JP2003012892A - Resin composition and flame-retardant laminate board and printed wiring board using the composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flame-retardant resin composition with no halogen compound and enabling to obtain a laminated board and a printed wiring board with excellent heat resistance by curing the composition. SOLUTION: This resin composition with no bromine compound comprises (A) an epoxy resin, (B) a polyfunctional phenolic resin with 100 deg.C or higher softening point, (C) a hydrate of a metal oxide, and (D) a silicon-functional siloxane oligomer as essential components, wherein (C) is 50 to 200 vol.% to the total of (A) and (B). Flame-retardant laminated board and printed wiring board using the composition are also provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition containing no bromine compound, a flame-retardant laminate used for various electronic materials, particularly a metal-clad laminate, and a printed wiring board using the resin composition. .

[0002]

2. Description of the Related Art Awareness of environmental problems is increasing on a global scale. Organic halogen compounds, antimony, lead alloys, lead compounds, etc., which pollute the atmosphere and soil and may be harmful to the human body, are subject to use regulations. For this reason, the shift to products that do not contain halogen compounds and lead alloys is progressing, centering on various information terminal devices such as home electric appliances and personal computers. Printed wiring boards and mounted components used in such electronic devices are no exception.

Generally, most of conventional substrate materials used for printed wiring boards and plastic packages use organic halogen compounds for flame retardancy. Also,
At present, Sn-Pb alloys are used for solder connection of mounted components.

According to reports on solder materials containing no lead, the melting point of such solder tends to rise, and the reflow temperature is likely to rise accordingly. In such a situation, as a substrate material, a halogen compound is not used, and at the same time, higher heat resistance than ever is required in order to withstand the melting temperature of solder.

As a flame retarding method which does not use an organic halogen compound, conventionally, a phosphorus compound or a nitrogen compound is added, or they are introduced into a resin skeleton. However, in order to secure flame retardancy with a phosphorus compound or a nitrogen compound, it is necessary to mix a certain amount, which causes an increase in water absorption and a decrease in heat resistance. Therefore, a method of using a hydrate of a metal oxide in combination has also been attempted for the purpose of reducing the compounding amount of a phosphorus compound or a nitrogen compound.

However, since hydrates of metal oxides trap a large amount of water that exerts a cooling effect at the time of combustion, the heat resistance of a resin composition or a laminated plate is drastically reduced if it is mixed in a certain amount or more. To do. This is due to the fact that the temperature at which the hydrate of the metal oxide releases water is lower than the melting temperature of the solder, which is expected to lead to higher required melting temperatures. , It seems to be more prominent with lead-free solder.

The present inventors previously treated the base material and filler of the laminate with a siloxane oligomer having a functional group that reacts with the hydroxyl group, so that the interface between the base material and the filler and the resin is treated. It has been found that a laminate and a printed wiring board having excellent drilling workability and insulating properties can be produced by improving the adhesiveness (Patent International Publication WO97 / 01595).
(See the official gazette). However, the knowledge that this technique can be applied to the flame-retardant of such a laminated board has not been obtained until now.

[0008]

SUMMARY OF THE INVENTION The present invention has been made on the premise of such a situation, and a laminated board and a printed wiring board obtained by curing without containing an organic halogen compound are flame-retardant and heat-resistant. An object of the present invention is to provide a resin composition having excellent properties; a laminated board using the same, which is excellent in flame retardancy, heat resistance and processability; and a printed wiring board.

[0009]

Means for Solving the Problems As a result of repeated studies to solve the above problems, the present inventors have blended a hydrate of a metal oxide as a flame retardant, and By incorporating a reactive silicon-functional siloxane oligomer, excellent mechanical properties and excellent mechanical properties can be obtained even if a large amount of (C) is added without impairing the flame retardant effect of the hydrate of the metal oxide (C). The present invention has been completed by finding that processability can be obtained and that the above-mentioned object can be achieved thereby.

That is, the resin composition of the present invention comprises: (A) an epoxy resin; (B) a polyfunctional phenol resin having a softening point of 100 ° C. or higher; (C) a hydrate of a metal oxide; and (D). It contains a siloxane oligomer having a silicon functional group, the content of (C) is 50 to 200% by volume based on the total amount of (A) and (B), and does not substantially contain an organic halogen compound. Is characterized by. The flame-retardant laminate of the present invention is obtained by laminating and curing a prepreg obtained from the resin composition, and the flame-retardant printed wiring board of the present invention is a metal-clad laminate thus obtained. It is obtained by forming a circuit from

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The epoxy resin as the component (A) may be any compound having two or more epoxy groups in the molecule, such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, and bisphenol S type epoxy. Resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolac type epoxy resin, bisphenol F novolac type epoxy resin, dicyclopentadiene type epoxy resin, alicyclic epoxy resin, aliphatic chain Epoxy resin, glycidyl ester type epoxy resin, isocyanurate type epoxy resin, hydantoin type epoxy resin, polyfunctional phenol glycidyl ether compound, difunctional alcohol glycidyl ether compound, and those There is a hydrogenated product or the like, be used alone or in combination of two or more thereof.

The polyfunctional phenolic resin as the component (B) is
It is a curing agent of component (A). As the component (B), there are phenol novolac, cresol novolac, bisphenol A novolac, bisphenol F novolac, catechol novolac, and those in which these aromatic rings are substituted with an alkyl group. Even if one kind is used, two or more kinds are used. You may use together. In the present invention, among these polyfunctional phenolic resins, a resin composition having a softening point of 100 ° C. or higher, preferably 100 to 150 ° C. is blended to obtain a resin composition having good heat resistance and flame retardancy. be able to.

The blending amount of the component (B) imparts excellent heat resistance to the cured resin, so that the number of hydroxyl groups of the component (B) is 0.8 to 1 per epoxy group of the component (A). .2
The amount which becomes individual is preferable.

The hydrate of the component (C) metal oxide imparts flame retardancy to the composition of the present invention. Here, the hydrate of a metal oxide is a concept including what is expressed as a metal hydroxide. As the component (C), a hydrate of a metal oxide of Group 2 or Group 13 of the periodic table is usually used, and aluminum oxide hydrate, magnesium hydroxide and calcium hydroxide are preferable. The aluminum oxide hydrate includes what is called aluminum hydroxide, and includes monohydrates such as boehmite and diaspore; and trihydrates (aluminum hydroxide) such as gibbsite and bayerite. As the component (C), one type may be used, or two or more types may be used in combination. Gibbsite is particularly preferable because excellent flame retardancy can be obtained with the same blending amount.

The blending amount of the component (C) is 50 to 200% by volume, preferably 70 to 150% by volume based on the total amount of the components (A) and (B). When the amount of the component (C) is less than 50% by volume, sufficient flame retardancy cannot be obtained, and when it exceeds 200% by volume, moldability becomes insufficient.

The siloxane oligomer of component (D) is
It is a surface treatment agent for an inorganic filler other than the component (C) and optionally the component (C). The component (D) is not particularly limited as long as it has two or more siloxane units and one or more silicon functional groups that react with the hydroxyl groups on the surface of the base material. The siloxane skeleton may be linear, branched, cyclic, or net-like, and preferably has a branched structure in view of compatibility with the components (A) and (B). In addition, the number of siloxane units is preferably 2 to 70, more preferably 5 to 50, because handling is easy and uneven treatment does not occur. Examples of the silicon functional group include a hydroxyl group (including silanol group including silicon atom); an alkoxy group such as methoxy, ethoxy, and propoxy; an alkoxy-substituted alkoxy group such as 2-methoxyethoxy; and a hydrogen atom. And a methoxy group are preferable, and a hydroxyl group is particularly preferable, because they are easy to react and have excellent reactivity. Such a silicon functional group is preferably bonded to a terminal silicon atom when the siloxane skeleton is linear, but in the case of other skeleton structures, it may be bonded to any silicon atom. Good.

The siloxane oligomer has an unsubstituted or substituted monovalent hydrocarbon group bonded to the silicon atom. Such groups include alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl;
Examples thereof include an aryl group such as phenyl; an alkenyl group such as vinyl; and a substituted hydrocarbon group such as 3-methoxypropyl. Since they give excellent heat resistance to the cured resin, at least one of them is included in the molecule. It is preferable to have a phenyl group, and to raise the temperature at which the hydrate of the metal oxide releases water so that the resin does not swell due to processing such as soldering, and the flame retardancy is not impaired. Therefore, it is more preferable that 25 mol% or more of all the siloxane units are units having at least one phenyl group. As the other group, a methyl group is preferable because it is easy to synthesize and handle.

Such siloxane oligomers include, for example, silicon functional group-containing silanes such as alkoxysilanes and chlorosilanes and / or their partial hydrolysis-condensation products corresponding to the siloxane units constituting the oligomers. It can be obtained by (co) hydrolysis or (co) alcolysis and partial condensation. For example, the above silanes are dissolved in an alcoholic solvent such as methanol, ethanol or 2-methoxyethanol; and / or a hydrocarbon solvent such as toluene or xylene, and water; Acidified water; drop alcohol or the like, or conversely add the mixed silane solution into similar water, continue stirring until the desired degree of polymerization is reached, and separate the oil phase to form a siloxane oligomer. Can be collected.

The method for treating the siloxane oligomer with respect to the component (C) and optionally other inorganic fillers is not particularly limited, and it is a dry method in which the siloxane oligomer is directly added or a method of diluting with an organic solvent or the like. A wet method using the treated liquid is suitable.

The treatment amount of the siloxane oligomer to the component (C) and other inorganic fillers is not particularly limited, but it is sufficiently dispersed in the system to be effective in treating the object, and the component (C) and the necessary amount. A polysiloxane layer having an appropriate thickness is formed on the surface of the other inorganic filler to be blended according to the formula (A), thereby producing excellent interfacial adhesion with the component (A),
In addition, since it has an effect of reducing residual stress and imparts excellent heat resistance to the resin, 0.01 to 5.0% by weight relative to the total amount of the component (C) and the other inorganic filler is used. It is suitable.

The resin composition of the present invention may optionally contain various components in addition to the above-mentioned components (A) to (D).

In order to accelerate the curing of the component (A), a curing accelerator can be added if necessary. The type and amount of the curing accelerator are not particularly limited, and for example, an imidazole compound, a tertiary amine, an onium salt or the like is used, and one kind may be used or two or more kinds may be used in combination. .

Further, an inorganic filler other than the component (C) is used in combination for the purpose of improving heat resistance, flame retardancy and the like, and for imparting appropriate mechanical properties to the resin composition and / or its cured product. You may. As such an inorganic filler, alumina, silica, titanium oxide, clay, calcium carbonate, aluminum carbonate, magnesium silicate, aluminum silicate, mica, glass short fibers, etc. are used.
Further, various whiskers such as aluminum borate and silicon carbide are used. These may be used alone or in combination of two or more.

Further, in order to enhance the affinity between the hydrate of the metal oxide and the resin, various coupling agents may be used in combination with the siloxane oligomer for the surface treatment. As the coupling agent, a silane coupling agent, a titanate coupling agent, or the like is used. As the silane-based coupling agent, carbon-functional silane is used.
-Glycidoxypropyltrimethoxysilane, 3-glycidoxypropyl (methyl) dimethoxysilane, 2-
Epoxy group-containing silanes such as (2,3-epoxycyclohexyl) ethyltrimethoxysilane; 3-aminopropyltriethoxysilane, N- (2-aminoethyl)
-3-Aminopropyltrimethoxysilane, N- (2-
Amino group-containing silanes such as aminoethyl) -3-aminopropyl (methyl) dimethoxysilane; cationic silanes such as 3- (trimethoxylyl) propyltetramethylammonium chloride; vinyl group-containing such as vinyltriethoxysilane Silane; acrylic group-containing silanes such as 3-methacryloxypropyltrimethoxysilane; and mercapto group-containing silanes such as 3-mercaptopropyltrimethoxysilane. As titanate coupling agents, titanium propoxide,
Illustrative are alkyl titanates such as titanium butoxide. Such coupling agents may be used alone or in combination of two or more, and the compounding amount thereof is not particularly limited.

A solvent is used to dilute or disperse each component of the resin composition and optionally mixed inorganic filler to form a varnish. As a solvent,
For example, hydrocarbons such as toluene and xylene; ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone; esters such as ethyl acetate; ether alcohols such as ethylene glycol monomethyl ether; methanol, ethanol, isopropanol, butanol Alcohols such as; and N, N-
An aprotic polar solvent such as dimethylformamide is exemplified, and one kind may be used or two or more kinds may be mixed and used. Moreover, you may mix | blend the reactive diluent which has one epoxy group in a molecule | numerator.

The solid content concentration of the varnish is not particularly limited,
It can be appropriately changed depending on the type and blending amount of the resin composition and the inorganic filler, but the resin content of the prepreg is sufficient to maintain the insulating property of each layer, and the workability is impaired due to an increase in the apparent viscosity of the varnish, The range of 50 to 80% by weight is preferable because it does not spoil the appearance of the prepreg.

If desired, the composition of the present invention may further contain a colorant, an antioxidant, a reducing agent, an ultraviolet ray shielding agent and the like. However, the resin composition of the present invention is, from the problem thereof, an aromatic bromine compound, a brominated epoxy resin and its terminal group derivative, a brominated alcohol, a brominated pentaerythritol, a brominated benzyl acrylate, a brominated alkyl isocyanurate. An organic bromine compound such as;
It is substantially free of organic halogen compounds such as organic chlorine compounds such as chlorinated paraffin and chlorinated polyethylene.

A resin composition obtained by blending the above-mentioned components, particularly a varnish prepared by further blending a solvent and / or a reactive diluent, is impregnated into a substrate, air-dried if necessary, and then dried. A prepreg for a printed wiring board is obtained by semi-curing in a furnace. The processing conditions are usually 80 to 200 ° C,
The temperature is preferably 100 to 180 ° C. for 3 to 30 minutes, preferably 5 to 15 minutes. The base material is not particularly limited as long as it can be used when manufacturing a metal-clad laminate or a multilayer printed wiring board, but a fiber base material such as a woven fabric or a non-woven fabric is usually used. As the fiber base material, for example, glass,
Inorganic fibers such as silica glass, silica-alumina glass, alumina, zirconia, asbestos, tyranno, silicon carbide, silicon nitride, boron carbide; carbon fibers; aromatic polyamide, polyetheretherketone, polyetherimide, polyethersulfone, cellulose There are such organic fibers and the like, and mixed paper-making systems thereof, and in particular, a woven fabric of glass fibers is preferably used.

The prepreg used in the present invention has a temperature of 150.
To 200 ° C. and pressure in the range of about 1.0 to 8.0 MPa to cure and harden the laminated plate, especially a metal clad laminated plate such as a copper clad laminated plate, or a multilayer printed wiring board on which a circuit is formed. Used in manufacturing.

[0030]

In the resin composition of the present invention, by adding 50 to 200% by volume of the metal oxide hydrate, water of hydration is released upon combustion. Therefore, the composition is cured. Flame retardancy can be imparted to the obtained laminate.

Further, by blending a silicon-functional siloxane oligomer, the dispersibility of the hydrate in the system can be enhanced, the insulation property can be prevented from lowering due to its aggregation, and good processability can be maintained. . In particular, when 25 mol% or more of all siloxane units have at least one phenyl group as the siloxane oligomer, the temperature at which the hydrate of the metal oxide releases water can be increased. Therefore, since water is not released at the temperature of processing such as soldering, the resin does not bulge. Further, by using a polyfunctional epoxy resin and a polyfunctional phenol resin having a softening point of 100 ° C. or higher, it is possible to prevent a decrease in heat resistance due to the release of water from the hydrate.

[0032]

EXAMPLES The present invention will be described below with reference to examples. The invention is not limited by these examples. In Examples and Comparative Examples, “parts” means “parts by weight”.

Example 1 105 parts of methanol were mixed with 20 parts of dimethyldimethoxysilane.
Parts and 25 parts of tetramethoxysilane were blended to prepare a solution. While stirring this, a solution of 17.8 parts of distilled water and 0.60 part of acetic acid was added dropwise, and then heated to 50 ° C. for 8 hours to promote cohydrolysis and partial condensation. Liquid separation was performed to obtain an oil phase as a silanol group-containing siloxane oligomer.

This siloxane oligomer was dissolved in methyl ethyl ketone to prepare a solution having a solid content of 1% by weight. A varnish consisting of the following resin and inorganic filler was prepared, and 0.5 part of the above siloxane oligomer solution was added to the above solution while stirring. Bisphenol A type epoxy resin (epoxy equivalent: 245) 10 parts Bisphenol A novolac type epoxy resin (epoxy equivalent: 205) 90 parts Phenol novolac resin (hydroxyl equivalent: 108, softening point: 108 ° C) 52 parts 2-Ethyl-4- Methyl imidazole 0.5 part Aluminum hydroxide (gibbsite) 90 parts Calcined clay 30 parts Methyl ethyl ketone is further added thereto to give a solid content of 70.
A weight percent varnish was prepared.

Example 2 The solid content was 70% by weight in the same manner as in Example 1 except that 52 parts of a phenol novolac resin having a hydroxyl equivalent of 108 and a softening point of 120 ° C. was used in place of the phenol novolac resin of Example 1. The varnish of was prepared.

Example 3 In place of the phenol novolac resin of Example 1, cresol novolac resin (hydroxylation equivalent: 108, softening point:
A varnish having a solid content of 70% by weight was prepared in the same manner as in Example 1 except that 52 parts (121 ° C.) was used.

Example 4 A varnish having a solid content of 70% by weight was prepared in the same manner as in Example 1 except that the blending amount of aluminum hydroxide in Example 1 was changed to 150 parts.

Example 5 A varnish having a solid content of 70% by weight was prepared in the same manner as in Example 1 except that 0.5 part of 3-glycidoxypropyltrimethoxysilane was added to the varnish of Example 1.

Comparative Example 1 A varnish having a solid content of 70% by weight was prepared without adding aluminum hydroxide to the varnish of Example 1.

Comparative Example 2 A solid content of 70 was obtained in the same manner as in Example 1 except that 52 parts by weight of a phenol novolac resin having a hydroxylation equivalent of 108 and a softening point of 84 ° C. was used instead of the phenol novolac resin of Example 1. A weight percent varnish was prepared.

Comparative Example 3 Except that the siloxane oligomer of Example 1 was not added,
A varnish having a solid content of 70% by weight was prepared in the same manner as in Example 1.

The varnishes prepared in Examples 1 to 5 and Comparative Examples 1 to 3 were each coated with a glass cloth (# 2) having a thickness of about 0.1 mm.
116, E-glass) and then at 150 ° C. for 3 to 1
It was dried by heating for 0 minutes to obtain a prepreg having a resin content of 48% by weight. 4 pieces of this prepreg are piled up and the thickness is 18
A copper foil having a thickness of μm was overlaid and pressed at 170 ° C. under a press condition of 3.0 MPa for 90 minutes to prepare a double-sided copper-clad laminate.

The obtained double-sided copper-clad laminate was evaluated for flame retardancy, glass transition temperature, heat resistance and electrolytic corrosion resistance. The results are as shown in Table 1.

The test method was as follows. Flame retardance, glass transition temperature (Tg): JIS C 6481
It was measured according to. Heat resistance: Cut a double-sided copper clad laminate into 50mm x 50mm,
Floating in the solder at 288 ° C., the time until swelling was measured was measured. Electrolytic corrosion resistance: A double-sided copper clad laminate was processed with a drill having a diameter of 0.4 mm to a hole interval of 0.3 mm, a voltage of 50 V was applied between the holes, and the conditions were 85 ° C. and 85% RH for 500 hours and The insulation resistance was measured after standing for 1,000 hours.

[0045]

[Table 1]

From the results shown in Table 1, the copper clad laminates obtained in Examples 1 to 5 were excellent in flame retardancy and heat resistance, and also excellent in electrolytic corrosion resistance. On the other hand, the laminated plate obtained in Comparative Example 1 was extremely inferior in flame retardancy, and the laminated plate obtained in Comparative Example 2 was inferior in flame retardancy and heat resistance, and thus was obtained in Comparative Example 3. The plate was inferior in heat resistance and inferior in electrolytic corrosion resistance.

Example 6 A solution obtained by dissolving 14.8 parts of dimethyldiethoxysilane and 21.1 parts of phenyltrichlorosilane in 36.0 parts of toluene was stirred vigorously at a temperature of 70 ° C. with water 100.
A portion was added dropwise, and then the mixture was stirred at the reflux temperature of toluene for 2 hours to carry out cohydrolysis and partial condensation. Allow to stand and separate, neutralize oil layer by conventional method, wash with water, then dehydrate and filter,
Further, a part of toluene was distilled off to obtain a 60 wt% toluene solution of a siloxane oligomer. The obtained siloxane oligomer has (CH ₃ ) ₂ SiO units and C ₆ H ₅ SiO
_It contained _3/2 units equimolar and contained 6% by weight of hydroxyl groups.

The siloxane oligomer thus obtained was added to the same epoxy resin varnish as used in Example 1 in an amount of 0.5% by weight in terms of siloxane content, and the mixture was stirred and dissolved to obtain a siloxane oligomer-containing epoxy resin. A resin varnish was prepared. Using this, a double-sided copper-clad laminate was prepared in the same manner as in Example 1, and the flame retardancy and heat resistance were evaluated in the same manner as in Example 1. The flame retardancy was 94 V-
0, heat resistance was> 300 seconds.

Example 7 20 parts of dimethyldimethoxysilane and 20 parts of diphenyldimethoxysilane were dissolved in 50 parts of ethylene glycol monomethyl ether to prepare a mixed silane solution. While stirring this, a solution of 50 parts of distilled water and 0.28 part of acetic acid was added dropwise at room temperature and then heated to 50 ° C. for 8 hours to proceed with cohydrolysis and partial condensation.

The siloxane oligomer thus obtained was added to the same epoxy resin varnish as used in Example 1 in an amount of 0.5% by weight in terms of siloxane content, and the mixture was stirred and dissolved to obtain a siloxane oligomer-containing epoxy resin. A resin varnish was prepared. Using this, a double-sided copper-clad laminate was prepared in the same manner as in Example 1, and flame retardancy, heat resistance, Tg, and electrolytic corrosion resistance were evaluated in the same manner as in Example 1. The results were as follows. Flame retardance: 94V-0 Heat resistance:> 300 seconds Tg: 163 ° C Electrolytic corrosion resistance (500h): 1 × 10 ¹² Electrolytic corrosion resistance (1,000h): 1 × 10 ¹²

[0051]

EFFECTS OF THE INVENTION A laminated board made from the resin composition of the present invention is a material containing no halogen compound, but is excellent in flame retardancy, heat resistance and workability, and is also excellent in electrolytic corrosion resistance. A printed wiring board obtained by forming a circuit from such a laminated board has high reliability and excellent wire bonding property. Therefore, the resin composition of the present invention, and a laminate and a printed wiring board using the resin composition are very useful as an insulating material for electronic devices and a printed wiring board.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) C08G 59/62 C08G 59/62 C08J 5/24 CFC C08J 5/24 CFC C08K 3/22 C08K 3/22 C08L 83/04 C08L 83/04 H05K 1/03 610 H05K 1/03 610L 610S (72) Inventor Shinji Shimaoka 1500 Ogawa, Shimodate City, Ibaraki Prefecture Hitachi Chemical Co., Ltd. Shimodate Works (72) Inventor Fukuda Tomio Ibaraki Prefecture Shimodate City Oita 1500 Oita Hitachi Chemical Co., Ltd. Research Institute (72) Inventor Masato Miyatake Ibaraki Shimodate City Ogawa 1500 Hitachi Research Institute Co., Ltd. Research Institute F-term (reference) 4F072 AA02 AA04 AA07 AB02 AB03 AB06 AB06 AB07 AB08 AB09 AB10 AD23 AD25 AD26 AD27 AD28 AE01 AE07 AF03 AF04 AF21 AG03 4F100 AA17B AA18 B AA19B AB01C AB17C AB33C AK33 AK41B AK52B AL05B BA03 BA07 BA10A BA10C DG01A DH01A GB43 JA04B JJ03 JJ07 4J002 CC032 CC042 CC052 CC062 EX860 EX0860EX078EX078EX0 0670 0470 0670 0670470 FD142 GQ00 GQ01 4J036 AA01 AA02 AB07 AB17 AC05 AD01 AD07 AD08 AD21 AF06 AF19 AJ05 AJ08 DC05 DC41 FB07

Claims (9)

[Claims] 1. An epoxy resin; (B) a polyfunctional phenol resin having a softening point of 100 ° C. or higher; (C) a hydrate of a metal oxide; and (D) a siloxane oligomer having a silicon functional group. A resin composition containing, (C) content of 50 to 200% by volume with respect to the total amount of (A) and (B), and substantially containing no organic halogen compound. 2. The resin composition according to claim 1, wherein (C) is one or more selected from the group consisting of aluminum oxide hydrate, magnesium hydroxide and calcium hydroxide. 3. The resin composition according to claim 1, wherein the silicon functional group of (D) is a hydroxyl group. 4. The resin composition according to claim 1, wherein the siloxane unit (D) is 2 to 70. 5. The resin composition according to claim 1, wherein (D) has at least one phenyl group in the molecule. 6. The resin composition according to claim 5, wherein 25% or more of all the siloxane units of (D) have at least one phenyl group. 7. A flame-retardant laminate obtained by laminating a prepreg obtained from the resin composition according to claim 1 and curing the prepreg. 8. The laminate according to claim 7, which is a metal-clad laminate. 9. A flame-retardant printed wiring board obtained by forming a circuit from the metal-clad laminate according to claim 8.