JP2003040449A - Substrate receiving device - Google Patents

Substrate receiving device

Info

Publication number
JP2003040449A
JP2003040449A JP2001226427A JP2001226427A JP2003040449A JP 2003040449 A JP2003040449 A JP 2003040449A JP 2001226427 A JP2001226427 A JP 2001226427A JP 2001226427 A JP2001226427 A JP 2001226427A JP 2003040449 A JP2003040449 A JP 2003040449A
Authority
JP
Japan
Prior art keywords
substrate
piling
receiving
receiving device
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001226427A
Other languages
Japanese (ja)
Inventor
Yasuhiko Shigematsu
康彦 重松
Toru Yajima
亨 矢島
Hiroshi Takahashi
啓 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2001226427A priority Critical patent/JP2003040449A/en
Publication of JP2003040449A publication Critical patent/JP2003040449A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a receiving device capable of easily changing over between an inclined piling method receiving substrates by resting them against an inclined receiving tool and a horizontal piling method tiering them on a floor plate placed horizontally without reloading them by a worker. SOLUTION: This substrate receiving device is provided with the inclined piling method rotatably supporting raising arm 2 having a suction pad 5, raising the raising arm at an arbitrary piling angle and piling the substrates, and the horizontal loading method piling them into the flat pile. This device is so constructed as to change over between the both methods by a changeover switch. This constitution can reduce the work conventionally performed in required to change over to the other loading method and eliminate a flaw produced during the work.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、プリント基板製造
装置に係わり、特に基板の受取装置に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed board manufacturing apparatus, and more particularly to a board receiving apparatus.

【0002】[0002]

【従来の技術】従来、受取装置は加工後、搬送された基
板を受取るために、基板を治具により引き起こし、傾斜
した受取治具にもたれかけさせ受取る斜め積み積載方式
か、水平に置かれた敷板に段積みする水平積載方式また
はその他方式を選択し、受取作業を行っていた。また、
その際、他方式の積載要求に対しては、積み替え作業を
行っていた。
2. Description of the Related Art In the past, a receiving device, after being processed, was placed in an oblique stacking system in which a substrate was raised by a jig and leaned against an inclined receiving jig to receive the conveyed substrate, or placed horizontally. They chose the horizontal loading method of stacking on the floor board or other methods, and received the work. Also,
At that time, the transshipment work was performed in response to a loading request of another method.

【0003】[0003]

【発明が解決しようとする課題】従来、受取り装置で
は、加工後コンベア等で搬送された基板を、傾斜した受
取治具にもたれかけさせ受取る斜め積み積載方式で積載
する際、受取り装置の回転アーム後端部に、コの字型の
折り返しを設け、回転アーム本体は基板を保持せず、コ
の字型治具により基板を保持させ、傾斜した受取治具に
もたれかけさせ受取る斜め積み積載方式の、受取治具の
基板支持部にアームを回転させ、基板を乗り移らせてい
た。また、水平に置かれた敷板に段積みする水平積載方
式により積載する場合は、搬送コンベア上部に吸着パッ
ト等を有するホイストを設け、このホイストが昇降、吸
着、積載していた。尚、従来の受取機では、これら相反
する受取方式には互換性が無く、片方の受取方式で受取
った基板を、他方式の積載要求に対しては、作業者が積
み替え作業を行っていた。これにより積載作業の作業負
荷が増大し、また積み替え作業に伴うキズの発生、ま
た、異物の付着が発生し、後々の工程において不良発生
の要因となっていた。また、両方式の設備を並列に設置
し受取りを行う方法があるが、設置場所拡大及び設備投
資増大の問題がある。
Conventionally, in the receiving device, when the substrates conveyed by the conveyer after processing are stacked by the oblique stacking method in which the substrates are leaned against the inclined receiving jig and received, the rotary arm of the receiving device is used. An oblique stacking method in which a U-shaped turnback is provided at the rear end, the rotating arm body does not hold the substrate, the substrate is held by a U-shaped jig, and leans against an inclined receiving jig to receive. The substrate was transferred by rotating the arm on the substrate supporting portion of the receiving jig. Further, in the case of stacking by a horizontal stacking method of stacking on a horizontally placed floor plate, a hoist having a suction pad or the like is provided on the upper part of the conveyor, and the hoist is lifted, sucked and stacked. In the conventional receiver, these contradictory receiving methods are not compatible with each other, and an operator performs a transshipment work for a substrate received by one of the receiving methods in response to a loading request of the other method. As a result, the work load of the stacking work is increased, scratches are generated during the transshipment work, and foreign matter is attached, which causes defects in the subsequent processes. Further, there is a method of installing both types of equipment in parallel and receiving the equipment, but there is a problem of expanding the installation place and increasing the equipment investment.

【0004】本発明は、上記課題に鑑みてなされたもの
であり、作業者が積み替えること無しに、傾斜した受取
治具にもたれかけさせ受け取る斜め積み積載方式と水平
に置かれた敷板に段積みする水平積載方式とが、容易に
切り替え可能な受取装置を提供することを目的としたも
のである。
The present invention has been made in view of the above problems, and an oblique stacking and stacking system in which an operator leans against a tilted receiving jig to receive it without reloading it by a worker and a step on a floor plate placed horizontally. The purpose of the present invention is to provide a receiving device that can be easily switched between the horizontal loading method for loading.

【0005】[0005]

【課題を解決するための手段】請求項1の発明に係る基
板受取装置は、プリント基板製造工程において、基板を
製造、加工する装置から受取る場合で、基板を引き起こ
し、傾斜した受取り治具に積載する方式と、基板を水平
に設置された敷板に平積みし、受取る方式とのいずれか
に切り替え可能であることを特徴とする。請求項2の発
明は、請求項1の発明において、基板下面から基板を吸
着保持する吸着パッドを有する回転アームを回転可能に
設け、基板を受取る際に前記アームの回転より斜め積載
または水平積載を行うことを特徴とする。
According to a first aspect of the present invention, there is provided a board receiving device which raises a board and loads it on an inclined receiving jig when the board is received from an apparatus for manufacturing and processing the board in a printed board manufacturing process. It is possible to switch between a method of receiving and a method of receiving the board by stacking the boards flat on a horizontally installed floor board. According to the invention of claim 2, in the invention of claim 1, a rotary arm having a suction pad for suction-holding a substrate from the lower surface of the substrate is rotatably provided, and when the substrate is received, diagonal loading or horizontal loading is performed by rotation of the arm. It is characterized by performing.

【0006】[0006]

【発明の実施の形態】本発明の構成を、実施例に対応す
る図1を用いて説明すると、本発明は、プリント基板製
造装置の受取装置として、加工された傾斜した受取治具
にもたれかけさせ受取る斜め積み積載方式と、水平に置
かれた敷板に段積みする水平積載方式が、容易に切り替
え可能である受取装置である。
BEST MODE FOR CARRYING OUT THE INVENTION The structure of the present invention will be described with reference to FIG. 1 corresponding to an embodiment. The present invention, as a receiving device of a printed circuit board manufacturing apparatus, leans against a machined inclined receiving jig. This is a receiving device that can be easily switched between a diagonal stacking and loading method for receiving and then a horizontal loading method for stacking on a horizontally placed floor plate.

【0007】プリント基板の製造工程において、加工
後、搬送ロール3で搬送された基板1を受取る際、次工
程の投入方式に合わせ、傾斜した受取治具である斜め積
載ラック6にもたれかけさせ受取る斜め積み積載方式、
または水平に置かれた敷板に段積みする水平積載方式、
または他の方式を用いている。本方式は、吸着パット5
を有する引き起こしアーム2により基板を保持し、駆動
部4により引き起こしアームを回転させる。このアーム
により適宜、斜め積載ラック6に積載、または、切り替
えにより引き起こしアーム2が180°反転し、水平敷
板7に段積みする水平積載方式として、基板を受取る方
式である。
In the manufacturing process of the printed circuit board, when the substrate 1 transferred by the transfer roll 3 after processing is received, it is leaned against the oblique loading rack 6 which is an inclined receiving jig and received in accordance with the loading method of the next step. Diagonal loading method,
Or a horizontal loading method that stacks on a floor plate placed horizontally,
Or another method is used. This method uses suction pad 5
The holding arm 2 holds the substrate, and the driving unit 4 rotates the holding arm. A board is received as a horizontal stacking method in which the arm 2 is appropriately loaded on the diagonal loading rack 6 or flipped by switching by the arm so that the arm 2 is inverted by 180 ° and stacked on the horizontal floor plate 7.

【0008】このように、基板を吸着パット5により吸
着保持することで、引き起こしアーム端部にコの字型積
載治具を用いないため、従来では不可能であった180
°反転と、斜め積み方式との併用を可能としている。
As described above, since the substrate is sucked and held by the suction pad 5, a U-shaped stacking jig is not used at the end of the raising arm, which has been impossible in the past.
° Inversion and diagonal stacking method can be used together.

【0009】吸着パット5は、昇降させても、引き起こ
しアーム2に固定しても良い。また、引き起こしアーム
2に適宜、吸着穴を明け、これにより吸着してもよい。
また、斜め積み用のラック6は、任意の角度で良い。
The suction pad 5 may be moved up and down or fixed to the raising arm 2. Further, suction holes may be appropriately formed in the raising arm 2 so that suction can be performed.
Moreover, the rack 6 for diagonal stacking may have any angle.

【0010】(実施例)以下、本発明のプリント基板受
取装置の受取方法について説明する。図1は、本発明の
実施例を示す略断面図である。引き起こしアーム2は、
適宜配置された吸着パット5を有し、基板1の存在を光
電センサ等により検出し、その検出結果を基に搬送ロー
ル3を停止させ、基板1を吸着保持する。次いで、斜め
積み積載方式を用いる場合、駆動部4により事前に設定
された角度まで引き起こしアーム2を回転させ、斜め積
載ラック6に基板1を受け渡す。一方、図2に示す平積
み積載方式を用いる場合は、駆動部4により引き起こし
アーム2を回転せさる角度を180°に設定する切り替
えスイッチを設ける。この切り替えスイッチを切り替え
ることで、引き起こしアーム2を180°回転させ、基
板を真上から保持し、水平敷板7に受け渡すことができ
る。
(Embodiment) The receiving method of the printed circuit board receiving apparatus of the present invention will be described below. FIG. 1 is a schematic sectional view showing an embodiment of the present invention. The raising arm 2 is
It has a suction pad 5 arranged appropriately, and detects the presence of the substrate 1 by a photoelectric sensor or the like, stops the transport roll 3 based on the detection result, and suction-holds the substrate 1. Next, when the diagonal stacking system is used, the drive unit 4 raises the arm 2 up to a preset angle to rotate the arm 2 and transfers the substrate 1 to the diagonal stacking rack 6. On the other hand, in the case of using the flat stacking method shown in FIG. 2, a changeover switch is provided to set the angle at which the arm 2 is rotated by the drive unit 4 to 180 degrees. By switching the changeover switch, the raising arm 2 can be rotated by 180 °, the substrate can be held from directly above, and the substrate can be transferred to the horizontal floor plate 7.

【0011】[0011]

【発明の効果】本発明は、プリント基板製造工程におけ
る受取機において、斜め積み積載と平積み積載の切り替
えを容易に可能とした。これにより、積載後の積載方式
変更の作業が不要となり、作業の軽減が図れる。また、
積載に伴い発生していた基板表面のキズ及び汚れ、基板
端部からの発塵及び端部オレの不良が発生しない。ま
た、積載装置を並列に設置する必要が無くなり、設備投
資金額の低減も図れる。
The present invention makes it possible to easily switch between diagonal stacking and flat stacking in a receiver in a printed circuit board manufacturing process. As a result, the work of changing the loading method after loading is unnecessary, and the work can be reduced. Also,
Scratches and stains on the substrate surface, dust generated from the edge of the substrate, and defects in the edge of the substrate, which were caused by loading, do not occur. Further, it is not necessary to install the loading devices in parallel, and the amount of capital investment can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の実施例を示す斜め積み積載方式の略
断面図である。
FIG. 1 is a schematic cross-sectional view of an oblique stacking and loading system showing an embodiment of the present invention.

【図2】 本発明の実施例を示す平積み積載方式の略断
面図である。
FIG. 2 is a schematic cross-sectional view of a flat-stack loading system showing an embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1 搬送物(基板) 2 引き起こしアーム 3 搬送ロール 4 駆動部 5 吸着パット 6 斜め積載ラック 7 水平敷板 1 Transported items (substrate) 2 provoking arm 3 transport rolls 4 drive 5 adsorption pad 6 diagonal loading rack 7 Horizontal floor board

───────────────────────────────────────────────────── フロントページの続き (72)発明者 高橋 啓 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館事業所内 Fターム(参考) 3F029 BA09 CA58 CA82    ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Kei Takahashi             Hitachi Chemical, 1500 Ogawa, Shimodate City, Ibaraki Prefecture             Shimodate Office of Industry Co., Ltd. F term (reference) 3F029 BA09 CA58 CA82

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】プリント基板製造工程において、基板を製
造、加工する装置から受取る場合で、基板を引き起こ
し、傾斜した受取り治具に積載する方式と、基板を水平
に設置された敷板に平積みし、受取る方式とのいずれか
に切り替え可能であることを特徴とする基板受取装置。
1. In a printed circuit board manufacturing process, when a board is received from an apparatus for manufacturing and processing, the board is raised and loaded on an inclined receiving jig, and the board is flatly stacked on a floor plate installed horizontally. , A substrate receiving device, which can be switched to any of a receiving system.
【請求項2】請求項1の記載において、基板下面から基
板を吸着保持する吸着パッドを有する回転アームを回転
可能に設け、基板を受取る際に前記アームの回転より斜
め積載または水平積載を行うことを特徴とする基板受取
装置。
2. The rotating arm having a suction pad for sucking and holding a substrate from the lower surface of the substrate is rotatably provided, and when the substrate is received, diagonal loading or horizontal loading is performed by rotation of the arm. A board receiving device.
JP2001226427A 2001-07-26 2001-07-26 Substrate receiving device Pending JP2003040449A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001226427A JP2003040449A (en) 2001-07-26 2001-07-26 Substrate receiving device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001226427A JP2003040449A (en) 2001-07-26 2001-07-26 Substrate receiving device

Publications (1)

Publication Number Publication Date
JP2003040449A true JP2003040449A (en) 2003-02-13

Family

ID=19059247

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001226427A Pending JP2003040449A (en) 2001-07-26 2001-07-26 Substrate receiving device

Country Status (1)

Country Link
JP (1) JP2003040449A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02138037A (en) * 1988-11-18 1990-05-28 Somar Corp Substrate conveying device
JPH04292330A (en) * 1991-03-19 1992-10-16 Murata Mfg Co Ltd Work stacking device
JPH05319572A (en) * 1992-05-15 1993-12-03 Nippon Steel Metal Prod Co Ltd Reverse piling device
JPH10167474A (en) * 1996-12-02 1998-06-23 Canon Inc Booklet loading device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02138037A (en) * 1988-11-18 1990-05-28 Somar Corp Substrate conveying device
JPH04292330A (en) * 1991-03-19 1992-10-16 Murata Mfg Co Ltd Work stacking device
JPH05319572A (en) * 1992-05-15 1993-12-03 Nippon Steel Metal Prod Co Ltd Reverse piling device
JPH10167474A (en) * 1996-12-02 1998-06-23 Canon Inc Booklet loading device

Similar Documents

Publication Publication Date Title
JP2009094242A (en) Substrate holding mechanism, substrate delivery mechanism, and substrate treating equipment
JP2000009661A (en) Flat panel inspection device
KR100822280B1 (en) Glass input system
EP1079429A1 (en) Alignment processing mechanism and semiconductor processing device using it
JP4282827B2 (en) Glass substrate transfer device
JP4032778B2 (en) Plate member conveying device
JP2003188597A (en) Backup plate lift device
JP2003040449A (en) Substrate receiving device
JP3563851B2 (en) Substrate transfer device
JP4272757B2 (en) Grinding equipment
JPH11123643A (en) Working device of plate material
JPH09221218A (en) Tilting-transferring device for panel
JPH10313196A (en) Substrate feeder
JP2003266266A (en) Semiconductor wafer carrying device
JP3892327B2 (en) Substrate processing equipment
JP3705699B2 (en) Thin plate holding and conveying method
KR102500323B1 (en) Tansfer Device for Display Panel using Vacuum Roller Unit
JPH07153816A (en) Substrate transferring method and equipment
KR100626555B1 (en) Device for Cutting of nonmetal
KR100676078B1 (en) Uprighting and feeding device and method for a substrate
JP2002019958A (en) Board handling facilities
JP3418824B2 (en) Transfer and holding device for flat workpieces
KR100688872B1 (en) Loading device and method of badness glass
JP2003100691A (en) Wet processing method and device thereof
JP4457480B2 (en) Electronic component mounting method

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080630

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100819

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100824

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20101221