JP2003046221A - Method of manufacturing electronic component wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component wiring board which is capable of preventing a short circuit from occurring between wiring patterns formed by etching or screen printing. SOLUTION: A circuit pattern is composed of wiring patterns 19 provided in array, a common wire 26 is provided to either of the wiring patterns 19, and the wiring patterns 19 are set independent of each other at a joint between the wiring pattern and the common wire 26. The circuit pattern is formed by etching in a method of manufacturing an electronic component wiring board 10, where a part 19a corresponding to the wiring pattern 19 is provided to a pattern mask 17 used for forming an etching resist film 18 utilized in an etching process, and a corresponding enlarged space 27 which furthermore enlarges a space 25 formed between the wiring patterns 19 is provided to the corner of the pattern mask 17 where a part 26a corresponding to the common wire 26 and a part 19a corresponding to the wiring pattern 19 are connected together.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component wiring board for mounting an electronic component such as a semiconductor element, and more specifically, to a short circuit in a wiring pattern which is adjacent to a wiring pattern via a space portion. The present invention relates to a method for manufacturing a wiring board for electronic components having a non-existing circuit pattern.

[0002]

2. Description of the Related Art As electronic components such as semiconductor elements have become higher in performance and smaller in size in recent years, wiring boards for electronic components for mounting electronic components have a large number of external connection terminals, semiconductor elements, etc. From the viewpoint of mountability, cost reduction, heat dissipation characteristics, low impedance, high insulation characteristics, etc., wiring boards made of plastic, packages made of ceramics, and multilayer wiring boards are often used.

As shown in FIGS. 6A to 6E, for example, a plastic wiring board 50 includes a resin base material 5 made of resin.
Through holes 54 are formed at predetermined positions in a one-layer or multi-layered copper-clad resin base material 53 having high heat resistance, which is provided with a conductor layer formed by joining copper foils 52 on both sides of the copper-clad resin base. Material 53
Copper plating 55 is applied to the surface layer and the through holes 54. Further, a dry film is attached to the surface layer, and the wiring pattern 5
The etching resist film 56 is formed by a photolithography method so as to have eight patterns, the etching solution 57 is sprayed on the copper layer formed of the copper foil 52 and the copper plating 55 to perform etching, and then the etching resist film 56 is peeled off. To form the wiring pattern 58. Then, a photosensitive solder resist is screen-printed, and the wire bond pad 59 and the external connection terminal pad 6 are formed by photolithography.
It is covered with a solder resist film 61 except for parts such as 0,
The portion exposed from the opening of the solder resist film 61 is formed by nickel plating and gold plating.

Further, as shown in FIGS. 7 (A) and 7 (B),
For example, in the ceramic package 70, a ceramic green sheet made of alumina or the like is provided with electronic component mounting portions such as semiconductor elements and through holes, and a screen printing screen having 72 wiring patterns is applied to the ceramic green sheet. The through-hole conductor 71 and the wiring pattern 72 are formed by screen printing using a high melting point metal paste made of tungsten or molybdenum, and a plurality of these ceramic green sheets are stacked and pressed while heating. To form a laminate,
The ceramic green sheet and the refractory metal are formed by simultaneous firing at a high temperature of about 1550 ° C. in a reducing atmosphere.

[0005]

However, in the conventional method of manufacturing a wiring board for electronic parts such as a plastic wiring board and a ceramic package as described above,
There are the following problems. (1) As shown in FIG. 8 (A), a circuit pattern having, for example, each wiring pattern 58 and a common line 62 which serves as a plating routing pattern for short-circuiting the wiring pattern 58 to perform plating is etched. In the case of the plastic wiring board 50 to be formed, the flow of the etching solution becomes poor in the etching in the vicinity of the corners where the wiring patterns 58 and the common line 62 are connected, and the etching residual portion 65 is generated in the space portion 64. Even if the connecting portion between the common line 62 and each wiring pattern 58 is cut and cut by the cutting portion 63 after plating, a short-circuit portion 66 occurs between the adjacent wiring patterns 58. (2) As shown in FIG. 8 (B), on a ceramic substrate,
In the case of a ceramic package 70 that has a bent portion 74 and adjacent wiring patterns 72 are adjacent to each other through a narrow space portion 73 to form a circuit pattern by using screen printing, a portion near the corner of the bent portion 74 is formed. In screen printing, a bleed portion 75 of the printing paste is generated, and a short circuit occurs between the adjacent wiring patterns 72. The present invention has been made in view of the above circumstances, and provides a method for manufacturing a wiring board for an electronic component, which prevents a short circuit from occurring between wiring patterns formed by etching or screen printing. With the goal.

[0006]

According to a first aspect of the present invention, there is provided a method of manufacturing a wiring board for electronic parts, which has a common line on one of wiring patterns arranged in parallel, and finally a wiring pattern. In a method of manufacturing a wiring board for electronic components for forming a circuit pattern for separating and independently separating each wiring pattern at a joint portion between a pattern and a common line, in a pattern mask for forming an etching resist film used for etching processing, Corresponding enlarged space portions are provided at the corners where the portions corresponding to the wiring patterns and the portions corresponding to the common lines are connected, and the space portions formed between the wiring patterns further expand. As a result, the etching solution easily flows to the corners of the space formed between the wiring patterns, and the etching process can be performed while preventing the etching solution from being stagnant. Therefore, for example, even if the common line, which is a plating routing pattern, and each wiring pattern are cut after etching, the generation of unetched portions can be suppressed, so that a short circuit between adjacent wiring patterns of the product portion can be prevented. it can.

According to a second aspect of the present invention, there is provided a method for manufacturing a wiring board for electronic parts, which has a bent portion on a ceramic substrate and adjacent wiring patterns are close to each other via a narrow space portion. In a method of manufacturing a wiring board for an electronic component in which a circuit pattern is formed by screen printing, a printing resist film of a screen printing screen used in screen printing has a corner near at least one corner of a portion corresponding to a bent portion. In addition, a corresponding enlarged space portion is provided which substantially expands a portion corresponding to the space portion. As a result, the bleeding of the printing paste can be absorbed in the enlarged space portion formed by the corresponding enlarged space portion and can be suppressed to the vicinity of at least one corner of the bent portion, so that a short circuit between adjacent wiring patterns can be prevented. it can.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Next, referring to the attached drawings, an embodiment in which the present invention is embodied will be described to provide an understanding of the present invention. Here, FIGS. 1 (A) to 1 (E) are explanatory views of a method for manufacturing a wiring board for electronic parts according to the first embodiment of the present invention, and FIGS. 2 (A) to 2 (D) are the same electronic drawings, respectively. 3A to 3C are partially enlarged plan views illustrating a method of forming a circuit pattern of a component wiring board, and FIGS. 3A to 3C are used in a method for manufacturing an electronic component wiring board according to a second embodiment of the present invention. 4A to 4C are partially enlarged plan views of the screen printing screen used in the method for manufacturing the electronic component wiring board, respectively, and FIG. (C) is an explanatory view of the manufacturing method of the wiring board for electronic components, respectively.

A method of manufacturing a plastic wiring board 10, which is an example of a wiring board for electronic parts according to the first embodiment of the present invention, will be described with reference to FIGS.
As shown in FIG. 1 (A), both surfaces of a resin base material 11 such as BT resin (a resin containing bismaleimide triazine as a main component) or polyimide resin having excellent heat resistance, dielectric properties, insulation properties, and processability. In addition, a single-layer or multi-layer high heat-resistant copper-clad resin substrate 13 having a conductor layer formed by stretching a copper foil 12 having a copper thickness of 10 to 70 μm and a copper purity of 99.8% or more.
Through holes 14 are drilled at predetermined positions of the copper-clad resin substrate 13 by using a drill or a laser.

Then, after applying a catalyst such as palladium to the surface of the copper foil 12 of the copper-clad resin substrate 13 and the wall surface of the through hole 14, electroless copper plating is performed in a strong alkaline bath using formalin as a reducing agent. Then, the both surface layers of the copper-clad resin substrate 13 are brought into an electrically conducting state via the copper conductor film formed on the wall surface of the through hole 14. Then, in the plating bath through the electroless copper-plated conductor film, for example, a copper plate attached to the anode side in a plating bath of copper sulfate, pyrophosphoric acid or the like is the object to be attached attached to the cathode side. The electroless copper plating of the copper-clad resin substrate 13 as the object to be plated is performed by arranging the copper-clad resin substrate 13 so as to face the copper-clad resin substrate 13 and applying the voltage of the DC power supply device between the copper plate and the copper-clad resin substrate 13. Metal copper is deposited on the surface layer and the through holes 14 that have been applied and electrolytic copper plating is applied to form a copper plated film 15 composed of electroless copper plating and electrolytic copper plating. The copper plating film 15 is also formed on the surface of the copper foil 12.
Then, a photosensitive dry film 16 is attached on the copper plating film 15.

Next, as shown in FIGS. 1 (B) and 1 (C),
Etching pattern mask 17 is dry film 16
The exposed portion is exposed to ultraviolet rays by a normal photolithography method, exposed and developed to remove the portion other than the portion covering the desired circuit pattern having the wiring pattern 19 from the dry film 16 to form the opening 20. The etching resist film 18 having is formed. Then, an etching solution such as a ferric chloride solution, a cupric chloride solution, an alkaline etchant, a hydrogen peroxide-sulfuric acid-based etchant is sprayed to perform an etching process, and the opening 20 of the etching resist film 18 is formed.
The copper foil 12 and the copper plating film 15 exposed from the are removed.

Next, as shown in FIG. 1D, a stripping solution is sprayed on the surface of the etching resist film 18 to swell it, and the etching resist film 18 is stripped to form a circuit pattern having a wiring pattern 19. Furthermore, FIG.
As shown in (E), a photosensitive solder resist is applied by a roll coater, screen printing, or the like, a pattern mask for the solder resist is brought into contact, and ultraviolet exposure and development are performed by a photolithography method to open the opening 22. The solder resist film 21 having is formed. A portion of the solder resist film 21 exposed from the opening 22 is plated with Ni and Au, and has a wire bond pad 23 for connecting to a semiconductor element with a bonding wire, a pad 24 for an external connection terminal, and the like. The plastic wiring board 10 is formed.

The circuit pattern of the plastic wiring board 10 is, for example, a common line which is a plating routing pattern used when plating is performed by short-circuiting adjacent wiring patterns 19 to one of the wiring patterns 19 arranged in parallel. 26, and finally the wiring pattern 19 and the common line 26 are cut at the junction (reference numeral 28 in FIG. 2D indicates a cutting line) to separate the wiring pattern 19 independently. ing. In order to form this circuit pattern by etching (see FIG. 1C), first, as shown in FIG.
As shown in (A), an etching pattern mask 17 for forming an etching resist film 18 used for etching is arranged on the dry film 16. This etching pattern mask 17 has a wiring pattern 1
A corresponding enlarged space portion 27 is provided at the corner where the portion 19a corresponding to 9 and the portion 26a corresponding to the common line 26 are connected and the space portion 25 formed between the wiring patterns 19 further expands.

Then, as shown in FIG. 2B, a portion other than the covering portion of the pattern mask 17 for etching is exposed (exposure and developed by irradiation with ultraviolet rays by a normal photolithography method) (a portion indicated by a grid line in the drawing). To remove dry film 1
An etching resist film 18 exposing the copper plating film 15 from the opening 20 of 6 is formed. Similar to the pattern of the etching pattern mask 17, in the etching resist film 18, a space portion 25 further expands at the corner where the portion corresponding to the wiring pattern 19 and the portion corresponding to the common line 26 are connected. A space portion 27a is provided.

Next, as shown in FIG. 2C, an etching solution is jetted onto the copper plating film 15 exposed from the opening 20 of the etching resist film 18 to remove the copper plating film 15 and the copper foil 12. The resin base material 11 is exposed to form the space portion 25. Then, the etching resist film 1
8 is peeled off to remove the common line 26 on one side of the wiring pattern 19.
Forming a circuit pattern having In this etching process, since the corresponding enlarged space portion 27a of the etching resist film 18 causes the etching solution to flow well to the corner of the space portion 25, an unetched portion is formed at the corner where the space portion 25 and the common line 26 are connected. It can be prevented from occurring. Therefore, as shown in FIG.
Even after cutting the joint between the wiring pattern 19 and the common line 26 after coating with the solder resist film 21, a short circuit between the adjacent wiring patterns 19 can be prevented. The shapes of the corresponding expansion space portions 27 and 27a are as follows.
The shape may be any of a circle, an ellipse, a triangle, a square, a polygon, or a combination thereof, and is not particularly limited.

Next, a method of manufacturing the ceramic package 10a, which is an example of the electronic component wiring board according to the second embodiment of the present invention, will be described with reference to FIGS. First, a ceramic powder, for example, alumina (Al ₂ O ₃ ) powder, to which a suitable amount of a sintering aid such as magnesia, silica, or calcia is added, and a plasticizer such as dioxyl phthalate,
A binder such as an acrylic resin and a solvent such as toluene, xylene, alcohols, etc. are added, sufficiently kneaded, and defoamed to prepare a slurry having a viscosity of 2000 to 40,000 cps.
mm-shaped roll-shaped sheet, cut into an appropriate size, and formed into a plurality of rectangular ceramic green sheets 29.
(See FIG. 5). Then, a punching die, an NC punching machine or the like is used for each ceramic green sheet 29 to form a plurality of through holes, positioning holes for screen printing, etc., and a cavity portion for mounting electronic components such as semiconductor elements. A hole for forming the is formed.

On the other hand, as shown in FIGS. 3 (A) to 3 (C),
The screen-printing screen 30 used for screen-printing on the ceramic green sheet 29 serving as a ceramic substrate is, for example, polyester, nylon,
A screen mesh 31 formed by alternately weaving vertical and horizontal lines made of synthetic fibers such as tetoron or fine wires of stainless steel is attached and fixed to a screen plate frame, and a photosensitive emulsion 32 is applied on both sides and dried. To attach. Next, a photosensitive pattern mask 33 is formed on the surface side of the screen mesh 31 to which the photosensitive emulsion 32 is attached, in contact with the screen printing material.
Are exposed to light and developed to remove a portion of the photosensitive emulsion 32 which becomes a desired wiring pattern 40 (see FIG. 5B) to form a screen pattern. Then, the remaining photosensitive emulsion is cured to form a printing resist film 34, which is manufactured.

A circuit having a bent portion which is bent at a substantially right angle on a ceramic substrate by screen printing using this resist film 34 for printing, and adjacent wiring patterns 40 are adjacent to each other via a narrow space portion. When forming a pattern, as shown in FIG. 4A, a corresponding enlarged space portion 37 that substantially expands a portion 36 corresponding to the space portion near at least one corner of the portion 35 corresponding to the bent portion.
Is provided. In addition, as shown in FIG. 4B, the corresponding enlarged space portion 3 that substantially expands the portion 36 corresponding to the space portion in the portion 35 corresponding to the bent portion in the vicinity of the other corner portion.
7a can also be provided. Further, as shown in FIG. 4C, corresponding enlarged space portions 37b and 37c can be provided near both corners of the portion 35 corresponding to the bent portion in plan view. The shape of the corresponding expansion space portion is not particularly limited.

Next, as shown in FIGS. 5A and 5B, a screen printing screen 30 is brought into contact with the surface of the ceramic green sheet 29. Then, the printing paste 38 is extruded from the opening of the printing resist film 34 with a squeegee 39 to print, thereby forming a circuit pattern having a wiring pattern 40. By providing the corresponding enlarged space portion, the bleeding of the printing paste 38 can be absorbed in this portion, and a short circuit between adjacent wiring patterns can be prevented. Then, as shown in FIG. 5C, the plurality of ceramic green sheets 2 on which the wiring patterns 40 are formed are formed.
9 are stacked and thermocompression bonded to form a laminated body.
The ceramic package 10a is manufactured by firing in a reducing atmosphere at 0 ° C.

[0020]

According to the first aspect of the present invention, there is provided a method of manufacturing a wiring board for an electronic component, wherein a pattern mask for forming an etching resist film used in an etching process has a portion corresponding to a wiring pattern and a portion corresponding to a common line. Since the corresponding enlarged space portion that further expands the space portion formed between each wiring pattern is provided at the corner where the wiring pattern is connected, the etching liquid easily flows to the vicinity of the corner of the corresponding enlarged space portion, and the etching is not processed. The etching process can be performed by preventing the generation of a portion. Therefore, for example, after the common line of the wiring pattern, which is the plating lead-out pattern, is cut after the etching process, no unetched portion remains, and it is possible to prevent the occurrence of a short circuit between the adjacent wiring patterns of the product portion.

According to a second aspect of the present invention, there is provided a method of manufacturing a wiring board for an electronic component, wherein a printing resist film of a screen printing screen used in screen printing has at least one corner of a portion corresponding to a bent portion near a corner. Since the corresponding enlarged space portion that substantially expands the portion corresponding to the space portion is provided, the bleeding of the printing paste can be absorbed in the corresponding enlarged space portion, and it can be suppressed near at least one corner of the bent portion, so it is adjacent It is possible to prevent a short circuit between the wiring patterns.

[Brief description of drawings]

1A to 1E are explanatory views of a method for manufacturing an electronic component wiring board according to a first embodiment of the present invention.

2A to 2D are partially enlarged plan views illustrating a method of forming a circuit pattern on the electronic component wiring board.

3A to 3C are explanatory views of a method for producing a screen printing screen used in a method for producing an electronic component wiring board according to a second embodiment of the present invention.

FIG. 4A to FIG. 4C are partially enlarged plan views of screen printing screens used in the method for manufacturing the same electronic component wiring board.

5A to 5C are explanatory views of a method for manufacturing the same electronic component wiring board.

6A to 6E are explanatory views of a conventional method for manufacturing a wiring board for electronic parts.

7A and 7B are explanatory views of a conventional method for manufacturing a wiring board for electronic parts.

8A and 8B are explanatory views of a conventional method for manufacturing a wiring board for electronic components.

[Explanation of symbols]

10: Plastic wiring board, 10a: Ceramic package, 11: Resin base material, 12: Copper foil, 13: Copper-clad resin board, 14: Through hole, 15: Copper plating film, 1
6: Dry film, 17: Pattern mask for etching, 18: Etching resist film, 19: Wiring pattern, 19a: Portion corresponding to wiring pattern, 20: Opening portion, 21: Solder resist film, 22: Opening portion, 23:
Wire bond pad, 24: Pad for external connection terminal, 2
5: space part, 26: common line, 26a: part corresponding to common line, 27, 27a: corresponding expanded space part, 28:
Cutting line, 29: Ceramic green sheet, 30: Screen for screen printing, 31: Screen mesh,
32: Photosensitive emulsion, 33: Photosensitive pattern mask, 3
4: resist film for printing, 35: a portion corresponding to the bent portion,
36: parts corresponding to the space part, 37, 37a, 37
b, 37c: corresponding expansion space portion, 38: print paste, 39: squeegee, 40: wiring pattern

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 23/12 H05K 3/12 610P H05K 3/12 610 H01L 23/12 DF term (reference) 2C035 AA06 FF24 FF26 4K057 WA11 WB04 WB17 WC10 WE08 WN01 5E339 AB02 AD03 BC02 BD07 BE11 BE13 CD01 CE12 CE16 CF15 EE02 GG02 5E343 AA02 AA12 AA15 AA17 BB72 CC62 DD03 ER12 ER16 FF12 GG06 GG08

Claims (2)

[Claims] 1. An etching process of a circuit pattern having a common line on one of the wiring patterns arranged in parallel and finally separating and separating the respective wiring patterns at a joint portion between the wiring pattern and the common line. In a method of manufacturing a wiring board for electronic parts formed by, a portion corresponding to the wiring pattern and a portion corresponding to the common line are connected to a pattern mask for forming an etching resist film used in the etching process. A method of manufacturing a wiring board for an electronic component, characterized in that a corresponding enlarged space portion is provided in a corner portion to further expand a space portion formed between the wiring patterns. 2. A method of manufacturing a wiring board for an electronic component, which has a bent portion on a ceramic substrate, and a circuit pattern in which adjacent wiring patterns are adjacent to each other through a narrow space portion is formed by screen printing. In the printing resist film of the screen printing screen used in the screen printing, in the vicinity of at least one corner of the portion corresponding to the bent portion, substantially expand the portion corresponding to the space portion. A method of manufacturing a wiring board for an electronic component, characterized in that a space portion is provided.