JP2003023021A - Mounted shield electronic component and manufacturing method therefor - Google Patents
Mounted shield electronic component and manufacturing method thereforInfo
- Publication number
- JP2003023021A JP2003023021A JP2001205456A JP2001205456A JP2003023021A JP 2003023021 A JP2003023021 A JP 2003023021A JP 2001205456 A JP2001205456 A JP 2001205456A JP 2001205456 A JP2001205456 A JP 2001205456A JP 2003023021 A JP2003023021 A JP 2003023021A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- shield
- shield member
- recess
- base member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、回路基板に実装す
るための電子素子が金属からなるシールド部材によりシ
ールドされた実装型シールド電子部品の構造とその製造
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a mountable shielded electronic component in which an electronic element for mounting on a circuit board is shielded by a shield member made of metal, and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】従来の実装型シールド電子部品は、電気
素子をベース部材に取りつけ、該電子素子を樹脂により
モールドして、該モールドの部分に、プレス加工により
凹部を成形したシールド部材をかぶせて、前記シールド
部材と前記ベース部材とを固着していた。2. Description of the Related Art A conventional mounting type shielded electronic component is one in which an electric element is mounted on a base member, the electronic element is molded with resin, and a shield member having a recess formed by press working is placed on the molded portion. The shield member and the base member are fixed to each other.
【０００３】図７は、従来例を斜め上方から見た状態を
示す斜視図である。図８（ａ）は、図７における実装型
シールド電子部品１１を上面から見た状態を示す上面図
である。図８（ｂ）は、（ａ）に示す上面図を右側面か
ら見た状態を示す側面図である。図９は、図８に示す実
装型シールド電子部品１１を組み立てる状態を示す説明
図である。FIG. 7 is a perspective view showing a state in which the conventional example is seen from diagonally above. FIG. 8A is a top view showing a state in which the mountable shield electronic component 11 in FIG. 7 is viewed from above. FIG. 8B is a side view showing a state where the top view shown in FIG. 8A is viewed from the right side surface. FIG. 9 is an explanatory diagram showing a state in which the mountable shield electronic component 11 shown in FIG. 8 is assembled.
【０００４】図７、および図８において従来例の構成に
ついて説明する。図７、および図８に示すように、実装
型シールド電子部品１１は、磁気の良導体である鉄材等
により、図９に示す樹脂１６ａを覆うように箱形に成形
されたシールド部材１３が、スルーホール１２ａおよび
配線パターン１２ｂを形成したベース部材１２にフック
部１３ｆで取りつけられて構成されている。ベース部材
１２には図９に示すようなＩＣ素子１４およびコンデン
サ１５等の電子素子が取りつけられ樹脂１６ａでモール
ドされている。シールド部材１３は、樹脂１６ａでモー
ルドされているＩＣ素子１４およびコンデンサ１５等の
電子素子を外部からの磁気的外乱から守るために、ＩＣ
素子１４およびコンデンサ１５等の電子素子をモールド
している樹脂１６ａを覆っており、図示せぬ制御回路の
グランドに接続されている。The configuration of the conventional example will be described with reference to FIGS. 7 and 8. As shown in FIGS. 7 and 8, in the mounted shield electronic component 11, the shield member 13 formed in a box shape so as to cover the resin 16a shown in FIG. The hook member 13f is attached to the base member 12 having the holes 12a and the wiring patterns 12b formed therein. Electronic elements such as an IC element 14 and a capacitor 15 as shown in FIG. 9 are attached to the base member 12 and molded with a resin 16a. The shield member 13 protects the electronic elements such as the IC element 14 and the capacitor 15 molded with the resin 16a from external magnetic disturbance.
It covers the resin 16a molding the electronic elements such as the element 14 and the capacitor 15, and is connected to the ground of a control circuit (not shown).
【０００５】図９おいて従来例の製造工程について説明
する。ＩＣ素子１４およびコンデンサ１５等の電子素子
をベース部材１２に半田付け等により取りつけ、取りつ
けられたＩＣ素子１４およびコンデンサ１５等の電子素
子を樹脂１６ａでモールドする。磁気の良導体である鉄
材等をプレス抜き、プレス曲げ加工により樹脂１６ａを
覆うように箱形に成形したたシールド部材１３を、モー
ルドされた樹脂１６ａにかぶせ、フック部１３ｅによっ
てベース部材１２に取りつける。シールド部材１３は図
７に示すように、配線パターン１２ｂおよびスルーホー
ル１２ａを介して図示せぬ制御回路のグランドに接続す
る。A conventional manufacturing process will be described with reference to FIG. Electronic elements such as the IC element 14 and the capacitor 15 are attached to the base member 12 by soldering or the like, and the attached electronic elements such as the IC element 14 and the capacitor 15 are molded with the resin 16a. An iron material or the like having a good magnetic property is punched out, and a box-shaped shield member 13 formed by press bending to cover the resin 16a is covered with the molded resin 16a and attached to the base member 12 by the hook portion 13e. As shown in FIG. 7, the shield member 13 is connected to the ground of a control circuit (not shown) via the wiring pattern 12b and the through hole 12a.
【０００６】[0006]
【発明が解決しようとする課題】上述のように、従来例
における実装型シールド電子部品は、シールド部材１３
をプレス抜き、プレス曲げ加工により箱形に成形し、こ
のようにして成形したシールド部材１３を、ＩＣ素子１
４およびコンデンサ１５等の電子素子を取りつけてモー
ルドしたベース部材１２に個別に組み付けるので、金型
の費用が多くかかると共に、工程数が多くなることによ
りコスト高になっていた。また、製造時間数が大きくな
り納期短縮を困難なものにしていた。As described above, the mounting type shielded electronic component in the conventional example is the shield member 13.
Is pressed into a box shape by press bending, and the shield member 13 thus formed is used as the IC element 1
Since the electronic elements such as 4 and the capacitor 15 are individually attached to the molded base member 12, the cost of the die is high and the number of steps is increased, resulting in a high cost. In addition, the number of manufacturing hours increases, making it difficult to shorten the delivery time.
【０００７】本発明の目的は、廉価にして納期短縮が可
能な実装型シールド電子部品を得ることにある。An object of the present invention is to obtain a mountable shield electronic component which can be manufactured at a low cost and which can shorten the delivery time.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
に、本発明においては、回路基板に実装するための電子
素子が金属からなるシールド部材によりシールドされた
実装型シールド電子部品において、エンボス加工により
凹部を成形したシールド部材の該凹部に液状の樹脂を流
し込み、該凹部の樹脂の中にベース部材に取りつけられ
た前記電子素子をいれて、前記シールド部材と前記ベー
ス部材とを固着したことを特徴とするものである。In order to achieve the above object, according to the present invention, an embossing is applied to a mounting type shielded electronic component in which an electronic element for mounting on a circuit board is shielded by a shield member made of metal. Liquid resin is poured into the recess of the shield member having the recess formed by, and the electronic element mounted on the base member is put into the resin of the recess to fix the shield member and the base member together. It is a feature.
【０００９】また、回路基板に実装するための電子素子
を金属からなるシールド部材によりシールドすることに
より製造された実装型シールド電子部品の製造方法にお
いて、前記電子素子をベース部材に取り付け、前記シー
ルド部材の裏面にエンボス加工により凹部を形成し、該
凹部に液状の樹脂を流し込み該凹部の樹脂の中にベース
部材に取りつけられた前記電子素子をいれて硬化させた
後該シールド部材と前記ベース部材とを固着することに
より製造することを特徴とするものである。Also, in a method of manufacturing a mountable shield electronic component manufactured by shielding an electronic element for mounting on a circuit board with a shield member made of metal, the electronic element is attached to a base member, and the shield member is provided. A recess is formed on the back surface of the recess by embossing, a liquid resin is poured into the recess, and the electronic element mounted on the base member is put into the resin of the recess and cured, and then the shield member and the base member It is characterized by being manufactured by fixing.
【００１０】また、前記ベース部材の素材に電子部品の
複数個分の前記電子素子を取り付け、前記シールド部材
の素材の裏面にエンボス加工により電子部品の複数個分
の凹部を形成し、該凹部に液状の樹脂を流し込み該凹部
の樹脂の中にベース部材に取りつけられた前記電子素子
をいれて硬化させて該シールド部材と前記ベース部材と
を固着した後、個別の電子部品に切断分離することによ
り製造することを特徴とするものである。Further, the electronic elements for a plurality of electronic components are attached to the material of the base member, and recesses for a plurality of electronic components are formed on the back surface of the material of the shield member by embossing. By pouring a liquid resin into the resin of the concave portion and hardening the electronic element attached to the base member to fix the shield member and the base member, by cutting and separating into individual electronic parts, It is characterized by being manufactured.
【００１１】また、前記シールド部材の表面にレジスト
被膜を形成し、前記シールド部材の表面をエッチング処
理して該シールド部材の不要部分を除去して成形するこ
とにより製造することを特徴とするものでる。Further, the invention is characterized in that the shield member is manufactured by forming a resist film on the surface of the shield member, etching the surface of the shield member to remove unnecessary portions of the shield member, and molding. .
【００１２】[0012]
【発明の実施の形態】以下発明の実施の形態を実施例に
基づき図面を参照して説明する。図１は、本発明に係る
一実施例を斜め上方から見た状態を示す斜視図である。
図２（ａ）は、図１における実装型シールド電子部品１
を上面から見た状態を示す上面図である。（ｂ）は、
（ａ）に示す上面図を右側面から見た状態を示す右側面
図である。図３は、図１における実装型シールド電子部
品１の第１製造工程を示す説明図である。図４は、図１
における実装型シールド電子部品１の第２製造工程を示
す説明図である。図５は、図１における実装型シールド
電子部品１の第３製造工程を示す説明図である。図６
は、図１における実装型シールド電子部品１の第４製造
工程を示す説明図である。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will now be described based on examples with reference to the drawings. FIG. 1 is a perspective view showing a state in which an embodiment according to the present invention is viewed obliquely from above.
FIG. 2A shows the mounted shield electronic component 1 shown in FIG.
It is a top view which shows the state seen from the upper surface. (B) is
It is a right side view which shows the state which looked at the top view shown to (a) from the right side. FIG. 3 is an explanatory view showing a first manufacturing process of the mountable shield electronic component 1 in FIG. 4 is shown in FIG.
5 is an explanatory view showing a second manufacturing process of the mountable shield electronic component 1 in FIG. FIG. 5 is an explanatory view showing a third manufacturing process of the mountable shield electronic component 1 in FIG. Figure 6
FIG. 7 is an explanatory diagram showing a fourth manufacturing process of the mountable shielded electronic component 1 in FIG. 1.
【００１３】図１、および図２において、本発明の実装
型シールド電子部品１の構成について説明する。絶縁材
により形成されているベース部材２の上面には図示せぬ
配線パターンが形成され、四隅にはスルーホール２ａが
形成されている。前記配線パターンには、図３に示す半
田付け等によりＩＣ素子４、コンデンサ５等の電子素子
が半田付け等により固着されている。ＩＣ素子４、コン
デンサ５等の電子素子は樹脂６ａでモールドされてい
る。シールド部材３は、樹脂６ａでモールドされている
ＩＣ素子１４およびコンデンサ１５等の電子素子を外部
からの磁気的外乱から守るために、ＩＣ素子４およびコ
ンデンサ５等の電子素子をモールドしている樹脂６ａを
覆っており、ベース部材２の上面に形成されている配線
パターンを介してグランドに接続されている。シールド
部材３の上面には窓部３ａが形成され、四隅にはスルー
ホール逃げ部３ｂが形成されている。The structure of the mountable shield electronic component 1 of the present invention will be described with reference to FIGS. 1 and 2. A wiring pattern (not shown) is formed on the upper surface of the base member 2 formed of an insulating material, and through holes 2a are formed at the four corners. Electronic elements such as the IC element 4 and the capacitor 5 are fixed to the wiring pattern by soldering or the like shown in FIG. Electronic elements such as the IC element 4 and the capacitor 5 are molded with resin 6a. The shield member 3 is a resin for molding electronic elements such as the IC element 4 and the capacitor 5 in order to protect the electronic elements such as the IC element 14 and the capacitor 15 molded with the resin 6a from external magnetic disturbance. 6a is covered and is connected to the ground via a wiring pattern formed on the upper surface of the base member 2. A window portion 3a is formed on the upper surface of the shield member 3, and through hole relief portions 3b are formed at the four corners.
【００１４】図３において、本発明の実装型シールド電
子部品１の第１製造工程について説明する。一体の磁気
の良導体である鉄材等に樹脂６ａを覆うための凹部３ｃ
を複数個形成し、表面には図６に示すレジスト被膜３ｄ
を形成してシールド部材３の素材を作成する。次に、シ
ールド部材３の素材の各凹部３ｃに液状樹脂６を流し込
む。次に、一体の絶縁体に複数個の電子部品を構成する
ためのスルーホール２ａおよび配線パターン２ｂを形成
してベース部材２の素材を作成する。次に、ベース部材
２の素材の配線パターン２ｂに、複数個の電子部品を構
成するためのＩＣ素子４およびコンデンサ５等の電子素
子を取りつける。Referring to FIG. 3, the first manufacturing process of the mountable shield electronic component 1 of the present invention will be described. A recess 3c for covering the resin 6a on an iron material or the like which is a good magnetic conductor
A plurality of resists are formed on the surface of the resist coating 3d shown in FIG.
To form a material for the shield member 3. Next, the liquid resin 6 is poured into each concave portion 3c of the material of the shield member 3. Next, a through hole 2a and a wiring pattern 2b for forming a plurality of electronic components are formed in an integral insulator to form a material for the base member 2. Next, electronic elements such as IC elements 4 and capacitors 5 for forming a plurality of electronic components are attached to the wiring pattern 2b of the material of the base member 2.
【００１５】図４において、本発明の実装型シールド電
子部品１の第２製造工程について説明する。ベース部材
２の素材に取りつけられている複数個の電子部品を構成
するためのＩＣ素子４およびコンデンサ５等の電子素子
を、シールド部材３の各凹部３ｃに貯められている液状
樹脂６に沈漬させ、ベース部材２の素材とシールド部材
３の素材を接合する。次に、液状樹脂６を硬化させて樹
脂６ａの状態にする。Referring to FIG. 4, the second manufacturing process of the mountable shield electronic component 1 of the present invention will be described. Electronic elements such as an IC element 4 and a capacitor 5 for forming a plurality of electronic components attached to the material of the base member 2 are immersed in the liquid resin 6 stored in each recess 3c of the shield member 3. Then, the material of the base member 2 and the material of the shield member 3 are joined. Next, the liquid resin 6 is cured to be in the state of the resin 6a.
【００１６】図５において、本発明の実装型シールド電
子部品１の第３製造工程について説明する。ベース部材
２の素材とシールド部材３の素材とが接合され、液状樹
脂６が硬化して樹脂６ａとなった状態で切断線ａで切断
することにより個別の実装型シールド電子部品１を得
る。Referring to FIG. 5, the third manufacturing process of the mountable shield electronic component 1 of the present invention will be described. When the material of the base member 2 and the material of the shield member 3 are joined and the liquid resin 6 is cured to become the resin 6a, cutting is performed at the cutting line a to obtain the individual mountable shield electronic components 1.
【００１７】図６において、本発明の実装型シールド電
子部品１の第４製造工程について説明する。シールド部
材３の表面をエッチング処理を行うことにより、レジス
ト被膜３ｄが成されていないシールド部材３の表面は除
去され、図１に示す窓部３ａおよびスルーホール逃げ部
３ｂを形成する。その後、必要があればレジストの除去
を行う。なお、このエッチング処理は図５に示す切断の
前に行ってもよい。A fourth manufacturing process of the mountable shield electronic component 1 of the present invention will be described with reference to FIG. By etching the surface of the shield member 3, the surface of the shield member 3 on which the resist coating 3d is not formed is removed, and the window portion 3a and the through hole relief portion 3b shown in FIG. 1 are formed. Then, if necessary, the resist is removed. The etching process may be performed before the cutting shown in FIG.
【００１８】[0018]
【発明の効果】以上説明したように、本発明によれば、
複数個の電子部品に用いるシールド部材３を一体の素材
で形成すると共に、複数個の電子部品に用いるベース部
材２を一体の素材で形成して、一体のシールド部材３の
素材と一体のベース部材２の素材とを結合してから個別
に切断することによって、実装型シールド電子部品１を
製造するので一貫した製造工程で製造することができ
る。従って、納期を短縮することができると共に製造コ
ストを廉価に抑えることができる。As described above, according to the present invention,
The shield member 3 used for the plurality of electronic components is formed of an integral material, and the base member 2 used for the plurality of electronic components is formed of an integral material, and the base member is integrated with the material of the integral shield member 3. Since the mountable shielded electronic component 1 is manufactured by combining the two materials and then cutting them individually, it is possible to manufacture them in a consistent manufacturing process. Therefore, the delivery time can be shortened and the manufacturing cost can be kept low.
【図１】本発明に係る一実施例を斜め上方から見た状態
を示す斜視図である。FIG. 1 is a perspective view showing a state in which an embodiment according to the present invention is viewed obliquely from above.
【図２】（ａ）は、図１における実装型シールド電子部
品１を上面から見た状態を示す上面図である。（ｂ）
は、（ａ）に示す上面図を右側面から見た状態を示す右
側面図である。FIG. 2A is a top view showing a state where the mountable shield electronic component 1 in FIG. 1 is viewed from above. (B)
[Fig. 4] is a right side view showing a state where the top view shown in (a) is viewed from the right side.
【図３】図１における実装型シールド電子部品１の第１
製造工程を示す説明図である。FIG. 3 is a first part of the mountable shield electronic component 1 in FIG.
It is explanatory drawing which shows a manufacturing process.
【図４】図１における実装型シールド電子部品１の第２
製造工程を示す説明図である。4 is a second view of the mountable shield electronic component 1 in FIG.
It is explanatory drawing which shows a manufacturing process.
【図５】図１における実装型シールド電子部品１の第３
製造工程を示す説明図である。5 is a third view of the mountable shield electronic component 1 in FIG.
It is explanatory drawing which shows a manufacturing process.
【図６】図１における実装型シールド電子部品１の第４
製造工程を示す説明図である。FIG. 6 is a fourth view of the mountable shield electronic component 1 in FIG.
It is explanatory drawing which shows a manufacturing process.
【図７】従来例を斜め上方から見た状態を示す斜視図で
ある。FIG. 7 is a perspective view showing a conventional example as seen from diagonally above.
【図８】（ａ）は、図７における実装型シールド電子部
品１１を上面から見た状態を示す上面図である。（ｂ）
は、（ａ）に示す上面図を右側面から見た状態を示す右
側面図である。FIG. 8A is a top view showing a state where the mountable shield electronic component 11 in FIG. 7 is viewed from above. (B)
[Fig. 4] is a right side view showing a state where the top view shown in (a) is viewed from the right side.
【図９】図８に示す実装型シールド電子部品１１を組み
立てる状態を示す説明図である。FIG. 9 is an explanatory diagram showing a state in which the mountable shield electronic component 11 shown in FIG. 8 is assembled.
１ 実装型シールド電子部品 ２ ベース部材 ２ａ スルーホール ２ｂ 配線パターン ３ シールド部材 ３ａ 窓部 ３ｂ スルーホール逃げ部 ３ｃ 凹部 ３ｄ レジスト被膜 ４ ＩＣ素子 ５ コンデンサ ６ 液状樹脂 ６ａ 樹脂 1 Mounted shielded electronic components 2 Base member 2a through hole 2b wiring pattern 3 Shield member 3a window 3b Through hole relief 3c recess 3d resist coating 4 IC element 5 capacitors 6 Liquid resin 6a resin
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成１３年７月５日（２００１．７．５）[Submission date] July 5, 2001 (2001.7.5)
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】図面[Document name to be corrected] Drawing
【補正対象項目名】図９[Correction target item name] Figure 9
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図９】 [Figure 9]
フロントページの続き (72)発明者 小島 勉 岩手県盛岡市みたけ５丁目２番15号 株式 会社シチズン岩手内 Ｆターム(参考） 4M109 AA01 BA03 CA02 DB10 EE07 GA02 5E321 AA01 GG05 5F061 AA01 BA03 CA02 FA02 Continued front page (72) Inventor Tsutomu Kojima 5-21 Mitake, Morioka, Iwate Stock Company citizen Iwatenai F-term (reference) 4M109 AA01 BA03 CA02 DB10 EE07 GA02 5E321 AA01 GG05 5F061 AA01 BA03 CA02 FA02
Claims (4)
属からなるシールド部材によりシールドされた実装型シ
ールド電子部品において、エンボス加工により凹部を成
形したシールド部材の該凹部に液状の樹脂を流し込み、
該凹部の樹脂の中にベース部材に取りつけられた前記電
子素子をいれて、前記シールド部材と前記ベース部材と
を固着したことを特徴とする実装型シールド電子部品。1. A mounting type shield electronic component in which an electronic element for mounting on a circuit board is shielded by a shield member made of metal, and a liquid resin is poured into the recess of a shield member having a recess formed by embossing,
A mountable shielded electronic component, characterized in that the electronic element mounted on a base member is put into the resin of the recess, and the shield member and the base member are fixed to each other.
属からなるシールド部材によりシールドすることにより
製造された実装型シールド電子部品の製造方法におい
て、前記電子素子をベース部材に取り付け、前記シール
ド部材の裏面にエンボス加工により凹部を形成し、該凹
部に液状の樹脂を流し込み該凹部の樹脂の中にベース部
材に取りつけられた前記電子素子をいれて硬化させた後
該シールド部材と前記ベース部材とを固着することによ
り製造することを特徴とする実装型シールド電子部品の
製造方法。2. A method of manufacturing a mountable shielded electronic component manufactured by shielding an electronic element for mounting on a circuit board with a shield member made of metal, wherein the electronic element is attached to a base member, and the shield member is provided. A recess is formed on the back surface of the recess by embossing, a liquid resin is poured into the recess, and the electronic element mounted on the base member is put into the resin of the recess and cured, and then the shield member and the base member A method for manufacturing a mountable shielded electronic component, which is characterized in that it is manufactured by fixing.
個分の前記電子素子を取り付け、前記シールド部材の素
材の裏面にエンボス加工により電子部品の複数個分の凹
部を形成し、該凹部に液状の樹脂を流し込み該凹部の樹
脂の中にベース部材に取りつけられた前記電子素子をい
れて硬化させて該シールド部材と前記ベース部材とを固
着した後、個別の電子部品に切断分離することにより製
造することを特徴とする請求項２記載の実装型シールド
電子部品の製造方法。3. A plurality of electronic components of the electronic component are attached to the material of the base member, and a recess for the plurality of electronic components is formed on the back surface of the material of the shield member by embossing, and the recess is formed in the recess. By pouring a liquid resin into the resin of the concave portion and hardening the electronic element attached to the base member to fix the shield member and the base member, by cutting and separating into individual electronic parts, 3. The method for manufacturing a mountable shielded electronic component according to claim 2, wherein the mountable shielded electronic component is manufactured.
を形成し、前記シールド部材の表面をエッチング処理し
て該シールド部材の不要部分を除去して成形することに
より製造することを特徴とする請求項２乃至３記載の実
装型シールド電子部品の製造方法。4. The manufacturing is performed by forming a resist coating on the surface of the shield member, etching the surface of the shield member to remove unnecessary portions of the shield member, and molding. 2. A method for manufacturing a mounted shielded electronic component according to any one of 2 to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001205456A JP2003023021A (en) | 2001-07-05 | 2001-07-05 | Mounted shield electronic component and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001205456A JP2003023021A (en) | 2001-07-05 | 2001-07-05 | Mounted shield electronic component and manufacturing method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003023021A true JP2003023021A (en) | 2003-01-24 |
Family
ID=19041761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001205456A Pending JP2003023021A (en) | 2001-07-05 | 2001-07-05 | Mounted shield electronic component and manufacturing method therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003023021A (en) |
-
2001
- 2001-07-05 JP JP2001205456A patent/JP2003023021A/en active Pending
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