JP2003017456A - Apparatus for treating substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for treating a substrate, capable of rapidly decomposing and removing organic matters adhered to the substrate. SOLUTION: The apparatus for treating the substrate holds the substrate W, in which the organic matter is adhered at a rotor 10 by a fixed substrate- holding member 12 and a movable substrate-holding member 15, provided at the rotor 10 and rotates the substrate in the direction of arrow A at a rotor shaft 18 as the axis. In the apparatus, a step of discharging a hydrogen peroxide water (in a spray state) from a hydrogen peroxide discharging mechanism 20 to the substrate W and thinning the water on the upper surface of the substrate W, and a step of thereafter simultaneously supplying ozone gas and pure water (spray state) from an ozone gas supply nozzle 30 and a pure water discharge mechanism 50 are repeated. Then, a large quantity of the ozone is supplied to the thinned peroxide water, to generate a large quantity of oxygen radicals, the large quantity of the radicals are supplied instantaneously to the organic matter, and matters adhered to the substrate W can be decomposed and removed rapidly.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an FPD (FlatPane) such as a semiconductor substrate or a glass substrate for a liquid crystal display device.
l Display) substrate, photomask glass substrate, optical disc substrate, etc. (hereinafter, simply referred to as “substrate”) by supplying ozone to the substrate, for example, to remove organic substances attached to the substrate. The present invention relates to a substrate processing apparatus.

[0002]

2. Description of the Related Art Conventionally, in a substrate manufacturing process,
A substrate cleaning process is indispensable. For example, for decomposition and removal of organic substances such as resist stripping in a photolithography process in a semiconductor device manufacturing process, a wet cleaning device is used to mix a sulfuric acid and hydrogen peroxide solution (hereinafter referred to as SPM). Has been used. However, since SPM is a deleterious substance and is used at high temperatures, a great deal of work is done to ensure safety. Further, it is difficult to treat the drainage of SPM after the substrate treatment, and the equipment and cost for drainage treatment are large.

Therefore, in recent years, in consideration of the environment, a device using ozone water has been proposed as a simple and safe cleaning device for decomposing and removing organic substances such as resist.
This apparatus is an apparatus that supplies ozone water to the surface of a substrate and oxidizes organic substances such as resist by ozone to decompose and remove the organic substances to clean the surface of the substrate. As is well known, ozone has an extremely strong oxidizing power, and such a strong oxidizing power of ozone is used for cleaning the substrate.

[0004]

However, the rate of oxidative decomposition reaction of organic substances such as resist by ozone water is
It is known to depend on the ozone concentration in the ozone water, but the solubility of ozone is uniquely determined by temperature and pressure. Therefore, even if saturated ozone water is used, there is a certain limit to the ozone concentration, and the decomposition / removal rate of organic substances cannot be increased beyond a certain level.

When the oxidative decomposition reaction of an organic substance by ozone water proceeds, O radicals and OH radicals (hereinafter referred to as oxygen radicals) generated by the decomposition of ozone control the rate of the oxidative decomposition reaction of the organic substance. However, in conventional cleaning equipment using ozone water, ozone water is simply supplied to the surface of the substrate, so a large amount of oxygen radicals generated by decomposition of ozone are generated. Moreover, it was not possible to instantaneously supply it to the surface of the substrate.

Due to various circumstances as described above, in the conventional ozone water cleaning, the decomposition / removal rate of organic substances cannot be increased to a certain level or higher, and as a result, the cleaning process takes a relatively long time. Therefore, there is a problem that the throughput of the apparatus is lowered.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing apparatus capable of rapidly decomposing and removing organic substances attached to a substrate.

[0008]

In order to solve the above problems, the invention of claim 1 is a substrate processing apparatus for performing a predetermined process on a substrate, comprising: (a) holding means for holding the substrate; (B) ozone supply means for supplying ozone to the substrate held by the holding means, and (c) hydrogen peroxide for supplying a solution containing hydrogen peroxide solution to the substrate held by the holding means. The hydrogen peroxide solution is supplied to the water supply means and (d) the substrate held by the holding means so that the hydrogen peroxide solution is supplied on the substrate held by the holding means. A first step of thinning the hydrogen oxide water, and a second step of supplying the ozone by the ozone supplying means from the hydrogen peroxide solution thinned on the substrate held by the holding means. Combination process including And a control means for repeating the operation.

The invention according to claim 2 is the substrate processing apparatus according to claim 1, wherein the ozone supply means comprises ozone gas supply means for supplying ozone gas to the substrate held by the holding means. Including.

Further, the invention of claim 3 is the substrate processing apparatus according to claim 2, wherein the ozone supply means supplies pure water to the substrate held by the holding means. In the second step, the ozone gas supply unit and the pure water supply unit simultaneously supply the ozone gas and the pure water in the second step.

Further, the invention of claim 4 is the substrate processing apparatus according to claim 3, wherein the deionized water supply means mist or steam the deionized water on the substrate held by the holding means. Means for supplying in the state of.

The invention according to claim 5 is the substrate processing apparatus according to claim 1, wherein the ozone supply means supplies ozone water to the substrate held by the holding means. Including means.

The invention according to claim 6 is the substrate processing apparatus according to claim 5, wherein the ozone supply means supplies the ozone gas to the substrate held by the holding means. Means further comprising the second
In the step, after the first step, the ozone water supply unit and the ozone gas supply unit perform the ozone water supply and the ozone water supply from the hydrogen peroxide solution thinned on the substrate held by the holding unit. Ozone gas is supplied at the same time.

Further, the invention of claim 7 is the substrate processing apparatus according to claim 5 or 6, wherein the ozone water supply means is provided on the substrate held by the holding means. A means for supplying the ozone water in the state of mist or steam is included.

The invention according to claim 8 is the substrate processing apparatus according to any one of claims 1 to 7, wherein the hydrogen peroxide solution supply means is the substrate held by the holding means. And means for supplying the solution containing the hydrogen peroxide solution in the state of mist or steam.

The invention according to claim 9 is the substrate processing apparatus according to any one of claims 1 to 8, further comprising rotating means for rotating the substrate held by the holding means, The control means drives the rotation means to rotate the substrate held by the holding means when repeating the combination process.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings.

<First Embodiment> FIG. 1 shows a first embodiment of the present invention.
FIG. 2 is a front view showing a main part configuration of the substrate processing apparatus of the embodiment, and FIG. 2 is a plan view showing a main part configuration of the substrate processing apparatus of the first embodiment. 1 and 2, an XYZ orthogonal coordinate system is attached in order to clarify their directional relationship.

The substrate processing apparatus of the first embodiment is the first step of supplying hydrogen peroxide solution to the substrate to thin the hydrogen peroxide solution on the substrate, and the hydrogen peroxide solution thinned on the substrate. Is a substrate cleaning apparatus that removes organic substances such as resist adhering to the substrate W by repeating a combination process including a second step of simultaneously supplying ozone gas and pure water from above. A hydrogen peroxide solution discharge mechanism 20, an ozone gas supply nozzle 30, and a pure water discharge mechanism 50 are provided. In addition, in the device corresponding to the present invention, processes in other modes besides the above-described combination process are possible as described later, and therefore the combination process here is referred to as “combination process (type 1)”. To

The chamber 5 is a substantially cylindrical processing chamber whose axis is horizontal (Y direction). On the upper part of the chamber 5, there is provided an auto cover 6 which can be opened and closed by moving up and down in the Z direction and horizontally moving in the X direction by an opening and closing means (not shown). In the state where the auto cover 6 is closed (the state shown in FIG. 1), the seal member 6a is provided between the auto cover 6 and the chamber 5, and the airtightness inside the chamber 5 is maintained. That is, the chamber 5 is a closed chamber.

A rotor 10 is provided inside the chamber 5. As shown in the figure, the rotor 10 has a structure in which two fixed substrate holding members 12 and two movable substrate holding members 15 are provided between a pair of "X-shaped" end plates 11. The fixed substrate holding member 12 has both ends fixed to the two end plates 11, and
A plurality of grooves each holding one substrate W are engraved. On the other hand, the movable substrate holding member 15 has two ends
The substrate W is connected to the end plates 11 so as to be rotatable about a rotation shaft 15a, and each of the end plates 11 includes one substrate W.
A plurality of grooves for holding are engraved. The movable substrate holding member 15 is configured to rotate by a link mechanism (not shown), and a position for pressing and holding the edge of the substrate W (solid line position in FIG. 1) and a position for releasing the substrate W. (Fig. 1
(The position indicated by the chain double-dashed line). Therefore, the substrate W can be reliably held by the link mechanism even when the rotor 10 rotates.

A rotor shaft 18 is fixed to the center of each of the two end plates 11. Rotor shaft 1
8 is rotatably provided with respect to the chamber 5 via a seal member 19. That is, the seal member 19 maintains the airtightness inside the chamber 5, and the rotor shaft 18 has its one end (the end opposite to the end fixed to the end plate 11) outside the chamber 5. It is connected to the provided motor M. With such a mechanism, the rotation of the motor M can rotate the rotor 10 and the plurality of substrates W held by the rotor 10. A balancer 13 is provided on each of the two end plates 11, and the rotor 10
The rotation balance during rotation is maintained.

Although not shown in the figure, below the chamber 5, there is provided a substrate elevating mechanism for delivering the substrate W to the substrate transfer robot via the auto cover 6 before and after the cleaning process is started. Further, in order to drain the contaminated processing liquid generated after the substrate processing, the chamber 5
A drainage port 7 is provided below, and a drainage processing mechanism, which is omitted in the figure, is provided outside the drainage port 7.

Above the inside of the chamber 5, a hydrogen peroxide solution discharge mechanism 20, an ozone gas supply nozzle 30, and a pure water discharge mechanism 50 are provided. The hydrogen peroxide solution discharge mechanism 20 is connected to the hydrogen peroxide solution supply source 22 via a first pipe 25, and the first pipe 25 is provided with a first
A pump 23 and a first valve 24 are provided. The ozone gas supply nozzle 30 includes an ozone gas supply source 32 and a second
It is connected via a pipe 35, and a second valve 34 is provided in the middle of the second pipe 35. The pure water discharge mechanism 50 is connected to a pure water supply source 52 via a third pipe 55, and a third pump 53 and a third valve 54 are provided in the middle of the third pipe 55. There is.

The hydrogen peroxide solution discharge mechanism 20 includes the rotor 10
It is a mechanism for ejecting hydrogen peroxide solution onto the substrate W held by, and is provided with a hydrogen peroxide solution ejection nozzle 21. The hydrogen peroxide solution discharge nozzle 21 is a hollow tubular member extending along the Y direction and has a plurality of hydrogen peroxide solution discharge holes 21a arranged at equal intervals in the Y direction. The intervals at which the plurality of hydrogen peroxide discharge holes 21a are arranged are the intervals between the holding grooves formed in the fixed substrate holding member 12 and the movable substrate holding member 15, that is, the plurality of holding grooves held by the rotor 10. The interval is equal to the array interval of the substrates W.

The hydrogen peroxide discharge nozzle 21 is the rotor 1
It is a spray type nozzle that sprays hydrogen peroxide solution onto the main surface of each of the plurality of substrates W held at 0. The hydrogen peroxide solution discharge nozzle 21
Is not limited to a spray type nozzle, and may be a straight type nozzle that discharges hydrogen peroxide solution in a straight line (rod shape) or a shower type nozzle that discharges hydrogen peroxide solution in a shower shape. It may be a nozzle or a steam type nozzle that discharges hydrogen peroxide solution in a vapor state. Further, the interval at which the hydrogen peroxide solution discharge holes 21a are arranged is not limited to the same interval as the arrangement interval of the plurality of substrates W held by the rotor 10, and the plurality of substrates held by the rotor 10 are not limited to the same. Different intervals may be used as long as hydrogen peroxide water can be supplied to all the main surfaces of W.

The ozone gas supply nozzle 30 is used for the rotor 10.
This is a mechanism for supplying the ozone gas to the substrate W held by. The ozone gas supply nozzle 30 is a hollow tubular member extending along the Y direction, and has a plurality of ozone gas discharge holes 30a arranged at equal intervals in the Y direction. The intervals at which the plurality of ozone gas discharge holes 30a are arranged are the intervals between the holding grooves formed in the fixed substrate holding member 12 and the movable substrate holding member 15, that is, the plurality of substrates W held by the rotor 10. The interval is equal to the array interval.

The ozone gas supply nozzle 30 includes the rotor 10
It is a nozzle that discharges ozone gas onto the main surface of each of the plurality of substrates W held by the. The intervals of the ozone gas discharge holes 30a are not limited to the intervals equal to the arrangement intervals of the plurality of substrates W held by the rotor 10, but all the main surfaces of the plurality of substrates W held by the rotor 10 are arranged. On the other hand, different intervals may be used as long as ozone gas can be supplied.

The pure water discharge mechanism 50 is a mechanism for discharging pure water onto the substrate W held by the rotor 10, and includes a pure water discharge nozzle 51. The pure water discharge nozzle 51 is a hollow tubular member extending along the Y direction and has a plurality of pure water discharge holes 51a arranged at equal intervals in the Y direction. The intervals at which the plurality of pure water discharge holes 51a are arranged are the intervals between the holding grooves formed in the fixed substrate holding member 12 and the movable substrate holding member 15, that is, the plurality of substrates W held by the rotor 10. The interval is equal to the array interval of.

The deionized water discharge nozzle 51 is a spray type nozzle that discharges ozone water in the form of a spray onto the main surface of each of the plurality of substrates W held by the rotor 10. The pure water discharge nozzle 51 is not limited to a spray type nozzle, and may be a straight type nozzle that discharges pure water in a straight line (rod shape) or may discharge pure water in a shower shape. It may be a shower type nozzle or a steam type nozzle that discharges pure water in a vapor state. In addition, the pure water discharge hole 51
The intervals at which a is arranged are not limited to the intervals equal to the arrangement intervals of the plurality of substrates W held by the rotor 10, but for all the main surfaces of the plurality of substrates W held by the rotor 10. Different intervals may be used as long as pure water can be supplied.

The substrate processing apparatus of this embodiment includes the control unit 1
Is provided. The control unit 1 includes a first valve 24, a second valve
The valve 34, the third valve 54, and the motor M are electrically connected. The control unit 1 is configured by using a computer including a memory and a CPU. The control unit 1 controls the supply of hydrogen peroxide solution, pure water, and ozone gas to the substrate W to which the organic substance adheres, and also controls the rotation of the substrate W according to the processing software describing a predetermined processing procedure. . More precisely, the control unit 1 controls the opening and closing of the first valve 24, the second valve 34, and the third valve 54 in accordance with the processing procedure described in the above-mentioned processing software, thereby adhering the organic matter. The fixed type provided on the rotor 10 that is rotatable by the rotation of the motor M by controlling the rotation of the motor M while controlling the supply of hydrogen peroxide solution, pure water, and ozone gas to the substrate W Substrate holding member 12 and movable substrate holding member 1
The rotation of the substrate W held at 5 is controlled.

In the present embodiment, the rotor 10
The fixed-type substrate holding member 12 and the movable-type substrate holding member 15 provided on the substrate correspond to holding means for holding the substrate W, and the ozone gas supply nozzle 30 is held by the holding means.
Corresponds to ozone gas supply means for supplying ozone gas to
The hydrogen peroxide solution discharge mechanism 20 corresponds to a hydrogen peroxide solution supply means for supplying a solution containing hydrogen peroxide solution to the substrate W held by the holding means, and the pure water discharge mechanism 50 is held by the holding means. It corresponds to pure water supply means for supplying pure water to W, and ozone gas supply nozzle 30 and pure water discharge mechanism 50 correspond to ozone supply means for supplying ozone to the substrate W held by the holding means. Moreover, the control unit 1 corresponds to a control unit that repeats the above-described combination process (type 1). Further, the control unit 1 also corresponds to a unit that controls the rotation of the substrate W held by the holding unit by the rotating unit when repeating the combination process (Type 1), and is rotated by the rotation of the motor M. 10 corresponds to a rotating means.

Next, the procedure for cleaning the substrate W to which organic substances such as resist adhere in the substrate processing apparatus of this embodiment will be described. First, although not shown in the drawing, the substrate W on which the organic substances such as resist are attached is removed by the substrate transfer robot and the substrate elevating mechanism that transfers the substrate W through the auto cover 6 provided above the chamber 5. It is passed to the rotor 10. At this time, the end edges of the substrates W fit into the grooves formed in the two fixed substrate holding members 12 of the rotor 10, and the plurality of substrates W are held in a standing posture with a predetermined space therebetween. .

After that, the plurality of substrates W held by the two fixed substrate holding members 12 are reliably held by the rotor 10 by the rotation of the two movable substrate holding members 15. That is, by rotating the two movable substrate holding members 15 from the two-dot chain line position in FIG. 1 to the solid line position, the edge of the substrate W fits into the groove formed in the movable substrate holding member 15, The plurality of substrates W are reliably held at four points by the two fixed substrate holding members 12 and the two movable substrate holding members 15.

After that, after the auto cover 6 is closed and the airtightness inside the chamber 5 is made sufficient, the substrate W is rotated by the motor M according to the processing software describing the predetermined processing procedure of the controller 1. Rotation of rotor 1
The rotation of 0 in the direction of arrow A is started.

Next, according to the processing software describing the predetermined processing procedure of the control unit 1, hydrogen peroxide solution and
Ozone gas and pure water are supplied to the substrate W. Regarding the procedure for supplying the hydrogen peroxide solution, the ozone gas, and the pure water to the substrate W, FIGS.
Will be described with reference to.

FIG. 3 shows the substrate W on which the resist R is attached.
The surface of the substrate W on which the resist R is attached is rotated by the rotation of the motor M in the direction of arrow A of the rotor 10 which is also shown in FIG.

Next, as shown in FIG. 4, hydrogen peroxide solution HP (spray) is discharged from the hydrogen peroxide solution discharge mechanism 20 onto the main surface of the rotating substrate W (that is, the upper surface of the resist R). Hydrogen peroxide solution HP discharged onto the upper surface of the resist R
Is thinned on the upper surface of the resist R by the centrifugal force generated by the rotation of the substrate W. Then, the discharge of the hydrogen peroxide solution HP from the hydrogen peroxide solution discharge mechanism 20 is stopped.

Next, as shown in FIG. 5, the main surface of the substrate W rotating from the ozone gas supply nozzle 30 and the pure water discharge mechanism 50 (that is, the hydrogen peroxide solution HP thinned on the upper surface of the resist R). Ozone gas OG and pure water (sprayed) WM are simultaneously supplied to the upper surface). In addition, ozone gas OG
When the pure water (spray state) WM and the pure water (spray state) WM are simultaneously supplied, the ozone gas OG dissolves in the pure water (spray state) WM and the ozone water OW
Becomes Therefore, ozone is the state of ozone water OW,
The ozone gas OG is supplied to the upper surface of the hydrogen peroxide solution HP thinned in two states, that is, the state in which the ozone gas OG remains as it is.

Then, as shown in FIGS. 3 to 5, hydrogen peroxide solution HP (spray) is ejected from the hydrogen peroxide solution ejecting mechanism 20 onto the upper surface of the resist R so that the upper surface of the resist R is not exposed. A step of thinning the hydrogen oxide water HP, and then pure water (sprayed) WM from the pure water discharge mechanism 50 and the ozone gas supply nozzle 30 to the upper surface of the hydrogen peroxide solution HP thinned on the upper surface of the resist R. And the step of simultaneously supplying the ozone gas OG are repeated, and the resist R attached to the substrate W is decomposed and removed by oxidation, and the substrate W is washed.

FIG. 6 shows the hydrogen peroxide solution H in this embodiment.
P (spray), ozone gas OG, pure water (spray) W
7 shows a timing chart in which M and M are supplied to the substrate W.
From time t1 to time t2, the hydrogen peroxide solution discharge mechanism 20 discharges hydrogen peroxide solution HP onto the main surface of the rotating substrate W to which the resist R is attached (the upper surface of the rotating resist R).
(Sprayed) is discharged, and the hydrogen peroxide solution HP is thinned on the upper surface of the resist R by rotation. After that, time t2
From time t3 to time t3, pure water (spray) WM and ozone gas OG are simultaneously supplied to the upper surface of the hydrogen peroxide solution HP thinned on the upper surface of the resist R from the pure water discharge mechanism 50 and the ozone gas supply nozzle 30. To be done.

Next, from time t3 to time t4, the hydrogen peroxide solution discharge mechanism 2 is applied to the upper surface of the rotating resist R.
Hydrogen peroxide solution HP (spray state) is discharged from 0. Then, from time t4 to time t5, pure water (sprayed) WM is applied from the pure water discharge mechanism 50 and the ozone gas supply nozzle 30 to the upper surface of the hydrogen peroxide solution HP thinned by rotation on the upper surface of the resist R. And ozone gas OG are simultaneously supplied. In this way, the hydrogen peroxide solution HP (sprayed) is discharged onto the upper surface of the substrate W on which the organic matter such as the rotating resist R adheres, and the hydrogen peroxide solution HP is discharged on the upper surface of the resist R.
Is thinned and then pure water (sprayed) W
The step of simultaneously supplying M and ozone gas OG is repeated a plurality of times to decompose and remove the resist R attached to the substrate W.

Conventionally, since ozone water is simply supplied to the upper surface of the substrate on which organic substances such as resist are attached,
As described above, it was not possible to instantaneously supply a large amount of oxygen radicals generated by the decomposition of ozone to the substrate.

On the other hand, in this embodiment, hydrogen peroxide solution HP (spray) is ejected from the hydrogen peroxide solution ejecting mechanism 20 onto the upper surface of the rotating resist R so that the upper surface of the resist R is peroxidized. The step of thinning the hydrogen water HP and the step of simultaneously supplying pure water (sprayed) WM and ozone gas OG from the pure water discharge mechanism 50 and the ozone gas supply nozzle 30 are repeated, and the thin film is formed on the upper surface of the resist R. Ozone is supplied to the upper surface of the hydrogenated aqueous solution HP. As a result, the decomposition of ozone in contact with the hydrogen peroxide solution HP is promoted to instantly generate a large amount of oxygen radicals, and a large amount of oxygen radicals are instantaneously supplied to the resist R attached to the substrate W. Therefore, since a large amount of oxygen radicals are instantaneously supplied near the upper surface of the resist R, a large amount of oxygen radicals are instantaneously supplied to the upper surface of the resist R as well. Organic matter can be decomposed and removed quickly.

As described above, in the present embodiment, the decomposition / removal rate of organic substances such as the resist R is higher than that when only ozone water is simply supplied to the upper surface of the organic substances attached to the substrate W. Remarkably large organic substances such as the resist R attached to the substrate W can be quickly removed.

After ozone is decomposed to generate oxygen radicals, the oxygen radicals naturally decrease in a short time without reacting with organic substances such as resist. That is, since the life of oxygen radicals is very short, when the hydrogen peroxide solution and ozone are mixed and supplied to the organic substance such as the resist R attached to the substrate W in advance, the hydrogen peroxide solution and ozone are mixed. Oxygen radicals generated when mixed are reduced by the time they reach the upper surface of the organic material such as the resist R. as a result,
A large amount of oxygen radicals cannot be instantaneously supplied to the upper surface of the organic material such as the resist R. Therefore, even if the hydrogen peroxide solution and ozone are mixed and supplied to the organic substances such as the resist R attached to the substrate W in advance, the resist R attached to the substrate W in the present embodiment is compared.
It is possible to quickly decompose and remove organic substances such as.

<Second Embodiment> Next, a second embodiment of the present invention will be described. 7 and 8 are a front view and a plan view showing the main configuration of the substrate cleaning apparatus according to the second embodiment of the present invention. In the substrate cleaning apparatus of the second embodiment, the hydrogen peroxide solution is supplied to the upper surface (upper surface of the organic material) of the rotating substrate W to which the organic material such as resist adheres, and the hydrogen peroxide solution is thinned on the upper surface of the organic material. A combination process (type 2) including steps and a second step of supplying ozone water in which ozone and pure water are mixed in advance to the upper surface of the thinned hydrogen peroxide solution is repeated.

The substrate processing apparatus of the second embodiment differs from the substrate processing apparatus of the first embodiment in that the ozone gas supply nozzle 30, the ozone gas discharge hole 30a, and the ozone gas supply source 32 provided in the first embodiment are used. A second valve 34, a second pipe 35, a pure water discharge mechanism 50, a pure water discharge nozzle 51, a pure water discharge hole 51a, a pure water supply source 52, a third pump 53, and a third valve. 54 and the third pipe 55 are eliminated, and instead, in the second embodiment, an ozone water discharge mechanism 70, an ozone water discharge nozzle 71, an ozone water discharge hole 71a, and an ozone water supply source are provided above the chamber 5. 72, the seventh pump 73, and the seventh valve 7
4 and the seventh pipe 75 are provided.

The ozone water discharge mechanism 70 is connected to an ozone water supply source 72 via a seventh pipe 75, and its seventh
A seventh pump 73 and a seventh valve 74 are provided in the middle of the pipe 75.

The ozone water discharge mechanism 70 is a mechanism for discharging ozone water onto the substrate W held by the rotor 10, and is provided with an ozone water discharge nozzle 71. The ozone water discharge nozzle 71 is a hollow tubular member extending along the Y direction,
A plurality of ozone water discharge holes 7 arranged at equal intervals in the Y direction
1a is provided. The interval at which the plurality of ozone water discharge holes 71a are arranged is the interval between the holding grooves formed in the fixed substrate holding member 12 and the movable substrate holding member 15, that is, the plurality of substrates W held by the rotor 10. The interval is equal to the array interval of.

The ozone water discharge nozzle 71 is a spray type nozzle that discharges ozone water in the form of a spray onto the main surface of each of the plurality of substrates W held by the rotor 10. The ozone water discharge nozzle 71 is not limited to a spray type nozzle, and may be a straight type nozzle that discharges ozone water in a straight line (rod shape) or may discharge ozone water in a shower shape. It may be a shower type nozzle or a steam type nozzle that discharges ozone water in a vapor state.
The interval at which the ozone water discharge holes 71a are arranged is
The interval is not limited to the same as the arrangement interval of the plurality of substrates W held by the rotor 10, and any ozone water can be supplied to all the main surfaces of the plurality of substrates W held by the rotor 10. For example, the intervals may be different.

The configuration other than the above (for example, the rotor 10) is the same as that of the first embodiment, and the description thereof is omitted.

In the second embodiment, the ozone water discharge mechanism 70 supplies ozone water to the substrate W held by the holding means and supplies ozone to the ozone water supply means and the substrate W held by the holding means. Since it corresponds to ozone supply means, the procedure for cleaning the substrate W to which organic substances such as resist adhere in the substrate processing apparatus of the second embodiment is the same as the substrate W to which organic substances such as resist adhere in the substrate processing apparatus of the first embodiment. The procedure is slightly different from the cleaning procedure.
Hereinafter, regarding the cleaning processing procedure of the substrate W to which the organic matter such as resist adheres in the substrate processing apparatus of the second embodiment, the cleaning processing procedure of the substrate W to which the organic matter such as resist adheres in the substrate processing apparatus of the first embodiment (Fig. 3 to FIG. 6) for reference.

According to the processing software describing the predetermined processing procedure of the controller 1, the processing procedure is the same as that of the first embodiment until before the hydrogen peroxide solution is first supplied to the substrate W. The description is omitted.

In the second embodiment, the hydrogen peroxide solution discharge mechanism 20 and the ozone water discharge mechanism 70 are processed according to the processing software describing the predetermined processing procedure of the control unit 1.
From this, hydrogen peroxide water (spray) and ozone water (spray) are supplied to the substrate W to which organic substances such as resist adhere. Regarding the procedure of discharging the hydrogen peroxide solution from the hydrogen peroxide solution discharging mechanism 20 to the substrate W, the first embodiment (FIGS. 3 to 6) will be described.
Form), and the procedure for ejecting ozone water from the ozone water ejection mechanism 70 to the substrate W is as follows.
Pure water in the embodiment (forms of FIGS. 3 to 6) is the substrate W.
The procedure is the same as that of discharging to. That is, the step of supplying pure water and ozone gas at the same time in the first embodiment (the embodiment of FIGS. 3 to 6) is the step of supplying ozone water in the second embodiment. That is, in the substrate processing apparatus of the second embodiment, the substrate W on which organic substances such as resist adhere is rotated, and hydrogen peroxide solution is discharged onto the upper surface of the substrate W on which organic substances such as resist adhere to generate hydrogen peroxide. The step of thinning water on the substrate W and the step of supplying ozone water thereafter are repeated a plurality of times to decompose and remove organic substances such as resist adhered to the substrate W.

In the first embodiment, the ozone gas supply nozzle 3 is attached to the substrate W to which organic substances such as resist adhere.
0 and the pure water discharge mechanism 50 simultaneously supply ozone gas and pure water to supply ozone to the substrate W. In the second embodiment, ozone water is discharged onto the substrate W to which organic substances such as resist adhere. Ozone water in which ozone and pure water are mixed in advance is supplied from the mechanism 70. Therefore, by generating ozone water having a high ozone concentration in advance and supplying it to the substrate W, the oxidative decomposition reaction can be performed by the ozone water having a higher ozone concentration than the first embodiment, and the resist or the like attached to the substrate W The organic substances can be decomposed and removed more quickly.

<Modification> The embodiment of the present invention has been described above, but the present invention is not limited to the above example. For example, in the first embodiment, a pure water discharge mechanism 50, a pure water discharge nozzle 51, a pure water discharge hole 51a,
Pure water supply source 52, third pump 53, third valve 54
Alternatively, the third pipe 55 may be omitted, and the ozone supply means may be only the ozone gas supply nozzle 30. Instead of supplying pure water from the pure water discharge mechanism 50 in the first embodiment, ozone water is supplied. You may do it.

Further, in either the first embodiment or the second embodiment, the substrate W to which the organic substance such as resist is attached is rotated by the rotation of the motor M in the direction of arrow A of the rotor 10. However, not limited to this, the hydrogen peroxide solution is discharged onto the main surface of the substrate W (that is, the upper surface of the organic material such as the resist) to which the organic material such as the resist adheres, and the hydrogen peroxide solution is discharged onto the upper surface of the organic material such as the resist. If W is thinned, the substrate W may not be rotated. That is, in either the first embodiment or the second embodiment, the hydrogen peroxide solution is thinned on the upper surface of the substrate W (the upper surface of the organic material such as the resist) on which the organic material such as the resist adheres. A form in which a combination process including a first step of discharging hydrogen oxide water and a second step of supplying ozone to the upper surface of hydrogen peroxide solution thinned on the upper surface of an organic material such as a resist is repeated Anything will do.

Further, in either the first embodiment or the second embodiment, the hydrogen peroxide solution was discharged from the hydrogen peroxide solution discharge mechanism 20, but the invention is not limited to this, and the peroxide solution is not used. The liquid discharged from the hydrogen water discharging mechanism 20 may be a solution containing hydrogen peroxide water.

Further, in either the first embodiment or the second embodiment, the shape of the end plate 11 of the rotor 10 is “X-shaped”, and the end plate 11 is provided on the rotor 10.
The substrate W was held at four points by one fixed substrate holding member 12 and two movable substrate holding members 15,
It is not limited to this. The shape of the end plate 11 may be, for example, a “Y-shaped” shape, and may be a shape that holds the substrate W at three points, or a shape that supports the substrate W at five or more points. May be. In other words, the minimum requirement for the end plate 11 is the rotor shaft 18
Is a connecting member that connects the rotation center where is fixedly installed and the erected position where the holding means (the fixed substrate holding member 12 and the movable substrate holding member 15) are erected, and using such a connecting member If it is formed, it can be applied to the substrate processing apparatus according to the present invention.

Further, in either the first embodiment or the second embodiment, during the holding / processing of the substrate W,
The plurality of substrates W are held in an upright state (substantially vertical), but the present invention is not limited to this, and may be held at an angle or may be held substantially horizontal.

Further, in either the first embodiment or the second embodiment, the cleaning process of the substrate W is performed after the substrate W is held by the rotor 10 and the airtightness inside the chamber 5 is made sufficient. However, the present invention is not limited to this, and may be such that the airtightness inside the chamber 5 is not sufficient.

Further, in either the first embodiment or the second embodiment, a plurality of substrates W are collectively processed, but the present invention is not limited to this, and each substrate W is processed one by one. It may be in the form of processing.

[0064]

As described above, according to the first aspect of the present invention, the substrate held by the holding means is supplied with the hydrogen peroxide solution by the hydrogen peroxide solution supply means and is held by the holding means. The first step of thinning the hydrogen peroxide solution on the substrate, and the second step of supplying ozone by the ozone supply means from the thinned hydrogen peroxide solution on the substrate held by the holding means. By repeating the combination process including ozone, ozone is brought into contact with the hydrogen peroxide solution thinned on the substrate, the decomposition of ozone is promoted, a large amount of oxygen radicals are generated, and the organic substances attached to the substrate are removed. Since a large amount of oxygen radicals can be instantaneously supplied, organic substances attached to the substrate can be rapidly decomposed and removed.

According to the second aspect of the present invention, ozone supply means for supplying ozone gas is provided as ozone supply means, and ozone is supplied by ozone gas from above the hydrogen peroxide solution thinned on the substrate. By supplying ozone, a large amount of ozone can be supplied from above the hydrogen peroxide solution thinned on the substrate without washing away the hydrogen peroxide solution thinned on the substrate.

According to the third aspect of the invention, as the ozone supply means, an ozone gas supply means for supplying ozone gas and a pure water supply means for supplying pure water are provided, and the peroxidation thinned on the substrate is performed. By simultaneously supplying ozone gas and pure water from above the hydrogen water, ozone is dissolved in the pure water and supplied from above the hydrogen peroxide solution that is thinned on the substrate. Since the frequency of mixing and contact between the hydrogen peroxide solution and ozone increases, a large amount of oxygen radicals can be instantly generated.

Further, according to the invention of claim 4, as the ozone supply means, an ozone gas supply means for supplying ozone gas and a pure water supply means for supplying pure water are provided.
The pure water supply means supplies the pure water in the form of mist or steam, and when supplying ozone gas and pure water simultaneously from the hydrogen peroxide solution thinned on the substrate, the mist or steam is supplied. Ozone is quickly dissolved in pure water in the state of, and ozone is supplied by supplying ozone water in the state of mist or steam in which a large amount of ozone is dissolved from above the hydrogen peroxide solution thinned on the substrate. By doing so, a large amount of ozone can be instantaneously supplied to the hydrogen peroxide solution thinned on the substrate, while the hydrogen peroxide solution thinned on the substrate is hardly washed away.

According to the fifth aspect of the present invention, ozone water supply means for supplying ozone water is provided as ozone supply means, and ozone having a high ozone concentration is formed on the hydrogen peroxide solution thinned on the substrate. By supplying water, a larger amount of ozone can be instantaneously supplied to the hydrogen peroxide solution formed into a thin film on the substrate.

Further, according to the invention of claim 6, as the ozone supply means, the ozone water supply means for supplying the ozone water and the ozone gas supply means for supplying the ozone gas are provided, so that a larger amount of ozone is instantaneously added to the substrate. It can be supplied from above the hydrogen peroxide solution thinned.

Further, according to the invention of claim 7, as the ozone supply means, only ozone water supply means for supplying ozone water, or only ozone water supply means and ozone gas supply means for supplying ozone gas are provided. The ozone water supply means supplies the ozone water in the state of mist or steam. By supplying the ozone water, a large amount of ozone is supplied to the substrate without washing away the hydrogen peroxide solution thinned on the substrate. It is possible to instantly supply to the hydrogen peroxide solution that has been thinned above.

Further, according to the invention of claim 8, the hydrogen peroxide solution supply means uniformly supplies the hydrogen peroxide solution onto the substrate in order to supply the hydrogen peroxide solution in the state of mist or steam. However, it is possible to form a thin film of hydrogen peroxide solution uniformly on the substrate, and by supplying ozone to the hydrogen peroxide solution that is uniformly thinned on the substrate, a large amount of oxygen radicals are attached to the substrate. It is possible to uniformly and instantly supply the formed organic matter.

Further, according to the invention of claim 9, it is provided with a rotating means for rotating the substrate on which the organic substance is adhered, and by rotating the substrate by the rotating means, the hydrogen peroxide solution supplied onto the substrate is made more uniform. And it is possible to make the film extremely thin, and by supplying ozone to the hydrogen peroxide solution that is uniformly and extremely thin on the substrate, a large amount of oxygen radicals can be made more uniform with respect to the organic substances attached to the substrate. Moreover, it can be supplied very instantly, and the organic substances attached to the substrate can be decomposed and removed more quickly.

[Brief description of drawings]

FIG. 1 is a front view showing a main configuration of a substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view of the substrate processing apparatus of FIG.

FIG. 3 is a diagram showing a state in which a substrate to which a resist is attached is rotated in the first embodiment.

FIG. 4 is a diagram showing a state in which hydrogen peroxide solution is being supplied to a substrate on which a rotated resist is attached in the first embodiment.

FIG. 5 is a diagram showing a state in which ozone gas and pure water are being supplied to a substrate on which a resist is rotated, in the first embodiment.

FIG. 6 is a timing chart in which hydrogen peroxide solution, ozone gas, and pure water are supplied to the substrate in the first embodiment.

FIG. 7 is a front view showing a main configuration of a substrate processing apparatus according to a second embodiment of the present invention.

8 is a plan view of the substrate processing apparatus of FIG.

[Explanation of symbols]

1 control unit 5 chambers 10 rotor 11 End plate 12 Fixed type substrate holding member 15 Movable substrate holding member 20 Hydrogen peroxide water discharge mechanism 30 Ozone gas supply nozzle 50 Pure water discharge mechanism 70 Ozone water discharge mechanism M motor W board R resist HP Hydrogen peroxide water OG ozone gas WM Pure water (spray) OW ozone water

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masato Tanaka             4-chome Tenjin, which runs up to Teranouchi, Horikawa-dori, Kamigyo-ku, Kyoto             1 Kitamachi No. 1 Dai Nippon Screen Manufacturing Co., Ltd.             Inside the company F-term (reference) 2H088 FA21 FA30 MA20                 2H090 JB02 JC19                 3B201 AA01 AB33 AB44 BB11 BB21                       BB92 BB93 BB96

Claims (9)

[Claims] 1. A substrate processing apparatus for performing a predetermined process on a substrate, comprising: (a) holding means for holding the substrate; and (b) ozone for supplying ozone to the substrate held by the holding means. Supply means, (c) a hydrogen peroxide solution supply means for supplying a solution containing hydrogen peroxide solution to the substrate held by the holding means, and (d) the substrate held by the holding means, A first step of supplying the hydrogen peroxide solution by the hydrogen peroxide solution supply means to form a thin film of the hydrogen peroxide solution on the substrate held by the holding means; Control means for repeating a combination process including a second step of supplying the ozone by the ozone supply means on the hydrogen peroxide solution thinned on the substrate. Group Processing apparatus. 2. The substrate processing apparatus according to claim 1, wherein the ozone supply unit includes an ozone gas supply unit that supplies ozone gas to the substrate held by the holding unit. Processing equipment. 3. The substrate processing apparatus according to claim 2, wherein the ozone supply means further comprises pure water supply means for supplying pure water to the substrate held by the holding means, In the second step, the ozone gas supply unit and the pure water supply unit simultaneously supply the ozone gas and the pure water, respectively. 4. The substrate processing apparatus according to claim 3, wherein the pure water supply means supplies the pure water in a mist or steam state to the substrate held by the holding means. A substrate processing apparatus comprising: 5. The substrate processing apparatus according to claim 1, wherein the ozone supply means includes ozone water supply means for supplying ozone water to the substrate held by the holding means. Substrate processing equipment. 6. The substrate processing apparatus according to claim 5, wherein the ozone supply means further comprises the ozone gas supply means for supplying the ozone gas to the substrate held by the holding means, In the second step, after the first step, the ozone water supply means and the ozone gas supply means generate the ozone water and the ozone water from the hydrogen peroxide solution thinned on the substrate held by the holding means. A substrate processing apparatus, wherein the ozone gas is supplied at the same time. 7. The substrate processing apparatus according to claim 5, wherein the ozone water supply unit mist or steam the ozone water on the substrate held by the holding unit. A substrate processing apparatus comprising: a supply unit in the state of. 8. The substrate processing apparatus according to claim 1, wherein the hydrogen peroxide solution supply unit is configured to apply the hydrogen peroxide solution to the substrate held by the holding unit. A substrate processing apparatus, characterized in that it includes means for supplying a solution containing the above in the state of mist or steam. 9. The substrate processing apparatus according to claim 1, further comprising a rotating unit that rotates the substrate held by the holding unit, wherein the control unit includes the combination. A substrate processing apparatus, characterized in that, when the process is repeated, the rotating means is driven to rotate the substrate held by the holding means.