JP2003075793A - Method and device for manufacturing liquid crystal panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and a device for manufacturing a liquid crystal panel preventing the occurrence of vacuum destruction in the manufacturing process of the liquid crystal panel carrying out panel alignment under reduced pressure. SOLUTION: The pressure inside the panel alignment system is reduced, two sheets of glass substrates are superimposed on each other via an adhesive with a closed curve shape under a reduced pressure state, subsequently the reduced pressure inside the system is released and further the inside of the system is pressurized. Therefore, air bubbles are not generated in the adhesive and destruction of the reduced pressure state in a closed space surrounded by the two sheets of glass substrates and the adhesive due to the crack of the adhesive and return to the atmospheric pressure do not take place. Thus, the liquid crystal panel with desired cell thickness is obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a liquid crystal panel in which two substrates facing each other are bonded to each other in manufacturing a liquid crystal panel, and a liquid crystal panel manufacturing apparatus used for the method.

[0002]

2. Description of the Related Art Conventionally, for example, the following method has been used as a method for bonding two glass substrates forming a liquid crystal panel.

An injection port for injecting liquid crystal by a screen printing method or a drawing method using a dispenser, for example, a thermosetting resin as a sealing material on the surface of one of the two glass substrates, which is the bonding surface. Is applied in the form of an open curve. Further, a closed curved adhesive is applied so as to surround the open curved sealing material. On the other hand, a granular spacing member having a uniform size is scattered over the entire surface of the other glass substrate, which is the bonding surface. Then, after the two glass substrates are carried into the vacuum apparatus, the inside of the apparatus is evacuated to a depressurized state, and under the depressurized state, the two glass substrates are superposed and aligned with each other. At this time, the space surrounded by the two glass substrates and the closed-curve sealing material is in a reduced pressure atmosphere. Then overlaid 2
By placing the two glass substrates under atmospheric pressure, a space surrounded by the two glass substrates and the closed-curve sealing material is created.
Due to the pressure difference between the space in which the two glass substrates are placed, the two glass substrates are pressed against each other to manufacture an assembled panel before the liquid crystal is injected. Then, the assembled panel is heat-treated to cure the sealing material and the adhesive material. Then, the assembled panel is partially cut off to expose the liquid crystal injection port, liquid crystal is injected from the liquid crystal injection port, and the liquid crystal injection port is sealed with a sealing material to manufacture a liquid crystal panel.

[0004]

[Problems to be Solved by the Invention]
In the method of bonding a plurality of glass substrates, the method shown in FIG.
As shown in FIG. 16A, at the time when the adhesive material 318 having a closed curve shape is applied onto the one substrate 311, unevenness is generated on the surface of the adhesive material 318.
If the two substrates 311 and 312 were simply overlapped with each other, bubbles 318a might be generated in the adhesive 318. In this way, when air bubbles are generated in the adhesive, the strength of the adhesive is reduced, and the adhesive is not used until the two substrates are bonded together under reduced pressure and are heated and bonded under atmospheric pressure. In some cases, the adhesive cannot withstand the pressure difference between the pressure in the closed space formed by the two glass substrates and the atmospheric pressure, and the adhesive may crack. When a crack is generated in this way, the closed space formed by the adhesive and the two glass substrates is destroyed under reduced pressure (called vacuum break), and this space returns to atmospheric pressure. There has been a problem that a liquid crystal panel having a cell thickness cannot be obtained.

The object of the present invention has been made in view of the above problems, and manufacture of a liquid crystal panel capable of preventing the occurrence of vacuum breakage in the manufacturing process of a liquid crystal panel in which substrates are bonded together under reduced pressure. An object of the present invention is to provide a method and a liquid crystal panel manufacturing apparatus.

[0006]

In order to solve such a problem, the present invention adopts the following configuration.

According to the method of manufacturing a liquid crystal panel of the present invention, a first substrate on which a closed-curve adhesive material is arranged and a second substrate on the surface on which the adhesive material is arranged are arranged in a processing chamber. A step, a step of decompressing the processing chamber, a step of superimposing the first substrate and the second substrate via the adhesive under a depressurized state, and the first substrate and the second substrate, And a step of applying a pressure larger than the differential pressure between the pressure in the processing chamber and the atmospheric pressure during the superposing step.

According to such a constitution of the present invention, the two glass substrates are bonded together under a reduced pressure, and then the pressure is applied to the two glass substrates so that the adhesive is generated at the time of application. The irregularities on the surface that had been formed are crushed, and the glass substrate is brought into close contact with the glass substrate without generating bubbles. That is, when the adhesive material is applied onto the glass substrate, the surface of the adhesive material has irregularities, so that simply laminating the two glass substrates causes bubbles to be generated in the adhesive material. However, by applying pressure, the irregularities on the surface of the adhesive material are crushed and the adhesive material and the glass substrate can be brought into close contact with each other.
For example, if air bubbles are generated in the adhesive, between bonding under reduced pressure and heating under atmospheric pressure to crimp,
In some cases, the adhesive cannot withstand the pressure difference between the pressure in the closed space formed by the adhesive and the two glass substrates and the atmospheric pressure, and the adhesive may crack. When a crack is generated in this way, the closed space formed by the adhesive and the two glass substrates is destroyed under reduced pressure, the space returns to atmospheric pressure, and a liquid crystal having a desired cell thickness is obtained. I can't get a panel. On the other hand, in the present invention, since no bubbles are generated, the adhesive material and the glass substrate are in close contact with each other, and the depressurized state in the closed space formed by the adhesive material and the two glass substrates is maintained. The adhesive can be cured, and a liquid crystal panel having a uniform cell thickness within the substrate surface can be obtained.

Further, the step of applying the pressure is a step of pressurizing the processing chamber to a pressure higher than atmospheric pressure.

As described above, as a method of applying pressure, the adhesion can be further improved by pressurizing the processing chamber to a pressure higher than atmospheric pressure.

Further, the step of applying the pressure is a step of mechanically applying pressure to the first and second substrates and the second substrate which are superposed under a reduced pressure state.

As described above, as a method of applying pressure, mechanical adhesion of pressure can further enhance the adhesion.

Further, after the step of applying the pressure, there is provided a step of returning the inside of the processing chamber to atmospheric pressure.

According to another method of manufacturing a liquid crystal panel of the present invention, there is provided a first substrate having a first surface and a second surface, and an adhesive material having a closed curve shape disposed on the first surface, and the first surface and the second surface. A method for manufacturing a liquid crystal panel, comprising: bonding a second substrate having two surfaces, the first surface being opposed to the first surface of the first substrate.
A step of arranging the first substrate and the second substrate such that their first surfaces face each other in a second processing chamber that is disposed inside the processing chamber; and the first processing chamber and the second processing chamber. A step of depressurizing, and a space in the first processing chamber and a space in the second processing chamber are shut off by the first substrate and the second substrate under the depressurized state, and the first substrate or the second substrate A step of superimposing the first substrate and the second substrate via the adhesive so that one of the second surfaces is exposed to the inside of the second processing chamber; and the step of superimposing after the superimposing step. The pressure difference between the pressure in the first processing chamber and the pressure in the second processing chamber is determined by the first pressure during the superimposing step.
The pressures in the first processing chamber and the second processing chamber are adjusted so as to be larger than the pressure difference between the processing chamber and the second processing chamber and the atmospheric pressure, and the first substrate and the second substrate are adjusted. And a step of applying a pressure to the.

According to such a constitution of the present invention, the two glass substrates are bonded together under reduced pressure, and then the pressure is applied to the two glass substrates, whereby the adhesive is generated at the time of application. The irregularities on the surface that had been formed are crushed, and the glass substrate is brought into close contact with the glass substrate without generating bubbles. That is, when the adhesive material is applied onto the glass substrate, the surface of the adhesive material has irregularities, so that simply laminating the two glass substrates causes bubbles to be generated in the adhesive material. However, by applying pressure, the irregularities on the surface of the adhesive material are crushed and the adhesive material and the glass substrate can be brought into close contact with each other.
For example, if air bubbles are generated in the adhesive, between bonding under reduced pressure and heating under atmospheric pressure to crimp,
In some cases, the adhesive cannot withstand the pressure difference between the pressure in the closed space formed by the adhesive and the two glass substrates and the atmospheric pressure, and the adhesive may crack. When a crack is generated in this way, the closed space formed by the adhesive and the two glass substrates is destroyed under reduced pressure, the space returns to atmospheric pressure, and a liquid crystal having a desired cell thickness is obtained. I can't get a panel. On the other hand, in the present invention, since no bubbles are generated, the adhesive material and the glass substrate are in close contact with each other, and the depressurized state in the closed space formed by the adhesive material and the two glass substrates is maintained. The adhesive can be cured, and a liquid crystal panel having a uniform cell thickness within the substrate surface can be obtained.

Further, after the step of applying the pressure, there is provided a step of returning the first processing chamber and the second processing chamber to atmospheric pressure.

In the step of applying the pressure and the step of returning to the atmospheric pressure, the first substrate and the second substrate
It is characterized by comprising a step of measuring a gap between the substrate and the substrate by a measuring means and controlling a pressure adjusting means in the processing chamber based on a measurement result by the measuring means.

With such a structure, it is possible to confirm the state of the cell thickness when the first substrate and the second substrate which are superposed on each other are pressed at a pressure higher than the atmospheric pressure. Thereby, while suppressing the generation of bubbles of the adhesive material, so as to have a desired cell thickness when the assembly panel is placed under atmospheric pressure,
The degree of pressure applied to crush the surface of the adhesive material can be adjusted. In addition, the first substrate and the second
The cell thickness can be measured when, for example, an assembled panel having a substrate and an adhesive material interposed therebetween is placed under atmospheric pressure. Thereby, when the measured cell thickness is not a desired value, the depressurized state at the time of superposition of the two glass substrates is adjusted so that the cell thickness becomes the desired cell thickness when placed under atmospheric pressure. . In this way, the cell thickness measurement result is fed back and the depressurized state is adjusted, so that in the substrate bonding step in the next work, an assembled panel having a desired cell thickness can be obtained. Therefore, for example, even if there is a slight change in atmospheric pressure, the pressure-reduced state at the time of bonding can be kept under a preferable state by feedback control, and an assembly panel having the same cell thickness can be stably manufactured.

The measuring means is a spectrophotometer.

As described above, by using a spectrophotometer as the measuring means, accurate measurement can be performed, and the equipment can be downsized.

In addition, the first substrate or the second substrate has an injection port for injecting liquid crystal into a region surrounded by the adhesive when the first substrate and the second substrate are superposed on each other. The first sealing material is arranged.

As described above, when the liquid crystal panel is formed, the inside of the cell is decompressed by arranging the open-curved first sealing material that functions to bond the two substrates together and the closed-cured adhesive that surrounds the first sealing material. Can be in a state.

Further, the adhesive material is characterized by having a first sealing material having an injection port for injecting liquid crystal and a second sealing material closing the injection port.

As described above, a part of the adhesive having a closed curve is
When the liquid crystal panel is used, the first seal material having an open curve shape that functions to bond the two substrates together may be used.

The liquid crystal panel manufacturing apparatus according to the present invention includes a processing chamber in which a first substrate on which an adhesive material having a closed curve shape is arranged and a second substrate which faces the surface on which the adhesive material is arranged are arranged. ,
Decompressing means for decompressing the pressure in the processing chamber, means for superposing the first substrate and the second substrate via the adhesive in the processing chamber decompressed by the decompressing means, and the superposing means A means for exerting a pressure on the first substrate and the second substrate that is greater than the differential pressure between the pressure in the processing chamber and the atmospheric pressure when the first substrate and the second substrate are superposed. Is characterized by.

According to the manufacturing apparatus having such a structure of the present invention, the pressure can be applied to the two glass substrates after the two glass substrates are bonded together under reduced pressure. The surface irregularities generated during application are crushed, and the glass substrate is brought into close contact with the glass substrate without generating bubbles. That is, when the adhesive material is applied onto the glass substrate, the surface of the adhesive material has irregularities, so that simply laminating the two glass substrates causes bubbles to be generated in the adhesive material. However, by applying pressure, the irregularities on the surface of the adhesive material are crushed and the adhesive material and the glass substrate can be brought into close contact with each other. For example, if bubbles are generated in the adhesive, the pressure in the closed space formed by the adhesive and the two glass substrates will be maintained between the bonding under reduced pressure and the heating and pressure bonding under atmospheric pressure. In some cases, the adhesive cannot withstand the pressure difference between the atmospheric pressure and the atmospheric pressure and cracks occur in the adhesive. When a crack is generated in this way, the closed space formed by the adhesive and the two glass substrates is destroyed under reduced pressure, the space returns to atmospheric pressure, and a liquid crystal having a desired cell thickness is obtained. I can't get a panel. On the other hand, in the present invention, since no bubbles are generated,
The adhesive material and the glass substrate are in close contact with each other, and the adhesive material can be cured while maintaining the reduced pressure state in the closed space formed by the adhesive material and the two glass substrates. A liquid crystal panel having a cell thickness can be obtained.

Further, the means for applying the pressure is an inflow means for injecting gas into the processing chamber.

As described above, the inflow means can be used as the means for applying the pressure.

Further, the means for applying the pressure is a pressurizing means for mechanically pressurizing the first substrate and the second substrate which are stacked and are provided in the processing chamber.

As described above, the adhesion can be further enhanced by using the means for mechanically pressing as the means for applying the pressure.

Further, it is characterized by further comprising a measuring means for measuring a gap between the first substrate and the second substrate.

As described above, by providing the measuring means for measuring the gap between the two substrates, the gap between the substrates can be observed during the manufacturing process.

Further, there is further provided control means for adjusting the depressurized state in the processing chamber when the first substrate and the second substrate are superposed on each other, based on the measurement result measured by the measuring means. And

According to this structure, the cell thickness when the assembled panel having the first substrate, the second substrate and the adhesive material interposed therebetween is placed under atmospheric pressure by the measuring means. If the measured cell thickness is not the desired value, control the depressurized state when stacking the two glass substrates so that the desired cell thickness is achieved when placed under atmospheric pressure. Adjusted by means. In this way, the cell thickness measurement result is fed back and the depressurized state is adjusted, so that in the substrate bonding step in the next work, an assembled panel having a desired cell thickness can be obtained. Therefore, for example, even if there is a slight change in atmospheric pressure, the pressure-reduced state at the time of bonding can be kept under a preferable state by feedback control, and an assembly panel having the same cell thickness can be stably manufactured.

Further, the measuring means is a spectrophotometer.

Thus, by using a spectrophotometer as the measuring means, accurate measurement can be performed, and the equipment can be made smaller.

Further, the measuring means applies pressure to the first substrate and the second substrate, which are superposed by the means for applying pressure, until the pressure in the processing chamber returns to atmospheric pressure. It is characterized by working during.

According to such a configuration, it is possible to confirm the state of the cell thickness when the first substrate and the second substrate which are superposed on each other are pressed at a pressure higher than the atmospheric pressure. Thereby, while suppressing the generation of bubbles of the adhesive material, so as to have a desired cell thickness when the assembly panel is placed under atmospheric pressure,
The degree of pressurization for crushing the surface of the adhesive material can be adjusted by the control means.

Another liquid crystal panel manufacturing apparatus of the present invention is
A first substrate having a first surface and a second surface, and an adhesive having a closed curve shape disposed on the first surface; and a first substrate having a first surface and a second surface
What is claimed is: 1. A liquid crystal panel manufacturing apparatus, comprising a first processing chamber and a first processing chamber, the first processing chamber being disposed inside the first processing chamber, and the second substrate having a surface facing the first surface of the first substrate. A second processing chamber in which the first substrate and the second substrate are arranged so that their respective first surfaces face each other; a first pressure reducing means for reducing the pressure in the first processing chamber; and a second processing chamber in the second processing chamber. A second decompression means for decompressing the pressure, a space in the first processing chamber and the second treatment in the first processing chamber and the second processing chamber decompressed by the first decompression means and the second decompression means. The bonding is performed so that the space inside the chamber is blocked by the first substrate and the second substrate, and the second surface of either the first substrate or the second substrate is exposed to the inside of the second processing chamber. The first substrate and the second substrate with a material interposed therebetween And a pressure difference between the pressure in the first processing chamber and the pressure in the second processing chamber, which is higher than the pressure difference between the pressures in the first processing chamber and the second processing chamber at the time of superposition and the atmospheric pressure. And a means for adjusting pressures in the first processing chamber and the second processing chamber so as to increase the pressure.

According to the manufacturing apparatus having such a structure of the present invention, the pressure can be applied to the two glass substrates after the two glass substrates are bonded together under reduced pressure. The surface irregularities generated during application are crushed, and the glass substrate is brought into close contact with the glass substrate without generating bubbles. That is, when the adhesive material is applied onto the glass substrate, the surface of the adhesive material has irregularities, so that simply laminating the two glass substrates causes bubbles to be generated in the adhesive material. However, by applying pressure, the irregularities on the surface of the adhesive material are crushed and the adhesive material and the glass substrate can be brought into close contact with each other. For example, if bubbles are generated in the adhesive, the pressure in the closed space formed by the adhesive and the two glass substrates will be maintained between the bonding under reduced pressure and the heating and pressure bonding under atmospheric pressure. In some cases, the adhesive cannot withstand the pressure difference between the atmospheric pressure and the atmospheric pressure and cracks occur in the adhesive. When a crack is generated in this way, the closed space formed by the adhesive and the two glass substrates is destroyed under reduced pressure, the space returns to atmospheric pressure, and a liquid crystal having a desired cell thickness is obtained. I can't get a panel. On the other hand, in the present invention, since no bubbles are generated,
The adhesive material and the glass substrate are in close contact with each other, and the adhesive material can be cured while maintaining the reduced pressure state in the closed space formed by the adhesive material and the two glass substrates. A liquid crystal panel having a cell thickness can be obtained.

Further, it is characterized by further comprising measuring means for measuring a gap between the first substrate and the second substrate.

As described above, by providing the measuring means for measuring the gap between the two substrates, the gap between the substrates can be observed during the manufacturing process.

Further, control for adjusting the depressurized state in the first processing chamber and the second processing chamber when the first substrate and the second substrate are superposed on the basis of the measurement result measured by the measuring means. Means are further provided.

According to this structure, the cell thickness when the assembled panel having the first substrate, the second substrate, and the adhesive material interposed between them is placed under atmospheric pressure by the measuring means. If the measured cell thickness is not the desired value, control the depressurized state when stacking the two glass substrates so that the desired cell thickness is achieved when placed under atmospheric pressure. Adjusted by means. In this way, the cell thickness measurement result is fed back and the depressurized state is adjusted, so that in the substrate bonding step in the next work, an assembled panel having a desired cell thickness can be obtained. Therefore, for example, even if there is a slight change in atmospheric pressure, the pressure-reduced state at the time of bonding can be kept under a preferable state by feedback control, and an assembly panel having the same cell thickness can be stably manufactured.

The measuring means is a spectrophotometer.

As described above, a spectrophotometer can be used as the measuring means.

Further, the measuring means applies a pressure to the first substrate and the second substrate superposed by the means for applying a pressure, and then the first processing chamber and the second processing chamber. It is characterized in that it operates until the pressure of is returned to the atmospheric pressure.

According to such a configuration, it is possible to confirm the state of the cell thickness when the first substrate and the second substrate which are superposed on each other are pressed at a pressure higher than the atmospheric pressure. Thereby, while suppressing the generation of bubbles of the adhesive material, so as to have a desired cell thickness when the assembly panel is placed under atmospheric pressure,
The degree of pressurization for crushing the surface of the adhesive material can be adjusted by the control means.

[0049]

BEST MODE FOR CARRYING OUT THE INVENTION (First Embodiment) A first embodiment of the present invention will be described below with reference to the drawings.

First, a liquid crystal panel 10 in which a semiconductor chip is mounted on a liquid crystal panel formed through the manufacturing steps described later.
A schematic structure of No. 1 will be described with reference to FIGS.

The liquid crystal panel 101 includes a first glass substrate 141 having a first surface 141a and a second surface 141b, and a first glass substrate 141.
Second glass substrate 1 having surface 142a and second surface 142b
42 are arranged with a predetermined gap so that the first surface 141a of the first glass substrate 141 and the first surface 142a of the second glass substrate 141b face each other. The first glass substrate 141 and the second glass substrate 142 are bonded to each other by the first sealing material 12 and are a region surrounded by the first sealing material 12 and are located between the first glass substrate 141 and the second glass substrate 142. A liquid crystal 144 is enclosed in. The liquid crystal injection port 10 is closed by a sealing material 145.

A transparent electrode 146 and an alignment film 147 are formed on the first surface 141a of the first glass substrate 141, and the transparent electrode 146 extends to the outside of the first sealing material 12 and extends over the substrate overhanging portion 141c. The wiring has been pulled out.
In addition, on the first surface 142a of the second glass substrate 142,
The transparent electrode 148 and the alignment film 149 are formed, and the transparent electrode 148 is formed on the substrate overhanging portion 1 through a vertical conducting portion (not shown).
It is connected to the wiring on 41c.

A semiconductor chip 150 which constitutes a liquid crystal drive circuit is mounted on the first surface 141a of the substrate overhanging portion 141c. The semiconductor chip 150 includes transparent electrodes 146, 1
The wiring on the board overhanging portion 141c that is electrically connected to the switch 48 and the input terminal 151 formed at the end of the board overhanging portion 141c are both electrically connected. Here, depending on the structure of the liquid crystal panel, the flexible wiring board is electrically connected to the input terminal 151, or the first surface 141a of the board overhanging portion 141c is sealed with a sealing material such as a silicone resin. Is done.

Next, the substrate bonding apparatus used in the bonding process of the first glass substrate and the second glass substrate in the above-described liquid crystal panel manufacturing process will be described with reference to FIGS. 1 and 2.

FIG. 1 shows a first substrate to be bonded by a substrate bonding device as a liquid crystal panel manufacturing device described later.
It is a schematic perspective view showing a state before the glass substrate 311 and the second glass substrate 312 are pasted together.
2A and 2B are diagrams for explaining application positions of 2 and an adhesive 318. The pair of first glass substrate 311 and second glass substrate 312 are
First surface 311a, second surface 311b, first surface 3 respectively
12a and the second surface 312b, the first surface 311a and the first surface 312a are arranged so as to face each other, and the first surface 311a and the first surface 312a are opposed to each other by using a substrate bonding apparatus described later.
It is pasted together with a sealing material and an adhesive material. In the present embodiment, for example, the first glass substrate 311 is provided with the first
The seal material 12 and the adhesive material 318 are arranged, and a spacer 314 for holding a gap between the two glass substrates is arranged on the second glass substrate 312. After that, the glass substrate in the portion where the adhesive material 318 is formed is cut off, and liquid crystal is injected between the pair of substrates to form a liquid crystal panel.

FIG. 2 is a schematic diagram of the substrate bonding apparatus 300.

The substrate bonding apparatus 300 includes the first glass substrate 31 on which the first sealing material 12 and the adhesive material 318 are arranged.
1 and the second glass substrate 312 on which the spacers are dispersed, and the processing chamber 103 is disposed inside. Processing room 1
In the inside of 03, an xy stage 301 to which the second glass substrate 312 is fixedly arranged, and a holding plate 302 that adsorbs and holds the first glass substrate 311 are arranged. The xy stage 301 is set to be movable in the xy plane,
At the time of alignment using the CCD camera 101 described later, x
-By moving the y stage 301, the two glass substrates 311 and 312 are aligned. Also, x
The -y stage 301 is set to be movable inside and outside the processing chamber 103 via a loading / unloading port (not shown). On the other hand, the holding plate 302 has a plurality of suction ports 302a, and the second glass substrate 312 can be suction-held by exhausting the air inside the suction ports 302a by an exhaust unit (not shown). The holding plate 302 is set to be movable inside and outside the processing chamber 103 via a loading / unloading port (not shown). Further, the holding plate 302 can be moved up and down, and x
-The second glass substrate 31 arranged on the y stage 301
By stacking the first glass substrate 311 sucked and held by the holding plate 302 on top of the two, it is possible to stack the two glass substrates.

The upper part of the processing chamber 103 is almost the front glass window 1.
No. 02, which faces the processing chamber 103 through the glass window 102 and is used for positioning C of two glass substrates.
Spectrophotometer 14 as a measuring means for measuring the gap between the CD camera 101 and the two glass substrates, that is, the cell thickness.
0 is placed. This spectrophotometer 140 uses xy
It is movable in a plane and 2 along the horizontal plane of the glass substrate.
The cell thickness between the glass substrates can be measured. In the spectrophotometer 140, two glass substrates 311 and 31 are used.
2 is irradiated with light, and the cell thickness is measured based on the reflected light of this light. Further, the substrate bonding apparatus 300 has a control device 130, and in this control device 130, the spectrophotometer 1
Based on the cell thickness information measured at 40, how to adjust the pressure adjusting means described later is calculated, and the information is sent to the pressure adjusting means.

Further, the substrate bonding apparatus 300 is provided with a pressure gauge 120 for measuring the pressure inside the processing chamber 103.

The inside of the processing chamber 103 is set to be depressurizable and pressurizable by a pressure adjusting means. In the present embodiment, the pressure adjusting unit has an exhaust unit and an inflow unit for inflowing gas into the processing chamber 103.

The exhaust means has a rotary pump 119 for exhausting the air in the processing chamber 103, a mechanical booster pump 118, and a vacuuming valve 117 as a first valve interposed between these pumps and the processing chamber 103. ing. As a result, the inside of the processing chamber 103 can be evacuated to reduce the pressure and function as a pressure reducing means.

The inflow means is a mass flow controller 106 for adjusting the flow rate of the gas, which is decompressed by the regulator 132 after the air 110 as the gas has passed through the filter 125.
And a gas valve 105 as a second valve for adjusting the presence / absence of supply of the gas whose flow rate is adjusted into the processing chamber 103. As a result, gas is introduced into the processing chamber 103 and the pressure inside the processing chamber 103 is increased. That is,
By increasing the pressure in the processing chamber 103 by using the inflow means, a pressure larger than the differential pressure between the pressure in the processing chamber 103 and the atmospheric pressure when the first substrate and the second substrate are superposed is It can be adjusted to act on one substrate and a second substrate. Although air is used as the inflowing gas in the present embodiment, inert gases such as nitrogen and argon may be used. For example, these gases are supplied from the factory piping. In particular, when a liquid crystal layer is provided on one of the glass substrates arranged in the processing chamber 103 by, for example, a dropping method, an inert gas such as nitrogen or argon is used to eliminate the influence of oxidation on the liquid crystal. It is desirable to use.

Further, a leak valve 107 is provided as one of the pressure adjusting means. This leak valve 107
When the pressure inside the processing chamber 103 is increased from the atmospheric pressure where the substrate bonding apparatus 300 is arranged, the air inside the processing chamber 103 leaks to the outside of the processing chamber 103 by opening. After being discharged through the valve 107, the inside of the processing chamber 103 can be returned to atmospheric pressure. On the other hand, when the pressure inside the processing chamber 103 is reduced from the atmospheric pressure where the substrate bonding apparatus 300 is arranged, the air 110 outside the processing chamber 103 passes through the filter 125 and the inside of the processing chamber 103. It is introduced through the leak valve 107, and the inside of the processing chamber 103 can be returned to the atmospheric pressure. That is, the leak valve 107 functions as both an exhaust means and an inflow means. Although the gas flowing into the processing chamber 103 via the leak valve 107 is air here,
When a liquid crystal layer is provided on one of the glass substrates arranged in the processing chamber 103 by, for example, a dropping method, an inert gas such as nitrogen or argon is used to eliminate the influence of oxidation on the liquid crystal. Is desirable.

Next, a method of manufacturing the liquid crystal panel of the present invention using the above-mentioned substrate bonding apparatus 300 will be described with reference to FIGS. FIG. 3 is a diagram for explaining a liquid crystal panel manufacturing process, and is a diagram for explaining a state inside the substrate bonding apparatus and a working state of the spectrophotometer at the time of bonding the substrates. FIG. 4 is a diagram for explaining the pressure change in the substrate bonding apparatus during the manufacturing process by the substrate bonding apparatus and the timing of monitoring by the spectrophotometer, the vertical axis is the pressure in the processing chamber, and the horizontal axis is the time. Is shown.

First, the first surface 311a and the second surface 311b.
A first glass substrate 311 having the above, a second glass substrate 312 having a first surface 312a and a second surface 312b are prepared. Next, as shown in FIG. 1, an open curve shape having a liquid crystal injection port 10 for injecting liquid crystal, as shown in FIG. 1, on the first surface 311a serving as a bonding surface of the first glass substrate 311. First sealing material 12 made of a thermosetting resin, and an adhesive 318 made of a thermosetting resin having a closed curve along the peripheral edge of the glass substrate so as to surround the first sealing material 12.
Apply. The size of the first sealing material 12 and the adhesive material 318 is, for example, 1 mm in width and 100 μm in height.
The sealing material 12 is applied in a rectangular area of approximately 180 mm × 280 mm, and the adhesive 318 is applied in a rectangular area of approximately 200 mm × 300 mm. In the first seal material 12 and the adhesive material 318, for example, spherical glass fibers (not shown) having a diameter of 10 μm are dispersed and mixed as a gap maintaining member. In addition, the second glass substrate 312
As a spacer, plastic beads 314 having a diameter of 10 μm, for example, are uniformly applied to the entire surface of the first surface 312a serving as the bonding surface of the. The application of the first sealing material 12 and the adhesive 318 and the spraying of the plastic beads 314 may be performed on different glass substrates as in the present embodiment, or may be performed on the same glass substrate.

Next, the second glass substrate 312 prepared as described above was moved to the outside of the substrate bonding apparatus 300, x-.
The xy stage 3 is fixedly arranged on the y stage 301.
When 01 is moved, it is carried into the substrate bonding apparatus 300. On the other hand, the first glass substrate 311 is sucked and held by the holding plate 302 that has moved to the outside of the substrate bonding apparatus 300 so that the second surface facing the bonding surface contacts the holding plate 302, and the holding plate 302 moves. By doing so, it is carried into the substrate bonding apparatus 300. At this time, the two glass substrates are not overlapped yet and are arranged with a predetermined gap. Further, at this time, the positioning accuracy of the two glass substrates needs to include an alignment mark on the substrates in the visual field of the alignment CCD camera according to the magnification of the alignment CCD camera 1.

Next, after the first glass substrate 311 and the second glass substrate 312 have been carried in, a vacuuming valve 117.
And the rotary pump 119 and the mechanical booster pump 118 adjust the pressure inside the processing chamber 103 to, for example, 0.1.
The chamber is evacuated to 3 kPa and the inside of the processing chamber 103 is depressurized. There is no problem if the pressure at this time is equal to or lower than the pressure difference between the pressure for performing the pressure bonding and the atmospheric pressure.

Next, the gas valve 105 is opened with the vacuuming valve 117 open, and the mass flow controller 106 controls the air flow while measuring with the pressure gauge 120 so that the pressure in the processing chamber 103 becomes 0.6 kgf / cm ² . When the flow rate is adjusted and the pressure becomes stable, the first glass substrate 31
The holding plate 302 that holds 1 is sucked down, and the two glass substrates are stacked with the first sealing material 12 and the adhesive 318 interposed therebetween. Here, the pressure was between 0.6 kgf / cm ² is because we wanted to crimp pressure and 0.4 kgf / cm ^2, in order to adjust so that the differential pressure between the atmospheric pressure and the pressure pressure. In the present embodiment, since the pressure bonding of the two glass substrates is performed under the atmospheric pressure, the pressure adjusted at this time, that is, the pressure difference between the atmospheric pressure and the pressure bonding has a great influence on the cell thickness of the cell after pressure bonding. Exert.

Thereafter, while observing the alignment mark photographed by the CCD camera 1 through the glass window 102 while maintaining the pressure at the time of superimposition, x
-Y The stage 301, the holding plate 302, or both are moved to align the relative positions of the two glass substrates.

After the alignment is completed, the vacuuming valve 1
17 and the gas valve 105 are closed, and then the leak valve 107 is opened to release the decompression in the processing chamber 103, and the pressure in the processing chamber 103 is returned to the atmospheric pressure. The monitoring of the cell thickness by the spectrophotometer 140 is started at the same time when the leak valve 107 is opened.

Next, when the pressure in the processing chamber 103 returns to atmospheric pressure, the leak valve 107 is closed and the gas valve 105 is opened to allow air to flow into the processing chamber 103, and the pressure in the processing chamber 103 is reduced. Is 0.5 kgf / cm ² , the gas valve 105 is closed. Then, the processing chamber 103 is left to stand for 1 minute while maintaining the pressurized state where the pressure is 0.5 kgf / cm ² . At this time, a pressure of 1000 kg is applied to the stacked first glass substrate 311 and second glass substrate 312.

By thus pressurizing the inside of the processing chamber 103, the surface irregularities of the adhesive 318 and the first sealing material 12 which have been generated at the time of application are crushed, and the adhesive material 318 and the first sealing material 12 adhere to the glass substrate without generating bubbles. To be done. That is, the first
At the time when the sealing material 12 and the adhesive material 318 are applied on the glass substrate, the surface of the first sealing material 12 and the adhesive material 318 has unevenness. Therefore, simply stacking two glass substrates together First sealing material 12 and adhesive material 31
Although air bubbles were generated in 8, the unevenness on the surface of the first seal material 12 and the adhesive material 318 was crushed by applying pressure, and the first seal material 12 and the adhesive material 318 and the glass substrate could be brought into close contact with each other. it can. For example, the adhesive 318
When air bubbles are generated in the adhesive 318, the strength of the adhesive 318 decreases,
Between the bonding under a reduced pressure and the heating and pressure bonding under the atmospheric pressure, the pressure difference between the pressure in the closed space formed by the adhesive 318 and the two glass substrates and the atmospheric pressure causes the adhesive 3
There is a case where 18 becomes unbearable and the adhesive material 318 is cracked. If a crack occurs like this,
The closed space formed by the adhesive material 318 and the two glass substrates breaks under a reduced pressure state, the space returns to atmospheric pressure, and a liquid crystal panel having a desired cell thickness cannot be obtained.

Also in this pressurizing step, the spectrophotometer 14
Cell thickness monitoring by 0 continues.
In this embodiment, air is introduced by opening the leak valve 107 in order to return from reduced pressure to atmospheric pressure, but by opening the gas valve 105 with the leak valve 107 closed, air is introduced. Then, the inside of the processing chamber 103 may be returned to atmospheric pressure, and further, air may be introduced to increase the pressure.

Next, by closing the gas valve 105 and subsequently opening the leak valve 107, the pressure inside the processing chamber 103 is released, and the pressure inside the processing chamber 103 is returned to atmospheric pressure. Also at this time, the cell thickness is continuously monitored by the spectrophotometer 140, and when the pressure inside the processing chamber 103 becomes stable under the atmospheric pressure, the monitoring is finished and the assembly of the two glass substrates pasted together is completed. The panel is carried out of the apparatus 300.

As described above, after the step of stacking the two glass substrates, the monitoring of the spectrophotometer is started when the pressure in the processing chamber 103 is started, and the monitoring is performed immediately before the assembled panel is carried out. finish. The result of this monitoring is sent to the control device 130 almost at the same time when the assembly panel is carried out of the apparatus 300, and the two glass sheets are made to have a desired cell thickness when the assembly panel is placed under atmospheric pressure. The controller 130 calculates how to adjust the reduced pressure state when the substrates are stacked. Specifically, for example, the control device 130 calculates the length of time for opening the evacuation valve 117 and the length of time for opening the gas valve 105, and based on this information, the evacuation valve 117 and the gas valve 105 are opened. The timing of opening and closing is controlled. In this way, since the cell thickness measurement result is fed back, in the bonding step in the substrate bonding apparatus 300 in the next work, the reduced pressure state during bonding is adjusted so that an assembly panel having a desired cell thickness can be obtained. ing. Therefore, for example, even if there is a slight change in atmospheric pressure, the pressure-reduced state at the time of bonding can be kept under a preferable state by feedback control, and an assembly panel having the same cell thickness can be stably manufactured.
Further, in the present embodiment, since the monitoring is performed from the start of pressurization in the processing chamber 103 after the step of stacking the two glass substrates to immediately before the assembled panel is carried out, the pressure at atmospheric pressure or higher is used. It is possible to confirm the state of the cell thickness when pressure is applied. As a result, the adhesive 3
18 A pressure for crushing the surfaces of the adhesive 318 and the sealing material 12 so as to obtain a desired cell thickness when the assembly panel is placed under atmospheric pressure while suppressing the generation of bubbles in the sealing material 12. The degree of can be adjusted.
Further, the optimum pressurizing pressure can be controlled based on the cell pressure during pressurization and the cell thickness difference when returning to atmospheric pressure.

The assembled panel manufactured as described above has a difference between the atmospheric pressure and the atmospheric pressure in the closed space formed by the first glass substrate 311, the second glass substrate 312 and the adhesive 318 under the atmospheric pressure. Then, the first glass substrate 311 and the second glass substrate 311
A uniform pressure is applied to the entire surface of the glass substrate 312, and the cell thickness is uniform in the substrate surface. Then, the assembled panel is heat-treated by a baking device (not shown) in a pressurized state, and the first sealing material 1
2 and the adhesive 318 are cured.

After that, the substrate of the assembly panel where the adhesive material 318 is formed is cut off, liquid crystal is injected from the liquid crystal injection port, and the liquid crystal injection port is sealed with a sealing material to form a liquid crystal panel. It

(Second Embodiment) In the first embodiment,
After stacking the two glass substrates together, the inside of the processing chamber 103 is returned to atmospheric pressure, and then air is introduced into the processing chamber 103 to make the inside of the processing chamber 103 a pressure higher than atmospheric pressure.
The two glass substrates were pressed. However, as in the substrate bonding apparatus 1300 according to the second embodiment shown in FIG. 5, the second inside of the processing chamber 103 as the first processing chamber is
A chamber 203 as a processing chamber is provided, and this chamber 2
Two glass substrates 311 and 312 may be arranged in the interior 03. Hereinafter, description will be made with reference to FIG.
The description of the same structure as the first embodiment is omitted.

In the present embodiment, the pressure inside the chamber 203 is adjusted by a pressure adjusting means different from the pressure adjusting means inside the processing chamber 103. Also in the chamber 203, the pressure adjusting means has an exhausting means and an inflowing means for inflowing gas into the chamber 203.

The exhaust means in the chamber 203 is the rotary pump 21 for exhausting the air in the chamber 203.
9 and a mechanical booster pump 218, and a vacuuming valve 217 as a first valve interposed between these pumps and the chamber 203. As a result, the inside of the chamber 203 can be evacuated and the pressure can be reduced, and the chamber 203 functions as a second pressure reducing unit. The exhaust means in the processing chamber 103 includes a rotary pump 119 and a mechanical booster pump 118 for exhausting the air in the processing chamber 103.
It has a vacuuming valve 117 as a first valve interposed between these pumps and the processing chamber 103, and functions as a first pressure reducing means.

In addition, the inflow means in the chamber 203 is a mass flow controller 206 for adjusting the flow rate of gas that has been decompressed by the regulator 232 after the air 210 as a gas has passed through the filter 225, and the inside of the gas chamber 203 for which the flow rate has been adjusted. It has a gas valve 205 as a second valve for adjusting the presence / absence of supply to the gas. As a result, the gas is introduced into the chamber 203 and the chamber 20
The pressure in 3 is increased. In the present embodiment,
Although air was used as the inflowing gas, nitrogen, argon, or the like, which is an inert gas, may be used. For example, these gases are supplied from factory piping. In particular, when a liquid crystal layer is provided on one of the glass substrates arranged in the chamber 203 by, for example, a dropping method, an inert gas such as nitrogen or argon is used to eliminate the influence of oxidation on the liquid crystal. Is desirable. On the other hand, the inflow means in the processing chamber 103 is a mass flow controller 106 that adjusts the flow rate of gas that has been decompressed by the regulator 132 after passing the air 110 as a gas through the filter 125, and the flow rate-adjusted gas into the processing chamber 103. It has a gas valve 105 as a second valve for adjusting the presence or absence of supply. As a result, gas is introduced into the processing chamber 103 and the pressure inside the processing chamber 103 is increased. For example, the pressure in the processing chamber 103 is increased by using an inflow unit, so that the chamber 203
A pressure difference between the inside and the processing chamber 103 can be provided. That is, by adjusting the pressure adjusting means provided in each processing chamber 103 and chamber 203, the processing chamber 1
The pressure difference between the pressure inside the chamber 03 and the pressure inside the chamber 203 can be set to an arbitrary value, and the pressure inside the processing chamber 103 and the chamber 203 at the time of stacking the first substrate and the second substrate and the atmospheric pressure. A pressure larger than the differential pressure between the first substrate and the second substrate
It can be adjusted to act on the substrate. Although air is used as the inflowing gas in the present embodiment, inert gases such as nitrogen and argon may be used. For example, these gases are supplied from the factory piping. In particular, when a liquid crystal layer is provided on one of the glass substrates arranged in the chamber 203 by, for example, a dropping method, an inert gas such as nitrogen or argon is used to eliminate the influence of oxidation on the liquid crystal. Is desirable.

Further, a leak valve 207 is provided as one of the pressure adjusting means. This leak valve 207
Is opened, the pressure in the chamber 203 becomes
If the substrate bonding apparatus 1300 is placed under the atmospheric pressure where it is arranged, the air in the chamber 203 is discharged to the outside of the chamber 203 through the leak valve 207, and the inside of the chamber 203 is kept at the atmospheric pressure. Can be returned.
On the other hand, the pressure in the chamber 203 is controlled by the substrate bonding apparatus 3
00 is placed under the atmospheric pressure, the air 210 outside the chamber 203 is filtered by the filter 225.
Through the leak valve 207, and the inside of the chamber 203 can be returned to the atmospheric pressure. That is, the leak valve 207 functions as both an exhaust means and an inflow means.

Further, a pressure gauge 220 for measuring the pressure inside the processing chamber 203 is provided. In addition, the second glass substrate 3
The xy stage 1301 holding 12 is set to be able to move up and down. In the present embodiment, in a state where two glass substrates are bonded together, as shown in FIG.
The second surface 311b of the first glass substrate 311 is the processing chamber 103.
The space inside the processing chamber 103 and the space inside the chamber 203 are exposed by the packing 204, which is exposed to the inside and the first glass substrate 311 is provided on the outer peripheral portion of the substrate, and the first glass substrate 311. .

Next, the substrate bonding apparatus 1300 described above
The substrate bonding process using is described with reference to FIG. 5, but the description of the same parts as those in the first embodiment will be omitted.

First, similarly to the first embodiment, the first glass substrate 311 and the second glass substrate 312 are prepared, the first sealing material 12 and the adhesive material 318 are applied to one side, and the spacer 314 is applied to the other side. Disperse.

Next, the substrate bonding apparatus 13 shown above
00 into the second glass substrate 3 on the xy stage 1301.
12 is fixedly arranged, and the second glass substrate 312 is carried into the substrate bonding apparatus 1300 described above. On the other hand, the first
The glass substrate 311 is also suction-held by the holding plate 302 (not shown), and is carried into the substrate bonding apparatus 1300. At this time, the peripheral edge of the first glass substrate 311 is in close contact with the packing 204 provided on the inner peripheral edge of the opening provided in the upper portion of the chamber 203, and the packing 204 and the first glass
With the glass substrate 311, the processing chamber 103 and the chamber 30
The space with 2 is blocked. In addition, the second glass substrate 312
Are placed on the xy stage 1301 in a lowered state, and the two glass substrates are not superposed yet and are placed with a predetermined gap. Also, at this time, 2
The positioning accuracy of one glass substrate is CC for alignment.
The alignment mark on the substrate must be included in the field of view of the alignment CCD camera according to the magnification of the D camera 1.

Next, after the first glass substrate 311 and the second glass substrate 312 are carried in, a vacuuming valve 117
And 217 are opened, and rotary pumps 119 and 21 are opened.
9. With the mechanical booster pumps 118 and 218, the pressure in the processing chamber 103 and the chamber 203 is set to, for example, 0.1.
The chamber is evacuated to 3 kPa, and the pressure inside the processing chamber 103 and the chamber 203 is reduced. There is no problem if the pressure at this time is equal to or lower than the pressure difference between the pressure for performing the pressure bonding and the atmospheric pressure.

Next, the evacuation valves 117 and 217.
Open the gas valves 105 and 205 with the
The pressure inside the chamber 103 and the chamber 203 is 0.6 kgf /
cm ^TwoMeasurement with pressure gauges 120 and 220
The mass flow controllers 106 and 206
When the flow rate is adjusted and the pressure is stable,
Raise the xy stage 1301 holding the plate 312.
Set the two glass substrates to the first sealing material 12 and the adhesive 3
Overlay via 18. Where the pressure is 0.6 kg
f / cm^TwoIs because the pressure is 0.4 kgf / cm^Two
Because the pressure difference between the atmospheric pressure and the pressure
This is to adjust so that In this embodiment
This is because the pressure bonding of the two glass substrates is performed under atmospheric pressure.
Pressure to be adjusted at the time, that is, the difference between atmospheric pressure and pressure
The pressure has a great influence on the cell thickness of the cell after crimping.
You

After that, the relative positions of the two glass substrates are aligned as in the first embodiment.

After the alignment is completed, the vacuuming valve 1
17 and 217, the gas valves 105 and 205 are closed,
Subsequently, the leak valve 107 is opened to open the processing chamber 10.
The reduced pressure in 3 is released, and the pressure in the processing chamber 103 is returned to atmospheric pressure. The monitoring of the cell thickness by the spectrophotometer 140 is started at the same time when the leak valve 107 is opened.

Next, when the pressure in the processing chamber 103 returns to atmospheric pressure, the leak valve 107 is closed and the gas valve 105 is opened to allow air to flow into the processing chamber 103, and the pressure in the processing chamber 103 is reduced. Is 0.5 kgf / cm ² , the gas valve 105 is closed. Then, it is left for 1 minute while the pressure inside the processing chamber 103 is maintained at 0.5 kgf / cm ² . At this time, since the inside of the chamber 302 is under a reduced pressure when the glass substrates are stacked, the chamber 3
The first glass substrate 311 and the second glass substrate 312 are pressed by the pressure difference between the pressure inside 02 and the pressure inside the processing chamber 301. Thereby, the adhesive material 318 and the first sealing material 12
The surface irregularities generated during application are crushed, and the glass substrate is brought into close contact with the glass substrate without generating bubbles. That is, when the first sealing material 12 and the adhesive 318 are applied on the glass substrate, the first sealing material 12 and the adhesive 31 are applied.
Since the surface of 8 has irregularities, air bubbles were generated in the first sealing material 12 and the adhesive material 318 by simply superposing the two glass substrates, but by applying pressure, The irregularities on the surfaces of the seal material 12 and the adhesive material 318 are crushed to crush the first seal material 12 and the adhesive material 318.
And the glass substrate can be brought into close contact with each other. For example, if air bubbles are generated in the adhesive material 318, the strength of the adhesive material 318 decreases, and the adhesive material 318 and the two glass sheets are bonded to each other between the bonding under the reduced pressure and the heating and pressure bonding under the atmospheric pressure. The adhesive 318 may not be able to withstand the pressure difference between the pressure in the closed space formed by the substrate and the atmospheric pressure, and the adhesive 318 may crack. When a crack is generated in this way, the closed space formed by the adhesive material 318 and the two glass substrates is destroyed under a reduced pressure state, and this space returns to atmospheric pressure and has a desired cell thickness. The liquid crystal panel cannot be obtained.

Also in this pressurizing step, the spectrophotometer 14
Cell thickness monitoring by 0 continues.

Next, the gas valve 105 is closed, and then the leak valves 107 and 207 are opened, whereby the processing chamber 1 is closed.
The pressure inside 03 and the pressure inside chamber 203 are released,
The pressure in the processing chamber 103 and the pressure in the chamber 203 are returned to atmospheric pressure. Also at this time, the cell thickness is continuously monitored by the spectrophotometer 140, and when the pressure inside the processing chamber 103 becomes stable under the atmospheric pressure, the monitoring is finished and the assembly of the two glass substrates pasted together is completed. The panel is carried out of the apparatus 1300.

As described above, after the step of stacking the two glass substrates, the processing chamber 103 and the chamber 203 are processed.
Monitoring of the spectrophotometer will start from the start of pressurization inside, and monitoring will end just before the assembly panel is carried out. The result of this monitoring is, for example, sent to the control device 1130 almost at the same time when the assembly panel is carried out of the apparatus 1300, and two glass sheets are provided so that the assembly panel has a desired cell thickness when the assembly panel is placed under atmospheric pressure. The controller 1130 calculates how to adjust the reduced pressure state when the substrates are stacked. Specifically, for example, the controller 1130 calculates the length of time for opening the vacuum evacuation valves 117 and 217 and the length of time for opening the gas valves 105 and 205, respectively, and based on this information, the vacuum evacuation valve 117 and 217, gas valve 1
The timing of opening and closing 05 and 205 is controlled. In this way, since the cell thickness measurement result is fed back,
In the bonding step of the substrate bonding apparatus 300 in the next operation, the reduced pressure state during bonding is adjusted so that an assembled panel having a desired cell thickness can be obtained. Therefore, for example, even if there is a slight change in atmospheric pressure, the pressure-reduced state at the time of bonding can be kept under a preferable state by feedback control, and an assembly panel having the same cell thickness can be stably manufactured. Further, in the present embodiment, since the monitoring is performed from the start of pressurization in the processing chamber 103 and the chamber 203 after the step of stacking the two glass substrates until immediately before the assembled panel is carried out, for example, large It is possible to confirm the cell state when pressure is applied at a pressure higher than atmospheric pressure. As a result, the adhesive 31
8 and a pressure for crushing the surfaces of the adhesive 318 and the sealing material 12 so that the desired cell thickness is obtained when the assembly panel is placed under atmospheric pressure while suppressing the generation of bubbles in the sealing material 12. The degree of can be adjusted. Further, the optimum overpressure pressure can be controlled from the cell pressure at the time of pressurization and the cell pressure at the time of returning to the atmospheric pressure.

The assembled panel manufactured as described above has a difference between the atmospheric pressure and the atmospheric pressure in the closed space formed by the first glass substrate 311, the second glass substrate 312 and the adhesive 318 under atmospheric pressure. Then, the first glass substrate 311 and the second glass substrate 311
A uniform pressure is applied to the entire surface of the glass substrate 312, and the cell thickness is uniform in the substrate surface. Then, the assembled panel is heat-treated by a baking device (not shown) in a pressurized state, and the first sealing material 1
2 and the adhesive 318 are cured.

After that, the substrate of the portion of the assembly panel where the adhesive material 318 is formed is cut off, liquid crystal is injected from the liquid crystal injection port, and the liquid crystal injection port is sealed with a sealing material to form a liquid crystal panel. It

In the present embodiment, the holding mechanism for the first glass substrate is not shown.

(Third Embodiment) In the first embodiment,
After stacking the two glass substrates together, the inside of the processing chamber 103 is returned to atmospheric pressure, and then air is introduced into the processing chamber 103 to make the inside of the processing chamber 103 a pressure higher than atmospheric pressure.
Although the two glass substrates are pressed, the two glass substrates may be mechanically pressed while the inside of the processing chamber 103 is kept under reduced pressure.

A substrate bonding apparatus having a mechanism for mechanically applying pressure will be described below with reference to FIG.
The description of the structure and method similar to those of the first embodiment will be partially omitted. FIG. 6 is a schematic diagram of the substrate bonding apparatus 2300 in this embodiment. In this embodiment, a first holding plate 2302 holding the first glass substrate 311 and a second holding plate 2301 holding the second glass substrate 312 are arranged in the processing chamber 103. Each of the holding plates 2301 and 2302 has a mechanism (not shown) for holding the glass substrate, is set to be movable in the xy plane, and is set to be movable up and down, and functions as a pressing unit. The holding plates 2301 and 2302 hold the corresponding glass substrates, and the first holding plate 2302
Is lowered and the second holding plate 2301 is raised,
Pressure can be mechanically applied to the glass substrate. Although the two holding plates are movable here, it is also possible to apply pressure to the two glass substrates by fixing one and moving the other.

Next, the substrate bonding apparatus 2300 described above
About the manufacturing method of the liquid crystal panel of the present invention using
This will be described with reference to FIG. FIG. 7 is a diagram for explaining the manufacturing process, and is a diagram for explaining the state inside the substrate bonding apparatus and the operating state of the spectrophotometer at the time of bonding the substrates. Figure 8
Is a diagram for explaining a pressure change in the substrate bonding apparatus during the manufacturing process by the substrate bonding apparatus and the timing of monitoring by the spectrophotometer, the vertical axis represents the pressure in the processing chamber, the horizontal axis represents time. ing.

First, similarly to the first embodiment, the first glass substrate 311 and the second glass substrate 312 are prepared, the first seal material 12 and the adhesive material 318 are applied to one of them, and the spacer 314 is applied to the other. Disperse.

Next, the substrate bonding apparatus 23 shown above.
00 into the second holding plate 2301 on the second glass substrate 312
Are fixedly arranged, and the second glass substrate 312 is loaded into the substrate bonding apparatus 2300 described above. On the other hand, the first glass substrate 311 is also held by the first holding plate 2302,
It is carried into the substrate bonding apparatus 2300. At this time, 2
The glass substrates are not superposed yet and are arranged with a predetermined gap. Further, at this time, the positioning accuracy of the two glass substrates needs to include an alignment mark on the substrates in the visual field of the alignment CCD camera according to the magnification of the alignment CCD camera 1.

Next, after the first glass substrate 311 and the second glass substrate 312 are carried in, a vacuuming valve 117
Open the rotary pump 119 and the mechanical booster pump 118 to adjust the pressure in the processing chamber 103 to 0.1
The chamber is evacuated to 3 kPa and the processing chamber 103 is depressurized. There is no problem if the pressure at this time is equal to or lower than the pressure difference between the pressure for performing the pressure bonding and the atmospheric pressure.

Next, the gas valve 105 is opened while the vacuuming valve 117 is open, and the mass flow controller 106 measures the flow rate of air while measuring the pressure gauge 120 so that the pressure in the processing chamber 103 becomes 0.6 kgf / cm ^2. When the pressure is stabilized, the second holding plate 2301 is moved up, the first holding plate 2302 is moved down, and the two glass substrates are superposed on each other with the first sealing material 12 and the adhesive 318. . Here, the pressure is 0.6 kgf / cm
^The reason why the pressure is set to ² is that the pressure bonding pressure is 0.4 kgf / cm ² , and the pressure is adjusted so as to be a differential pressure between the atmospheric pressure and the pressure bonding pressure. In the present embodiment, since the pressure bonding of the two glass substrates is performed under the atmospheric pressure, the pressure adjusted at this time, that is, the pressure difference between the atmospheric pressure and the pressure bonding has a great influence on the cell thickness of the cell after pressure bonding. Exert.

After that, the relative positions of the two glass substrates are aligned.

After the alignment is completed, the vacuuming valve 1
17 and the gas valve 105 are closed, the second holding plate 2301 is raised and the first holding plate 2302 is further lowered in a state where the inside of the processing chamber 103 is kept in a depressurized state, so that the two glass substrates are mechanically operated. A pressure of 1000 kg is applied to. Thereby, the adhesive material 318 and the first sealing material 12
The surface irregularities generated during application are crushed, and the glass substrate is brought into close contact with the glass substrate without generating bubbles. That is, when the first sealing material 12 and the adhesive 318 are applied on the glass substrate, the first sealing material 12 and the adhesive 31 are applied.
Since the surface of 8 has irregularities, air bubbles were generated in the first sealing material 12 and the adhesive material 318 by simply superposing the two glass substrates, but mechanical pressure should be applied. As a result, the irregularities on the surfaces of the first seal material 12 and the adhesive material 318 are crushed and the first seal material 12 and the adhesive material 318 can be brought into close contact with the glass substrate. For example, if air bubbles are generated in the adhesive 318, the adhesive 318
Strength decreases, and the pressure in the closed space formed by the adhesive 318 and the two glass substrates and the atmospheric pressure are increased between the bonding under reduced pressure and the heating and pressure bonding under atmospheric pressure. Since the adhesive 318 cannot withstand the pressure difference, the adhesive 31
8 may be cracked. When the cracks are generated in this way, the closed space formed by the adhesive 318 and the two glass substrates breaks under a reduced pressure state, and this space returns to the atmospheric pressure and has a desired cell thickness. The liquid crystal panel cannot be obtained. At the same time as the start of this mechanical pressurization, the monitoring of the cell thickness by the spectrophotometer 140 is started.

Next, holding of the second glass substrate 311 by the holding mechanism of the first holding plate 2302 is released, and the second glass substrate 311 and the first holding plate 2302 are separated from each other. afterwards,
The pressure inside the processing chamber 103 is released by opening the leak valve 107, and the pressure inside the processing chamber 103 is returned to atmospheric pressure. Also at this time, the cell thickness is continuously monitored by the spectrophotometer 140, and the monitoring ends when the pressure in the processing chamber 103 becomes stable at the atmospheric pressure, and the assembled panel made of two glass substrates bonded together. Are carried out of the apparatus 2300.

As described above, the monitoring of the spectrophotometer is started at the time when pressure is applied to the two glass substrates under reduced pressure after the step of stacking the two glass substrates, and the assembly panel is assembled. Monitoring will be completed immediately before the shipment. The result of this monitoring is, for example, sent to the control device 130 almost at the same time when the assembly panel is carried out of the apparatus 2300, and two glass sheets are provided so that the assembly panel has a desired cell thickness when placed under atmospheric pressure. The controller 130 calculates how to adjust the reduced pressure state when the substrates are stacked. Specifically, for example, the control device 130 calculates the length of time for opening each vacuuming valve 117 and the length of time for opening the gas valve 105, and based on this information, the vacuuming valve 117 and the gas valve 105. The timing of opening and closing is controlled. In this way, since the cell thickness measurement result is fed back, in the bonding step in the substrate bonding apparatus 2300 in the next work, the reduced pressure state during bonding is adjusted so that an assembly panel having a desired cell thickness can be obtained. ing. Therefore, for example, even if there is a slight change in atmospheric pressure,
The pressure-reduced state at the time of bonding can be kept under a preferable state by feedback control at any time, and an assembled panel having the same cell thickness can be stably manufactured. Further, in the present embodiment, since the monitoring is performed from the time when pressure is applied to the two glass substrates under reduced pressure to immediately before the assembly panel is carried out, for example, mechanically under reduced pressure. It is possible to confirm the cell state of the assembly panel under pressure. As a result, the surfaces of the adhesive material 318 and the seal material 12 are controlled so that a desired cell thickness is obtained when the assembly panel is placed under atmospheric pressure while suppressing the generation of bubbles in the adhesive material 318 and the seal material 12. The degree of pressurization for crushing can be adjusted. Further, the optimum overpressure can be controlled from the cell pressure at the time of pressurization and the cell pressure at the time of returning to the atmospheric pressure.

The assembled panel manufactured as described above has a difference between the atmospheric pressure and the atmospheric pressure in the closed space formed by the first glass substrate 311, the second glass substrate 312 and the adhesive 318 under the atmospheric pressure. Then, the first glass substrate 311 and the second glass substrate 311
A uniform pressure is applied to the entire surface of the glass substrate 312, and the cell thickness is uniform in the substrate surface. Then, the assembled panel is heat-treated by a baking device (not shown) in a pressurized state, and the first sealing material 12 and the adhesive material 318 are cured.

After that, the substrate in the portion where the adhesive material 318 of the assembly panel is formed is cut off, liquid crystal is injected from the liquid crystal injection port, and the liquid crystal injection port is sealed with a sealing material to form a liquid crystal panel. It

(Fourth Embodiment) In the third embodiment, a pair of holding plates 2301 and 230 are provided in the processing chamber 103.
Two glass substrates were sandwiched by 2 and mechanically pressed against the two glass substrates, but the two glass substrates were mechanically pressed by using a pressing means as shown in FIG. Pressure may be applied to the substrate. Hereinafter, description will be made with reference to FIG.
Only the mechanism 3301 for applying pressure, which is arranged in the processing chamber of the substrate bonding apparatus, is partially illustrated, and the other structures are common to the third embodiment, and therefore description and illustration thereof are omitted.

As shown in FIG. 9, a mechanism 3301 for applying pressure.
Then, air bags 303 and 304 made of rubber bags are arranged between the base materials 301 and 302. The air bag 303 is arranged on the base material 101, and the flat plate 305 serving as a reference is arranged on the air bag 303.
A pair of glass substrates 311 and 312 are placed on the flat plate 305 so that the second glass substrate 312 is in contact with the adhesive 318 and the first sealing material. Further, a thin plate 306 is arranged on the first glass substrate 312,
An air bag 304 is arranged on the upper base material 1
02 is covered and fixed by the stopper 111. still,
The superposition and fixing of the two glass substrates are performed under reduced pressure. In this fixed state, compressed air is injected into the air bags 103 and 104 under reduced pressure as in the third embodiment, and pressure is applied to the two glass substrates bonded together. At this time, the air pressure is 0.
100 kg for ² glass substrates at 5 kgf / cm ^2.
A pressure of 0 kgf is applied.

In the above-described embodiment, the single-piece fabrication in which one liquid crystal panel is manufactured from one assembly panel has been described as an example, but a plurality of liquid crystal panels can be formed from one assembly panel. It goes without saying that the present invention can be applied to the multi-cavity production.

In this case, two mother substrates are prepared first.
Then, as shown in FIG. 12, a plurality of open curve-shaped first sealing materials 12 having an injection port 10 are applied to a bonding surface 2a of one of the pair of mother substrates 2 and the first seals thereof are applied. After the adhesive 318 having a closed curve shape is applied to the outer periphery so as to include all of the material 12, a pair of mother substrates are bonded by any of the bonding devices described in the above-described embodiments to manufacture a large-sized assembled panel. Good.

Then, as shown in FIG. 13A, scribe grooves 6x extending in the X direction shown on the first surfaces 2a and 4a of the first mother board 2 and the second mother board 4 of the large-sized assembly panel 3, respectively. (Scribe grooves similarly formed on the first mother substrate 2 are not shown) are formed (primary scribe), and a breaking force is applied along these scribe grooves 6x to form the first mother substrate 2, The two mother substrates 4 are each broken (primary break) to form the strip panel P shown in FIG. 13 (b).

When this strip panel P is formed, the opening of the sealing material, which serves as a liquid crystal injection port, is exposed at the portion where the first mother substrate 2 and the second mother substrate 4 are broken, and the liquid crystal is injected from this opening. Then, the opening is closed by the sealing material.

Next, as shown in FIG. 13C, a scribe groove 6y (a scribe groove formed on one of the strip substrates is not shown) is provided in each of the two strip substrates constituting the strip panel P. After forming (secondary scribing) and applying a breaking force along these scribing grooves 6y, the two strip substrates are fractured together (secondary break), and liquid crystal is injected between the substrates to form the liquid crystal shown in FIG. The single liquid crystal panel p shown in FIG. Although the description is omitted here,
The adhesive 318 formed on the peripheral portion of the large-sized panel is removed by the scribing step and the breaking step described above, and does not remain in the state of the single liquid crystal panel p.

Further, in the above embodiment, the liquid crystal injection port 1
The closed curve adhesive material 318 is arranged so as to surround the open curve first seal material 12 having 0, but as shown in FIG. 14, the first seal material 1318b having the injection port 10 for injecting the liquid crystal. And an adhesive 131 having a closed curve shape in which a second sealing material 1318a that closes the inlet 10 is connected.
8 may be applied and the first glass substrate 311 and the second glass substrate 312 may be bonded together by a bonding device.
In this case, the two glass substrates may be bonded to each other, subjected to a heat press bonding process, and then the two glass substrates may be cut along the cutting plane line 45 to form the liquid crystal injection port 10 to inject the liquid crystal. .

[Brief description of drawings]

FIG. 1 is a schematic perspective view of a pair of glass substrates before substrate bonding according to an embodiment of the present invention.

FIG. 2 is a schematic view of a substrate bonding apparatus for carrying out the liquid crystal panel manufacturing method according to the first embodiment of the present invention.

FIG. 3 is a diagram for explaining the manufacturing process of the liquid crystal panel according to the first embodiment, and is a diagram for explaining the state in the substrate bonding apparatus and the operating state of the spectrophotometer at the time of bonding the substrates.

FIG. 4 is a diagram for explaining a pressure change in the apparatus and a timing of monitoring by a spectrophotometer during the operation of the substrate bonding apparatus according to the first embodiment.

FIG. 5 is a schematic diagram of a substrate bonding apparatus for carrying out the liquid crystal panel manufacturing method according to the second embodiment of the present invention.

FIG. 6 is a schematic view of a substrate bonding apparatus for carrying out the liquid crystal panel manufacturing method according to the third embodiment of the present invention.

FIG. 7 is a diagram for explaining the manufacturing process of the liquid crystal panel according to the third embodiment, and is a diagram for explaining a state in the substrate bonding apparatus and a working state of the spectrophotometer at the time of bonding the substrates.

FIG. 8 is a diagram for explaining a pressure change in a device and a timing of monitoring by a spectrophotometer during operation of the substrate bonding device according to the third embodiment.

FIG. 9 is a partial cross-sectional view of a substrate bonding apparatus according to the fourth embodiment.

FIG. 10 is a schematic plan view showing the structure of a liquid crystal panel.

FIG. 11 is a schematic cross-sectional view showing the structure of a liquid crystal panel.

FIG. 12 is a perspective view of one of a pair of large-sized glass substrates that constitutes a part of a large-sized assembly panel that employs multi-sided cutting.

FIG. 13 is a schematic perspective view showing an external appearance of a liquid crystal panel in a main step of a method for manufacturing a liquid crystal panel that adopts multiple chamfering.

FIG. 14 is a diagram for explaining another adhesive material shape.

FIG. 15 is a diagram for explaining a problem in a conventional liquid crystal panel manufacturing method.

[Explanation of symbols]

2 ... First mother substrate 4 ... Second mother substrate 10 ... inlet 12, 1318b ... First sealing material 103 ... Processing room 105, 205 ... Gas valve 107, 207 ... Leak valve 110 ... Air 117, 217 ... Vacuum evacuation valve 118, 218 ... Mechanical booster pump 119, 219 ... Rotary pump 130, 1130 ... Control device 140 ... Spectrophotometer 203 ... Chamber 300, 1300, 2300 ... Substrate bonding apparatus 301, 1301 ... xy stage 302 ... holding plate 311 ... First glass substrate 312 ... Second glass substrate 318, 1318 ... Adhesive 1318a ... second sealing material 2301 ... First holding plate 2302: second holding plate 3301 ... Pressurizing mechanism

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 2H088 FA11 FA30 HA01 KA02 MA17                       MA20                 2H089 LA21 LA41 NA37 QA14 QA16                       TA01

Claims (22)

[Claims] 1. A step of disposing a first substrate in which a bonding agent is arranged in a closed curve shape in a processing chamber and a second substrate facing a surface in which the bonding material is disposed, and depressurizing the processing chamber. And a step of superposing the first substrate and the second substrate via the adhesive under a reduced pressure condition, and the treatment at the superposing step with respect to the first substrate and the second substrate. And a step of applying a pressure larger than the differential pressure between the pressure in the chamber and the atmospheric pressure, the method for producing a liquid crystal panel. 2. The method of manufacturing a liquid crystal panel according to claim 1, wherein the step of applying the pressure is a step of pressurizing the processing chamber to a pressure higher than atmospheric pressure. 3. The step of applying the pressure is a step of mechanically applying pressure to the stacked first substrate and second substrate under a reduced pressure state. A method for manufacturing the liquid crystal panel described. 4. The method of manufacturing a liquid crystal panel according to claim 1, further comprising a step of returning the processing chamber to atmospheric pressure after the step of applying the pressure. . 5. A first substrate having a first surface and a second surface on which a closed-curve adhesive material is arranged, and a first surface having a first surface and a second surface. Is a method for manufacturing a liquid crystal panel, in which a first substrate and a second substrate arranged to face the first surface are bonded together, wherein the second treatment chamber disposed inside the first treatment chamber is provided with the first treatment chamber. 1
A step of arranging the substrate and the second substrate such that their first surfaces face each other; a step of depressurizing the first processing chamber and the second processing chamber; and a space in the first processing chamber under a depressurized state. And a space in the second processing chamber is blocked by the first substrate and the second substrate, and a second surface of either the first substrate or the second substrate is exposed to the inside of the second processing chamber. like,
The step of superposing the first substrate and the second substrate via the adhesive, and the differential pressure between the pressure in the first processing chamber and the pressure in the second processing chamber The pressures in the first processing chamber and the second processing chamber are adjusted so as to be higher than the pressure difference between the pressures in the first processing chamber and the second processing chamber and the atmospheric pressure, and the first substrate and the second processing chamber are adjusted. (2) A method of manufacturing a liquid crystal panel, comprising: applying a pressure to the substrate. 6. The method for manufacturing a liquid crystal panel according to claim 5, further comprising the step of returning the first processing chamber and the second processing chamber to atmospheric pressure. 7. In the step of applying the pressure and the step of returning to the atmospheric pressure, the gap between the first substrate and the second substrate is measured by a measuring means, and based on the measurement result by the measuring means, 7. The method of manufacturing a liquid crystal panel according to claim 4, further comprising a step of controlling a pressure adjusting means in the processing chamber. 8. The method of manufacturing a liquid crystal panel according to claim 7, wherein the measuring unit is a spectrophotometer. 9. An injection port for injecting liquid crystal is provided on the first substrate or the second substrate in a region surrounded by the adhesive when the first substrate and the second substrate are superposed on each other. The method for manufacturing a liquid crystal panel according to claim 1, wherein a first sealing material is arranged. 10. The adhesive according to claim 1, wherein the adhesive has a first sealing material having an injection port for injecting liquid crystal and a second sealing material closing the injection port. Item 6. A method for manufacturing a liquid crystal panel according to item. 11. A processing chamber in which a first substrate on which a closed-curve adhesive material is arranged, a second substrate on which a surface on which the adhesive material is arranged is arranged, and a pressure inside the processing chamber are reduced. Depressurizing means, and means for superposing the first substrate and the second substrate via the adhesive in the processing chamber depressurized by the depressurizing means, the superposed first substrate and the second substrate A liquid crystal panel, comprising: a means for exerting a pressure on the substrate that is greater than the differential pressure between the pressure in the processing chamber and the atmospheric pressure when the first substrate and the second substrate are superposed. Manufacturing equipment. 12. The liquid crystal panel manufacturing apparatus according to claim 11, wherein the means for exerting the pressure is an inflow means for inflowing gas into the processing chamber. 13. The means for applying the pressure is a pressurizing means for mechanically pressurizing the stacked first substrate and second substrate provided in the processing chamber. Item 11. A liquid crystal panel manufacturing apparatus according to item 11. 14. The liquid crystal panel manufacturing apparatus according to claim 11, further comprising a measuring unit that measures a gap between the first substrate and the second substrate. . 15. A control means for adjusting the depressurized state in the processing chamber when the first substrate and the second substrate are superposed on each other based on the measurement result measured by the measuring means. The liquid crystal panel manufacturing apparatus according to claim 14. 16. The liquid crystal panel manufacturing apparatus according to claim 17, wherein the measuring unit is a spectrophotometer. 17. The measuring means includes the first substrate and the second substrate, which are superposed by the means for exerting the pressure.
20. The liquid crystal panel according to claim 17, wherein the liquid crystal panel is operated during a period from when the pressure is applied to the substrate until the pressure in the processing chamber returns to atmospheric pressure. apparatus. 18. A first substrate having a first surface and a second surface, and an adhesive material having a closed curve shape arranged on the first surface; a first surface and a second surface;
And a first substrate having a first surface, the first surface being bonded to a second substrate facing the first surface of the first substrate, the first processing chamber comprising: A second processing chamber which is disposed in the processing chamber and in which the first substrate and the second substrate are disposed so that the respective first surfaces face each other; and a first pressure reducing means for reducing the pressure in the first processing chamber. A second depressurizing means for depressurizing the pressure in the second processing chamber; a first depressurizing means and a second processing chamber depressurized by the first depressurizing means and the second depressurizing means;
The space inside the processing chamber and the space inside the second processing chamber are blocked by the first substrate and the second substrate, and the second surface of either the first substrate or the second substrate is the second substrate.
A means for superposing the first substrate and the second substrate via the adhesive so as to be exposed to the inside of the processing chamber; and a pressure difference between the pressure inside the first processing chamber and the pressure inside the second processing chamber. So as to be larger than the pressure difference between the pressure in the first processing chamber and the second processing chamber at the time of superposition and the atmospheric pressure,
An apparatus for manufacturing a liquid crystal panel, comprising: means for adjusting pressures in the first processing chamber and the second processing chamber. 19. The liquid crystal panel manufacturing apparatus according to claim 17, further comprising a measuring unit that measures a gap between the first substrate and the second substrate. 20. Control for adjusting a depressurized state in the first processing chamber and the second processing chamber at the time of stacking the first substrate and the second substrate based on a measurement result measured by the measuring means. 19. The liquid crystal panel manufacturing apparatus according to claim 18, further comprising: 21. The liquid crystal panel manufacturing apparatus according to claim 22, wherein the measuring unit is a spectrophotometer. 22. The measuring means comprises the first substrate and the second substrate which are superposed by the means for exerting the pressure.
After the pressure is applied to the substrate until the pressures in the first processing chamber and the second processing chamber return to atmospheric pressure,
The liquid crystal panel manufacturing apparatus according to any one of claims 18 to 20, which operates.