JP2003031991A - Method and device for detecting circuit board for circuit board working machine - Google Patents

Method and device for detecting circuit board for circuit board working machine

Info

Publication number
JP2003031991A
JP2003031991A JP2001219982A JP2001219982A JP2003031991A JP 2003031991 A JP2003031991 A JP 2003031991A JP 2001219982 A JP2001219982 A JP 2001219982A JP 2001219982 A JP2001219982 A JP 2001219982A JP 2003031991 A JP2003031991 A JP 2003031991A
Authority
JP
Japan
Prior art keywords
circuit board
detection
board
detection sensor
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001219982A
Other languages
Japanese (ja)
Other versions
JP4601872B2 (en
Inventor
Tomoyuki Nakano
智之 中野
Koji Kodera
幸治 小寺
Takeshi Kuribayashi
毅 栗林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2001219982A priority Critical patent/JP4601872B2/en
Publication of JP2003031991A publication Critical patent/JP2003031991A/en
Application granted granted Critical
Publication of JP4601872B2 publication Critical patent/JP4601872B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide the circuit board detecting method/device of a circuit board working machine which can securely detect and stop multiple types of circuit boards, and to improve transport reliability and productivity, in the circuit board working machine. SOLUTION: When the circuit board 25 is detected and stopped in the respective stop positions of the circuit board 25 in a transfer path 44 of the circuit board working machine, a first board detection sensor 51 and a second board detection sensor 53 which differ in detection characteristics are arranged. At least the board detection sensor 51 or 53 is switched and used, based on information on the circuit board 25 which stops either sensor.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、回路基板加工機内
の搬送路で回路基板を所定位置まで搬送して停止させる
際に、搬送路上を搬送されてきた回路基板を検出して所
定の加工位置で停止させる回路基板検出方法及び回路基
板検出装置に関し、特に正確な回路基板の検出を行う技
術に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention detects a circuit board that has been transported on a transport path when transporting the circuit board to a predetermined position on a transport path in a circuit board processing machine and then stops the circuit board. TECHNICAL FIELD The present invention relates to a circuit board detection method and a circuit board detection device that are stopped at, and particularly to a technique for accurately detecting a circuit board.

【0002】[0002]

【従来の技術】電子部品の実装される回路基板を製造す
るための回路基板加工機には種々の装置があるが、いず
れも回路基板を搬送する搬送路を備えており、所定の加
工位置で回路基板を停止させて加工を行っている。例え
ば、電子部品を回路基板に自動的に実装する電子部品実
装機は、図6に示すように回路基板1を設備内に搬入す
るローダ部3と、電子部品を供給する図示しない部品供
給部と、この部品供給部から電子部品を吸着して回路基
板1の所定位置に装着するXYロボットのテーブル部7
と、実装が終了した回路基板1を設備外に搬出するアン
ローダ部5とを備えている。
2. Description of the Related Art There are various types of circuit board processing machines for manufacturing circuit boards on which electronic components are mounted. However, all of them are equipped with a transfer path for transferring the circuit board, and at a predetermined processing position. Processing is performed by stopping the circuit board. For example, an electronic component mounter that automatically mounts electronic components on a circuit board includes a loader unit 3 for loading the circuit board 1 into the facility as shown in FIG. 6, and a component supply unit (not shown) for supplying electronic components. , A table portion 7 of an XY robot that picks up electronic components from the component supply portion and mounts them on a predetermined position of the circuit board 1.
And an unloader section 5 that carries out the circuit board 1 that has been mounted to the outside of the facility.

【0003】このように、回路基板の搬送路は、ローダ
部3と、テーブル部7と、アンローダ部5とからなる。
ローダ部3は、電子部品の実装中に、未実装の回路基板
1を待機させる。テーブル部7は、回路基板1に対して
電子部品を実装する生産工程を行う。アンローダ部5
は、生産工程完了後の回路基板1を搬入して次工程に搬
送するまで待機させる。なお、これら各ローダ部3、テ
ーブル部7、アンローダ部5は、図示はしないが、回路
基板1を搬送するための搬送ベルトと、この搬送ベルト
9を駆動する駆動源を備えている。
As described above, the transfer path of the circuit board is composed of the loader section 3, the table section 7, and the unloader section 5.
The loader unit 3 puts the unmounted circuit board 1 on standby while mounting the electronic component. The table section 7 performs a production process of mounting electronic components on the circuit board 1. Unloader section 5
Waits until the circuit board 1 after the completion of the production process is loaded and conveyed to the next process. Although not shown, each of the loader unit 3, the table unit 7, and the unloader unit 5 includes a conveyor belt for conveying the circuit board 1 and a drive source for driving the conveyor belt 9.

【0004】このような搬送路における回路基板の搬送
動作は、次のようにして行われる。即ち、前工程から搬
送されてくる回路基板1は、ローダ部3の搬送ベルトに
よりこの搬送路へ搬入する。ローダ部3は、テーブル部
7に回路基板1が存在した状態で基板検出センサ13a
が回路基板1を検出すると、搬送ベルト9を停止して待
機状態となる。一方、ローダ部3は、テーブル部7に回
路基板1が存在していないと、回路基板1をテーブル部
7に搬入する。テーブル部7は、回路基板1を基板検出
センサ13bが検出すると、搬送ベルト9を停止して回
路基板1を所定の加工位置に停止させる。この加工位置
で電子部品の実装を終了した回路基板1は、アンローダ
部5に搬出される。アンローダ部5は、回路基板1を基
板検出センサ13cが検出すると、搬送ベルトを停止し
て待機状態となる。
The transporting operation of the circuit board on such a transporting path is performed as follows. That is, the circuit board 1 conveyed from the previous step is carried into this conveyance path by the conveyance belt of the loader unit 3. The loader unit 3 detects the board detection sensor 13a while the circuit board 1 is present on the table unit 7.
When the circuit board 1 is detected, the conveyor belt 9 is stopped to enter the standby state. On the other hand, if the circuit board 1 does not exist in the table section 7, the loader section 3 carries the circuit board 1 into the table section 7. When the board detection sensor 13b detects the circuit board 1, the table portion 7 stops the conveyor belt 9 to stop the circuit board 1 at a predetermined processing position. The circuit board 1 on which the electronic components have been mounted at this processing position is unloaded to the unloader unit 5. When the board detection sensor 13c detects the circuit board 1, the unloader unit 5 stops the conveyor belt and enters a standby state.

【0005】このように、ローダ部3、テーブル部7、
アンローダ部5では、搬入されてくる回路基板1を基板
検出センサ13a,13b,13cによって検出し、搬
送ベルトの搬送動作を停止させていた。従来、この基板
検出センサ13a,13b,13cには、発光素子から
出射した収束光を回路基板1に照射し、その戻り光を受
光することにより回路基板1を検出する所謂限定反射方
式の基板検出センサ13a,13b,13cが用いられ
ていた。
In this way, the loader unit 3, the table unit 7,
In the unloader section 5, the circuit board 1 that has been carried in is detected by the board detection sensors 13a, 13b, 13c, and the carrying operation of the carrying belt is stopped. Conventionally, the substrate detection sensors 13a, 13b, 13c detect the circuit substrate 1 by irradiating the circuit substrate 1 with the converged light emitted from the light emitting element and receiving the return light thereof, so-called limited reflection type substrate detection. The sensors 13a, 13b, 13c were used.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、上記従
来の電子部品実装機の回路基板検出方法においては、限
定反射方式の基板検出センサのみを用いて搬送路の各停
止位置における回路基板を検出していたため、近年の回
路基板の多品種化に伴って、その検出が困難となる傾向
にある。例えばミシン目や切欠を有する複数枚取り基板
の場合や、種々の電子部品が実装済みとなった回路基板
の場合では、これらミシン目、切欠、電子部品等を回路
基板端部として誤検出する虞があった。このような誤検
出が発生すれば、搬送路における回路基板の円滑な搬送
が行えなくなり、電子部品実装機の生産性を低下させる
ことになった。
However, in the above-mentioned conventional circuit board detection method for electronic component mounting machines, only the limited reflection type board detection sensor is used to detect the circuit board at each stop position of the conveyance path. Therefore, with the recent increase in the number of types of circuit boards, it tends to be difficult to detect them. For example, in the case of a multi-piece board having perforations or notches, or in the case of a circuit board on which various electronic components have been mounted, these perforations, notches, electronic components, etc. may be erroneously detected as the circuit board end. was there. If such an erroneous detection occurs, it becomes impossible to smoothly carry the circuit board on the carrying path, which lowers the productivity of the electronic component mounter.

【0007】本発明は上記状況に鑑みてなされたもの
で、多種類の回路基板を確実に検出して停止させること
のできる回路基板加工機の回路基板検出方法及び回路基
板検出装置を提供し、回路基板加工機における搬送信頼
性の向上、生産性の向上を図ることを目的とする。
The present invention has been made in view of the above circumstances, and provides a circuit board detection method and a circuit board detection device for a circuit board processing machine capable of surely detecting and stopping various types of circuit boards. The purpose of the present invention is to improve the transportation reliability and productivity of the circuit board processing machine.

【0008】[0008]

【課題を解決するための手段】上記目的を達成するため
の本発明に係る請求項1記載の電子部品実装機の回路基
板検出方法は、回路基板加工機内の搬送路で回路基板を
所定位置まで搬送して停止させる際に、前記回路基板の
搬送中に該回路基板を検出して前記所定位置で停止させ
るための回路基板加工機の回路基板検出方法であって、
回路基板に拡散光を照射すると共に該回路基板からの反
射光を検出する第1の基板検出センサと、回路基板に収
束光を照射すると共に該回路基板からの反射光を検出す
る第2の基板検出センサとを前記搬送路に配設して、前
記第1の基板検出センサと第2の基板検出センサの少な
くともいずれか一方を、前記停止させようとする回路基
板の種類に応じて選択的に切り替えて使用することを特
徴とする。
A circuit board detecting method for an electronic component mounting machine according to a first aspect of the present invention for achieving the above object is a circuit board detecting method for a circuit board up to a predetermined position in a carrier path in a circuit board processing machine. A circuit board detection method of a circuit board processing machine for detecting the circuit board during transportation of the circuit board and stopping at the predetermined position when the circuit board is transported and stopped.
A first substrate detection sensor that irradiates the circuit board with diffused light and detects reflected light from the circuit board, and a second board that irradiates the circuit board with convergent light and detects reflected light from the circuit board. A detection sensor is disposed in the transport path, and at least one of the first board detection sensor and the second board detection sensor is selectively operated according to the type of the circuit board to be stopped. It is characterized by switching and using.

【0009】この回路基板加工機の回路基板検出方法で
は、回路基板に応じて最適な基板検出センサを使用し
て、全ての回路基板に対して高精度な検出が可能にな
り、例えばミシン目や切欠を有する複数枚取り基板や部
品実装済み基板の違いを確実に判別して、回路基板を高
精度に停止制御することができる。これにより、搬送制
御の信頼性を高めることができる。
In this circuit board detecting method for a circuit board processing machine, it is possible to detect all circuit boards with high accuracy by using an optimum board detecting sensor according to the circuit board. It is possible to reliably determine the difference between a multi-piece board having notches or a board on which components are mounted, and to stop and control the circuit board with high accuracy. As a result, the reliability of transport control can be improved.

【0010】請求項2記載の回路基板加工機の回路基板
検出方法は、前記搬送路の回路基板の上方及び下方のそ
れぞれに、前記第1の基板検出センサと前記第2の基板
検出センサとを上下対向させてそれぞれ配置し、前記搬
送路上方の基板検出センサからの検出信号と前記搬送路
下方の基板検出センサからの検出信号とを比較して回路
基板の検出を行うことを特徴とする。
According to a second aspect of the present invention, there is provided a circuit board detection method for a circuit board processing machine, wherein the first board detection sensor and the second board detection sensor are provided above and below the circuit board in the transfer path, respectively. The circuit boards are arranged so as to face each other in the vertical direction, and a circuit board is detected by comparing a detection signal from a board detection sensor above the conveyance path with a detection signal from a board detection sensor below the conveyance path.

【0011】この回路基板加工機の回路基板検出方法で
は、搬送路の回路基板の上方及び下方のそれぞれに配置
した第1の基板検出センサと第2の基板検出センサから
の検出信号を上下双方で比較する。これにより、表裏面
の色や濃度、或いは電子部品の実装状態が異なる回路基
板に対して、これら回路基板の特性に応じて上下いずれ
か適する基板検出センサ或いは両方の基板検出センサを
用いて検出を行うことで、検出精度の信頼性を向上でき
る。
In this circuit board detection method for the circuit board processing machine, the detection signals from the first board detection sensor and the second board detection sensor arranged above and below the circuit board in the transfer path are both upper and lower. Compare. As a result, for circuit boards with different front and back colors and densities, or mounting states of electronic components, detection can be performed using either the upper or lower board detection sensor that is suitable for the upper or lower side, depending on the characteristics of these circuit boards. By doing so, the reliability of detection accuracy can be improved.

【0012】請求項3記載の回路基板加工機の回路基板
検出方法は、前記回路基板の検出に先立ち、前記第1の
基板検出センサと前記第2の基板検出センサの少なくと
もいずれか一方を、前記回路基板に対して基板面と平行
な方向へ相対移動させつつ前記各基板検出センサにより
反射光を検出し、該移動により得られた検出情報に基づ
いて前記回路基板の検出位置を決定し、各基板検出セン
サを前記検出位置に移動させておくことを特徴とする。
According to a third aspect of the present invention, there is provided a circuit board detecting method for a circuit board processing machine, wherein prior to the detection of the circuit board, at least one of the first board detecting sensor and the second board detecting sensor is used. The reflected light is detected by each of the substrate detection sensors while relatively moving in the direction parallel to the circuit board with respect to the circuit board, and the detection position of the circuit board is determined based on the detection information obtained by the movement. It is characterized in that the substrate detection sensor is moved to the detection position.

【0013】この回路基板加工機の回路基板検出方法で
は、回路基板が搬送路の各停止位置に搬入されると、第
1の基板検出センサと第2の基板検出センサの少なくと
もいずれか一方が、回路基板の基板面と平行な方向に相
対移動しながら回路基板面を走査しながら検出する。そ
して、この走査によって得た回路基板の走査検出情報に
基づいて各基板検出センサを最適なセンサ位置に配置す
る。これにより、各基板検出センサが最適な位置で、最
大限に検出機能を発揮する。
In this circuit board detecting method for the circuit board processing machine, when the circuit board is carried into each stop position of the carrying path, at least one of the first board detecting sensor and the second board detecting sensor Detection is performed while scanning the circuit board surface while relatively moving in a direction parallel to the board surface of the circuit board. Then, each board detection sensor is arranged at the optimum sensor position based on the scan detection information of the circuit board obtained by this scanning. This maximizes the detection function of each substrate detection sensor at the optimum position.

【0014】請求項4記載の回路基板加工機の回路基板
検出装置は、回路基板を所定位置まで搬送して停止させ
る搬送路を有する回路基板加工機で、前記回路基板の搬
送中に該回路基板を検出して前記所定位置で停止させる
ための回路基板加工機の回路基板検出装置であって、回
路基板に拡散光を照射すると共に該回路基板からの反射
光を検出する第1の基板検出センサと、回路基板に収束
光を照射すると共に該回路基板からの反射光を検出する
第2の基板検出センサと、前記第1の基板検出センサと
第2の基板検出センサの少なくともいずれか一方を、前
記停止させようとする回路基板の種類に応じて選択的に
切り替えて使用する選択制御手段と、を備えたことを特
徴とする。
A circuit board detection device for a circuit board processing machine according to a fourth aspect is a circuit board processing machine having a transfer path for transferring a circuit board to a predetermined position and stopping the circuit board, the circuit board being transferred. A circuit board detection device for a circuit board processing machine for detecting a light source and stopping at the predetermined position, the first board detection sensor irradiating the circuit board with diffused light and detecting reflected light from the circuit board. A second substrate detection sensor for irradiating the circuit substrate with convergent light and detecting reflected light from the circuit substrate; and at least one of the first substrate detection sensor and the second substrate detection sensor, Selection control means for selectively switching and using the circuit board according to the type of the circuit board to be stopped.

【0015】この回路基板加工機の回路基板検出装置で
は、異なる検出特性の第1の基板検出センサと第2の基
板検出センサを選択的に切り替える選択制御手段によっ
て、回路基板の種類に応じて最適な基板検出センサを選
択的に使用して、全ての回路基板に対して高精度な検出
を可能にできる。これにより、例えばミシン目や切欠を
有する複数枚取り基板や部品実装済み基板の違いを確実
に判別して、回路基板を高精度に停止制御することがで
き、搬送制御の信頼性を高めることができる。
In the circuit board detection device of this circuit board processing machine, the selection control means for selectively switching the first board detection sensor and the second board detection sensor having different detection characteristics is optimal according to the type of the circuit board. It is possible to selectively use various board detection sensors to enable highly accurate detection for all circuit boards. As a result, for example, it is possible to reliably determine the difference between a multi-piece board having perforations and notches or a board on which components have been mounted, and to stop the circuit board with high accuracy, thereby improving the reliability of the transfer control. it can.

【0016】請求項5記載の回路基板加工機の回路基板
検出装置は、前記搬送路の回路基板の上方及び下方のそ
れぞれに、前記第1の基板検出センサと前記第2の基板
検出センサとを上下対向させてそれぞれ配置したことを
特徴とする。
According to a fifth aspect of the present invention, there is provided a circuit board detection device for a circuit board processing machine, wherein the first board detection sensor and the second board detection sensor are provided above and below the circuit board of the transfer path, respectively. It is characterized in that they are arranged facing each other vertically.

【0017】この回路基板加工機の回路基板検出装置で
は、回路基板の上方及び下方のそれぞれに第1及び第2
の基板検出センサを配置することにより、表裏面の色や
濃度、或いは電子部品の実装状態が異なる回路基板に対
して、これら回路基板の特性に応じて上下いずれか適す
る基板検出センサ或いは両方の基板検出センサを用いて
検出を行うことができ、検出精度の信頼性を向上でき
る。
In the circuit board detecting device of this circuit board processing machine, the first and second circuit boards are provided above and below the circuit board, respectively.
By arranging the board detection sensor of, the board detection sensor or both boards which are suitable for the top and bottom depending on the characteristics of these circuit boards with respect to the circuit boards having different front and back colors and densities or mounting states of electronic components. Detection can be performed using a detection sensor, and the reliability of detection accuracy can be improved.

【0018】請求項6記載の回路基板加工機の回路基板
検出装置は、前記第1の基板検出センサと前記第2の基
板検出センサの少なくともいずれか一方を前記回路基板
に対して基板面と平行な方向へ相対移動させるセンサ移
動機構と、前記センサ移動機構による各基板検出センサ
の動作を制御すると共に前記第1、第2の基板検出セン
サによる検出を行い、得られる検出信号に基づいて前記
回路基板の検出位置を設定する最適検出位置設定手段と
を備え、前記設定された回路基板の検出位置で、前記搬
送路に搬送されてくる回路基板の検出を行うことを特徴
とする。
According to a sixth aspect of the present invention, there is provided a circuit board detection device for a circuit board processing machine, wherein at least one of the first board detection sensor and the second board detection sensor is parallel to the board surface with respect to the circuit board. A sensor moving mechanism that relatively moves in various directions, and the operation of each substrate detecting sensor by the sensor moving mechanism is controlled, and detection is performed by the first and second substrate detecting sensors, and the circuit is based on the obtained detection signal. An optimum detection position setting means for setting the detection position of the board is provided, and the circuit board conveyed to the conveyance path is detected at the set detection position of the circuit board.

【0019】この回路基板加工機の回路基板検出装置で
は、回路基板が搬送路の各停止位置に搬入されると、セ
ンサ移動機構により、第1の基板検出センサと第2の基
板検出センサの少なくともいずれか一方が、回路基板の
基板面と平行な方向に相対移動しながら回路基板面を走
査する。この走査に伴って各基板検出センサが検出を行
うことで走査検出情報を取得し、この走査検出情報に基
づいて最適検出位置設定手段が各基板検出センサの最適
な配置位置を設定する。そして、設定された回路基板の
検出位置で、搬送路に搬送されてくる回路基板の検出を
行うことにより、各基板検出センサが最適な位置で、最
大限に検出機能を発揮することができる。
In the circuit board detecting device of this circuit board processing machine, when the circuit board is carried into each stop position of the conveying path, the sensor moving mechanism causes at least the first board detecting sensor and the second board detecting sensor to be operated. Either one scans the circuit board surface while relatively moving in a direction parallel to the board surface of the circuit board. Each substrate detection sensor performs detection in accordance with this scanning to acquire scanning detection information, and the optimum detection position setting means sets the optimum arrangement position of each substrate detection sensor based on this scanning detection information. Then, by detecting the circuit board conveyed to the conveyance path at the set detection position of the circuit board, each board detection sensor can exert its maximum detection function at the optimum position.

【0020】[0020]

【発明の実施の形態】以下、本発明に係る回路基板加工
機の回路基板検出方法及び回路基板検出装置の好適な実
施の形態について図面を参照して詳細に説明する。図1
は本発明に係る回路基板検出装置を搭載した電子部品実
装機の構成図、図2は回路基板検出装置の概念的な構成
を示す構成図、図3は基板検出センサの説明図である。
BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of a circuit board detection method and a circuit board detection apparatus for a circuit board processing machine according to the present invention will be described in detail below with reference to the drawings. Figure 1
Is a block diagram of an electronic component mounter equipped with a circuit board detection device according to the present invention, FIG. 2 is a block diagram showing a conceptual structure of the circuit board detection device, and FIG. 3 is an explanatory diagram of a board detection sensor.

【0021】図1に示すように、回路基板加工装置とし
ての電子部品実装機21は、基台23上面中央に、回路
基板25のガイドレール27が設けられ、このガイドレ
ール27の搬送ベルトによって、回路基板25は端側の
ローダ部29から電子部品の実装位置31に、また、実
装位置31から他端側のアンローダ部33に搬送され
る。回路基板25上方の基台23上面両側部にはY軸部
36が設けられ、Y軸部36の間にはX軸部37が懸架
されている。また、X軸部37には移載ヘッド39が取
り付けられており、これにより、移載ヘッド39をX−
Y平面内で移動可能にしている。
As shown in FIG. 1, in the electronic component mounting machine 21 as a circuit board processing apparatus, a guide rail 27 of a circuit board 25 is provided at the center of the upper surface of a base 23, and a conveyor belt of the guide rail 27 allows The circuit board 25 is transported from the loader unit 29 on the end side to the mounting position 31 of the electronic component, and from the mounting position 31 to the unloader unit 33 on the other end side. Y-axis portions 36 are provided on both sides of the upper surface of the base 23 above the circuit board 25, and an X-axis portion 37 is suspended between the Y-axis portions 36. Further, a transfer head 39 is attached to the X-axis portion 37, which allows the transfer head 39 to move in the X- direction.
It is movable in the Y plane.

【0022】上記X軸部37、Y軸部36からなるXY
ロボット上に搭載され、X−Y平面(水平面)上を自在
移動する移載ヘッド39は、例えば抵抗チップやチップ
コンデンサ等の電子部品が供給されるパーツフィーダ4
1、又はSOPやQFP等のICやコネクタ等の比較的
大型の電子部品が供給されるパーツトレイ43から所望
の電子部品を吸着ノズル45により吸着して、回路基板
25の所定位置に装着できるように構成されている。こ
のような電子部品の実装動作は、予め設定された実装プ
ログラムに基づいて図示しない制御装置により制御され
る。
XY composed of the X-axis portion 37 and the Y-axis portion 36
The transfer head 39 mounted on the robot and freely moving on the XY plane (horizontal plane) includes a parts feeder 4 to which electronic components such as a resistance chip and a chip capacitor are supplied.
1 or a desired electronic component is sucked by a suction nozzle 45 from a parts tray 43 to which relatively large electronic components such as ICs and connectors such as SOP and QFP are supplied, and can be mounted at a predetermined position on the circuit board 25. Is configured. The mounting operation of such an electronic component is controlled by a control device (not shown) based on a preset mounting program.

【0023】パーツフィーダ41は、ガイドレール27
の両端部に多数個並設されており、各パーツフィーダに
は、例えば抵抗チップやチップコンデンサ等の電子部品
が収容されたテープ状の部品ロールがそれぞれ取り付け
られている。また、パーツトレイ43は、ガイドレール
27と直交する方向が長尺となるトレイ43aが計2個
載置可能で、各トレイ43aは部品の供給個数に応じて
ガイドレール27側にスライドして、Y方向の部品取り
出し位置を一定位置に保つ構成となっている。このトレ
イ43a上には、QFP等の電子部品が載置される。
The parts feeder 41 has a guide rail 27.
A large number of tape-shaped component rolls accommodating electronic components such as resistor chips and chip capacitors are attached to the respective component feeders. Further, in the parts tray 43, a total of two trays 43a each having a lengthwise direction orthogonal to the guide rail 27 can be placed, and each tray 43a slides to the guide rail 27 side according to the number of supplied components, The Y-direction component take-out position is kept constant. Electronic components such as QFP are placed on the tray 43a.

【0024】上記電子部品実装機21における回路基板
25の搬送路44は、図2に示すように、ローダ部29
と、テーブル部35と、アンローダ部33とからなる。
ローダ部29は、電子部品実装機21に搬送されてきた
未実装の回路基板25を搬入し、テーブル部35におい
て電子部品を実装している間、未実装の回路基板25を
待機させる。テーブル部35は、ローダ部29から回路
基板25を搬入し、この回路基板25に対して電子部品
を実装する生産工程を行う。アンローダ部33は、生産
完了した回路基板25をテーブル部35から受け取り、
次工程に搬送するまで待機させる。これらのローダ部2
9、テーブル部35、アンローダ部33は、回路基板2
5を搬送するための搬送ベルトを有しており、この搬送
ベルトは、ACサーボモータ47又はインダクションモ
ータにより駆動される。
As shown in FIG. 2, the transfer path 44 of the circuit board 25 in the electronic component mounter 21 is a loader section 29.
And a table section 35 and an unloader section 33.
The loader unit 29 carries in the unmounted circuit board 25 transferred to the electronic component mounter 21 and makes the unmounted circuit board 25 stand by while the electronic components are mounted on the table unit 35. The table section 35 carries in the circuit board 25 from the loader section 29 and performs a production process of mounting electronic components on the circuit board 25. The unloader unit 33 receives the production-completed circuit board 25 from the table unit 35,
Wait until it is conveyed to the next process. These loader units 2
The circuit board 2 includes the table portion 35, the table portion 35, and the unloader portion 33.
It has a transport belt for transporting 5, and this transport belt is driven by an AC servomotor 47 or an induction motor.

【0025】即ち、搬送路44では、ローダ部29、テ
ーブル部35、アンローダ部33において、回路基板2
5の停止位置がそれぞれ存在する。本実施形態における
回路基板検出装置100においては、搬送路44の各停
止位置に広光拡散方式の基板検出センサ(第1の基板検
出センサ)51及び限定反射方式の基板検出センサ(第
2の基板検出センサ)53を配設している。ここではテ
ーブル部35に設けた基板検出センサ51,53に対し
て説明することにする。なお、ローダ部29、アンロー
ダ部33に対しては、基板検出センサ51、53の図示
を省略してあるが、テーブル部35と同様に設けられて
いる。
That is, in the transport path 44, in the loader unit 29, the table unit 35, and the unloader unit 33, the circuit board 2
There are 5 stop positions each. In the circuit board detection device 100 according to the present embodiment, a wide light diffusion type substrate detection sensor (first substrate detection sensor) 51 and a limited reflection type substrate detection sensor (second substrate detection) are provided at respective stop positions of the transport path 44. (Sensor) 53 is provided. Here, the substrate detection sensors 51 and 53 provided on the table portion 35 will be described. Although the substrate detection sensors 51 and 53 are not shown in the loader unit 29 and the unloader unit 33, they are provided similarly to the table unit 35.

【0026】これら広光拡散方式の基板検出センサ51
及び限定反射方式の基板検出センサ53は、コンピュー
タ等の選択制御手段55に接続されている。この選択制
御手段55は、上記した制御装置57に接続される。選
択制御手段55は、予め登録してある回路基板25の基
板データに基づいて、広光拡散方式の基板検出センサ5
1と限定反射方式の基板検出センサ53との少なくとも
いずれか一方を使用可能に切り替える制御を行う。な
お、選択制御手段55は、制御装置57に同等の機能を
付与することにより、上記の制御装置57に組み込むも
のであってもよい。
These wide light diffusion type substrate detection sensors 51
The limited reflection type substrate detection sensor 53 is connected to the selection control means 55 such as a computer. The selection control means 55 is connected to the control device 57 described above. The selection control means 55 uses the wide light diffusion type board detection sensor 5 based on the board data of the circuit board 25 registered in advance.
At least one of 1 and the limited reflection type substrate detection sensor 53 is controlled to be enabled. The selection control means 55 may be incorporated in the control device 57 by giving the control device 57 an equivalent function.

【0027】基板検出センサ51,53は、回路基板2
5へ光を照射するLED等の発光素子と、この発光素子
の照射光が回路基板25で反射した戻り光を受光する受
光素子とを有し、発光素子からの照射光を通過させる光
学系(レンズ等)によって広光拡散方式又は限定反射方
式とに分類される。受光素子は、回路基板25からの戻
り光を検出し、この戻り光を光電変換することにより検
出信号として出力する。受光素子からの検出信号を制御
装置57で処理することにより、回路基板25の形状、
色や濃度、電子部品実装状況等の把握が可能となる。
The board detection sensors 51 and 53 are used for the circuit board 2
5, an optical system having a light emitting element such as an LED for irradiating light, and a light receiving element for receiving the return light reflected by the light emitted from the light emitting element on the circuit board 25, and transmitting the light emitted from the light emitting element ( Depending on the lens), it is classified into a wide light diffusion system or a limited reflection system. The light receiving element detects the return light from the circuit board 25 and photoelectrically converts the return light to output it as a detection signal. By processing the detection signal from the light receiving element by the control device 57, the shape of the circuit board 25,
It is possible to understand the color, density, mounting status of electronic parts, etc.

【0028】ここで、本実施形態における回路基板検出
装置100においては、広光拡散方式の基板検出センサ
51及び限定反射方式の基板検出センサ53が、回路基
板25の一方の面である裏面側に対面させて、回路基板
25の搬送方向に並べて配設されている。これにより、
テーブル部35の搬送路上を回路基板25が搬送される
と、広光拡散方式の基板検出センサ51と、限定反射方
式の基板検出センサ53とが回路基板25を同一面側か
ら検出し、それぞれの基板検出センサ51、53が異な
る検出特性で一つの回路基板25を重複検出する。本実
施形態では、これら双方の検出情報を判断制御に用いる
ことで、検出精度の向上を図っている。
Here, in the circuit board detecting device 100 according to the present embodiment, the wide light diffusion type board detecting sensor 51 and the limited reflection type board detecting sensor 53 face the back side, which is one side of the circuit board 25. The circuit boards 25 are arranged side by side in the carrying direction. This allows
When the circuit board 25 is conveyed on the conveying path of the table portion 35, the wide light diffusion type substrate detection sensor 51 and the limited reflection type substrate detection sensor 53 detect the circuit substrate 25 from the same surface side, and the respective substrates are detected. The detection sensors 51 and 53 redundantly detect one circuit board 25 with different detection characteristics. In the present embodiment, the detection accuracy is improved by using both of these pieces of detection information for determination control.

【0029】広光拡散方式の基板検出センサ51と限定
反射方式の基板検出センサ53とは、図3に示すよう
に、その検出特性が異なる。広光拡散方式の基板検出セ
ンサ51は、照射光を拡散して照射することにより、広
範囲にわたる検出を可能にできる。また、例えばφ25
mm程度までの回路基板の切り欠きが検出でき、拡散光
照射であるために回路基板に形成された抜き穴やミシン
目等の局所的な開口が存在しても影響を受けることはな
い。さらに、回路基板上に実装された背の高い部品や鏡
面を有するCSP(Chip Size Package)等の電子部品
の存在によっても影響を受けることはない。一方、限定
反射方式の基板検出センサ53は、照射光を集光した収
束光を照射することにより、限られた狭い範囲において
高い検出精度で検出が可能になる。また、回路基板の背
面影響(背景輝度による影響)を受けにくく、安定した
検出が可能となる。
As shown in FIG. 3, the wide-light diffusion type substrate detection sensor 51 and the limited reflection type substrate detection sensor 53 have different detection characteristics. The wide light diffusion type substrate detection sensor 51 can detect a wide range by diffusing and irradiating the irradiation light. Also, for example, φ25
Notches of the circuit board up to about mm can be detected, and because of the diffused light irradiation, there is no effect even if there are local openings such as perforations and perforations formed in the circuit board. Further, it is not affected by the presence of tall components mounted on the circuit board or electronic components such as CSP (Chip Size Package) having a mirror surface. On the other hand, the limited reflection type substrate detection sensor 53 is capable of performing detection with high detection accuracy in a limited narrow range by irradiating convergent light obtained by converging irradiation light. In addition, it is possible to perform stable detection because it is unlikely to be affected by the back surface of the circuit board (effect of background brightness).

【0030】次に、上記構成の回路基板検出装置100
の動作を説明する。回路基板検出装置100は、ローダ
部29、テーブル部35、アンローダ部33のいずれか
に回路基板25が進入すると、先ず、選択制御手段55
が、進入した回路基板25についての基板データを抽出
する。基板データは、例えば制御装置57から受け取る
ことができが、これ以外にも電子部品実装装置21に直
接入力してもよい。選択制御手段55は、その回路基板
25が特定できたなら、その回路基板25に適した基板
検出センサへの切り替えを行う。この切り替えは、広光
拡散方式の基板検出センサ51と、限定反射方式の基板
検出センサ53との少なくともいずれか一方とすること
ができる。
Next, the circuit board detection device 100 having the above configuration
The operation of will be described. When the circuit board 25 enters the loader unit 29, the table unit 35, or the unloader unit 33, the circuit board detection device 100 first selects the selection control unit 55.
Extracts board data for the entered circuit board 25. The board data can be received from, for example, the control device 57, but other than this, it may be directly input to the electronic component mounting device 21. When the circuit board 25 can be specified, the selection control means 55 switches to a board detection sensor suitable for the circuit board 25. This switching can be performed by at least one of the wide light diffusion type substrate detection sensor 51 and the limited reflection type substrate detection sensor 53.

【0031】具体的には、例えば回路基板25が割基板
等の複数枚取り基板である場合、広光拡散方式の基板検
出センサ51のみを用いて検出を行うか、限定反射方式
の基板検出センサ53のみを用いて検出を行うか、或い
は広光拡散方式の基板検出センサ51と限定反射方式の
基板検出センサ53の両方を用いて検出を行うかを、回
路基板の種類に応じて選択的に設定する。これにより、
一元的に限定反射方式の基板検出センサ53のみ用いて
検出する場合と比較して、ミシン目等を回路基板端部と
して検出する誤検出が生じ難くなる。
Specifically, for example, when the circuit board 25 is a multi-piece board such as a split board, detection is performed using only the wide light diffusion type board detection sensor 51 or the limited reflection type board detection sensor 53. It is selectively set according to the type of the circuit board whether to perform detection using only the wide light diffusion type substrate detection sensor 51 or the limited reflection type substrate detection sensor 53. . This allows
Compared with the case where the detection is performed only by using the limited reflection type substrate detection sensor 53 in a unified manner, erroneous detection in which perforations and the like are detected as the circuit board end portion is less likely to occur.

【0032】このように、本実施形態の回路基板検出装
置100によれば、回路基板25の種類に応じて、最適
な検出が行える基板検出センサ51、53を選択的に使
用することにより、多種類の回路基板25に対して高精
度な検出が可能になり、例えばミシン目や切欠等を有す
る複数枚取り基板や部品実装済み基板の違いを確実に判
別して、回路基板25を誤動作させることなく高精度に
停止制御することができる。これにより、搬送路44に
おける搬送制御の信頼性を高めることができる。
As described above, according to the circuit board detecting apparatus 100 of the present embodiment, the board detecting sensors 51 and 53 capable of performing the optimum detection are selectively used according to the type of the circuit board 25, so that it is possible to increase the number of the circuit boards. Highly accurate detection is possible with respect to various types of circuit boards 25. For example, it is possible to reliably determine the difference between a multi-piece board having perforations, notches, etc. or a board on which components are mounted, and to cause the circuit board 25 to malfunction. Therefore, stop control can be performed with high accuracy. As a result, the reliability of the transport control on the transport path 44 can be improved.

【0033】次に、本発明に係る回路基板検出装置の第
2の実施の形態を説明する。図4は本実施形態の回路基
板検出装置200の構成図である。なお、図1〜図3に
示した部材と同一の部材には同一の符号を付し、重複す
る説明は省略するものとする。本実施形態による回路基
板検出装置200は、広光拡散方式の基板検出センサ5
1及び限定反射方式の基板検出センサ53を、搬送路4
4の回路基板25の上方及び下方のそれぞれに、この回
路基板25を挟み回路基板25の表面側と裏面側との両
方に対面するように上下対向させて配設している。な
お、ローダ部29、アンローダ部33の基板検出センサ
51,53は、図示は省略してあるがテーブル部35と
同様に配設される。
Next, a second embodiment of the circuit board detecting device according to the present invention will be described. FIG. 4 is a configuration diagram of the circuit board detection device 200 of the present embodiment. The same members as those shown in FIGS. 1 to 3 are designated by the same reference numerals, and duplicate explanations will be omitted. The circuit board detection device 200 according to the present embodiment includes a wide light diffusion type board detection sensor 5.
1 and the limited reflection type substrate detection sensor 53,
The circuit boards 25 are arranged above and below the fourth circuit board 25 so as to face both the front surface side and the back surface side of the circuit board 25 so as to face each other. The substrate detection sensors 51 and 53 of the loader unit 29 and the unloader unit 33 are arranged in the same manner as the table unit 35, though not shown.

【0034】この回路基板検出装置200では、広光拡
散方式の基板検出センサ51及び限定反射方式の基板検
出センサ53が、回路基板25の表面と裏面との両方を
検出可能にしている。回路基板25は、表裏面の色や濃
度、或いは電子部品の実装状態が異なる場合が多々ある
が、これら回路基板25の特性を基板データから判断
し、表裏いずれか適する基板検出センサ51,53或い
は両方の基板検出センサ51,53を用いて検出を行う
ことで、検出精度の信頼性を向上している。搬送される
回路基板25の種類によっては、表面からは回路基板2
5の端部を検出しにくいが、裏面からは検出が容易であ
る場合がある。このときに表面からの情報のみを用いて
判断していたのでは、非効率的で検出の正確性も得られ
ないことがあるが、裏面からの情報を用いることで確実
な検出が可能となる。
In the circuit board detection device 200, the wide light diffusion type board detection sensor 51 and the limited reflection type board detection sensor 53 can detect both the front surface and the back surface of the circuit board 25. The circuit board 25 often has different colors and densities on the front and back surfaces, or the mounting state of electronic components, but the characteristics of the circuit board 25 are judged from the board data, and either the front or back surface of the suitable board detection sensor 51, 53 or By performing detection using both the substrate detection sensors 51 and 53, reliability of detection accuracy is improved. Depending on the type of the circuit board 25 being transported, the circuit board 2 may be viewed from the surface.
Although it is difficult to detect the end portion of No. 5, it may be easy to detect from the back surface. At this time, if only the information from the front side is used for the determination, it may be inefficient and the accuracy of detection may not be obtained, but by using the information from the back side, reliable detection is possible. .

【0035】このように、本実施形態においては、回路
基板25の表裏両側の基板検出センサ51,53を使用
することで、例えば表裏両側の基板検出センサ51,5
3の判定が共に“回路基板を検出した”ときに、回路基
板25の搬送を停止するAND制御とすることで一層正
確な検出を行うことができる。また、端部の検出が困難
な回路基板25である場合には、少なくともいずれか一
方から“回路基板を検出した”ときに搬送を停止するO
R制御としてもよい。これにより、検出精度の信頼性を
向上できる。
As described above, in this embodiment, by using the substrate detection sensors 51, 53 on both the front and back sides of the circuit board 25, for example, the substrate detection sensors 51, 5 on both the front and back sides are used.
When both the determinations in 3 are “circuit board detected”, AND control is performed to stop the conveyance of the circuit board 25, so that more accurate detection can be performed. When the circuit board 25 is difficult to detect the end portion, the conveyance is stopped when "the circuit board is detected" from at least one of the two.
It may be R control. Thereby, the reliability of detection accuracy can be improved.

【0036】次に、本発明に係る回路基板検出装置の第
3の実施の形態を説明する。図5は本実施形態の回路基
板検出装置300の構成図である。なお、図1〜図3に
示した部材と同一の部材には同一の符号を付し、重複す
る説明は省略するものとする。
Next, a third embodiment of the circuit board detecting device according to the present invention will be described. FIG. 5 is a configuration diagram of the circuit board detection device 300 of the present embodiment. The same members as those shown in FIGS. 1 to 3 are designated by the same reference numerals, and duplicate explanations will be omitted.

【0037】本実施形態による回路基板検出装置300
は、広光拡散方式の基板検出センサ51と限定反射方式
の基板検出センサ53とを、回路基板25と平行なXY
方向に移動自在にするセンサ移動機構60を有してい
る。このセンサ移動機構は60、ラック・ピニオン機
構、ボールネジ機構、空圧・油圧駆動機構等により構成
することができる。また、広光拡散方式の基板検出セン
サ51と限定反射方式の基板検出センサ53とは、第2
の実施の形態と同様に、回路基板25の表面側と裏面側
の両方に対面させて配設することが好ましい。
The circuit board detecting device 300 according to the present embodiment.
Includes a wide light diffusion type substrate detection sensor 51 and a limited reflection type substrate detection sensor 53, which are arranged in an XY parallel to the circuit board 25.
It has a sensor moving mechanism 60 that can move in any direction. This sensor moving mechanism can be composed of 60, a rack and pinion mechanism, a ball screw mechanism, a pneumatic / hydraulic drive mechanism, and the like. In addition, the wide light diffusion type substrate detection sensor 51 and the limited reflection type substrate detection sensor 53 are
Similar to the embodiment described above, it is preferable that the circuit board 25 is disposed so as to face both the front surface side and the back surface side.

【0038】広光拡散方式の基板検出センサ51と限定
反射方式の基板検出センサ53とを移動させるセンサ移
動機構60は、最適検出位置設定手段62によって制御
する。即ち、各基板検出センサ51,53を回路基板2
5に対して相対移動させることにより、回路基板25の
表裏面全面を走査して、その形状、色や濃度、電子部品
実装状況等の諸情報を検出する。最適検出位置設定手段
62は、この検出された情報に基づいて検出が最も確実
に行える最適な検出位置を求め、各基板検出センサ5
1,53を、この検出が最も確実に行える最適な検出位
置へ移動制御する。
The sensor moving mechanism 60 for moving the wide-light-diffusion type substrate detection sensor 51 and the limited reflection type substrate detection sensor 53 is controlled by the optimum detection position setting means 62. That is, the board detection sensors 51 and 53 are connected to the circuit board 2
By moving the circuit board 25 relative to 5, the entire front and back surfaces of the circuit board 25 are scanned to detect various information such as the shape, color and density, and electronic component mounting status. The optimum detection position setting means 62 finds the optimum detection position at which the detection can be performed most reliably based on the detected information, and each substrate detection sensor 5
The movement control of 1 and 53 is performed to the optimum detection position where this detection can be performed most reliably.

【0039】具体的に説明すると、例えばテーブル部3
5に搬入された回路基板25は、図示しない基板ストッ
パにより電子部品実装位置に位置決めされる。次に、最
適検出位置設定手段62からの指令によりセンサ移動機
構60を動作させ、基板検出センサ51,53を、予め
設定した範囲でY方向(図5の紙面垂直方向)に移動さ
せ、また、基板検出センサ51,53を、搬送方向であ
るX方向に移動させる。この動作の繰り返しにより基板
検出センサ51,53を回路基板25上でXY方向に走
査させる。このとき、基板検出センサ51,53から出
力される検出信号である電流値が最適検出位置設定手段
62へと出力される。この動作を回路基板25の所定の
範囲、特に回路基板25の端部で連続的に行う。この結
果得られた電流検出波形から、最適検出位置設定手段6
2は、回路基板25の端部境界における信号強度のギャ
ップが大きく、安定検出可能と判断される最適検出位置
を求める。このようにして求めた最適検出位置へ基板検
出センサ51,53を移動して停止させる。
More specifically, for example, the table portion 3
The circuit board 25 carried in 5 is positioned at the electronic component mounting position by a board stopper (not shown). Next, the sensor moving mechanism 60 is operated by a command from the optimum detection position setting means 62 to move the substrate detection sensors 51 and 53 in the Y direction (direction perpendicular to the paper surface of FIG. 5) within a preset range, and The substrate detection sensors 51 and 53 are moved in the X direction which is the transport direction. By repeating this operation, the board detection sensors 51 and 53 are scanned on the circuit board 25 in the XY directions. At this time, a current value which is a detection signal output from the substrate detection sensors 51 and 53 is output to the optimum detection position setting means 62. This operation is continuously performed in a predetermined range of the circuit board 25, particularly in the end portion of the circuit board 25. From the current detection waveform obtained as a result, the optimum detection position setting means 6
2 has a large signal strength gap at the edge boundary of the circuit board 25, and obtains an optimum detection position where stable detection is possible. The substrate detection sensors 51 and 53 are moved to the optimum detection position thus obtained and stopped.

【0040】このように、本実施形態による回路基板検
出装置300は、広光拡散方式の基板検出センサ51と
限定反射方式の基板検出センサ53との少なくともいず
れか一方を、回路基板25に平行なXY方向に移動させ
ながら回路基板25を走査する。そして、この走査によ
って得た回路基板25の電流検出波形に基づき、広光拡
散方式の基板検出センサ51と限定反射方式の基板検出
センサ53との少なくともいずれか一方を、最適な検出
位置へ自動で移動させる。
As described above, in the circuit board detection device 300 according to the present embodiment, at least one of the wide light diffusion type board detection sensor 51 and the limited reflection type board detection sensor 53 is arranged in parallel with the circuit board 25. The circuit board 25 is scanned while moving in the direction. Then, based on the current detection waveform of the circuit board 25 obtained by this scanning, at least one of the wide light diffusion type substrate detection sensor 51 and the limited reflection type substrate detection sensor 53 is automatically moved to the optimum detection position. Let

【0041】これにより、広光拡散方式の基板検出セン
サ51、及び限定反射方式の基板検出センサ53を検出
に最適となる位置で使用することができ、それぞれの検
出特性を最大限に発揮させた高精度な検出が可能にな
る。
As a result, the wide-light-diffusion type substrate detection sensor 51 and the limited reflection type substrate detection sensor 53 can be used at positions that are optimal for detection, and the high detection characteristics of each can be maximized. It enables accurate detection.

【0042】以上、本発明の回路検出装置及び回路検出
方法について、電子部品実装機21に適用した一例を基
に説明したが、本発明はこれに限定されることなく、回
路基板を所定位置に搬送・停止させる機能を有する搬送
路を有する回路基板加工機であれば、同様にして本発明
を適用することができる。例えば、回路基板にクリーム
半田を印刷するクリーム半田印刷装置、回路基板上に印
刷されたクリーム半田の印刷状態を検査するクリーム半
田印刷検査装置、回路基板の所定位置に電子部品接着用
の接着剤を塗布する接着剤塗布装置等のいずれの装置に
対しても本発明を好適に適用できる。
The circuit detection device and the circuit detection method of the present invention have been described above based on an example applied to the electronic component mounter 21. However, the present invention is not limited to this, and the circuit board is placed at a predetermined position. The present invention can be applied in the same manner as long as it is a circuit board processing machine having a transfer path having a function of transferring and stopping. For example, a cream solder printing device for printing cream solder on a circuit board, a cream solder printing inspection device for inspecting the printing state of the cream solder printed on the circuit board, and an adhesive for bonding electronic components at a predetermined position on the circuit board. The present invention can be suitably applied to any device such as an adhesive applying device for applying.

【0043】[0043]

【発明の効果】以上詳細に説明したように、本発明に係
る回路基板加工機の回路基板検出方法によれば、第1の
基板検出センサと第2の基板検出センサとの検出特性の
異なる二種類の基板検出センサを使用し、これら基板検
出センサの少なくともいずれか一方を、停止させる回路
基板の情報に基づき切り替えて使用するので、種々の回
路基板ごとに最適な検出を行うことができ、例えばミシ
ン目や切欠を有する複数枚取り基板や部品実装済み基板
を高精度に判別して、搬送制御の信頼性を高めることが
できる。この結果、未搬送や重送を防止して電子部品実
装機における生産性を向上させることができる。
As described in detail above, according to the circuit board detecting method for the circuit board processing machine of the present invention, the first board detecting sensor and the second board detecting sensor have different detection characteristics. Since various types of board detection sensors are used and at least one of these board detection sensors is switched and used based on the information of the circuit board to be stopped, optimum detection can be performed for each of various circuit boards. It is possible to highly accurately discriminate a multi-cavity board having perforations or notches or a board on which components are mounted, and to enhance the reliability of transport control. As a result, it is possible to prevent non-conveyance and double feeding and improve the productivity in the electronic component mounting machine.

【0044】本発明に係る回路基板加工機の回路基板検
出装置によれば、第1の基板検出センサ及び第2の基板
検出センサと、回路基板の種類に応じてこれら基板検出
センサのいずれか一方又は両方を使用可能に切り替える
選択制御手段とを備えたので、搬送路の各停止位置に搬
入した回路基板ごとに、最適な基板検出センサを使用し
て回路基板を検出することができる。この結果、回路基
板の形状、色や濃度、電子部品の実装状態の違いによる
誤検出を防止して、搬送路を高精度に制御することがで
きる。
According to the circuit board detecting device of the circuit board processing machine of the present invention, one of the first board detecting sensor and the second board detecting sensor, and one of these board detecting sensors depending on the type of the circuit board. Alternatively, since the selection control means for switching both of them to usable is provided, it is possible to detect the circuit board by using the optimum board detection sensor for each circuit board carried into each stop position of the transport path. As a result, erroneous detection due to differences in the shape, color and density of the circuit board, and mounting states of electronic components can be prevented, and the transport path can be controlled with high accuracy.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る回路基板検出装置を搭載した電子
部品実装機を示す構成図である。
FIG. 1 is a configuration diagram showing an electronic component mounter equipped with a circuit board detection device according to the present invention.

【図2】回路基板検出装置の概念的な構成を示す構成図
である。
FIG. 2 is a configuration diagram showing a conceptual configuration of a circuit board detection device.

【図3】基板検出センサの説明図である。FIG. 3 is an explanatory diagram of a substrate detection sensor.

【図4】本発明に係る回路基板検出装置の第2実施形態
の構成図である。
FIG. 4 is a configuration diagram of a second embodiment of a circuit board detection device according to the present invention.

【図5】本発明に係る回路基板検出装置の第3実施形態
の構成図である。
FIG. 5 is a configuration diagram of a third embodiment of the circuit board detection device according to the present invention.

【図6】従来の電子部品実装機における回路基板検出装
置の構成図である。
FIG. 6 is a configuration diagram of a circuit board detection device in a conventional electronic component mounting machine.

【符号の説明】[Explanation of symbols]

21 電子部品実装機(回路基板加工機) 25 回路基板 44 搬送路 51 広光拡散方式の基板検出センサ(第1の基板検出
センサ) 53 限定反射方式の基板検出センサ(第2の基板検出
センサ) 55 選択制御手段 60 センサ移動機構 62 最適検出位置設定手段 100,200,300 回路基板検出装置
21 Electronic Component Mounting Machine (Circuit Board Processing Machine) 25 Circuit Board 44 Conveying Path 51 Wide Light Diffusion Type Substrate Detection Sensor (First Substrate Detection Sensor) 53 Limited Reflection Type Substrate Detection Sensor (Second Substrate Detection Sensor) 55 Selection control means 60 Sensor moving mechanism 62 Optimal detection position setting means 100, 200, 300 Circuit board detection device

───────────────────────────────────────────────────── フロントページの続き (72)発明者 栗林 毅 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Fターム(参考) 5E313 AA02 AA03 AA11 AA15 AA23 CC03 CC04 DD02 DD03 DD05 DD12 EE24 EE35 FF11 FF33 FG02    ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takeshi Kuribayashi             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F term (reference) 5E313 AA02 AA03 AA11 AA15 AA23                       CC03 CC04 DD02 DD03 DD05                       DD12 EE24 EE35 FF11 FF33                       FG02

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 回路基板加工機内の搬送路で回路基板を
所定位置まで搬送して停止させる際に、前記回路基板の
搬送中に該回路基板を検出して前記所定位置で停止させ
るための回路基板加工機の回路基板検出方法であって、 回路基板に拡散光を照射すると共に該回路基板からの反
射光を検出する第1の基板検出センサと、回路基板に収
束光を照射すると共に該回路基板からの反射光を検出す
る第2の基板検出センサとを前記搬送路に配設して、 前記第1の基板検出センサと第2の基板検出センサの少
なくともいずれか一方を、前記停止させようとする回路
基板の種類に応じて選択的に切り替えて使用することを
特徴とする回路基板加工機の回路基板検出方法。
1. A circuit for detecting a circuit board during conveyance of the circuit board and stopping it at the predetermined position when the circuit board is conveyed to a predetermined position and stopped on a conveyance path in the circuit board processing machine. A circuit board detection method for a board processing machine, comprising: a first board detection sensor for irradiating a circuit board with diffused light and detecting reflected light from the circuit board; and a circuit board for irradiating converged light with the circuit board. A second substrate detection sensor that detects reflected light from the substrate is disposed in the transport path, and at least one of the first substrate detection sensor and the second substrate detection sensor is stopped. A method for detecting a circuit board of a circuit board processing machine, which is selectively switched according to the type of the circuit board to be used.
【請求項2】 前記搬送路の回路基板の上方及び下方の
それぞれに、前記第1の基板検出センサと前記第2の基
板検出センサとを上下対向させてそれぞれ配置し、前記
搬送路上方の基板検出センサからの検出信号と前記搬送
路下方の基板検出センサからの検出信号とを比較して回
路基板の検出を行うことを特徴とする請求項1記載の回
路基板加工機の回路基板検出方法。
2. A substrate above the transport path, wherein the first substrate detection sensor and the second substrate detection sensor are vertically opposed to each other above and below the circuit board of the transport path, respectively. 2. The circuit board detection method for a circuit board processing machine according to claim 1, wherein the detection of the circuit board is performed by comparing the detection signal from the detection sensor with the detection signal from the board detection sensor below the conveyance path.
【請求項3】 前記回路基板の検出に先立ち、前記第1
の基板検出センサと前記第2の基板検出センサの少なく
ともいずれか一方を、前記回路基板に対して基板面と平
行な方向へ相対移動させつつ前記各基板検出センサによ
り反射光を検出し、該移動により得られた検出情報に基
づいて前記回路基板の検出位置を決定し、各基板検出セ
ンサを前記検出位置に移動させておくことを特徴とする
請求項1記載の回路基板加工機の回路基板検出方法。
3. Prior to the detection of the circuit board, the first
At least one of the second board detection sensor and the second board detection sensor is moved relative to the circuit board in a direction parallel to the board surface while the reflected light is detected by each board detection sensor, and the movement is performed. The circuit board detection of the circuit board processing machine according to claim 1, wherein the detection position of the circuit board is determined based on the detection information obtained by, and each board detection sensor is moved to the detection position. Method.
【請求項4】 回路基板を所定位置まで搬送して停止さ
せる搬送路を有する回路基板加工機で、前記回路基板の
搬送中に該回路基板を検出して前記所定位置で停止させ
るための回路基板加工機の回路基板検出装置であって、 回路基板に拡散光を照射すると共に該回路基板からの反
射光を検出する第1の基板検出センサと、 回路基板に収束光を照射すると共に該回路基板からの反
射光を検出する第2の基板検出センサと、 前記第1の基板検出センサと第2の基板検出センサの少
なくともいずれか一方を、前記停止させようとする回路
基板の種類に応じて選択的に切り替えて使用する選択制
御手段と、を備えたことを特徴とする回路基板加工機の
回路基板検出装置。
4. A circuit board processing machine having a carrying path for carrying a circuit board to a predetermined position and stopping the circuit board, the circuit board detecting the circuit board during the carrying of the circuit board and stopping the circuit board at the predetermined position. A circuit board detection device for a processing machine, comprising: a first board detection sensor for irradiating a circuit board with diffused light and detecting reflected light from the circuit board; and a circuit board for irradiating converged light with the circuit board. A second substrate detection sensor for detecting reflected light from the substrate, and at least one of the first substrate detection sensor and the second substrate detection sensor are selected according to the type of the circuit board to be stopped. A circuit board detection device for a circuit board processing machine, comprising: a selection control unit that is selectively switched for use.
【請求項5】 前記搬送路の回路基板の上方及び下方の
それぞれに、前記第1の基板検出センサと前記第2の基
板検出センサとを上下対向させてそれぞれ配置したこと
を特徴とする請求項4記載の回路基板加工機の回路基板
検出装置。
5. The first board detection sensor and the second board detection sensor are arranged above and below the circuit board of the transfer path so as to face each other in the vertical direction. 4. The circuit board detection device of the circuit board processing machine according to 4.
【請求項6】 前記第1の基板検出センサと前記第2の
基板検出センサの少なくともいずれか一方を前記回路基
板に対して基板面と平行な方向へ相対移動させるセンサ
移動機構と、 前記センサ移動機構による各基板検出センサの動作を制
御すると共に前記第1、第2の基板検出センサによる検
出を行い、得られる検出信号に基づいて前記回路基板の
検出位置を設定する最適検出位置設定手段とを備え、 前記設定された回路基板の検出位置で、前記搬送路に搬
送されてくる回路基板の検出を行うことを特徴とする請
求項4又は請求項5記載の回路基板加工機の回路基板検
出装置。
6. A sensor moving mechanism for relatively moving at least one of the first substrate detecting sensor and the second substrate detecting sensor relative to the circuit board in a direction parallel to a board surface, and the sensor moving mechanism. An optimum detection position setting means for controlling the operation of each board detection sensor by the mechanism, performing the detection by the first and second board detection sensors, and setting the detection position of the circuit board based on the obtained detection signal. The circuit board detection device for a circuit board processing machine according to claim 4 or 5, further comprising: detecting the circuit board conveyed to the conveyance path at the set detection position of the circuit board. .
JP2001219982A 2001-07-19 2001-07-19 Circuit board detection method and circuit board detection apparatus for circuit board processing machine Expired - Fee Related JP4601872B2 (en)

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JP2010092980A (en) * 2008-10-06 2010-04-22 Juki Corp Substrate conveying apparatus
JP2011071345A (en) * 2009-09-25 2011-04-07 Fuji Mach Mfg Co Ltd Electronic circuit component mounting machine
CN102340979A (en) * 2010-07-15 2012-02-01 富士机械制造株式会社 Method and device for controlling board stopping position and method for controlling board mounting position
JP2012023241A (en) * 2010-07-15 2012-02-02 Fuji Mach Mfg Co Ltd Substrate stop position control method and device, and substrate mounting position control method
US8649894B2 (en) 2010-07-15 2014-02-11 Fuji Machine Mfg. Co., Ltd. Method and device for controlling circuit board positions during the assembly of electronic components
CN102340979B (en) * 2010-07-15 2015-07-15 富士机械制造株式会社 Method and device for controlling board stopping position
JP2016001660A (en) * 2014-06-11 2016-01-07 富士通周辺機株式会社 Print circuit board inspection device and print circuit board inspection system

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