JP2003039418A - Method for manufacturing ceramic electronic component - Google Patents

Method for manufacturing ceramic electronic component

Info

Publication number
JP2003039418A
JP2003039418A JP2001234543A JP2001234543A JP2003039418A JP 2003039418 A JP2003039418 A JP 2003039418A JP 2001234543 A JP2001234543 A JP 2001234543A JP 2001234543 A JP2001234543 A JP 2001234543A JP 2003039418 A JP2003039418 A JP 2003039418A
Authority
JP
Japan
Prior art keywords
blade
block
laminate
electronic component
ceramic electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001234543A
Other languages
Japanese (ja)
Inventor
Atsuo Nagai
淳夫 長井
Susumu Tanii
晋 谷井
Yoshiya Sakaguchi
佳也 坂口
Katsuyuki Miura
克之 三浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2001234543A priority Critical patent/JP2003039418A/en
Publication of JP2003039418A publication Critical patent/JP2003039418A/en
Pending legal-status Critical Current

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  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic electronic component having a high yield by suppressing a structural defect caused by a cutting step. SOLUTION: The method for manufacturing the ceramic electronic component comprises the steps of fixing a laminated block 11 obtained by alternatively laminating a ceramic sheet and a conductor layer, onto a pedestal 10, push cutting the block 22 by a cutter 12 made of a metal, then moving the cutter 12 in parallel, cutting plural times the block 11 while confirming a cutting position, thereby obtaining a laminate, cutting at this time while removing the block component adhered to the cutter 12, then baking the laminate and forming an external electrode.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は例えば積層セラミッ
クコンデンサ等のセラミック電子部品の製造方法に関す
るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic electronic component such as a monolithic ceramic capacitor.

【0002】[0002]

【従来の技術】積層セラミックコンデンサを例に従来の
セラミック電子部品の製造方法について説明する。
2. Description of the Related Art A conventional method for manufacturing a ceramic electronic component will be described by taking a multilayer ceramic capacitor as an example.

【0003】図3は従来の積層体の斜視図である。FIG. 3 is a perspective view of a conventional laminated body.

【0004】まず、誘電体層1となるセラミックシート
をチタン酸バリウムなどのセラミック粉末とアクリル樹
脂やポリビニルブチラール樹脂などのバインダ、ジブチ
ルフタレートなどの可塑材を用いて作製する。
First, a ceramic sheet to be the dielectric layer 1 is produced by using ceramic powder such as barium titanate, a binder such as acrylic resin or polyvinyl butyral resin, and a plastic material such as dibutyl phthalate.

【0005】次に、このセラミックシートの表面にNi
などの金属粉末とエチルセルロースやアクリル樹脂、ポ
リビニルブチラール樹脂などからなる導電体層2を複数
形成する。
Next, Ni is formed on the surface of the ceramic sheet.
A plurality of conductor layers 2 made of metal powder such as and ethyl cellulose, acrylic resin, polyvinyl butyral resin, etc. are formed.

【0006】次いで、このセラミックシートを導電体層
2どうしがセラミックシートを挟んで対向するように複
数枚重ね合わせ、積層体ブロックを作製する。
Next, a plurality of the ceramic sheets are stacked so that the conductor layers 2 face each other with the ceramic sheet sandwiched therebetween, to produce a laminated block.

【0007】その後、積層体ブロックを金属製の刃を用
いて、積層体のブロックの上面に垂直方向から複数回押
し切り、所望の形状の積層体にそれぞれ分離する。
After that, the laminate block is cut by using a metal blade in the vertical direction a plurality of times on the upper surface of the block of the laminate to separate the laminate into a desired shape.

【0008】次に、この積層体を焼成して焼結体を得
て、この焼結体の導電体層2が露出した両端面に外部電
極を形成する。
Next, the laminated body is fired to obtain a sintered body, and external electrodes are formed on both end surfaces of the sintered body where the conductor layer 2 is exposed.

【0009】[0009]

【発明が解決しようとする課題】この方法においては、
積層体ブロックを切断する際、積層体ブロック成分(セ
ラミック粉末、樹脂、金属粉末)が刃に付着する。積層
体ブロック成分が刃に付着したまま複数回切断を行う
と、刃の側面に堆積した付着物により、刃と積層体ブロ
ックとの摩擦が増大する。その結果、図3に示すように
積層体の切り口に構造欠陥3が生じるという問題点を有
していた。
SUMMARY OF THE INVENTION In this method,
When cutting the laminate block, the laminate block components (ceramic powder, resin, metal powder) adhere to the blade. When cutting is performed a plurality of times while the laminated body block component is attached to the blade, the friction between the blade and the laminated body block increases due to the adhered matter accumulated on the side surface of the blade. As a result, as shown in FIG. 3, there is a problem that structural defects 3 occur at the cut end of the laminate.

【0010】特に、セラミックシートおよび導電体層2
の積層数を多くし、高容量化を図ろうとすると、上記切
断方法によって引き起こされる積層体の構造欠陥による
歩留まりの低下が深刻な問題となる。
In particular, the ceramic sheet and the conductor layer 2
If an attempt is made to increase the number of stacked layers and increase the capacity, the decrease in yield due to the structural defect of the stacked body caused by the cutting method becomes a serious problem.

【0011】そこで本発明は、切断工程に起因する構造
欠陥の発生を抑制し、歩留まりの高いセラミック電子部
品の製造方法を提供することを目的とするものである。
Therefore, it is an object of the present invention to provide a method for manufacturing a ceramic electronic component having a high yield by suppressing the occurrence of structural defects caused by the cutting process.

【0012】[0012]

【課題を解決するための手段】上記目的を達成するため
に本発明は以下の方法とするものである。
To achieve the above object, the present invention provides the following method.

【0013】本発明の請求項1に記載の発明は、特に、
積層体ブロックを切断することにより刃に付着した積層
体ブロック成分を除去後、再び積層体ブロックを切断す
るものであり、刃と積層体ブロックとの摩擦を減少さ
せ、積層体の切り口の損傷、つまり構造欠陥の発生を抑
制し、歩留まりを向上させることができる。
The invention according to claim 1 of the present invention is
After removing the laminated block component attached to the blade by cutting the laminated block, it is to cut the laminated block again, reduce the friction between the blade and the laminated block, damage to the cut end of the laminated body, That is, it is possible to suppress the occurrence of structural defects and improve the yield.

【0014】本発明の請求項2に記載の発明は、特に、
刃に付着した積層体ブロック成分の除去を積層体ブロッ
ク中の有機物を溶解する物質に接触させることにより行
うものであり、容易に付着物を除去することができる。
The invention according to claim 2 of the present invention is
The removal of the laminate block component adhering to the blade is carried out by bringing it into contact with a substance that dissolves the organic matter in the laminate block, and the deposit can be easily removed.

【0015】本発明の請求項3に記載の発明は、特に、
刃の付着物を積層体ブロック中の有機物を溶解する物質
で除去し、刃の表面の液体成分を除去した後、再度積層
体ブロックを切断するものであり、再度積層体ブロック
を切断する際、刃の表面の液体により積層体ブロックが
溶解するのを防止することができる。
The invention according to claim 3 of the present invention is
The blade deposit is removed with a substance that dissolves organic matter in the laminate block, and after removing the liquid component on the surface of the blade, the laminate block is cut again, and when the laminate block is cut again, It is possible to prevent the laminate block from being dissolved by the liquid on the surface of the blade.

【0016】本発明の請求項4に記載の発明は、特に、
刃に付着した積層体ブロック成分の除去を積層体ブロッ
ク中の有機物を溶解する液体を含浸させた弾性多孔質体
内を通過させることにより行うものであり、刃の動きを
停止すること無く付着物を除去できるので、生産性を確
保することができる。
The invention according to claim 4 of the present invention is
The removal of the laminated block component adhering to the blade is carried out by passing it through the elastic porous body impregnated with the liquid that dissolves the organic matter in the laminated block, and the adhering matter can be removed without stopping the movement of the blade. Since it can be removed, productivity can be secured.

【0017】本発明の請求項5に記載の発明は、特に、
刃の表面に平均10μm以下の凹凸を有するものであ
り、刃と積層体ブロックとの摩擦が小さくなり、刃に積
層体ブロック成分が付着するのを防止し、積層体の切り
口の損傷、つまり構造欠陥の発生を抑制することができ
る。
The invention according to claim 5 of the present invention is
Since the blade surface has irregularities of 10 μm or less on average, the friction between the blade and the laminate block is reduced, adhesion of the laminate block component to the blade is prevented, and damage to the cut end of the laminate, that is, structure Occurrence of defects can be suppressed.

【0018】本発明の請求項6に記載の発明は、特に、
刃の表面を研磨材を含んだ樹脂で被覆したものであり、
刃の摩耗を抑制するとともに、刃と積層体ブロックとの
摩擦を小さくすることができ、積層体の切り口の損傷、
つまり構造欠陥の発生を抑制することができる。
The invention according to claim 6 of the present invention is
The blade surface is coated with a resin containing an abrasive,
While suppressing blade wear, it is possible to reduce the friction between the blade and the laminate block, damage to the cut end of the laminate,
That is, the occurrence of structural defects can be suppressed.

【0019】[0019]

【発明の実施の形態】以下、一実施の形態を用いて、本
発明の特に請求項1〜請求項6について積層セラミック
コンデンサを例に図面を参照しながら説明する。
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, with reference to the drawings, a first embodiment to a sixth embodiment of the present invention will be described with reference to the drawings, taking a laminated ceramic capacitor as an example.

【0020】図1は一実施の形態における積層セラミッ
クコンデンサの切断工程を示す斜視図であり、上面が水
平な台座10の上に積層体ブロック11を固定し、刃1
2で積層体ブロック11を切断し、有機溶剤を含浸させ
た多孔質弾性体13で刃12に付着した積層体ブロック
成分を除去する。図中矢印は、刃12の進行方向を示
す。
FIG. 1 is a perspective view showing a cutting process of a monolithic ceramic capacitor according to an embodiment, in which a laminated body block 11 is fixed on a pedestal 10 having a horizontal upper surface and a blade 1 is provided.
The laminate block 11 is cut at 2, and the laminate block component attached to the blade 12 is removed by the porous elastic body 13 impregnated with the organic solvent. The arrow in the figure indicates the traveling direction of the blade 12.

【0021】また図2は一実施の形態における積層セラ
ミックコンデンサの一部切欠斜視図であり、誘電体層2
1と導電体層22とを交互に積層した積層体の導電体層
22が露出した両端面に外部電極23を形成したもので
ある。
FIG. 2 is a partially cutaway perspective view of the monolithic ceramic capacitor according to the embodiment.
The external electrodes 23 are formed on both end surfaces of the conductor layer 22 of the laminated body in which 1 and the conductor layer 22 are alternately laminated.

【0022】まず、誘電体層21となるセラミックシー
トをチタン酸バリウムを主成分とするセラミック粉末
と、アクリル樹脂やポリビニルブチラール樹脂などのバ
インダ、ジブチルフタレートなどの可塑材、酢酸ブチル
などの溶剤を用いてドクターブレード法により作製す
る。セラミックシートの厚みは8〜10μm程度であ
る。
First, a ceramic sheet to be the dielectric layer 21 is formed by using ceramic powder containing barium titanate as a main component, a binder such as acrylic resin or polyvinyl butyral resin, a plastic material such as dibutyl phthalate, and a solvent such as butyl acetate. Manufactured by the doctor blade method. The thickness of the ceramic sheet is about 8 to 10 μm.

【0023】次にこのセラミックシートを縦5cm、横
5cmに裁断し、表面にNi粉末を主成分とし、エチル
セルロースやアクリル樹脂、ポリビニルブチラール樹
脂、酢酸ブチルなどからなる金属ペーストをスクリーン
印刷し、導電体層22を複数形成する。導電体層22は
縦2mm、横3mm、厚み2〜2.5μmの直方体形状
であり、セラミックシート上において約100個の縦横
に整列している。
Next, this ceramic sheet was cut into a length of 5 cm and a width of 5 cm, and a metal paste containing Ni powder as a main component and containing ethyl cellulose, acrylic resin, polyvinyl butyral resin, butyl acetate, etc. was screen-printed on the surface to obtain a conductor. A plurality of layers 22 are formed. The conductor layer 22 has a rectangular parallelepiped shape having a length of 2 mm, a width of 3 mm, and a thickness of 2 to 2.5 μm, and is arranged on the ceramic sheet in about 100 rows and columns.

【0024】次いでセラミックシートを導電体層22ど
うしがセラミックシートを挟んで対向するように150
枚重ね合わせ、セラミックシートおよび導電体層22に
含まれる有機物が軟化を始める温度に加熱しながら、5
MPa〜20MPaで加圧し、セラミックシートどうし
およびセラミックシートと導電体層22を一体化させ、
積層体ブロック11を作製する。
Next, the ceramic sheet is placed 150 so that the conductor layers 22 face each other with the ceramic sheet sandwiched therebetween.
While stacking the sheets and heating to a temperature at which the organic substances contained in the ceramic sheet and the conductor layer 22 start to soften, 5
Pressure is applied at MPa to 20 MPa to integrate the ceramic sheets and the ceramic sheet with the conductor layer 22,
The laminated body block 11 is produced.

【0025】この積層体ブロック11は切断することに
より約100個の積層体を得ることができるものであ
る。
The laminated body block 11 can be cut to obtain about 100 laminated bodies.

【0026】その後この積層体ブロック11を図1に示
すように台座10に固定し、金属製の刃12で台座10
に対し垂直方向即ち、積層体ブロック11の真上から押
し切る。
Thereafter, the laminated block 11 is fixed to the base 10 as shown in FIG. 1, and the base 10 is fixed with a metal blade 12.
With respect to the vertical direction, that is, the laminate block 11 is completely pressed.

【0027】次に刃12を平行移動させて、切断位置を
確認しながら複数回、積層体ブロック11の切断を行
う。
Next, the blade 12 is moved in parallel, and the laminate block 11 is cut a plurality of times while confirming the cutting position.

【0028】次いで積層体ブロック11を刃12に対し
て90度回転させて、同様に複数回切断を行い、縦2.
5mm、横3.5mmの積層体を作製する。
Next, the laminated body block 11 is rotated 90 degrees with respect to the blade 12 and similarly cut a plurality of times to make a vertical 2.
A laminated body having a size of 5 mm and a width of 3.5 mm is produced.

【0029】この切断工程について詳しく説明する。The cutting step will be described in detail.

【0030】刃12は最大厚さ150μm程度の積層体
ブロック11に対して十分硬い超硬質の金属やセラミッ
クで作製されたものであり、積層体ブロック11の幅よ
りも長い。また刃先のなす角度は10度〜20度とし、
積層体ブロック11を切断する際、刃先の厚みにより積
層体が変形したりしないようにする。
The blade 12 is made of an ultra-hard metal or ceramic that is sufficiently hard for the laminate block 11 having a maximum thickness of about 150 μm, and is longer than the width of the laminate block 11. The angle formed by the cutting edge is 10 to 20 degrees,
When cutting the laminated body block 11, the laminated body is prevented from being deformed due to the thickness of the blade edge.

【0031】さらに切断を複数回繰り返すうちに、例え
ばセラミック粉末や樹脂といった積層体ブロック成分が
刃12に付着、堆積する。この付着物が刃12と積層体
ブロック11との間の摩擦を増大させ、積層体ブロック
11の切り口に損傷を与え、図3に示すような構造欠陥
3を誘発してしまう。
Further, as the cutting is repeated a plurality of times, a laminated body block component such as ceramic powder or resin adheres and deposits on the blade 12. This attached matter increases the friction between the blade 12 and the laminated body block 11, damages the cut end of the laminated body block 11, and induces the structural defect 3 as shown in FIG.

【0032】従って、図1に示すように例えば酢酸ブチ
ルやイソプロピルアルコールなど積層体ブロック11内
に含まれる有機物を溶解する有機溶剤を含浸させた多孔
質弾性体13を積層体ブロック11の近傍に配置し、刃
12が積層体ブロック11を切断した後、多孔質弾性体
13の内部を通過させる。そして切断の途中で刃12の
表面に付着した積層体ブロック成分を多孔質弾性体13
に含まれた有機溶剤で溶解し、多孔質弾性体13で拭き
取るという洗浄工程を経ながら、切断を行うことで刃1
2と積層体ブロック11との摩擦による構造欠陥の発生
を抑制することができる。
Therefore, as shown in FIG. 1, a porous elastic body 13 impregnated with an organic solvent such as butyl acetate or isopropyl alcohol that dissolves organic substances contained in the laminated body block 11 is arranged near the laminated body block 11. Then, after the blade 12 cuts the laminated body block 11, the blade is passed through the inside of the porous elastic body 13. Then, the laminate block component attached to the surface of the blade 12 during the cutting is removed by the porous elastic body 13
The blade 1 can be cut by performing a cleaning process in which it is dissolved with the organic solvent contained in and is wiped off with the porous elastic body 13.
It is possible to suppress the occurrence of structural defects due to friction between 2 and the laminated body block 11.

【0033】しかしながら、有機溶剤が多量に刃12に
付着したまま、積層体ブロック11を切断すると、逆に
積層体ブロック成分を付着する。従って有機溶剤は比較
的揮発性に優れたものを用いるか、あるいは刃12の付
着物を除去した後、刃12の表面の液体を除去すること
が望ましい。
However, when the laminate block 11 is cut while a large amount of the organic solvent is attached to the blade 12, the laminate block component is attached on the contrary. Therefore, it is desirable to use an organic solvent having a relatively high volatility, or to remove the deposit on the blade 12 and then remove the liquid on the surface of the blade 12.

【0034】また刃12の積層体ブロック11に対する
摩擦は刃12の表面粗さによっても大きく影響される。
表面粗さが10μmよりも大きい場合、刃12と積層体
ブロック11との摩擦が大きく、積層体の切り口を損傷
する恐れが有る。また刃12の表面が鏡面の場合、積層
体ブロック11との接触面積が大きくなり、やはり摩擦
が大きくなる。従って、刃12の表面は平均10μm以
下の凹凸を有することが望ましい。
The friction of the blade 12 with respect to the laminated block 11 is also greatly affected by the surface roughness of the blade 12.
When the surface roughness is larger than 10 μm, friction between the blade 12 and the laminated body block 11 is large, which may damage the cut end of the laminated body. Further, when the surface of the blade 12 is a mirror surface, the contact area with the laminated body block 11 becomes large, and the friction also becomes large. Therefore, it is desirable that the surface of the blade 12 has unevenness of 10 μm or less on average.

【0035】さらに刃12はこのような切断工程で摩耗
する。摩耗が大きいと、積層体ブロック11の切断を適
切に行うことができないので何度も刃12を取り替える
必要が生じ、生産性が悪くなる。そこで、刃12の表面
をダイヤモンド粉末など硬質粉末を含んだ樹脂で被覆し
たものを用いることが望ましい。この場合も、刃12の
表面に平均10μm以下の凹凸を有するように、硬質粉
末は粒径が10μm以下のものを用いることが望まし
い。また樹脂は積層体ブロック11中に含まれる有機物
と接着しにくいシリコン系あるいはテフロン(登録商
標)系の樹脂を用いることが望ましい。
Further, the blade 12 is worn by such a cutting process. If the wear is great, the laminate block 11 cannot be cut appropriately, so that the blade 12 needs to be replaced many times, resulting in poor productivity. Therefore, it is desirable to use a blade 12 whose surface is coated with a resin containing a hard powder such as diamond powder. Also in this case, it is preferable to use hard powder having a particle size of 10 μm or less so that the surface of the blade 12 has irregularities of 10 μm or less on average. Further, as the resin, it is desirable to use a silicon-based or Teflon (registered trademark) -based resin that is unlikely to adhere to the organic matter contained in the laminate block 11.

【0036】以上のようなことに配慮しながら、積層体
ブロック11を個々の積層体に切断後、分離する。
Taking the above into consideration, the laminate block 11 is cut into individual laminates and then separated.

【0037】続いて、個々の積層体の有機物を窒素ガス
中で除去した後に、導電体層22となるニッケルが過度
に酸化されない窒素水素の混合ガス雰囲気中で1300
℃まで加熱処理して焼成し、焼結体を得る。
Subsequently, after removing the organic substances of the individual laminated bodies in nitrogen gas, 1300 in a nitrogen-hydrogen mixed gas atmosphere in which nickel serving as the conductor layer 22 is not excessively oxidized.
A heat treatment is performed up to ° C and firing is performed to obtain a sintered body.

【0038】次に、焼結体の面取りを行い、焼結体の両
端面に導電体層22を完全に露出させる。続いて焼結体
の両端面及び側面に銅を主成分とする電極ペーストを塗
布した後、800℃の窒素雰囲気中で焼付けを行って外
部電極23を形成し、この上にニッケル、半田のメッキ
を施し、図2に示すような積層セラミックコンデンサを
作製する。
Next, the sintered body is chamfered to completely expose the conductor layer 22 on both end surfaces of the sintered body. Then, after applying an electrode paste containing copper as a main component to both end faces and side faces of the sintered body, baking is performed in a nitrogen atmosphere at 800 ° C. to form an external electrode 23, and nickel and solder are plated on this. Then, a monolithic ceramic capacitor as shown in FIG. 2 is manufactured.

【0039】本発明の効果をより明確に示すために、積
層体ブロック11を個々の積層体に切断するまで刃12
に付着した積層体ブロック成分の除去を行わなかったも
の(試料1)、積層体ブロック11を一回切断する毎に
刃12を酢酸ブチルを含浸させた多孔質弾性体13中を
通過させて、表面に付着した積層体ブロック成分を除去
したもの(試料2〜4)において、それぞれ積層体10
0個の切り口に構造欠陥が発生した積層体の発生数を
(表1)に示す。
To more clearly show the effect of the present invention, the blade 12 is used until the laminate block 11 is cut into individual laminates.
No removal of the laminated block component adhered to (Sample 1), and each time the laminated block 11 was cut once, the blade 12 was passed through the porous elastic body 13 impregnated with butyl acetate, Each of the laminates 10 (Samples 2 to 4) from which the laminate block component attached to the surface was removed was used.
The number of occurrences of laminated bodies in which structural defects occurred at 0 cuts is shown in (Table 1).

【0040】[0040]

【表1】 [Table 1]

【0041】この(表1)を見ると分かるように、積層
体ブロック11の切断工程において、刃12に付着した
積層体ブロック成分を除去することにより、構造欠陥の
発生を抑制し、歩留まりを向上させることができる。
As can be seen from this (Table 1), in the step of cutting the laminated body block 11, by removing the laminated body block component adhering to the blade 12, the occurrence of structural defects is suppressed and the yield is improved. Can be made.

【0042】さらに、刃12の表面の凹凸を10μm以
下とするか(試料3)、あるいは刃12の表面をダイヤ
モンド粉末を分散させた樹脂で被覆する(試料4)こと
によりさらに構造欠陥の発生を抑制することができる。
Further, the unevenness of the surface of the blade 12 is set to 10 μm or less (Sample 3), or the surface of the blade 12 is coated with a resin in which diamond powder is dispersed (Sample 4) to further generate structural defects. Can be suppressed.

【0043】なお、上記一実施の形態においては、積層
体ブロック11を一回切断する毎に、刃12の表面を洗
浄していたが、刃12に付着する積層体ブロック成分が
ある水準以下の場合、毎回洗浄を行う必要はない。洗浄
回数が多くなると切断スピードが遅くなる。従って積層
体ブロック成分が刃12に付着する程度に合せて、洗浄
回数を決定することが望ましい。
In the above-described embodiment, the surface of the blade 12 is cleaned every time the laminate block 11 is cut, but the laminate block component adhering to the blade 12 is below a certain level. In this case, it is not necessary to wash each time. The cutting speed becomes slower as the number of washings increases. Therefore, it is desirable to determine the number of times of cleaning in accordance with the degree to which the laminate block component adheres to the blade 12.

【0044】また多孔質弾性体13としては、刃12を
損傷しない程度の硬度を有し、スポンジ質や繊維質のも
のなど有機溶剤で溶解させた積層体ブロック成分を拭き
取ることができるものが望ましい。
Further, the porous elastic body 13 is preferably one having a hardness that does not damage the blade 12 and capable of wiping off a laminate block component dissolved in an organic solvent such as sponge or fibrous material. .

【0045】さらに、刃12の洗浄に用いる液体は、積
層体ブロック11内に含まれる有機物を溶解するもので
あれば良いが、積層体ブロック11に悪影響を及ぼさな
いように、セラミックシートあるいは金属ペースト中に
含まれる溶剤が好ましい。
Further, the liquid used for cleaning the blade 12 may be any liquid as long as it dissolves the organic substances contained in the laminate block 11, but the ceramic sheet or the metal paste is used so as not to adversely affect the laminate block 11. The solvent contained therein is preferred.

【0046】上記本実施の形態においては、積層体ブロ
ック11の近傍に溶剤を含浸させた多孔質弾性体13を
配置し、刃12をこの内部を通過させることにより、刃
12に付着した積層体ブロック成分を除去した。この方
法に変えて、刃12を両側から溶剤を含浸させた多孔質
弾性体13を挟んだ状態で一方の端部から他方の端部に
移動させることにより、刃12の付着物を拭き取る方法
を用いても構わない。
In the present embodiment, the solvent-impregnated porous elastic body 13 is arranged in the vicinity of the laminate block 11, and the blade 12 is passed through the inside of the laminate to adhere the laminate 12 to the blade 12. The block component was removed. In place of this method, the blade 12 is moved from one end to the other end while sandwiching the solvent-impregnated porous elastic body 13 from both sides to wipe off the deposits on the blade 12. You can use it.

【0047】さらに上記一実施の形態においては積層セ
ラミックコンデンサについて説明したが、積層バリス
タ、積層サーミスタ、積層コイル、セラミック多層基板
などのセラミックシートおよびセラミックシートを積層
して形成するセラミック電子部品においては同様の効果
が得られる。
Further, although the monolithic ceramic capacitor has been described in the above-mentioned one embodiment, the same applies to a ceramic sheet such as a laminated varistor, a laminated thermistor, a laminated coil, a ceramic multilayer substrate and a ceramic electronic component formed by laminating ceramic sheets. The effect of is obtained.

【0048】[0048]

【発明の効果】以上のように本発明によると、積層体ブ
ロックの切断工程において少なくとも積層体ブロック成
分が刃に付着した場合は、この付着物を除去してから切
断を行うことにより刃と積層体ブロックとの摩擦を小さ
くし、積層体の構造欠陥の発生を抑制し、歩留まりを向
上させることができる。
As described above, according to the present invention, when at least the laminate block component adheres to the blade in the step of cutting the laminate block, the adhered matter is removed and then the blade is laminated by cutting. The friction with the body block can be reduced, the occurrence of structural defects in the laminate can be suppressed, and the yield can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施の形態における積層体ブロック
の切断工程を説明するための斜視図
FIG. 1 is a perspective view for explaining a cutting process of a laminate block according to an embodiment of the present invention.

【図2】本発明の一実施の形態における積層セラミック
コンデンサの一部切欠斜視図
FIG. 2 is a partially cutaway perspective view of a monolithic ceramic capacitor according to an embodiment of the present invention.

【図3】従来の積層体の斜視図FIG. 3 is a perspective view of a conventional laminated body.

【符号の説明】[Explanation of symbols]

10 台座 11 積層体ブロック 12 刃 13 多孔質弾性体 21 誘電体層 22 導電体層 23 外部電極 10 pedestals 11 Laminated block 12 blades 13 Porous elastic body 21 Dielectric layer 22 Conductor layer 23 External electrode

───────────────────────────────────────────────────── フロントページの続き (72)発明者 坂口 佳也 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 三浦 克之 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Fターム(参考) 4G055 AA08 AC09 BB12 5E082 AA01 AB03 EE04 EE35 FF05   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Yoshiya Sakaguchi             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Katsuyuki Miura             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F-term (reference) 4G055 AA08 AC09 BB12                 5E082 AA01 AB03 EE04 EE35 FF05

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 有機物を含有するセラミックシートと導
電体層が積層された積層体ブロックを準備する第1の工
程と、前記積層体ブロックを台座に固定する第2の工程
と、前記積層体ブロックを刃で複数回切断する第3の工
程と、その後前記積層体ブロックを個々の積層体に分離
して焼成する第4の工程とを備え、前記第3の工程にお
いて刃に付着した積層体ブロック成分を除去するセラミ
ック電子部品の製造方法。
1. A first step of preparing a laminate block in which a ceramic sheet containing an organic substance and a conductor layer are laminated, a second step of fixing the laminate block to a pedestal, and the laminate block. A laminate block attached to the blade in the third step, and a third step of cutting the laminate with a blade a plurality of times, and then a fourth step of separating the laminate block into individual laminates and firing. A method for manufacturing a ceramic electronic component for removing components.
【請求項2】 刃に付着した積層体ブロック成分の除去
は、積層体ブロック中の有機物を溶解する物質に接触さ
せることにより行う請求項1に記載のセラミック電子部
品の製造方法。
2. The method for producing a ceramic electronic component according to claim 1, wherein the removal of the laminated body block component attached to the blade is carried out by bringing it into contact with a substance that dissolves an organic substance in the laminated body block.
【請求項3】 刃に付着した積層体ブロック成分を除去
した後、前記刃の表面の液体成分を除去する請求項2に
記載のセラミック電子部品の製造方法。
3. The method of manufacturing a ceramic electronic component according to claim 2, wherein after removing the laminated body block component attached to the blade, the liquid component on the surface of the blade is removed.
【請求項4】 刃に付着した積層体ブロック成分の除去
は、積層体ブロック中の有機物を溶解する液体を含浸さ
せた多孔質弾性体内を通過させることにより行う請求項
1に記載のセラミック電子部品の製造方法。
4. The ceramic electronic component according to claim 1, wherein the component of the laminate block adhered to the blade is removed by passing it through a porous elastic body impregnated with a liquid that dissolves an organic substance in the laminate block. Manufacturing method.
【請求項5】 刃の表面は平均10μm以下の凹凸を有
する請求項1に記載のセラミック電子部品の製造方法。
5. The method of manufacturing a ceramic electronic component according to claim 1, wherein the surface of the blade has irregularities with an average of 10 μm or less.
【請求項6】 刃の表面は研磨材を含んだ樹脂で被覆さ
れたものである請求項1に記載のセラミック電子部品の
製造方法。
6. The method for manufacturing a ceramic electronic component according to claim 1, wherein the surface of the blade is coated with a resin containing an abrasive.
JP2001234543A 2001-08-02 2001-08-02 Method for manufacturing ceramic electronic component Pending JP2003039418A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001234543A JP2003039418A (en) 2001-08-02 2001-08-02 Method for manufacturing ceramic electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001234543A JP2003039418A (en) 2001-08-02 2001-08-02 Method for manufacturing ceramic electronic component

Publications (1)

Publication Number Publication Date
JP2003039418A true JP2003039418A (en) 2003-02-13

Family

ID=19066138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001234543A Pending JP2003039418A (en) 2001-08-02 2001-08-02 Method for manufacturing ceramic electronic component

Country Status (1)

Country Link
JP (1) JP2003039418A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008168609A (en) * 2006-04-11 2008-07-24 Ibiden Co Ltd Molding cutting device, cutting method of ceramic molding, and manufacturing process of honeycomb structure
JP2008265003A (en) * 2007-04-16 2008-11-06 Yodogawa Ncc Co Ltd Cutting device for ceramic green sheet laminated body
JP2015109413A (en) * 2013-10-25 2015-06-11 株式会社村田製作所 Method for manufacturing electronic component
JP7374746B2 (en) 2019-12-13 2023-11-07 太陽誘電株式会社 Method for manufacturing laminated ceramic electronic components and apparatus for manufacturing laminated ceramic electronic components

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008168609A (en) * 2006-04-11 2008-07-24 Ibiden Co Ltd Molding cutting device, cutting method of ceramic molding, and manufacturing process of honeycomb structure
JP2008265003A (en) * 2007-04-16 2008-11-06 Yodogawa Ncc Co Ltd Cutting device for ceramic green sheet laminated body
JP2015109413A (en) * 2013-10-25 2015-06-11 株式会社村田製作所 Method for manufacturing electronic component
US9576736B2 (en) 2013-10-25 2017-02-21 Murata Manufacturing Co., Ltd. Method of manufacturing electronic component
JP7374746B2 (en) 2019-12-13 2023-11-07 太陽誘電株式会社 Method for manufacturing laminated ceramic electronic components and apparatus for manufacturing laminated ceramic electronic components

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