JP2003011126A - Mold temperature adjusting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mold temperature adjusting system which does not need an excess space and an excess cost for auxiliary temperature adjustment although it is a fundamental mold temperature adjusting system as a pair with a mold. SOLUTION: The mold temperature adjusting system 30 for adjusting the temperature of a mold K to be used in a resin molding machine, etc., has a sub-part 20 which can do auxiliary temperature adjustment independently in addition to a main part 10 for adjusting a mold temperature.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold temperature control system for controlling the temperature of a mold used in a resin molding machine or the like.

[0002]

2. Description of the Related Art A mold temperature control system for controlling the temperature of a mold used in a resin molding machine or the like is usually provided in a one-to-one correspondence with the mold. For example, a system configuration as shown in FIG. Has become.

The mold temperature control system 130 is a tank 101 for storing a medium (usually water) w for temperature control for a mold K to be temperature-controlled, and is stored in the tank 101. A circulation pump 102 for circulating the medium, a sensor 1 for detecting the temperature of the medium w circulated.
03, and conduit systems 104a to 104m for connecting these to each other to circulate the medium w.

In the tank 101, a heater 101a for heating the stored medium w, a storage level of the stored medium w, and a medium w of a certain storage level or higher are detected.
There is provided a level switch 101b for discharging from the pipe 104m to the discharge destination (or drain) D.

The tank 101 is supplied with a medium (usually tap water) w from a medium supply source W such as general tap water through a conduit 104j equipped with a filter F and a supply valve 104k, and stores the medium. The temperature of w can be lowered, that is, cooled.

A pipe line 104a extends from the lower part of the tank 101 and is connected to the suction side of the circulation pump 102. A pipe line to the discharge destination D is branched from the pipe line 104a, and the sensor 103 is provided before the connection of the pipe line 104a to the pump 102.

From the discharge side of the circulation pump 102, that is, from the supply side, a pipe line 104b extends, which is branched and provided with a supply valve 104c, respectively, and a mold K is formed by a pipe line 104d.
Of male type KA and female type KB. This pipeline 10
The medium w is a mold K (KA, KB) by 4b and 104d.
It is supplied to and flowed through. Circulation pump 10
A pressure gauge 102a for measuring and displaying the pressure of the supplied medium w is provided on the discharge side of No.2.

A medium w that has flowed through the mold K (KA, KB)
Are recirculated to the tank 101 by a pipe line 104e provided with a return valve 104f and a pipe line 104g where these are joined.

The line 104b from the circulation pump 102 is
Before the branching, a pipeline 104h provided with a pressure control valve 104i is further branched, and the pipeline 104h is connected to the tank 101. When the pressure of the medium w supplied by the regulating valve 104i exceeds a certain level, a part of the medium w is returned to the tank 101 so that the pipeline 104h provided with the pressure regulating valve 104i is supplied. The pressure of the medium w is adjusted.

With such a structure, the mold temperature control system 130 circulates the medium w between the mold K and the tank 101 while monitoring the temperature of the medium w with the sensor 103, and when it is low, Is heated by the heater 101a, and when it becomes too hot, the medium w at room temperature is fed from the medium supply source W.
Is supplied to adjust the temperature of the mold K by adjusting the medium temperature. When the supply of the medium w from the medium supply source W becomes excessive, the level switch 101b ejects the medium w to the ejection destination D.

In this way, the system 130 can satisfactorily control the temperature of the mold.

[0012]

However, this mold temperature control system is provided in a one-to-one correspondence with the mold as the temperature control target. As in the case of the resin molding machine of this example, the temperature If there is a material injection part of the resin molding machine instead of the mold as the object of adjustment, it was dealt with by separately configuring a temperature adjustment system dedicated to this material injection part. Since the temperature control systems are provided independently of each other, there have been problems of installation space and cost increase.

The present invention is intended to solve the above-mentioned problems, and is an original one-to-one correspondence mold temperature control system, but does not require excessive space or cost for auxiliary temperature control. It is intended to provide a mold temperature control system.

[0014]

The mold temperature control system according to claim 1 is a mold temperature control system for controlling the temperature of a mold used in a resin molding machine or the like. In addition to the main part, a sub-part that can independently perform auxiliary temperature control is provided.

Here, the term "resin molding machine" refers to not only a resin molding machine for injecting a molten resin material into a mold and molding, but also a similar molten material to a mold. A molding machine for molding, for example, a die-cast molding machine of a material of aluminum, zinc, or an alloy thereof is also included. In addition, since the mold used for these moldings is to mold by holding the molten material for a certain period of time and cooling the mold during this time, it is very important to control the temperature of this mold. The mold temperature control system of the present invention is
The effect is exerted as such a mold temperature control system.

This mold temperature control system is originally provided with a subpart that can independently perform auxiliary temperature control in addition to the main part that controls the temperature of the target mold. , There is no need to provide a separate temperature control system,
It is possible to control the temperature of the temperature control target, for example, the material charging section of the resin molding machine. Therefore, it is not necessary to install a system to be separately provided, and the installation space and cost can be saved.

A mold temperature control system according to a second aspect is the mold temperature control system according to the first aspect, wherein the main part controls the temperature of the mold of the resin molding machine, and the subpart. It is characterized in that the temperature of the material feeding part of the resin molding machine is controlled by the above.

This mold temperature control system limits the system of claim 1 to the one used for temperature control of the mold of the resin molding machine, and in the subpart, the temperature control of the material injection part of the resin molding machine. Since this is done, the effect of claim 1 can be exerted for more specific temperature control of both the mold and the material charging part.

The mold temperature control system according to claim 3 is the mold temperature control system according to any one of claims 1 and 2, wherein the subpart is at least a medium for auxiliary temperature control. And a sub-pump for recirculating the stored medium, and a sub-sensor for detecting the temperature of the recirculated medium.

In this mold temperature control system, the structure of the subpart is limited to the subtank, the subpump, and the subsensor as the structure required for independent temperature control, and the effects of claims 1 and 2 are exhibited. The system can be configured more easily.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic view showing the overall structure of an example of a mold temperature control system according to the present invention.

This mold temperature control system 30 is used for a resin molding machine and has a main part 10 having substantially the same structure as the conventional mold temperature control system 130 shown in FIG.
In addition to the above, a subpart 20 capable of independently performing auxiliary temperature control is provided, and the main part 10 controls the temperature of the original mold K and the subpart 20 controls the temperature of the material injection part CA of the resin molding machine. It is something to do.

Therefore, the main tank 1 constituting the main part 10, the heater 1a installed in the main tank 1, the level switch 1b, the main pump 2, the pressure gauge 2a, the main sensor 3, and the pipelines 4a, 4b, Supply valve 4c, pipelines 4d, 4e, return valve 4f, pipelines 4g, 4h,
The pipeline system including the pressure regulating valve 4i, the pipeline 4j, the supply valve 4k, and the pipeline 4m includes a tank 101 of the mold temperature control system 130 and a heater 10 installed in the tank 101.
1a, level switch 101b, circulation pump 102, pressure gauge 102a, sensor 103, and pipeline 104a, 1
04b, supply valve 104c, pipelines 104d and 104e, return valve 104f, pipelines 104g and 104h, pressure regulating valve 1
04i, pipeline 104j, supply valve 104k, pipeline 104m
It has the same configuration as the pipeline system composed of, and exhibits the same effect.

The same parts as those in FIG. 4 are designated by the same reference numerals, and the duplicated description will be omitted.

On the other hand, the sub-part 20 provided in addition to the main part 10, which is a feature of this system, is
A sub-tank 11 for storing the medium w for auxiliary temperature control, and a sub-pump 1 for refluxing the stored medium w
2. The sub-sensor 13 for detecting the temperature of the medium w to be refluxed is provided, and these are connected by the pipe lines 14a to 14g.

The sub-tank 11 receives the supply of the medium w from the tank 1 of the main part 10 through the pipeline 14a and stores it.
The stored medium w is guided to the sub pump (P1) 12 by the conduit 14b provided with the sub sensor 13.
After being guided from the pump 12 to the material feeding portion CA of the resin molding machine by the pipe line 14c and flowing through the material feeding portion CA, it is returned to the sub tank 11 by the pipe line 14d.

The medium w, which has passed through the filter F from the medium supply source W, is supplied to the sub-tank 11 by the pipe line 14g having the supply valve 14h, and the temperature of the medium w stored in the sub-tank 11 is lowered. It is used. Due to this supply, the excess medium w merges into the conduit 4m of the main part 10 through the conduit 14f, and the discharge destination D
Is discharged to.

With this structure, the mold temperature control system 30 is a resin molding machine that controls the temperature of the mold K in the main part 10 and molds the resin in the mold K in the sub part 20. Although the temperature of the material feeding portion CA can be controlled at the same time, for example, a pipe from the medium supply source W, the tank 1, without a separate independent temperature control system is provided.
Since the pipeline to the drainage destination D is shared, the installation space,
Costs can be saved.

The conduits 4d, 4 of the main part 10
e, T provided in the pipelines 14c and 14d of the subpart 20 is a joint portion that connects and disconnects these pipelines, and thus, the system 30 is connected to the mold K to be temperature-controlled and the material charging unit CA. , And can be divided into a main body side for temperature control excluding these.

Actually, what is supplied as the mold temperature control system 30 is the main body side separated by the joint portion T,
It is composed of the mold K and the portions of the conduits 4d and 4e to the material feeding portion CA.

2A and 2B show the appearance of the main part and the subpart shown in FIG. 1. FIG. 2A is a side view and FIG. 2B is a rear view. In this figure, the same parts as those already described are designated by the same reference numerals, and the duplicated description will be omitted.

As can be seen from this figure, the main part 10 similar to the conventional one is housed inside one box 10a, while the sub part 20 for auxiliary temperature control is added to the rear part of the main part 10. Box 20a provided in a special manner
It is housed inside.

That is, although not visible in this figure, the sub-tank 11, the sub-pump 12, and the sub-sensor 13 described in FIG. 1 are housed inside the box 20a, and the resin is provided outside the box 20a. Only the joint portion T of the pipe lines 14c and 14d for connecting to the material feeding portion of the molding machine is drawn out.

As can be seen from this figure, in terms of space,
Compared to the main part 10, the sub part 20 does not require extra space, and in terms of cost,
Compared to installing another one, the same as the main part 10, it is a great savings.

FIG. 3 is a front view of FIG. 2 (a).

This front view shows the box body 1 of the main part 10.
0a shows the front of the main part 10
An operation display unit 5 for input / output relating to control of and the operation display unit 15 for the subpart 20 are shown.

The operation display section 5 of the main part 10 includes a medium current temperature display section 5a, a target temperature display section 5b as a control target, a reset button 5c for an alarm buzzer, and an on / off button 5d for turning on / off the system. , A setting button 5e for setting a target temperature, a monitor button 5f, an LCD display section 5g for performing various displays, an on / off button 5d
An ON / OFF display lamp 5h indicating the setting state of the above and an alarm display lamp 5i displaying the alarm state of the system are provided.

On the other hand, the operation display section 1 of the subpart 20
5 is a temperature display unit 15a that displays the target temperature and the current temperature.
By providing a setting button 15b for performing various settings, it is possible to perform operations and displays required only for the subpart 20.

As can be seen from this figure, the operation display section 15 can also be dealt with by allocating a part of the box 10a of the main part 10 without requiring an extra box for the subpart 20. It is possible to save space.

Although an example in which the mold temperature control system of the present invention is applied to a resin molding machine has been described here, the present invention is not limited to this. Along with this, the portion to be the subject of auxiliary temperature adjustment by the subpart is not limited to the material feeding portion.

Further, the structure of the sub-part is not limited to that shown here, and the part necessary for independent temperature control is further provided while sharing the necessary part with the main part. Also, as compared with the one shown here, a part thereof may be shared with the main part.

Specifically, the subpart may be further provided with a pressure adjusting valve and a pressure gauge similar to those of the main part, and the supply valve of the main part may be shared by the subpart.

[0044]

According to the mold temperature control system of the first aspect, in addition to the main part that originally controls the temperature of the target mold, auxiliary temperature control can be independently performed. With this sub-part, it is possible to perform temperature control of a temperature control target, for example, the temperature of a material injection section of a resin molding machine, without the need to separately provide a temperature control system separately. Therefore, it is not necessary to install a system that should be separately provided, and the installation space and cost can be saved.

According to the mold temperature control system of the second aspect, in addition to the effect of the first aspect, the system of the first aspect is limited to that used for temperature control of the mold of the resin molding machine, and Since the temperature of the material injection part of the resin molding machine is adjusted in the subpart, the effect of claim 1 can be obtained by more specifically controlling the temperature of both the mold and the material injection part of the resin molding machine. Demonstrate.

According to the mold temperature control system of the third aspect, in addition to the effect of the first or second aspect, the configuration of the subpart is a subtank as a configuration necessary for independent temperature control. The present invention is limited to the sub-pump and the sub-sensor, and a system exhibiting the effects of claims 1 and 2 can be more easily configured.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing an overall configuration of an example of a mold temperature control system according to the present invention.

2A and 2B are external views of the main part and subpart of FIG. 1, where FIG. 2A is a side view and FIG. 2B is a rear view.

FIG. 3 is a front view of FIG.

FIG. 4 is a schematic diagram showing an overall configuration of an example of a conventional mold temperature control system.

[Explanation of symbols]

1 main tank 2 main pump 3 main sensor 10 Main part 11 sub tank 12 sub pump 13 sub sensor 20 subparts 30 Mold temperature control system CA material input section K mold

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Motoharu Shimizu             2-19 Shojitsuta, Hirakata-shi, Osaka Matsu, Inc.             Well factory F term (reference) 4F201 BA06 BC01 BC07 BN05 BN11                       BQ02 BQ09 BQ20 BQ31 BQ34                       BQ57 BQ60                 4F202 CA11 CB01 CN01 CN05 CN13                       CN18 CN24 CN30

Claims (3)

[Claims] 1. A mold temperature control system for controlling the temperature of a mold used in a resin molding machine or the like, wherein auxiliary temperature control can be independently performed in addition to a main part for controlling the mold temperature. A mold temperature control system that is equipped with a sub-part that can be used. 2. The mold temperature control system according to claim 1, wherein the main part controls the temperature of the mold of the resin molding machine, and the subpart controls the material injection part of the resin molding machine. A mold temperature control system characterized in that the temperature is controlled. 3. The mold temperature control system according to claim 1, wherein the subpart stores at least a sub tank for storing a medium for auxiliary temperature control, and the stored medium. A mold temperature control system comprising a sub-pump for recirculating and a sub-sensor for detecting the temperature of the medium to be recirculated.