JP2005243889A - Solid electrolytic capacitor and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To realize a highly reliable solid electrolytic capacitor having low-impedance characteristics enabling direct mounting on a semiconductor component, and to provide a manufacturing method thereof. <P>SOLUTION: The solid electrolytic capacitor consists of a porous unit 6 on one side of a valve metallic seat body 1. The capacitor has a dielectric coating film, a solid electrolyte layer 8, and a collector layer on the surface of the porous unit 6. Further, the capacitor is provided with through holes 14 at predetermined positions on the valve metallic seat body 1; insulating films 3 consisting of spacers provided on the inner wall of the through holes 14 and the non-porous surfaces of the valve metallic seat body 1; and through hole electrodes 2 connected to the collector layers provided in the through holes 14, and connecting terminals 4, 5, provided at the predetermined positions of the insulating film 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a solid electrolytic capacitor used in various electronic devices and a method for manufacturing the same.

  As a conventional solid electrolytic capacitor, one side or middle core in the thickness direction of a porous valve metal sheet body such as aluminum or tantalum is used as an electrode part, and a dielectric is formed on the surface of the porous part of the valve metal sheet body. A body oxide film is formed, a solid electrolyte layer such as a functional polymer is provided on the surface thereof, a current collector layer is provided on the surface of the solid electrolyte layer, and a metal electrode layer is provided on the current collector layer to provide a capacitor element The capacitor elements are stacked, the electrode portions or electrode layers of the capacitor elements are collectively connected to the external terminals, and the exterior is formed so as to expose the external terminals.

  In the conventional solid electrolytic capacitor, the capacity and ESR can be reduced. However, like a general solid electrolytic capacitor, it must be mounted on a circuit board via an external terminal. Thus, in a solid electrolytic capacitor that is surface-mounted on a circuit board in the same way as a semiconductor component, the ESR and ESL characteristics in the state in which an actual circuit is configured become large due to the presence of the terminal length and wiring length, and the high frequency response It had the subject that it was inferior in property.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
Japanese Patent Laid-Open No. 3-145115

  However, although the above-mentioned conventional solid electrolytic capacitor can increase the capacity and reduce the equivalent series resistance (hereinafter referred to as ESR), it is mounted on a circuit board via an external terminal in the same manner as a general solid electrolytic capacitor. There must be.

  Thus, in a solid electrolytic capacitor that is surface-mounted on a circuit board in the same way as a semiconductor component, the ESR and ESL characteristics in the state in which an actual circuit is configured become large due to the presence of the terminal length and wiring length, and the high frequency response It had the subject that it was inferior in property.

  In order to solve such problems, a solid electrolytic capacitor has been proposed in which both the positive and negative electrodes are arranged on the surface of the solid electrolytic capacitor, and the ESR and ESL can be lowered by mounting components directly on the surface.

  It is an object of the present invention to provide a solid electrolytic capacitor that can be directly connected to a semiconductor component as described above and that can efficiently produce a highly reliable solid electrolytic capacitor excellent in high-frequency response and a method for manufacturing the same. Is.

  In order to achieve the above object, the present invention has the following configuration.

  According to the first aspect of the present invention, a porous portion is provided on at least one surface of the valve metal sheet body, a dielectric coating is provided on the surface of the porous portion, a solid electrolyte layer is provided on the dielectric coating, and the solid In a solid electrolytic capacitor in which a current collector layer is provided on an electrolyte layer, a through hole provided at a predetermined position of the valve metal sheet body, an inner wall of the through hole, and a non-porous surface of the valve metal sheet body A solid electrolytic capacitor in which an insulating film made of a spacer and a resin material provided in a through hole, a through hole electrode connected to the current collector layer provided in the through hole, and a connection terminal at a predetermined position of the insulating film, By realizing an insulating film with a uniform thickness, it is possible to achieve the effect of realizing a highly reliable solid electrolytic capacitor with excellent high frequency characteristics that can be directly connected to semiconductor components. .

  According to a second aspect of the present invention, there is provided a porous portion on at least one surface of the valve metal sheet body, a dielectric coating on the surface of the porous portion, a solid electrolyte layer on the dielectric coating, and the solid In a solid electrolytic capacitor in which a current collector layer is provided on an electrolyte layer, a through hole provided at a predetermined position of the valve metal sheet body, an inner wall of the through hole, and a non-porous surface of the valve metal sheet body A solid electrolytic capacitor provided with a spacer, a filler and an insulating film made of a resin material, a through-hole electrode connected to the current collector layer provided in the through-hole, and a connection terminal at a predetermined position of the insulating film. In addition, since it is possible to form an insulating film with a better covering property, it is possible to obtain an effect of realizing a more reliable solid electrolytic capacitor with excellent high-frequency characteristics.

  The invention according to claim 3 of the present invention is the solid according to claim 1 or 2, wherein at least one of thermosetting resin of epoxy type, acrylic type and polyimide type is used as the resin material of the insulating paint. It is an electrolytic capacitor, and the effect of realizing a solid electrolytic capacitor having an insulating film with high productivity and reliability can be obtained.

  The invention according to claim 4 of the present invention is the solid electrolytic capacitor according to claim 1 or 2 in which the size of the spacer is smaller than the thickness of the insulating film, and the thickness of the insulating film can be controlled to a constant thickness. An effect can be obtained.

  Invention of Claim 5 of this invention is a solid electrolytic capacitor of Claim 1 or 2 which made the shape of the spacer substantially spherical shape, and obtains the effect that the film thickness precision of an insulating film can be improved more. Can do.

  A sixth aspect of the present invention is the solid electrolytic capacitor according to the first or second aspect, wherein the spacer has a particle size of 5 to 60 μm, and a highly reliable insulating film is formed on the inner wall of the minute through hole. The effect that it can be formed can be obtained.

  The invention according to claim 7 of the present invention is the solid electrolytic capacitor according to claim 2, wherein the size of the filler is smaller than the thickness of the insulating film and smaller than the size of the spacer. Since the decrease in viscosity can be prevented, an effect of being able to form an insulating film having a good covering property at the edge portion can be obtained.

  The invention according to claim 8 of the present invention is the solid electrolytic capacitor according to claim 1, wherein the composition of the insulating film is such that the spacer is 20 to 60 vol% and the remainder is the resin content, and the insulating film has a constant thickness. The effect that can be formed can be obtained.

  The invention according to claim 9 of the present invention is the solid electrolytic capacitor according to claim 2, wherein the composition of the insulating film is such that the spacer is 5 to 50 vol%, the filler is 30 to 50 vol%, and the remainder is the resin content. In addition, it is possible to obtain an effect that an insulating film having a constant thickness can be formed with higher accuracy.

  According to a tenth aspect of the present invention, there is provided a step of forming a through hole in a valve metal sheet body provided with a porous portion on at least one side and having a dielectric coating formed on the porous portion; After the absorber is brought into contact with one side of the body and an insulating paint made of a spacer and a resin material is applied to at least the inner wall of the through hole, a through hole is formed by leaving a certain insulating resin on at least the inner wall surface of the through hole. Removing the insulating resin to form an insulating film, forming a solid electrolyte layer on the dielectric coating, forming a negative electrode layer on the solid electrolyte layer, A solid electrolytic capacitor comprising a step of forming a through-hole electrode that is electrically connected to the negative electrode layer, and a step of forming a connection terminal that is electrically connected to the through-hole electrode and a connection terminal that is electrically connected to the valve metal sheet body on the other surface. This is a manufacturing method that prevents excess insulating paint from protruding and allows an insulating film to be uniformly formed only at a predetermined location, so that it can be directly connected to semiconductor parts with excellent productivity and insulation reliability. The effect that the manufacturing method of the solid electrolytic capacitor excellent in the characteristic can be provided can be obtained.

  According to an eleventh aspect of the present invention, there is provided a step of forming a through hole in a valve metal sheet body provided with a porous portion on at least one surface and having a dielectric coating formed on the porous portion; After the absorber is brought into contact with one side of the body and at least the inner wall of the through hole is coated with an insulating paint made of a spacer, a filler, and a resin material, the through hole is left on the inner wall of the through hole leaving a certain insulating resin. Forming an insulating film by removing the insulating resin so as to form; forming a solid electrolyte layer on the dielectric coating; forming a negative electrode layer on the solid electrolyte layer; A solid having a step of forming a through-hole electrode that is electrically connected to the negative electrode layer, and a connection terminal that is electrically connected to the through-hole electrode and a connection terminal that is electrically connected to the valve metal sheet body. This is a method of manufacturing a decapacitor, which prevents the excess insulating paint from protruding and can form an insulating film more uniformly only at a predetermined site, so it can be directly connected to semiconductor parts with higher productivity and higher insulation reliability. The effect of being able to provide a method for manufacturing a solid electrolytic capacitor having excellent high-frequency characteristics that can be connected can be obtained.

  According to a twelfth aspect of the present invention, a conductive material is provided on the other surface side of the valve metal sheet body with respect to the valve metal sheet body provided with a porous portion on at least one surface and having a dielectric coating formed on the porous portion. A step of forming a conductive material layer, a step of forming a through hole, and a contact hole after contacting the absorber with one side of the valve metal sheet body and applying an insulating paint made of a spacer and a resin material on at least the inner wall of the through hole A step of forming an insulating film by removing the insulating resin so as to form a through-hole while leaving a certain insulating resin on at least an inner wall surface of the inside, and a step of forming a solid electrolyte layer on the dielectric coating A step of forming a negative electrode layer on the solid electrolyte layer; a step of forming a through-hole electrode that is electrically connected to the negative electrode layer; and a connection terminal that is electrically connected to the through-hole electrode and the valve metal sheet body. It is a method for manufacturing a solid electrolytic capacitor having a step of forming a connection terminal on the other surface of the valve metal sheet body, and it is possible to obtain an electrode layer having a low resistance value while improving the adhesion of the insulating film. To obtain an effect of providing a manufacturing method of a solid electrolytic capacitor excellent in high frequency characteristics that can be directly connected to a semiconductor component that can prevent an excessive insulating paint from protruding and can be applied only to a predetermined portion. Can do.

  According to a thirteenth aspect of the present invention, a conductive material is provided on the other surface side of the valve metal sheet body with respect to the valve metal sheet body provided with a porous portion on at least one surface and having a dielectric coating formed on the porous portion. Forming a conductive material layer, forming a through hole, and contacting the absorber to one side of the valve metal sheet body, and applying an insulating paint made of a spacer, a filler, and a resin material to at least the inner wall of the through hole A step of forming the insulating film by removing the insulating resin so as to form a through-hole, leaving a certain insulating resin on at least the inner wall surface in the rear through hole, and forming a solid electrolyte layer on the dielectric coating A step of forming a negative electrode layer on the solid electrolyte layer, a step of forming a through-hole electrode that is electrically connected to the negative electrode layer, a connection terminal that is electrically connected to the through-hole electrode, and the valve metal sheet Is a method of manufacturing a solid electrolytic capacitor having a step of forming a connection terminal electrically connected to the other surface of the valve metal sheet body, and can improve the adhesion of the insulating film and obtain an electrode layer having a low resistance value. In addition, it is possible to provide a method of manufacturing a solid electrolytic capacitor excellent in high frequency characteristics that can be directly connected to a semiconductor component that can prevent the excess insulating paint from protruding and can more uniformly apply the insulating paint only to a predetermined portion. It is possible to obtain the operational effect.

  Invention of Claim 14 of this invention is a manufacturing method of the solid electrolytic capacitor as described in any one of Claims 10-13 which uses a porous body as an absorber, Absorbs an excess insulating paint. Thus, the effect of preventing the flow into the porous portion can be obtained.

  Invention of Claim 15 of this invention is a manufacturing method of the solid electrolytic capacitor as described in any one of Claims 10-13 which uses paper as a porous body, In addition to the effect | action of Claim 14, The effect of being excellent in productivity can be obtained.

  According to a sixteenth aspect of the present invention, in the step of forming an insulating film on at least the inner wall of the through hole, a gas is injected to form a through-hole while leaving a certain insulating resin on at least the inner wall surface of the through hole. It is a manufacturing method of the solid electrolytic capacitor as described in any one of Claims 10-13 which removes insulating resin, and obtains the effect that the insulating coating material in a through hole can be removed efficiently. Can do.

  According to a seventeenth aspect of the present invention, in the step of forming an insulating film on at least the inner wall of the through hole, it penetrates while leaving a certain insulating resin on at least the inner wall surface of the through hole while absorbing through the porous body. The method for producing a solid electrolytic capacitor according to claim 10, wherein the insulating resin is removed so as to form a hole, and a uniform insulating film is formed by removing excess insulating paint in the through-hole. The effect that can be formed can be obtained.

  According to an eighteenth aspect of the present invention, at least in the step of forming an insulating film on the inner wall of the through hole, the coating and curing of the insulating paint are performed a plurality of times. This is a method for manufacturing an electrolytic capacitor, and it is possible to obtain an effect that a highly reliable insulating film with few defects can be obtained.

  According to a nineteenth aspect of the present invention, in the step of forming an insulating film on at least the inner wall of the through hole, the insulating paint in the first application is made into a semi-cured state, and the insulating paint in the first application is formed. 19. The method for producing a solid electrolytic capacitor according to claim 18, wherein the curing is performed after the second coating is performed on the top, and an insulating film having high adhesion between insulating coatings and having high reliability can be obtained. An effect can be obtained.

  According to a twentieth aspect of the present invention, in the step of forming an insulating film on at least the inner wall of the through hole, curing is performed in a stationary state with the other surface side of the valve metal sheet body facing down. The method for producing a solid electrolytic capacitor according to any one of the above, wherein it is possible to improve the covering property by preventing dripping of the edge portion on the other surface side, and to obtain an insulating film with high insulation reliability. An effect can be obtained.

  The solid electrolytic capacitor and the manufacturing method thereof according to the present invention use an insulating material made of a spacer and a resin material on the inner wall of the through hole and the non-porous surface of the valve metal sheet body by a coating method such as a printing method. Since an insulating film is formed, it is possible to efficiently form a plurality of through-holes at the same time, and a highly uniform insulating film can be obtained with an arbitrary thickness. In addition, the through-hole and edge portion have good coverability. Thus, it is possible to realize a highly reliable solid electrolytic capacitor that can be directly connected to a semiconductor component and has excellent high-frequency characteristics, and a method for manufacturing the same.

(Embodiment 1)
Hereinafter, the first to eleventh, the fourteenth to sixteenth and the eighteenth to eighteenth inventions of the present invention will be described using the first embodiment.

  FIG. 1 is a cross-sectional view taken along line AA of FIG. 2 for explaining the structure of a solid electrolytic capacitor having low ESL characteristics that can be directly connected to a semiconductor component according to Embodiment 1 of the present invention. FIG. FIGS. 3 to 5 are enlarged sectional views of the vicinity of the through hole. 6 to 17 are process cross-sectional views for explaining a method for manufacturing a solid electrolytic capacitor.

  First, the structure of the solid electrolytic capacitor of the present invention will be described with reference to FIGS.

  The valve metal sheet body 1 is made of, for example, aluminum, and can be formed of a material such as tantalum or niobium. A porous portion 6 is provided on one surface of the valve metal sheet body 1, and the porous portion 6 is further configured as shown in FIG. A dielectric film 11 such as an aluminum oxide film that is an oxide of the valve metal sheet body 1 is formed on the surface of the porous portion 6. A solid electrolyte layer 8 made of pyrrole, thiophene, or the like is formed on the dielectric film 11, and a carbon layer 13 is further provided thereon, forming a capacitor element as a counter electrode with the plain portion of the valve metal sheet body 1. doing. The negative electrode layer 9 is provided on the upper surface of the carbon layer 13 and is formed by applying Ag paste or the like, for example. Further, the through hole electrode 2 is provided in the valve metal sheet body 1 so as to penetrate the valve metal sheet body 1. The through-hole electrode 2 can be formed integrally with the negative electrode layer 9. Further, since the inner wall of the through hole 14 is covered with the insulating film 3, the through hole electrode 2 and the valve metal sheet body 1 are insulated. The insulating film 3 is formed on the inner wall of the through hole 14 and the other surface of the valve metal sheet body 1 with a predetermined thickness with high accuracy, which is an important component for electrical performance and productivity.

  Conventionally, the insulating film 3 is formed on the inner wall of the through hole 14 by an electrodeposition or printing method using an insulating resin material or the like. The hole diameter of the through hole 14 has a dimension of several hundred μm or less. In addition, when the insulating film 3 is formed on the inner wall of the through hole 14 having this dimension and shape, the insulating film 3 becomes thin at the edge portion of the through hole 14. This occurs when the viscosity of the insulating resin material decreases at a high temperature during thermosetting, and flows and flows from the edge portion of the through hole 14. This is because in such a state, the insulation reliability of the edge portion of the through hole 14 is lowered.

  In order to solve this problem, as shown in FIG. 3, the insulating film 3 can be formed to have a uniform thickness by using an insulating paint made of spacers 19, fillers 18 and a resin material. it can. By using such a highly thixotropic insulating coating composition, the addition of the spacer 19 to prevent the dripping of the insulating coating at the edge portion of the through hole 14 due to the addition effect of the filler 18 and to determine the thickness. The insulating film 3 with improved thickness accuracy can be formed by an action such as eliminating coating unevenness due to the effect. Further, the insulating film 3 can be formed with the highest accuracy by configuring the insulating film 3 with the spacers 19, the fillers 18, and the resin material.

  In addition, as the resin material of the insulating paint at this time, the insulating film 3 is efficiently applied by using at least one of thermosetting resins such as epoxy resin, acrylic resin, and polyimide resin, and then thermosetting. Can be formed.

  Next, the configuration of the insulating film 3 will be described in more detail with reference to FIGS. 4 and 5 are enlarged cross-sectional views of the main part in the vicinity of the through hole 14 in the first embodiment.

  As shown in FIG. 4, the composition of the insulating film 3 is such that the spacer 19 and the filler 18 are dispersed and present in the insulating paint, thereby reducing the flow of the insulating paint and the edges of the through holes 14. Since the flow of the insulating paint in the portion can be reduced, the insulating film 3 having high insulation reliability can be obtained.

  Here, when the filler 18 is present in the resin material, the flow of the insulating paint can be reduced, the film loss at the edge portion can be reduced, and higher insulation reliability can be obtained. Further, since the spacer 19 is present in the resin material, when the insulating film 3 is printed and formed on the non-porous surface of the valve metal sheet body 1 using screen printing, the spacer 19 has a thickness of the insulating film 3. Therefore, the insulating film 3 having a uniform coating thickness can be easily obtained. Therefore, the size of the spacer 19 is preferably smaller than the thickness of the insulating film 3.

  In addition, by making the shape of the spacer 19 substantially spherical, the fluidity in the insulating paint is improved, and the spacer 19 does not coagulate or exist in a state where a plurality of layers overlap in the thickness direction. Therefore, the coating thickness of the insulating film 3 can be made more uniform.

  Furthermore, the optimum particle size of the spacer 19 can be determined by the shape of the through hole 14, but as a result of examination, the range of 5 to 60 μm was optimum. It was found that if the particle size of the spacer 19 is less than 5 μm, the insulating property of the insulating film 3 is lowered, and if it exceeds 60 μm, the connectivity of the through hole electrode 2 is lowered.

  In addition, the size of the filler 18 is preferably smaller than the thickness of the insulating film 3 and smaller than the size of the spacer 19 from the viewpoint of improving thixotropy controllability.

  Then, as a result of examining the composition of the insulating film 3 from the viewpoint of improving the insulation reliability of the insulating film 3, the connectivity of the through-hole electrode 2, and the productivity, the composition of the insulating film 3 is 7 to 50 vol%. The most excellent characteristics and reproducibility were obtained when the filler was 30 to 50 vol% and the rest was the resin content. Outside this range, it has been found that there are problems in either insulation reliability of the insulating film 3, connectivity of the through-hole electrode 2, or productivity.

  Further, the effects as described above can be realized even in the presence of the spacer 19 alone. For example, as shown in FIG. 5, the spacer 19 can also have the effect of the filler 18 by optimizing the particle size and addition amount of the spacer 19, and in the first embodiment, glass beads having an average particle size of 10 μm are used. Is applied by screen printing to the inner wall of the through-hole 14 and the other side of the valve metal sheet body 1 using an insulating paint having an epoxy resin of 50 vol%, and the remainder is then thermally cured at a temperature of 120 ° C. An insulating film 3 of 10 to 15 μm could be formed. The presence of the spacer 19 makes it possible to easily obtain a uniform coating thickness of the insulating paint in the case of a squeegee and the like, and the spacer 19 has an effect of improving the thixotropy of the insulating paint. Because it is.

  Next, a connection terminal 4 connected to the valve metal sheet body 1 is provided on the other surface of the valve metal sheet body 1, and the connection terminal 4 and the connection terminal 5 provided on the through-hole electrode 2 are alternately arranged. It has an arranged electrode configuration.

  In addition, a positive and negative electrode separation part 7 made of an insulating resin is provided on the outer peripheral part of one side of the valve metal sheet body 1, and by providing this positive and negative electrode separation part 7, the solid electrolyte layer 8 and the negative electrode layer 9 and the valve are provided. A short circuit (short circuit) with the plain part (part which is not made porous) of the metal sheet 1 is prevented. By providing the anode / cathode separator 7, productivity and reliability can be further increased.

  Further, the reinforcing plate 10 can increase the mechanical strength of the solid electrolytic capacitor of the present invention, and can also function as an electrode by using a conductive material.

  By adopting such a basic configuration, the wiring length can be minimized by directly connecting various components via the connection terminals 4 and 5 of the solid electrolytic capacitor. In addition, a solid electrolytic capacitor capable of minimizing the ESL can be achieved by producing an effect of canceling the magnetic field by reversing the direction of the current in the through-hole electrode 2 and the direction of the current flowing through the valve metal sheet body 1. can do.

  In realizing this solid electrolytic capacitor, the structure of the insulating film 3 having a uniform thickness and high insulation reliability on the inner wall of each fine through hole 14 and a manufacturing method for efficiently forming the insulating film 3 are very important. It will be something.

  Next, a method for manufacturing the solid electrolytic capacitor having the above-described configuration will be described in detail.

  6 to 17 are cross-sectional process diagrams for explaining the method for manufacturing the solid electrolytic capacitor in Embodiment 1 of the present invention.

  As shown in FIG. 6, 1 is a valve metal sheet | seat body and forms the porous part 6 in the single side | surface side. This porous part 6 is obtained by performing acid treatment and heat treatment on the valve metal sheet body 1 such as an aluminum foil.

  Next, as shown in FIG. 7, the through hole 14 is formed in the valve metal sheet body 1 by punching or the like. Subsequently, as shown in FIG. 8, one side of the valve metal sheet body 1 is brought into contact with the absorber 15. The absorbent body 15 is preferably made of a material that appropriately absorbs liquid, such as Japanese paper.

  Next, as shown in FIG. 9, from the other side, an insulating paint composed of a spacer 19 made of glass beads having an average particle diameter of 15 μm, a filler 18 made of alumina powder having an average particle diameter of 1 to 3 μm, and an epoxy resin. Is formed by coating with a squeegee 16. At this time, the insulating coating is filled in the through hole 14 together with the surface on the other side of the valve metal sheet body 1, and the insulating coating protruding from the one side is absorbed by the absorber 15 and protrudes into the porous portion 6. To prevent. In addition to this, as a method of applying the insulating paint at this time, a method of applying the insulating paint to the whole by a spin coating method, a method of spraying the insulating paint by spraying, or the like may be used.

  As shown in FIG. 10, the absorber 15 is removed and air is sprayed from one side of the valve metal sheet body 1 to remove excess insulating paint in the through hole 14 to remove the inner wall of the through hole 14 as shown in FIG. The through hole 14a is formed leaving a uniform insulating paint. At this time, by injecting air from one side of the valve metal sheet body 1, the insulative paint is prevented from flowing into the porous portion 6 and the insulating paint is applied to the edge portion of the through hole 14 on the other side. Thus, the coverability of the edge portion of the through hole 14 can be improved.

  In this state, the insulating film 3 can be formed by curing the insulating paint by heating. At this time, by heating with the other surface side of the valve metal sheet body 1 facing down, the insulating paint whose viscosity is reduced by heating does not flow into the porous portion 6 and the insulating paint is applied to the edge portion of the through hole 14. Therefore, the coverability can be maintained. In addition, by performing the process from the application of the insulating paint to the hardening of the insulating paint a plurality of times, defects in the insulating film 3 can be reduced and the insulation reliability can be further improved. In this case, the insulating coating applied previously is not completely cured, but is semi-cured, and then the insulating coating is applied and main curing is performed on the insulating coating so that the adhesion between the insulating coatings is improved. This improves the insulation reliability.

  Subsequently, a resin is applied to the outer peripheral portion on one side of the valve metal sheet body 1 and cured to form the positive-cathode separation portion 7 to obtain the state shown in FIG. 12, and then the porous portion as shown in FIG. A solid electrolyte layer 8 is formed on 6. For example, a conductive polymer film such as polythiophene can be formed by a chemical polymerization method, an electrolytic polymerization method, or the like.

  Thereafter, as shown in FIG. 14, a thin layer of a carbon layer (not shown) is formed on the solid electrolyte layer 8, and is applied to the through hole 14a on the carbon layer and in the through hole 14 using Ag paste or the like. The through hole electrode 2 and the negative electrode layer 9 are formed by filling.

  Next, as shown in FIG. 15, a conductive reinforcing plate 10 made of Ag, Cu or the like is adhered to the negative electrode layer 9 with Ag paste to improve the rigidity of the solid electrolytic capacitor and reduce the resistance value to reduce the charge. Easy removal.

  Next, as shown in FIG. 16, a predetermined position of the insulating film 3 is processed by a laser to form the anode opening 17, and the surface layer of the valve metal sheet body 1 is exposed, and then a plating method is performed as shown in FIG. As a result, the surface layer of the through-hole electrode 2 and the connection terminals 4 and 5 as electrode layers are collectively formed in the anode opening 17.

  According to this method of manufacturing a solid electrolytic capacitor, the surface of the valve metal sheet body 1 and the inner wall of the through-hole 14 can be efficiently insulated without increasing the thickness of the entire sheet-shaped solid electrolytic capacitor, and thus has high insulation reliability. The insulating film 3 can be obtained. In addition, since the insulating paint can be prevented from spreading outside the predetermined region, the characteristic deterioration of the solid electrolytic capacitor can be prevented, and a high capacitance value and low ESR can be realized.

  In addition to the above methods, a more uniform film thickness and high insulation reliability can be obtained by changing the components of the insulating paint.

(Embodiment 2)
Hereinafter, the second and second embodiments of the present invention will be described.

  18 to 21 are cross-sectional process diagrams for explaining the method for manufacturing the solid electrolytic capacitor in Embodiment 2 of the present invention.

  The manufacturing method of the solid electrolytic capacitor in the second embodiment is almost the same as that in the first embodiment, but a conductive material layer 20 is provided on the surface on the other surface side of the valve metal sheet body 1 as shown in FIG. This is different from the first embodiment. The conductive material layer 20 can be manufactured by previously forming a layer such as Ni or Cu on the entire other surface side of the valve metal sheet body 1 by plating.

  Next, as shown in FIG. 19, a through hole 14 having a hole diameter of 300 μm is formed in the valve metal sheet body 1 by punching or the like, and then, one side of the valve metal sheet body 1 is brought into contact with the absorber 15 as shown in FIG. Let The absorber 15 is preferably made of a material that appropriately absorbs liquid, such as paper.

  Next, as shown in FIG. 21, from the other side of the valve metal sheet body 1, a spacer 19 made of glass beads having a particle size of 50 μm, a filler 18 made of Teflon (registered trademark) resin beads having an average particle size of 1 to 5 μm, and acrylic. An insulating paint made of resin is applied by screen printing with a squeegee 16. At this time, the insulating paint composed of the spacer 19, the filler 18 and the acrylic resin is filled in the through hole 14 together with the surface on the other surface side of the valve metal sheet body 1, and the insulating property protrudes from one side of the valve metal sheet body 1. The paint is absorbed by the absorber 15 and prevents the porous portion 6 from protruding.

  Subsequent manufacturing steps are the same as those in FIG. 8 and subsequent steps in the first embodiment, so that the method for manufacturing the solid electrolytic capacitor in the second embodiment is configured.

  According to the method for manufacturing a solid electrolytic capacitor in the second embodiment of the present invention, the rigidity of the valve metal sheet body 1 is increased by the conductive material layer 20, so that the handling property in the production process of the solid electrolytic capacitor having a sheet shape is improved. It is possible to improve the insulation reliability of the insulating film 3 by selecting a material with good adhesion between the spacer 19, the filler 18 and the insulating paint made of acrylic resin, and from other processes such as plating, the valve metal sheet Effects such as being able to protect the body 1 are obtained.

  In addition, since electric charges can be efficiently extracted from the entire other side of the valve metal sheet body 1, it is possible to further reduce ESR and improve the electrical characteristics of the solid electrolytic capacitor.

  Moreover, the effect is confirmed even if it uses the insulating coating material which consists of the spacer 19 and an acrylic resin.

(Embodiment 3)
Hereinafter, the invention described in claim 17 of the present invention will be described with reference to the third embodiment.

  FIG. 22 is a cross-sectional process diagram for explaining the method for manufacturing the solid electrolytic capacitor in the third embodiment.

  The manufacturing method of the solid electrolytic capacitor in the third embodiment is almost the same as that in the first embodiment, and the insulating paint or the spacer 19 and the filler 18 are constituted by the structure of the spacer 19 and the resin material while sucking through the absorber 15. The first embodiment is different from the first embodiment in that an insulating paint having a resin material structure is applied. The manufacturing method of the solid electrolytic capacitor in the third embodiment is the same as the manufacturing process up to FIG. 6 in the first embodiment, and thereafter, as shown in FIG. Using the squeegee 16 from the other side of the valve metal sheet body 1 while abutting against one side of the metal sheet body 1 and performing suction with this suction body 15 using a suction pump or the like (suction in the direction of the arrow) The insulating film 3 is printed and formed by a method of applying an insulating paint.

  According to this method, since the excess insulating paint in the through hole 14 can be removed simultaneously with the application of the insulating paint, the production efficiency in forming the insulating film 3 is improved, and the extra insulation only by the absorber 15 is achieved. Therefore, it is possible to provide a method for manufacturing a solid electrolytic capacitor that has an effect larger than that of the absorption of the conductive paint and can more reliably prevent the insulating paint from protruding.

  The solid electrolytic capacitor and the manufacturing method thereof according to the present invention can easily obtain a desired insulating film by filling a plurality of through holes with an insulating paint in a batch by a printing method or the like, and at the through holes and edge portions. The present invention is useful as a solid electrolytic capacitor having low ESR and low ESL characteristics that can obtain high insulation reliability by making the covering property good, and a method for manufacturing the same.

Sectional drawing of the solid electrolytic capacitor in Embodiment 1 of this invention Same perspective view Enlarged sectional view of the main part Enlarged sectional view of the main part Enlarged sectional view of the main part Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Sectional process drawing for demonstrating the manufacturing method of the solid electrolytic capacitor in Embodiment 2 of this invention Sectional process drawing for demonstrating the manufacturing method of the solid electrolytic capacitor in Embodiment 2 of this invention Sectional process drawing for demonstrating the manufacturing method of the solid electrolytic capacitor in Embodiment 2 of this invention Sectional process drawing for demonstrating the manufacturing method of the solid electrolytic capacitor in Embodiment 2 of this invention Sectional process drawing for demonstrating the manufacturing method of the solid electrolytic capacitor in Embodiment 3 of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Valve metal sheet body 2 Through-hole electrode 3 Insulating film 4, 5 Connection terminal 6 Porous part 7 Cathode separation part 8 Solid electrolyte layer 9 Negative electrode layer 10 Reinforcement plate 14 Through-hole 14a Through-hole 15 Absorber 17 Anode opening part 18 Filler 19 Spacer 20 Conductive Material Layer

Claims (20)

A porous portion is provided on at least one surface of the valve metal sheet body, a dielectric coating is provided on the surface of the porous portion, a solid electrolyte layer is provided on the dielectric coating, and a current collector layer is provided on the solid electrolyte layer. In the solid electrolytic capacitor, a through hole provided at a predetermined position of the valve metal sheet body, an inner wall of the through hole, a spacer provided on a non-porous surface of the valve metal sheet body, and an insulating film made of a resin material, A solid electrolytic capacitor provided with a through-hole electrode connected to the current collector layer provided in the through-hole and a connection terminal at a predetermined position of the insulating film. A porous portion is provided on at least one surface of the valve metal sheet body, a dielectric coating is provided on the surface of the porous portion, a solid electrolyte layer is provided on the dielectric coating, and a current collector layer is provided on the solid electrolyte layer. In the solid electrolytic capacitor according to the present invention, a through hole provided at a predetermined position of the valve metal sheet body, an inner wall of the through hole, and a spacer provided on a non-porous surface of the valve metal sheet body, an insulating material made of a filler and a resin material A solid electrolytic capacitor comprising a film, a through-hole electrode connected to the current collector layer provided in the through-hole, and a connection terminal at a predetermined position of the insulating film. 3. The solid electrolytic capacitor according to claim 1, wherein at least one of an epoxy-based resin, an acrylic-based resin, and a polyimide-based thermosetting resin is used as a resin material for the insulating paint. The solid electrolytic capacitor according to claim 1, wherein the size of the spacer is smaller than the thickness of the insulating film. The solid electrolytic capacitor according to claim 1, wherein the spacer has a substantially spherical shape. The solid electrolytic capacitor according to claim 1, wherein the spacer has a particle size of 5 to 60 μm. The solid electrolytic capacitor according to claim 2, wherein the size of the filler is smaller than the thickness of the insulating film and smaller than the size of the spacer. The solid electrolytic capacitor according to claim 1, wherein the composition of the insulating film is such that the spacer is 20 to 60 vol% and the remainder is the resin content. The solid electrolytic capacitor according to claim 2, wherein the composition of the insulating film is such that the spacer is 5 to 50 vol%, the filler is 30 to 50 vol%, and the rest is the resin content. Providing a porous portion on at least one surface and forming a through hole on a valve metal sheet body having a dielectric coating formed on the porous portion; and contacting an absorber on one surface side of the valve metal sheet body After applying an insulating paint made of a spacer and a resin material to at least the inner wall of the through hole, the insulating resin is removed so that a through hole is formed leaving a certain insulating resin on at least the inner wall surface of the through hole. A step of forming, a step of forming a solid electrolyte layer on the dielectric coating, a step of forming a negative electrode layer on the solid electrolyte layer, and a step of forming a through-hole electrode electrically connected to the negative electrode layer And a method of manufacturing a solid electrolytic capacitor, comprising: forming a connection terminal electrically connected to the through-hole electrode and a connection terminal electrically connected to the valve metal sheet body on the other surface. Providing a porous portion on at least one surface and forming a through hole on a valve metal sheet body having a dielectric coating formed on the porous portion; and contacting an absorber on one surface side of the valve metal sheet body Insulate by removing the insulating resin so that a through-hole is formed leaving at least a certain insulating resin on at least the inner wall surface in the through hole after applying an insulating paint made of spacer, filler and resin material on at least the inner wall of the through hole. Forming a film; forming a solid electrolyte layer on the dielectric coating; forming a negative electrode layer on the solid electrolyte layer; and forming a through-hole electrode electrically connected to the negative electrode layer And a solid electrolytic capacitor manufacturing method including a step of forming on the other surface a connection terminal electrically connected to the through-hole electrode and a connection terminal electrically connected to the valve metal sheet body. Forming a conductive material layer on the other side of the valve metal sheet body with respect to the valve metal sheet body having a porous portion on at least one surface and having a dielectric coating formed on the porous portion, and forming a through hole And applying an insulating paint made of a spacer and a resin material to at least the inner wall of the through hole, and then applying a certain insulating resin to at least the inner wall surface of the through hole. A step of forming an insulating film by removing the insulating resin so as to leave a through hole, a step of forming a solid electrolyte layer on the dielectric coating, and a negative electrode layer on the solid electrolyte layer A step of forming a through hole electrode that is electrically connected to the negative electrode layer, a connection terminal that is electrically connected to the through hole electrode, and a connection terminal that is electrically connected to the valve metal sheet body of the valve metal sheet body. Method of manufacturing a solid electrolytic capacitor having a step of forming on the surface. Forming a conductive material layer on the other side of the valve metal sheet body with respect to a valve metal sheet body having a porous portion on at least one surface and having a dielectric coating formed on the porous portion; A step of forming and applying an insulating coating made of a spacer, a filler and a resin material to at least the inner wall of the through hole after contacting the absorber to one side of the valve metal sheet body, and then providing a constant insulation to at least the inner wall of the through hole Forming the insulating film by removing the insulating resin so as to form the through hole leaving the conductive resin, forming the solid electrolyte layer on the dielectric coating, and forming the solid electrolyte layer on the solid electrolyte layer The valve plate includes a step of forming a negative electrode layer, a step of forming a through hole electrode electrically connected to the negative electrode layer, a connection terminal electrically connected to the through hole electrode, and a connection terminal electrically connected to the valve metal sheet body. Method of manufacturing a solid electrolytic capacitor comprising forming on the other surface of the sheet. The manufacturing method of the solid electrolytic capacitor as described in any one of Claims 10-13 using a porous body as an absorber. The method for producing a solid electrolytic capacitor according to claim 10, wherein paper is used as the porous body. At least in the process of forming an insulating film on the inner wall of the through hole, the insulating resin is removed so as to form a through hole by injecting gas and leaving a constant insulating resin on at least the inner wall surface in the through hole. The manufacturing method of the solid electrolytic capacitor as described in any one of Claims 10-13 which removes. At least in the step of forming an insulating film on the inner wall of the through hole, the insulating resin is removed so as to form a through hole while leaving a certain insulating resin on at least the inner wall surface of the through hole while absorbing through the porous body. The method for manufacturing a solid electrolytic capacitor according to claim 10, wherein the insulating paint is removed. The method for producing a solid electrolytic capacitor according to any one of claims 10 to 13, wherein the insulating coating is applied and cured a plurality of times at least in the step of forming an insulating film on the inner wall of the through hole. At least in the step of forming an insulating film on the inner wall of the through-hole, the insulating paint in the first application is in a semi-cured state, and after the second application is performed on the insulating paint in the first application, curing is performed. The manufacturing method of the solid electrolytic capacitor of Claim 18 to perform. The solid electrolytic capacitor according to any one of claims 10 to 13, wherein at least in the step of forming an insulating film on the inner wall of the through hole, curing is performed in a stationary state with the other side of the valve metal sheet body facing down. Production method.

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