JP2003068575A - Method for manufacturing solid electrolytic capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a solid electrolytic capacitor with excellent high frequency characteristics. SOLUTION: A dielectric film 27 is formed on a roughed surface on one side of an aluminum foil 20, and a protective film 21 is formed on the other side, respectively. A through-hole 24 is formed at a prescribed position, an insulting film 25 is formed on an inner wall of the through-hole 24, and a solid electrolyte layer 29 is formed on an appearing surface on one side of the insulating film 25 and on a surface of the dielectric film 27. A through-hole electrode 28 is formed inside the through-hole, a collector layer 30 is formed on the appearing surface on one side of the through-hole electrode 28 and on the surface of the solid electrolyte layer 29, and an opening part 37 is provided on a prescribed position of the protective film 21. A first connection terminal 31 is formed at the opening part 37, and a second connection terminal 32 is formed on the appearing surface on the other side of the through-hole electrode 28, respectively.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a solid electrolytic capacitor, and more specifically, it reduces an equivalent series resistance (hereinafter referred to as ESR) and an equivalent series inductance (hereinafter referred to as ESL), and a semiconductor. The present invention relates to a method for manufacturing a solid electrolytic capacitor that can be directly connected to parts.

[0002]

2. Description of the Related Art In recent years, as electronic equipment becomes more portable and has higher performance, solid electrolytic capacitors, which are electronic components, are also required to have large capacity and excellent high frequency characteristics.

In order to meet the demands of this market, the surface condition of the electrode portion, the method for forming the dielectric coating, the development of the solid electrolyte layer,
Investigations have been made from various angles such as improvement, surface condition of electrode layer, and structure of capacitor element.

As a conventional solid electrolytic capacitor, a metal foil or sintered body having a valve action such as aluminum or tantalum is used as an electrode portion, and a dielectric film is formed on the surface of the metal foil or sintered body by anodic oxidation. And forming a solid electrolyte layer using a transition metal oxide such as Mn on its surface, forming a collector layer on the surface of this solid electrolyte layer and providing an electrode layer to form a capacitor element, The electrode portion and the electrode layer of the capacitor element are respectively connected to the connection terminals, and the exterior is formed so as to expose the connection terminals.

[0005]

Since the conventional solid electrolytic capacitor is mounted on the circuit board via the connecting terminal, when looking at the characteristics of the solid electrolytic capacitor as a circuit, from the electrode portion and electrode layer to the connecting terminal. In addition to the conduction path, the wiring part on the circuit board affects the high frequency characteristics. Therefore, the ESL was large and the high frequency characteristics were poor.

The present invention solves the above-mentioned problems, and by arranging the first connection terminal and the second connection terminal on the same surface, they can be directly connected to a semiconductor component, thereby realizing low ESR and low ESL. It is an object of the present invention to provide a method for manufacturing a solid electrolytic capacitor having excellent high frequency characteristics.

[0007]

In order to solve the above-mentioned problems, the invention according to claim 1 of the present invention provides a dielectric film on the rough surface of one side of the aluminum foil and a protective film on the other side thereof. Form a through hole through the dielectric film, the aluminum foil, the protective film at a predetermined position, form an insulating film on the inner wall of the through hole, a solid electrolyte layer on the surface of the dielectric film. A through hole electrode is formed so as to fill the through hole hole, a current collector layer is formed on the exposed surface on one side of the through hole electrode and the surface of the solid electrolyte layer, and an opening is formed at a predetermined position of the protective film. Part,
A method for manufacturing a solid electrolytic capacitor in which a first connection terminal is formed in this opening and a second connection terminal is formed on the exposed surface of the other surface of the through-hole electrode, respectively, and high-frequency characteristics enabling direct connection of semiconductor components The excellent solid electrolytic capacitor can be easily provided.

According to a second aspect of the present invention, a dielectric coating is formed on the rough surface of one side of the aluminum foil, and a protective film is formed on the other side of the aluminum foil. A through hole is formed at a predetermined position so as to penetrate the film, an insulating film is formed on the inner wall of the through hole, a solid electrolyte layer is formed on the surface of the dielectric film, and a current collector is formed on the surface of the solid electrolyte layer. A layer is formed, a connection electrode is formed on the surface of this current collector layer and on the exposed surface on one side of the through-hole, and a through-hole electrode is formed so as to fill the through-hole, and the protective film is opened at a predetermined position. And a first connection terminal in the opening and a second connection terminal in the exposed surface on the other surface of the through-hole electrode, the method of manufacturing a solid electrolytic capacitor according to claim 1. In addition, a connection electrode is formed A method for forming the through hole electrodes can widen the selection by.

That is, not only the method using a conductive adhesive but also the method of electroplating or electroless plating can be included in the options, which facilitates the process design and facilitates the production of the solid electrolytic capacitor. can do.

According to a third aspect of the present invention, an insulating film is formed by an electrodeposition method, an insulating resin is applied so as to cover the exposed surface of the other side of the through hole, and suction is applied from one side of the through hole. The method for producing a solid electrolytic capacitor according to claim 1 or 2, wherein at least one of the methods described above is used, and when an electrodeposition method is used, an insulating film having excellent reliability is uniformly formed on a desired portion. Because it can be formed
The insulation between the aluminum foil and the through-hole electrode is improved.
As a result, there is an effect that the reliability of the solid electrolytic capacitor is improved.

When a method of applying an insulating resin so as to cover the exposed surface on the other side of the through hole and sucking from one side of the through hole is used, the insulating film can be formed easily and efficiently. .

It is also possible to combine these methods, and in this case, an insulating film having a higher insulating property can be formed, and as a result, the reliability of the solid electrolytic capacitor is improved. Have.

According to a fourth aspect of the present invention, an insulating resin is formed as a first layer by an electrodeposition method as an insulating film, and thereafter, the resistivity is higher than that of the first layer and the microgel and carbon fine particles are formed. The method for producing a solid electrolytic capacitor according to claim 3, wherein an insulative resin, which is a mixture of titanium oxide fine particles and the titanium oxide fine particles, is formed as the second layer.
By stacking the layers, it is possible to obtain an insulating film that completely covers the inner wall and the edge portion of the through-hole and has the characteristics of both such as heat resistance and film thickness.

The invention according to claim 5 of the present invention is the method for producing a solid electrolytic capacitor according to claim 3, wherein any one of printing, dispenser and potting is used as a method for applying the insulating resin. It complements the action of item 3.

By these methods, the insulating resin can be accurately applied so as to cover the exposed surface on the other side of the through hole, and particularly when a dispenser or potting is used, the amount of the insulating resin applied can be adjusted widely. Can be performed, and as a result, it has an effect of making it easier to control the formation state of the insulating film.

According to a sixth aspect of the present invention, at least one of a laser processing method, a punching processing method and a drill processing method is used as a method of forming a through hole. This is a method for manufacturing a solid electrolytic capacitor, and through-holes can be formed easily and accurately. As a result, it is effective in stabilizing the performance and improving the reliability of the solid electrolytic capacitor.

The invention according to claim 7 is the method for producing a solid electrolytic capacitor according to claim 1 or 2, wherein a method of applying and curing a conductive adhesive is used to form a through-hole electrode. Since it is easy to fill and cure the conductive adhesive in the through-holes, it has an effect of improving productivity.

The invention according to claim 8 of the present invention is the solid electrolysis according to claim 1, wherein a solid electrolyte comprising a composition containing a pi-electron conjugated polymer and / or other conductive polymer is used as a through-hole electrode. A method of manufacturing a capacitor, by making the solid electrolyte and the material of the solid electrolyte layer formed on the surface of the dielectric coating the same, the step of forming the through-hole electrode and the step of forming the solid electrolyte layer are performed continuously. Since the process can be performed in one step, the process can be simplified.

The invention according to claim 9 of the present invention is the method for producing a solid electrolytic capacitor according to claim 2, wherein any one of electroplating and electroless plating is used to form the through-hole electrode. Through-hole electrodes can be collectively formed uniformly and easily at desired locations.

In the invention according to claim 10 of the present invention, any one of dipping, spin coater, screen printing, film bonding method and spraying method is used as a method for forming a protective film. In the method for producing a solid electrolytic capacitor, since the film can be easily and uniformly formed on the surface of the aluminum foil, the reliability of the solid electrolytic capacitor can be improved. In addition, it also has an effect of contributing to the improvement of productivity.

The invention according to claim 11 of the present invention is the method for producing a solid electrolytic capacitor according to claim 1 or 2, wherein a photosensitive resin is used as a method for forming a protective film, and a photolithography method is used. It has an effect of easily and highly accurately forming an arbitrary pattern on the surface of the aluminum foil. As a result, since the connection terminals can be arranged with high precision, the reliability of the solid electrolytic capacitor can be improved and the solid electrolytic capacitor can be accurately connected.

According to a twelfth aspect of the present invention, the solid electrolytic capacitor according to the first or second aspect uses one of an epoxy resin, a polyimide resin, a silicon resin, an acrylic resin and a phenol resin as a protective film. And a method of complementing the operation of claim 1 or claim 2.

In addition, the protective film has an insulating property, a solvent resistance,
Since it has excellent heat resistance and adhesion to the aluminum foil that is the electrode part, it not only protects the surface of the aluminum foil from solvent, acid, etc. in the manufacturing process, but also protects the solid electrolytic capacitor from the external environment. A solid electrolytic capacitor having excellent insulation between electrodes can be provided.

According to a thirteenth aspect of the present invention, a composition containing a pi-electron conjugated polymer and / or a conductive polymer other than the pi-electron conjugated polymer is used as a material constituting the solid electrolyte layer. The method of manufacturing a solid electrolytic capacitor as described in (1) above, which complements the operation of (1) or (2). When a conductive polymer having a low specific resistance is used, the ESR can be further reduced, which has the effect of contributing to the improvement of high frequency characteristics.

According to a fourteenth aspect of the present invention, as a method for forming a solid electrolyte layer, a heterocyclic monomer is chemically polymerized by using an oxidizing agent, and a heterocyclic monomer is polymerized by applying an electric field. A method for producing a solid electrolytic capacitor according to claim 1 or 2, wherein at least one of electrolytic polymerization, application of a powder suspension of a conductive polymer, and application of a conductive polymer aqueous solution is used. Claim 1
Alternatively, the function of claim 2 is complemented. According to the above-mentioned forming method, the solid electrolyte layer can be formed also on the surface of the dielectric film in the fine etching pit hole, so that the electrostatic capacitance of the solid electrolytic capacitor can be effectively extracted.

According to a fifteenth aspect of the present invention, as a method of forming the solid electrolyte layer, a method of forming manganese dioxide by thermally decomposing manganese nitrate is used. This is a method for manufacturing a solid electrolytic capacitor, and it has an effect that electrodes can be selectively formed in a portion coated with manganese nitrate and that it can be manufactured at low cost.

In a sixteenth aspect of the present invention, as a method for forming a solid electrolyte layer, manganese dioxide is formed by thermally decomposing manganese nitrate, and then a heterocyclic monomer is polymerized using an oxidizing agent. At least one of chemical polymerization, electrolytic polymerization in which a heterocyclic monomer is polymerized by applying an electric field, application of a powder suspension of a conductive polymer, and application of an aqueous solution of a conductive polymer. The method for producing a solid electrolytic capacitor according to claim 2, wherein the conductive polymer can be uniformly and densely formed by forming the manganese dioxide layer on the surface of the dielectric film, which contributes to improvement of high frequency characteristics. Have an effect.

According to a seventeenth aspect of the present invention, a suspension of carbon fine particles and a conductive adhesive, or a suspension of carbon fine particles and a conductive paint is used as the current collector material. It is a manufacturing method of the solid electrolytic capacitor according to claim 2, ESR is reduced and high frequency characteristics are improved by improving the adhesiveness of the solid electrolyte layer which is a substantial electrode, and the collector layer which is an apparent electrode. Has the effect of contributing to the improvement of

The invention according to claim 18 of the present invention is the method for producing a solid electrolytic capacitor according to claim 2, wherein a conductive adhesive and a metal foil are used as the material of the connecting electrode. It has the effect of electrically connecting to the through-hole electrode. Electrically connecting the current collector layer and the through-hole electrode,
It serves to carry the electric charge of the solid electrolytic capacitor extracted by the collector layer to the through-hole electrode.

When a through-hole electrode is formed by using a conductive adhesive by bonding a metal foil to one side of a capacitor element through the conductive adhesive, it becomes easy to fill the through-hole with the conductive adhesive. It has an effect that a through-hole electrode can be easily formed.

When the through-hole electrode is formed by electroplating or electroless plating, the surface of the metal foil in the through-hole serves as a starting point for forming the through-hole electrode, and the through-hole electrode can be uniformly and easily formed at one time. .

The invention according to claim 19 of the present invention is the method for producing a solid electrolytic capacitor according to claim 1 or 2, wherein any one of a laser processing method and a grinding method is used as a method for forming an opening. This is a method and the opening can be formed by efficiently processing the protective film.

The invention according to claim 20 of the present invention is the method for producing a solid electrolytic capacitor according to claim 1 or 2, wherein any one of electroplating and electroless plating is used as a method for forming a connection terminal. This is a method, and the connection terminals can be uniformly and easily collectively formed at desired locations. As a result, the reliability of the solid electrolytic capacitor is improved and the productivity is improved.

The invention according to claim 21 of the present invention is the method for producing a solid electrolytic capacitor according to claim 1 or 2, wherein a conductive adhesive is used as a material for forming the connection terminal. Since it is easily cured, it has an effect of contributing to improvement in productivity.

[0035]

BEST MODE FOR CARRYING OUT THE INVENTION A method for manufacturing a solid electrolytic capacitor of the present invention will be described below with reference to embodiments and drawings.

(Embodiment 1) Claims 1, 3 to 8 and 10 to 1 according to Embodiment 1 of the present invention and FIGS.
The inventions described in Nos. 7 and 19 to 21 will be described.

FIG. 1 is a perspective view of a solid electrolytic capacitor according to Embodiment 1 of the present invention, FIG. 2 is a sectional view of the same, and FIG.
FIG. 4 is an enlarged cross-sectional view of the relevant part.

In FIGS. 1 to 3, reference numeral 20 denotes an aluminum foil having one surface roughened.
A dielectric film 27 is formed on the rough surface of No. 0. Further, a solid electrolyte layer 29 that serves as a substantial electrode is formed on the surface thereof, and functions as a capacitor together with the aluminum foil 20. The roughening of the aluminum foil 20 is performed in order to increase the surface area of the electrode portion and improve the capacitance of the solid electrolytic capacitor.

A current collector layer 30 is provided on the surface of the solid electrolyte layer 29 to facilitate the extraction of the electrode to the outside, and the current collector layer 30 is used as the through-hole electrode 2.
It is connected to the second connection terminal 32 via 8.

The through-hole electrode 28 is the through-hole 2
It is formed by filling the inside of 4 with a conductor, and is electrically insulated from the aluminum foil 20 by an insulating film 25.

The first connection terminal 31 is the aluminum foil 20.
And the first connection terminal 31 and the second connection terminal 32 are electrically insulated by the protective film 21. Further, the first and second connection terminals 31 and 32 are connected to the semiconductor component directly so that the first and second connection bumps 3 are formed.
3, 34 are provided respectively.

By arranging the first connecting terminal 31 and the second connecting terminal 32 on the same surface as described above, the semiconductor component can be directly connected to the solid electrolytic capacitor. As a result, wiring between components can be significantly shortened, and ESR and ESL can be reduced. Further, by arranging the connection terminals as shown in FIG. 1, current flows in the opposite directions, so that the magnetic fields cancel each other and the ESL can be reduced.

4 to 12 are sectional views showing the manufacturing process of the solid electrolytic capacitor.

In FIG. 4, a dielectric film 27 is formed on the rough surface on one side of the aluminum foil 20, and a protective film 21 is formed on the other side, and a through hole 24 is formed in a portion where a through hole electrode 28 is formed. This is shown in FIG.

Examples of the method for forming the protective film 21 include a spin coater, screen printing, a film bonding method, and a spray method, and any of these can form these films easily and with high productivity.

Next, the insulating film 25 is formed on the inner wall of the through hole 24.
FIG. 6 shows that the insulating film 25 is formed by an electrodeposition method, an insulating resin is applied so as to cover the exposed surface of the through hole 24 on the other side, and suction is applied from one side of the through hole 24. There is a method of doing.

When the electrodeposition method is used to form the insulating film 25, the highly reliable insulating film 25 can be uniformly formed on the inner wall of the through hole 24 of the aluminum foil 20 and the dielectric film 27. The material of the insulating film 25 is acrylic or epoxy resin, and the aluminum foil 20
Also, the insulating film 25 can be selectively formed by electrodeposition only on the inner wall of the through hole 24 of the dielectric film 27.

However, when the through hole 24 is a fine hole having a size of 100 μm or less, the through hole 24 is likely to be filled because the insulating film 25 formed by using a resin having a high edge covering property is thick. Therefore, the electrodeposition process is 2
The insulating resin is formed as the first layer, and then the insulating resin having a higher resistivity than the first layer and mixed with microgel, carbon fine particles, and titanium oxide fine particles is formed as the second layer. The method of doing is effective.

That is, according to the above method, the insulating film having a high resistivity is formed thinly in the first layer, and the mixed resin having a high edge covering property is formed in the second layer. Since the insulating film 25 having a low defect rate can be formed also on the inner wall of the through hole 24, the insulating film 25 having a high insulating property can be formed without filling the through hole 24.

When the method of applying the insulating resin so as to cover the exposed surface on the other surface of the through hole 24 and forming the insulating film 25 by suction from one side of the through hole 24, the insulating resin is applied. Examples of the method include a printing method, a dispenser method, and a potting method, and the insulating resin can be applied accurately and efficiently.

As a method of sucking from one side of the through hole 24, for example, a method of using an air pump or the like can be cited.

The insulating film 25 formed by the above method is shown in FIG. 14, and the insulating film 25 can be easily and efficiently formed on the entire inner wall of the through hole 24.

In addition, by the electrodeposition method, an insulating resin is applied so as to cover the exposed surface on the other surface side of the through hole 24, and the through hole 2 is formed.
It is also possible to combine the methods of suctioning from one side of No. 4 described above.

In this case, the insulating property between the aluminum foil 20 and the through-hole electrode 28 formed later is further improved,
As a result, the reliability of the solid electrolytic capacitor can be further improved.

Next, FIG. 7 shows a solid electrolyte layer 29 formed on the surface of the dielectric coating 27. As a method for forming the solid electrolyte layer 29, a heterocyclic monomer such as pyrrole or thiophene is mixed with sulfuric acid. A method for forming a polymer having conductivity by chemical polymerization in which an oxidizer such as ferric iron is used for polymerization, electrolytic polymerization in which an aluminum foil 20 is immersed in a heterocyclic monomer solution and an electric field is applied, and manganese nitrate is heated. A method of forming manganese dioxide by decomposing,
There are a method of applying a powder suspension of a conductive polymer, a method of applying a conductive polymer aqueous solution, and the like, and it is also possible to combine the above methods.

According to these materials and methods, the solid electrolyte layer 29 can be formed also on the surface of the dielectric film 27 in the fine etching pit holes, so that the capacitance of the solid electrolytic capacitor can be effectively extracted. be able to. Further, when the solid electrolyte layer 29 is an organic material, the solid electrolyte layer 29 is rich in flexibility, so that it is possible to prevent breakage during the process or the like.

As shown in FIG. 13, the dielectric coating 2
The solid electrolyte layer 29 may be formed not only on the surface of No. 7 but also on the exposed surface on one side of the insulating film 25.

Next, FIG. 8 shows the through-hole electrode 28 formed so as to fill the through-hole hole. As a method of forming the through-hole electrode 28, a method of filling a conductive adhesive and then hardening it, or forming a through-hole electrode 28 is used. Examples thereof include a method of using a solid electrolyte composed of a composition containing an electron conjugated polymer and / or a conductive polymer other than this.

In the former case, it is easy to apply and cure the conductive adhesive, so that the productivity can be improved. In the latter case, the material of the through-hole electrode 28 is the same as the material of the solid electrolyte layer 29. By setting the solid electrolyte layer 2
Since the step of forming 9 and the step of forming the through-hole electrode 28 can be continuously performed in one step, the steps can be simplified.

When a solid electrolyte composed of the latter pi-electron conjugated polymer and / or a composition containing a conductive polymer other than this is used as the through-hole electrode 28, the forming method is a heterocyclic system such as pyrrole or thiophene. A method of forming a polymer having conductivity by chemical polymerization in which a monomer is polymerized with an oxidizing agent such as ferric sulfate, or electrolytic polymerization in which an aluminum foil 20 is immersed in a heterocyclic monomer solution and an electric field is applied, Examples include a method of applying a powder suspension of a conductive polymer and a method of applying a conductive polymer aqueous solution.

Here, the through-hole electrode 28 is the collector layer 30.
Since it functions to carry the electric charge of the solid electrolytic capacitor extracted by the second connecting terminal 32, it is desirable to select a solid electrolyte having higher electric conductivity as a material.

Next, the current collector layer 30 is formed on the exposed surface on one side of the through-hole electrode 28 and the surface of the solid electrolyte layer 29.
9 is formed, and examples of the forming method include application of a suspension of carbon fine particles and a conductive adhesive, or a suspension of carbon fine particles and a conductive paint.

By the above method, the adhesion between the solid electrolyte layer 29, which is the actual electrode, and the current collector layer 30, which is the apparent electrode, is improved, thereby reducing the ESR and contributing to the improvement of high frequency characteristics. Have.

FIG. 10 shows an opening 37 provided at a predetermined position of the protective film 21. As a method of providing the opening 37, a laser processing method and a grinding method can be mentioned, and these methods are used. As a result, the protective film 21 can be efficiently processed to form the opening 37.

Next, the first connection terminal 31 is placed in the opening 37.
FIG. 11 shows that the first connection terminal 3 is formed.
Examples of the method of forming No. 1 include a method of applying a conductive adhesive and then curing it, electroplating, electroless plating, and the like.

In the case of applying a conductive adhesive, productivity can be improved because application and curing are easy.
In the case of electroplating or electroless plating, the protective film 2 except for the opening 37 and the exposed surface on the other surface of the through-hole electrode 28.
Since the through-hole electrode 28 is covered with the first contact terminal 31, the first connecting terminal 31 can be uniformly and easily formed collectively by covering and protecting the exposed surface and the one-side surface of the through-hole electrode 28 on the other surface side with an insulating tape or the like.

The second connection terminal 32 is the through-hole electrode 28.
Although it is the exposed surface on the other surface side, electroplating or electroless plating may be performed as necessary to form the second connection terminal 32 in order to improve the connection with the semiconductor component. In that case,
The first connecting terminal 31 and the second connecting terminal 32 are formed by covering and protecting only one side with the insulating tape or the like.
Can be collectively formed.

In FIG. 12, first and second connection bumps 33 and 34 made of solder, gold, tin, silver or the like are formed on the exposed surfaces of the first connection terminal 31 and the through-hole electrode 28 of FIG. As a result, direct connection with semiconductor components becomes possible.

According to the above manufacturing method, low ESR is achieved.
And a low ESL, and a solid electrolytic capacitor having excellent high frequency characteristics can be easily provided.

(Embodiment 2) The invention according to claims 2, 9 and 18 will be described with reference to Embodiment 2 of the present invention and FIGS.

15 to 19 are sectional views showing the steps of manufacturing the solid electrolytic capacitor in the second embodiment. Figure 1
Reference numeral 5 denotes a solid electrolyte layer 29 of FIG. 7 of the first embodiment, on which a current collector layer 30 is formed, which is manufactured by the same method as that of the first embodiment.

Next, FIG. 16 shows the connection electrode 38 formed on the surface of the current collector layer 30 and the exposed surface on one side of the through hole 24.

The connection electrode 38 uses a conductive adhesive and a metal foil as materials, and the connection electrode 38 electrically connects the collector layer 30 and the through-hole electrode 28,
It serves to carry the electric charge of the solid electrolytic capacitor extracted by the collector layer 30 to the through-hole electrode 28. Therefore, it is desirable to use a metal having a relatively high electric conductivity, such as silver or copper, for the metal foil.

Next, FIG. 17 shows a through hole electrode 28 formed so as to fill the inside of the through hole. As a method of forming this through hole electrode 28, a method of applying a conductive adhesive and curing it, electroplating, Electrolytic plating is included.

The method of applying and curing the conductive adhesive is
Since it is easy to fill and cure the conductive adhesive in the through hole, it has high productivity.

In the case of electroplating or electroless plating, it is possible to uniformly and easily collectively form the through-hole electrodes 28 in the through-holes by covering the entire surface on one side with an insulating tape or the like. It also has the effect of improving reliability and contributing to improvement of productivity.

Next, an opening 37 is provided at a predetermined position of the protective film in FIG. 18, and the first connecting terminal 31 is provided in this opening 37.
FIG. 19 shows that the first embodiment is formed.
It is manufactured by the same method as.

The second connection terminal 32 is the through-hole electrode 28.
Although it is the exposed surface on the other surface side, electroplating or electroless plating may be performed as necessary to form the second connection terminal 32 in order to improve the connection with the semiconductor component. In that case,
The first connecting terminal 31 and the second connecting terminal 32 are formed by covering and protecting only one side with the insulating tape or the like.
Can be collectively formed.

As shown in FIG. 12 of the first embodiment, first and second connection bumps made of solder, gold, tin, silver or the like are formed on the exposed surfaces of the first connection terminal 31 and the through-hole electrode 28 of FIG. By forming 33 and 34, direct connection with a semiconductor component becomes possible.

The second embodiment differs from the first embodiment in that the connection electrode 38 is provided, which has the following advantages.

That is, when a conductive adhesive is used to form the through-hole electrode 28, the connecting electrode 38 is formed and then the through-hole electrode 28 is formed, so that the through-hole 24 can be easily filled with the conductive adhesive. This has the effect of easily forming the electrode 28.

When electroplating or electroless plating is used to form the through-hole electrode 28, the connection electrode 38 serves as a starting point for forming the through-hole electrode 28.

That is, electroplating is performed as a method of forming the through-hole electrode 28 by forming the connection electrode 38.
It is possible to use electroless plating, and it is possible to broaden the selection range regarding the method of forming the through-hole electrode 28.

Further, the current collector layer 30 and the through-hole electrode 2
As the conductive path for electrically connecting 8 to each other, the connection electrode 38 made of a conductive adhesive is provided in addition to the connection electrode 38 made of a metal foil, which facilitates the transfer of charges, and as a result, improves the high frequency characteristics. is there.

According to the above manufacturing method, low ESR is achieved.
And a low ESL, and a solid electrolytic capacitor having excellent high frequency characteristics can be easily provided.

[0086]

As described above, the present invention has a low ESR and a low E.
It is possible to realize SL, easily provide a solid electrolytic capacitor having excellent high frequency characteristics, and realize high productivity, and its industrial value is great.

[Brief description of drawings]

FIG. 1 is a perspective view of a solid electrolytic capacitor according to an embodiment of the present invention.

FIG. 2 is a sectional view of the same.

FIG. 3 is an enlarged cross-sectional view of the relevant part.

FIG. 4 is a cross-sectional view of the aluminum foil with a protective film formed on the other surface side.

FIG. 5 is a cross-sectional view of the aluminum foil with through holes formed therein.

FIG. 6 is a sectional view showing a state in which an insulating film is formed on the inner wall of the through hole.

FIG. 7 is a cross-sectional view of a state in which a solid electrolyte layer is formed on the surface of the dielectric film.

FIG. 8 is a sectional view showing a state where a conductor is filled in the through hole.

FIG. 9 is a cross-sectional view showing a state in which a current collector layer is formed on the surface of the solid electrolyte layer and the exposed surface on one side of the through-hole electrode.

FIG. 10 is a sectional view showing a state in which an opening is provided in the protective film.

FIG. 11 is a sectional view showing a state in which a first connection terminal is formed in the opening.

FIG. 12 is a sectional view showing a state in which the connection bumps are formed.

FIG. 13 is a cross-sectional view showing a state in which a solid electrolyte layer is formed on the surface of the dielectric film and the exposed surface on one side of the insulating film.

FIG. 14 is a sectional view showing a state in which the insulating film is formed.

FIG. 15 is a cross-sectional view showing a state where a current collector layer is formed on the surface of the solid electrolyte layer.

FIG. 16 is a cross-sectional view showing a state in which a connection electrode is formed on the surface of the current collector layer and the exposed surface on one side of the through hole.

FIG. 17 is a cross-sectional view showing a state where a conductor is filled in the through hole.

FIG. 18 is a sectional view showing a state in which an opening is provided in the protective film.

FIG. 19 is a sectional view showing a state in which a first connection terminal is formed in the opening.

[Explanation of symbols]

20 aluminum foil 21 Protective film 24 Through hole 25 insulating film 27 Dielectric coating 28 Through-hole electrode 29 Solid electrolyte layer 30 Current collector layer 31 First connection terminal 32 Second connection terminal 33 First connection bump 34 Second connection bump 37 opening 38 Connection electrode

Front page continuation (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01G 9/14 H01G 9/02 331H 13/00 371 321 9/24 A 9/05 H (72) Inventor Tatsuo Fujii Osaka 1006 Kadoma, Kadoma City, Fuchu, Matsushita Electric Industrial Co., Ltd. (72) Inventor Shin Nakano 1006 Kadoma, Kadoma City, Osaka Prefecture 72 Inventor, Matsushita Electric Industrial Co., Ltd. Ryo Kimura 1006 Kadoma, Kadoma City, Osaka Matsushita F term in Denki Sangyo Co., Ltd. (reference) 5E082 AA01 AB09 BC14 EE03 EE15 EE42 GG01 GG28 JJ06 JJ26 LL29 MM05 MM22 MM28

Claims (21)

[Claims] 1. A dielectric film is formed on a rough surface of one side of an aluminum foil, and a protective film is formed on the other side of the aluminum foil, and through-hole holes are formed so as to penetrate the dielectric film, the aluminum foil and the protective film. The insulating film is formed on the inner wall of the through hole, the solid electrolyte layer is formed on the surface of the dielectric film, and the through hole electrode is formed so as to fill the through hole. A current collector layer is formed on the exposed surface and the surface of the solid electrolyte layer, an opening is provided at a predetermined position of the protective film, a first connection terminal is provided in this opening, and the other surface side of the through-hole electrode is formed. A method for manufacturing a solid electrolytic capacitor, wherein a second connection terminal is formed on each exposed surface. 2. A dielectric film is formed on a rough surface of one side of an aluminum foil, and a protective film is formed on the other side of the aluminum foil, and through-hole holes are formed so as to penetrate the dielectric film, the aluminum foil and the protective film. Formed in a position, an insulating film is formed on the inner wall of the through hole, a solid electrolyte layer is formed on the surface of the dielectric film, and a current collector layer is formed on the surface of the solid electrolyte layer.
A connection electrode is formed on the surface of the current collector layer and the exposed surface on one side of the through-hole, a through-hole electrode is formed so as to fill the inside of the through-hole, and an opening is provided at a predetermined position of the protective film. A method for manufacturing a solid electrolytic capacitor, wherein a first connection terminal is formed in an opening and a second connection terminal is formed on an exposed surface of the through-hole electrode on the other surface side. 3. A method of forming an insulating film, wherein at least one of an electrodeposition method and a method of applying an insulating resin so as to cover the exposed surface of the other side of the through hole and sucking from one side of the through hole is used. Item 1. A method of manufacturing a solid electrolytic capacitor according to Item 1 or 2. 4. An insulating film in which an insulating resin is formed as a first layer by an electrodeposition method as an insulating film, and the resistivity is higher than that of the first layer and microgel, carbon fine particles and titanium oxide fine particles are mixed. The method for producing a solid electrolytic capacitor according to claim 3, wherein a resin is formed as the second layer. 5. The method for producing a solid electrolytic capacitor according to claim 3, wherein any one of printing, dispenser and potting is used as a method of applying the insulating resin. 6. The method for producing a solid electrolytic capacitor according to claim 1, wherein at least one of a laser processing method, a punching processing method and a drill processing method is used as a method of forming the through hole. 7. The method for producing a solid electrolytic capacitor according to claim 1, wherein a method of applying a conductive adhesive and curing the same is used to form the through-hole electrode. 8. The method for producing a solid electrolytic capacitor according to claim 1, wherein a solid electrolyte made of a composition containing a pi-electron conjugated polymer and / or a conductive polymer other than this is used as the through-hole electrode. 9. The method for producing a solid electrolytic capacitor according to claim 2, wherein either electroplating or electroless plating is used to form the through-hole electrode. 10. The method for producing a solid electrolytic capacitor according to claim 1, wherein any one of dipping, spin coater, screen printing, film bonding method and spraying method is used as a method for forming the protective film. 11. The method according to claim 1, wherein a photosensitive resin is used as a method for forming the protective film, and a photolithography method is used.
A method for manufacturing a solid electrolytic capacitor as described in. 12. The method for producing a solid electrolytic capacitor according to claim 1, wherein any one of epoxy resin, polyimide resin, silicon resin, acrylic resin, and phenol resin is used as the protective film. 13. The method for producing a solid electrolytic capacitor according to claim 1, wherein a composition containing a pi-electron conjugated polymer and / or a conductive polymer other than this is used as a material forming the solid electrolyte layer. 14. A method for forming a solid electrolyte layer, comprising:
Chemical polymerization in which a heterocyclic monomer is polymerized using an oxidizing agent,
The method according to claim 1 or 2, wherein at least one of electrolytic polymerization in which a heterocyclic monomer is polymerized by applying an electric field, application of a powder suspension of a conductive polymer, and application of an aqueous solution of a conductive polymer is used. A method for producing the solid electrolytic capacitor described. 15. A method for forming a solid electrolyte layer, comprising:
The method for producing a solid electrolytic capacitor according to claim 1 or 2, wherein a method of forming manganese dioxide by thermally decomposing manganese nitrate is used. 16. A method for forming a solid electrolyte layer, comprising:
After manganese dioxide is formed by thermally decomposing manganese nitrate, chemical polymerization in which a heterocyclic monomer is polymerized with an oxidizing agent, electrolytic polymerization in which a heterocyclic monomer is polymerized by applying an electric field, and a conductive polymer powder The method for producing a solid electrolytic capacitor according to claim 1 or 2, wherein at least one method of applying a suspension and applying a conductive polymer aqueous solution is used. 17. The solid electrolytic capacitor according to claim 1, wherein a suspension of carbon fine particles and a conductive adhesive, or a suspension of carbon fine particles and a conductive paint is used as the current collector material. Production method. 18. The method for producing a solid electrolytic capacitor according to claim 2, wherein a conductive adhesive and a metal foil are used as the material of the connection electrode. 19. The method for producing a solid electrolytic capacitor according to claim 1, wherein any one of a laser processing method and a grinding method is used as a method of forming the opening. 20. A method of forming a connection terminal using either electroplating or electroless plating.
Alternatively, the method for manufacturing the solid electrolytic capacitor according to claim 2. 21. The method for producing a solid electrolytic capacitor according to claim 1, wherein a conductive adhesive is used as a material forming the connection terminal.