JP2005228925A - Manufacturing method of solid electrolytic capacitor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a reliable solid electrolytic capacitor of excellent productivity which is directly loadable with a semiconductor and which has low impedance characteristic. <P>SOLUTION: The method has a process of forming a through hole to a valve metallic sheet body 1 having a porous part and a dielectric coat on its one surface, a process of forming an insulation film 3 by abutting an absorber to one surface side of the sheet body 1, applying an insulating resin to the inner wall of the through hole and thereafter removing an extra insulating resin, a process of forming a solid electrolyte layer 8, a process of forming a cathode layer 9, a process of forming a through hole electrode 2 for conducting with the cathode layer 9, and a process of forming a connection terminal 5 conducting with the through hole electrode 2 and a connection terminal 4 conducting with the sheet body 1 on the other surface. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for producing a solid electrolytic capacitor used in various electronic devices.

  As a conventional solid electrolytic capacitor, one side or middle core in the thickness direction of a porous valve metal sheet body such as aluminum or tantalum is used as an electrode part, and a dielectric is formed on the surface of the porous part of the valve metal sheet body. A body oxide film is formed, a solid electrolyte layer such as a functional polymer is provided on the surface thereof, a current collector layer is provided on the surface of the solid electrolyte layer, and a metal electrode layer is provided on the current collector layer to provide a capacitor element The capacitor elements are stacked, the electrode portions or electrode layers of the capacitor elements are collectively connected to the external terminals, and the exterior is formed so as to expose the external terminals.

  In the conventional solid electrolytic capacitor, the capacity and the equivalent series resistance (hereinafter referred to as ESR) can be reduced. However, like a general solid electrolytic capacitor, it is mounted on a circuit board via an external terminal. There must be. As described above, in a solid electrolytic capacitor that is surface-mounted on a circuit board in the same manner as a semiconductor component, the ESR and equivalent series inductance (hereinafter referred to as ESL) characteristics in a state where an actual circuit is configured have a terminal length and a wiring length. Therefore, it has a problem that it becomes large and inferior in high-frequency response.

For example, Patent Document 1 is known as a prior art document relating to the invention of this application.
Japanese Patent Laid-Open No. 3-145115

  However, although the above-mentioned conventional solid electrolytic capacitor can increase the capacity and reduce the equivalent series resistance (hereinafter referred to as ESR), it is mounted on a circuit board via an external terminal in the same manner as a general solid electrolytic capacitor. There must be.

  As described above, in a solid electrolytic capacitor that is surface-mounted on a circuit board in the same manner as a semiconductor component, the ESR and equivalent series inductance (hereinafter referred to as ESL) characteristics in a state where an actual circuit is configured have a terminal length and a wiring length. Therefore, it has a problem that it becomes large and inferior in high-frequency response.

  In order to solve such problems, a solid electrolytic capacitor has been proposed in which both the positive and negative electrodes are arranged on the surface of the solid electrolytic capacitor, and the ESR and ESL can be lowered by mounting components directly on the surface.

  An object of the present invention is to provide a highly reliable solid electrolytic capacitor manufacturing method capable of efficiently producing a large-capacity solid electrolytic capacitor that can be directly connected to a semiconductor component as described above and has excellent high-frequency response. It is what.

  In order to achieve the above object, the present invention has the following configuration.

  The invention according to claim 1 of the present invention includes a step of forming a through hole in a valve metal sheet body provided with a porous portion on at least one side and having a dielectric coating formed on the porous portion, and a valve metal sheet After the absorber is brought into contact with one side of the body and the insulating resin is applied to at least the inner wall of the through hole, the insulating resin is removed so as to form a through hole leaving a certain insulating resin layer on at least the inner wall of the through hole. A step of forming an insulating film, a step of forming a fixed electrolyte layer on the dielectric coating, a step of forming a negative electrode layer on the solid electrolyte layer, and a through-hole electrode electrically connected to the negative electrode layer A solid electrolytic capacitor manufacturing method comprising the steps of: forming a connection terminal electrically connected to the through-hole electrode and a connection terminal electrically connected to the valve metal sheet body on the other surface, Preventing protrusion of the resin, it is possible to provide a manufacturing method of a solid electrolytic capacitor capable of achieving productivity and high reliability because it can be applied only uniformly insulative resin at the predetermined site.

  The invention according to claim 2 of the present invention is characterized in that a conductive material is provided on the other surface side of the valve metal sheet body with respect to the valve metal sheet body provided with a porous portion on at least one surface and having a dielectric coating formed on the porous portion. Forming a conductive material layer, forming a through hole, contacting an absorber with one side of the valve metal sheet body, applying an insulating resin to at least the inner wall of the through hole, and then fixing the inner wall of the through hole to at least the inner wall Removing the insulating resin so as to form a through hole while leaving the insulating resin, forming an insulating film, forming a solid electrolyte layer on the dielectric coating, and overlying the solid electrolyte layer Forming a negative electrode layer on the valve metal sheet, a step of forming a through hole electrode electrically connected to the negative electrode layer, a connection terminal electrically connected to the through hole electrode, and a connection terminal electrically connected to the valve metal sheet body. body A method of manufacturing a solid electrolytic capacitor having a step of forming on another surface, and in addition to the function of claim 1, manufacturing of a solid electrolytic capacitor capable of improving the adhesion of an insulating film and obtaining an electrode layer having a low resistance value A method can be provided.

  Invention of Claim 3 of this invention is a manufacturing method of the solid electrolytic capacitor of Claim 1 or 2 which uses a porous body as an absorber, Extra insulation is obtained by using a porous body as an absorber. Has the effect of being able to absorb the functional resin efficiently.

  Invention of Claim 4 of this invention is a manufacturing method of the solid electrolytic capacitor of Claim 3 which uses paper as a porous body, Productivity can be improved by using paper as a porous body. It has the effect of.

  According to a fifth aspect of the present invention, at least in the step of forming an insulating film on the inner wall of the through hole, gas is injected to remove excess insulating resin in the through hole. This is a method for manufacturing an electrolytic capacitor, and has an effect that an insulating resin in a through hole can be removed quickly and efficiently.

  According to a sixth aspect of the present invention, in the step of forming an insulating film on at least the inner wall of the through hole, excess insulating resin in the through hole is removed while sucking through the porous body. The method for producing a solid electrolytic capacitor according to claim 5 has an effect of being able to provide a production method different from that of claim 5.

  According to a seventh aspect of the present invention, there is provided the method for producing a solid electrolytic capacitor according to the first or second aspect, wherein the insulating resin is applied and cured a plurality of times at least in the step of forming the insulating film on the inner wall of the through hole. Therefore, it has an effect that an insulating film with high insulation reliability can be realized.

  According to an eighth aspect of the present invention, in the step of forming an insulating film on at least the inner wall of the through hole, the insulating resin in the first application is in a semi-cured state, and the insulating resin in the first application is formed. 8. The method for producing a solid electrolytic capacitor according to claim 7, wherein the curing is performed after the second coating is applied, and has the effect of increasing the adhesive force of the insulating film in addition to the function of claim 7.

  The invention according to claim 9 of the present invention is a method in which at least one of an epoxy resin, an acrylic resin, and a polyimide resin is used as the insulating resin in the step of forming an insulating film on at least the inner wall of the through hole. Item 3. The method for producing a solid electrolytic capacitor according to Item 1 or 2, which has an effect that a highly reliable insulating film can be easily formed.

  According to a tenth aspect of the present invention, at least in the step of forming an insulating film on the inner wall of the through-hole, curing is performed in a stationary state with the other side of the valve metal sheet body facing down. The method for producing a solid electrolytic capacitor according to claim 1, wherein the liquid metal is prevented from dripping at the edge portion on the other surface side of the valve metal sheet body, thereby improving the covering property and obtaining an insulating film with high insulation reliability. Has an effect.

  When the insulating film is formed on the inner wall of the through hole and the non-porous surface of the valve metal sheet body by a coating method such as a printing method, By applying and forming an insulating film while contacting the absorber on one side, it is possible to efficiently form an insulating film collectively for a plurality of through-holes, and at the same time, high insulation is achieved by forming an insulating film having a uniform predetermined thickness. The effect is that it is possible to provide a method of manufacturing a solid electrolytic capacitor capable of obtaining reliability.

(Embodiment 1)
Hereinafter, the first aspect of the present invention will be described with reference to the first, third, fifth and seventh to ninth aspects of the present invention.

  FIG. 1 is a cross-sectional view taken along line AA of FIG. 2 for explaining the structure of the solid electrolytic capacitor having low ESL characteristics according to Embodiment 1 of the present invention, and FIG. 2 is a perspective view thereof. FIG. 3 is an enlarged cross-sectional view of the main part in the vicinity of the through hole. 4 to 15 are process cross-sectional views for explaining the method for manufacturing the solid electrolytic capacitor in the first embodiment.

  First, the manufacture of the solid electrolytic capacitor according to the first embodiment will be described with reference to FIGS. The valve metal sheet body 1 is made of, for example, aluminum, and can be formed of a material such as tantalum or niobium. A porous portion 6 is provided on one surface of the valve metal sheet body 1, and the porous portion 6 is further configured as shown in FIG. A dielectric film 11 such as an aluminum oxide film that is an oxide of the valve metal sheet 1 is formed on the surface of the porous portion 6. A solid electrolyte layer 8 made of pyrrole, thiophene, or the like is formed on the dielectric film 11, and a carbon layer 13 is further provided thereon, and a capacitor serving as a counter electrode with the plain portion of the valve metal sheet body 1 serving as an anode. The element is configured. The negative electrode layer 9 is provided on the upper surface of the carbon layer 13 and is formed by applying Ag paste or the like, for example.

  Further, a through hole electrode 2 is provided in the valve metal sheet body 1 so as to penetrate the valve metal sheet body 1, and the through hole electrode 2 can be formed integrally with the negative electrode layer 9. Further, since the inner wall of the through hole is covered with the insulating film 3, the through hole electrode 2 and the valve metal sheet body 1 are insulated.

  Further, a connection terminal 4 connected to the valve metal sheet body 1 is provided on the other surface of the valve metal sheet body 1, and the connection terminals 4 and the connection terminals 5 provided on the through-hole electrodes 2 are alternately arranged. The electrode configuration is as described above.

  In addition, a positive and negative electrode separation portion 7 made of an insulating resin is provided on the outer peripheral portion on one side of the valve metal sheet body 1. By providing this positive and negative electrode separation portion 7, the solid electrolyte layer 8 and the negative electrode layer 9 The short circuit (short circuit) with the plain part (part which is not made porous) of the valve metal sheet body 1 is prevented. By providing the anode / cathode separator 7, productivity and reliability can be improved.

  Further, the reinforcing plate 10 can increase the mechanical strength of the solid electrolytic capacitor of the present invention, and can also function as an electrode by using a conductive material.

  The cathode separation part 7 and the reinforcing plate 10 are configured from the viewpoint of further improving the reliability, and the cathode separation part 7 and the reinforcing plate 10 can be provided as necessary.

  By adopting such a configuration, it is possible to minimize the wiring length by directly connecting various components via the connection terminals 4 and 5 of the solid electrolytic capacitor, and to determine the current direction in the through-hole electrode 2 and the valve metal. Since the effect of canceling the electromagnetic field is produced by setting the direction of the current flowing through the sheet body 1 in the reverse direction, a solid electrolytic capacitor capable of minimizing ESL can be obtained.

  And in realizing this solid electrolytic capacitor, it is very important how to efficiently form the insulating film 3 having a uniform thickness and high insulation reliability on the inner wall of each fine through hole.

  Next, a method for manufacturing a solid electrolytic capacitor having such a configuration will be described in detail.

  4 to 15 are cross-sectional process diagrams for explaining the method for manufacturing the solid electrolytic capacitor in Embodiment 1 of the present invention.

  As shown in FIG. 4, 1 is a valve metal sheet | seat body and forms the porous part 6 in the single side | surface side. This porous part 6 is obtained by performing acid treatment and heat treatment on the valve metal sheet body 1 such as an aluminum foil.

  Next, as shown in FIG. 5, the through hole 14 is formed in the valve metal sheet body 1 by punching or the like. Subsequently, as shown in FIG. 6, one side of the valve metal sheet body 1 is disposed on the absorber 15. The absorber 15 is preferably made of a material that appropriately absorbs liquid, such as a porous body. The porous body is preferably a resin, ceramic, sintered metal or the like, and more preferably paper from the viewpoint of productivity and cost.

  Next, as shown in FIG. 7, an insulating film 3 made of an insulating resin is applied from the other surface side by a squeegee 16 using a screen printing method. At this time, the insulating resin is filled in the through hole 14 together with the surface on the other side, and the insulating resin protruding from one side of the valve metal sheet body 1 is absorbed by the absorber 15 and protrudes into the porous portion 6. To prevent. Moreover, as a method of applying the insulating resin at this time, a method of applying the whole by a spin coating method or a method of spraying by a spray method may be used. As the insulating resin used at this time, it is preferable to use a resin containing at least one of an epoxy-based, acrylic-based, and polyimide-based thermosetting resin from the viewpoint of productivity and insulating reliability.

  Thereafter, as shown in FIG. 8, the absorber 15 is removed, and a gas such as compressed air or nitrogen gas is injected from one side of the valve metal sheet body 1 to leave at least the inner wall of the through hole 14 and leave a certain insulating resin. The excess insulating resin is removed so that the holes 14a are formed, resulting in a state as shown in FIG. At this time, by injecting a gas such as compressed air from one side of the valve metal sheet body 1, the insulating resin can be prevented from flowing into the porous portion 6, and the through hole on the other side of the valve metal sheet body 1 can be prevented. Insulating resin can be fed into the 14 edge portions, and the coverage at the edge portions can be improved.

  Next, the insulating resin is cured by heating to form the insulating film 3.

  At this time, by heating with the other surface side of the valve metal sheet body 1 facing down, the insulating resin whose viscosity has been reduced by heating does not flow into the porous portion 6, and the other surface of the valve metal sheet body 1. Since more insulating resin can be left in the edge portion of the through hole 14 on the side, the flow of the insulating resin due to heating can be suppressed, and the covering property can be maintained.

  In addition, by performing the steps from application of the insulating resin to curing of the insulating resin a plurality of times, it is possible to further improve the insulation reliability of the insulating film 3 by reducing defects such as pinholes in the insulating film 3. .

  Further, the first applied insulating resin is not completely cured, but is semi-cured, and the second insulating resin is applied on the semi-cured insulating resin. Then, by performing the main curing, it is possible to form the insulating film 3 in which the adhesion between the insulating resins is improved and the insulation reliability is further improved.

  Next, an insulating resin is applied to the outer peripheral portion on one side of the valve metal sheet body 1 and cured to form the cathode separation portion 7, and the state shown in FIG. 10 is obtained.

  Next, a solid electrolyte layer 8 is formed on the porous portion 6 as shown in FIG. For example, a conductive polymer film such as polythiophene can be formed by a chemical polymerization method, an electrolytic polymerization method, or the like.

  Thereafter, as shown in FIG. 12, a thin layer of a carbon layer (not shown) is formed on the solid electrolyte layer 8, and then Ag paste is applied to the through hole 14a of the through hole 14 on which the carbon layer and the insulating film 3 are formed. The through-hole electrode 2 and the negative electrode layer 9 are formed by coating, filling and curing the inside.

  Next, as shown in FIG. 13, the conductive reinforcing plate 10 made of Ag, Cu or the like is adhered to the negative electrode layer 9 with Ag paste or the like, thereby improving the rigidity of the solid electrolytic capacitor and reducing the resistance value of the conductor. Lowering to facilitate the extraction of charges in the high frequency range. In addition, the reinforcement board 10 can be provided as needed.

  Next, a predetermined position of the insulating film 3 is processed by laser processing or the like to form the anode opening 17, and the surface layer of the valve metal sheet body 1 is exposed to be in the state of FIG. Thereafter, the connection terminals 4 and 5 are formed on the surface layer of the through-hole electrode 2 and the anode opening 17 by plating, and the process reaches FIG.

  According to the method for manufacturing a solid electrolytic capacitor as described above, the surface of the valve metal sheet body 1 and the inner wall of the through hole 14 can be efficiently insulated without increasing the overall thickness, and the solid electrolytic having high insulation reliability. A capacitor can be obtained. In addition, since the insulating resin can be prevented from spreading outside the predetermined region, it is possible to provide a method for manufacturing a solid electrolytic capacitor that can prevent deterioration in characteristics of the solid electrolytic capacitor and realize a high capacitance value and low ESR.

(Embodiment 2)
The second aspect of the present invention will be described below with reference to the second embodiment.

  16 to 19 are cross-sectional process diagrams for explaining the method for manufacturing the solid electrolytic capacitor in Embodiment 2 of the present invention.

  The manufacturing method of the solid electrolytic capacitor in the second embodiment is almost the same as that in the first embodiment, but as shown in FIGS. 16 to 19, the conductive material layer 18 is formed on the surface on the other surface side of the valve metal sheet body 1. Is different from the first embodiment. This conductive material layer 18 is obtained in advance by, for example, forming a layer of Ni, Cu or the like on the entire other surface side of the valve metal sheet body 1 by a plating method. Next, as shown in FIG. A through hole 14 is formed in the body 1 by punching or the like. Subsequently, as shown in FIG. 18, one side of the valve metal sheet body 1 is disposed on the absorber 15. The absorber 15 is preferably made of a material that appropriately absorbs liquid, such as paper.

  Next, as shown in FIG. 19, an insulating film 3 made of an insulating resin is applied by a squeegee 16 from the other side. At this time, the insulating resin is filled in the through hole 14 together with the surface on the other side, and the insulating resin protruding from one side of the valve metal sheet body 1 is absorbed by the absorber 15 and protrudes into the porous portion 6. To prevent.

  Subsequent manufacturing steps are the same as those in FIG. 8 and subsequent steps in the first embodiment, so that the method for manufacturing the solid electrolytic capacitor in the second embodiment is configured.

  According to the method for manufacturing a solid electrolytic capacitor in the second embodiment of the present invention, the rigidity of the valve metal sheet body 1 is increased by the conductive material layer 18, so that the handling property in the production process of the solid electrolytic capacitor having a sheet shape is improved. Advantages such as improvement, insulation reliability can be further improved by selecting a material having good adhesion to the insulating resin, and the valve metal sheet body 1 can be protected from other processes such as plating. In addition, since electric charges can be efficiently extracted from the entire other side, ESR can be further reduced and the electric characteristics of the solid electrolytic capacitor can be improved.

(Embodiment 3)
The third aspect of the present invention will be described below with reference to the third embodiment.

  FIG. 20 is a cross-sectional process diagram for explaining the method of manufacturing the solid electrolytic capacitor in the third embodiment.

  The manufacturing method of the solid electrolytic capacitor in the third embodiment is almost the same as that in the first embodiment, and is different from the first embodiment in that the insulating resin is applied while sucking through the absorber 15. The manufacturing method of the solid electrolytic capacitor in the third embodiment is the same as the manufacturing process up to FIG. 6 in the first embodiment, and then, as shown in FIG. Insulate with the squeegee 16 from the other side of the valve metal sheet 1 while being brought into contact with one side of the metal sheet 1 and sucking with a suction pump or the like through this absorber 15 (suction in the direction of the arrow). The insulating film 3 is printed by a method of applying a functional resin.

  According to this method, since the excess insulating resin in the through hole 14 can be removed simultaneously with the application of the insulating resin, the production efficiency in the formation of the insulating film 3 is improved, and the excess insulating property only by the absorber 15 is obtained. It is possible to provide a method for manufacturing a solid electrolytic capacitor, which is more effective than resin absorption and can more reliably prevent the insulating resin from protruding.

  The manufacturing method of the solid electrolytic capacitor according to the present invention is such that a desired insulating film can be easily obtained by filling a plurality of through-holes with an insulating resin by a printing method or the like, and covering the through-holes and edge portions. Therefore, it is useful as a method for manufacturing a solid electrolytic capacitor having low ESR and low ESL characteristics, which can obtain high insulation reliability by improving the property.

Sectional drawing of the solid electrolytic capacitor in Embodiment 1 of this invention Same perspective view Enlarged sectional view of the main part Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Cross-sectional process drawing for explaining the manufacturing method Sectional process drawing for demonstrating the manufacturing method of the solid electrolytic capacitor in Embodiment 2 of this invention Sectional process drawing for demonstrating the manufacturing method of the solid electrolytic capacitor in Embodiment 2 of this invention Sectional process drawing for demonstrating the manufacturing method of the solid electrolytic capacitor in Embodiment 2 of this invention Sectional process drawing for demonstrating the manufacturing method of the solid electrolytic capacitor in Embodiment 2 of this invention Sectional process drawing for demonstrating the manufacturing method of the solid electrolytic capacitor in Embodiment 3 of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Valve metal sheet | seat body 2 Through-hole electrode 3 Insulating film 4, 5 Connection terminal 6 Porous part 7 Cathode separation part 8 Solid electrolyte layer 9 Negative electrode layer 10 Reinforcement plate 14 Through-hole 14a Through-hole 15 Absorber 17 Anode opening part 18 Conductivity Material layer

Claims (10)

Providing a porous portion on at least one surface and forming a through hole on a valve metal sheet body having a dielectric coating formed on the porous portion; and contacting an absorber on one surface side of the valve metal sheet body Forming an insulating film by applying an insulating resin to at least the inner wall of the through hole and then removing the insulating resin so as to form a through-hole, leaving a predetermined insulating resin on at least the inner wall surface of the through hole; and the dielectric Forming a fixed electrolyte layer on the body coating; forming a negative electrode layer on the solid electrolyte layer; forming a through-hole electrode electrically connected to the negative electrode layer; and conducting to the through-hole electrode. The manufacturing method of the solid electrolytic capacitor which has the process of forming the connecting terminal which conducts, and the connecting terminal which conducts with the said valve metal sheet body in the other surface. Forming a conductive material layer on the other side of the valve metal sheet body with respect to the valve metal sheet body having a porous portion on at least one surface and having a dielectric coating formed on the porous portion, and forming a through hole And applying an insulating resin to at least the inner wall of the through hole after leaving the absorber in contact with one side of the valve metal sheet body, and leaving a certain insulating resin on at least the inner wall of the through hole to form a through hole Removing the insulating resin to form an insulating film; forming a solid electrolyte layer on the dielectric coating; forming a negative electrode layer on the solid electrolyte layer; and A solid having a step of forming a through-hole electrode that is electrically connected to the electrode layer, and a step of forming a connection terminal that is electrically connected to the through-hole electrode and a connection terminal that is electrically connected to the valve metal sheet body on the other surface of the valve metal sheet body Method for producing a solution capacitor. The manufacturing method of the solid electrolytic capacitor of Claim 1 or 2 using a porous body as an absorber. The method for producing a solid electrolytic capacitor according to claim 3, wherein paper is used as the porous body. The method for producing a solid electrolytic capacitor according to claim 1 or 2, wherein in the step of forming an insulating film on at least the inner wall of the through hole, gas is injected to remove the insulating resin in the through hole. The method for producing a solid electrolytic capacitor according to claim 1 or 2, wherein the insulating resin in the through hole is removed while sucking through the porous body in the step of forming an insulating film on at least the inner wall of the through hole. 3. The method for producing a solid electrolytic capacitor according to claim 1, wherein the insulating resin is applied and cured a plurality of times at least in the step of forming the insulating film on the inner wall of the through hole. At least in the step of forming an insulating film on the inner wall of the through-hole, the insulating resin in the first application is in a semi-cured state, and after the second application on the insulating resin in the first application, the curing is performed. The manufacturing method of the solid electrolytic capacitor of Claim 7 to perform. 3. The production of a solid electrolytic capacitor according to claim 1, wherein at least one of a thermosetting resin of an epoxy type, an acrylic type, or a polyimide type is used as the insulating resin in the step of forming an insulating film on at least the inner wall of the through hole. Method. The method for producing a solid electrolytic capacitor according to claim 1 or 2, wherein in at least the step of forming an insulating film on the inner wall of the through hole, curing is performed in a stationary state with the other side of the valve metal sheet body facing down.

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