JP2003043069A - Terminal connection structure, electric characteristic measuring device for electronic device using the same, and using method for the electric characteristic measuring device for electronic device - Google Patents
Terminal connection structure, electric characteristic measuring device for electronic device using the same, and using method for the electric characteristic measuring device for electronic deviceInfo
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- JP2003043069A JP2003043069A JP2001231544A JP2001231544A JP2003043069A JP 2003043069 A JP2003043069 A JP 2003043069A JP 2001231544 A JP2001231544 A JP 2001231544A JP 2001231544 A JP2001231544 A JP 2001231544A JP 2003043069 A JP2003043069 A JP 2003043069A
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- electronic device
- terminal
- ground
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- electrode
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Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、電子デバイスの信
号入出力端子および接地端子それぞれと電気的に接続さ
れる端子接続構造、および、その端子構造が用いられる
電子デバイスの電気特性測定装置、ならびに、その使用
方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal connection structure electrically connected to a signal input / output terminal and a ground terminal of an electronic device, and an electric characteristic measuring apparatus for an electronic device using the terminal structure. , About how to use it.
【0002】[0002]
【従来の技術】電子デバイスの電気特性測定装置として
は、たとえば、特開平11−183563号公報に開示
されているもの等が知られている。これに類似する従来
の電子デバイスの電気特性測定装置を図4を例示して説
明する。2. Description of the Related Art As an electric characteristic measuring apparatus for an electronic device, for example, one disclosed in Japanese Patent Application Laid-Open No. 11-183563 is known. A similar conventional electrical characteristic measuring apparatus for electronic devices will be described with reference to FIG.
【0003】図4に示すように、従来の電子デバイスの
電気特性測定装置は、台座101が導電性の材料で形成
されるとともに、台座101の電子デバイス109の裏
面に配置された接地端子110と接続される箇所にデバ
イス突き当て部2が突出するように設けられている。ま
た、台座101は、配線基板104が撓むことができる
ように彫り込み部103が形成されている。彫り込み部
103には、弾性体108が設置されている。また、配
線基板104には、電子デバイス109の測定に必要な
整合回路やバイアス回路が形成され、電子デバイス10
9の信号入出力端子111と接続する箇所には接点電極
105が接続されている。また、上記回路に用いる線路
は、マイクロストリップ線路などを用いて構成されてお
り、配線基板104の裏面には接地用電極106が設け
られている。そして、配線基板104の裏面側の接地用
電極106は、台座1と、ねじ止め、または、はんだ付
けにより電気的に接続されている。As shown in FIG. 4, in the conventional electrical characteristic measuring apparatus for an electronic device, the pedestal 101 is made of a conductive material, and the ground terminal 110 is provided on the back surface of the electronic device 109 of the pedestal 101. The device abutting portion 2 is provided so as to protrude at the connection point. Further, the pedestal 101 is formed with a carved portion 103 so that the wiring board 104 can be bent. An elastic body 108 is installed in the engraved portion 103. In addition, a matching circuit and a bias circuit necessary for measuring the electronic device 109 are formed on the wiring board 104, and the electronic device 10
A contact electrode 105 is connected to the location of the signal input / output terminal 111 of FIG. Further, the line used in the above circuit is configured by using a microstrip line or the like, and the grounding electrode 106 is provided on the back surface of the wiring substrate 104. The ground electrode 106 on the back surface side of the wiring board 104 is electrically connected to the base 1 by screwing or soldering.
【0004】電子デバイス109を装着して測定すると
きは、電子デバイス109の信号入出力端子111は接
点電極105に押し付けられ、電子デバイス109の接
地端子110はデバイス突き当て部102に押し付けら
れる。その際、弾性体108の弾力によって接点電極1
05と信号入出力端子111が弾性的に接触するように
設計されている。また、デバイス突き当て部102は、
電子デバイス109の接地端子110と接触して、電子
デバイス109の接地端子110と台座101とが電気
的に接続されるとともに、台座101は、配線基板10
4の裏面側の接地用電極106と接触しているため、電
子デバイス109の接地端子110は、台座101を介
して配線基板104の裏面側の接地用電極106に電気
的に接続されることになる。When the electronic device 109 is mounted and measured, the signal input / output terminal 111 of the electronic device 109 is pressed against the contact electrode 105, and the ground terminal 110 of the electronic device 109 is pressed against the device abutting portion 102. At that time, the elastic force of the elastic body 108 causes the contact electrode 1
05 and the signal input / output terminal 111 are designed to elastically contact each other. Further, the device abutting section 102 is
The ground terminal 110 of the electronic device 109 is brought into contact with the ground terminal 110 of the electronic device 109 and the pedestal 101 is electrically connected to the pedestal 101.
4, the ground terminal 110 of the electronic device 109 is electrically connected to the ground electrode 106 on the back surface side of the wiring board 104 via the pedestal 101 because it is in contact with the ground electrode 106 on the back surface side. Become.
【0005】[0005]
【発明が解決しようとする課題】上記の構造では、電子
デバイス109の接地端子110は、台座101を介し
て配線基板104の裏面側の接地用電極106に電気的
に接続される。したがって、台座101には接点電極1
05を弾性接触させるための弾性体108を入れる彫り
込み部103が形成されている影響で、配線基板104
の裏面側の接地用電極106と電子デバイス109の接
地端子110とを結ぶ間の電気長が長くなってしまう。
そのため、配線基板104の裏面の接地用電極106と
電子デバイス109の接地用電極106との間の寄生イ
ンダクタンスが大きくなる。その結果、電子デバイス1
09の電気特性が実際の電気特性とは異なって測定され
るなど、正確な電気的特性の測定ができなくなってしま
うという問題があった。特に、上記寄生インダクタンス
によるインピーダンスが増大する高周波域では問題が深
刻化する。In the above structure, the ground terminal 110 of the electronic device 109 is electrically connected to the ground electrode 106 on the back surface side of the wiring board 104 via the pedestal 101. Therefore, the pedestal 101 has a contact electrode 1
Due to the formation of the engraved portion 103 for inserting the elastic body 108 for elastically contacting the wiring board 05,
The electrical length between the grounding electrode 106 on the rear surface side and the grounding terminal 110 of the electronic device 109 becomes long.
Therefore, the parasitic inductance between the ground electrode 106 on the back surface of the wiring board 104 and the ground electrode 106 of the electronic device 109 increases. As a result, the electronic device 1
There is a problem in that the electrical characteristics of 09 are measured differently from the actual electrical characteristics, making it impossible to measure the electrical characteristics accurately. In particular, the problem becomes serious in a high frequency region where the impedance due to the parasitic inductance increases.
【0006】本発明は、上述の問題に鑑みてなされたも
のであり、その目的は、極力正確な測定を行なうことが
できる端子接続構造、および、それを用いた電子デバイ
スの電気特性測定装置、ならびに、その使用方法を提供
することである。The present invention has been made in view of the above problems, and an object thereof is to provide a terminal connection structure capable of performing accurate measurement as much as possible, and an electric characteristic measuring apparatus for an electronic device using the same. And to provide a method of using the same.
【0007】[0007]
【課題を解決するための手段】本発明の端子接続構造
は、電子デバイスの信号入出力端子および接地端子それ
ぞれと電気的に接続される端子接続構造であって、縦断
面において、凹部と該凹部により形成された第1および
第2の凸部とを有する台座と、第1の凸部上から凹部上
の所定の位置まで片持ち梁状に延び、接地端子と電気的
に接続されて電子デバイスを接地するための接地用電極
と、第2の凸部上面側から接地用電極の下面側へ向かっ
て延びるように設けられた導電性部材と、凹部上に設け
られ、信号入出力端子に対して信号の入出力を行なうた
めの接点電極とを備え、電子デバイスを端子接続構造に
電気的に接続するために、接地端子が導電性部材と接触
するように電子デバイスが第2の凸部の上面に設置され
たときに、信号入出力端子と接点電極とが接触するとと
もに、導電性部材と接地用電極とが接触するか、また
は、導電性部材と接地用電極とが接触する状態を維持す
るように構成されている。The terminal connection structure of the present invention is a terminal connection structure electrically connected to each of a signal input / output terminal and a ground terminal of an electronic device. And a pedestal having first and second convex portions formed by, and extending in a cantilever shape from above the first convex portion to a predetermined position above the concave portion, and electrically connected to the ground terminal to form an electronic device. A grounding electrode for grounding, a conductive member provided so as to extend from the upper surface side of the second convex portion to the lower surface side of the grounding electrode, and a conductive member provided on the concave portion, with respect to the signal input / output terminal. And a contact electrode for inputting and outputting a signal, and for electrically connecting the electronic device to the terminal connection structure, the electronic device has the second convex portion so that the ground terminal contacts the conductive member. Signal input / output when installed on the top Together and the terminal and the contact point electrode in contact or the conductive member and the ground electrode is in contact, or, conductive member and the ground electrode is configured to maintain a state of contact.
【0008】本発明の端子接続構造によれば、接地端子
から接地用電極へ向かって延び、接地端子と接地用電極
との双方に接触し得る導電性部材を設けたことにより、
第1および第2の凸部を有する台座を介して接地用電極
と接地端子とを電気的に接続する場合に比較して、端子
接続構造の接地用電極と電子デバイスの接地端子とを短
経路で接続できるため、接地用電極と接地端子との間に
生じる寄生インダクタンスを低減することができる。According to the terminal connection structure of the present invention, by providing the conductive member that extends from the ground terminal toward the ground electrode and can contact both the ground terminal and the ground electrode,
A short path between the ground electrode of the terminal connection structure and the ground terminal of the electronic device as compared with the case where the ground electrode and the ground terminal are electrically connected through the pedestal having the first and second convex portions Therefore, the parasitic inductance generated between the ground electrode and the ground terminal can be reduced.
【0009】本発明の端子接続構造は、凹部には、導電
性部材の下側に弾性体が設けられ、導電性部材と接地用
電極とが接触する状態で弾性体を凹部に押し付けて使用
する端子接続構造であって、台座が導電性であり、か
つ、弾性体が導電性であればなおよい。このようにする
ことにより、導電性の弾性体を介しても接地電極と接地
端子とを電気的に接続することができる構造を形成する
ことが可能となる。In the terminal connection structure of the present invention, the recess is provided with an elastic body below the conductive member, and the elastic body is pressed against the recess when the conductive member and the ground electrode are in contact with each other. It is more preferable that the pedestal is conductive and the elastic body is conductive in the terminal connection structure. By doing so, it becomes possible to form a structure in which the ground electrode and the ground terminal can be electrically connected via the conductive elastic body.
【0010】本発明の端子接続構造は、高周波回路が形
成された配線基板を備え、接地用電極が配線基板の下面
に設けられ、かつ、接点電極が配線基板の上面に設けら
れるように、配線基板が台座の上に設けられ、第2の凸
部の上面が、配線基板の上面より高い位置にあり、か
つ、接点電極の上面よりも低い位置にある。このように
することにより、導電性部材が第2の凸部に押し付けら
れるときの衝撃を和らげることができる。The terminal connection structure of the present invention includes a wiring board on which a high-frequency circuit is formed, and wiring is performed so that the ground electrode is provided on the lower surface of the wiring board and the contact electrode is provided on the upper surface of the wiring board. The substrate is provided on the pedestal, and the upper surface of the second convex portion is located higher than the upper surface of the wiring board and lower than the upper surface of the contact electrode. By doing so, the impact when the conductive member is pressed against the second convex portion can be softened.
【0011】本発明の端子接続構造は、第2の凸部が弾
性体により構成されていてもよい。このようにすること
により、電子デバイスを第2の凸部に押付けたときに電
子デバイスに生じる衝撃を和らげることができる。In the terminal connection structure of the present invention, the second convex portion may be made of an elastic body. By doing so, it is possible to mitigate the shock generated in the electronic device when the electronic device is pressed against the second convex portion.
【0012】本発明の端子接続構造は、接地用電極、接
点電極、および、導電性部材それぞれが対応して複数設
けられていてもよい。このようにすることにより、複数
の電子デバイスの測定を同時に行なうことが可能とな
る。また、1の測定装置で複数の端子を有する電子デバ
イスの電気特性の測定も可能となる。In the terminal connection structure of the present invention, a plurality of ground electrodes, contact electrodes, and conductive members may be provided correspondingly. By doing so, it becomes possible to simultaneously measure a plurality of electronic devices. Further, it becomes possible to measure the electrical characteristics of an electronic device having a plurality of terminals with one measuring device.
【0013】本発明の電子デバイスの電気特性測定装置
は、上述の端子接続構造を測定の対象となる電子デバイ
スの端子との接続に用いている。そのため、電子デバイ
スのより正確な電気特性の測定が可能となる。特に、寄
生インダクタンスのインピーダンスが増大する高周波域
ではその効果が大きい。The electrical characteristic measuring apparatus for an electronic device of the present invention uses the above-mentioned terminal connection structure for connection with the terminal of the electronic device to be measured. Therefore, it becomes possible to measure the electrical characteristics of the electronic device more accurately. In particular, the effect is great in the high frequency range where the impedance of the parasitic inductance increases.
【0014】本発明の電子デバイスの電気特性測定装置
の使用方法は、電子デバイスを端子接続構造に電気的に
接続するために、圧接手段を用いて第2の凸部上の導電
性部材に対して電子デバイスの接地端子側の面を圧接す
ることにより、接地端子が導電性部材を介して接地用電
極に電気的に接続されるとともに、信号入出力端子と接
点電極とが電気的に接続されて、電子デバイスの電気特
性の測定を行なえる状態にする。このようにすることに
より、電子デバイスを測定装置に簡単に装着することが
できる。The method of using the electrical characteristic measuring apparatus for an electronic device according to the present invention is directed to a conductive member on the second convex portion using a pressure contact means for electrically connecting the electronic device to the terminal connection structure. By pressing the surface of the electronic device on the side of the ground terminal, the ground terminal is electrically connected to the ground electrode via the conductive member, and the signal input / output terminal and the contact electrode are also electrically connected. The electronic device so that the electrical characteristics of the electronic device can be measured. By doing so, the electronic device can be easily attached to the measuring apparatus.
【0015】[0015]
【発明の実施の形態】以下、図面を参照して、本発明の
実施の形態の端子接続構造等を説明する。まず、本実施
の形態の電子デバイスの電気特性測定装置50の端子接
続構造を、図1を用いて説明する。BEST MODE FOR CARRYING OUT THE INVENTION A terminal connection structure and the like according to an embodiment of the present invention will be described below with reference to the drawings. First, the terminal connection structure of the electrical characteristic measuring apparatus 50 for an electronic device according to the present embodiment will be described with reference to FIG.
【0016】図1に示すように、電子デバイスの電気特
性測定装置50の導電性の台座1には、接点電極5を備
えた絶縁性の配線基板4と、導電性薄板7と、導電性の
弾性体8とが設けられている。そして、図2に示すよう
に、電子デバイス9の接地端子10を、圧接手段12を
用いて、台座1のデバイス突き当て部2へ押し付けるこ
とによって、すなわち、導電性薄板7を接地端子10と
デバイス突き当て部2とで挟むことにより、接地端子1
0と導電性薄板7とが圧接されて、接地端子10は導電
性薄板7を介して配線基板4の裏面側の接地用電極6に
電気的に接続される。なお、導電性薄板7と接地用電極
6とは、予め接触していてもいし、圧接手段12による
圧接により接触するように位置関係てあってもよい。As shown in FIG. 1, an electrically conductive pedestal 1 of an electrical characteristic measuring apparatus 50 for an electronic device has an insulating wiring board 4 having a contact electrode 5, a conductive thin plate 7, and a conductive thin plate 7. The elastic body 8 is provided. Then, as shown in FIG. 2, the ground terminal 10 of the electronic device 9 is pressed against the device abutting portion 2 of the pedestal 1 by using the pressure contact means 12, that is, the conductive thin plate 7 is connected to the ground terminal 10 and the device. By sandwiching it with the butting part 2, the ground terminal 1
0 and the conductive thin plate 7 are pressed into contact with each other, and the ground terminal 10 is electrically connected to the ground electrode 6 on the back surface side of the wiring substrate 4 via the conductive thin plate 7. The conductive thin plate 7 and the grounding electrode 6 may be in contact with each other in advance, or may have a positional relationship such that they are brought into contact with each other by pressure contact by the pressure contact means 12.
【0017】本実施の形態の電子デバイスの電気特性測
定装置50の端子接続構造によれば、前述した従来の接
続構造のように台座101を介して接地端子110と配
線基板104の裏面の接地用電極106とを電気的に接
続する場合に比べて、短い電気長で接地端子10と配線
基板4の裏面の接地用電極6とを電気的に接続すること
ができる。そのため、配線基板4の裏面の接地用電極6
と電子デバイス9の接地端子10との間に生じる寄生イ
ンダクタンスを低減することができるようになってい
る。According to the terminal connection structure of the electric characteristic measuring apparatus 50 for an electronic device of this embodiment, the ground terminal 110 and the back surface of the wiring board 104 are grounded via the pedestal 101 as in the conventional connection structure described above. Compared to the case where the electrode 106 is electrically connected, the ground terminal 10 and the ground electrode 6 on the back surface of the wiring board 4 can be electrically connected with a shorter electric length. Therefore, the grounding electrode 6 on the back surface of the wiring board 4
It is possible to reduce the parasitic inductance between the electronic device 9 and the ground terminal 10 of the electronic device 9.
【0018】なお、配線基板4には電子デバイス9を動
作させるためのバイアス回路や整合回路など、高周波の
伝送線路を含む回路が形成されており、図1の上面図で
ある図3に示すように、配線基板4には整合回路用マイ
クロストリップ線路13およびチップコンデンサ14、
接地用ビアホール15、バイアス回路用マイクロストリ
ップ線路16などが形成されている。A circuit including a high-frequency transmission line such as a bias circuit and a matching circuit for operating the electronic device 9 is formed on the wiring board 4, as shown in FIG. 3, which is a top view of FIG. On the wiring board 4, the matching circuit microstrip line 13 and the chip capacitor 14,
A ground via hole 15, a bias circuit microstrip line 16, and the like are formed.
【0019】また、配線基板4の裏面側には接地用電極
6が設けられ、この接地用電極6が台座1に接して装着
されている。マイクロストリップ線路13の接地用電極
となる配線基板4の裏面側の接地用電極6と電子デバイ
ス9の接地端子10との間に生じる上記寄生インダクタ
ンスは、電子デバイス9から見ると直列帰還成分となる
ため、電子デバイス9の利得低下や不要発振の原因とな
る。しかしながら、本実施の形態の電子デバイスの端子
接続構造によれば、この寄生インダクタンスを低減でき
るため、利得低下や不要発振を抑制した電子デバイスの
特性評価が可能となる。A grounding electrode 6 is provided on the back side of the wiring board 4, and the grounding electrode 6 is mounted in contact with the pedestal 1. The parasitic inductance generated between the grounding electrode 6 on the back surface side of the wiring substrate 4 that serves as the grounding electrode of the microstrip line 13 and the grounding terminal 10 of the electronic device 9 becomes a series feedback component when viewed from the electronic device 9. Therefore, it causes a decrease in the gain of the electronic device 9 and unnecessary oscillation. However, according to the terminal connection structure of the electronic device of the present embodiment, since this parasitic inductance can be reduced, it is possible to evaluate the characteristics of the electronic device in which gain reduction and unnecessary oscillation are suppressed.
【0020】本実施の形態では、配線基板4内に設けら
れる高周波伝送部としてマイクロストリップ線路を用い
たが、コプレーナ線路を用いてもよい。配線基板4の材
料としては適度な硬さと柔軟性を持った材料が好まし
く、本実施の形態ではガラスエポキシ基板を用いたが、
テフロン(R)基板や、ポリイミド基板、ガラスフッ素
樹脂基板、PPO(Poly Phenylene Oxide)基板などを
用いてもよい。また、本実施の形態では、配線基板4の
台座1への装着は、ねじ止め18にすることによって、
配線基板4の交換を容易にできるようにしたが、はんだ
付けにより確実な接続状態にすることも可能である。In this embodiment, the microstrip line is used as the high frequency transmission section provided in the wiring board 4, but a coplanar line may be used. As the material of the wiring board 4, a material having appropriate hardness and flexibility is preferable. In the present embodiment, the glass epoxy board is used.
A Teflon (R) substrate, a polyimide substrate, a glass fluororesin substrate, a PPO (Poly Phenylene Oxide) substrate, or the like may be used. Further, in the present embodiment, the wiring board 4 is attached to the pedestal 1 by screwing 18.
Although the wiring board 4 can be easily replaced, it is possible to make a reliable connection by soldering.
【0021】また、配線基板4に形成されたマイクロス
トリップ線路13と電子デバイス9の信号入出力端子1
1との接続部分には、接点電極5が配置されている。接
点電極5は、信号入出力端子11と線路の接続の耐久性
を高めるとともに、接続をより確実にするために硬い導
電性材料で形成するのが好ましい。本実施の形態では、
接点電極5には、金めっきを施した鉄、ニッケル合金を
用いることとするが、銅などの金属を用いてもよく、さ
らに、接点電極5に金などの導電性がよく腐食しにくい
金属めっきを施すことにより、より低抵抗で正確かつ確
実な電気的接続を行なうことができる。The microstrip line 13 formed on the wiring board 4 and the signal input / output terminal 1 of the electronic device 9 are also provided.
A contact electrode 5 is arranged at the connecting portion with 1. The contact electrode 5 is preferably formed of a hard conductive material in order to enhance the durability of the connection between the signal input / output terminal 11 and the line and to ensure the connection more reliably. In this embodiment,
The contact electrode 5 is made of gold-plated iron or nickel alloy. However, a metal such as copper may be used, and the contact electrode 5 may be made of metal such as gold that has good conductivity and does not easily corrode. By applying the above, it is possible to perform accurate and reliable electrical connection with lower resistance.
【0022】また、配線基板4の裏面側には、導電性薄
板7と接続される接地用電極6が形成されているが、こ
の接地用電極6は、配線基板4のデバイス突き当て部2
の近くまで延びるように形成されて導電性薄板7と接続
されるように設定されている。本実施の形態では配線基
板4の裏面側に接地用電極6を設けたが、コプレーナ線
路など、接地電位の配線が表面に形成されている配線基
板4では、接地用電極6を表面に設けてもよい。また、
接地用電極6には、導電率の高い金属を用いることが好
ましいが、本実施の形態では、配線基板4の配線材料で
もある銅に金めっきを施し、確実な接続が得られるもの
を用いた。Further, a grounding electrode 6 connected to the conductive thin plate 7 is formed on the back surface side of the wiring board 4. The grounding electrode 6 is connected to the device contact portion 2 of the wiring board 4.
Is formed so as to extend close to and is connected to the conductive thin plate 7. Although the ground electrode 6 is provided on the back surface side of the wiring board 4 in the present embodiment, the ground electrode 6 is provided on the front surface of the wiring board 4 on the surface of which the wiring of the ground potential is formed, such as a coplanar line. Good. Also,
It is preferable to use a metal having a high conductivity for the grounding electrode 6, but in the present embodiment, copper that is also the wiring material of the wiring board 4 is plated with gold to obtain a reliable connection. .
【0023】また、台座1には、デバイス突き当て部2
が形成されている。デバイス突き当て部2は、より広い
面積で接地端子10と接触した方がよく、電子デバイス
9の接地端子10に合わせた形状が望ましい。本実施の
形態では、デバイス突き当て部2の材料に電気伝導と熱
伝導との双方を考慮してアルミ材を用い、電子デバイス
9の接地端子10が平坦であることに合わせてデバイス
突き当て部2も平坦にしたが、形状のばらつきの多い電
子デバイス9や接地端子10の形状によっては、伸縮性
のコンタクトピンを用いたり、ばねやゴムなどの弾性体
を用いてもよい。The pedestal 1 also has a device abutting portion 2
Are formed. It is better that the device abutting portion 2 is in contact with the ground terminal 10 in a wider area, and a shape matching the ground terminal 10 of the electronic device 9 is desirable. In the present embodiment, an aluminum material is used as the material of the device abutting portion 2 in consideration of both electric conduction and thermal conduction, and the device abutting portion is made to match the fact that the ground terminal 10 of the electronic device 9 is flat. Although 2 is also made flat, a stretchable contact pin or an elastic body such as a spring or rubber may be used depending on the shapes of the electronic device 9 and the ground terminal 10 that have many variations in shape.
【0024】また、本実施の形態では、デバイス突き当
て部2は配線基板4の表面より突出しているが、配線基
板4の接点電極5よりはわずかに低くすることにより、
電子デバイス9を台座1に押し付けたときに電子デバイ
ス9が受けるストレスを低減しかつ各端子の良好な電気
的接続を得るようにした。特に、表面実装型の電子デバ
イス9のように信号入出力端子11と接地端子10が同
一平面にある場合は、デバイス突き当て部2からの接点
電極5の突出の程度を小さくしても、各信号入出力端子
11と良好な電気的接続が得られるため、電子デバイス
9を台座1に押し付けたときに電子デバイスが受けるス
トレスをより効果的に低減できる。Further, in the present embodiment, the device abutting portion 2 projects from the surface of the wiring board 4, but by making it slightly lower than the contact electrode 5 of the wiring board 4,
The stress that the electronic device 9 receives when the electronic device 9 is pressed against the pedestal 1 is reduced and good electrical connection of each terminal is obtained. In particular, when the signal input / output terminal 11 and the ground terminal 10 are on the same plane as in the surface mount type electronic device 9, even if the degree of protrusion of the contact electrode 5 from the device abutting portion 2 is reduced, Since good electrical connection with the signal input / output terminal 11 can be obtained, the stress applied to the electronic device when the electronic device 9 is pressed against the pedestal 1 can be reduced more effectively.
【0025】また、台座1の接地用電極6の直下には彫
り込み部3が形成されており、彫り込み部3には弾性体
8が設けられている。本実施の形態では弾性体8に加工
がしやすい導電性ゴムを用いたが、ばねを使用してもよ
い。Further, the engraved portion 3 is formed immediately below the grounding electrode 6 of the pedestal 1, and the engraved portion 3 is provided with an elastic body 8. In this embodiment, the elastic body 8 is made of conductive rubber that is easy to process, but a spring may be used.
【0026】デバイス突き当て部2には導電性薄板7が
敷かれている。導電性薄板7は、柔軟に変形する厚さと
硬さとを有する導電性の薄板であり、その端部は配線基
板4の接地用電極6と接続されている。本実施の形態で
は、導電性薄板7には、電気伝導率および熱伝導率が高
い100μm厚の銅箔を用いたが、耐久性を考慮してポ
リイミドフィルムに銅箔を貼付けたものなどを用いても
よく、接続をより確実にするために金めっきなどを施し
てもよい。この導電性薄板7は彫り込み部3に埋込まれ
た弾性体8によって接地用電極6に押し当てられ、接地
用電極6と電気的に接続されている。本実施の形態で
は、配線基板4の柔軟性を損なわずに、弾性体8の弾圧
接触によって導電性薄板7と接地用電極6とを接続する
ことができるが、より確実に接続するためには導電性薄
板7と接地用電極6とをはんだ付けによって接続しても
よい。さらに、本実施の形態では、各配線基板4の接地
用電極6を、1枚の導電性薄板7を用いて接続したが、
複数枚の導電性薄板7を設け、各接地用電極6にそれぞ
れの導電性薄板7を接続してもよい。A conductive thin plate 7 is laid on the device abutting portion 2. The conductive thin plate 7 is a conductive thin plate having a thickness and hardness that can be flexibly deformed, and its end portion is connected to the ground electrode 6 of the wiring board 4. In the present embodiment, the conductive thin plate 7 is made of a copper foil having a high electric conductivity and a high thermal conductivity and having a thickness of 100 μm. However, in consideration of durability, a polyimide film having a copper foil attached thereto is used. Alternatively, gold plating or the like may be applied to secure the connection. The conductive thin plate 7 is pressed against the grounding electrode 6 by the elastic body 8 embedded in the engraved portion 3 and is electrically connected to the grounding electrode 6. In the present embodiment, the conductive thin plate 7 and the grounding electrode 6 can be connected by elastic contact of the elastic body 8 without impairing the flexibility of the wiring board 4, but in order to connect more reliably The conductive thin plate 7 and the ground electrode 6 may be connected by soldering. Further, in the present embodiment, the ground electrode 6 of each wiring board 4 is connected using one conductive thin plate 7,
A plurality of conductive thin plates 7 may be provided, and each conductive thin plate 7 may be connected to each ground electrode 6.
【0027】次に、電子デバイス9と電子デバイスの測
定装置とが接続された状態を、図2を用いて説明する。
電子デバイス9を装着して測定する際には、電子デバイ
ス9はデバイス押え12などによって接点電極5および
デバイス突き当て部2に敷かれた導電性薄板7に押し付
けられる。デバイス突き当て部2よりわずかに高くして
ある接点電極5は、電子デバイス9の信号入出力端子1
1によって下方に押され、配線基板4は弾性変形し、下
方に撓む。そして、彫り込み部3に入れられた弾性体8
の弾力によって信号入出力端子11と接点電極5は弾性
的に接触し、配線基板4の回路と信号入出力端子11と
は接点電極5を介して電気的に接続される。このとき、
導電性薄板7は配線基板4の撓みに合わせて柔らかく変
形するため、配線基板4の撓みに支障を来すことはな
い。Next, the state in which the electronic device 9 and the measuring device for the electronic device are connected will be described with reference to FIG.
When the electronic device 9 is mounted and measured, the electronic device 9 is pressed against the contact electrode 5 and the conductive thin plate 7 laid on the device abutting portion 2 by the device retainer 12 or the like. The contact electrode 5 which is slightly higher than the device abutting portion 2 is the signal input / output terminal 1 of the electronic device 9.
The wiring board 4 is pushed downward by 1 and elastically deforms, and bends downward. And the elastic body 8 put in the engraving part 3
The elastic force makes the signal input / output terminal 11 and the contact electrode 5 elastically contact each other, and the circuit of the wiring board 4 and the signal input / output terminal 11 are electrically connected via the contact electrode 5. At this time,
Since the conductive thin plate 7 is softly deformed according to the bending of the wiring board 4, it does not hinder the bending of the wiring board 4.
【0028】しかしながら、デバイス突き当たり部2に
コンタクトピンや弾性体8を用いた場合は、導電性薄板
7の可動範囲が大きくなるため、配線基板4の撓みを妨
げないような構造にした方がよい。そして、配線基板4
が撓んで電子デバイス9が下方に押し付けられること
で、電子デバイス9の接地端子10はデバイス突き当て
部2の上面に敷かれた導電性薄板7に接触し、電子デバ
イス9の接地端子10と導電性薄板7とが電気的に接続
される。However, when the contact pin or the elastic body 8 is used for the device abutting portion 2, the movable range of the conductive thin plate 7 becomes large, so it is better to have a structure that does not hinder the bending of the wiring board 4. . And the wiring board 4
Is bent and the electronic device 9 is pressed downward, so that the ground terminal 10 of the electronic device 9 comes into contact with the conductive thin plate 7 laid on the upper surface of the device abutting portion 2, and is electrically connected to the ground terminal 10 of the electronic device 9. The electrically conductive thin plate 7 is electrically connected.
【0029】なお、今回開示された実施の形態はすべて
の点で例示であって制限的なものではないと考えられる
べきである。本発明の範囲は上記した説明ではなく特許
請求の範囲によって示され、特許請求の範囲と均等の意
味および範囲内でのすべての変更が含まれることが意図
される。It should be understood that the embodiments disclosed this time are illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description but by the scope of the claims, and is intended to include meanings equivalent to the scope of the claims and all modifications within the scope.
【0030】[0030]
【発明の効果】本発明の端子接続構造によれば、接地端
子から接地用電極へ向かって延び、接地端子と接地用電
極との双方に接触し得る導電性部材を設けたことによ
り、第1および第2の凸部を有する台座を介して接地用
電極と接地端子とを電気的に接続する場合に比較して、
端子接続構造の接地用電極と電子デバイスの接地端子と
を短経路で接続できるため、接地用電極と接地端子との
間に生じる寄生インダクタンスを低減することができ
る。According to the terminal connection structure of the present invention, by providing the conductive member that extends from the ground terminal toward the ground electrode and can contact both the ground terminal and the ground electrode, As compared with the case where the ground electrode and the ground terminal are electrically connected via the pedestal having the second convex portion,
Since the ground electrode of the terminal connection structure and the ground terminal of the electronic device can be connected by a short path, the parasitic inductance generated between the ground electrode and the ground terminal can be reduced.
【0031】そのため、端子接続構造を電子デバイスの
電気特性測定装置に用いれば、電子デバイスのより正確
な電気特性の測定が可能となる。特に、寄生インダクタ
ンスのインピーダンスが増大する高周波域ではその効果
が大きい。Therefore, if the terminal connection structure is used in an electric characteristic measuring apparatus for an electronic device, it is possible to measure the electric characteristic of the electronic device more accurately. In particular, the effect is great in the high frequency range where the impedance of the parasitic inductance increases.
【0032】本発明の電子デバイスの電気特性測定装置
の使用方法によれば、電子デバイスを端子接続構造に電
気的に接続するために、圧接手段を用いて第2の凸部上
の導電性部材に対して電子デバイスの接地端子側の面を
圧接することにより、電子デバイスの電気特性の測定を
行なえる状態にするため、電子デバイスを測定装置に簡
単に装着することができる。According to the method of using the electrical characteristic measuring apparatus for an electronic device of the present invention, the electrically conductive member on the second convex portion is formed by using the pressure contact means in order to electrically connect the electronic device to the terminal connection structure. By pressing the surface of the electronic device on the side of the ground terminal, the electric characteristics of the electronic device can be measured, so that the electronic device can be easily attached to the measuring apparatus.
【図1】 本実施の形態の電子デバイスの電気特性測定
装置の端子接続構造を示す部分断面図である。FIG. 1 is a partial cross-sectional view showing a terminal connection structure of an electric characteristic measuring apparatus for an electronic device according to a present embodiment.
【図2】 図1で示した端子接続構造に電子デバイスが
装着された状態を示す図である。FIG. 2 is a diagram showing a state in which an electronic device is mounted on the terminal connection structure shown in FIG.
【図3】 図1で示した端子接続構造の上面図である。FIG. 3 is a top view of the terminal connection structure shown in FIG.
【図4】 従来の電子デバイスの電気特性測定装置の端
子接続構造を示す部分断面図である。FIG. 4 is a partial cross-sectional view showing a terminal connection structure of a conventional electronic device electrical characteristic measuring apparatus.
1 台座、2 デバイス突き当て部、3 彫り込み部、
4 配線基板、5 接点電極、6 接地用電極、7 導
電性薄板、8 弾性体、9 電子デバイス、10 接地
端子、11 信号入出力端子、12 圧接手段、13,
16 マイクロストリップ線路、14 チップコンデン
サ、15 ビアホール、17 コネクタ、18 ねじ止
め。1 pedestal, 2 device butting part, 3 engraving part,
4 wiring boards, 5 contact electrodes, 6 ground electrodes, 7 conductive thin plates, 8 elastic bodies, 9 electronic devices, 10 ground terminals, 11 signal input / output terminals, 12 pressure contact means, 13,
16 microstrip lines, 14 chip capacitors, 15 via holes, 17 connectors, 18 screws.
Claims (7)
地端子それぞれと電気的に接続される端子接続構造であ
って、 縦断面において、凹部と該凹部により形成された第1お
よび第2の凸部とを有する台座と、 前記第1の凸部上から前記凹部上の所定の位置まで片持
ち梁状に延び、前記接地端子と電気的に接続されて前記
電子デバイスを接地するための接地用電極と、 前記第2の凸部上面側から前記接地用電極の下面側へ向
かって延びるように設けられた導電性部材と、 前記凹部上に設けられ、前記信号入出力端子に対して信
号の入出力を行なうための接点電極とを備え、 前記電子デバイスを前記端子接続構造に電気的に接続す
るために、前記接地端子が前記導電性部材と接触するよ
うに前記電子デバイスが前記第2の凸部の上面に設置さ
れたときに、前記信号入出力端子と前記接点電極とが接
触するとともに、前記導電性部材と前記接地用電極とが
接触するか、または、前記導電性部材と前記接地用電極
とが接触する状態を維持するように構成された、端子接
続構造。1. A terminal connection structure electrically connected to each of a signal input / output terminal and a ground terminal of an electronic device, comprising a recess and first and second protrusions formed by the recess in a vertical cross section. And a grounding electrode extending in a cantilever shape from above the first convex portion to a predetermined position above the concave portion and electrically connected to the ground terminal to ground the electronic device. A conductive member provided so as to extend from the upper surface side of the second convex portion toward the lower surface side of the ground electrode, and a signal input to the signal input / output terminal provided on the concave portion. A contact electrode for performing an output, and the electronic device is configured such that the ground terminal contacts the conductive member to electrically connect the electronic device to the terminal connection structure. Installed on the top of the unit When the signal input / output terminal and the contact electrode are in contact with each other, the conductive member is in contact with the ground electrode, or the conductive member is in contact with the ground electrode. A terminal connection structure configured to maintain.
弾性体が設けられ、前記導電性部材と前記接地用電極と
が接触する状態で前記弾性体を前記凹部に押し付けて使
用する端子接続構造であって、 前記台座が導電性であり、かつ、前記弾性体が導電性で
ある、請求項1に記載の端子接続構造。2. An elastic body is provided in the recess below the conductive member, and the elastic body is pressed against the recess when the conductive member and the ground electrode are in contact with each other. The terminal connection structure according to claim 1, wherein the pedestal is electrically conductive, and the elastic body is electrically conductive.
え、 前記接地用電極が前記配線基板の下面に設けられ、か
つ、前記接点電極が前記配線基板の上面に設けられるよ
うに、該配線基板が前記台座の上に設けられ、 前記第2の凸部の上面が、前記配線基板の上面よりも高
い位置にあり、かつ、前記接点電極の上面よりも低い位
置にある、請求項1または請求項2に記載の端子接続構
造。3. A wiring board provided with a high-frequency circuit, wherein the ground electrode is provided on a lower surface of the wiring board, and the contact electrode is provided on an upper surface of the wiring board. Is provided on the pedestal, and the upper surface of the second convex portion is at a position higher than the upper surface of the wiring board and lower than the upper surface of the contact electrode. Item 2. The terminal connection structure according to Item 2.
求項1〜請求項3のいずれかに記載の端子接続構造。4. The terminal connection structure according to claim 1, wherein the second convex portion is made of an elastic body.
び、前記導電性部材それぞれが対応して複数設けられて
いる、請求項1〜請求項4のいずれかに記載の端子接続
構造。5. The terminal connection structure according to claim 1, wherein a plurality of the ground electrodes, the contact electrodes, and the conductive member are provided correspondingly.
造を、測定の対象となる電子デバイスの端子との接続に
用いた、電子デバイスの電気特性測定装置。6. An electric characteristic measuring apparatus for an electronic device, wherein the terminal connection structure according to claim 1 is used for connection with a terminal of an electronic device to be measured.
電気的に接続するために、圧接手段を用いて前記第2の
凸部上の前記導電性部材に対して前記電子デバイスの前
記接地端子側の面を圧接することにより、前記接地端子
が導電性部材を介して前記接地電極に電気的に接続され
るとともに、前記信号入出力端子と前記接点電極とが電
気的に接続されて、電子デバイスの電気特性の測定を行
なえる状態にする、請求項6に記載の電子デバイスの電
気特性測定装置の使用方法。7. The ground terminal side of the electronic device with respect to the conductive member on the second convex portion using a pressure contact means for electrically connecting the electronic device to the terminal connection structure. The surface of the device is pressed to electrically connect the ground terminal to the ground electrode via a conductive member, and the signal input / output terminal and the contact electrode are electrically connected to each other to form an electronic device. 7. The method for using the electric characteristic measuring apparatus for an electronic device according to claim 6, which is set in a state in which the electric characteristic can be measured.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001231544A JP2003043069A (en) | 2001-07-31 | 2001-07-31 | Terminal connection structure, electric characteristic measuring device for electronic device using the same, and using method for the electric characteristic measuring device for electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001231544A JP2003043069A (en) | 2001-07-31 | 2001-07-31 | Terminal connection structure, electric characteristic measuring device for electronic device using the same, and using method for the electric characteristic measuring device for electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2003043069A true JP2003043069A (en) | 2003-02-13 |
Family
ID=19063584
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Application Number | Title | Priority Date | Filing Date |
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JP2001231544A Pending JP2003043069A (en) | 2001-07-31 | 2001-07-31 | Terminal connection structure, electric characteristic measuring device for electronic device using the same, and using method for the electric characteristic measuring device for electronic device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010002302A (en) * | 2008-06-20 | 2010-01-07 | Tokyo Electron Ltd | Contact structure for inspection |
-
2001
- 2001-07-31 JP JP2001231544A patent/JP2003043069A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010002302A (en) * | 2008-06-20 | 2010-01-07 | Tokyo Electron Ltd | Contact structure for inspection |
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