JP2003077998A - Substrate carrying container - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate carrying container capable of preventing contamination of electronic substrates stored in the substrate carrying container and cleanly maintain the inside of the container. SOLUTION: In the substrate carrying container 1 provided with a container body 11 having an opening part 12 for carrying in and out the electronic substrates W and a cover body 21 sealing the opening part 12, at least an inner face 11a of the container body 11 and at least one of faces 21a opposite to the container body 11 in a cover body 21 are covered with a film 41 having gas barrier property.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer container, and more particularly to a hermetically sealed substrate transfer container used to transfer electronic substrates such as semiconductor wafers and liquid crystal substrates.

[0002]

2. Description of the Related Art The manufacture of electronic equipment using electronic substrates such as semiconductor wafers, liquid crystal substrates and magnetic disks is carried out in a clean room free from dust. On the other hand, when the electronic substrate is transferred between the process processing apparatuses, the electronic substrate held in the cassette is stored in a portable and sealable local cleaning container (that is, a substrate transfer container). As a result, the electronic substrate can be transported inside and outside the clean room without exposing the electronic substrate to dust in the atmosphere. Such a substrate transport container is a SMIF (Standard Mechanical Interf
ace) Pod product name (Assist Technology)
It is commercially available at.

The inside of this SMIF pod is hermetically sealed to the extent that dust in the atmosphere can be prevented, but low molecular weight compounds such as oxygen, water, and volatile organic substances easily penetrate into the interior.
For this reason, the low-molecular substances that have entered during transportation contaminate the electronic substrate housed inside, for example, a natural oxide film grows on the surface of the semiconductor wafer, or molecular adsorption contamination of organic matter, boron, phosphorus, etc. occurs. . In state-of-the-art devices, such contamination can be a major factor affecting device characteristics.

Therefore, a flange is provided at the periphery of the opening of the container body, and an O-ring provided at the periphery of the lid is brought into close contact with this flange to enhance the airtightness inside the substrate transport container and prevent the intrusion of low-molecular substances. A restrained substrate transport container is disclosed in Japanese Patent Laid-Open No. 10-56060.
When an electronic substrate requiring a high degree of cleanliness, such as a semiconductor wafer, is transferred, the inside of the substrate transfer container in which the substrate is stored does not contain argon (Ar), nitrogen gas (N ₂ ) or the like. Replace with an active gas (hereinafter referred to as an inert gas). At this time, the atmosphere inside the container is replaced with an inert gas every time the lid is opened and closed, which causes the adsorption of molecules of organic substances, boron, phosphorus, etc. on the electronic substrate and the natural oxide film on the surface of the electronic substrate. To prevent the formation of.

[0005]

However, the substrate carrying container having the above-mentioned structure is made of a resin material such as polycarbonate. Since polycarbonate is a gas permeable material, the inert gas substituted inside the container permeates the container body and is gradually released, maintaining the inside of the container in a high-concentration inert gas atmosphere for a long period of time. There was a problem that I could not. Further, since polycarbonate is also a material having high hygroscopicity, it absorbs moisture in the atmosphere, and moisture is gradually leached from the inner surface of the substrate transport container into the container over time. In addition, atmospheric oxygen (O ₂ )
Since it also permeates polycarbonate, it is impossible to keep the water concentration and the O ₂ concentration inside the sealed container low for a long period of time, and a natural oxide film tends to be formed on the surface of the electronic substrate housed in the container. It was

Further, when a substrate carrying container is molded using a resin material such as polycarbonate, organic additives such as stabilizers, antioxidants and plasticizers are generally added. There is a problem that the system additive is volatilized and released, and the surface of the electronic substrate housed in the container is contaminated by adsorption of volatile organic substances. Also, when the board transport container is opened / closed and volatile organic substances enter the inside of the container easily, the volatile organic substances are easily adsorbed on the inner surface of the container. Also, there is a problem that volatile organic substances are re-emitted into the container and contaminate the electronic substrate.

[0007] It is difficult for an electronic device manufactured using the electronic substrate housed in the substrate transfer container as described above to maintain quality such as electrical characteristics, and the yield tends to deteriorate.

The present invention has been made in order to solve the above problems, and it is possible to maintain the inside of a container in a clean state and prevent contamination of electronic substrates housed in the container even during long-term storage. It is intended to provide a possible substrate transport container.

[0009]

In order to achieve the above-mentioned object, a substrate transfer container according to claim 1 of the present invention is a container body having an opening for loading and unloading a substrate, and an opening. In a substrate transfer container including a lid for sealing a part, at least one of an inner surface of the container body and a surface of the lid facing the container body is covered with a film having a gas barrier property.

In such a substrate transfer container, the inner surface of the container body and the surface of the lid body facing the container body are covered with a film having a gas barrier property, so that the release of gas from the inside of the container is prevented. At the same time, the gas outside the container and the gas contained in the container body and lid are prevented from entering the container. For this reason,
The inside atmosphere of the container can be maintained for a long period of time. Therefore, it is possible to prevent the substrates housed inside the container from being contaminated by the gas that has entered from the outside of the container.

For example, when an electronic substrate is stored in a substrate transfer container and the inside of the container is replaced with an inert gas,
The inside of the container can be kept in an inert gas atmosphere for a long period of time. Further, since O ₂ and water and volatile organic substances from outside the container and the container body are prevented from entering the container, the supply of O ₂ and water and volatile organic substances to the surface of the stored electronic substrate is suppressed, The formation of a natural oxide film is prevented, and the contamination of organic substances on the surface of the electronic substrate is prevented.

A substrate transfer container according to a third aspect of the present invention is a substrate transfer container including a container body having an opening for loading and unloading a substrate, and a lid for sealing the opening. At least one of the inner surface of the container body and the surface of the lid body facing the container body is covered with a film having a photocatalytic action.

In such a substrate transport container, since the inner surface of the container body and the surface of the lid body facing the container body are covered with a film having a photocatalytic action, volatile organic substances may be contained in the container by opening and closing the container. When it enters the inside and is adsorbed by the film covering the inner surface of the container, the adsorbed organic substance can be decomposed by the photocatalytic action of the compound forming the film. Therefore, it is possible to prevent the substrate housed inside the container from being contaminated by the volatile organic substances that have entered the inside of the container.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a substrate transport container of the present invention will be described in detail below with reference to the drawings. (First Embodiment) FIG. 1 is a view for explaining the structure of a substrate transfer container 1 of this embodiment and a substrate storage method using the same.

The substrate transfer container 1 shown in this figure comprises a container body 11 for accommodating an electronic substrate (for example, a semiconductor wafer) W and a lid 21. The container body 11 and the lid body 21 are formed by molding a resin material such as polycarbonate using a mold.

The container body 11 has a box-like shape with an opening 12 provided on one surface side thereof, and is large enough to accommodate a cassette L holding a plurality of electronic substrates W. Further, the container body 11 has an opening edge 13 formed in a step shape that can be widely expanded outwardly, and the latch groove 3 is formed on the inner surface of the expanded opening edge 13.
1 is provided.

On the other hand, the lid body 21 has a size that can be fitted into the opening edge 13 and is used for latching the container body 11 when the lid body 21 is fitted into the opening edge 13 of the container body 11. A latch 32 fitted into the groove 31 and projecting freely from the side wall of the lid body 21 and a latch operating portion 33 for operating the projection of the latch 32 are provided.

The latch operating portion 33 is provided at the center of the outer surface of the container main body 11 when the lid 21 is fitted to the opening edge 13 of the container body 11. The latch operating portion 33 is rotated in one direction. This allows the latch 32
Is projected and further rotated in the same direction, the latch 3
The tip of 2 is configured to incline toward the surface on which the latch operation portion 33 is provided, and the latch 3 is provided in the latch groove 31.
By inclining 2, the lid body 21 is crimped to the container body 11. Further, from this state, by rotating the latch operating portion 33 in the other direction, the latch 32 is housed in the side wall of the lid body 21, and the pressure-bonded state of the lid body 21 to the container body 11 is released. Has been done.

A packing 22 is provided around the periphery of the lid body 21 and is pressed against the entire circumference of the container body 11 in a state where the container body 11 is closed. There is. The packing 22 is fixed in a packing groove 23 provided on the surface facing the container body 11 at the peripheral edge of the lid 21.

And, in particular, the inner surface 1 of the container body 11
At least one of a surface 21a (hereinafter, referred to as an inner surface 21a) of the lid 1 and the lid 21 facing the container body 11 is covered with a film 41 having a gas barrier property (hereinafter, referred to as a coating film 41). Here, it is preferable that both the inner surfaces 11a and 21a are covered with the coating 41, and it is more preferable that the portion exposed in the container is entirely covered with the coating 41.

Further, the film 41 is smaller than water molecules.
It is preferably formed of a material having a close lattice spacing.
Water molecule is an inert gas N₂Than gas or Ar gas
Since the volume is small, a lattice spacing smaller than that of water molecules
If the coating 41 is formed of the material that has the container 1,
Even when the inside is an inert gas atmosphere, the inner surface 1
Since 1a and 21a are covered with the coating 41,
N from inside the antenna 1 ₂More reliable release of gas and Ar gas
You can really prevent it. Where O₂Molecules are more than water molecules
Is small, the coating 41 is O₂Case smaller than numerator
More preferably, it is formed of a material having a child spacing.
The inner surfaces 11a and 21a should be covered with such a coating 41.
As a result, the container body 11 and the lid 21 can be removed from the atmosphere.
O₂O inside the container 1 even if it contains gas or water₂gas
The permeation of water and water can be suppressed.

The coating 41 in this embodiment is, for example,
It is formed of silicon oxide (SiO ₂ ) having a lattice spacing smaller than that of O ₂ molecules, and is formed by using a film forming method such as plasma CVD. The coating film 41 is not limited to SiO ₂ and may have a gas barrier property. Specifically, inorganic compounds such as silicon nitride (Si ₃ N ₄ ), titanium nitride (TiN) or alloys thereof, or diamond-like carbon (DL)
C) etc. are mentioned. Inorganic compounds and DLC as above
When the coating film 41 is formed by plasma CVD,
The inner surface 11a, 21a is formed by a method such as sputtering or vapor deposition.
A coating film 41 is formed on.

Further, an organic polymer having a low hygroscopic property, such as polyvinylidene chloride, polyvinyl alcohol, ethylene-vinyl alcohol copolymer, acrylonitrile, etc., may be used as a material for forming the coating film 41. When the above-mentioned organic polymer is used, the coating film 41 is formed on the inner surfaces 11a and 21a by a method such as vapor deposition or welding such as melting and coating the organic polymer.

The film thickness of the coating film 41 varies depending on its composition and film forming method, but it is preferably formed in the range of 0.1 μm to 300 μm. If the film thickness is smaller than 0.1 μm, the gas barrier property is deteriorated, and if it is thicker than 300 μm, the film formation time becomes long and the productivity is poor. Further, the film is likely to peel off due to stress, which causes contamination of fine particles.

Next, the structure of the substrate transfer device 2 used when the electronic substrate W is stored in the substrate transfer container 1 having such a configuration will be described.

The substrate transfer device 2 is installed side by side with a process processing device (not shown).
The substrate transport container 1 is provided with an elevator 51 that moves up and down with the lid 21 placed thereon. The elevator 51 has a mounting portion for mounting the substrate transport container 1, and has a projecting portion 53 that can be fitted to the latch operation portion 33 of the lid 21 in the center thereof. This elevator 51 has a lid 21
It is arranged in a housing 52 whose upper surface is opened with a larger diameter.

The housing 52 supports the opening edge 13 of the container body 11 at the upper end of the housing 52 while the substrate transport container 1 is placed on the elevator 51, and the housing 5
The opening on the upper surface of 2 is configured to be closed by the container body 11. Although illustration is omitted here,
It is assumed that the casing 52 is provided with an exhaust pipe and an inert gas introduction pipe and is in communication with an electronic substrate introduction chamber of the process processing apparatus.

Next, a procedure for loading / unloading the electronic substrate W into / from the substrate transport container 1 using the substrate transport device 2 will be described.

First, the electronic substrate W is placed in the substrate transport container 1.
It is assumed that the cassette L in which is stored is placed on the lid 21. When carrying out the electronic substrate W stored in such a substrate transport container 1, the substrate transport container 1 is placed on the elevator 51 of the substrate transport device 2 provided in parallel with the process processing apparatus. Here, the protrusion 5 of the elevator 51
3 and the latch operation part 33 of the lid 21 are fitted and rotated, the latch 32 is removed from the latch groove 31 of the container body 11, and the close contact state between the container body 11 and the lid 21 is released.

Next, the elevator 51 of the substrate transfer device 2 is lowered. As a result, with the container body 11 supported by the upper end of the housing 52, the lid body 21 is lowered into the housing 52 together with the elevator 51, and the container body 11 is moved to the housing 52.
The electronic substrate W stored in the cassette L is unloaded. Then, the electronic substrate W is transferred from the cassette L to the process processing apparatus, and the electronic substrate W is processed.

When the processed electronic substrate W is stored in the substrate transfer container 1, the processed electronic substrate W is placed in the cassette L on the lid 21 placed on the elevator 51.
Is reprinted. At this time, it is assumed that the container body 11 is supported and placed on the upper end of the housing 52 on the housing 52 of the substrate transfer apparatus 2.

Therefore, first, the container body 11 and the housing 5
After the inside of 2 is sufficiently replaced with an inert gas, the electronic substrate W
Also, the elevator 51 on which the lid 21 is placed is raised. As a result, the lid 21 is fitted into the opening edge 13 of the container body 11, the latch operating portion 33 is rotated, and the latch 32 is housed in the latch groove 31 of the lid 21. In this way, the electronic substrate W is stored in the substrate transport container 1.

The substrate transfer container 1 used as described above has the inner surfaces 11a and 21a covered with a SiO ₂ film having a gas barrier property.
It is possible to prevent discharge of gas from the inside and invasion of gas from the outside of the container or gas contained in the container body 11 and the lid 21. In particular, since the SiO ₂ film has a lattice spacing smaller than that of O ₂ molecules, it is possible to prevent the inert gas inside the container 1 that was replaced when the electronic substrate W was stored from being released from the inside of the container, and for a long period of time. It can be maintained at a high concentration.

Further, moisture or O ₂ gas the resin material contained in the polycarbonate constituting the container body 11 and the lid 21, or the even absorbed moisture or O ₂ gas from the atmosphere, inner surface 11a, 21a is Since it is covered with the SiO ₂ film, permeation into the container 1 can be suppressed. Therefore, since the inert gas inside the substrate transport container 1 that has been replaced when the electronic substrate W is stored can be maintained at a high concentration for a long period of time, and an increase in water concentration or O ₂ concentration can be suppressed, so that the container 1 can be stored. It is possible to prevent the formation of a natural oxide film on the surface of the electronic substrate W which is hermetically sealed.

Further, regarding the volatile organic substances contained in the container body 11 and the lid 21 and the volatile organic substances absorbed from the atmosphere, since the inner surfaces 11a and 21a are covered with the SiO ₂ film, the inside of the container 1 is also prevented. Can be suppressed. Here, for example, when an organic additive is added during molding of the container body 11 and the lid 21, volatile organic substances due to the organic additive are released from the container body 11 and the lid 21 with time. However, in this embodiment, since the inner surface of the container is covered with the SiO ₂ film, volatile organic substances are not released inside the container 1. In addition, for example, the container body 11 and the lid 21 are
Even when the volatile organic substances and the like remaining in the mold adhere to the container body 11 and the lid 21, the inner surfaces 11a and 21a of the container 1 are made of SiO ₂
By being covered with the film, it is possible to prevent the release of volatile organic substances into the container 1. Therefore, it is possible to prevent the electronic substrate W stored in the container from being contaminated by volatile organic substances. From the above, the inside of the substrate transport container 1 can be kept clean, and the electronic substrates W stored in the container 1 can be stored even during long-term storage.
It is possible to prevent the pollution against.

FIG. 2 is a graph showing the change over time in the moisture concentration inside the sealed substrate transfer container. here,
Regarding the inner surface of the substrate transfer container containing polycarbonate as the main component of the first embodiment, which is covered with a SiO ₂ film as the coating 41, and the substrate transfer container containing polycarbonate as the main component (without SiO ₂ film), Was replaced with N ₂ gas, the water concentration was reduced to about 10 ppm, and after sealing, the change in water concentration with time was measured. still,
The SiO ₂ film was formed with a film thickness of 1 μm by the high density plasma CVD method.

As shown in this graph, the inner surface is SiO ₂
Compared with the moisture concentration in the substrate transport container which is not covered with a film, the increase in moisture concentration over time in the substrate transport container 1 of the first embodiment is suppressed to a low level, and the permeation of moisture into the substrate transport container 1 is suppressed. It was confirmed to be small.

Further, FIG. 3 is a gas chromatogram obtained by measuring the organic substances adsorbed on the electronic substrates housed in each container using the same two types of substrate transport containers used for measuring the water concentration. It is shown. Each electronic board is housed in the above container, the inside of the container is replaced with N ₂ gas, and the container is hermetically sealed.
The measurement was performed after 00 minutes.

As shown in this graph, the inner surface is SiO ₂
In the gas chromatogram of the substrate transport container not covered with the film, volatile organic substances added to the polycarbonate during molding such as polypyrrole, fatty acid ester, and trimethylpentanediol (TMPD) were detected. On the other hand, in the gas chromatogram of the substrate transport container 1 whose inner surface is covered with the SiO ₂ film in the first embodiment, almost no organic matter is detected, and the container body 11 and the lid 2 are not detected.
It was confirmed that the emission of volatile organic substances from 1 was suppressed.

(Second Embodiment) The substrate transport container 3 of the present embodiment is characterized in that the inner surfaces 11a and 21a of the container 3 are covered with a film 42 having a photocatalytic action (hereinafter referred to as a film 42). Although different from the substrate transport container 1 of the first embodiment, the other configurations are the same, and the description of the same configuration is omitted.

Here, the photocatalytic action means a reaction that occurs when the film 42 is irradiated with light having an energy higher than the band gap of the compound forming the film 42. When the coating 42 is irradiated with such light, the electrons in the valence band of the compound forming the coating 42 are excited to the conduction band in which no electron exists, and as a result, holes are generated in the valence band. Then, the electrons excited by the conductor and the holes generated in the valence body move in the film 42. Electron is the film 42
On the surface of the, other molecules are reduced and the holes oxidize the molecules. As a result, active oxygen is generated from oxygen and water remaining inside the container, and has a strong oxidizing action capable of oxidizing and decomposing the organic matter adsorbed on the film 42.

Substrate transport container 3 in this embodiment
Since the container body 11 and the lid 21 are made of highly transparent polycarbonate, the coating 42
It is not necessary to irradiate the coating 42 with light from the inside of the container 3 in order to induce the photocatalysis of the above, and the above-mentioned photocatalysis can be generated by the irradiation of light from the outside of the container 3.

In this embodiment, it is assumed that the coating 42 is made of titanium oxide, which is a compound having a photocatalytic action. Titanium oxide is highly versatile because it has strong catalytic activity and can be produced at low cost. As the titanium oxide, TiO ₂ or one having another composition is used.
The coating film 42 is not limited to TiO ₂ , and any material conventionally known as a photocatalyst can be used. Above all, a material usually used as a semiconductor is effective and has good processability. It is also preferable because it is easily available.

Specifically, Se, Ge, Si, Ti, Z
n, Cu, Al, Sn, Ga, In, P, As, Sb,
C, Cd, S, Te, Ni, Fe, Co, Ag, Mo,
Any of Sr, W, Cr, Ba, and Pb, or a compound, alloy, or oxide thereof is preferable, and these are used alone.
Alternatively, two or more kinds may be used in combination. For example, the element is Si, Ge, Se, and the compound is Al.
P, AlAs, GaP, AlSb, GaAs, InP,
GaSb, InAs, InSb, CdS, CdSe, Z
nS, MoS ₂ , WTe ₂ , Cr ₂ Te ₃ , MoTe, Cu
₂ S, WS ₂ , oxides such as TiO ₂ , Ba ₂ O ₃ , C
uO, Cu ₂ O, ZnO, MoO ₃ , InO ₃ , Ag ₂ O,
PbO, SrTiO ₃ , BaTiO ₃ , Co ₃ O ₄ , Fe ₂
Examples include O ₃ and NiO.

Here, the film thickness of the coating film 42 varies depending on the composition and the film forming method, but it is not less than a film thickness sufficient to absorb light, and electrons and holes generated in the coating film 42 are on the surface of the coating film 42. It is preferable that the film is formed in a range of the film thickness or less so that it can be diffused to the extent that the catalytic activity is not lowered.

[0046] According to the substrate transfer container 3 configured as described above, when the volatile organics are mixed by opening and closing of the container 3 also, by irradiating a band gap than the light of the TiO _2, the TiO ₂ film The adsorbed volatile organic substances are oxidatively decomposed by the photocatalytic action of TiO ₂ . Therefore, it is possible to prevent the electronic substrate W stored in the container 3 from being contaminated by volatile organic substances. Further, as a mixing path of the volatile organic matter, when the organic film is applied to the electronic substrate W housed in the substrate transport container 3, the volatile organic matter generated from the organic film is the inner surfaces 11a and 21a of the container 3. It may adhere to. Even in such a case, the coating film 42 that covers the inner surfaces 11a and 21a
Since the volatile organic substances can be decomposed by the photocatalytic action of the compound that forms the compound, it is possible to prevent the clean electronic substrate W that is newly stored from being contaminated. Therefore, the inside of the container 3 can be kept clean, and the electronic substrate W can be prevented from being contaminated even during long-term storage.

As described above, in the first and second embodiments, the substrate transfer container having the opening 21 on the bottom surface side of the container body 11 and having the lid 21 has been described. However, the present invention is not limited to such an embodiment and, for example, as shown in FIG. 4, has an opening 15 for inserting and removing the electronic substrate W in the side surface of the container body 14, A substrate transfer container having a lateral lid 24 for sealing the opening 15, wherein the inner surface of the container is covered with a coating 41 similar to that of the first embodiment, or the second embodiment. Substrate transport container 5 covered with a coating 42 similar to the configuration
Can also be used in, and the same effect can be obtained.

Further, although the substrate transfer container in the first and second embodiments is a sealing mechanism only by the latch, the pressure between the O-rings is reduced via the two O-rings arranged around the lid 21. The present invention can also be applied to a substrate transfer container or the like that is hermetically closed by applying a vacuum.

Although the substrate transfer container has been described in the embodiments of the present invention, the present invention is not limited to the substrate transfer container, and a stocker for storing electronic substrates or a transfer system in a process processing apparatus. It can be applied to the inner surface treatment of all electronic board manufacturing facilities used for transfer, transportation, and storage of electronic boards such as covers.

[0050]

As described above, according to the first aspect of the present invention.
According to the substrate transfer container described, at least one of the inner surface of the container body and the surface of the lid body facing the container body is covered with a film having a gas barrier property, so that the release of gas from the inside of the container is prevented. In addition, the gas outside the container and the gas contained in the resin material forming the container body and lid are prevented from entering the inside of the container. Therefore, for example, when the inside of the container is replaced with an inert gas, the inside of the container can be kept in an inert gas atmosphere for a long period of time. Furthermore, since it is possible to prevent the intrusion of O ₂ , water, and volatile organic substances from outside the container and the container body, the supply of O ₂ , water and volatile organic substances to the surface of the stored electronic substrate is suppressed, and natural oxidation is performed. The formation of a film is prevented, and the contamination of organic substances on the substrate surface is prevented. Therefore, the inside of the container can be maintained in a clean state, and the electronic substrates housed in the container can be prevented from being contaminated even during long-term storage.

According to the third aspect of the present invention, there is provided a substrate transfer container, wherein at least one of the inner surface of the container body and the surface of the lid body facing the container body is covered with a film having a photocatalytic action. From the above, when the volatile organic substance enters the inside of the container due to opening and closing of the container and is adsorbed on the film having the photocatalytic action formed on the inner surface of the container, the photocatalytic action of the compound forming a film causes
The adsorbed organic matter can be decomposed. For this reason, the inside of the container can be kept clean, and it is possible to prevent the electronic substrates contained in the container from being contaminated even during long-term storage.

As described above, the substrate transfer container of the present invention can maintain the inside of the container in a clean state, and can prevent the electronic substrates contained in the container from being contaminated even during long-term storage. is there. Therefore, in an electronic device (for example, a semiconductor device) manufactured by using the electronic substrate hermetically housed inside the substrate transport container of the present invention, it becomes possible to maintain quality such as electrical characteristics and to improve yield. It is possible to improve.

[Brief description of drawings]

FIG. 1 is a configuration diagram illustrating a configuration of a substrate transport container according to a first embodiment and a second embodiment and a substrate storage method using the same.

FIG. 2 is a graph showing the change over time in the water concentration inside the substrate transport container according to the first embodiment.

FIG. 3 is a gas chromatogram showing organic substances adsorbed on an electronic substrate housed in a substrate transport container according to the first embodiment.

FIG. 4 is a configuration diagram illustrating a modified example of the substrate transport container according to the first embodiment and the second embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Substrate carrying container, 11 ... Container main body, 12 ... Opening part, 21 ... Lid body, 41, 42 ... Coating film, W ... Electronic substrate,
11a, 21a ... Inner surface

Continued front page    F-term (reference) 3E067 AA12 AB41 AC04 BA01A                       BB14A BC06A BC07A CA04                       CA30 EA32 FA01 FC01 GA19                       GD01 GD10                 3E096 AA06 BA15 BB03 CA08 CB10                       DA14 EA06Y FA03 GA03                       GA04                 5F031 CA01 CA02 CA05 DA09 DA17                       EA01 EA02 EA12 EA14 FA03                       NA04 NA10 PA23

Claims (4)

[Claims] 1. A substrate transfer container comprising a container body having an opening for loading and unloading a substrate, and a lid for sealing the opening, wherein an inner surface of the container body and the container body in the lid. At least one of the facing surfaces is covered with a film having a gas barrier property. 2. The substrate transfer container according to claim 1, wherein the film having a gas barrier property is made of a material having a lattice spacing smaller than that of water molecules. 3. A substrate transfer container comprising a container body having an opening for loading and unloading a substrate, and a lid for sealing the opening, wherein an inner surface of the container body and the container body in the lid. At least one of the opposing surfaces is covered with a film having a photocatalytic action, which is a substrate transport container. 4. The substrate transport container according to claim 3, wherein the photocatalytic film is titanium oxide.