JP4171642B2 - Substrate surface treatment equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate surface treatment apparatus, and more specifically, removes an object to be processed such as a photoresist film, an organic compound, or an inorganic compound on a semiconductor substrate, a glass substrate, or a printed board represented by IC, LSI, or the like. The present invention relates to a substrate surface processing apparatus for cleaning.
[0002]
[Prior art]
[Patent Document 1]
JP 2001-223206 A (page 4-6, FIG. 1)
[0003]
2. Description of the Related Art Conventionally, a substrate surface processing apparatus is used in, for example, a microfabrication process including a manufacturing process of a semiconductor device such as an IC or LSI, a photoresist film on a semiconductor substrate (silicon wafer, etc.), a glass substrate (LCD), a printed circuit board, or the like. It is employed for the operation of removing an object to be treated such as an organic compound or an inorganic compound, and a wet method using a chemical (for example, refer to Patent Document 1) or a dry method using oxygen plasma or the like is usually used. . FIG. 6 is a block diagram showing an embodiment of a conventional substrate surface processing apparatus using such a chemical wet method.
[0004]
As shown in FIG. 6, an embodiment of a conventional substrate surface treatment apparatus includes a treatment tank 30 that accommodates a substrate 1 and a base 36 on which the substrate 1 is placed via a flat plate heater 34 in the treatment tank 30. And a nozzle plate 32 that uniformly supplies a wet ozone (O ₃ ) gas to the processing surface of the substrate 1 by controlling the gas flow in the processing tank 30. Although not shown, the nozzle plate 32 circulates hot water or is provided with a heating mechanism such as a heater. Further, the nozzle plate 32 is connected to a humidifier 41 that humidifies ozone gas from the outside of the processing tank 30 and an ozone gas generator 42 that generates ozone gas by an air supply pipe 39, and the air supply pipe 39 is connected by a ribbon heater 43. It is formed so as to supply ozone gas by heating. Further, a nitrogen tank 46 for applying pressure, a pure water tank 44 for supplying pure water after the ozone treatment of the substrate 1, and a pump 45 for water supply are connected to the air supply pipe 39, respectively. The treatment tank 30 is provided with an exhaust pipe 37 for exhausting ozone gas and a valve 38 for adjusting the exhaust amount. In addition, materials with high ozone resistance, such as quartz glass and fluororesin, are used for the portions of each member that are directly exposed to ozone gas. Although not shown, an ozone decomposing device is coupled to the exhaust pipe 37.
[0005]
In one embodiment of the conventional substrate surface treatment apparatus formed as described above, the substrate 1 is first placed on the base 36 via the flat plate heater 34 and heated to a predetermined temperature by the flat plate heater 34. Further, the humidifier 41, the air supply tube 39, and the nozzle plate 32 are also heated in advance and stabilized at a temperature equal to or higher than the temperature set value of the substrate 1. When the temperature of the substrate 1 is stabilized, the ozone gas is passed through the humidifier 41 to mix humidity, and the wet ozone gas is supplied (sprayed) to the surface of the substrate 1 to decompose the processing object on the surface. Process. After the object to be processed is decomposed by the treatment for a predetermined time, the supply of the wet ozone gas is stopped, and a cleaning process for rinsing the surface of the substrate 1 using the pump 45 and the pure water tank 44 is performed. Etc. are removed. Next, the substrate 1 is dried by supplying nitrogen gas from the nitrogen cylinder 46.
[0006]
As described above, the conventional substrate surface treatment apparatus reduces the environmental pollution due to the chemical solution disposal by using ozone (O ₃ ) gas as the chemical for treating the surface of the substrate 1, and heats the flat plate heater 34 and the ribbon heater 43. By adjusting the temperature of the treatment tank 30 and ozone gas or the like to a certain condition by the source, good treatment has been realized.
[0007]
[Problems to be solved by the invention]
However, in the conventional substrate surface treatment apparatus, since the nozzle plate 32 in the treatment tank 30 is fixed, for example, the distance between the nozzle plate 32 and the substrate 1 is increased during chemical treatment with ozone gas in the treatment tank 30. When fixed in a state, there are problems that a lot of medicine is used and processing takes time.
In the conventional substrate surface processing apparatus, since the nozzle plate 32 is fixed in the processing tank 30 as described above, for example, the substrate 1 and the nozzle plate 32 are fixed to each other at the time of cleaning (rinsing) with pure water. When the distance is fixed in a narrow state for the chemical solution processing described above, it becomes difficult to clean the entire surface of the substrate 1 and contamination of the surface of the nozzle plate 32 causes water to be removed. There is a problem that the signal is transmitted to the substrate 1 through the substrate 1. In addition, the load resistance during rotation increases due to the viscosity of the liquid, and the holding force of the substrate 1 may be impaired, so that it may come off the base 36.
The present invention solves such problems, and provides a substrate surface treatment apparatus that can perform good treatment by adjusting the distance between the substrate and the nozzle plate in accordance with each treatment step such as ozone or pure water in a treatment tank. With the goal.
[0008]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the present invention is a substrate surface processing apparatus that performs chemical processing of a substrate surface with a chemical containing ozone and cleaning processing of the substrate with a cleaning liquid, and a holding unit that holds the substrate can be rotated. A lower base that is pivotally supported on the upper base, an upper base that is disposed above and below the lower base, and that is supported by the upper base and that extends on the substrate and ejects a medicine and a cleaning liquid, respectively. A nozzle plate is provided, and the distance between the nozzle plate and the substrate can be adjusted according to the chemical treatment or the cleaning treatment by making it possible to move up and down either one or both of the holding part and the nozzle plate supported by the upper base and the lower base. with adjustably provided Te, the nozzle plate comprises a first supply port for supplying the ozone gas and hot air, and a second supply port for supplying the ammonia gas and hot DIW, penetrating to the back side from the respective supply ports It is opposed to the substrate by providing a number of ejection holes.
[0009]
Here, it is preferable that the lower bases are fitted to each other by the upper bases moving up and down to seal the substrate inside. In addition, the substrate is treated with a chemical solution in a state where the distance between the nozzle plate and the substrate is reduced by reducing the distance between the nozzle plate and the substrate by the vertical movement of the nozzle plate or the holding unit, and then the distance is increased to increase the volume. It is preferable to wash with Further, it is preferable that the holding portion is provided so that the number of rotations for holding and rotating the substrate can be adjusted . Also, the nozzle plate, after treatment by supplying simultaneously or alternately with ammonia gas from the ozone gas and a second supply port from the first supply port as a medicament when chemical processing of the substrate, supplying hot air and hot DIW It is preferable to flush the ejection hole and perform this operation at least once. In another embodiment of the nozzle plate, only ozone gas from the first supply port is supplied as a chemical during the chemical treatment of the substrate, and then hot air is supplied to flush the ejection hole. It is preferable to perform more than once. The nozzle plate is preferably cleaned by supplying hot DIW from the second supply port as a cleaning liquid during the cleaning process after the chemical processing. Moreover, it is preferable that a nozzle plate supplies a hot air from a 1st supply port after a washing process, and dries a board | substrate. The nozzle plate is preferably provided with a heat source. In addition, the nozzle plate preferably has a plurality of water droplet prevention grooves that extend radially from the center toward the outside on the back surface facing the substrate and guide water droplets to the outer periphery. Moreover, it is preferable that an upper base has the curved surface formed in spherical shape toward the outer side at the lower end where a nozzle plate moves up and down, and it guide | induces a water droplet from the said nozzle plate to an outer peripheral wall. The lower base is preferably provided so that hot air can be supplied.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Next, an embodiment of a substrate surface treatment apparatus according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a configuration diagram showing an embodiment of a substrate surface treatment apparatus according to the present invention. FIG. 2 is a view showing a cross section taken along line AA shown in FIG. FIG. 3 is a view showing the bottom surface of the nozzle plate 14 shown in FIG. FIG. 4 is a view showing a water droplet removing operation by the groove 14b of the nozzle plate 14 shown in FIG. 5 is a diagram showing the processing operation of the substrate surface processing apparatus shown in FIG. 1, FIG. 5 (a) shows the operation during the chemical treatment, and FIG. 5 (b) shows the operation during the cleaning processing. Show.
[0011]
As shown in FIG. 1, one embodiment of the substrate surface treatment apparatus according to the present invention is a wet type that performs chemical treatment with a chemical containing ozone and cleaning treatment with pure water of a substrate, as in the prior art shown in FIG. The lower base 20 that rotatably supports a holding portion 22 that holds the substrate 1 with a vacuum suction pad and the upper portion of the lower base 20 is moved up and down. An upper base 10 and a nozzle plate 14 that is supported by the upper base 10 and extends on the substrate 1 to control the flow of ozone gas and pure water to eject each uniformly.
[0012]
Here, this embodiment differs from the prior art shown in FIG. 6 by allowing both the holding portion 22 and the nozzle plate 14 supported by the upper base 10 and the lower base 20 to move up and down. The distance between the nozzle plate 14 and the substrate 1 is provided so as to be adjustable according to the chemical processing or cleaning processing. The holding portion 22 and the nozzle plate 14 are not limited to being able to move both up and down. For example, only one of them can be moved up and down to adjust the distance between the nozzle plate 14 and the substrate 1. You may do it. The nozzle plate 14 is made of a material having high conduction heat and is provided with a heating source 12 at the top, a first supply port 16 for supplying wet ozone (O ₃ ) gas and hot air, and wet ammonia (NH ₃ ) A second supply port 18 for supplying gas and hot DIW (pure water) is provided.
[0013]
As shown in FIGS. 2 and 3, the first supply port 16 and the second supply port 18 are opposed to the substrate 1 by providing a plurality of ejection holes 14 a penetrating toward the back side of the nozzle plate 14. Further, as shown in FIG. 2, the nozzle plate 14 supplies ozone gas from the first supply port 16 and ammonia gas from the second supply port 18 simultaneously or alternately as chemicals during the chemical treatment of the substrate 1. After the treatment, hot air and hot DIW are supplied to flush the product remaining in the ejection holes 14a, and this operation is performed at least once. Here, supply of a chemical | medical agent is not limited to supplying ozone gas and ammonia gas from the 1st supply port 16 and the 2nd supply port 18, For example, only ozone gas is used with respect to the process body weak with respect to alkalinity. You may supply and process. In addition, the nozzle plate 14 supplies hot DIW from the second supply port 18 during the cleaning process after the chemical solution process, and also supplies hot air from the first supply port 16 to dry the substrate 1 after the cleaning process. . Further, as shown in FIG. 3, the nozzle plate 14 is formed with a plurality of water droplet prevention grooves 14 b that radially extend from the center to the outer side on the back surface facing the substrate 1 to guide water droplets to the outer periphery. ing. The grooves 14b are formed so that the number of grooves gradually increases from the center of the nozzle plate 14 toward the outer periphery. Therefore, as shown in FIG. 4, the nozzle plate 14 has a structure capable of guiding and discharging the water droplets 2 adhering to the bottom surface to the outside by a capillary phenomenon caused by the grooves 14a. In addition, the nozzle plate 14 is formed so as to be inclined with respect to a central ejection hole 14 a penetrating from the first supply port 16 and the second supply port 18 to the bottom, and the substrate 1 is rotated by the rotation of the holding unit 22. The surface is formed so that the medicine can be ejected toward the center where the medicine diffuses outward from the center.
[0014]
Referring to FIG. 2 again, the lower base 20 is formed so that the upper base 10 can move up and down to fit each other and seal the substrate 1 inside. Within this sealed interior, the substrate 1 is treated with a chemical solution in a state in which the distance between the nozzle plate 14 and the substrate 1 is reduced and the volume in the gap is reduced by the vertical movement of the nozzle plate 14 or the holding portion 22, and then this distance Washing is performed in a state where the volume is expanded by expanding Therefore, in the present embodiment, the nozzle plate 14 and the holding unit 22 are not fixed as in the prior art shown in FIG. 6, so that the substrate 1 and the nozzle plate 14 are changed according to each processing step such as chemical processing or cleaning processing. By adjusting the distance, it can be processed satisfactorily. Moreover, the holding part 22 is provided so that the rotation speed which hold | maintains and rotates the board | substrate 1 can be adjusted. The lower base 20 is provided with a supply port 20a for supplying hot air from the outside through the outside of the holding unit 22, and the inside of the lower base 20 is maintained at a constant temperature by supplying hot air. A chemical such as gas is prevented from escaping to the bottom of the substrate 1. In addition, the lower base 20 is provided with a discharge port 20b for exhausting or draining chemicals such as gas remaining in the interior after processing is completed or water droplets such as pure water. Further, the upper base 10 has a curved surface 10a formed in a spherical shape toward the outside at the lower end where the nozzle plate 14 shown in FIG. 4 moves up and down, and receives the water droplet 2 from the nozzle plate 14 by the curved surface 10a. It is provided in an easily accessible manner on the outer peripheral wall. Accordingly, the water droplet 2 is guided to the lower end along the inner wall of the upper base 10 without adhering to the substrate 1, and is discharged from the discharge port 20b of the lower base 20 shown in FIG.
[0015]
In one embodiment of the substrate surface treatment apparatus according to the present invention thus formed, first, after holding the substrate 1 with the vacuum suction pad of the holding unit 22 in a state where the upper base 10 and the lower base 20 are separated from each other, The substrate 1 is sealed (sealed) inside by lowering the upper base 10 and fitting it into the lower base 20. Then, hot air is supplied to the nozzle plate 14 from the first supply port 16 and the supply port 20 a of the lower base 20 to heat the inside in advance, and the temperature is stabilized to a temperature equal to or higher than the temperature setting value of the substrate 1. At this time, by moving up or down either one or both of the nozzle plate 14 and the holding portion 22 in the sealed interior, the distance between the substrate 1 and the nozzle plate 14 is narrowed so that the chemical treatment can be performed satisfactorily. To do.
[0016]
Here, for example, when the nozzle plate 14 is lowered, as shown in FIG. 5A, the distance from the substrate 1 is reduced and the volume in the gap is reduced so that the chemical solution processing is easy. Is set. Then, when the temperature of the substrate 1 is stabilized, the holding unit 22 is rotated at a predetermined rotational speed, and wet ozone gas and ammonia gas are supplied to the surface of the substrate 1 from the first supply port 16 and the second supply port 18. (Injection) and a chemical solution treatment for decomposing the surface workpiece by rotation is performed. In addition, after the processing for a predetermined time is finished and the object to be processed is decomposed, supply of ozone gas and ammonia gas is stopped, and hot air and hot DIW are supplied from the first supply port 16 and the second supply port 18. The product remaining in the ejection holes 14a is flushed. And it processes reliably by repeating the above-mentioned operation | movement at least once according to the condition where the to-be-processed object of the board | substrate 1 decomposes | disassembles.
[0017]
Further, when the chemical treatment is completed, as shown in FIG. 5 (b), the nozzle plate 14 is raised so that the distance between the substrate 1 and the nozzle plate 14 is increased and the cleaning process can be performed satisfactorily. To do. Thereafter, the nozzle plate 14 supplies hot DIW from the second supply port 18 to perform a cleaning process for rinsing the surface of the substrate 1 to remove decomposition products and the like in the chemical processing. At this time, the pure water which processed the board | substrate 1 is discharged | emitted from the discharge port 20b via the inside of the lower base 20, and is discarded. When the cleaning process is completed, the supply of hot DIW is stopped, and the drying process is performed by simultaneously supplying hot air from the first supply port 16 and the supply port 20a of the lower base 20.
[0018]
Thus, according to one embodiment of the substrate surface treatment apparatus of the present invention, as shown in FIG. Since the distance from the substrate 1 can be set to be narrow during processing, the use of chemicals such as ozone gas and ammonia gas can be reduced, and the object to be processed on the substrate surface can be decomposed in a short time. Moreover, in this Embodiment, since the sealed internal volume of the upper base 10 and the lower base 20 can be reduced simultaneously by dropping the nozzle plate 14, the usage-amount of a chemical | medical agent can be reduced more effectively.
In addition, according to one embodiment of the substrate surface processing apparatus of the present invention, as shown in FIG. 5B, the nozzle plate 14 is raised (or the holding portion 22 is lowered) and the substrate 1 is cleaned during pure water cleaning. Therefore, the surface of the substrate 1 can be cleaned as a whole, the contamination of the surface of the nozzle plate 14 is not transmitted to the substrate 1 through water, and the viscosity of the substrate makes the substrate 1 It will not come off from the holding part 22.
[0019]
The embodiment of the substrate surface treatment apparatus according to the present invention has been described in detail above. However, the present invention is not limited to the above-described embodiment, and can be changed without departing from the gist thereof.
For example, an embodiment using ozone gas and ammonia gas wetted with a chemical agent has been described. However, the present invention is not limited to this, and a wet chemical treatment can also be performed by ejecting a liquid chemical agent containing ozone directly from a nozzle plate.
Moreover, although the Example using the cleaning liquid by a pure water was demonstrated at the time of a cleaning process, it is not limited to this, For example, cleaning liquids, such as alcohol, acidic aqueous solution, alkaline solution, may be sufficient.
[0020]
【The invention's effect】
As described above, according to the substrate surface treatment apparatus of the present invention, it is possible to perform good treatment by adjusting the distance between the substrate and the nozzle plate in accordance with each treatment step such as ozone or pure water in the treatment tank. .
[Brief description of the drawings]
FIG. 1 is a configuration diagram showing an embodiment of a substrate surface treatment apparatus according to the present invention.
FIG. 2 is a view showing a cross section taken along line AA shown in FIG. 1;
FIG. 3 is a view showing a bottom surface of the nozzle plate shown in FIG. 1;
4 is a view showing a water droplet removing operation by a groove of the nozzle plate shown in FIG. 3;
FIG. 5 is a view showing a processing operation of the substrate surface processing apparatus shown in FIG. 1;
FIG. 6 is a configuration diagram showing an embodiment of a conventional substrate surface treatment apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Substrate 10 Upper base 10a Curved surface 12 Heating source 14 Nozzle plate 14a Ejection hole 14b Groove 16 First supply port 18 Second supply port 20 Lower base 20a Supply port 20b Discharge port 22 Holding part

Claims (12)

In a substrate surface treatment apparatus for performing chemical treatment of a substrate surface with a chemical containing ozone and cleaning treatment of the substrate with a cleaning liquid,
A lower base that pivotally supports a holding portion for holding the substrate;
An upper base disposed above and below the lower base and moving up and down;
A nozzle plate that is supported by the upper base and extends on the substrate to eject each of the medicine and the cleaning liquid,
By enabling either or both of the holding part and the nozzle plate supported on the upper base and the lower base to move up and down, the distance between the nozzle plate and the substrate can be adjusted according to the chemical treatment or cleaning treatment. adjustably provided Te Rutotomoni, said nozzle plate, ozone (O ₃ ) First supply port for supplying gas and hot air; ammonia (NH ₃₎ And a second supply port for supplying gas and hot DIW, and a plurality of ejection holes penetrating from the supply ports to the back side are provided to face the substrate. The substrate surface treatment apparatus according to claim 1,
The lower surface base is a substrate surface treatment apparatus characterized in that the upper base moves up and down to fit each other and seal (seal) the substrate inside. The substrate surface treatment apparatus according to claim 2,
The substrate is treated with a chemical solution in a state in which the distance between the nozzle plate and the substrate is reduced and the volume in the gap is reduced by the vertical movement of the nozzle plate or the holding portion, and then the distance is increased to reduce the volume. A substrate surface processing apparatus characterized by performing a cleaning process in an enlarged state. The substrate surface treatment apparatus according to any one of claims 1 to 3,
The substrate surface processing apparatus, wherein the holding unit is provided so as to be capable of adjusting a rotation speed of holding and rotating the substrate. The substrate surface treatment apparatus according to claim 1 ,
The nozzle plate performs processing by supplying ozone gas from the first supply port and ammonia gas from the second supply port simultaneously or alternately as chemicals during chemical treatment of the substrate, and then processing the hot air and hot DIW. A substrate surface treatment apparatus characterized in that the substrate surface is flushed by supplying and flushing the ejection holes at least once. The substrate surface treatment apparatus according to claim 1 ,
The nozzle plate supplies and processes only ozone gas from the first supply port as a chemical during chemical treatment of the substrate, and then supplies the hot air to flush the ejection hole, and performs this operation at least once. A substrate surface processing apparatus. The substrate surface treatment apparatus according to claim 5 or 6 ,
The substrate surface processing apparatus, wherein the nozzle plate performs a cleaning process by supplying hot DIW from the second supply port as the cleaning liquid during the cleaning process after the chemical process. The substrate surface treatment apparatus according to claim 5 or 6 ,
The substrate surface processing apparatus, wherein the nozzle plate dries the substrate by supplying hot air from the first supply port after the cleaning process. In the substrate surface treating apparatus according to any one of claims 1 to 8,
A substrate surface processing apparatus, wherein a heating source (a heater or the like) is provided on the nozzle plate. The substrate surface treatment apparatus according to any one of claims 1 to 9 ,
The substrate surface treatment apparatus according to claim 1, wherein the nozzle plate has a plurality of grooves for preventing water droplets that radially extend from the center toward the outer surface on the back surface facing the substrate to guide water droplets to the outer periphery. In the substrate surface treating apparatus according to any one of claims 1 to 1 0,
The upper base has a curved surface formed in a spherical shape toward the outside at a lower end where the nozzle plate moves up and down, and guides water droplets from the nozzle plate to an outer peripheral wall on the outside. apparatus. The substrate surface treatment apparatus according to any one of claims 1 to 11,
The substrate surface processing apparatus, wherein the lower base is provided so as to be able to supply hot air.

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