JP2004179429A - Substrate surface treatment processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate surface treatment processing apparatus for attaining excellent processing by adjusting a distance between a substrate and a nozzle plate in response to each of an ozone processing processes and a pure water processing process or the like in a processing tank. <P>SOLUTION: The substrate surface treatment processing apparatus for performing chemical processing on the surface of the substrate 1 by chemicals including ozone and cleaning processing of the substrate 1 by a cleaning liquid is provided with a lower base 20 for pivotally supporting a support 22 for supporting the substrate 1 turnably, an upper base 10 placed at an upper part of the lower base 20 and vertically elevated / descended, and a nozzle plate 14 supported by the upper base 10 and extended on the substrate 1 to jet the chemicals and the cleaning liquid. The distance between the nozzle plate 14 and the substrate 1 is adjustable in response to the chemical processing or the cleaning processing by making either or both of the support 22 and the nozzle plate 14 supported by the upper base 10 and the lower base 20 vertically movable. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate surface treatment apparatus, and more specifically, removes an object to be treated such as a photoresist film or an organic compound or an inorganic compound in a semiconductor substrate, a glass substrate, and a printed substrate typified by an IC and an LSI. The present invention relates to a substrate surface treating apparatus for cleaning.
[0002]
[Prior art]
[Patent Document 1]
JP 2001-223206A (Pages 4-6, FIG. 1)
[0003]
2. Description of the Related Art Conventionally, a substrate surface treatment apparatus has been used, for example, in a fine processing step including a manufacturing step of a semiconductor device such as an IC or an LSI, a photoresist film on a semiconductor substrate (a silicon wafer or the like), a glass substrate (LCD), a printed board, or the like. It is used for an operation of removing and cleaning an object to be treated such as an organic compound or an inorganic compound, and is usually a wet method using a chemical (for example, see Patent Document 1) or a dry method using oxygen plasma or the like. . FIG. 6 is a configuration diagram showing an embodiment of a conventional substrate surface treatment apparatus using such a chemical wet method.
[0004]
As shown in FIG. 6, one embodiment of a conventional substrate surface treatment apparatus includes a processing tank 30 for housing a substrate 1 and a base 36 on which the substrate 1 is placed via a flat plate heater 34 in the processing tank 30. And a nozzle plate 32 that controls the flow of gas in the processing tank 30 to uniformly supply the ozone (O ₃ ) gas wet to the processing surface of the substrate 1. Although not shown, the nozzle plate 32 is provided with, for example, hot water, or a heating mechanism such as a heater. Further, the nozzle plate 32 connects a humidifier 41 for humidifying ozone gas from the outside of the processing tank 30 and an ozone gas generator 42 for generating ozone gas by an air supply pipe 39, and the air supply pipe 39 is connected by a ribbon heater 43. It is formed so as to supply ozone gas by heating. Further, a nitrogen tank 46 for applying pressure, a pure water tank 44 for supplying pure water after ozone treatment of the substrate 1, and a pump 45 for water supply are connected to the air supply pipe 39. The processing tank 30 is provided with an exhaust pipe 37 for exhausting ozone gas and a valve 38 for adjusting the exhaust amount. A material having high ozone resistance, for example, quartz glass, fluororesin, or the like is used for a portion of each member that is directly exposed to ozone gas. Although not shown, an ozone decomposing device is connected to the exhaust pipe 37.
[0005]
In one embodiment of the conventional substrate surface treating apparatus formed as described above, first, the substrate 1 is placed on the base 36 via the flat plate heater 34 and heated to a predetermined temperature by the flat plate heater 34. Further, the humidifier 41, the air supply pipe 39, and the nozzle plate 32 are also heated in advance and stabilized at a temperature equal to or higher than the temperature set value of the substrate 1. When the temperature of the substrate 1 is stabilized, the ozone gas is passed through the humidifier 41 to mix in humidity, and the wet ozone gas is supplied (sprayed) to the surface of the substrate 1 to decompose the object to be processed on the surface. Perform processing. Then, after the object is decomposed by the treatment for a predetermined time, the supply of the wet ozone gas is stopped, and a cleaning process of rinsing the surface of the substrate 1 using the pump 45 and the pure water tank 44 is performed, thereby performing the decomposition. Etc. are removed. Next, the substrate 1 is dried by supplying a nitrogen gas from the nitrogen cylinder 46.
[0006]
As described above, the conventional substrate surface treatment apparatus uses ozone (O ₃ ) gas as a chemical for treating the surface of the substrate 1, thereby reducing environmental pollution due to chemical liquid disposal and heating the flat plate heater 34 and the ribbon heater 43. By adjusting the temperature of the processing tank 30 and the temperature of the ozone gas and the like to constant conditions depending on the source, good processing has been realized.
[0007]
[Problems to be solved by the invention]
However, in the conventional substrate surface treatment apparatus, since the nozzle plate 32 in the processing tank 30 is fixed, for example, the distance between the nozzle plate 32 and the substrate 1 is large at the time of the chemical treatment with the ozone gas in the processing tank 30. When fixed in a state, there is a problem that a lot of medicine is used and it takes time to process.
Further, in the conventional substrate surface treatment apparatus, since the nozzle plate 32 is fixed in the treatment tank 30 as described above, for example, the substrate 1 and the nozzle plate 32 are fixed at a certain time during the cleaning (rinsing) treatment with pure water. If the distance is fixed in a narrow state for the above-described chemical treatment, it becomes difficult to clean the entire surface of the substrate 1 and contamination on the surface of the nozzle plate 32 reduces water. There is a problem that the signal is transmitted to the substrate 1 through the substrate. Further, the load resistance at the time of rotation increases due to the viscosity of the liquid, the holding force of the substrate 1 is impaired, and the substrate 1 may come off from the base 36.
The present invention solves such a problem and provides a substrate surface treatment apparatus capable of adjusting a distance between a substrate and a nozzle plate in accordance with each treatment step such as ozone or pure water in a treatment tank and performing satisfactory treatment. With the goal.
[0008]
[Means for Solving the Problems]
The present invention is directed to a substrate surface treatment apparatus that performs a chemical treatment of a substrate surface with a chemical containing ozone and a cleaning treatment of the substrate with a cleaning liquid in order to solve the above-described problem, and a holding unit that holds the substrate is rotatable. A lower base that is pivotally supported on the lower base, an upper base that is disposed above the lower base and that moves up and down, and that is supported by the upper base and extends on the substrate to eject a medicine and a cleaning liquid, respectively. A nozzle plate is provided, and the distance between the nozzle plate and the substrate can be changed according to the chemical solution treatment or the cleaning process by allowing one or both of the holding portion and the nozzle plate supported by the upper base and the lower base to be vertically movable. To be adjustable.
[0009]
Here, it is preferable that the lower bases fit into each other as the upper base moves up and down to hermetically seal the substrate inside. In addition, the substrate is subjected to chemical treatment in a state in which the distance between the nozzle plate and the substrate is reduced by the vertical movement of the nozzle plate or the holding portion and the volume in the gap is reduced, and then the distance is increased to increase the volume. It is preferable to carry out a washing treatment. In addition, it is preferable that the holding unit is provided so as to be able to adjust the number of rotations for holding and rotating the substrate. The nozzle plate has a first supply port for supplying ozone gas and hot air, and a second supply port for supplying ammonia gas and hot DIW. A plurality of ejection holes penetrating from the supply ports to the back side are provided. It is preferable to face the substrate. In addition, the nozzle plate supplies ozone gas from the first supply port and ammonia gas from the second supply port simultaneously or alternately as chemicals during processing of the substrate with the chemical liquid, and then supplies hot air and hot DIW. It is preferable to flush the ejection holes and perform this operation at least once or more. Further, in another embodiment of the nozzle plate, only the ozone gas is supplied from the first supply port as a chemical at the time of chemical treatment of the substrate, and then the hot air is supplied to flush the ejection holes. It is preferable to perform it more than once. Further, it is preferable that the nozzle plate be cleaned by supplying hot DIW from the second supply port as a cleaning liquid during the cleaning process after the chemical solution process. The nozzle plate preferably supplies hot air from the first supply port after the cleaning process to dry the substrate. Further, it is preferable to provide a heating source on the nozzle plate. In addition, it is preferable that the nozzle plate has a plurality of grooves for preventing water droplets extending radially from the center to the outside on the back surface facing the substrate and guiding the water droplets to the outer periphery. Preferably, the upper base has a curved surface formed in a spherical shape toward the outside at the lower end where the nozzle plate moves up and down, and it is preferable that water droplets are guided from the nozzle plate to the outer inner peripheral wall. Further, it is preferable that the lower base be provided so as to be able to supply hot air.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, an embodiment of a substrate surface treatment apparatus according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a configuration diagram showing one embodiment of a substrate surface treatment apparatus according to the present invention. FIG. 2 is a diagram showing a cross section taken along line AA shown in FIG. FIG. 3 is a diagram showing a bottom surface of the nozzle plate 14 shown in FIG. FIG. 4 is a view showing an operation of removing water droplets by the grooves 14b of the nozzle plate 14 shown in FIG. FIGS. 5A and 5B are diagrams showing the processing operation of the substrate surface treatment apparatus shown in FIG. 1, wherein FIG. 5A shows the operation at the time of the chemical treatment, and FIG. Is shown.
[0011]
As shown in FIG. 1, one embodiment of the substrate surface treatment apparatus according to the present invention is a wet type which performs a chemical treatment with an ozone-containing chemical and a cleaning treatment of a substrate with pure water, similarly to the prior art shown in FIG. The lower base 20 rotatably supports a holding unit 22 for holding the substrate 1 with a vacuum suction pad, and is disposed above the lower base 20 and moves up and down. An upper base 10 and a nozzle plate 14 supported on the upper base 10 and extending over the substrate 1 to control the flow of ozone gas and pure water and to uniformly eject each of them are provided.
[0012]
Here, this embodiment is different from the prior art shown in FIG. 6 in that both the holding portion 22 and the nozzle plate 14 supported by the upper base 10 and the lower base 20 can be moved up and down. The distance between the nozzle plate 14 and the substrate 1 is provided so as to be adjustable according to a chemical solution treatment or a cleaning treatment. The holding part 22 and the nozzle plate 14 are not limited to be able to move both up and down. For example, only one of them can be moved up and down to adjust the distance between the nozzle plate 14 and the substrate 1. You may. Further, the nozzle plate 14 is formed of a material having high conduction heat, is provided with the heating source 12 thereon, and has a first supply port 16 for supplying wet ozone (O ₃ ) gas and hot air, and a wet ammonia (NH ₃ ). ₃ ) A second supply port 18 for supplying gas and hot DIW (pure water) is provided.
[0013]
As shown in FIGS. 2 and 3, the first supply port 16 and the second supply port 18 are provided with a plurality of ejection holes 14 a penetrating toward the back side of the nozzle plate 14 and face the substrate 1. Further, as shown in FIG. 2, the nozzle plate 14 simultaneously or alternately supplies an ozone gas from the first supply port 16 and an ammonia gas from the second supply port 18 as chemicals during the chemical treatment of the substrate 1. After the processing, hot air and hot DIW are supplied to flush the products remaining in the ejection holes 14a, and this operation is performed at least once to perform the processing. Here, the supply of the chemical is not limited to the supply of the ozone gas and the ammonia gas from the first supply port 16 and the second supply port 18. For example, only the ozone gas is supplied to the processing body which is weak against alkalinity. It may be supplied and processed. The nozzle plate 14 supplies hot DIW from the second supply port 18 during the cleaning process after the chemical solution process, and supplies hot air from the first supply port 16 to dry the substrate 1 after the cleaning process. . As shown in FIG. 3, the nozzle plate 14 has a plurality of grooves 14b for preventing water droplets extending radially from the center to the outside and guiding water droplets to the outer periphery on the back surface facing the substrate 1. ing. The grooves 14b are formed so that the number of grooves increases stepwise from the center of the nozzle plate 14 toward the outer periphery. Therefore, as shown in FIG. 4, the nozzle plate 14 has a structure capable of guiding the water droplet 2 adhering to the bottom surface to the outside by capillary action by the groove 14a and discharging the water droplet. Further, the nozzle plate 14 is formed so as to be inclined about the center side ejection hole 14 a penetrating from the first supply port 16 and the second supply port 18 to the bottom, respectively. The surface is formed so that the medicine can be ejected from the center toward the center where the medicine diffuses outward.
[0014]
Referring again to FIG. 2, the lower base 20 is formed so that the upper base 10 moves up and down so that the lower base 20 can be fitted to each other to seal the substrate 1 inside. The substrate 1 is subjected to a chemical treatment in a state where the distance between the nozzle plate 14 and the substrate 1 is reduced by the vertical movement of the nozzle plate 14 or the holding portion 22 to reduce the volume in the gap. The washing process is carried out in a state where the volume is expanded by expanding. Therefore, in the present embodiment, since the nozzle plate 14 and the holding portion 22 are not fixed as in the related art shown in FIG. 6, the substrate 1 and the nozzle plate 14 are connected to each other in accordance with each processing step such as a chemical solution process or a cleaning process. The distance can be adjusted for good processing. Further, the holding unit 22 is provided so as to be able to adjust the number of rotations that hold and rotate the substrate 1. The lower base 20 is provided with a supply port 20a for supplying hot air from outside through the outside of the holding section 22. The inside of the lower base 20 is kept at a constant temperature by supplying hot air, and ozone gas or ammonia is supplied during chemical solution treatment. This prevents a chemical such as gas from escaping to the bottom of the substrate 1. Further, the lower base 20 is provided with an outlet 20b for exhausting or draining a chemical such as a gas remaining inside after the process is completed or a water droplet such as pure water. Further, the upper base 10 has a curved surface 10a formed in a spherical shape toward the outside at the lower end where the nozzle plate 14 shown in FIG. 4 moves up and down, and receives the water droplet 2 from the nozzle plate 14 by the curved surface 10a. It is provided on the outer inner peripheral wall so as to be easily guided. Therefore, the water droplet 2 is guided to the lower end along the inner wall of the upper base 10 without adhering to the substrate 1, and is discharged from the outlet 20b of the lower base 20 shown in FIG.
[0015]
One embodiment of the substrate surface treatment apparatus according to the present invention formed as described above first holds the substrate 1 with the vacuum suction pad of the holding unit 22 in a state where the upper base 10 and the lower base 20 are separated from each other. The substrate 1 is hermetically sealed (sealed) by lowering the upper base 10 and fitting the lower base 20. Then, hot air is supplied to the nozzle plate 14 from the first supply port 16 and the supply port 20a of the lower base 20 to heat the inside in advance, and to stabilize the temperature at or above the temperature set value of the substrate 1. At this time, by moving up or down one or both of the nozzle plate 14 and the holding portion 22 in the sealed interior, the distance between the substrate 1 and the nozzle plate 14 is reduced to set a state in which the chemical treatment can be performed well. I do.
[0016]
Here, for example, when the nozzle plate 14 is lowered, as shown in FIG. 5A, the distance between the nozzle plate 14 and the substrate 1 is reduced so that the volume in the gap is reduced so as to be in a state where the chemical solution can be easily processed. Is set. Then, when the temperature of the substrate 1 is stabilized, the holding unit 22 is rotated at a predetermined rotation speed to supply the wet ozone gas and ammonia gas from the first supply port 16 and the second supply port 18 to the surface of the substrate 1. (Injection) and a chemical solution treatment for decomposing the object to be treated on the surface by rotation. After the processing for a predetermined time is completed and the object to be processed is decomposed, supply of ozone gas and ammonia gas is stopped, and hot air and hot DIW are supplied from the first supply port 16 and the second supply port 18. The product remaining in the ejection hole 14a is flushed. Then, the above operation is repeated at least once or more in accordance with the situation in which the object to be processed of the substrate 1 is decomposed, so that the processing is surely performed.
[0017]
When the chemical treatment is completed, as shown in FIG. 5B, the distance between the substrate 1 and the nozzle plate 14 is increased by raising the nozzle plate 14 so that the cleaning process can be performed satisfactorily. I do. Thereafter, the nozzle plate 14 supplies hot DIW from the second supply port 18 to perform a cleaning process for rinsing the surface of the substrate 1 to remove decomposed products and the like in the chemical solution process. At this time, the pure water obtained by treating the substrate 1 is discharged from the outlet 20b through the lower base 20, and is discarded. When the cleaning process is completed, the supply of the hot DIW is stopped, and the drying process is performed by simultaneously supplying the hot air from the first supply port 16 and the supply port 20a of the lower base 20.
[0018]
As described above, according to one embodiment of the substrate surface treatment apparatus according to the present invention, as shown in FIG. 5A, the nozzle plate 14 (or the holding portion 22) of the upper base 10 is provided so as to be able to move up and down, and Since the distance from the substrate 1 during processing can be set to be small, the use of chemicals such as ozone gas and ammonia gas can be reduced, and the object to be processed on the substrate surface can be decomposed in a short time. Further, in the present embodiment, by lowering the nozzle plate 14, the sealed internal volumes of the upper base 10 and the lower base 20 can be reduced at the same time, so that the amount of medicine used can be reduced more effectively.
Further, according to an embodiment of the substrate surface treatment apparatus according to the present invention, as shown in FIG. 5B, the nozzle plate 14 is raised (or the holding portion 22 is lowered) so that the substrate 1 and the substrate 1 are cleaned during the cleaning process with pure water. Can be set in a state where the distance of the nozzle plate 14 is widened, the surface of the substrate 1 can be entirely cleaned, the contamination of the surface of the nozzle plate 14 is not transmitted to the substrate 1 via water, and the viscosity of the liquid makes the substrate 1 It does not come off from the holding part 22.
[0019]
As described above, the embodiments of the substrate surface treatment apparatus according to the present invention have been described in detail. However, the present invention is not limited to the above-described embodiments, and can be changed without departing from the gist thereof.
For example, although the embodiment using the ozone gas and the ammonia gas moistened in the medicine has been described, the invention is not limited to this, and the wet treatment can be performed by directly ejecting the liquid medicine containing ozone from the nozzle plate.
Further, although the embodiment using the cleaning liquid with pure water at the time of the cleaning process has been described, the present invention is not limited to this, and a cleaning liquid such as an alcohol, an acidic aqueous solution, or an alkaline solution may be used.
[0020]
【The invention's effect】
As described above, according to the substrate surface treatment apparatus of the present invention, it is possible to perform favorable treatment by adjusting the distance between the substrate and the nozzle plate according to each treatment step such as ozone or pure water in the treatment tank. .
[Brief description of the drawings]
FIG. 1 is a configuration diagram showing an embodiment of a substrate surface treatment apparatus according to the present invention.
FIG. 2 is a view showing a cross section taken along line AA shown in FIG. 1;
FIG. 3 is a diagram showing a bottom surface of the nozzle plate shown in FIG. 1;
FIG. 4 is a view showing an operation of removing water droplets by a groove of a nozzle plate shown in FIG. 3;
FIG. 5 is a view showing a processing operation of the substrate surface processing apparatus shown in FIG. 1;
FIG. 6 is a configuration diagram showing one embodiment of a conventional substrate surface treatment apparatus.
[Explanation of symbols]
1 Substrate 10 Upper base 10a Curved surface 12 Heat source 14 Nozzle plate 14a Spout hole 14b Groove 16 First supply port 18 Second supply port 20 Lower base 20a Supply port 20b Discharge port 22 Holding section

Claims (13)

In a substrate surface treatment apparatus that performs a chemical treatment of the substrate surface with a chemical containing ozone and a cleaning treatment of the substrate with a cleaning liquid,
A lower base rotatably supporting a holding unit for holding the substrate,
An upper base that is arranged above the lower base and that moves up and down,
A nozzle plate that is supported by the upper base and extends on the substrate and ejects the medicine and the cleaning liquid, respectively.
By allowing one or both of the holding portion and the nozzle plate supported by the upper base and the lower base to be able to move up and down, the distance between the nozzle plate and the substrate can be changed according to the chemical treatment or the cleaning treatment. A substrate surface treatment apparatus, which is provided so as to be adjustable. The substrate surface treatment apparatus according to claim 1,
The substrate surface treatment apparatus, wherein the lower base is fitted to each other as the upper base moves up and down to hermetically seal (sealing) the substrate inside. The substrate surface treatment apparatus according to claim 2,
The substrate is subjected to a chemical treatment in a state in which the distance between the nozzle plate and the substrate is reduced by the vertical movement of the nozzle plate or the holding portion and the volume in the gap is reduced, and then the distance is increased to increase the volume. A substrate surface treatment apparatus that performs a cleaning process in an enlarged state. The substrate surface treatment apparatus according to any one of claims 1 to 3,
The substrate surface treatment apparatus, wherein the holding unit is provided so as to be able to adjust the number of rotations that hold and rotate the substrate. The substrate surface treatment apparatus according to any one of claims 1 to 4,
The nozzle plate has a first supply port for supplying ozone (O ₃ ) gas and hot air, and a second supply port for supplying ammonia (NH ₃ ) gas and hot DIW, and penetrates from each supply port to the back side. A substrate surface treatment apparatus characterized in that a plurality of ejection holes are provided to face the substrate. The substrate surface treatment apparatus according to claim 5,
The nozzle plate is configured to simultaneously or alternately supply the ozone gas from the first supply port and the ammonia gas from the second supply port as chemicals during the chemical treatment of the substrate, and then process the hot air and hot DIW. A substrate surface treatment apparatus comprising: supplying and flushing the ejection holes; and performing this operation at least once. The substrate surface treatment apparatus according to claim 5,
The nozzle plate supplies and processes only the ozone gas from the first supply port as a chemical during the chemical treatment of the substrate, and then supplies the hot air to flush the ejection holes, and performs this operation at least once. A substrate surface treatment apparatus characterized by the above-mentioned. The substrate surface treatment apparatus according to claim 6 or 7,
The substrate surface treatment apparatus, wherein the nozzle plate performs a cleaning process by supplying hot DIW from the second supply port as the cleaning solution during the cleaning process after the chemical solution process. The substrate surface treatment apparatus according to claim 6 or 7,
The substrate surface treatment apparatus, wherein the nozzle plate supplies hot air from the first supply port after the cleaning process to dry the substrate. The substrate surface treatment apparatus according to any one of claims 1 to 9,
A substrate surface treatment apparatus, wherein a heating source (a heater or the like) is provided on the nozzle plate. The substrate surface treatment apparatus according to any one of claims 1 to 10,
The substrate surface treatment apparatus according to claim 1, wherein the nozzle plate has a plurality of grooves for preventing water droplets extending radially from the center to the outside on the back surface facing the substrate to guide the water droplets to the outer periphery. The substrate surface treatment apparatus according to any one of claims 1 to 11,
The substrate surface treatment, wherein the upper base has a curved surface formed in a spherical shape toward the outside at a lower end where the nozzle plate moves up and down, and guides water droplets from the nozzle plate to an outer inner peripheral wall. apparatus. The substrate surface treatment apparatus according to any one of claims 1 to 12,
The substrate surface treatment apparatus, wherein the lower base is provided so as to be able to supply hot air.

Images