JP2003084566A - Electrostatic conveyance device - Google Patents

Electrostatic conveyance device

Info

Publication number
JP2003084566A
JP2003084566A JP2001277022A JP2001277022A JP2003084566A JP 2003084566 A JP2003084566 A JP 2003084566A JP 2001277022 A JP2001277022 A JP 2001277022A JP 2001277022 A JP2001277022 A JP 2001277022A JP 2003084566 A JP2003084566 A JP 2003084566A
Authority
JP
Japan
Prior art keywords
electrode group
array
group
particles
electrostatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001277022A
Other languages
Japanese (ja)
Inventor
Nobuaki Kondo
信昭 近藤
Yoichiro Miyaguchi
耀一郎 宮口
Takeshi Takemoto
武 竹本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP2001277022A priority Critical patent/JP2003084566A/en
Publication of JP2003084566A publication Critical patent/JP2003084566A/en
Pending legal-status Critical Current

Links

Landscapes

  • Dry Development In Electrophotography (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an electrostatic conveyance device capable of classifying powders or grains into grades and separating positively charge powders or gains and negatively charged powders or gains and, moreover, capable of selecting desired powders or grains while performing classification and conveyance of the powders or grains and capable of conveying them. SOLUTION: In an electrostatic conveyance device conveying powders or grains by electrostatic force, since a first conveyance electrode group 2 is formed on the surface of the substrate 1, an array-type groove group 3 is formed by being made to have angles with respect to the first conveyance electrode group 2 on the electrode group 2 and a second conveyance electrode group 4 is formed on top surfaces of the array-type groove group 3, this device can convey selected powders or grains while selecting them by dropping powders of grains whose sizes are smaller than the pattern width of the groove group 3 and whose electrification quantities are small and whose conveyance flying are small into gaps of grooves while conveying them by the second conveyance electrode group 4.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、粉体または粒子を
静電力で搬送する静電搬送装置に係り、トナー、強誘電
体粉末やアルミナ粒、帯電粉体等の粉体または粒子を、
静電分離・分級させ、搬送する静電搬送装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrostatic transport device for transporting powder or particles by electrostatic force, and it is possible to transfer powder or particles such as toner, ferroelectric powder, alumina particles, and charged powder,
The present invention relates to an electrostatic transport device that performs electrostatic separation / classification and transport.

【0002】[0002]

【従来の技術】粉体または粒子を静電力で搬送する静電
搬送技術が知られており、例えば、「IS&TsNIP
16:2000Int、Conf,On Digit、Print、Tech p740〜
742、p736〜739」に静電搬送の基本技術が一部発表さ
れている。また、この静電搬送技術は画像形成装置の現
像装置等に応用されており、例えば現像装置におけるト
ナーの搬送、現像等に利用されている(特公平5−31
147号公報、特開昭59−181374号公報、特開
昭59−181375号公報、特開昭59−18136
9号公報、特開昭59−181371号公報、特許第2
836537号公報、特開昭63−13059号公報等
参照)。
2. Description of the Related Art Electrostatic transfer technology for transferring powder or particles by electrostatic force is known, for example, "IS &TsNIP".
16: 2000Int, Conf, On Digit, Print, Tech p740-
742, p736-739 ”, some of the basic technologies for electrostatic transport have been announced. Further, this electrostatic carrying technique is applied to a developing device of an image forming apparatus, and is used, for example, for carrying and developing toner in the developing device (Japanese Patent Publication No. 5-31).
147, JP-A-59-181374, JP-A-59-181375, JP-A-59-18136.
No. 9, Japanese Patent Laid-Open No. 59-181371, Japanese Patent No. 2
836537, JP-A-63-13059, etc.).

【0003】[0003]

【発明が解決しようとする課題】粉体、粒子、粒体、フ
レークなどの粉の集合体は、その大きさに分布を持って
いる。また、正・負に帯電しているものがある。本発明
はこれらの粉体または粒子を分級させ、正・負の帯電粉
体または粒子を分別させることができ、さらには、トナ
ー等の粉体または粒子の分級と搬送を行い、所望の粉
体、粒子を選定し搬送することのできる静電搬送装置を
提供することを目的とする。
The aggregate of powder such as powder, particles, granules and flakes has a distribution in size. There are also positively and negatively charged ones. The present invention can classify these powders or particles to classify positively and negatively charged powders or particles, and further classify and convey powders or particles such as toner to obtain a desired powder. An object of the present invention is to provide an electrostatic transfer device capable of selecting and transferring particles.

【0004】[0004]

【課題を解決するための手段】上記目的を達成するた
め、請求項1に係る発明は、粉体または粒子を静電力で
搬送する静電搬送装置において、基板表面に第1層搬送
電極群を形成し、この第1層搬送電極群の上に、アレイ
状の溝群を第1層搬送電極群に角度を持たせて形成し、
このアレイ状溝群のトップ面に第2の搬送電極群を形成
したことを特徴とするものである。すなわち、請求項1
の静電搬送装置においては、基板表面に第1層搬送電極
群を形成し、この第1層搬送電極群の上に、アレイ状の
溝群を第1層搬送電極群に角度を持たせて形成し、この
アレイ状の溝群のトップ面に第2の搬送電極群を形成し
たので、第2の搬送電極群で粉体または粒子を搬送させ
ながら溝群のパターン幅より小さい粉体または粒子や、
帯電量が小さいもので搬送飛翔が小さい粉体または粒子
を、溝間に落下させ、粉体または粒子の選別を行いなが
ら搬送を行うことが可能になる。また、溝に落下した粉
体または粒子は、第1と第2の電極群が角度を30°か
ら90°もっており、搬送方向が異なるので、分離が可
能である。
In order to achieve the above object, the invention according to claim 1 is an electrostatic carrying device for carrying powder or particles by electrostatic force, wherein a first layer carrying electrode group is provided on a substrate surface. And forming an array-shaped groove group on the first-layer transport electrode group with the first-layer transport electrode group having an angle,
A second transport electrode group is formed on the top surface of this array of groove groups. That is, claim 1
In the electrostatic transport device, the first layer transport electrode group is formed on the surface of the substrate, and the array-shaped groove group is formed on the first layer transport electrode group so that the first layer transport electrode group has an angle. Since the second carrier electrode group was formed on the top surface of the array-shaped groove group, the powder or particles smaller than the pattern width of the groove group while carrying the powder or particles by the second carrier electrode group. Or
It is possible to drop powders or particles having a small charge amount and a small amount of transportation flight between the grooves, and carry them while sorting the powders or particles. Further, the powder or particles dropped in the groove can be separated because the first and second electrode groups have an angle of 30 ° to 90 ° and the conveying directions are different.

【0005】請求項2に係る発明は、粉体または粒子を
静電力で搬送する静電搬送装置において、基板表面に第
1層搬送電極群を形成し、この第1層搬送電極群の上
に、アレイ状の溝群を第1層搬送電極群に角度を持たせ
て形成し、このアレイ状溝群のトップ面に第2の搬送電
極群を形成し、これを複数層形成したことを特徴とする
ものである。すなわち、請求項2の静電搬送装置におい
ては、基板表面に第1層搬送電極群を形成し、この第1
層搬送電極群の上に、アレイ状の溝群を第1層搬送電極
群に角度を持たせて形成し、このアレイ状溝群のトップ
面に第2の搬送電極群を形成し、これを複数層形成した
ので、請求項1と同様に、粉体または粒子の選別・分離
を行いながら搬送を行うことが可能である。また、粒径
が大きく分布した粉体または粒子を分離・分級させるこ
とが可能であり、多層の分だけ多くの種類の粉体または
粒子を分離・分級することができる。
According to a second aspect of the present invention, in an electrostatic carrying device for carrying powder or particles by electrostatic force, a first layer carrying electrode group is formed on the surface of a substrate, and the first layer carrying electrode group is formed on the first layer carrying electrode group. An array-shaped groove group is formed with an angle to the first-layer carrier electrode group, a second carrier electrode group is formed on the top surface of the array-shaped groove group, and a plurality of layers are formed. It is what That is, in the electrostatic transport device according to the second aspect, the first-layer transport electrode group is formed on the surface of the substrate, and the first transport electrode group is formed.
An array-shaped groove group is formed on the layer-carried electrode group with the first layer-carried electrode group having an angle, and a second carrier electrode group is formed on the top surface of this array-shaped groove group. Since a plurality of layers are formed, the powder or particles can be conveyed while being selected and separated, as in the first aspect. Further, it is possible to separate and classify powders or particles having a large particle size distribution, and it is possible to separate and classify many kinds of powders or particles corresponding to multiple layers.

【0006】請求項3に係る発明は、粉体または粒子を
静電力で搬送する静電搬送装置において、基板表面に第
1層搬送電極群を形成し、この第1層搬送電極群の上
に、アレイ状の溝群を第1層搬送電極群に角度を持たせ
て形成し、このアレイ状溝群のトップ面に第2の搬送電
極群を形成し、且つ、前記アレイ状溝群を形成する際
に、溝の側面、底部に搬送粒子の1/3以下の凹凸部を
形成し、粒子との接触を接点とすることを特徴とするも
のである。すなわち、請求項3の静電搬送装置において
は、基板表面に第1層搬送電極群を形成し、この第1層
搬送電極群の上に、アレイ状の溝群を第1層搬送電極群
に角度を持たせて形成し、このアレイ状溝群のトップ面
に第2の搬送電極群を形成し、且つ、前記アレイ状溝群
を形成する際に、溝の側面、底部に搬送粒子の1/3以
下の凹凸部を形成し、粒子との接触を接点とするので、
請求項1と同様に、粉体または粒子の選別・分離を行い
ながら搬送を行うことが可能である。また、粉体または
粒子と基板間には、通常クーロン力や鏡像力が発生し、
その力は20〜300nN(N:ニュートン)である
が、溝の側面、底部に搬送粒子の1/3以下の凹凸部を
形成し、粒子との接触を接点として、溝との付着点を最
小にすることで、接点の大部分が空気を介在し、その力
は非常に小さくなり5〜30nN程度となるので、静電
搬送時の電界がKVオーダーでなく、10V〜200V
程度で可能となる。
According to a third aspect of the invention, in an electrostatic carrying device for carrying powder or particles by electrostatic force, a first layer carrying electrode group is formed on the surface of a substrate, and the first layer carrying electrode group is formed on the first layer carrying electrode group. An array-shaped groove group is formed at an angle to the first-layer carrier electrode group, a second carrier electrode group is formed on the top surface of the array-shaped groove group, and the array-shaped groove group is formed. In this case, unevenness of 1/3 or less of the carrier particles is formed on the side surface and the bottom of the groove, and the contact with the particles is used as a contact point. That is, in the electrostatic carrying device according to claim 3, a first layer carrying electrode group is formed on the surface of the substrate, and an array of groove groups are provided on the first layer carrying electrode group as the first layer carrying electrode group. The second carrier electrode group is formed on the top surface of the array-shaped groove group at an angle, and when the array-shaped groove group is formed, 1 of carrier particles is formed on the side surface and the bottom of the groove. Since the uneven portion of / 3 or less is formed and the contact with the particles is used as the contact point,
Similar to the first aspect, it is possible to carry the powder or particles while selecting and separating them. In addition, Coulomb force or image force is usually generated between the powder or particles and the substrate,
The force is 20 to 300 nN (N: Newton), but unevenness of 1/3 or less of the carrier particles is formed on the side and bottom of the groove, and the contact point with the particle is used as a contact point to minimize the point of attachment to the groove. By doing so, most of the contacts interpose air, and the force thereof becomes very small, about 5 to 30 nN, so the electric field during electrostatic transfer is not in the KV order, but 10 V to 200 V.
It will be possible to some extent.

【0007】請求項4に係る発明は、粉体または粒子を
静電力で搬送する静電搬送装置において、基板表面に第
1層搬送電極群を形成し、この第1層搬送電極群の上
に、アレイ状の溝群を第1層搬送電極群に角度を持たせ
て形成し、このアレイ状溝群のトップ面に第2の搬送電
極群を形成し、且つ、前記アレイ状溝群は溝形成がオー
バーハング(逆テーパ)であることを特徴とするもので
ある。すなわち、請求項4の静電搬送装置においては、
基板表面に第1層搬送電極群を形成し、この第1層搬送
電極群の上に、アレイ状の溝群を第1層搬送電極群に角
度を持たせて形成し、このアレイ状溝群のトップ面に第
2の搬送電極群を形成したものであるので、請求項1と
同様に、粉体または粒子の選別・分離を行いながら搬送
を行うことが可能であり、さらに、前記アレイ状溝群は
溝形成がオーバーハング(逆テーパ)であるので、多層
の搬送電極群構成にした場合にも、各溝から落下した粉
体または粒子は、溝形成が逆テーパーであることによ
り、溝内で詰まりが発生せず、良好な静電搬送と分離・
分級を行うことができる。
According to a fourth aspect of the present invention, in an electrostatic carrying device for carrying powder or particles by electrostatic force, a first layer carrying electrode group is formed on a substrate surface, and the first layer carrying electrode group is formed on the first layer carrying electrode group. An array-shaped groove group is formed with an angle to the first-layer carrier electrode group, a second carrier electrode group is formed on the top surface of this array-shaped groove group, and the array-shaped groove group is a groove. It is characterized in that the formation is an overhang (inverse taper). That is, in the electrostatic carrier device according to claim 4,
A first-layer transport electrode group is formed on the substrate surface, and an array-shaped groove group is formed on the first-layer transport electrode group with the first-layer transport electrode group having an angle. Since the second transport electrode group is formed on the top surface of the, the transport can be performed while the powder or particles are selected and separated as in the case of claim 1, and further, the array shape can be used. Since the groove group has an overhang (reverse taper) in the groove formation, even when a multi-layered transport electrode group configuration is used, the powder or particles falling from each groove will have a reverse taper in the groove formation. No clogging inside, good electrostatic transfer and separation
Classification can be performed.

【0008】[0008]

【発明の実施の形態】以下、本発明の構成、動作および
作用を、図示の実施例に基づいて詳細に説明する。
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the configuration, operation and operation of the present invention will be described in detail with reference to the illustrated embodiments.

【0009】(実施例1)図1は請求項1に係る発明の
一実施例を示す図であって、静電搬送装置の概略構成お
よび作製プロセスを示す図である。この静電搬送装置
は、基板1の表面に第1層搬送電極群2を形成し、この
第1層搬送電極群2の上に、アレイ状の溝群3を第1層
搬送電極群2に角度を持たせて形成し、このアレイ状溝
群3のトップ面に第2の搬送電極群4を形成したもので
あり、第2層搬送電極群4で粉体または粒子を搬送させ
ながら溝群のパターン幅より小さい粉体または粒子や、
帯電量が小さいもので搬送飛翔が小さい粉体または粒子
を溝間に落下させ、粉体または粒子の選別を行いなが
ら、粉体または粒子を静電力で搬送することを可能にし
たものである。また、溝に落下した粉体または粒子は、
第1層搬送電極群2と第2層搬送電極群とが角度を30
°から90°もっており搬送方向が異なるので、分離が
可能である。尚、静電搬送装置としては、第1、第2の
搬送電極群2,4に3〜6相の位相の駆動回路が接続さ
れ、第1、第2の搬送電極群2,4の各電極への印加電
圧の極性および大きさが制御されるが、これらの図示は
省略する。
(Embodiment 1) FIG. 1 is a view showing an embodiment of the invention according to claim 1, and is a view showing a schematic structure and a manufacturing process of an electrostatic carrying device. In this electrostatic transport device, a first layer transport electrode group 2 is formed on the surface of a substrate 1, and an array of groove groups 3 are formed on the first layer transport electrode group 2 in the first layer transport electrode group 2. The second transport electrode group 4 is formed on the top surface of the array-shaped groove group 3 at an angle, and the groove group is formed while the powder or particles are transported by the second-layer transport electrode group 4. Powder or particles smaller than the pattern width of
It is possible to convey powder or particles by electrostatic force while dropping powder or particles having a small charge amount and small conveyance flight between the grooves to select the powder or particles. Also, the powder or particles that have fallen into the groove,
The first layer transport electrode group 2 and the second layer transport electrode group form an angle of 30.
Since it is from 90 ° to 90 ° and the conveying direction is different, separation is possible. As the electrostatic transport device, a drive circuit having a phase of 3 to 6 phases is connected to the first and second transport electrode groups 2 and 4, and each electrode of the first and second transport electrode groups 2 and 4 is connected. Although the polarity and magnitude of the voltage applied to the device are controlled, these are not shown.

【0010】次に図1に示す静電搬送装置の作成プロセ
スを説明する。まず、基板1として、ガラス、セラミッ
クス等の硬質材からなる平面基板を用意し、この平面基
板1の上に厚さが0.1〜2.0μmの金属膜からなる
第1層搬送電極群2を形成する。この第1層搬送電極群
2の形成方法としては、電極群のパターンを形成したマ
スクを用いて蒸着やスパッタリング、印刷等で基板1上
に電極群2を形成する方法、あるいは基板1上に金属膜
を形成してからフォトリソグラフィー法等により金属膜
をパターンエッチングして電極群2を形成する方法等が
ある。
Next, a process of manufacturing the electrostatic carrying device shown in FIG. 1 will be described. First, as the substrate 1, a flat substrate made of a hard material such as glass or ceramics is prepared, and a first layer carrying electrode group 2 made of a metal film having a thickness of 0.1 to 2.0 μm is provided on the flat substrate 1. To form. As the method of forming the first layer carrying electrode group 2, a method of forming the electrode group 2 on the substrate 1 by vapor deposition, sputtering, printing or the like using a mask on which a pattern of the electrode group is formed, or a metal on the substrate 1 is used. There is a method of forming the electrode group 2 by pattern-etching the metal film by a photolithography method or the like after forming the film.

【0011】次に第1層搬送電極群2の上に、搬送する
粉体または粒子の粒径の1〜10倍の厚さの有機材料
(例えばドライフィルム、レジスト、ポリイミド、アラ
ミド等)からなるアレイ状の溝群3を第1層搬送電極群
2に角度を持たせて形成する(図1(a),(b))。
アレイ状の溝群3の形成方法としては、基板1の第1層
搬送電極群2の上に、搬送粒径の1〜10倍の厚さの有
機材料からなる層を蒸着やスパッタリング等で形成した
後、溝群のパターンを有するマスクを用いてエッチング
等により形成する方法、あるいは、搬送粒径の1〜10
倍の厚さの有機材料のフィルムを用い、ホトリソ法や打
ち抜き加工等により溝群3を形成した後、基板1の第1
層搬送電極群2の上に接着する方法等がある。アレイ状
溝群3の各溝3bの幅は搬送する粉体または粒子の粒径
の1〜5倍であり、深さは粒径の1〜10倍である。
Next, an organic material (for example, dry film, resist, polyimide, aramid, etc.) having a thickness of 1 to 10 times the particle diameter of the powder or particles to be conveyed is formed on the first layer conveying electrode group 2. The array-shaped groove group 3 is formed with an angle to the first-layer transport electrode group 2 (FIGS. 1A and 1B).
As the method of forming the array-shaped groove group 3, a layer made of an organic material having a thickness of 1 to 10 times the carrier particle diameter is formed on the first layer carrier electrode group 2 of the substrate 1 by vapor deposition, sputtering or the like. After that, a method of forming by etching or the like using a mask having a groove group pattern, or a carrier particle size of 1 to 10
After forming the groove group 3 by a photolithography method or a punching process using an organic material film having a double thickness,
There is a method of adhering onto the layer transfer electrode group 2. The width of each groove 3b of the arrayed groove group 3 is 1 to 5 times the particle diameter of the powder or particles to be conveyed, and the depth is 1 to 10 times the particle diameter.

【0012】次に、アレイ状溝群3のトップ面に、厚さ
が0.1〜2.0μmの金属膜からなる第2の搬送電極
群4を形成する(図1(b))。この第2の搬送電極群
4の形成方法としては、マスクを用いて蒸着やスパッタ
リング等でアレイ状溝群3のトップ面に電極群2を形成
する方法等がある。
Next, a second carrier electrode group 4 made of a metal film having a thickness of 0.1 to 2.0 μm is formed on the top surface of the array-shaped groove group 3 (FIG. 1 (b)). As a method of forming the second transport electrode group 4, there is a method of forming the electrode group 2 on the top surface of the array-shaped groove group 3 by vapor deposition or sputtering using a mask.

【0013】次に、溝下の底部や第2の搬送電極群4の
上に、厚さが0.1〜2.0μmの無機材料(例えばS
iO,TiN等)からなる絶縁保護膜(保護層)3
a,5を形成する(図1(b),(c))。尚、アレイ
状溝群3の溝3bの底部の保護膜3aは、アレイ状溝群
3を形成する有機材料の一部で形成してもよい。
Next, an inorganic material (for example, S having a thickness of 0.1 to 2.0 μm) is formed on the bottom of the groove and the second carrier electrode group 4.
Insulating protective film (protective layer) 3 made of iO 2 , TiN, etc.
a and 5 are formed (FIGS. 1B and 1C). The protective film 3a on the bottom of the groove 3b of the array-shaped groove group 3 may be formed of a part of the organic material forming the array-shaped groove group 3.

【0014】(実施例2)図2は請求項2に係る発明の
一実施例を示す図であって、静電搬送装置の概略構成を
示す要部断面図である。この静電搬送装置は、基板1の
表面に第1層搬送電極群2を形成し、この第1層搬送電
極群2の上に、アレイ状の溝群3を第1層搬送電極群2
に角度を持たせて形成し、このアレイ状溝群3のトップ
面に第2の搬送電極群4を形成し、これらを複数層形成
したものであり、このように搬送電極群2,4,7,1
0,13とアレイ状の溝群3,6,9,12を複数層形
成させると、粒径が大きく分布した粉体または粒子1
5,16,17,18を分離・分級させることが可能と
なる。また、多層構成とした分だけ多くの種類(粒径)
の粉体または粒子を分離・分級させることができる。
尚、図2の例では、搬送電極群2,7,13と、搬送電
極群4,10が直交(90°の角度をもって交叉)して
いるパターンを示している。また、図2の例では、アレ
イ状溝群3,6,9,12は上層ほど溝幅と深さが大き
くなっており、搬送される粉体または粒子の粒径は上層
ほど大きくなっている。従って、この例では、4種の粒
径の粉体または粒子の分離・分級を行うことができる。
(Embodiment 2) FIG. 2 is a view showing an embodiment of the invention according to claim 2, and is a cross-sectional view of a main part showing a schematic structure of an electrostatic carrying device. In this electrostatic transport device, a first layer transport electrode group 2 is formed on the surface of a substrate 1, and an array of groove groups 3 are formed on the first layer transport electrode group 2 to form a first layer transport electrode group 2.
Is formed with an angle, the second carrier electrode group 4 is formed on the top surface of the array-shaped groove group 3, and a plurality of layers are formed. Thus, the carrier electrode groups 2, 4, 7, 1
0 or 13 and a plurality of groove groups 3, 6, 9 and 12 in the form of an array are formed, powder or particles 1 having a large particle size distribution
It is possible to separate and classify 5, 16, 17, and 18. In addition, there are many types (particle size) due to the multilayer structure.
The powder or particles can be separated and classified.
Note that the example of FIG. 2 shows a pattern in which the transport electrode groups 2, 7, 13 and the transport electrode groups 4, 10 are orthogonal (intersecting at an angle of 90 °). Further, in the example of FIG. 2, the groove width and depth of the array-shaped groove groups 3, 6, 9, 12 are larger in the upper layer, and the particle size of the powder or particles to be conveyed is larger in the upper layer. . Therefore, in this example, it is possible to perform separation / classification of powder or particles having four particle sizes.

【0015】次に図2に示す静電搬送装置の作成プロセ
スを説明する。基板1上に第1層搬送電極群2、アレイ
状の溝群3、第2の搬送電極群4、絶縁保護膜5を形成
する工程は実施例1で述べた作成プロセス(図1)と同
様である。絶縁保護膜5の上には、有機材料からなる第
2のアレイ状溝群6を形成し、この第2のアレイ状溝群
6の上に金属膜からなる第3の搬送電極群7を形成し、
さらにその上に無機材料からなる絶縁保護膜8を形成す
る。そして、この絶縁保護膜8の上には、有機材料から
なる第3のアレイ状溝群9を形成し、この第3のアレイ
状溝群9の上に金属膜からなる第4の搬送電極群10を
形成し、さらにその上に無機材料からなる絶縁保護膜1
1を形成する。そして、この絶縁保護膜11の上には、
有機材料からなる第4のアレイ状溝群12を形成し、こ
の第4のアレイ状溝群12の上に金属膜からなる第5の
搬送電極群13を形成し、さらにその上に無機材料から
なる絶縁保護膜14を形成する。このようにして、多層
構成の静電搬送装置を作成することができる。
Next, a process of manufacturing the electrostatic carrying device shown in FIG. 2 will be described. The steps of forming the first-layer transport electrode group 2, the array-shaped groove group 3, the second transport electrode group 4, and the insulating protective film 5 on the substrate 1 are the same as those in the manufacturing process (FIG. 1) described in the first embodiment. Is. A second array-shaped groove group 6 made of an organic material is formed on the insulating protective film 5, and a third transport electrode group 7 made of a metal film is formed on the second array-shaped groove group 6. Then
Further, an insulating protective film 8 made of an inorganic material is formed on it. Then, a third array-shaped groove group 9 made of an organic material is formed on the insulating protective film 8, and a fourth transport electrode group made of a metal film is formed on the third array-shaped groove group 9. 10 is formed, and an insulating protective film 1 made of an inorganic material is further formed thereon.
1 is formed. Then, on the insulating protective film 11,
A fourth array-shaped groove group 12 made of an organic material is formed, a fifth transport electrode group 13 made of a metal film is formed on the fourth array-shaped groove group 12, and an inorganic material is further formed thereon. The insulating protection film 14 is formed. In this way, it is possible to create a multi-layered electrostatic transport device.

【0016】(実施例3)図3は請求項3に係る発明の
一実施例を示す図であって、静電搬送装置の概略構成を
示す要部断面図である。この静電搬送装置は、基板1の
表面に第1層搬送電極群2を形成し、この第1層搬送電
極群2の上に、アレイ状の溝群3を第1層搬送電極群2
に角度を持たせて形成し、このアレイ状溝群3のトップ
面に第2の搬送電極群4を形成し、その第2の搬送電極
群4の上に絶縁保護膜5を形成し、さらに絶縁保護膜5
の上には、第2のアレイ状溝群6を形成し、この第2の
アレイ状溝群6の上に第3の搬送電極群7を形成し、さ
らにその上に絶縁保護膜8を形成したものであり、且
つ、前記アレイ状溝群3,6を形成する際に、溝の側
面、底部に搬送粒子の1/3以下の凹凸部19を形成
し、粉体または粒子との接触を接点としたものである。
(Embodiment 3) FIG. 3 is a view showing an embodiment of the invention according to claim 3, and is a cross-sectional view of a main part showing a schematic structure of an electrostatic carrying device. In this electrostatic transport device, a first layer transport electrode group 2 is formed on the surface of a substrate 1, and an array of groove groups 3 are formed on the first layer transport electrode group 2 to form a first layer transport electrode group 2.
At an angle, a second carrier electrode group 4 is formed on the top surface of the array-shaped groove group 3, and an insulating protective film 5 is formed on the second carrier electrode group 4. Insulation protection film 5
A second array-shaped groove group 6 is formed on the above, a third carrier electrode group 7 is formed on the second array-shaped groove group 6, and an insulating protective film 8 is further formed thereon. In addition, when forming the array-shaped groove groups 3 and 6, the concave and convex portions 19 of 1/3 or less of the carrier particles are formed on the side surfaces and the bottom portions of the grooves to prevent contact with powder or particles. It is a contact point.

【0017】本実施例の構成は、アレイ状溝群と電極群
を2層構成としたものであり、実施例1,2と同様に、
粉体または粒子の選別・分離を行いながら搬送を行うこ
とができる。また、粉体または粒子と基板間には、通常
クーロン力や鏡像力が発生し、その力は20〜300n
N(N:ニュートン)であるが、溝の側面、底部に搬送
粒子の1/3以下の凹凸部19を形成し、粒子との接触
を接点として、溝との付着点を最小にすることで、接点
の大部分が空気を介在し、その力は非常に小さくなり5
〜30nN程度となるので、静電搬送時の電界がKVオ
ーダーでなく、10V〜200V程度で可能となる。
The structure of this embodiment is a two-layer structure of an array-shaped groove group and an electrode group, and like the first and second embodiments,
The powder or particles can be conveyed while being sorted and separated. Coulomb force or image force is usually generated between the powder or particles and the substrate, and the force is 20 to 300 n.
N (N: Newton), but by forming the uneven portion 19 of 1/3 or less of the carrier particles on the side surface and the bottom portion of the groove, the contact point with the particle is used as a contact point, and the adhesion point with the groove is minimized. , The majority of the contacts have air, and the force becomes very small.
Since it is about 30 nN, the electric field at the time of electrostatic transfer is not on the KV order, but can be about 10 V to 200 V.

【0018】図3に示す静電搬送装置の作成プロセスは
実施例1,2と略同様であるが、本実施例では、各溝群
3,6の溝の側面、底部に搬送粒子の1/3以下の凹凸
部19を形成する。アレイ状の溝群3,6の作成方法と
しては、前述したように有機材料からなるフィルムにホ
トリソ法や打ち抜き加工により溝群を形成したものを作
成し、これを第1層搬送電極群2や第2の搬送電極4の
上に直接または保護膜を介して接着する。これによりア
レイ状溝群3,6が形成できるが、このままでは溝の底
部や側面はシャープな滑らかな面である。そこで、溝の
底部や側面に、ドライエッチング法により、アルゴン
(Ar)やヘリウム(He)等の物理エッチングを施す
ことで、凹凸部19を形成する。また、有機材料からな
るフィルム中に微粒子を混在させることでも凹凸部19
を形成することができる。
The process for producing the electrostatic transport device shown in FIG. 3 is substantially the same as that of the first and second embodiments, but in this embodiment, 1 / th of carrier particles are provided on the side and bottom of each groove group 3, 6. The uneven portion 19 of 3 or less is formed. As a method for forming the array-shaped groove groups 3 and 6, as described above, a film made of an organic material is used to form groove groups by a photolithography method or a punching process, and the first layer carrying electrode group 2 or The second transport electrode 4 is adhered directly or through a protective film. As a result, the array-shaped groove groups 3 and 6 can be formed, but the bottoms and side surfaces of the grooves are sharp and smooth as they are. Therefore, the concave-convex portion 19 is formed by performing physical etching with argon (Ar), helium (He), or the like on the bottom and side surfaces of the groove by a dry etching method. Further, by mixing fine particles in a film made of an organic material, the uneven portion 19 can be formed.
Can be formed.

【0019】(実施例4)図4は請求項4に係る発明の
一実施例を示す図であって、静電搬送装置の概略構成を
示す要部断面図である。この静電搬送装置は、基板21
の表面に第1層搬送電極群22を形成し、この第1層搬
送電極群22の上に、アレイ状の溝群24を第1層搬送
電極群22に角度を持たせて形成し、このアレイ状溝群
24のトップ面に第2の搬送電極群25を形成し、溝部
低部と第2の搬送電極群25の上に絶縁保護膜23,2
6を形成したものであり、且つ、前記アレイ状溝群24
は溝形成がオーバーハング(逆テーパ)となっている。
(Embodiment 4) FIG. 4 is a view showing an embodiment of the invention according to claim 4, and is a cross-sectional view of the main part showing the schematic construction of an electrostatic carrying device. This electrostatic transport device is a substrate 21
The first layer transport electrode group 22 is formed on the surface of the first layer transport electrode group 22, and the array-shaped groove group 24 is formed on the first layer transport electrode group 22 at an angle to the first layer transport electrode group 22. The second carrier electrode group 25 is formed on the top surface of the array-shaped groove group 24, and the insulating protective films 23, 2 are formed on the lower part of the groove and the second carrier electrode group 25.
6 is formed, and the array-like groove group 24 is formed.
The groove has an overhang (reverse taper).

【0020】本実施例の静電搬送装置においては、実施
例1と同様に、粉体または粒子の選別・分離を行いなが
ら搬送を行うことができるが、アレイ状溝群24は溝形
成がオーバーハング(逆テーパ)であるので、多層の搬
送電極群構成にした場合にも、各溝から落下した粉体ま
たは粒子は、溝形成が逆テーパーであることにより、溝
内で詰まりが発生せず、良好な静電搬送と分離・分級を
行うことができる。すなわち、溝群24の各溝24aが
逆テーパー形状であることにより、溝24aの開口部か
ら溝内に落下した粉体または粒子28の粒径よりも溝幅
が大きいので、溝内の粉体または粒子28は詰まること
なく搬送される。
In the electrostatic carrying device of the present embodiment, as in the first embodiment, the carrying can be carried out while selecting or separating the powder or particles, but the arrayed groove group 24 is over-grooved. Since it is a hang (reverse taper), even when a multi-layered transport electrode group configuration is used, the powder or particles that have fallen from each groove do not become clogged in the groove because the groove formation is a reverse taper. Good electrostatic transfer and separation / classification can be performed. That is, since each groove 24a of the groove group 24 has an inverse taper shape, the groove width is larger than the particle diameter of the powder or particles 28 dropped into the groove from the opening of the groove 24a. Alternatively, the particles 28 are transported without clogging.

【0021】図4に示す静電搬送装置の第1層搬送電極
群22、アレイ状の溝群24、第2の搬送電極群25、
絶縁保護膜23,26の作成プロセスは実施例1と同様
であるが、本実施例では、アレイ状溝群24の溝形成を
オーバーハング(逆テーパ)に形成したものである。溝
群24の各溝24aにオーバーハング(逆テーパ)を形
成させる方法としては、例えば湿式のオーバーエッチン
グによる方法がある。また、ドライエッチングで行う場
合は、2〜0.5Torrの高圧状態でエッチングすると、
等方性エッチングとなり、サイドエッチが進んで逆テー
パー状の溝24aとなる。
A first layer carrying electrode group 22, an array of groove groups 24, a second carrying electrode group 25 of the electrostatic carrying device shown in FIG.
The process of forming the insulating protection films 23 and 26 is the same as that of the first embodiment, but in this embodiment, the groove formation of the array-like groove group 24 is formed as an overhang (inverse taper). As a method of forming an overhang (reverse taper) in each groove 24a of the groove group 24, there is a method of wet overetching, for example. When performing dry etching, if etching is performed at a high pressure of 2 to 0.5 Torr,
It becomes isotropic etching, and side etching progresses to form grooves 24a having an inverse taper shape.

【0022】[0022]

【発明の効果】以上説明したように、請求項1の静電搬
送装置においては、基板表面に第1層搬送電極群を形成
し、この第1層搬送電極群の上に、アレイ状の溝群を第
1層搬送電極群に角度を持たせて形成し、このアレイ状
の溝群のトップ面に第2の搬送電極群を形成したので、
第2の搬送電極群で粉体または粒子を搬送させながら溝
群のパターン幅より小さい粉体または粒子や、帯電量が
小さいもので搬送飛翔が小さい粉体または粒子を、溝間
に落下させ、粉体または粒子の選別を行いながら搬送を
行うことができる。また、溝に落下した粉体または粒子
は、第1と第2の電極群が角度を30°から90°もっ
ており、搬送方向が異なるので、分離が可能である。従
って、本発明によれば、粉体または粒子を静電力で搬送
しながら、粒径や帯電量に依存して、粉体または粒子を
分離・分級する静電搬送装置を実現することができる。
As described above, in the electrostatic carrier device according to the first aspect, the first layer carrier electrode group is formed on the surface of the substrate, and the array-shaped grooves are formed on the first layer carrier electrode group. Since the group was formed with an angle to the first layer carrier electrode group, and the second carrier electrode group was formed on the top surface of this array-shaped groove group,
While transporting the powder or particles by the second transport electrode group, the powder or particles smaller than the pattern width of the groove group or the powder or particles having a small charge amount and small transport flight are dropped between the grooves, Conveyance can be performed while selecting powder or particles. Further, the powder or particles dropped in the groove can be separated because the first and second electrode groups have an angle of 30 ° to 90 ° and the conveying directions are different. Therefore, according to the present invention, it is possible to realize an electrostatic carrying device that separates and classifies powder or particles depending on the particle size and the amount of charge while carrying the powder or particles by electrostatic force.

【0023】請求項2の静電搬送装置においては、基板
表面に第1層搬送電極群を形成し、この第1層搬送電極
群の上に、アレイ状の溝群を第1層搬送電極群に角度を
持たせて形成し、このアレイ状溝群のトップ面に第2の
搬送電極群を形成し、これを複数層形成したので、請求
項1と同様に、粉体または粒子の選別・分離を行いなが
ら搬送を行うことができる。また、粒径が大きく分布し
た粉体または粒子を分離・分級させることが可能であ
り、多層の分だけ多くの種類の粉体または粒子を分離・
分級することができる。従って、本発明によれば、粉体
または粒子を静電力で搬送しながら、大きい粒径分布、
帯電分布を持った粉体または粒子を多数に分類・分別す
ることができる静電搬送装置を実現することができる。
In the electrostatic carrying device according to the second aspect, a first layer carrying electrode group is formed on the surface of the substrate, and an array of groove groups are provided on the first layer carrying electrode group. The second carrier electrode group is formed on the top surface of the array-shaped groove group and a plurality of layers are formed. It is possible to carry while carrying out separation. It is also possible to separate and classify powders or particles with a large particle size distribution, and to separate and classify as many types of powders or particles as there are multiple layers.
Can be classified. Therefore, according to the present invention, a large particle size distribution, while conveying powder or particles by electrostatic force,
It is possible to realize an electrostatic carrying device capable of classifying and classifying powder or particles having a charge distribution into a large number.

【0024】請求項3の静電搬送装置においては、基板
表面に第1層搬送電極群を形成し、この第1層搬送電極
群の上に、アレイ状の溝群を第1層搬送電極群に角度を
持たせて形成し、このアレイ状溝群のトップ面に第2の
搬送電極群を形成し、且つ、前記アレイ状溝群を形成す
る際に、溝の側面、底部に搬送粒子の1/3以下の凹凸
部を形成し、粒子との接触を接点とするので、請求項1
と同様に、粉体または粒子の選別・分離を行いながら搬
送を行うことができる。また、溝の側面、底部に搬送粒
子の1/3以下の凹凸部を形成し、粒子との接触を接点
として、溝との付着点を最小にすることで、接点の大部
分が空気を介在し、その力は非常に小さくなり5〜30
nN程度となるので、静電搬送時の電界がKVオーダー
でなく、10V〜200V程度で可能となる。従って、
本発明によれば、粉体または粒子を静電力で搬送しなが
ら、粒径や帯電量に依存して、粉体または粒子を分離・
分級することができ、且つ低電圧駆動が可能な静電搬送
装置を実現することができる。
In the electrostatic carrying device according to the third aspect, a first layer carrying electrode group is formed on the surface of the substrate, and an array of groove groups are provided on the first layer carrying electrode group. At an angle to form a second carrier electrode group on the top surface of the array-shaped groove group, and when the array-shaped groove group is formed, carrier particles are formed on the side surface and the bottom of the groove. Since the uneven portion of 1/3 or less is formed and the contact with the particles is used as the contact point,
Similarly to the above, the powder or the particles can be conveyed while being selected and separated. In addition, by forming irregularities of 1/3 or less of the carrier particles on the side and bottom of the groove and using the contact with the particle as a contact point to minimize the point of attachment to the groove, most of the contact point interposes air. However, the force becomes very small, 5-30
Since it is about nN, the electric field at the time of electrostatic transport can be about 10 V to 200 V instead of the KV order. Therefore,
According to the present invention, powder or particles are conveyed by an electrostatic force, and the powder or particles are separated or separated depending on the particle size or the charge amount.
It is possible to realize an electrostatic transfer device that can perform classification and can be driven at a low voltage.

【0025】請求項4の静電搬送装置においては、基板
表面に第1層搬送電極群を形成し、この第1層搬送電極
群の上に、アレイ状の溝群を第1層搬送電極群に角度を
持たせて形成し、このアレイ状溝群のトップ面に第2の
搬送電極群を形成したものであるので、請求項1と同様
に、粉体または粒子の選別・分離を行いながら搬送を行
うことができ、さらに、前記アレイ状溝群は溝形成がオ
ーバーハング(逆テーパ)であるので、多層の搬送電極
群構成にした場合にも、各溝から落下した粉体または粒
子は、溝形成が逆テーパーであることにより、溝内で詰
まりが発生せず、良好な静電搬送と分離・分級を行うこ
とができる。従って、本発明によれば、粉体または粒子
を静電力で搬送しながら、粒径や帯電量に依存して、粉
体または粒子を分離・分級することができ、且つ溝間搬
送時の詰まりを防止することができる静電搬送装置を実
現することができる。
According to another aspect of the electrostatic transport device of the present invention, a first layer transport electrode group is formed on the surface of the substrate, and an array of groove groups is provided on the first layer transport electrode group. Since the second carrier electrode group is formed on the top surface of this array-shaped groove group, the powder or particles are selected and separated in the same manner as in claim 1. Since it is possible to carry, and the groove formation of the array-like groove group is an overhang (inverse taper), even if a multi-layered transport electrode group configuration is adopted, powder or particles falling from each groove will not Since the groove is formed in the reverse taper, clogging does not occur in the groove, and good electrostatic conveyance and separation / classification can be performed. Therefore, according to the present invention, it is possible to separate and classify powder or particles depending on the particle size and the charge amount while conveying the powder or particles by electrostatic force, and to prevent clogging during conveyance between grooves. It is possible to realize an electrostatic transport device that can prevent the above.

【図面の簡単な説明】[Brief description of drawings]

【図1】請求項1に係る発明の一実施例を示す図であっ
て、静電搬送装置の概略構成および作製プロセスを示す
図である。
FIG. 1 is a diagram showing an embodiment of the invention according to claim 1, and is a diagram showing a schematic configuration and a manufacturing process of an electrostatic carrying device.

【図2】請求項2に係る発明の一実施例を示す図であっ
て、静電搬送装置の概略構成を示す要部断面図である。
FIG. 2 is a diagram showing an embodiment of the invention according to claim 2, and is a cross-sectional view of a main part showing a schematic configuration of an electrostatic transport device.

【図3】請求項3に係る発明の一実施例を示す図であっ
て、静電搬送装置の概略構成を示す要部断面図である。
FIG. 3 is a diagram showing an embodiment of the invention according to claim 3, and is a cross-sectional view of a main part showing a schematic configuration of an electrostatic transport device.

【図4】請求項4に係る発明の一実施例を示す図であっ
て、静電搬送装置の概略構成を示す要部断面図である。
FIG. 4 is a diagram showing an embodiment of the invention according to claim 4, and is a cross-sectional view of a main part showing a schematic configuration of an electrostatic transport device.

【符号の説明】[Explanation of symbols]

1:基板 2:第1層搬送電極群 3:アレイ状溝群 3a:絶縁保護膜(保護層) 3b:溝 4:第2の搬送電極群 5:絶縁保護膜 6:第2のアレイ状溝群 7:第3の搬送電極群 8:絶縁保護膜 9:第3のアレイ状溝群 10:第4の搬送電極群 11:絶縁保護膜 12:第4のアレイ状溝群 13:第5の搬送電極群 14:絶縁保護膜 15,16,17,18,27,28:粉体または粒子 19:凹凸部 21:基板 22:第1層搬送電極群 23:絶縁保護膜(保護層) 24:アレイ状溝群 24a:逆テーパー状の溝 25:第2の搬送電極群 26:絶縁保護膜 1: substrate 2: First layer transport electrode group 3: Array groove group 3a: Insulating protective film (protective layer) 3b: groove 4: Second carrier electrode group 5: Insulation protection film 6: Second array groove group 7: Third carrier electrode group 8: Insulation protection film 9: Third array groove group 10: Fourth carrier electrode group 11: Insulation protection film 12: Fourth array groove group 13: Fifth transport electrode group 14: Insulation protection film 15,16,17,18,27,28: powder or particles 19: uneven portion 21: substrate 22: First-layer transport electrode group 23: Insulating protective film (protective layer) 24: Array groove group 24a: Reverse taper groove 25: Second carrier electrode group 26: Insulation protection film

───────────────────────────────────────────────────── フロントページの続き (72)発明者 竹本 武 東京都大田区中馬込1丁目3番6号・株式 会社リコー内 Fターム(参考) 2H077 AC13 AD07 FA14    ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takemoto Takeshi             1-3-3 Nakamagome, Ota-ku, Tokyo, stock             Company Ricoh F term (reference) 2H077 AC13 AD07 FA14

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】粉体または粒子を静電力で搬送する静電搬
送装置において、 基板表面に第1層搬送電極群を形成し、この第1層搬送
電極群の上に、アレイ状の溝群を第1層搬送電極群に角
度を持たせて形成し、このアレイ状溝群のトップ面に第
2の搬送電極群を形成したことを特徴とする静電搬送装
置。
1. An electrostatic carrying device for carrying powder or particles by electrostatic force, wherein a first layer carrying electrode group is formed on a substrate surface, and an array of groove groups is formed on the first layer carrying electrode group. Is formed with an angle formed on the first-layer transport electrode group, and the second transport electrode group is formed on the top surface of the array-shaped groove group.
【請求項2】粉体または粒子を静電力で搬送する静電搬
送装置において、 基板表面に第1層搬送電極群を形成し、この第1層搬送
電極群の上に、アレイ状の溝群を第1層搬送電極群に角
度を持たせて形成し、このアレイ状溝群のトップ面に第
2の搬送電極群を形成し、これを複数層形成したことを
特徴とする静電搬送装置。
2. An electrostatic carrying device for carrying powders or particles by electrostatic force, wherein a first layer carrying electrode group is formed on a substrate surface, and an array of groove groups is formed on the first layer carrying electrode group. Is formed with an angle formed on the first-layer transport electrode group, the second transport electrode group is formed on the top surface of the array-shaped groove group, and a plurality of layers are formed. .
【請求項3】粉体または粒子を静電力で搬送する静電搬
送装置において、 基板表面に第1層搬送電極群を形成し、この第1層搬送
電極群の上に、アレイ状の溝群を第1層搬送電極群に角
度を持たせて形成し、このアレイ状溝群のトップ面に第
2の搬送電極群を形成し、且つ、前記アレイ状溝群を形
成する際に、溝の側面、底部に搬送粒子の1/3以下の
凹凸部を形成し、粒子との接触を接点とすることを特徴
とする静電搬送装置。
3. An electrostatic carrying device for carrying powder or particles by electrostatic force, wherein a first layer carrying electrode group is formed on a substrate surface, and an array of groove groups is formed on the first layer carrying electrode group. Is formed with an angle formed on the first-layer transport electrode group, the second transport electrode group is formed on the top surface of the array-like groove group, and when the array-like groove group is formed, An electrostatic carrying device, characterized in that concave and convex portions of 1/3 or less of the carried particles are formed on the side surface and the bottom, and the contact with the particles is used as a contact point.
【請求項4】粉体または粒子を静電力で搬送する静電搬
送装置において、 基板表面に第1層搬送電極群を形成し、この第1層搬送
電極群の上に、アレイ状の溝群を第1層搬送電極群に角
度を持たせて形成し、このアレイ状溝群のトップ面に第
2の搬送電極群を形成し、且つ、前記アレイ状溝群は溝
形成がオーバーハング(逆テーパ)であることを特徴と
する静電搬送装置。
4. An electrostatic carrying device for carrying powder or particles by electrostatic force, wherein a first layer carrying electrode group is formed on a substrate surface, and an array of groove groups is formed on the first layer carrying electrode group. Are formed with an angle to the first layer transport electrode group, a second transport electrode group is formed on the top surface of this array-shaped groove group, and the array-shaped groove group overhangs (reverse An electrostatic transfer device characterized by being a taper.
JP2001277022A 2001-09-12 2001-09-12 Electrostatic conveyance device Pending JP2003084566A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001277022A JP2003084566A (en) 2001-09-12 2001-09-12 Electrostatic conveyance device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001277022A JP2003084566A (en) 2001-09-12 2001-09-12 Electrostatic conveyance device

Publications (1)

Publication Number Publication Date
JP2003084566A true JP2003084566A (en) 2003-03-19

Family

ID=19101629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001277022A Pending JP2003084566A (en) 2001-09-12 2001-09-12 Electrostatic conveyance device

Country Status (1)

Country Link
JP (1) JP2003084566A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7270925B2 (en) 2003-10-08 2007-09-18 Seiko Epson Corporation Image carrier and developing device incorporated in image forming apparatus
JP2009115872A (en) * 2007-11-02 2009-05-28 Ricoh Co Ltd Development device and image forming apparatus
WO2011052378A1 (en) * 2009-10-30 2011-05-05 東海ゴム工業株式会社 Developing member for electrophotography device and method for producing said developing member
JP2016104470A (en) * 2014-12-01 2016-06-09 大日本印刷株式会社 Particle separation method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7270925B2 (en) 2003-10-08 2007-09-18 Seiko Epson Corporation Image carrier and developing device incorporated in image forming apparatus
JP2009115872A (en) * 2007-11-02 2009-05-28 Ricoh Co Ltd Development device and image forming apparatus
US7920812B2 (en) * 2007-11-02 2011-04-05 Ricoh Company, Ltd. Development device and image forming apparatus that uses this device
WO2011052378A1 (en) * 2009-10-30 2011-05-05 東海ゴム工業株式会社 Developing member for electrophotography device and method for producing said developing member
JP5290428B2 (en) * 2009-10-30 2013-09-18 東海ゴム工業株式会社 Developing member for electrophotographic apparatus and method for producing the same
JP2016104470A (en) * 2014-12-01 2016-06-09 大日本印刷株式会社 Particle separation method

Similar Documents

Publication Publication Date Title
US8066967B2 (en) System and method for the manipulation, classification sorting, purification, placement, and alignment of nano fibers using electrostatic forces and electrographic techniques
US6592671B2 (en) Apparatus for clamping a planar substrate
US7332361B2 (en) Xerographic micro-assembler
US8661661B2 (en) Process for the production of a circuit portion on a substrate
KR930008537A (en) Printing system and potential recording method by this system
CN104067379A (en) Method of fabricating a micro device transfer head
JP2003084566A (en) Electrostatic conveyance device
JP4008821B2 (en) Fabrication of patterned surface of coated abrasive
US4247390A (en) Method of separating vermiculite from the associated gangue
JP2003197561A (en) Method for dicing semiconductor wafer
JP2003509995A (en) Bead or particle manipulation chuck
JPH1121677A (en) Method and equipment for film formation and forming of superfine grain
US5340617A (en) Electrostatic patterning of multi-layer module lamina
US6358763B1 (en) Methods of forming a mask pattern and methods of forming a field emitter tip mask
EP0745236B1 (en) Field effect toning method/apparatus
US3017982A (en) Method and apparatus for handling charged particles
JP4307753B2 (en) Electrostatic transfer device, developing device, and image forming apparatus
RU2360741C2 (en) Device and method for particles separation
JP2919063B2 (en) Manufacturing method of printed wiring board
JP7047317B2 (en) Manufacturing method and manufacturing equipment for hierarchical structure
JP3017415B2 (en) Compact electronic component sorting device
JP3418116B2 (en) Powder transfer device
JP2740061B2 (en) Manufacturing method of printed wiring board
US10877425B2 (en) Fluid application devices with resistive coatings
US20020167579A1 (en) Thin film printhead with layered dielectric