JP2003057634A - Method for manufacturing electro-optic device, electro- optic device and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electro-optic device for optically and surely detecting the presence/nonpresence and position of even a substrate for color reflection, the electro-optic device and electronic equipment. SOLUTION: In a method for manufacturing a liquid crystal device, when first reflection film 11, light shielding films 12 and 13 and color filters 2R, 2G and 2B are formed in an image display area 15 of an original substrate 100' for forming an opposite substrate 10, second reflection film 11', light shielding film 12' and color filter 2' are layered on an outer area of the image display area 15. Then, if a light source 410 is made to emit light to the rear face of the opposite substrate 10 and a photodetector 420 detects reflected light of the light, the presence/nonpresence or position of the original substrate 100' can be detected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a reflective or semi-transmissive / semi-reflective electro-optical device, an electro-optical device and electronic equipment.

[0002]

2. Description of the Related Art In recent years, electro-optical devices such as liquid crystal devices have been widely used as display units in electronic devices such as mobile phones, portable computers and video cameras.

Among such electro-optical devices, for example,
As an active element, a TFD element (Thin Film Di)
In an active matrix type liquid crystal device using an OD / thin film diode element), a TFD element (not shown) and a transparent pixel electrode 66 are formed on a transparent element substrate 20 as shown in FIG. On the counter substrate 10, stripe-shaped counter electrodes are formed as data lines 52. Here, the counter substrate 10 and the element substrate 20 are bonded together by the sealing material 7 applied in a ring shape, and
The liquid crystal 6 as an electro-optical material is injected and held in the area defined by the sealing material 7. The gap between the counter substrate 10 and the element substrate 20 is defined by the gap material mixed in the seal material 6 and the gap material 5 interposed between the counter substrate 10 and the element substrate 20.

In the reflection type liquid crystal device 1 ′ among such liquid crystal devices, a reflection film 11 made of aluminum, silver alloy or the like is formed on the counter substrate 10. The pixel electrode 66 formed on the element substrate 20 is provided on the upper layer side of the reflective film 11.
A light-shielding film 12, which is a so-called black matrix, is formed in a region facing the boundary region of the color filters 2R, 2G, and 2B.
Are formed. Furthermore, the color filters 2R, 2
The color filters 2R, 2G, and 2 are provided on the upper layers of G and 2B.
Overcoat film 1 for protecting B and flattening unevenness caused by the color filters 2R, 2G, 2B
7 is formed, and the data line 52 is formed on the surface of the overcoat film 17.

In the liquid crystal device 1'constructed in this way, of the region surrounded by the sealing material 7 (the region where the liquid crystal 6 is held), the region slightly inside thereof is the image display region 1
It is set to 5 (active area). The image display area 15 is defined by the light-shielding film 13 for parting formed on the counter substrate 10, the opening 31 of the frame 30 arranged on the element substrate 20 side, and the like. The area outside the area is called a frame area 32 and does not contribute to the display of an image. Therefore, the reflective film 1
1 is formed only in the area corresponding to the image display area 15.

In manufacturing the liquid crystal device 1'having such a structure, generally, the reflection film 11, the light shielding films 12 and 13, the color filters 2R and 2 to be formed on the counter substrate 10.
As shown in FIG. 12A, the G, 2B, the data line 52, the alignment film 18 and the like are formed on the original substrate 100 'which is larger than the size mounted on the liquid crystal device 1'. A substrate forming region 1 surrounded by a two-dot chain line L1 from the original substrate 100 '
0'is cut out and used as the counter substrate 10. Although not shown in the figure, the element substrate 20 is also similar to the element substrate 20.
The TFD element and the pixel electrode 66 are formed on the original substrate capable of taking a large number of sheets.

Then, while the gap material 5 is sprinkled on the original substrate for forming the element substrate 20, the original substrate 100 'for forming the counter substrate 10 is indicated by a chain line L2 in FIG. 12 (A). The sealing material 7 is applied to the position shown, and the sealing material 7 is hardened while the original substrates are pressed from both sides in a state where the two original substrates are bonded to each other with the sealing material 7 sandwiched therebetween, so that an empty panel structure is formed. To form. In this state, in the panel structure, the gap between the substrates is defined by the gap material mixed with the seal material 6 and the gap material 5. Therefore, the panel structure is cut into strips to expose the discontinuous portion of the sealing material 7 as a liquid crystal injection port (not shown), the liquid crystal 6 is injected from the liquid crystal injection port, and then the liquid crystal injection port is sealed. After that, if the panel structure is cut into a predetermined size, the liquid crystal device 1'can be manufactured.

Here, when the reflective film 11, the light-shielding films 12 and 13, the color filters 2R, 2G, and 2B are sequentially formed on the original substrate 100 ', the reflective film 11 is shown in FIG.
Although it is formed only in the shaded area (image display area 15) in (A), the light shielding film 12 and the color filters 2R, 2G,
Regarding 2B, if the light shielding film 12 'and the color filter 2'are also formed in the area surrounded by the seal material 7 outside the image display area 15, the counter substrate 10 (original substrate 100') can be formed. Since the thickness of the film formed on the surface can be made substantially equal to that in the image display region 15, the gap material 5 acts effectively and the distance between the counter substrate 10 and the element substrate 20 can be made highly accurate.

Of the inside of the substrate forming area 10 ',
The area outside the image display area 15 and further the original substrate 100 '
In the area outside the substrate forming area 10 ', the light-shielding film 1 is also formed.
If the 2'and the color filter 2'are formed, the counter substrate 10 (original substrate 10) is formed even outside the area where the sealing material 7 is formed.
0 ') The thickness of the film formed on the surface can be equalized. Therefore, when the original substrates are pressed against each other until the sealing material 7 hardens, an even force can be applied to the original substrates.
The distance between the counter substrate 10 and the element substrate 20 can be made highly accurate.

Here, when the process of forming the data lines 52, the rubbing process, the bonding process of the substrates, the scribing process, etc. are performed, the original substrate 100 'and the panel structure are conveyed to various devices and placed at predetermined positions. I will set it,
At this time, as shown in FIG. 12B, the original substrate 100 '
When the light source 410 irradiates the back surface 101 of the substrate and the reflected light is detected by the photodetector 420, the original substrate 100 '
It is possible to detect the presence or absence and the position.

[0011]

However, when many light-shielding films 12 'and color filters 2'are formed in the area other than the image display area 15 on the surface of the original substrate 100', such films are formed. In this region, the intensity of the reflected light is extremely low even if the back surface of the original substrate 100 'is irradiated with light. Therefore, the presence or absence and the position of the original substrate 100' are detected by using such a region. There is a problem that you cannot do it. Particularly, in the region where the light shielding film 12 'is formed, the intensity of the reflected light is reduced by one digit or more. Therefore, when such a region is used, the presence or absence of the original substrate 100' cannot be detected at all. There is a problem.

In view of the above problems, the object of the present invention is to:
An object of the present invention is to provide a manufacturing method of an electro-optical device, an electro-optical device, and an electronic device capable of optically and reliably detecting the presence / absence and position of a substrate for color reflection.

[0013]

In order to solve the above problems, according to the present invention, a first reflective film is formed in an image display region on the surface of a first transparent substrate holding an electro-optical material, Further, when manufacturing the electro-optical device in which the light-shielding film and the color filter are formed on the upper layer side of the first reflective film, when handling the first transparent substrate, the back surface of the first transparent substrate is In the method of manufacturing an electro-optical device, which detects the presence or absence or the position of the first transparent substrate by irradiating the first transparent substrate with light and detecting the reflected light, the first transparent substrate is provided with the first transparent substrate. When forming the reflective film, the second reflective film is formed in an area outside the image display area.

According to the present invention, since the second reflective film is formed in the area which is not involved in the display (the area outside the image display area), the back surface of the first transparent substrate is formed in the area other than the image display area. When the light is emitted from, the intensity of the reflected light is high. Therefore, the presence or absence and the position of the first transparent substrate can be detected based on the reflected light on the back surface side of the first transparent substrate.

In the present invention, the color filter is formed on the surface of the first transparent substrate even in an area outside the image display area, and the color filter is formed outside the image display area on the lower layer side. It is preferable to form the second reflective film. With such a configuration, in the area outside the image display area, it is possible to obtain reflected light of sufficiently high intensity even on the back surface side of the area where the color filter is formed. Therefore, by utilizing the reflected light in this area, It is possible to detect the presence or absence and the position of the first transparent substrate.

In the present invention, the light-shielding film is formed on the surface of the first transparent substrate also in the area outside the image display area, and on the lower layer side of the light-shielding film formed outside the image display area. It is preferable to form the second reflective film. According to this structure, in the area outside the image display area, reflected light of sufficiently high intensity can be obtained even on the back surface side of the area where the light-shielding film is formed. Therefore, by utilizing the reflected light in this area, It is possible to detect the presence or absence and the position of the first transparent substrate.

In the present invention, the first transparent substrate is
At least until the formation of the first reflective film, the second reflective film, the light shielding film, and the color filter is handled in the state of the original substrate larger than the size mounted on the electro-optical device. There is. In this case, when handling the first transparent substrate in the state of the original substrate, the back surface of the original substrate is irradiated with light and the reflected light is detected to determine the presence or absence or the position of the original substrate. It is preferable to detect. With this configuration, reflected light of sufficiently high intensity can be obtained even on the back surface side of the area outside the substrate formation area. Therefore, the reflected light in this area can be used to detect the presence or absence and position of the original substrate. You can

In the present invention, the color filter is formed on the surface of the original substrate outside the substrate forming region where the first transparent substrate is cut out, and the color filter is formed outside the substrate forming region. The second reflective film is preferably formed on the lower layer side of the color filter. With this configuration, in the area outside the substrate formation area, it is possible to obtain reflected light of sufficiently high intensity even on the back surface side of the area where the color filter is formed.
The presence or absence and the position of the first transparent substrate can be detected by utilizing the reflected light in this region.

In the present invention, the light-shielding film is formed outside the substrate forming region of the original substrate where the first transparent substrate is cut out, and the light-shielding film is formed outside the substrate forming region. It is preferable to form the second reflective film on the lower layer side. According to this structure, in the area outside the substrate formation area, it is possible to obtain reflected light of sufficiently high intensity even on the back surface side of the area where the light-shielding film is formed. Therefore, by utilizing the reflected light in this area, It is possible to detect the presence or absence and the position of the first transparent substrate.

The electro-optical device to which the present invention is applied is, for example, a liquid crystal. In this case, a single-size or large-sized second transparent substrate is attached to the first transparent substrate or its original substrate via a sealing material, and then the region divided by the sealing material between the substrates. Liquid crystal as the electro-optical material is injected into the inside.

The electro-optical device manufactured by the method according to the present invention is used as a display unit of electronic equipment such as a mobile phone, a portable computer, a video camera and the like.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to the drawings. In the following description of the embodiments, an active matrix liquid crystal device using a TFD element as an active element is described as an example among various electro-optical devices.

(Structure of Liquid Crystal Device) FIG. 1 is a block diagram schematically showing the electrical structure of the liquid crystal device. 2 and 3 are an exploded perspective view and a sectional view showing a structure of a portion corresponding to an image display area of the liquid crystal device. Figure 4
Each of (A), (B), and (C) is one of a pair of substrates that sandwich a liquid crystal in a liquid crystal device, which is one of the element substrates.
FIG. 4 is a plan view of a pixel, a cross-sectional view taken along the line III-III ′ of FIG. 4A, and a perspective view of a TFD element formed in each pixel.

As shown in FIG. 1, in the image display area 15 of the liquid crystal device 1, a plurality of scanning lines 51 as wirings are formed in the row direction (X direction), and a plurality of data lines 52 are arranged in the column direction (Y direction). ) Is formed. Scan line 51 and data line 5
A pixel 53 is formed at a position corresponding to each intersection with 2, and in this pixel 53, a liquid crystal layer 54 and a pixel switching TFD element 56 are connected in series. Each scanning line 51 is driven by the scanning line drive circuit 57, and each data line 52 is driven by the data line drive circuit 58.

As shown in FIGS. 2 and 3, the active-matrix type liquid crystal device 1 having such a structure has a counter substrate 10 (a first substrate) holding a liquid crystal 6 as an electro-optical material.
Of the transparent substrate) and the element substrate 20 (second transparent substrate), a plurality of scanning lines 51 extend toward the element substrate 20, and each scanning line 51 is provided with a TFD element to be described later. The pixel electrode 66 is electrically connected. Further, the alignment film 28 is formed on the upper layer side of the pixel electrode 66.

On the other hand, in the counter substrate 10, as shown in FIG. 3, on the surface of the transparent substrate 100, in the area corresponding to the image display area 15, a first metal film made of aluminum or silver is formed. The reflection film 11 is formed, and the light-shielding film 12 is formed on the surface of the first reflection film 11 in a region facing a boundary region between pixel electrodes 66 formed on the element substrate 20 (a boundary region between pixel regions). It is formed in a matrix. In the liquid crystal device 1 for color display, the light shielding film 1
In the area (pixel area) surrounded by 2, the color filter 2
R, 2G, and 2B are formed. Further, an overcoat film 17 is formed on the surface side of the color filters 2R, 2G, 2B.
Are formed. On the surface of the overcoat film 17, a plurality of rows of band-shaped data lines 52 extending in a direction intersecting the scanning lines 51 of the element substrate 20 are formed (see FIG. 2),
The alignment film 18 is formed on the data lines 52. Here, the glass substrate 100 used for the counter substrate 10
Fine irregularities (not shown) are formed in a region corresponding to the image display region 15 on the surface of the first reflective film 11, and irregularities for light scattering are formed on the surface of the first reflective film 11. There is.

In the liquid crystal device 1 of the present embodiment, of the area surrounded by the sealing material 7 (area where the liquid crystal 6 is held), the area slightly inside the area is defined as the image display area 15 (active area). There is. Such an image display area 15 is
The light-shielding film 13 for parting formed on the counter substrate 10, or the opening 31 of the frame body 30 arranged on the element substrate 20 side
The area outside the image display area 15 is referred to as a frame area 32 and does not contribute to image display.

The counter substrate 10 and the element substrate 20 are adhered to each other by a sealing material 7 applied in an annular shape, and liquid crystal 6 as an electro-optical substance is injected and held in a region defined by the sealing material 7. There is. In addition, the counter substrate 1
The distance between 0 and the element substrate 20 is set with high accuracy by the gap material mixed in the sealing material 6 or the gap material 5 interposed between the counter substrate 10 and the element substrate 20.

In the liquid crystal device 1 of the present embodiment, an area slightly inside the area surrounded by the seal material 7 (area where the liquid crystal 6 is held) is defined as the image display area 15 (active area). There is. Such an image display area 15 is
The light-shielding film 13 for parting formed on the counter substrate 10, or the opening 31 of the frame body 30 arranged on the element substrate 20 side
The area outside the image display area 15 is referred to as a frame area 32 and does not contribute to image display.

In the liquid crystal device 1 thus constructed,
When a scanning signal is supplied to each of the scanning lines 51 formed on the element substrate 20 and a data signal is supplied to the data line 52 formed on the counter substrate 10, the pixel electrode 66 and the data line 52 face each other. In part, the liquid crystal 6 held therein can be driven for each pixel 53.
Therefore, in the pixel 53 in the lighting state, the light incident from the element substrate 20 side has the pixel electrode 66, the liquid crystal 6, the data line 52, the color filter 2R, and the color filter 2R, 2 as shown by an arrow LA.
The light that has passed through G and 2B, reaches the first reflection film 11, and is reflected by the first reflection film 11 is again reflected by the color filters 2R, 2G, and 2B, the data line 52, as indicated by the arrow LB.
The light is transmitted through the liquid crystal 6 and the pixel electrode 66 and emitted to display an image. At this time, since the light reflected by the first reflective film 11 is provided with the scattering property due to the unevenness, high-quality display can be performed.

Here, the first reflection film 11 is thinly formed,
Alternatively, if an opening is formed in the first reflective film 11, an image can be displayed by using the light incident from the back surface side of the counter substrate 10, so that the liquid crystal device 1 ′ is configured as a semi-transmissive / semi-reflective type. can do.

When a normal TN mode liquid crystal is used as the liquid crystal 6, this type of liquid crystal 6 performs light modulation by changing the polarization direction of light, so that a polarizing plate is provided on the outer surface of the element substrate 20. (Not shown) are arranged in a stack.

Further, in the counter substrate 10 of the present embodiment, the outer region of the image display region 15 is not directly involved in the display of an image, but is located between the light shielding film 13 defining the image display region 15 and the sealing material 7. The second reflective film 1 is formed on the same layer as the first reflective film 11.
1'is formed. Further, a light-shielding film 12 'of the same layer as the light-shielding films 12 and 13 is formed on the upper layer side of the first reflection film 11, and color filters 2R, 2G and 2B are formed on the upper layer side of the light-shielding film 12'. A color filter 2'of the same layer is formed. Here, the color filter 2'is one of the color filters 2R, 2G, and 2B formed at the same time.

Further, in the counter substrate 10 of the present embodiment, the second reflective film 11 'is also formed in the area outside the area where the sealing material 7 is formed. In addition, the second reflective film 1
A light-shielding film 12 'of the same layer as the light-shielding films 12 and 13 is formed on the upper layer side of 1', and a color filter 2'is further formed on the upper layer side of the light-shielding film 12 '.

Although the scanning lines 51 are formed on the element substrate 20 and the data lines 52 are formed on the counter substrate 10 in the example shown here, the data lines are formed on the element substrate 20 and the scanning lines are formed on the counter substrate 10. May be formed.

(Structure of Non-Linear Element) In the liquid crystal device 1 having such a structure, the TFD element 56 is, for example, as shown in FIG.
As shown in (A), (B), and (C), the first T formed on the base layer 61 formed on the surface of the element substrate 20.
By the two TFD element elements including the FD element 56a and the second TFD element 56b, a so-called Back-
It is configured as a to-Back structure. For this reason,
In the TFD element 56, the non-linear current-voltage characteristics are symmetrical in both positive and negative directions. The underlayer 61 is, for example, tantalum oxide (Ta) having a thickness of about 50 to 200 nm.
₂ O ₅ ).

The first TFD element 56a and the second TFD element 56a
The FD element 56b includes a first metal layer 62, an insulating film 63 formed on the surface of the first metal layer 62, and an insulating film 63.
A second metal layer 64 formed on the surface of the substrate and spaced apart from each other.
a, 64b. First metal layer 6
2 is formed of, for example, a Ta simple film or Ta alloy film having a thickness of about 100 to 500 nm, and the insulating film 63 is
For example, the thickness formed by oxidizing the surface of the first metal layer 62 by an anodic oxidation method is 10 to 35 nm.
Tantalum oxide (Ta ₂ O ₅ ).

The second metal layers 64a and 64b are made of a metal film such as chromium (Cr) and have a thickness of 50 to 300 n.
It is formed to a thickness of about m. Second metal layer 64a
Becomes the scanning line 51 as it is, and the other second metal layer 6
4b is connected to the pixel electrode 66 made of a transparent conductive material such as ITO, and the alignment film 28 is formed on the surface side of the pixel electrode 66.
Are formed.

(Manufacturing Method of Liquid Crystal Device) Among the manufacturing processes of such a liquid crystal device 1, a counter substrate forming process for manufacturing the counter substrate 10 will be described with reference to FIGS. 5, 6 and 7. In addition, the counter substrate 10 is generally a single counter substrate 10 after performing each step on a large-sized base substrate cut out from a plurality of single counter substrates 10 corresponding to the size of the liquid crystal device 1. Since the method of dividing the substrate 10 is adopted, the case where the present invention is applied to this method will be described.

5A and 5B are plan views showing the structure of the original substrate used to manufacture the counter substrate 10 used in the liquid crystal device 1 of this embodiment, and AA of the original substrate. ′ It is a cross-sectional view. Note that FIG. 5A shows a state where a reflective film is formed on the original substrate, and FIG. 5B shows a state where a reflective film, a light shielding film, and a color filter are formed. 6 and 7 are process cross-sectional views showing a method of manufacturing the counter substrate 10 used in the liquid crystal device 1.

Counter substrate 10 used in liquid crystal device 1 of the present embodiment
In the forming step (counter substrate forming step) of FIG.
As shown in (A), (B) and FIG. 6 (A), an original substrate 100 'made of a large glass substrate from which a plurality of single opposing substrates 10 can be cut out is prepared. Here, nine counter substrates 10 can be cut out from the original substrate 100 ′, and inside the substrate formation region 10 ′ (the region surrounded by the one-dot chain line L1 in FIG. 5) cut out as the counter substrate 10, An area where the sealing material 7 is formed is shown by a chain line L2, and an image display area 15 shown by a solid line L3 is located inside thereof.

Next, as shown in FIG. 6B, the original substrate 1
A reflecting film 110 made of a metal film such as aluminum or silver is formed on the surface of 00 '. Next, as shown in FIG. 6C, the reflective film 110 is patterned using a resist mask 112 formed on the surface of the reflective film 110, and as shown in FIG. 6D, an image of the surface of the glass substrate 100. The first reflective film 11 is left in the display area 15. Further, the outer region of the image display region 15 does not directly participate in the display of the image, but is also reflected between the planned formation position of the light shielding film 13 defining the image display region 15 and the planned formation position of the sealing material 7. Membrane 1
10 is left as the second reflective film 11 '. Further, the second reflective film 11 'is left in the region outside the region where the sealing material 7 is formed, inside the substrate forming region 10'. Furthermore, on the surface of the original substrate 100 ', the substrate forming region 1
The second reflective film 11 'is left in the outer region of 0'. The above is the reflective film forming step.

Next, as shown in FIG. 7A, the original substrate 1
A photosensitive resin 12 is formed on the entire surface of 00 'by a spin coating method.
After applying 0, the resin 120 is exposed and developed, and as shown in FIG. 7B, the light-shielding film that defines the light-transmitting region of each pixel by leaving the resin 120 in a matrix in a predetermined region. 12, and a light-shielding film 13 for defining the image display area 15 is formed. In addition, in the area outside the image display area 15, the second reflective film 11 ′ left between the light shielding film 13 and the position where the sealing material 7 is to be formed, and inside the substrate forming area 10 ′, the sealing material 7 is formed. The resin 120 is left as a light-shielding film 12 'on the second reflective film 11' left on the outer region of the planned formation position and on the upper layer side of the second reflective film 11 'left on the outer region of the substrate formation region 10'. . The above is the light-shielding film forming step.

Next, as shown in FIG. 7C, the color filters 2R and 2R are formed between the light shielding films 12 by the photolithography technique, the flexographic printing method, or the ink jet method.
2G and 2B are formed. At this time, the color filters 2R,
One of 2G and 2B is left between the light-shielding film 13 and the position where the sealing material 7 is to be formed. A color filter 2'is formed on the light-shielding film 12 'left on the outer region and on the light-shielding film 12' left on the outer region of the substrate formation region 10 '. The above is the color filter forming step.

Thereafter, as shown in FIG. 3, the overcoat film 1 is formed on the surfaces of the color filters 2R, 2G and 2B.
7, the strip-shaped data line 52 and the alignment film 18 are formed in this order, and the alignment film 182 is rubbed (overcoat film forming step, data line forming step, alignment film forming step).

On the other hand, similarly for the element substrate 20, the TFD element, the pixel electrode 66 and the alignment film 28 are formed on the original substrate from which a large number of element substrates 20 can be obtained (element substrate forming step).

Then, while the gap material 5 is dispersed on the original substrate for forming the element substrate 20 (gap material dispersion step), the original substrate 100 'for forming the counter substrate 10 is shown in FIG. A) is applied with the sealing material 7 at the position indicated by the alternate long and short dash line L2 (sealing material applying step).
In a state where the two original substrates are bonded to each other with the substrate sandwiched, the sealing material 7 is cured while pressing the original substrates from both sides to form an empty panel structure (substrate bonding step). In this panel structure, the distance between the substrates is defined by the gap material mixed with the seal material 6 and the gap material 5. Next, the panel structure is cut into strips to expose the discontinuous portion of the sealing material 7 as a liquid crystal injection port (not shown) (first scribing step), and the liquid crystal 6 is injected from this liquid crystal injection port. The liquid crystal device 1'can be manufactured by sealing the liquid crystal inlet (injecting / sealing step) and then cutting the panel structure into a predetermined size (second scribing step).

(Handling method of counter substrate and original substrate)
In such a manufacturing method, when the process of forming the data lines 52 and the like on the surface of the original substrate 100 '(counter substrate 10), the rubbing process, the substrate bonding process, the scribing process, etc. are performed, the original substrate 100' and the panel. The structure is transported to various devices and set at a predetermined position. At this time, as shown in FIG.
01 is irradiated with light from a light source 410 using an LED or the like, and the reflected light is detected by a photodetector 420 using a photodiode or the like, thereby detecting the presence or absence and the position of the original substrate 100 ′.

(Effect of this embodiment) Here, the original substrate 100 '
In the area other than the image display area 15 on the surface of the light shielding film 1
If a large number of 2'and color filters 2'are formed, the original substrate 100 'is formed in the region where such a film is formed.
Since the intensity of the reflected light is extremely low even when the back surface 101 of the substrate is irradiated with light, the presence or absence and the position of the original substrate 100 ′ cannot be detected using such a region, but in the present embodiment, A second reflective film 11 'of the same layer as the first reflective film 11 is formed on the lower layer side of the light shielding film 12' and the color filter 2'formed in a region other than the image display region 15. . Therefore, other than the image display area 15, the original substrate 10 is formed in the area where the second reflective film 11 ′ is formed.
When the light is irradiated from the back surface of 0 ', this light is reflected by the second reflection film 11', so that the intensity of the reflected light is high. Therefore,
The presence or absence and the position of the original substrate 100 '(first transparent substrate 10) can be detected based on the light reflected on the back surface side of the original substrate 100'.

Further, in the present embodiment, the light-shielding film 12 'and the color filter 2'are formed between the light-shielding film 13 and the sealing material 7 in the area outside the image display area 15, and the lower layer thereof. Since the second reflective film 11 ′ is formed on the side, the film structure is substantially similar to that of the image display area 15. Therefore, the thickness of the film formed on the surface of the counter substrate 10 (original substrate 100 ') can be equalized inside and outside the image display region 15, so that the gap material 5 acts effectively and the counter substrate 10
The distance between the element substrate 20 and the element substrate 20 can be made highly accurate.

Further, between the light-shielding film 13 and the sealing material 7, inside the substrate forming area 10 ', outside the area where the sealing material 7 is formed and outside the substrate forming area 10', Since the light-shielding film 12 'and the color filter 2'are formed and the second reflecting film 11' is formed under the light-shielding film 12 ', the image display region 15 is also formed in these regions.
It has the same film structure as. Therefore, in the substrate bonding step of bonding the original substrates to each other with the seal material 7, when the original substrates are pressed against each other until the seal material 7 is cured,
Since a uniform force can be applied to the entire original substrate, the distance between the counter substrate 10 and the element substrate 20 can be made highly accurate.

[Other Embodiments] In the above embodiment, between the light-shielding film 13 and the sealing material 7, inside the substrate forming area 10 ′, outside the area where the sealing material 7 is formed, and in the substrate. Although the three-layer structure of the second reflection film, the light shielding film 12 ', and the color filter 2'is provided in any of the regions outside the formation region 10', the second reflection film 11 'is provided in any of these regions. It may be a configuration in which only one is formed.

Further, between the light-shielding film 13 and the sealing material 7, inside the substrate forming area 10 ', outside the area where the sealing material 7 is formed, and outside the substrate forming area 10', Only one of the light-shielding film 12 'and the color filter 2'may be formed, and in any case, the second reflective film 11' may be formed on the lower layer side thereof.

Furthermore, in the above embodiment, a plurality of counter substrates 10 and element substrates 20 are provided for the original substrate,
Although it was a built-in structure, it is a counter substrate 1 with respect to the original substrate.
The present invention may be applied to the case where only one substrate 0 and the element substrate 20 are formed, or when these elements are formed on the counter substrate 10 and the element substrate 20 each having a single product size and then these substrates are bonded to each other. Good.

Furthermore, in the above embodiment, an example in which the present invention is applied to the active matrix type liquid crystal device 1 using the TFD element 56 as an active element has been described.
Not limited to this, the present invention may be applied to manufacture an active matrix type liquid crystal device using a thin film transistor as an active element, or other electro-optical devices. Can be modified in various ways.

[Embodiment of Electronic Device] FIG. 8 shows an embodiment in which the liquid crystal device according to the present invention is used as a display device of various electronic devices. The electronic device shown here has a display information output source 70, a display information processing circuit 71, a power supply circuit 72, a timing generator 73, and a liquid crystal device 74. The liquid crystal device 74 also includes a liquid crystal display panel 75 and a drive circuit 76. The liquid crystal device 1 described above can be used as the liquid crystal device 74 and the liquid crystal device 75.

The display information output source 70 is a ROM (Read
Only Memory), RAM (Random)
A memory such as an Access Memory), a storage unit such as various disks, a tuning circuit that tunes and outputs a digital image signal, and the like, and a display such as an image signal of a predetermined format based on various clock signals generated by the timing generator 73. Information is supplied to the display information processing circuit 71.

The display information processing circuit 71 is provided with various known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, a clamp circuit, etc., and executes processing of input display information. , And supplies the image signal to the drive circuit 76 together with the clock signal CLK. The drive circuit 76 is a general term for the scanning line drive circuit 57, the data line drive circuit 58, the inspection circuit, etc. in FIG. Further, the power supply circuit 72 supplies a predetermined voltage to each component.

FIG. 9 shows a mobile personal computer which is an embodiment of the electronic apparatus according to the present invention. The personal computer shown here has a main body 82 having a keyboard 81, and a liquid crystal display unit 83. The liquid crystal display unit 83 includes the liquid crystal device 1 described above.

FIG. 10 shows a mobile phone which is another embodiment of the electronic apparatus according to the present invention. The mobile phone 90 shown here has a plurality of operation buttons 91 and the liquid crystal device 1.

[0061]

As described above, according to the present invention, since the second reflective film is formed in the area that is not involved in the display (the area outside the image display area), such an area other than the image display area is also formed. When the back surface of the first transparent substrate is irradiated with light, the intensity of the reflected light is high. Therefore, the presence or absence and the position of the first transparent substrate can be detected based on the reflected light on the back surface side of the first transparent substrate.

[Brief description of drawings]

FIG. 1 is a block diagram schematically showing an electrical configuration of a liquid crystal device.

FIG. 2 is an exploded perspective view showing the structure of the liquid crystal device shown in FIG.

FIG. 3 is a cross-sectional view showing the structure of the liquid crystal device shown in FIG.

4A, 4B, and 4C are plan views of one pixel of an element substrate among a pair of substrates holding a liquid crystal in a liquid crystal device, and III- in FIG. 4A. FIG. 3 is a sectional view taken along line III ′ and a perspective view of a TFD element formed in each pixel.

5A and 5B are respectively a plan view showing a configuration of an original substrate used to manufacture a counter substrate used in the liquid crystal device of the present embodiment, and a cross section taken along the line AA ′ of the original substrate. It is a figure.

6A to 6D are process cross-sectional views showing a method of manufacturing a counter substrate of a liquid crystal device to which the present invention is applied.

7A to 7C are process cross-sectional views showing a method of manufacturing a counter substrate of a liquid crystal device to which the present invention is applied.

FIG. 8 is a block diagram showing a configuration of various electronic devices using the liquid crystal device according to the present invention.

FIG. 9 is an explanatory diagram showing a mobile personal computer as one embodiment of an electronic apparatus using the liquid crystal device according to the present invention.

FIG. 10 is an explanatory diagram of a mobile phone as an embodiment of an electronic device using the liquid crystal device according to the invention.

FIG. 11 is a cross-sectional view showing a structure of a conventional liquid crystal device.

12A and 12B are respectively a plan view showing a configuration of an original substrate used to manufacture a counter substrate used in a conventional liquid crystal device, and a cross-sectional view taken along line A1-A1 ′ of the original substrate. Is.

[Explanation of symbols]

1 Liquid crystal device (electro-optical device) 2R, 2G, 2B, 2'color filters 6 Liquid crystal (electro-optical material) 7 Seal material 10 Counter substrate (first transparent substrate) 10 'Substrate formation area 11 First reflective film 11 'Second reflective film 12, 12 ', 13 Light-shielding film 15 image display area 20 element substrate (second transparent substrate) 51 scan lines 52 data lines 53 pixels 66 pixel electrodes 100 'original board 410 light source 420 photo detector

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G09F 9/00 342 G09F 9/00 342Z 352 352 9/30 349 9/30 349B 349C 9/35 9/35 F term (reference) 2H048 BA02 BA11 BA45 BA55 BA64 BB02 BB42 2H088 FA03 FA04 FA16 FA18 HA12 HA14 HA21 MA20 2H091 FA02Y FA14Z FA34Y GA03 GA06 GA09 GA11 GA13 LA12 LA30 5C094 AA43 BA43 CA19 CA24 EB03 BB16 A12 BB03 ED03G15A12 KK05 KK07 KK09 KK10

Claims (11)

[Claims] 1. A first reflective film is formed in an image display region on the surface of a first transparent substrate holding an electro-optical material, and a light-shielding film is formed on an upper layer side of the first reflective film. When manufacturing the electro-optical device in which the color filter is formed, when handling the first transparent substrate,
In the method of manufacturing an electro-optical device, which detects the presence or the position of the first transparent substrate by irradiating the back surface of the transparent substrate with light and detecting the reflected light, Then, when the first reflective film is formed, the second reflective film is formed in an area outside the image display area. 2. The lower layer side of the color filter formed on the surface of the first transparent substrate, wherein the color filter is formed also in an area outside the image display area, and the color filter is formed outside the image display area. A method for manufacturing an electro-optical device, wherein the second reflective film is formed on the first reflective film. 3. The light-shielding film according to claim 1 or 2, wherein the light-shielding film is formed on a surface of the first transparent substrate even in an area outside the image display area, and the light-shielding film is formed outside the image display area. A method for manufacturing an electro-optical device, comprising forming the second reflective film on a lower layer side of the film. 4. The method according to any one of claims 1 to 3,
The first transparent substrate is larger than the size mounted on the electro-optical device at least until the formation of the first reflective film, the second reflective film, the light shielding film, and the color filter is completed. In the state of the original substrate, when handling the first transparent substrate in the state of the original substrate, the back surface of the original substrate is irradiated with light and the reflected light is detected to detect the original substrate. A method for manufacturing an electro-optical device, characterized by detecting the presence or absence or the position. 5. The substrate according to claim 3, wherein:
A method of manufacturing an electro-optical device, further comprising forming the second reflective film outside a substrate formation region where the first transparent substrate is cut out. 6. The color filter according to claim 5, wherein the color filter is formed on a surface of the original substrate outside a substrate formation region where the first transparent substrate is cut out, and the color filter is formed outside the substrate formation region. The method of manufacturing an electro-optical device, wherein the second reflective film is formed on the lower layer side of the color filter. 7. The light-shielding film according to claim 5, wherein the light-shielding film is formed outside the substrate forming region of the original substrate where the first transparent substrate is cut out, and is formed outside the substrate forming region. The method of manufacturing an electro-optical device, wherein the second reflective film is formed on a lower layer side of the light shielding film. 8. The method according to any one of claims 1 to 3,
Bonding a second transparent substrate to the first transparent substrate via a sealing material, and then injecting liquid crystal as the electro-optical substance into a region defined by the sealing material between the substrates. A method for manufacturing an electro-optical device, comprising: 9. The method according to claim 4, wherein
A second transparent substrate is attached to the original substrate via a sealing material, and then liquid crystal as the electro-optical material is injected into a region defined by the sealing material between the substrates. Method for manufacturing electro-optical device. 10. An electro-optical device manufactured by the method according to claim 1. 11. An electronic apparatus comprising the electro-optical device according to claim 10 as a display unit.