JP2003057634A5 - - Google Patents

Description

[0003]
Among such electro-optical devices, for example, in an active matrix liquid crystal device using a TFD element (Thin Film Diode / thin film diode element) as an active element, as shown in FIG. An element (not shown) and a transparent pixel electrode 66 are formed, and a stripe-shaped counter electrode is formed as a data line 52 on the transparent counter substrate 10 as well. Here, the opposing substrate 10 and the element substrate 20 are bonded together by the sealing material 7 applied in a ring shape, and the liquid crystal 6 as an electro-optical material is injected and held in the area partitioned by the sealing material 7 . There is. Further, the distance between the counter substrate 10 and the element substrate 20 is defined by the gap material blended in the sealing material 6 and the gap material 5 interposed between the counter substrate 10 and the element substrate 20.

[0007]
Then, the gap material 5 is dispersed on the original substrate for forming the element substrate 20, while the original substrate 100 'for forming the counter substrate 10 is located at a position indicated by a dashed dotted line L2 in FIG. The sealing material 7 is applied, and the sealing material 7 is cured while pressing the original substrate from both sides in a state where the two original substrates are attached to each other so as to sandwich the sealing material 7 to form an empty panel structure. . In this state, in the panel structure, the gap between the substrates is defined by the gap material blended in the seal material 7 and the gap material 5. Therefore, the panel structure is cut into strips to expose the discontinuous portion of the sealing material 7 as a liquid crystal injection port (not shown), the liquid crystal 6 is injected from the liquid crystal injection port, and then the liquid crystal injection port is sealed. Thereafter, the panel structure is cut into a predetermined size, whereby the liquid crystal device 1 'can be manufactured.

[0028]
The counter substrate 10 and the element substrate 20 are bonded together by a sealing material 7 applied in a ring shape, and liquid crystal 6 as an electro-optical material is injected and held in a region partitioned by the sealing material 7. Further, the distance between the counter substrate 10 and the element substrate 20 is set with high accuracy by the gap material blended in the sealing material 7 and the gap material 5 interposed between the counter substrate 10 and the element substrate 20.

[0047]
Then, while scattering the gap material 5 on the original substrate for forming the element substrate 20 (gap material dispersion step), the original substrate 100 ′ for forming the counter substrate 10 is shown in FIG. 5A. The sealing material 7 is applied to the position indicated by the alternate long and short dash line L2 (sealing material application step), and the sealing material 7 is sandwiched between the two original substrates while holding the sealing material 7 while the original substrate is pressed from both sides Are cured to form an empty panel structure (substrate bonding step). The gap between the substrates in this panel structure is defined by the gap material blended in the seal material 7 and the gap material 5. Next, the panel structure is cut into strips to expose the discontinuous portion of the sealing material 7 as a liquid crystal injection port (not shown) (first scribing step) and the liquid crystal 6 is injected from the liquid crystal injection port The liquid crystal injection port is sealed (injecting and sealing process), and then the panel structure is cut into a predetermined size, whereby the liquid crystal device 1 'can be manufactured (second scribing process).

Claims (11)

A first reflective film is formed in the image display area of the surface of the first transparent substrate that holds the electro-optical material, and a light shielding film and a color filter are formed on the upper layer side of the first reflective film. When manufacturing the electro-optical device, when the first transparent substrate is handled, the back surface of the first transparent substrate is irradiated with light, and the reflected light is detected to detect the first transparent substrate. In a method of manufacturing an electro-optical device for detecting the presence or absence or position of a substrate,
When forming the first reflective film on the first transparent substrate, a second reflective film is formed in the outer area of the image display area . 2. The color filter according to claim 1, wherein the color filter is formed on the surface of the first transparent substrate also in the outer area of the image display area, and the second side is formed on the lower layer side of the color filter formed outside the image display area. A method of manufacturing an electro-optical device, characterized in that a reflective film is formed. The light shielding film according to claim 1 or 2 , wherein the light shielding film is formed on the surface of the first transparent substrate also in an area outside the image display area, and the lower side of the light shielding film formed outside the image display area. A method of manufacturing an electro-optical device, comprising forming a second reflection film. 4. The method according to claim 1, wherein the first transparent substrate has at least the first reflection film, the second reflection film, the light shielding film, and the color filter. It is in the state of the original substrate larger than the size mounted on the optical device,
When the first transparent substrate is handled in the state of the original substrate, light is irradiated to the back surface of the original substrate, and the presence or absence or position of the original substrate is detected by detecting the reflected light. And a method of manufacturing an electro-optical device. 5. The method of manufacturing an electro-optical device according to claim 4 , wherein the second reflection film is also formed outside the substrate formation region where the first transparent substrate is cut out of the original substrate. 6. The color filter according to claim 5, wherein the color filter is formed outside the substrate formation region where the first transparent substrate is cut out of the surface of the original substrate, and the color filter is formed outside the substrate formation region. A method of manufacturing an electro-optical device, wherein the second reflective film is formed on the lower layer side of 7. The light shielding film according to claim 5, wherein the light shielding film is formed outside the substrate formation region where the first transparent substrate is cut out of the original substrate, and the light shielding film is formed outside the substrate formation region. A method of manufacturing an electro-optical device, wherein the second reflective film is formed on the lower layer side of 4. The semiconductor device according to claim 1, wherein a second transparent substrate is attached to the first transparent substrate via a sealing material, and then the second transparent substrate is placed in a region partitioned by the sealing material between the substrates. A method of manufacturing an electro-optical device, comprising injecting a liquid crystal as an electro-optical material. 8. The electro-optical material according to any one of claims 4 to 7, wherein a second transparent substrate is attached to the original substrate via a sealing material, and thereafter the electro-optical material is formed in a region partitioned by the sealing material between the substrates. A method of manufacturing an electro-optical device characterized in that a liquid crystal is injected as An electro-optical device manufactured by the method according to any one of claims 1 to 9. An electronic apparatus comprising the electro-optical device according to claim 10 as a display unit.