JP2003045914A - Method and apparatus for bonding - Google Patents

Abstract

PROBLEM TO BE SOLVED: To certainly grasp the correlation between command signals and feedback signals. SOLUTION: In a servo controller 20 to perform a bonding motion control, the command signal R(t) for a position command and a load command sent from a command generation part 22, and the feedback signal B(t) of a position signal, a load signal and a temperature signal from a bonding head 5, are stored in a buffer memory 30.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for bonding a chip component onto a wiring board to manufacture an electrical component, and more particularly to a bonding apparatus and method thereof.

[0002]

2. Description of the Related Art FIG. 4 is a block diagram of a bonding head in a bonding apparatus. A Y-axis frame 2 is provided on the Y-axis guide 1 which is movable in the Y-axis direction. The Y-axis frame 2 is provided with a Z-axis guide 4 movable in the Z-axis direction via an X-axis guide 3 movable in the X-axis direction. A bonding head 5 is attached to the Z-axis guide 4. X axis, Y axis,
The Z axes are set to be orthogonal to each other.

The bonding head 5 has a bonding tool 6 at its tip, and a head housing 7 is attached to the Z-axis guide 4. Further, the bonding head 5 is provided with a load sensor (load cell) 8 for detecting a load applied to the bonding tool 6 and a thermocouple 9 as a temperature sensor for detecting a heater temperature of the bonding tool 6. That is, the bonding head 5 is provided with a heater (not shown) to heat the bonding tool 6 during the bonding operation.

A pressurizing portion support portion 10 is provided above the bonding tool 6, and a pressurizing motor 12 is provided on the pressurizing portion support portion 10 via a support 11. A ball screw 13 is connected to the rotating shaft of the pressure motor 12, and a pressure member 14 is screwed onto the ball screw 13. The pressing member 14 is movable in the Z-axis direction along a Z-axis guide 15 provided on the support 11.
The pressure member 14 is in contact with the upper portion of the bonding head 5. The pressure motor 12 is provided with an encoder for detecting the displacement of the bonding tool 6.

Next, the bonding operation will be described. A tape substrate 17 to be bonded is arranged on the bonding stage 16. During the bonding operation, the pressure motor 12 rotates to move the pressure member 14 in the Z-axis direction via the ball screw 13 to press the bonding head 5 downward. As a result, the bonding head 5 moves down and the bonding tool 6 is heated by the heater. In this state, the bonding tool 6 applies a load to the tape substrate 17 to perform a bonding process on the tape substrate 17. After that, the pressure motor 12 rotates in the reverse direction, and the bonding tool 6 moves up.

FIG. 5 is a profile showing respective commands of displacement and load of the bonding head 5 when the bonding operation is performed. As for the displacement of the bonding head 5 in the Z-axis direction, as shown in FIG. 4A, first, the bonding head 5 that sucks and holds a chip component is lowered by position control. At this time, the bonding head 5 descends at a high speed, and after descending to a predetermined height, a bonding point search operation is performed.

When it is detected that the IC chip, which is a chip component made of a semiconductor, and the substrate 17, which is a wiring board, come into contact with each other when descending by the search operation, load control is performed for the bonding tool 6, and the IC chip and the tape are controlled. Bonding with the substrate is performed, and thereafter, the suction operation of the IC chip is released and the bonding head 5 is lifted by the position control again. At this time, a return operation is performed,
Then, a high speed climb is performed.

On the other hand, the load of the bonding head 5 in the Z-axis direction is proportionally applied when the load control is started, as shown in FIG. 2B, and when a predetermined pressure is applied, the pressure is applied. Hold. Then, when this pressure holding time elapses,
The load is reduced proportionally.

Such a profile has a descending amount (moving amount) of the bonding head 5 and a descending speed / acceleration / acceleration change rate, an ascending amount (moving amount) and an ascending speed / acceleration / acceleration change rate, a pressing force, and a pressing force. It is determined by setting parameters (bonding conditions) such as pressure time and heater temperature.

The bonding conditions in the bonding apparatus vary depending on the type of bonding target such as the tape substrate 17 and are appropriately changed by the user. Therefore, a problem may occur in the actual bonding operation due to a change in the bonding condition. or,
If the bonding operation is repeated with respect to the set bonding condition, a defect may occur in the bonding operation.

For this reason, the bonding operation is required to have a monitoring function for confirming that the bonding operation is properly performed with respect to the set bonding condition.

What is required of this monitoring function is to measure the command signal to confirm that an appropriate command signal is generated according to the bonding conditions set by the user, and to generate the command signal. On the other hand, in order to confirm what kind of signal is taken in by the control controller (servo controller) and the arithmetic processing is performed, the displacement output of the pressure motor 12 and the like, which are correlated with the command signal, are measured.

FIG. 6 is a diagram showing a monitoring method using a measuring instrument. The servo controller 20 has a control unit 21.
have. The control unit 21 includes a command generation unit 22 that outputs a command signal R (t) according to a preset bonding condition, a command signal R (t) issued from the command generation unit 22, and a bonding head 5 PID (proportional / integral / derivative) calculation processing is performed based on the feedback signal B (t) to generate a control signal C (t), and the control signal C (t) is sent to the bonding head 5. And a part 23.

With the measurement system having such a configuration, the time t
= C, the control signal C (X) and the bonding head 5
The detection signal B (X) in the above was sampled and the relationship between the input and output to the bonding head 5 was grasped.

The measuring instrument 27 controls the control signal C (t) output from the servo controller 20 and the control signal C (t).
Feedback signal B (t) indicating the state of the bonding head 5 which is driven and controlled by inputting (t).
And are sampled at a predetermined sampling period T, and the results are recorded.

The feedback signal B (t) from the bonding head 5 is an item necessary for understanding the operation with respect to the bonding condition set in the servo controller, and is a position signal indicating the displacement of the bonding head 5 and the bonding head 5 A load signal indicating the load at
A temperature signal or the like indicating the temperature of the bonding head 5 is typical.

The function of the operation control section 23 will be described with reference to FIG.
, The deviation signal E (t) (= R (t) -B (t)) between the command signal R (t) and the feedback signal B (t) such as the position signal from the encoder 24 is calculated by the deviation device 25. The control signal C (t) is generated by the PID controller 26 by the PID control algorithm on the basis of the deviation signal E (t), and the control signal C (t) is generated by the PID controller 26. The pressure is sent to the pressure motor 12.

When the transfer function is G (t) and the sampling period is T, the PID controller 26
Calculation processing (G (nT) * (R (nT) -B (n-1) T)) (1) is executed. n is a sample number (nth sampling) indicating the number of cycles.

Of these, the data necessary for measuring the command signal and the feedback signal is the command signal R (nT)
Is the feedback signal B ((n-1) T). The deviation signal E (nT) and the control signal C (nT) can be calculated from the command signal R (nT) and the feedback signal B ((n-1) T), and the following equations (2) (3) ).

E (nT) = R (nT) −B ((n−1) T) (2) C (nT) = G (nT) * E (nT) (3) Actually measured signal Is a measuring instrument 27 as shown in FIG.
Are connected to form a control signal C (t) and a feedback signal B (t). The feedback signal B (t) is a position signal, a load signal, and a temperature signal.

FIG. 8 shows a control signal C (t) and a feedback signal B (t) measured by the measuring device 27 and a deviation signal E.
(t) and the calculated deviation signal E (t) are represented as the time T elapses.

[0022]

However, n output from the servo controller 20 at an arbitrary time nT.
The response on the side of the bonding head 5 to the (n is a natural number) control signal C (nT) is accompanied by a certain time delay, and this occurs with a time delay equivalent to the sampling cycle of the measurement system. Therefore, the causal relationship with the feedback signal B (nT) acquired at the same timing is not direct.

The control signal is generated as a command signal indicating the target value minus the feedback signal. The feedback signal used when the control signal C (nT) at an arbitrary time nT is generated. Is B ((n−k)
When T), a natural number k smaller than n cannot be determined, and C (T), ..., C (nT) and B (T) ,. It was difficult to handle.

Therefore, even if the control signal C (nT) and the feedback signal B (nT) obtained by such a measurement system are used,
It has been difficult to improve the quality of bonding.

In addition, since the response relationship of the signal at the timing of switching the bonding operation of the bonding head 5 in the command signal is unclear, it is used as a material for evaluating the bonding condition that is the basis for generating the command signal. There were some dissatisfaction points.

Therefore, it is an object of the present invention to provide a bonding apparatus and a method therefor capable of grasping a command signal and a feedback signal so as to have a correlation with each other.

[0027]

According to a first aspect of the present invention, a control signal is generated by performing arithmetic processing based on a command signal according to a preset bonding condition and a feedback signal from a bonding head. A bonding apparatus having a controller for outputting a control signal to the bonding head, characterized by further comprising storage means for storing at least the command signal and the feedback signal in the controller.

A second aspect of the present invention is the bonding apparatus according to the first aspect of the present invention, wherein the storage means includes a position signal indicating a displacement of the bonding head, a load signal indicating a load on the bonding head, and the bonding head. The temperature signal in 1 is stored in a buffer memory.

A third aspect of the present invention is characterized in that, in the bonding apparatus of the first aspect of the present invention, the feedback signal stored in the storage means is read out and displayed.

A fourth aspect of the present invention is characterized in that, in the bonding apparatus of the first aspect of the present invention, the feedback signal for the number of times of bonding arbitrarily set is stored in the storage means.

A fifth aspect of the present invention is a servo controller for feeding back a state of the bonding head to a predetermined command signal for driving the bonding head to generate a control signal to be sent to the bonding head, for a predetermined time. The control signal is output to the bonding head, the command signal and the feedback signal are stored in a buffer, and the command signal and the feedback signal stored in the buffer are associated with the predetermined time. The bonding method is characterized by comprising a step of storing the information as a storage.

[0032]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a block diagram of a bonding apparatus.
The structure of the bonding head in this bonding apparatus is as shown in FIG. That is, the Y-axis frame 2 is provided on the Y-axis guide 1 that is movable in the Y-axis direction.
Is provided. The Y-axis frame 2 is provided with a Z-axis guide 4 movable in the Z-axis direction via an X-axis guide 3 movable in the X-axis direction. A bonding head 5 is attached to the Z-axis guide 4. The X axis, Y axis, and Z axis are set so as to be orthogonal to each other.

The bonding head 5 has a bonding tool 6 at its tip, and a head housing 7 is attached to the Z-axis guide 4. Further, the bonding head 5 is provided with a load sensor (load cell) 8 for detecting a load applied to the bonding tool 6 and a thermocouple 9 as a temperature sensor for detecting a heater temperature of the bonding tool 6. That is, the bonding head 5 is provided with a heater (not shown) to heat the bonding tool 6 during the bonding operation.

A pressurizing portion support portion 10 is provided above the bonding tool 6, and a pressurizing motor 12 is provided on the pressurizing portion support portion 10 via a support 11. A ball screw 13 is connected to the rotating shaft of the pressure motor 12, and a pressure member 14 is screwed onto the ball screw 13. The pressing member 14 is movable in the Z-axis direction along a Z-axis guide 15 provided on the support 11.
The pressure member 14 is in contact with the upper portion of the bonding head 5. The pressure motor 12 is provided with an encoder for detecting the displacement of the bonding tool 6.

Next, the bonding operation will be described. A tape substrate 17 to be bonded is arranged on the bonding stage 16. During the bonding operation, the pressure motor 12 rotates to move the pressure member 14 in the Z-axis direction via the ball screw 13 to press the bonding head 5 downward. As a result, the bonding head 5 moves down and the bonding tool 6 is heated by the heater. In this state, the bonding tool 6 applies a load to the tape substrate 17 to perform a bonding process on the tape substrate 17. After that, the pressure motor 12 rotates in the reverse direction, and the bonding tool 6 moves up.

FIG. 5 is a profile showing respective commands of displacement and load of the bonding head 5 when the bonding operation is performed. As for the displacement of the bonding head 5 in the Z-axis direction, as shown in FIG. 4A, first, the bonding head 5 that sucks and holds a chip component is lowered by position control. At this time, the bonding head 5 descends at a high speed, and after descending to a predetermined height, a bonding point search operation is performed.

When it is detected that the IC chip, which is a chip component made of a semiconductor, and the substrate 17, which is a wiring board, come into contact with each other during the descending operation by the search operation, load control is performed on the bonding tool 6, and the IC chip and the tape are controlled. Bonding with the substrate is performed, and thereafter, the suction operation of the IC chip is released and the bonding head 5 is lifted by the position control again. At this time, a return operation is performed,
Then, a high speed climb is performed.

On the other hand, the load of the bonding head 5 in the Z-axis direction is proportionally applied when the load control is started, as shown in FIG. 2B, and when a predetermined pressurization is reached, the pressurization is applied. Hold. Then, when this pressure holding time elapses,
The load is reduced proportionally.

Such a profile has a descending amount (moving amount) of the bonding head 5 and a descending speed / acceleration / acceleration change rate, an ascending amount (moving amount) and an ascending speed / acceleration / acceleration change rate, a pressing force, and a pressing force. It is determined by setting parameters (bonding conditions) such as pressure time and heater temperature.

In FIG. 1, the servo controller 20 is provided with a buffer memory 30. Further, the servo controller 20 is provided with a storage means 31.

The storage means 31 has a function of storing the command signal R (t) issued from the command generator 22 and the feedback signal B (t) from the bonding head 5 in the buffer memory 30. Among these, the position command and load command of digital values (pulses) are stored as the command signal R (t), and the position signal from the encoder, the load signal from the load sensor 8 and the thermocouple 9 are stored as the feedback signal B (t). Save the temperature signal from. These position signal, load signal and temperature signal are also digital values (pulses).

Further, the storage means 31 stores the position command and the load command in the buffer memory 31 at intervals at which the servo controller 20 outputs the position command and the load command, and takes in the position signal, the load signal and the temperature signal. The position signal, the load signal and the temperature signal are buffered at intervals.
It is supposed to be stored in.

On the other hand, an upper device 32 is connected to the servo controller 20. The upper device 32 is
Each data is exchanged between the key input processing unit 33 for outputting each instruction necessary for the bonding process and outputting the result and the servo controller 20 for controlling the bonding, and the bonding condition (movement amount, speed). ,
A device control processing unit 34 that generates a sequence program based on a load and gives the sequence program to the servo controller 20 and gives an instruction to start a bonding operation.

The apparatus control processing section 34 is obtained by imaging the apparatus main control section 36 having the apparatus internal memory 35, the bonding head unit 37 for exchanging data with the servo controller 20, and the bonding operation. The camera recognition unit 38 for recognizing the bonding portion and the bonding result from the image data.

Of these, the bonding head unit 37
Has a function of receiving an instruction to start the bonding operation with the apparatus main control unit 36 and reporting the end thereof.
A sequence program is passed to and from the servo controller 20, an operation start instruction is sent, and setting operation start /
It has a function of receiving an end signal and an operation end report.

Further, this bonding head unit 37
Has a temporary storage memory 39. The bonding head unit 37 transmits the command signal R (t) and the feedback signal B (t) stored in the buffer memory 30 of the servo controller 20 at regular intervals, for example, 100 m.
It has a function of taking out at intervals of sec and storing it in the temporary storage memory 39. The temporary storage memory 39 stores the command signal R (t) and the feedback signal B (t) for one bonding operation.

At this time, the bonding head unit 37
Has a function of reading the command signal R (t) and the feedback signal B (t) in an arbitrary period stored in the buffer memory 30 based on the operation start signal and the end signal generated in the servo controller 20. ing.

The apparatus main control unit 36 reads the command signal R (t) and the feedback signal B (t) for one bonding operation stored in the temporary storage memory 39 composed of DRAM or the like, and reads the apparatus internal memory 35. It has the function of storing in. In this case, the apparatus main control unit 36 controls the data for one bonding operation (command signal R
(t) and feedback signal B (t)) are converted into units (the number of significant digits, [mm], [N], [° C], etc.), and the device internal memory 35
It is supposed to be stored in. It should be noted that the device internal memory 35 stores data (command signal R (t) and feedback signal B) as many times as the preset number of bonding operations.
(t)) is stored.

A device monitor 40 and a device hard disk 41 are connected to the device main controller 36. The device main control unit 36 includes a device internal memory 35.
A function of reading the data (command signal R (t) and feedback signal B (t)) stored in the device and displaying the temporal change of the position signal, load signal, and temperature signal in one bonding operation on the device monitor 40. have.

Further, the apparatus main control unit 36 uses the data (command signal R (t)) stored in the apparatus internal memory 35.
And a feedback signal B (t)) and stores these data in the device hard disk 41. The data stored in the device hard disk 41 can be displayed as text on the device monitor 40 or the like.

Next, the operation of the apparatus constructed as described above will be described.

In the servo controller 20, the operation control section 23 has the command signal R issued from the command generation section 22.
The deviation signal E (t) (= R (t) −B (t)) between (t) and the feedback signal B (t) from the bonding head 5 is output to the deviation device 2
5, the PID controller 26 performs a PID calculation process by a PID control algorithm based on the deviation signal E (t) to generate a control signal C (t), and the control signal C (t) is generated by the bonding head 5 Send to.

At this time, the command generator 22 issues a position command and a load command as the command signal R (t), and the operation controller 23 receives the feedback signal B (t) from the encoder in the bonding head 5. The position signal, the load signal from the load sensor 8 and the temperature signal from the thermocouple 9 are taken in.

In the bonding apparatus according to the control signal C (t) sent from the servo controller 20, the pressure motor 12 rotates to cause the pressure member 14 to descend in the Z-axis direction via the ball screw 13 and the bonding head. Press 5 downwards. As a result, the bonding head 5
Moves down and the bonding tool 6 is heated by the heater. In this state, the bonding process for the tape substrate 17 is performed. After that, the pressure motor 12 rotates in the reverse direction, and the bonding tool 6 moves up.

At this time, the storage means 31 of the servo controller 20 bonds the command signal R (t), which is the position command and load command of the digital value (pulse) issued from the command generator 22 in one bonding operation, to the bonding. The feedback signal B (t) including the position signal, the load signal, and the temperature signal from the head 5 is stored in the buffer memory 30.

The storage means 31 issues a command to store the position command and the load command in the buffer memory 30 at intervals at which the servo controller 20 outputs the position command and the load command. As a result, the buffer memory 30 stores the position signal, the load signal, and the temperature signal in the buffer memory 30 at intervals at which the position signal, the load signal, and the temperature signal are captured.

On the other hand, the bonding head unit 37
Is a command signal R (t) and a feedback signal B (t) stored in the buffer memory 30 based on a setting operation start signal and an end signal generated in the servo controller 20.
To start and end the reading. Specifically, the bonding unit 37 receives a setting operation start / end signal (for example, a pressurizing operation start / end signal) sent from the servo controller 20, and the command unit R (t ) And the reading of the feedback signal B (t) are started and ended. As a result, the command signal R (t) and the feedback signal B (t) can be read during the specific period, for example, only the pressurizing operation.

After this, when one bonding operation is completed, the apparatus main control unit 36 reads the command signal R (t) and the feedback signal B (t) for one bonding operation stored in the temporary storage memory 39. , Unit conversion (the number of significant digits, [mm], [N], [° C.], etc.) is stored in the device internal memory 35. As a result, the device internal memory 35 stores data (sampled values of the command signal R (t) and the feedback signal B (t)) (n is a natural number) by the number of preset bonding operations. .

The apparatus main control unit 36 reads out the data (command signal R (t) and feedback signal B (t)) stored in the apparatus internal memory 35, and detects the position signal and load signal for one bonding operation. The time change of the temperature signal is displayed and output to the device monitor 40.

FIG. 2 is a diagram showing a display example of temporal changes of the position signal, the load signal, and the temperature signal in one bonding operation of the bonding head 5. In the bonding operation shown in this display example, the heater temperature of the bonding tool 6 is raised to the set temperature before the bonding operation is started, and after the bonding tool 6 is heated, the lowering operation of the bonding head 5 is started by the position control. Then, pressurization with a set load is performed by a load operation. Next, after pressurizing for a set time, the load is reduced to the standby load, the bonding tool 6 is cooled, the heater temperature is lowered to the set temperature, the position control is switched again, and the bonding head 5 is moved upward. . Also, in this display example, the average load in the pressurizing section is displayed.

Further, the apparatus main control unit 36 uses the data (command signal R (t)) stored in the apparatus internal memory 35.
And the feedback signal B (t)) is read out and these data are stored in the device hard disk 41. The data stored in the device hard disk 41 is used as the device monitor 40.
It is possible to display the text in, for example.

FIG. 3 shows a display example in which the data stored in the device hard disk 41 is opened by a text editor. In this display example, the sampling period of the servo controller 20 is 2 [KHz], and the interval is 0.5 [m
[s] is used to capture the data and save the data. With this save file, data processing becomes easy with, for example, spreadsheet software.

Thus, in the above-mentioned one embodiment,
Servo controller 20 for controlling bonding operation
In the buffer memory 30, the command signal R (t) of the position command and the load command issued from the command generator 22 and the feedback signal B (t) of the position signal, the load signal, and the temperature signal from the bonding head 5 are stored in the buffer memory 30. Since the data is stored, the command signal R (t), which is the data necessary for measuring the command signal R (t) and the feedback signal B (t),
The feedback signal B ((n-1) T) having a correlation with the command signal R (t) can be stored in the buffer memory 30. As a result, it is possible to accurately grasp what kind of bonding operation was performed on the command signal R (t). That is, the bonding operation can be accurately grasped from the position signal, the load signal and the temperature signal.

Further, a setting operation start / end signal (for example, start of pressurizing operation, sent from the servo controller 20)
End signal) is received by the bonding unit 37, and the reading of the command signal R (t) and the feedback signal B (t) is started and ended by the operation processing of the bonding unit 37. The command signal R (t) and the feedback signal B (t) corresponding to the command signal R (t) in a specific period such as only the end or the pressurizing operation are read out, and the display output showing the change of the parameter on the time axis can be performed.

Further, since the command signal R (t) and the feedback signal B (t) are stored in a state having the bonding conditions (pressurizing force, pressurizing time, temperature, etc.), the validity of the bonding conditions from these data is confirmed. Data required for evaluation (pressurization time, average load during pressurization, variation, etc.) can be calculated immediately after the storage of the command signal R (t) and the feedback signal B (t) is completed, and can be output for display.

Further, since the command signal R (t) and the feedback signal B (t) are stored in the internal memory 35 of the apparatus as many times as the preset number of bonding operations, at the time of stoppage due to defective bonding or the like, from that point of time. The bonding operation can be viewed in the past by the set number of times of bonding, and the change over time in the bonding operation from the time of occurrence of a defect can be grasped. Therefore, accurate data and evaluation results can be referred to immediately before the occurrence of a defective bonding, the cause of the defective occurrence can be quickly investigated, and the recovery thereof can be speeded up. As a result, the cause of defective bonding can be solved in a short time, and productivity can be improved.

The present invention is not limited to the above-mentioned one embodiment, and can be variously modified at the stage of carrying out the invention without departing from the spirit thereof.

Further, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements. For example, even if some constituent elements are deleted from all the constituent elements shown in the embodiment, the problem described in the section of the problem to be solved by the invention can be solved, and it is described in the section of the effect of the invention. When the effect of being obtained is obtained, a configuration in which this constituent element is deleted can be extracted as an invention.

[0070]

As described above in detail, according to the bonding apparatus of the present invention, the correlation between the command signal and the feedback signal can be surely grasped.

According to the bonding method of the present invention,
Since it is assembled with high positioning accuracy, it is possible to provide a highly reliable device.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing an embodiment of a bonding apparatus according to the present invention.

FIG. 2 is a diagram showing a display example of temporal changes of a position signal, a load signal, and a temperature signal in one bonding operation in an embodiment of the bonding apparatus according to the present invention.

FIG. 3 is a diagram showing a display example in which the data stored in the hard disk of the bonding apparatus according to the embodiment of the present invention is opened by a text editor.

FIG. 4 is a configuration diagram of a bonding head in the bonding apparatus.

FIG. 5 is a profile showing respective commands of displacement and load of a bonding head when performing a conventional bonding operation.

FIG. 6 is a diagram showing a monitoring method using a conventional measuring instrument.

FIG. 7 is a functional block diagram of an operation control unit in the bonding apparatus.

FIG. 8 is a diagram showing a control signal and a feedback signal measured by a conventional measuring instrument.

[Explanation of symbols]

1: Y-axis guide 2: Y-axis frame 3: X-axis guide 4: Z axis guide 5: Bonding head 6: Bonding tool 7: Head case 8: Load sensor 9: Thermocouple 10: Pressing part support part 11: Support 12: Pressure motor 13: Ball screw 14: Pressurizing member 15: Z axis guide 16: Bonding stage 17: Tape substrate 20: Servo controller 21: Control unit 22: Command generation unit 23: Control signal generator 24: Encoder 25: deviation device 26: PID controller 30: Buffer memory 31: Storage means 32: Upper device 33: Key input processing unit 34: Device control processing unit 35: Device internal memory 36: Device main control unit 37: Bonding head unit 38: Camera recognition unit 39: Temporary storage memory 40: Device monitor 41: Device hard disk

Claims (5)

[Claims] 1. A controller for generating a control signal by performing arithmetic processing based on a command signal according to a preset bonding condition and a feedback signal from the bonding head, and outputting the control signal to the bonding head. A bonding apparatus provided with: a bonding unit that stores at least the command signal and the feedback signal in the controller. 2. The storage means stores a position signal indicating a displacement of the bonding head, a load signal indicating a load on the bonding head, and a temperature signal at the bonding head in a buffer memory. 1. The bonding apparatus according to 1. 3. The bonding apparatus according to claim 1, wherein the feedback signal stored in the storage means is read out and displayed. 4. The bonding apparatus according to claim 1, wherein the feedback signal is stored in the storage unit for an arbitrary number of times of bonding. 5. A servo controller for feeding back a state of the bonding head to a predetermined command signal for driving the bonding head to generate a control signal to be sent to the bonding head, wherein the control signal is supplied at a predetermined time. Outputting to the bonding head, storing the command signal and the feedback signal in a buffer, and storing the command signal and the feedback signal stored in the buffer in association with the predetermined time. A bonding method comprising: