JP2003043069A - Terminal connection structure, electric characteristic measuring device for electronic device using the same, and using method for the electric characteristic measuring device for electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a terminal connection structure capable of performing very exact measurement, an electric characteristic measuring device for electronic device thereof and its using method. SOLUTION: By using crimping means 12 for pushing a ground terminal 10 of an electronic device 9 to a device butting part 2 of a pedestal 1 to crimp the ground terminal 10 and a conductive thin plate 7. The ground terminal 10 is electrically connected to an electrode for ground 6 on the back side of a wiring board 4 by way of the conductive thin plate 7. Also, a signal terminal 11 and a contact electrode 5 are electrically connected to be capable of electric characteristic measurement.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal connection structure electrically connected to a signal input / output terminal and a ground terminal of an electronic device, and an electric characteristic measuring apparatus for an electronic device using the terminal structure. , About how to use it.

[0002]

2. Description of the Related Art As an electric characteristic measuring apparatus for an electronic device, for example, one disclosed in Japanese Patent Application Laid-Open No. 11-183563 is known. A similar conventional electrical characteristic measuring apparatus for electronic devices will be described with reference to FIG.

As shown in FIG. 4, in the conventional electrical characteristic measuring apparatus for an electronic device, the pedestal 101 is made of a conductive material, and the ground terminal 110 is provided on the back surface of the electronic device 109 of the pedestal 101. The device abutting portion 2 is provided so as to protrude at the connection point. Further, the pedestal 101 is formed with a carved portion 103 so that the wiring board 104 can be bent. An elastic body 108 is installed in the engraved portion 103. In addition, a matching circuit and a bias circuit necessary for measuring the electronic device 109 are formed on the wiring board 104, and the electronic device 10
A contact electrode 105 is connected to the location of the signal input / output terminal 111 of FIG. Further, the line used in the above circuit is configured by using a microstrip line or the like, and the grounding electrode 106 is provided on the back surface of the wiring substrate 104. The ground electrode 106 on the back surface side of the wiring board 104 is electrically connected to the base 1 by screwing or soldering.

When the electronic device 109 is mounted and measured, the signal input / output terminal 111 of the electronic device 109 is pressed against the contact electrode 105, and the ground terminal 110 of the electronic device 109 is pressed against the device abutting portion 102. At that time, the elastic force of the elastic body 108 causes the contact electrode 1
05 and the signal input / output terminal 111 are designed to elastically contact each other. Further, the device abutting section 102 is
The ground terminal 110 of the electronic device 109 is brought into contact with the ground terminal 110 of the electronic device 109 and the pedestal 101 is electrically connected to the pedestal 101.
4, the ground terminal 110 of the electronic device 109 is electrically connected to the ground electrode 106 on the back surface side of the wiring board 104 via the pedestal 101 because it is in contact with the ground electrode 106 on the back surface side. Become.

[0005]

In the above structure, the ground terminal 110 of the electronic device 109 is electrically connected to the ground electrode 106 on the back surface side of the wiring board 104 via the pedestal 101. Therefore, the pedestal 101 has a contact electrode 1
Due to the formation of the engraved portion 103 for inserting the elastic body 108 for elastically contacting the wiring board 05,
The electrical length between the grounding electrode 106 on the rear surface side and the grounding terminal 110 of the electronic device 109 becomes long.
Therefore, the parasitic inductance between the ground electrode 106 on the back surface of the wiring board 104 and the ground electrode 106 of the electronic device 109 increases. As a result, the electronic device 1
There is a problem in that the electrical characteristics of 09 are measured differently from the actual electrical characteristics, making it impossible to measure the electrical characteristics accurately. In particular, the problem becomes serious in a high frequency region where the impedance due to the parasitic inductance increases.

The present invention has been made in view of the above problems, and an object thereof is to provide a terminal connection structure capable of performing accurate measurement as much as possible, and an electric characteristic measuring apparatus for an electronic device using the same. And to provide a method of using the same.

[0007]

The terminal connection structure of the present invention is a terminal connection structure electrically connected to each of a signal input / output terminal and a ground terminal of an electronic device. And a pedestal having first and second convex portions formed by, and extending in a cantilever shape from above the first convex portion to a predetermined position above the concave portion, and electrically connected to the ground terminal to form an electronic device. A grounding electrode for grounding, a conductive member provided so as to extend from the upper surface side of the second convex portion to the lower surface side of the grounding electrode, and a conductive member provided on the concave portion, with respect to the signal input / output terminal. And a contact electrode for inputting and outputting a signal, and for electrically connecting the electronic device to the terminal connection structure, the electronic device has the second convex portion so that the ground terminal contacts the conductive member. Signal input / output when installed on the top Together and the terminal and the contact point electrode in contact or the conductive member and the ground electrode is in contact, or, conductive member and the ground electrode is configured to maintain a state of contact.

According to the terminal connection structure of the present invention, by providing the conductive member that extends from the ground terminal toward the ground electrode and can contact both the ground terminal and the ground electrode,
A short path between the ground electrode of the terminal connection structure and the ground terminal of the electronic device as compared with the case where the ground electrode and the ground terminal are electrically connected through the pedestal having the first and second convex portions Therefore, the parasitic inductance generated between the ground electrode and the ground terminal can be reduced.

In the terminal connection structure of the present invention, the recess is provided with an elastic body below the conductive member, and the elastic body is pressed against the recess when the conductive member and the ground electrode are in contact with each other. It is more preferable that the pedestal is conductive and the elastic body is conductive in the terminal connection structure. By doing so, it becomes possible to form a structure in which the ground electrode and the ground terminal can be electrically connected via the conductive elastic body.

The terminal connection structure of the present invention includes a wiring board on which a high-frequency circuit is formed, and wiring is performed so that the ground electrode is provided on the lower surface of the wiring board and the contact electrode is provided on the upper surface of the wiring board. The substrate is provided on the pedestal, and the upper surface of the second convex portion is located higher than the upper surface of the wiring board and lower than the upper surface of the contact electrode. By doing so, the impact when the conductive member is pressed against the second convex portion can be softened.

In the terminal connection structure of the present invention, the second convex portion may be made of an elastic body. By doing so, it is possible to mitigate the shock generated in the electronic device when the electronic device is pressed against the second convex portion.

In the terminal connection structure of the present invention, a plurality of ground electrodes, contact electrodes, and conductive members may be provided correspondingly. By doing so, it becomes possible to simultaneously measure a plurality of electronic devices. Further, it becomes possible to measure the electrical characteristics of an electronic device having a plurality of terminals with one measuring device.

The electrical characteristic measuring apparatus for an electronic device of the present invention uses the above-mentioned terminal connection structure for connection with the terminal of the electronic device to be measured. Therefore, it becomes possible to measure the electrical characteristics of the electronic device more accurately. In particular, the effect is great in the high frequency range where the impedance of the parasitic inductance increases.

The method of using the electrical characteristic measuring apparatus for an electronic device according to the present invention is directed to a conductive member on the second convex portion using a pressure contact means for electrically connecting the electronic device to the terminal connection structure. By pressing the surface of the electronic device on the side of the ground terminal, the ground terminal is electrically connected to the ground electrode via the conductive member, and the signal input / output terminal and the contact electrode are also electrically connected. The electronic device so that the electrical characteristics of the electronic device can be measured. By doing so, the electronic device can be easily attached to the measuring apparatus.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION A terminal connection structure and the like according to an embodiment of the present invention will be described below with reference to the drawings. First, the terminal connection structure of the electrical characteristic measuring apparatus 50 for an electronic device according to the present embodiment will be described with reference to FIG.

As shown in FIG. 1, an electrically conductive pedestal 1 of an electrical characteristic measuring apparatus 50 for an electronic device has an insulating wiring board 4 having a contact electrode 5, a conductive thin plate 7, and a conductive thin plate 7. The elastic body 8 is provided. Then, as shown in FIG. 2, the ground terminal 10 of the electronic device 9 is pressed against the device abutting portion 2 of the pedestal 1 by using the pressure contact means 12, that is, the conductive thin plate 7 is connected to the ground terminal 10 and the device. By sandwiching it with the butting part 2, the ground terminal 1
0 and the conductive thin plate 7 are pressed into contact with each other, and the ground terminal 10 is electrically connected to the ground electrode 6 on the back surface side of the wiring substrate 4 via the conductive thin plate 7. The conductive thin plate 7 and the grounding electrode 6 may be in contact with each other in advance, or may have a positional relationship such that they are brought into contact with each other by pressure contact by the pressure contact means 12.

According to the terminal connection structure of the electric characteristic measuring apparatus 50 for an electronic device of this embodiment, the ground terminal 110 and the back surface of the wiring board 104 are grounded via the pedestal 101 as in the conventional connection structure described above. Compared to the case where the electrode 106 is electrically connected, the ground terminal 10 and the ground electrode 6 on the back surface of the wiring board 4 can be electrically connected with a shorter electric length. Therefore, the grounding electrode 6 on the back surface of the wiring board 4
It is possible to reduce the parasitic inductance between the electronic device 9 and the ground terminal 10 of the electronic device 9.

A circuit including a high-frequency transmission line such as a bias circuit and a matching circuit for operating the electronic device 9 is formed on the wiring board 4, as shown in FIG. 3, which is a top view of FIG. On the wiring board 4, the matching circuit microstrip line 13 and the chip capacitor 14,
A ground via hole 15, a bias circuit microstrip line 16, and the like are formed.

A grounding electrode 6 is provided on the back side of the wiring board 4, and the grounding electrode 6 is mounted in contact with the pedestal 1. The parasitic inductance generated between the grounding electrode 6 on the back surface side of the wiring substrate 4 that serves as the grounding electrode of the microstrip line 13 and the grounding terminal 10 of the electronic device 9 becomes a series feedback component when viewed from the electronic device 9. Therefore, it causes a decrease in the gain of the electronic device 9 and unnecessary oscillation. However, according to the terminal connection structure of the electronic device of the present embodiment, since this parasitic inductance can be reduced, it is possible to evaluate the characteristics of the electronic device in which gain reduction and unnecessary oscillation are suppressed.

In this embodiment, the microstrip line is used as the high frequency transmission section provided in the wiring board 4, but a coplanar line may be used. As the material of the wiring board 4, a material having appropriate hardness and flexibility is preferable. In the present embodiment, the glass epoxy board is used.
A Teflon (R) substrate, a polyimide substrate, a glass fluororesin substrate, a PPO (Poly Phenylene Oxide) substrate, or the like may be used. Further, in the present embodiment, the wiring board 4 is attached to the pedestal 1 by screwing 18.
Although the wiring board 4 can be easily replaced, it is possible to make a reliable connection by soldering.

The microstrip line 13 formed on the wiring board 4 and the signal input / output terminal 1 of the electronic device 9 are also provided.
A contact electrode 5 is arranged at the connecting portion with 1. The contact electrode 5 is preferably formed of a hard conductive material in order to enhance the durability of the connection between the signal input / output terminal 11 and the line and to ensure the connection more reliably. In this embodiment,
The contact electrode 5 is made of gold-plated iron or nickel alloy. However, a metal such as copper may be used, and the contact electrode 5 may be made of metal such as gold that has good conductivity and does not easily corrode. By applying the above, it is possible to perform accurate and reliable electrical connection with lower resistance.

Further, a grounding electrode 6 connected to the conductive thin plate 7 is formed on the back surface side of the wiring board 4. The grounding electrode 6 is connected to the device contact portion 2 of the wiring board 4.
Is formed so as to extend close to and is connected to the conductive thin plate 7. Although the ground electrode 6 is provided on the back surface side of the wiring board 4 in the present embodiment, the ground electrode 6 is provided on the front surface of the wiring board 4 on the surface of which the wiring of the ground potential is formed, such as a coplanar line. Good. Also,
It is preferable to use a metal having a high conductivity for the grounding electrode 6, but in the present embodiment, copper that is also the wiring material of the wiring board 4 is plated with gold to obtain a reliable connection. .

The pedestal 1 also has a device abutting portion 2
Are formed. It is better that the device abutting portion 2 is in contact with the ground terminal 10 in a wider area, and a shape matching the ground terminal 10 of the electronic device 9 is desirable. In the present embodiment, an aluminum material is used as the material of the device abutting portion 2 in consideration of both electric conduction and thermal conduction, and the device abutting portion is made to match the fact that the ground terminal 10 of the electronic device 9 is flat. Although 2 is also made flat, a stretchable contact pin or an elastic body such as a spring or rubber may be used depending on the shapes of the electronic device 9 and the ground terminal 10 that have many variations in shape.

Further, in the present embodiment, the device abutting portion 2 projects from the surface of the wiring board 4, but by making it slightly lower than the contact electrode 5 of the wiring board 4,
The stress that the electronic device 9 receives when the electronic device 9 is pressed against the pedestal 1 is reduced and good electrical connection of each terminal is obtained. In particular, when the signal input / output terminal 11 and the ground terminal 10 are on the same plane as in the surface mount type electronic device 9, even if the degree of protrusion of the contact electrode 5 from the device abutting portion 2 is reduced, Since good electrical connection with the signal input / output terminal 11 can be obtained, the stress applied to the electronic device when the electronic device 9 is pressed against the pedestal 1 can be reduced more effectively.

Further, the engraved portion 3 is formed immediately below the grounding electrode 6 of the pedestal 1, and the engraved portion 3 is provided with an elastic body 8. In this embodiment, the elastic body 8 is made of conductive rubber that is easy to process, but a spring may be used.

A conductive thin plate 7 is laid on the device abutting portion 2. The conductive thin plate 7 is a conductive thin plate having a thickness and hardness that can be flexibly deformed, and its end portion is connected to the ground electrode 6 of the wiring board 4. In the present embodiment, the conductive thin plate 7 is made of a copper foil having a high electric conductivity and a high thermal conductivity and having a thickness of 100 μm. However, in consideration of durability, a polyimide film having a copper foil attached thereto is used. Alternatively, gold plating or the like may be applied to secure the connection. The conductive thin plate 7 is pressed against the grounding electrode 6 by the elastic body 8 embedded in the engraved portion 3 and is electrically connected to the grounding electrode 6. In the present embodiment, the conductive thin plate 7 and the grounding electrode 6 can be connected by elastic contact of the elastic body 8 without impairing the flexibility of the wiring board 4, but in order to connect more reliably The conductive thin plate 7 and the ground electrode 6 may be connected by soldering. Further, in the present embodiment, the ground electrode 6 of each wiring board 4 is connected using one conductive thin plate 7,
A plurality of conductive thin plates 7 may be provided, and each conductive thin plate 7 may be connected to each ground electrode 6.

Next, the state in which the electronic device 9 and the measuring device for the electronic device are connected will be described with reference to FIG.
When the electronic device 9 is mounted and measured, the electronic device 9 is pressed against the contact electrode 5 and the conductive thin plate 7 laid on the device abutting portion 2 by the device retainer 12 or the like. The contact electrode 5 which is slightly higher than the device abutting portion 2 is the signal input / output terminal 1 of the electronic device 9.
The wiring board 4 is pushed downward by 1 and elastically deforms, and bends downward. And the elastic body 8 put in the engraving part 3
The elastic force makes the signal input / output terminal 11 and the contact electrode 5 elastically contact each other, and the circuit of the wiring board 4 and the signal input / output terminal 11 are electrically connected via the contact electrode 5. At this time,
Since the conductive thin plate 7 is softly deformed according to the bending of the wiring board 4, it does not hinder the bending of the wiring board 4.

However, when the contact pin or the elastic body 8 is used for the device abutting portion 2, the movable range of the conductive thin plate 7 becomes large, so it is better to have a structure that does not hinder the bending of the wiring board 4. . And the wiring board 4
Is bent and the electronic device 9 is pressed downward, so that the ground terminal 10 of the electronic device 9 comes into contact with the conductive thin plate 7 laid on the upper surface of the device abutting portion 2, and is electrically connected to the ground terminal 10 of the electronic device 9. The electrically conductive thin plate 7 is electrically connected.

It should be understood that the embodiments disclosed this time are illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description but by the scope of the claims, and is intended to include meanings equivalent to the scope of the claims and all modifications within the scope.

[0030]

According to the terminal connection structure of the present invention, by providing the conductive member that extends from the ground terminal toward the ground electrode and can contact both the ground terminal and the ground electrode, As compared with the case where the ground electrode and the ground terminal are electrically connected via the pedestal having the second convex portion,
Since the ground electrode of the terminal connection structure and the ground terminal of the electronic device can be connected by a short path, the parasitic inductance generated between the ground electrode and the ground terminal can be reduced.

Therefore, if the terminal connection structure is used in an electric characteristic measuring apparatus for an electronic device, it is possible to measure the electric characteristic of the electronic device more accurately. In particular, the effect is great in the high frequency range where the impedance of the parasitic inductance increases.

According to the method of using the electrical characteristic measuring apparatus for an electronic device of the present invention, the electrically conductive member on the second convex portion is formed by using the pressure contact means in order to electrically connect the electronic device to the terminal connection structure. By pressing the surface of the electronic device on the side of the ground terminal, the electric characteristics of the electronic device can be measured, so that the electronic device can be easily attached to the measuring apparatus.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional view showing a terminal connection structure of an electric characteristic measuring apparatus for an electronic device according to a present embodiment.

FIG. 2 is a diagram showing a state in which an electronic device is mounted on the terminal connection structure shown in FIG.

FIG. 3 is a top view of the terminal connection structure shown in FIG.

FIG. 4 is a partial cross-sectional view showing a terminal connection structure of a conventional electronic device electrical characteristic measuring apparatus.

[Explanation of symbols]

1 pedestal, 2 device butting part, 3 engraving part,
4 wiring boards, 5 contact electrodes, 6 ground electrodes, 7 conductive thin plates, 8 elastic bodies, 9 electronic devices, 10 ground terminals, 11 signal input / output terminals, 12 pressure contact means, 13,
16 microstrip lines, 14 chip capacitors, 15 via holes, 17 connectors, 18 screws.

Claims (7)

[Claims] 1. A terminal connection structure electrically connected to each of a signal input / output terminal and a ground terminal of an electronic device, comprising a recess and first and second protrusions formed by the recess in a vertical cross section. And a grounding electrode extending in a cantilever shape from above the first convex portion to a predetermined position above the concave portion and electrically connected to the ground terminal to ground the electronic device. A conductive member provided so as to extend from the upper surface side of the second convex portion toward the lower surface side of the ground electrode, and a signal input to the signal input / output terminal provided on the concave portion. A contact electrode for performing an output, and the electronic device is configured such that the ground terminal contacts the conductive member to electrically connect the electronic device to the terminal connection structure. Installed on the top of the unit When the signal input / output terminal and the contact electrode are in contact with each other, the conductive member is in contact with the ground electrode, or the conductive member is in contact with the ground electrode. A terminal connection structure configured to maintain. 2. An elastic body is provided in the recess below the conductive member, and the elastic body is pressed against the recess when the conductive member and the ground electrode are in contact with each other. The terminal connection structure according to claim 1, wherein the pedestal is electrically conductive, and the elastic body is electrically conductive. 3. A wiring board provided with a high-frequency circuit, wherein the ground electrode is provided on a lower surface of the wiring board, and the contact electrode is provided on an upper surface of the wiring board. Is provided on the pedestal, and the upper surface of the second convex portion is at a position higher than the upper surface of the wiring board and lower than the upper surface of the contact electrode. Item 2. The terminal connection structure according to Item 2. 4. The terminal connection structure according to claim 1, wherein the second convex portion is made of an elastic body. 5. The terminal connection structure according to claim 1, wherein a plurality of the ground electrodes, the contact electrodes, and the conductive member are provided correspondingly. 6. An electric characteristic measuring apparatus for an electronic device, wherein the terminal connection structure according to claim 1 is used for connection with a terminal of an electronic device to be measured. 7. The ground terminal side of the electronic device with respect to the conductive member on the second convex portion using a pressure contact means for electrically connecting the electronic device to the terminal connection structure. The surface of the device is pressed to electrically connect the ground terminal to the ground electrode via a conductive member, and the signal input / output terminal and the contact electrode are electrically connected to each other to form an electronic device. 7. The method for using the electric characteristic measuring apparatus for an electronic device according to claim 6, which is set in a state in which the electric characteristic can be measured.