length to expose a central conductor, and then the array of adjacent arrays to the shifted dielectric layer is disclosed. A terminal-processed cable is described which maintains the pitch arrangement of the central conductors of the micro-coaxial cable array by heat-sealing other dielectric layers of other micro-coaxial cables that are similarly displaced.

JP 2005-317334 A Japanese Patent Laid-Open No. 2005-50622

  In the cable processed product described in Patent Document 1, when mounting on various circuit boards such as a printed circuit board, connection is made by inserting an end into an FPC dedicated connector provided on the printed circuit board side. Although the cable mounting process can be simplified, the process for connecting the micro coaxial cable to the FPC has not been simplified.

  In the cable with terminal processing described in Patent Document 2, since the pitch arrangement of the central conductors of the micro coaxial cable array is maintained, alignment during connection work to the printed circuit board and the connector terminal is facilitated. However, since it is necessary to peel off the dielectric layers fused to each other as the pitch holding member before the final connection operation, there remains a problem that the arrangement cannot be maintained immediately before the connection operation.

  The present invention eliminates the problems of the prior art, enables the pitch of the fine coaxial cable array to be maintained until the completion of the connection work, and enables terminal processing that can be connected to various circuit boards without using an additional connector member. It is an object of the present invention to provide a cable array and a method for connecting it to a printed wiring board.

In order to achieve the above object, the present invention provides:
Multiple cables,
A terminal processing cable array comprising a terminal holding material composed of a molded thermosetting resin that is not thermoset,
The cables are arranged at specific pitch intervals with the terminals aligned,
The conductor constituting the cable on the terminal side is exposed,
Provided is a terminal-processed cable array, wherein the exposed conductors are fixed at the specific pitch interval by the terminal holding material.

  In addition, the present invention provides a terminal processing cable array, wherein conductive particles are dispersed in the terminal holding material.

  In the present invention, the cable includes a center conductor, an insulator formed around the center conductor, an outer conductor disposed around the insulator, and a jacket covering the outer conductor. A terminal-processed cable array characterized by being an ultrafine coaxial cable.

  Further, according to the present invention, in the micro coaxial cable, a center conductor, an insulator, and an outer conductor are exposed in order from the terminal side, and each exposed length is 0.2 mm or more and 5.0 mm or less. A processed cable array is provided.

Further, the present invention is a method for connecting the terminal processing cable array and the printed wiring board,
A plurality of substrate electrodes are arranged on the printed wiring board,
The conductors are arranged at the same pitch as the pitch at which the substrate electrodes are arranged,
The terminal processing cable array is disposed on the printed wiring board so that the conductor faces the substrate electrode,
The terminal holding material is heated while being pressurized,
When the thermosetting resin constituting the terminal holding material has a reduced viscosity due to an increase in temperature, the conductor is brought into contact with the substrate electrode by the pressurization,
Provided is a method of connecting a terminal processing cable array and a printed wiring board, characterized in that the conductor is fixed in contact with the substrate electrode by curing of a thermosetting resin.

Further, the present invention is a method for connecting the terminal processing cable array and the printed wiring board,
A plurality of substrate electrodes are arranged on the printed wiring board,
The central conductor is arranged at the same pitch as the pitch at which the substrate electrodes are arranged,
The terminal processing cable array is arranged on the printed wiring board so that the central conductor faces the substrate electrode,
By means of the pressure heating tool with a step provided with a step which is not less than the thickness of the insulator, which is a value obtained by subtracting the diameter of the central conductor from the diameter of the insulator of the micro coaxial cable, and having a step which is not more than the diameter of the outer conductor, the terminal The position of the holding material facing the central conductor and the outer conductor is heated while being pressurized,
When the viscosity of the thermosetting resin constituting the terminal holding material is reduced due to an increase in temperature, the center conductor and the outer conductor are brought into contact with the substrate electrode by the pressurization,
Provided is a method of connecting a terminal processing cable array and a printed wiring board, wherein the center conductor and the outer conductor are fixed in contact with the substrate electrode by curing a thermosetting resin.

  According to the present invention, it is possible to maintain the pitch of the micro-coaxial cable array until the completion of the connection work, and a terminal-processed cable array that can be connected to various circuit boards without using an additional connector member, and a printed wiring board therefor Connection method is obtained.

  This makes it possible to maintain the pitch of the micro coaxial cable array until the completion of the operation of connecting the terminal processing cable array to various circuit boards, and the connection work to various circuit boards can be performed without using an additional connector member. It becomes possible.

  According to the present invention, it is not necessary to use an additional connector member in connecting the terminal processing cable array to various circuit boards, particularly in connecting to the printed wiring board. For this reason, when connecting the terminal processing cable array onto the printed wiring board, the area occupied by the terminal processing cable array on the printed wiring board can be minimized, so that the mounting density of the electronic components is improved, The performance can be improved.

  In addition, by using the end-processed cable array according to the present invention, it becomes possible to connect the central conductor and the outer conductor of the coaxial cable, which has been conventionally connected individually, in a single process, thereby shortening the manufacturing process. Is possible.

It is a perspective view which shows the terminal processing cable array which concerns on embodiment of this invention. It is a figure which shows the process of processing the terminal of the terminal processing cable array which concerns on embodiment of this invention. It is a figure which shows the process of providing the terminal holding material with which the terminal processing cable array which concerns on embodiment of this invention is provided. It is a figure which shows the terminal processing cable array which concerns on embodiment of this invention. It is a figure which shows the method of connecting the terminal processing cable array and printed wiring board which concern on embodiment of this invention. It is a figure which shows the method of connecting the terminal processing cable array and printed wiring board which concern on embodiment of this invention. It is a figure which shows the method of connecting the terminal processing cable array and printed wiring board which concern on embodiment of this invention. It is a figure which shows the structure of a common microfine coaxial cable.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[Terminal processing cable array]
FIG. 1 shows a terminal processing cable array according to an embodiment of the present invention. A terminal-processed cable array 1 shown in FIG. 1 includes a plurality of micro coaxial cables 2, a polyimide sheet 11 that is an array pitch holding material, and a thermosetting resin 12 that is a terminal holding material.

  The micro coaxial cables 2 are arranged at specific pitch intervals. The specific pitch interval is, for example, the pitch of connection electrodes provided on various circuit boards such as a printed wiring board to which the terminal processing cable array 1 is connected.

  The micro coaxial cables 2 arranged at specific pitch intervals are fixed by a polyimide sheet 11 which is an arrangement pitch holding material. The polyimide sheet 11 is made of a sticky adhesive or a thin film polyimide coated with a thermosetting resin on one side, with the adhesive surfaces facing each other from the front and back surfaces of the micro coaxial cable 2 and joined together to form the micro coaxial cable 2. It is fixed.

  As the present embodiment, the polyimide sheet 11 is used as the array pitch holding material, but the embodiment of the present invention is not limited to this. As the arrangement pitch holding material, for example, an injection molding resin, a molding material, or the like may be used.

  Each of the plurality of micro coaxial cables 2 arranged at a specific pitch is arranged on the leading end side of the micro coaxial cable 2 with respect to the polyimide sheet 11 and in order from the side closer to the polyimide sheet 11, the outer conductor 23, the insulator 22, and the central conductor. 21 is exposed.

  The outer conductor 23, the insulator 22, and the center conductor 21 exposed at the distal end side of the micro coaxial cable 2 with respect to the polyimide sheet 11 are covered with a thermosetting resin 12 that is a terminal holding material. The thermosetting resin 12 is formed by molding a thermosetting resin that is not thermoset as a whole. By being covered with the thermosetting resin 12, the arrangement of the outer conductor 23, the insulator 22, and the center conductor 21 of each of the plurality of micro coaxial cables 2 is fixed at specific pitch intervals.

  In the present embodiment, an epoxy resin having a curing temperature of about 195 ° C. to 200 ° C. is used as the thermosetting resin 12. As an embodiment of the present invention, it is desirable that the thermosetting resin 12 has a curing temperature of 300 ° C. or less in consideration of the heat resistant temperature of the fluororesin that constitutes the insulator 3 that constitutes the micro coaxial cable 2.

  The exposed length of the center conductor 21 is preferably 0.2 mm or more and 5 mm or less in consideration of workability of terminal processing and connection reliability. In this range, when the center conductor 21 is connected to electrodes on various circuit boards such as a printed wiring board, a minimum connection area can be secured, and if necessary, the exposed center conductor 21 can be preliminarily soldered. It can also be applied.

  The exposed length of the insulator 22 is preferably 0.2 mm or more and 5 mm or less in consideration of workability of terminal processing and connection reliability. In this range, when the central conductor 21 and the external conductor 23 are connected to electrodes on various circuit boards such as a printed wiring board, there is no problem that they are electrically short-circuited. Further, by keeping the insulator length at 5 mm or less, the bending rigidity of the insulator portion becomes high, and it becomes possible to properly maintain the arrangement pitch of the terminal portion when the terminal processing cable array 1 is manufactured.

  The exposed length of the outer conductor 23 is preferably 0.2 mm or more and 5 mm or less in consideration of workability of terminal processing and connection reliability. In this range, when the external conductor 23 is connected to electrodes on various circuit boards such as a printed wiring board, a minimum connection area can be secured, and if necessary, the exposed external conductor 23 can be preliminarily soldered. It can also be applied.

[Method for manufacturing terminal-processed cable array]
(1) Processing of Cable Terminal FIG. 2 shows a method of manufacturing a terminal processing cable array according to the embodiment of the present invention.

  First, as shown in FIG. 2A, a plurality of micro coaxial cables 2 are fixed at a specific pitch using a polyimide sheet 11.

  Specifically, a micro coaxial cable 2 of AWG # 46 (jacket outer diameter 0.2 mm, outer conductor outer diameter 0.15 mm, insulator outer diameter 0.11 mm, center conductor outer diameter 0.048 mm) is pitched at 0.25 mm. 16 are arranged.

  A polyimide sheet 11 having a thickness of 0.1 mm, a length of 6 mm, and a width of 1 mm, coated with a thermosetting resin on one side, is applied to the front and back sides of the 16 micro coaxial cables 2 described above.

  Using a pressure heating tool (not shown) having an area approximately equal to the length and width of the polyimide sheet 11, the polyimide sheet 11 is sandwiched with a load and heat of about 3 N and 250 ° C. from both sides of the micro coaxial cable 2. And fix the micro coaxial cable 2.

  At this time, the terminal side of the fine coaxial cable 2 from the polyimide sheet 11 is covered with the jacket 24 of the fine coaxial cable 2.

  Next, the jacket 24 at the dotted line position shown in FIG. 2B and the external conductor (not shown) are cut. Here, the term “cut” means that the jacket 24 and the outer conductor are cut along the entire circumference of the micro coaxial cable 2, but the insulator 22 and the center conductor 21 disposed inside the outer conductor 23 are not cut. .

Specifically, the CO ₂ laser is irradiated from the back side and the front side of the micro coaxial cable 2 at the dotted line position shown in FIG. 2B, and the jacket 24 is burned and vaporized.

At this time, the energy of the CO ₂ laser is absorbed by the jacket 24 and used for combustion and vaporization of the jacket 24, and other energy is reflected by the surface of the outer conductor 23.

  Next, the same dotted line position is irradiated with a YAG laser from the back side and the front side of the micro coaxial cable 2, and the external conductor 23 is cut at the dotted line position. The energy of the YAG laser is absorbed by the outer conductor surface, and the Cu alloy constituting the outer conductor is instantaneously melted. The molten Cu alloy is rounded by the surface tension, and as a result, a gap of about 0.1 mm to 0.15 mm is generated in the YAG laser irradiated portion, and the outer conductor 23 is cut.

Next, the jacket 24 at the dotted line position shown in FIG. 2C is cut by the method described in FIG. Then, the jacket 24 on the terminal side of the micro coaxial cable 2 from the dotted line position shown in FIG. 2C and the outer conductor 24 cut at the dotted line position shown in FIG. 2B are pulled out. Thereby, the insulator 22 on the terminal side of the fine coaxial cable from the dotted line position shown in FIG. 2B and the outer conductor 23 on the terminal side of the fine coaxial cable 2 exposed from the dotted line position shown in FIG. To do.
At this time, the exposed lengths of the outer conductor 23 and the insulator 22 were 1 mm and 0.9 mm, respectively.

  Next, the insulator 22 at the dotted line position shown in FIG. 2D was cut, and the insulator 22 was pulled out as shown in FIG. 2E to expose the central conductor 21.

Specifically, the CO ₂ laser is irradiated from the back side and the front side of the micro coaxial cable 2 to the dotted line position in FIG. 2D, and the insulator 3 is burned and vaporized at the dotted line position shown in FIG. . At this time, the position where the CO ₂ laser was irradiated was set to a position of 0.4 mm from the terminal side of the micro coaxial cable 2.

  That is, at the stage of FIG. 2D, the outer conductor 23, the insulator 22, and the center conductor 21 are exposed at lengths of 1 mm, 0.5 mm, and 0.4 mm, respectively.

  Finally, as shown in FIG. 2 (f), the terminal side of the polyimide sheet 11 is covered with a thermosetting resin 12 to obtain the terminal-processed cable array 1.

(Grounds for optimal conditions)
The following can be said with respect to the exposed lengths of the central conductor, insulator, and outer conductor.

The exposed length of the center conductor is preferably 0.2 mm or more and 5 mm or less. In the step of FIG. 2D, the insulator 22 is cut by irradiating the insulator 22 with a CO ₂ laser and burning and vaporizing the insulator 22.

Thereafter, in the step of FIG. 2E, the insulator 22 is pulled out to the end side of the micro coaxial cable 1 to expose the center conductor 21, but the cutting width of the cut surface of the insulator 22 irradiated with the CO ₂ laser is about In this region, the combustion residue of the insulator 22 adheres to the central conductor surface 21. If combustion residue adheres to the center conductor 21, connection failure is likely to occur.

  The exposed length of the center conductor 21 that does not cause poor connection practically needs to be 0.2 mm or more in the length from the center of the cut width of the insulator 22 to the tip.

  In addition, it may be necessary to preliminarily apply solder to the exposed central conductor 21 to suppress the dispersion of the central conductor 21 formed of a stranded wire.

  The solder is usually applied by inserting a central conductor into a sealed solder bath. When the exposed length of the center conductor is long, when the center conductor is inserted into the solder bath and pulled out, the center conductor 21 of the adjacent micro coaxial cable 2 is pulled and bent by the surface tension of the molten solder, and the adjacent conductors are bent. Thus, a so-called bridge is formed.

  In order to suppress this solder bridge, it is desirable that the exposed length of the central conductor 21 be 5 mm or less.

  The exposed length of the insulator 22 is desirably 0.2 mm or more and 5 mm or less. In the step of covering the entire terminal exposed portion with the thermosetting resin 12 in the steps of FIGS. 2 (e) and 2 (f), in the stage before fixing the pitch of the terminal portion with the thermosetting resin 12, particularly the insulator 22. Since the outer conductor 23 and the jacket 24 are removed, the outer diameter of the front end side of the exposed portion becomes thinner, and the rigidity of the front end portion becomes extremely lower than that of the portion where the jacket 24 is covered. For this reason, the pitch interval at the tip tends to be disturbed by some contact and vibration.

  As means for solving this problem, there is a method of increasing the bending rigidity by shortening the exposed length of the insulator 22.

  The insulator exposure length that can be practically manufactured in this embodiment is 5 mm or less. Further, regarding the structure of the electrodes formed on the surface of the substrate to be connected and the connection of the end processing cable array according to the present embodiment, an electrical short circuit between the electrode on the central conductor 21 side and the electrode on the external conductor 23 side is prevented. In order to do so, it is necessary to have a distance of 0.2 mm or more. Therefore, it can be seen that the lower limit of the exposed length of the insulator 22 is 0.2 mm.

The exposed length of the outer conductor 23 is preferably 0.2 mm or more and 5 mm or less. In the step of FIG. 2 (c), the irradiated with CO ₂ laser to the jacket 24, burning the jacket 24, is cut by vaporizing, but then expose the outer conductor 23 and pull the jacket 24 to the terminal unit, CO ₂ The cut width of the cut portion of the jacket 24 irradiated with the laser is about 0.1 mm, and the combustion residue of the jacket 24 adheres to the surface of the outer conductor 23 in that region. If combustion residues adhere to the outer conductor 23, poor connection is likely to occur.

  The exposed length of the outer conductor 23 that does not cause poor connection practically needs to be 0.2 mm or more in the length from the center of the cut width of the jacket 24 to the cut portion of the outer conductor 23.

  Further, when the solder is preliminarily applied to the outer conductor 23, the solder may be applied in a state in which a solder bridge is formed and electrically connected to the outer conductor 23 of the adjacent micro coaxial cable 2 in terms of electrical characteristics. Such a solder application method is usually performed. However, at that time, when the solder is solidified in a state where the adjacent outer conductors 23 are attracted to each other due to the surface tension of the molten solder, the arrangement pitch of the insulators 22 and the central conductors 21 on the tip side of the outer conductors 23 is increased. There is a problem that is disturbed.

  To solve this problem, there is a method of increasing the rigidity by shortening the exposed length of the outer conductor 23. In the present embodiment, the exposed length of the outer conductor 23 that does not affect the arrangement pitch of the central conductors 21 is 5 mm or less.

(2) Manufacturing method of thermosetting resin The method of providing the thermosetting resin 12 which is a terminal holding material in the terminal processing cable array 1 which concerns on embodiment of this invention is demonstrated based on FIG.

  FIG. 3A shows a resin molding jig in which a thermosetting resin 12 as a terminal holding material is provided on the terminal processing cable array 1 in the present embodiment. The resin molding jig 3 shown in FIG. 3A includes a recess 31 and inclined walls 32 and 32.

  The recess 31 is formed on the surface of the resin molding jig 3. The inclined walls 32 and 32 are continuously provided on both sides of the recess 31 on the side surface of the recess 31.

  The recess 31 is formed to a depth that the outer conductor 23, the insulator 22, and the center conductor 21 of the micro coaxial cable 2 constituting the terminal processing cable array 1 are accommodated. The slant walls 32 and 32 are formed to have a height corresponding to the height position of the outer conductor 23 from the central conductor 21.

  In the present embodiment, the depth of the recess 31 is 0.1 mm. The inclined walls 32 and 32 are the highest in the vicinity where the outer conductor 23 is disposed, and the height thereof is 0.17 mm from the bottom surface of the recess 31.

  FIG. 3B shows a conceptual diagram of a process of providing the thermosetting resin 12 on the terminal processing cable array 1 using the resin molding jig 12.

  In the step of providing the thermosetting resin 12 on the terminal processing cable array 1, the terminal processing cable array 1 is arranged on the resin molding jig 3, as shown in FIG. At this time, the outer conductor 23, the insulator 22, and the center conductor 21 included in the plurality of micro coaxial cables 2 constituting the terminal processing cable array 1 are placed in the recess 31. The terminal processing cable array 1 is arranged so that the polyimide sheet 11 is in contact with the inclined walls 32 and 32, thereby positioning the terminal processing cable 1.

  The thermosetting resin 12 is formed by dissolving the adhesive composition in a solvent, providing the dispersed adhesive composition solution in the recess 31, and then volatilizing the solvent.

  As shown in FIG. 3B, after the terminal-processed cable array 1 is arranged on the resin molding jig 3, the adhesive composition solution is dropped into the recess 31. Due to the viscosity of the dropped adhesive composition solution, the adhesive composition solution is held between the inside of the recess 31 and the inclined walls 32 and 32.

  By holding the adhesive composition solution inside the recess 31 and between the inclined walls 32 and 32, the outer conductor 23, the insulator 22, and the central conductor 21 constituting the terminal-processed cable array 1 are entirely adhesive composition. Covered with solution.

  When the entire outer conductor 23, insulator 22, and center conductor 21 are covered with the adhesive composition solution, the thermosetting resin 12 is formed by volatilizing the solvent of the adhesive composition solution.

  The terminal processing cable array which concerns on embodiment of this invention is obtained by the above-mentioned process. FIG. 4 shows the configuration of the terminal processing cable array according to the present embodiment. Fig.4 (a) is a top view of the terminal processing cable array 1 which concerns on this Embodiment, FIG.4 (b) is a side view. 4C is a cross-sectional view taken along the line XX shown in FIG. 4A, and FIG. 4D is a cross-sectional view taken along the line YY shown in FIG. 4A.

  As shown in FIG. 4A, the end-processed cable array 1 according to the present embodiment includes an outer conductor 23, an insulator 22, and a center conductor 21 that are exposed on the distal end side of the micro coaxial cable 2 with respect to the polyimide sheet 11. The thermosetting resin 12 is covered.

  As shown in FIG. 4 (b), the plurality of micro coaxial cables 2 constituting the terminal processing cable array 1 according to the present embodiment are such that the polyimide sheet 11, which is an array pitch holding material, is on the front and back surfaces of the micro coaxial cable 2. Then, they are joined to each other, and the micro coaxial cable 2 is fixed. The central conductor 21 and the outer conductor 23 may be either buried in the thermosetting resin 12 or exposed on the surface.

  In the present embodiment, the outer conductor 23, the insulator 22, and the center conductor 21 are covered with a thermosetting resin 12 that is a terminal holding material. Therefore, as shown in FIGS. 4C and 4D, the outer conductor 23, the insulator 22, and the center conductor 21 are arranged in the thermosetting resin 12.

[Modification of this embodiment]
As a modification of the embodiment of the present invention, in order to supplement the connectivity between the center conductor 21 and the outer conductor 23 and the electrode to be connected at the time of connection work, the conductor particles (Au, (Metals such as Ag and Cu) may be dispersed. The center conductor 21 and the outer conductor 23 may be preliminarily applied with molten solder before being molded into the thermosetting resin 12.

[Connection to printed wiring board]
Hereinafter, the process of connecting the terminal processing cable array which concerns on embodiment of this invention to to-be-connected members, such as a printed wiring board, is demonstrated based on figures.

(1) Method of Connecting Center Conductor of Terminal Processed Cable Array to Printed Wiring Board FIG. 5 shows the connection of the center conductor of the terminal processed cable array according to the embodiment of the present invention to a connection electrode provided on the printed wiring board. The process is shown.

  FIG. 5A shows a conceptual diagram of a connection process according to the present embodiment. In FIG. 5A, the terminal processing cable array 1, the printed wiring board 4, and the pressure heating tool 5 are used in the connection process according to the present embodiment.

  The printed wiring board 4 is provided with a plurality of substrate electrodes 41 and ground electrodes 42 arranged at a specific pitch. Here, the pitch at which the substrate electrodes 41 are arranged and the pitch of the central conductor 21 of the terminal processing cable array 1 are made the same in advance. In addition, the pitch of arranging the ground electrodes 42 and the pitch of the outer conductors 23 of the terminal processing cable array 1 are made the same in advance.

  The terminal processing cable array 1 is positioned on the printed wiring board 4 so that the center conductor 21 faces the substrate electrode 41 and the outer conductor 23 faces the ground electrode 42.

  The pressurizing / heating tool 5 is disposed on the center conductor 21.

  Hereinafter, a process of connecting the center conductor 21 of the terminal processing cable array 1 to the substrate electrode 41 provided on the printed wiring board 4 will be described based on FIGS.

  In FIG. 5B, the center conductor 21 is aligned so that the pitch of the central conductor 21 corresponds to the pitch of the substrate electrode 41, and the pressure heating tool 5 is disposed immediately above. The pressure heating tool 5 can apply a load to the center conductor 21 by moving up and down. Furthermore, heat can be generated by applying an electric current to the pressure heating tool 5.

  In FIG.5 (c), the pressurization heating tool 5 is lowered | hung so that the center conductor 21 and the thermosetting resin 12 may be pressurized, and the pressurization heating tool 5 is electrically heated.

  Specifically, the tool 11 was heated to 250 ° C. while applying a load 2N to the center conductor 21 and the thermosetting resin 12 by the pressure heating tool 5, and the state was maintained for 10 seconds.

  When a pressure is applied to the center conductor 21 and the thermosetting resin 12 while applying a load while heating the pressure heating tool 5, the thermosetting resin 12 is cured after the viscosity is temporarily reduced at the same time as the temperature rises. When the viscosity of the thermosetting resin 12 decreases, the center conductor 21 physically comes into contact with the substrate electrode 41 by the load of the pressure heating tool 5, and the position is fixed by the curing of the thermosetting resin 12.

  At this time, in order to supplement the connectivity between the center conductor 21 and the substrate electrode 41, conductor particles may be dispersed in the thermosetting resin 12 in advance.

  The center conductor 21 may be preliminarily coated with molten solder before being molded into the thermosetting resin 12. For example, when the dispersed conductor particles are solder balls and the molten solder is preliminarily applied to the central conductor 21, the solder particles and the conductor are preliminarily applied simultaneously with the temperature rise of the pressure heating tool 5. The solder is melted and bonded, and at the same time, the molten solder adheres to the surface of the substrate electrode 41 and bonding is possible.

  As described above, the center conductor 21 is connected to the substrate electrode 41 as shown in FIG.

(2) Method of Connecting the External Conductor of the Terminal Processing Cable Array to the Printed Wiring Board FIG. 6 shows the connection of the external conductor of the terminal processing cable array according to the embodiment of the present invention to the ground electrode provided on the printed wiring board. The process is shown.

  FIG. 6A shows a conceptual diagram of a connection process according to the present embodiment. The conceptual diagram of the connection process according to the present embodiment shown in FIG. 6A differs from FIG. 5A only in the arrangement position of the pressure heating tool 5, and therefore, the description of common parts is omitted.

  In the present embodiment, the pressure heating tool 5 is disposed on the upper portion of the outer conductor 23 that constitutes the terminal processing cable array 1.

  Hereinafter, a process of connecting the external conductor 23 of the terminal processing cable array 1 to the ground electrode 42 provided on the printed wiring board 4 will be described with reference to FIGS.

  In FIG. 6B, the outer conductor 23 is aligned with the ground electrode 42, and the pressure heating tool 5 is disposed immediately above the outer conductor 23. The pressure heating tool 5 can apply a load to the outer conductor 23 by moving up and down. Furthermore, heat can be generated by applying an electric current to the pressure heating tool 5.

  In FIG.6 (c), the pressurization heating tool 5 was lowered | hung so that the external conductor 23 and the thermosetting resin 12 might be pressurized, and the pressurization heating tool 5 was electrically heated.

  Specifically, the pressure heating tool 5 was heated to 250 ° C. while applying a load 2N to the outer conductor 23 and the thermosetting resin 12 by the pressure heating tool 5, and the state was maintained for 10 seconds.

  When a pressure is applied to the outer conductor 23 and the thermosetting resin 12 while applying a load while heating the pressure heating tool 5, the thermosetting resin 12 is cured after the viscosity is temporarily reduced at the same time as the temperature rises. The outer conductor 23 physically contacts the ground electrode 42 when the viscosity of the thermosetting resin 12 decreases, and the position is fixed by the curing of the thermosetting resin 12.

  As described above, the external conductor 23 is connected to the ground electrode 42 as shown in FIG.

  5 and 6, the center conductor 21 and the outer conductor 23 of the terminal processing cable array 1 are electrically connected to the substrate electrode 41 and the ground electrode 42 provided on the printed wiring board 4.

(3) Method of simultaneously connecting center conductor and outer conductor of terminal-processed cable array to printed wiring board FIG. 7 differs from FIGS. 5 and 6 in that the center conductor and outer conductor of the terminal-processed cable array according to the present embodiment are connected. It is a construction method at the time of connecting to a printed wiring board simultaneously.

  FIG. 7A shows a conceptual diagram of a connection process according to the present embodiment. The conceptual diagram of the connection process according to the present embodiment shown in FIG. 7A is different from FIG. 5A only in the configuration of the pressurizing / heating tool 5a.

  In the present embodiment, as shown in FIG. 7B, the pressurizing / heating tool 5a has a diameter of the center conductor 21 and the outer conductor 23 in order to appropriately pressurize the center conductor 21 and the outer conductor 23, respectively. In consideration of the difference, a step is provided so as to be appropriate for each height.

  The pressurizing / heating tool 5 a shown in FIG. 7B includes a stepped portion 51, a central conductor pressing portion 52, and an outer conductor pressing portion 53. The outer conductor pressing portion 53 is formed 0.1 mm higher than the center conductor pressing portion 52 through the step portion 51 in order to press the outer conductor 23 properly while pressing the center conductor 21.

  The outer conductor pressing portion 53 does not collapse the insulator 22 inside the outer conductor 23 by pressing at the stepped portion 51, so that the outer conductor pressing portion 53 is an insulator that forms a micro coaxial cable with respect to the central conductor pressing portion 52. It is desirable to provide at a level difference equal to or greater than the thickness (a value obtained by subtracting the central conductor from the insulator diameter). If the step is too large, the outer conductor 23 cannot be pressurized properly, and the maximum value of the step is made equal to the outer diameter of the outer conductor.

  Specifically, in this embodiment, since the insulator outer diameter is 0.11 mm and the center conductor outer diameter is 0.048 mm, the step between the center conductor pressing portion 52 and the outer conductor pressing portion 53 is 0.062 mm or more, 0.11 mm or less.

  FIG. 7C is a cross-sectional view showing the process of connecting the center conductor 21 and the outer conductor 23 of the terminal processing cable array 1.

  The state in which the center conductor 21 and the outer conductor 23 are properly aligned with the substrate electrode 41 and the ground electrode 42 is the same as that shown in FIGS.

  The center conductor 21 and the outer conductor 23 are aligned with the substrate electrode 41 and the ground electrode 42, and the pressure heating tool 5a is disposed immediately above.

  The pressure heating tool 5a can apply a load to the center conductor 21 and the outer conductor 23 by moving up and down. Furthermore, heat can be generated by applying an electric current to the pressure heating tool 5a.

  At this time, the pressurizing / heating tool 5a appropriately pressurizes each of the center conductor 21 and the outer conductor 23 by the center conductor pressing portion 52 and the outer conductor pressing portion 53 formed through the step portion 51. Will be. In this way, the connection between the center conductor 21 and the outer conductor 23 is simultaneously performed in one process.

  The embodiment of the present invention has been described so far by taking the ultrafine coaxial cable 2 as an example. However, the embodiment of the present invention is not limited to this, and the present invention can also be applied to a normal single conductor cable.

  DESCRIPTION OF SYMBOLS 1 ... Terminal processing cable array, 2 ... Micro coaxial cable, 3 ... Resin molding jig, 4 ... Printed wiring board, 5 ... Pressure heating tool, 11 ... Polyimide sheet, 12 ... Thermosetting resin, 21 ... Center conductor, 22 DESCRIPTION OF SYMBOLS ... Insulator, 23 ... Outer conductor, 24 ... Jacket, 31 ... Recessed part, 32 ... Oblique wall, 41 ... Substrate electrode, 42 ... Ground electrode, 51 ... Step part, 52 ... Center conductor pressing part, 53 ... Outer conductor pressing part .

Claims (6)

Multiple cables,
A terminal processing cable array comprising a terminal holding material composed of a molded thermosetting resin that is not thermoset,
The cables are arranged at specific pitch intervals with the terminals aligned,
The conductor constituting the cable on the terminal side is exposed,
The terminal-processed cable array, wherein the exposed conductor is fixed at the specific pitch interval by the terminal holding material.   The terminal processing cable array according to claim 1, wherein conductive particles are dispersed in the terminal holding material.   The cable is a micro coaxial cable including a central conductor, an insulator formed around the central conductor, an outer conductor disposed around the insulator, and a jacket covering the outer conductor. The terminal-processed cable array according to claim 1 or 2, wherein:   4. The terminal according to claim 3, wherein a center conductor, an insulator, and an outer conductor are exposed in order from the end side of the micro coaxial cable, and each exposed length is 0.2 mm or more and 5.0 mm or less. Processed cable array. A method of connecting a terminal processing cable array according to any one of claims 1 to 4 and a printed wiring board,
A plurality of substrate electrodes are arranged on the printed wiring board,
The conductors are arranged at the same pitch as the pitch at which the substrate electrodes are arranged,
The terminal processing cable array is disposed on the printed wiring board so that the conductor faces the substrate electrode,
The terminal holding material is heated while being pressurized,
When the thermosetting resin constituting the terminal holding material has a reduced viscosity due to an increase in temperature, the conductor is brought into contact with the substrate electrode by the pressurization,
A method of connecting a terminal processing cable array and a printed wiring board, wherein the conductor is fixed in contact with the substrate electrode by curing a thermosetting resin. A method of connecting the terminal processing cable array according to claim 3 or 4 and the printed wiring board,
A plurality of substrate electrodes are arranged on the printed wiring board,
The central conductor is arranged at the same pitch as the pitch at which the substrate electrodes are arranged,
The terminal processing cable array is arranged on the printed wiring board so that the central conductor faces the substrate electrode,
By means of the pressure heating tool with a step provided with a step which is not less than the thickness of the insulator, which is a value obtained by subtracting the diameter of the central conductor from the diameter of the insulator of the micro coaxial cable, and having a step which is not more than the diameter of the outer conductor. The position of the holding material facing the central conductor and the outer conductor is heated while being pressurized,
When the viscosity of the thermosetting resin constituting the terminal holding material is reduced due to an increase in temperature, the center conductor and the outer conductor are brought into contact with the substrate electrode by the pressurization,
A method of connecting a terminal processing cable array and a printed wiring board, wherein the center conductor and the outer conductor are fixed in contact with the substrate electrode by curing a thermosetting resin.

Images