JP2003031439A - Method for producing solid electrolytic capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for producing a solid electrolytic capacitor exhibiting excellent high frequency characteristics and mountability. SOLUTION: A through hole 24 is made through an aluminum foil 20, a resist film 22 is formed on one side of the aluminum foil 20 and a resist film 23 is formed on the other side thereof. An insulation film 25 is then formed on the exposed part of the aluminum foil 20 and on the inner wall of the through hole 24. Subsequently, the resist film 23 is removed and the aluminum foil 20 is etched, a dielectric film 27 is formed on the surface thereof and a through hole electrode 28 is formed in the through hole. Thereafter, a solid electrolytic layer 29 and a current collector layer 30 are formed on the dielectric film 27, the resist film 22 is removed, a first connection terminal 31 is formed at that part and a second connection terminal 32 is formed on the exposed surface of the through hole electrode 28.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a solid electrolytic capacitor, and more specifically, it reduces an equivalent series resistance (hereinafter referred to as ESR) and an equivalent series inductance (hereinafter referred to as ESL), and a semiconductor. The present invention relates to a method for manufacturing a solid electrolytic capacitor that can be directly connected to parts.

[0002]

2. Description of the Related Art In recent years, as electronic equipment becomes more portable and has higher performance, solid electrolytic capacitors, which are electronic components, are also required to have large capacity and excellent high frequency characteristics. In order to meet the demands of this market, investigations have been made from various angles such as the surface condition of the electrode portion, the method for forming the dielectric coating, the development and improvement of the solid electrolyte layer, the surface condition of the electrode layer, and the structure of the capacitor element.

In a conventional solid electrolytic capacitor, a foil or a sintered body of a metal such as aluminum or tantalum having a valve action is used as an electrode portion, and a dielectric film is formed on the surface of the metal foil or the sintered body by anodic oxidation. Then, a solid electrolyte layer using a transition metal oxide such as Mn or Pb is formed on the surface, a current collector layer is formed on the surface of the solid electrolyte layer, and an electrode layer is provided to form a capacitor element. The electrode part and the electrode layer of this capacitor element were respectively connected to the connection terminals, and the exterior was formed so as to expose the connection terminals.

[0004]

However, since the conventional solid electrolytic capacitor is mounted on the circuit board through the connection terminal, when the characteristics of the solid electrolytic capacitor as a circuit are examined, the solid electrolytic capacitor is connected from the electrode portion and the electrode layer. Not only the conduction path to the terminals, but also the wiring part on the circuit board affects the high frequency characteristics. Therefore, the ESL was large and the high frequency characteristics were poor.

The present invention solves the above-mentioned problems, and by arranging the first connection terminal and the second connection terminal on the same surface, they can be directly connected to a semiconductor component, thereby realizing low ESR and low ESL. It is an object of the present invention to provide a method for manufacturing a solid electrolytic capacitor having excellent high frequency characteristics.

[0006]

In order to solve the above problems, the invention according to claim 1 of the present invention is to form a through hole in a portion of an aluminum foil where a through hole electrode is formed, and After forming a resist film on the part that forms one connection terminal and a resist film on the other surface, form an insulating film on the exposed part of the aluminum foil and the inner wall of the through hole, and then on the other surface of the aluminum foil. The resist film is removed to etch the aluminum foil, a dielectric film is formed on the surface of the aluminum foil, and then a through hole electrode is formed in the through hole, and then a solid electrolyte layer and a current collector layer are formed on the surface of the dielectric film. Then, after removing the resist film in the portion where the first connection terminal is formed, the first connection terminal is formed in this portion and the second connection is formed in the exposed surface of the through-hole electrode. A method for producing a solid electrolytic capacitor which forms a child, respectively, the semiconductor component can be easily provide superior solid electrolytic capacitor of the high frequency characteristics can be connected directly to, and can achieve high productivity.

According to a second aspect of the present invention, the through hole is formed in the portion of the aluminum foil where the through hole electrode is formed, and the resist film is formed in the portion where the first connection terminal is formed on one side of the aluminum foil. After forming the resist film on the other surface as well, an insulating film is formed on the exposed portion of the aluminum foil and the inner wall of the through hole, and then the resist film on the other surface of the aluminum foil is removed to etch the aluminum foil, After forming a dielectric film on the surface and then forming a through-hole electrode in the through-hole, a resist film is formed on one surface of the aluminum foil, and then a solid electrolyte layer is formed on the surface of the dielectric film. After removing the resist film on the entire surface of one side of the aluminum foil and forming a current collector layer on the surface of the solid electrolyte layer, a portion of the portion for forming the first connection terminal is formed. A method for manufacturing a solid electrolytic capacitor, comprising forming a first connection terminal on this portion and a second connection terminal on the exposed surface of a through-hole electrode after removing the dysto film, and in addition to the function of claim 1, By forming a resist film on the entire surface of one side of the aluminum foil after forming the through-hole electrode in the through-hole, it is possible to prevent a short circuit between the aluminum foil and the through-hole electrode on one side of the aluminum foil when forming the solid electrolyte layer. It has the effect of contributing to the improvement of the reliability of the electrolytic capacitor.

According to a third aspect of the present invention, a through hole is formed in a portion of the aluminum foil where a through hole electrode is formed, and a resist film is formed in a portion of the aluminum foil where a first connection terminal is formed. After forming the resist film on the other surface as well, an insulating film is formed on the exposed portion of the aluminum foil and the inner wall of the through hole, and then the resist film on the other surface of the aluminum foil is removed to etch the aluminum foil, After forming a dielectric film on the surface, then forming a resist film on the entire surface of one side of the aluminum foil, forming a through hole electrode in the through hole, and then forming a solid electrolyte layer on the surface of the above dielectric film. After removing the resist film on the entire surface of one side of the aluminum foil and forming a current collector layer on the surface of the solid electrolyte layer, the resist for the portion where the first connection terminal is formed A method for producing a solid electrolytic capacitor, comprising the steps of forming a first connection terminal at this portion and a second connection terminal at the exposed surface of a through-hole electrode after removing the film. In addition, since the resist film is formed on one surface of the aluminum foil when forming the through-hole electrode, there is an advantage that the conductive adhesive is easily filled and the through-hole electrode is easily formed. Therefore, it has an effect of contributing to the improvement of productivity and an effect of improving the reliability of the solid electrolytic capacitor.

According to a fourth aspect of the present invention, the step of forming the current collector layer is performed before the step of removing the resist film on one surface of the aluminum foil. A method of manufacturing a solid electrolytic capacitor, wherein when the material of the resist film for forming the first connection terminal and the resist film on the entire surface of one side of the aluminum foil are the same, the resist film for the portion for forming the first connection terminal And the removal of the resist film on the entire surface of one side of the aluminum foil can be continuously performed in one step, which has the effect of simplifying the steps.

The invention according to claim 5 of the present invention uses at least one of a laser machining method, a punching machining method, a drill machining method, an electric discharge machining method and an etching method as a method of forming a through hole. A method for manufacturing a solid electrolytic capacitor according to any one of 1 to 3,
Through-holes can be formed easily and with high accuracy. As a result, it is effective in stabilizing the performance and improving the reliability of the solid electrolytic capacitor.

The invention according to claim 6 of the present invention is the method for producing a solid electrolytic capacitor according to any one of claims 1 to 3, wherein the edge of the through hole on the surface on which the dielectric film is formed is chamfered. The purpose of this is to remove burrs that may occur when forming the through-hole, and when forming the solid electrolyte layer, prevent short circuit between the electrode part and the solid electrolyte, and prevent short circuit from occurring. Has the effect of suppressing.

According to a seventh aspect of the present invention, the solid electrolytic capacitor according to any one of the first to third aspects uses a photosensitive resin or an adhesive organic film as a resist film. It is a manufacturing method and has an effect of easily and highly accurately forming an arbitrary pattern on the surface of the aluminum foil. As a result, since the connection terminals can be arranged with high precision, the reliability of the solid electrolytic capacitor can be improved and the solid electrolytic capacitor can be accurately connected. In addition, when an organic film is used, there is an advantage that the process can be simplified and the resist film can be easily peeled off later.

The invention according to claim 8 of the present invention uses any one of dipping, spin coater, screen printing, film bonding method and spraying method as a method for forming a resist film. In the method for producing a solid electrolytic capacitor described in No. 3, the resist film can be easily and uniformly formed on the surface of the aluminum foil, so that the reliability of the solid electrolytic capacitor can be improved.
In addition, it also has an effect of contributing to the improvement of productivity.

According to a ninth aspect of the present invention, the insulating film is formed of epoxy resin, polyimide resin, silicon resin,
The method for producing a solid electrolytic capacitor according to any one of claims 1 to 3 using either an acrylic resin or a phenol resin, and complements the effects of claims 1 to 3.

In addition, the insulating film has insulating properties, solvent resistance,
Since it has excellent heat resistance and adhesion to the aluminum foil that is the electrode part, it not only protects the surface of the aluminum foil from solvent, acid, etc. in the manufacturing process, but also protects the solid electrolytic capacitor from the external environment. A solid electrolytic capacitor having excellent insulation between electrodes can be manufactured.

The invention according to claim 10 of the present invention is the method for producing a solid electrolytic capacitor according to any one of claims 1 to 3, wherein an insulating resin is formed by an electrodeposition method as a method for forming an insulating film. Thus, an insulating film having excellent reliability can be uniformly formed at a desired location, so that the insulating property between the aluminum foil and the through-hole electrode is improved. As a result,
This has the effect of improving the reliability of the solid electrolytic capacitor.

According to an eleventh aspect of the present invention, an insulating resin is formed as a first layer by an electrodeposition method as an insulating film, and then one layer is formed by mixing microgel, carbon fine particles and titanium oxide fine particles. The method for producing a solid electrolytic capacitor according to any one of claims 1 to 3, wherein an insulating resin having higher conductivity than the eyes is formed as the second layer.
By stacking two layers of resins having different properties, it is possible to obtain an insulating film that completely covers the inner wall and the edge portion of the through-hole, and that has both properties such as heat resistance and thickness ensuring.

The invention according to claim 12 of the present invention uses a method of filling with a conductive adhesive and then curing it to form a through-hole electrode. This is a method for manufacturing a capacitor, and since it is easy to fill and harden the through holes, it has an effect of contributing to improvement in productivity.

The invention according to claim 13 of the present invention is the method for producing a solid electrolytic capacitor according to any one of claims 1 to 3, wherein a conductive adhesive is used as a material for forming the connection terminal. Since it is easy to apply and cure, it has an effect of contributing to the improvement of productivity.

According to a fourteenth aspect of the present invention, the solid electrolytic method according to any one of the first to third aspects uses one of electroplating and electroless plating as a method for forming a connection terminal. This is a method of manufacturing a capacitor, and connection terminals can be uniformly and easily collectively formed at desired locations. As a result, the reliability of the solid electrolytic capacitor is improved and the productivity is improved.

The invention according to claim 15 of the present invention is any one of claims 1 to 3 in which a composition containing a pi-electron conjugated polymer and / or a conductive polymer other than this is used as a material constituting the solid electrolyte layer. In the method for producing a solid electrolytic capacitor described in any one of the above, when a conductive polymer having a low specific resistance is used, the ESR can be further reduced, and it has an effect of contributing to improvement of high frequency characteristics.

According to a sixteenth aspect of the present invention, as a method for forming a solid electrolyte layer, a chemical polymerization in which a heterocyclic monomer is polymerized by using an oxidizing agent, or a heterocyclic monomer is polymerized by applying an electric field. The method for producing a solid electrolytic capacitor according to any one of claims 1 to 3, wherein at least one of electrolytic polymerization, coating of a powder suspension of a conductive polymer, and coating of a conductive polymer aqueous solution is used. According to the above-mentioned forming method, the solid electrolyte layer can be formed also on the surface of the dielectric coating film in the fine etching pit hole, so that the capacitance of the solid electrolytic capacitor can be effectively obtained.

According to a seventeenth aspect of the present invention, as a method for forming the solid electrolyte layer, a method for forming manganese dioxide by thermally decomposing manganese nitrate is used. In the method for producing a solid electrolytic capacitor described in (3), the electrode can be selectively formed on the portion coated with manganese nitrate, and the solid electrolytic capacitor can be produced at low cost.

According to the eighteenth aspect of the present invention, as a method of forming a solid electrolyte layer, manganese dioxide is formed by thermally decomposing manganese nitrate, and then a heterocyclic monomer is polymerized using an oxidizing agent. At least one of chemical polymerization, electrolytic polymerization in which a heterocyclic monomer is polymerized by applying an electric field, application of a powder suspension of a conductive polymer, and application of an aqueous solution of a conductive polymer. 3. The method for producing a solid electrolytic capacitor as described in any one of 3, wherein a conductive polymer can be uniformly and densely formed by forming a manganese dioxide layer on the surface of a dielectric film, and thus high frequency characteristics are improved. Has the effect of contributing to.

According to a nineteenth aspect of the present invention, a suspension of carbon fine particles and a conductive adhesive, or a suspension of carbon fine particles and a conductive paint is used as the current collector material. 3. The method for producing a solid electrolytic capacitor as described in any one of 3, wherein the ESR is reduced by improving the adhesion between the solid electrolyte that is the actual electrode and the current collector layer that is the apparent electrode, It has the effect of contributing to the improvement of high frequency characteristics.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION A method for manufacturing a solid electrolytic capacitor of the present invention will be described below with reference to embodiments and drawings.

(Embodiment 1) The invention described in claims 1 and 5 to 19 will be described with reference to the first embodiment of the present invention and FIGS.

FIG. 1 is a perspective view of a solid electrolytic capacitor according to a first embodiment of the present invention, FIG. 2 is a sectional view of the same, and FIG.
FIG. 4 is an enlarged cross-sectional view of the relevant part.

2 to 3, reference numeral 20 denotes an aluminum foil, the other surface side of which is roughened.
A dielectric film 27 is formed on the surface of No. 6. Further, a solid electrolyte layer 29 that serves as a substantial electrode is formed on the surface thereof, and functions as a capacitor together with the aluminum foil 20. The roughening of the aluminum foil 20 is performed in order to increase the surface area of the electrode portion and improve the capacitance of the solid electrolytic capacitor.

A current collector layer 30 is provided on the surface of the solid electrolyte layer 29 in order to facilitate the extraction of the electrode to the outside, and the current collector layer 30 is used as the through-hole electrode 2.
It is connected to the second connection terminal 32 via 8.

The through-hole electrode 28 is the through-hole 2
It is formed by filling the inside of 4 with a conductor, and is electrically insulated from the aluminum foil 20 by an insulating film 25.

The first connection terminal 31 is the aluminum foil 20.
And the first connection terminal 31 and the second connection terminal 32 are electrically insulated by the insulating film 25. Further, connection bumps 33 and 34 are provided on the connection terminals 31 and 32, respectively, in order to directly connect to the semiconductor component.

By arranging the first connection terminal 31 and the second connection terminal 32 on the same surface as described above, the semiconductor component can be directly connected to the solid electrolytic capacitor. As a result, wiring between components can be significantly shortened, and ESR and ESL can be reduced. Further, by arranging the connection terminals as shown in FIG. 1, current flows in the opposite directions, so that the magnetic fields cancel each other and the ESL can be reduced.

4 to 15 are sectional views showing the manufacturing process of the solid electrolytic capacitor.

In FIG. 4, a through hole 24 is formed in the aluminum foil 20. The through hole 24 can be formed at an arbitrary position with high accuracy by using any one of a laser processing method, a punching processing method, a drill processing method, an electric discharge processing method, and an etching method.

Next, as shown in FIG. 5, the aluminum foil 20 is used.
The resist film 2 is formed on the surface of one side where the first connection terminal is to be formed.
2 is formed, and the resist film 23 is also formed on the other surface. As the resist films 22 and 23, either a photosensitive resin or an organic film having adhesiveness is used, and as a method for forming these, dipping, spin coater, screen printing, film bonding method, and spray method are used. These resist films 22 and 23 can be formed easily and with high productivity. When a photosensitive resin is used, there is an advantage that coating and curing are easy, and when an organic film is used, the process can be simplified and the resist films 22 and 23 can be easily peeled off later. There is an advantage.

FIG. 6 shows an insulating film 25 formed on the exposed part of the aluminum foil 20 and the inner wall of the through hole 24. As a method of forming the insulating film 25, a method of forming an insulating resin by an electrodeposition method is used. Thus, the highly reliable insulating film 25 can be uniformly formed on the exposed portion of the aluminum foil 20 and the inner wall of the through hole 24. The material of the insulating film 25 is epoxy resin, polyimide resin,
Silicon resin, acrylic resin, or phenol resin, which is electrodeposited only on the exposed portion of the aluminum foil 20 and the inner wall of the through hole 24 to form the resist film 22, 2.
Since the electrode 3 is not electrodeposited, the insulating film 25 can be selectively formed.

However, when the through hole 24 is a fine hole of 100 μm or less, the through hole 24 is likely to be filled because the insulating film 25 formed by using a resin having a high edge covering property is thick. Therefore, the electrodeposition process is 2
The insulating resin is formed as the first layer, and then the insulating resin having higher conductivity than the first layer, which is a mixture of microgel, carbon particles, and titanium oxide particles, is formed as the second layer. The method of doing is effective. That is, according to the above method, the insulating film having a high resistivity is formed thinly in the first layer, and the mixed resin having a high edge covering property is formed in the second layer. Since a small amount of the insulating film 25 can be formed on the inner wall of the through hole 24, the insulating film 25 having a high insulating property can be formed without filling the through hole 24.

FIG. 7 shows that the resist film 23 on the other surface is removed, and FIG. 8 shows that the roughened portion 26 is provided by etching on the surface of the aluminum foil 20 from which the resist film 23 has been removed. As a method of forming the roughened portion 26,
In some cases, immersion in an acid solution is performed and a predetermined electric field is applied, or only immersion in an acid solution is performed.

Next, FIG. 9 shows a dielectric film 27 formed on the surface of the roughened aluminum foil 20. The method for forming the dielectric film 27 is, for example, an aqueous solution of ammonium adipate or an aqueous solution of boric acid and borax. Among them, a method of anodizing the aluminum foil 20 and the like can be mentioned. Prior to the step of forming the dielectric coating 27, the aluminum foil 2
Chamfering may be performed around the 0 through hole 24. This is performed to remove burrs that may occur when forming the through-holes 24, and when forming the solid electrolyte layer 29, the covering property of the insulating film 25 at the edge of the through-holes 24 is improved. By increasing it, it has the effect of preventing a short circuit between the electrode part and the solid electrolyte and suppressing the occurrence of a short circuit.

Next, FIG. 10 shows a through hole electrode 28 formed by a method of filling the inside of the through hole 24 with a conductive adhesive and curing the same. The inside of the through hole 24 can be easily filled and cured. The through-hole electrode 28 can be easily formed.

A solid electrolyte layer 29 is formed on the surface of the dielectric film 27.
FIG. 11 shows the formation of the above. The solid electrolyte layer 29 is
Having electrical conductivity by chemical polymerization in which a heterocyclic monomer such as pyrrole or thiophene is polymerized using an oxidizing agent such as ferric sulfate, or electrolytic polymerization in which an aluminum foil 20 is immersed in a heterocyclic monomer solution and an electric field is applied There is a method of forming a polymer, a method of forming manganese dioxide by thermally decomposing manganese nitrate, a method of applying a powder suspension of a conductive polymer, a method of applying a conductive polymer aqueous solution, and the like. It is also possible to combine the above methods.
According to these materials and methods, the solid electrolyte layer 29 can be formed also on the surface of the dielectric film 27 in the fine etching pit holes of the roughened portion 26, so that the capacitance of the solid electrolytic capacitor can be improved. You can effectively withdraw.
Further, when the solid electrolyte layer 29 is an organic material, the solid electrolyte layer 29 is rich in flexibility, so that it is possible to prevent breakage during the process or the like.

FIG. 12 shows the current collector layer 30 formed on the surface of the solid electrolyte layer 29. The method for forming the current collector layer 30 is as follows: suspension of carbon fine particles and conductive adhesive, or suspension of carbon fine particles and Application of a conductive paint may be mentioned. Solid electrolyte layer 2 which is an actual electrode by the above method
By improving the adhesiveness between 9 and the current collector layer 30 that is an apparent electrode, it has an effect of reducing ESR and contributing to improvement of high frequency characteristics.

Next, FIG. 13 shows the resist film 22 on one surface of the portion where the first connection terminal is to be formed removed by a method such as immersion in a chemical solution, and FIG. 14 shows the first connection terminal 31 formed. It is sectional drawing of a state. First connection terminal 3
Examples of the method of forming No. 1 include a method of applying a conductive adhesive and then curing it, electroplating, electroless plating, and the like. In the case of applying the conductive adhesive, the application and curing are easy, so that the productivity can be improved, and in the case of electroplating or electroless plating, the portion forming the first connection terminal 31 and the through hole. Since the exposed portion of the electrode 28 is covered with the insulating film 25, the exposed portion of the through-hole electrode 28 and the back side thereof are covered and protected by an insulating tape or the like, so that the first connection terminal 31 can be uniformly and easily formed. It can be formed collectively. The second connection terminal 32 becomes an exposed portion of the through-hole electrode 28, but in order to improve the connection with the semiconductor component, electroplating or electroless plating is performed as necessary to form the second connection terminal 32. May be. In that case, the first connecting terminal 31 and the second connecting terminal 32 can be collectively formed by covering and protecting only the back side with the insulating tape or the like.

FIG. 15 shows connection bumps 33 and 34 made of solder, gold, tin, silver or the like formed on the exposed portions of the connection terminal 31 and the through-hole electrode 28 shown in FIG. Can be directly connected.

According to the above manufacturing method, low ESR is achieved.
And a low ESL, and a solid electrolytic capacitor having excellent high frequency characteristics can be easily provided.

(Embodiment 2) The invention according to claim 2 will be described with reference to Embodiment 2 of the present invention and FIGS.

In FIG. 16, as shown in FIG. 10 of the first embodiment, a through hole electrode 28 is formed by a method of filling the inside of the through hole 24 with a conductive adhesive and curing it, and then forming the through hole electrode 28 on one entire surface of the aluminum foil 20. The resist film 35 is formed.

Subsequently, FIG. 17 shows a solid electrolyte layer 29 formed on the surface of the dielectric film 27.
By forming the resist film 35 on the entire surface of one side of the aluminum foil 20 before forming 9, the short-circuit between the aluminum foil 20 and the through-hole electrode 28 on one side of the aluminum foil 20 when forming the solid electrolyte layer 29 is prevented. This has the effect of contributing to the improvement of the reliability of the solid electrolytic capacitor.

The resist film 35 is composed of the resist film 22,
As in the case of No. 23, either a photosensitive resin or an organic film having adhesiveness is used.
The use of dipping, a spin coater, screen printing, a film adhesion method, and a spray method can be mentioned. Any of these can form these films easily and with high productivity.
In addition, when a photosensitive resin is used, there is an advantage that application and curing are easy, and when an organic film is used, the process can be simplified and the resist film 35 can be easily peeled off later. There are advantages.

In the following, a solid electrolytic capacitor can be obtained by the same steps as in the first embodiment.

According to the manufacturing method as described above, when the solid electrolyte layer 29 is formed by forming the resist film 35, a short circuit between the aluminum foil 20 and the through-hole electrode 28 on one side of the aluminum foil 20 can be prevented. Therefore, a solid electrolytic capacitor having high reliability can be easily provided.

(Embodiment 3) The invention according to claim 3 will be described with reference to Embodiment 3 and FIG.

In FIG. 18, after the dielectric film 27 is formed on the surface of the aluminum foil 20 roughened as shown in FIG. 9 of the first embodiment, the resist film 35 is formed on the entire one surface of the aluminum foil 20. Like the resist films 22 and 23, the resist film 35 uses any one of a photosensitive resin and an organic film having adhesiveness. The forming method of these is dipping, spin coater, screen printing, film. Adhesion methods and spray methods may be used. Subsequently, as shown in FIG. 16 of the second embodiment, the through-hole electrode 28 is formed by a method of filling the inside of the through-hole 24 with a conductive adhesive and curing the same.
In the following, a solid electrolytic capacitor can be obtained by the same construction method as in the second embodiment.

According to the manufacturing method as described above, in addition to the effect described in the second embodiment, the resist film 35 is formed on the entire one surface of the aluminum foil 20 when the through-hole electrode 28 is formed.
Since it is formed, the conductive adhesive is easily filled and the through-hole electrode 28 is easily formed, so that it is possible to provide a solid electrolytic capacitor having high productivity and high reliability.

(Embodiment 4) The invention according to claim 4 will be described with reference to Embodiment 4 of the present invention and FIG.

FIG. 19 shows a state in which a solid electrolyte layer 29 is formed on the surface of the dielectric film 27 and then a current collector layer 30 is formed as shown in FIG. 17 of the second embodiment. As a method for forming the layer 30, a suspension of carbon fine particles and a conductive adhesive, or a suspension of carbon fine particles and a conductive paint is applied. By the above-mentioned method, the adhesion between the solid electrolyte layer 29, which is the actual electrode, and the current collector layer 30, which is the apparent electrode, is improved.
And has an effect of contributing to the improvement of high frequency characteristics.
In the following, a solid electrolytic capacitor can be obtained by the same construction method as in the first embodiment.

According to the manufacturing method as described above, in addition to the effects described in the second to third embodiments, the resist film 22 in the portion where the first connection terminal 31 is formed and the resist on the entire one surface of the aluminum foil 20 are formed. When the material of the film 35 is the same, the removal of the resist film 22 in the portion where the first connection terminal 31 is formed and the removal of the resist film 35 on the entire one surface of the aluminum foil 20 can be continuously performed in one step. Therefore, the process can be simplified and higher productivity can be realized.

A feature of the manufacturing method of the present invention is that the aluminum foil 20 before etching is used as a starting material for manufacturing, and has the following advantages. That is, since the aluminum foil 20 is processed into the through-holes 24 and then the aluminum foil 20 is roughened by etching, the aluminum foil 20 is processed into the through-holes 24 more effectively than when the through-holes 24 are processed into the etching foil. Strong against mechanical stress,
When selecting a processing method, the range of selection can be expanded.

Also in the step of removing the resist film 23 after processing the through-holes 24, according to the present invention, not only an organic solvent but also an acid or alkali solution can be used as a resist removing agent. When the roughened aluminum foil 20 is used as a starting material, when the resist film 23 is removed, and when an acid or alkali solution is used, not only the resist film 23 but also the roughened portion 26 is dissolved and solid electrolytic There is a high possibility that the capacitance of the capacitor will be reduced. However, in the manufacturing method of the present invention, since etching is performed after removing the resist film 23, there is no fear of this, and the range of selection can be expanded when selecting the resist removing agent.

As described above, according to the present invention, the degree of freedom in designing the process is high, so that the solid electrolytic capacitor can be easily manufactured.

The solid electrolytic capacitor manufactured by using the present invention has the following features. That is, since the first connection terminal 31 and the second connection terminal 32 are arranged on the same surface and have excellent high frequency characteristics, they can be directly connected to a semiconductor as a power source of a semiconductor component, and a dielectric material. When an organic material is used for the coating 27, it is highly flexible and can be mounted on a circuit or a board that is difficult to use in the related art to which bending stress is applied, and it can be easily embedded in the board. Effective for downsizing equipment.

[0063]

As described above, the present invention has a high degree of freedom in designing a process, so that a solid electrolytic capacitor can be easily and accurately manufactured, and high productivity can be realized. The value is great.

[Brief description of drawings]

FIG. 1 is a perspective view of a solid electrolytic capacitor according to an embodiment of the present invention.

FIG. 2 is a sectional view of the same.

FIG. 3 is an enlarged cross-sectional view of the relevant part.

FIG. 4 is a cross-sectional view showing a state where through holes are formed in the aluminum foil.

FIG. 5 is a sectional view showing a state in which a resist film is formed on the aluminum foil.

FIG. 6 is a sectional view showing a state where an insulating film is formed on the aluminum foil.

FIG. 7 is a cross-sectional view with the resist film removed.

FIG. 8 is a cross-sectional view of the same aluminum foil with a roughened portion.

FIG. 9 is a sectional view showing a state where a dielectric film is formed on the roughened portion.

FIG. 10 is a sectional view showing a state in which a conductor is filled in the through hole.

FIG. 11 is a sectional view showing a state in which a solid electrolyte layer is formed on the dielectric film.

FIG. 12 is a cross-sectional view showing a state where a current collector layer is formed on the solid electrolyte layer.

FIG. 13 is a cross-sectional view with the resist film removed.

FIG. 14 is a sectional view showing a state in which the connection terminal is formed.

FIG. 15 is a sectional view showing a state in which the connection bumps are formed.

FIG. 16 is a cross-sectional view of a state where a resist film is formed on one surface of the aluminum foil.

FIG. 17 is a sectional view showing a state in which a solid electrolyte layer is formed on the dielectric film.

FIG. 18 is a cross-sectional view showing a state where a resist film is formed on one surface of the aluminum foil.

FIG. 19 is a cross-sectional view showing a state where the current collector layer is formed.

[Explanation of symbols]

20 aluminum foil 22 Resist film 23 Resist film 24 Through hole 25 insulating film 26 Roughening part 27 Dielectric coating 28 Through-hole electrode 29 Solid electrolyte layer 30 Current collector layer 31 First connection terminal 32 Second connection terminal 33 First connection bump 34 Second connection bump 35 Resist film

Continued front page    (72) Inventor Tatsuo Fujii             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Shin Nakano             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Ryo Kimura             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd.

Claims (19)

[Claims] 1. A through-hole is formed in a portion of an aluminum foil where a through-hole electrode is formed, and a resist film is formed on a portion of one side of the aluminum foil where a first connection terminal is formed and a resist film is formed on the other surface. After that, an insulating film is formed on the exposed part of the aluminum foil and the inner wall of the through hole, and then the resist film on the other surface of the aluminum foil is removed to etch the aluminum foil, and a dielectric film is formed on the surface. After that, after forming a through-hole electrode in the through-hole, a solid electrolyte layer further current collector layer is formed on the surface of the dielectric film, and subsequently, after removing the resist film in the portion forming the first connection terminal, A method for manufacturing a solid electrolytic capacitor, wherein a first connection terminal is formed in this portion and a second connection terminal is formed on the exposed surface of the through-hole electrode. 2. A through-hole is formed in a portion of an aluminum foil where a through-hole electrode is formed, a resist film is formed in a portion of one side of the aluminum foil where a first connection terminal is formed, and a resist film is formed on the other surface of the aluminum foil. After that, an insulating film is formed on the exposed part of the aluminum foil and the inner wall of the through hole, and then the resist film on the other surface of the aluminum foil is removed to etch the aluminum foil, and a dielectric film is formed on the surface. Then, after forming a through-hole electrode in the through-hole, a resist film is formed on the entire surface of one side of the aluminum foil, and then a solid electrolyte layer is formed on the surface of the dielectric film, and then the resist film on the entire surface of one side of the aluminum foil is removed. Then, after forming a collector layer on the surface of the solid electrolyte layer, after removing the resist film of the portion forming the first connection terminal, this portion And a second connection terminal on the exposed surface of the through-hole electrode. 3. A through-hole is formed in a portion of an aluminum foil where a through-hole electrode is formed, and a resist film is formed on a portion of one side of the aluminum foil where a first connection terminal is formed and a resist film is formed on the other surface. After that, an insulating film is formed on the exposed part of the aluminum foil and the inner wall of the through hole, and then the resist film on the other surface of the aluminum foil is removed to etch the aluminum foil, and a dielectric film is formed on the surface. After that, a resist film is formed on the entire surface of one side of the aluminum foil, then a through-hole electrode is formed in the through-hole, and then a solid electrolyte layer is formed on the surface of the dielectric film, and then the resist film on the entire surface of one side of the aluminum foil is removed. After forming a collector layer on the surface of the solid electrolyte layer,
A method for manufacturing a solid electrolytic capacitor, comprising: removing a resist film from a portion where a first connection terminal is formed, and then forming a first connection terminal at this portion and a second connection terminal at an exposed surface of a through-hole electrode. 4. The method for producing a solid electrolytic capacitor according to claim 2, wherein the step of forming the current collector layer is performed before the step of removing the resist film on one surface of the aluminum foil. 5. The method according to claim 1, wherein at least one of a laser processing method, a punching processing method, a drill processing method, an electric discharge processing method, and an etching method is used as a method of forming a through hole. Manufacturing method of solid electrolytic capacitor. 6. The method for producing a solid electrolytic capacitor according to claim 1, wherein the edge of the through hole on the surface on which the dielectric film is formed is chamfered. 7. The resist film used is either a photosensitive resin or an adhesive organic film.
3. The method for manufacturing a solid electrolytic capacitor as described in any one of 3 above. 8. The method for producing a solid electrolytic capacitor according to claim 1, wherein any one of a dipping method, a spin coater method, a screen printing method, a film bonding method and a spray method is used as a method for forming a resist film. . 9. The method for producing a solid electrolytic capacitor according to claim 1, wherein any one of epoxy resin, polyimide resin, silicon resin, acrylic resin, and phenol resin is used as the insulating film. 10. The method for producing a solid electrolytic capacitor according to claim 1, wherein an insulating resin is formed by an electrodeposition method as a method for forming the insulating film. 11. An insulating resin is formed as a first layer by an electrodeposition method as an insulating film, and thereafter, an insulating resin having a higher conductivity than that of the first layer in which microgel, carbon fine particles and titanium oxide fine particles are mixed is used. The method for producing a solid electrolytic capacitor according to claim 1, wherein a resin is formed as the second layer. 12. A method of filling a conductive adhesive and then curing the same to form the through-hole electrode.
2. A method for manufacturing a solid electrolytic capacitor as described in any one of 1. 13. The method for manufacturing a solid electrolytic capacitor according to claim 1, wherein a conductive adhesive is used as a material for forming the connection terminal. 14. A method of forming a connection terminal using either electroplating or electroless plating.
3. The method for producing a solid electrolytic capacitor as described in any one of 3 to 3. 15. The solid electrolytic capacitor according to claim 1, wherein a composition containing a pi-electron conjugated polymer and / or a conductive polymer other than this is used as a material forming the solid electrolyte layer. Production method. 16. A method for forming a solid electrolyte layer, comprising:
Chemical polymerization in which a heterocyclic monomer is polymerized using an oxidizing agent,
4. The method according to claim 1, wherein at least one of electrolytic polymerization in which a heterocyclic monomer is polymerized by applying an electric field, application of a powder suspension of a conductive polymer, and application of an aqueous solution of a conductive polymer is used. 1. A method for manufacturing a solid electrolytic capacitor as described in 1. 17. A method for forming a solid electrolyte layer, comprising:
The method for producing a solid electrolytic capacitor according to claim 1, wherein a method of forming manganese dioxide by thermally decomposing manganese nitrate is used. 18. A method for forming a solid electrolyte layer, comprising:
After manganese dioxide is formed by thermally decomposing manganese nitrate, chemical polymerization in which heterocyclic monomer is polymerized using an oxidizing agent, electrolytic polymerization in which heterocyclic monomer is polymerized by applying an electric field, and conductive polymer powder The method for producing a solid electrolytic capacitor according to claim 1, wherein at least one method of coating a suspension and coating a conductive polymer aqueous solution is used. 19. The solid according to claim 1, wherein a suspension of carbon fine particles and a conductive adhesive, or a suspension of carbon fine particles and a conductive paint is used as the current collector material. Method of manufacturing electrolytic capacitor.