JP5294501B2 - Mold temperature controller - Google Patents

Mold temperature controller Download PDF

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JP5294501B2
JP5294501B2 JP2010191770A JP2010191770A JP5294501B2 JP 5294501 B2 JP5294501 B2 JP 5294501B2 JP 2010191770 A JP2010191770 A JP 2010191770A JP 2010191770 A JP2010191770 A JP 2010191770A JP 5294501 B2 JP5294501 B2 JP 5294501B2
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medium
temperature
mold
low
high
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JP2012045872A (en
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正明 目次
元治 清水
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株式会社松井製作所
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold thermostat capable of improving heat efficiency by decreasing one amount of a medium recovered by switching high/low temperature media. <P>SOLUTION: The mold thermostat 1 includes a high-temperature medium supply part 2, a low-temperature medium supply part 3, a medium-feeding side switching connection part 4 and a medium-returning side switching connection part 5 near a mold 8, a high-temperature medium storage part 20, a low-temperature medium storage part 30, a recovered medium storage part 60, and a pipe line. After a control part changes a mold heating state to a heating/cooling switching state in which a low-temperature medium sending route 14, the pipe line, a recovered medium storage part 60, and the low-temperature medium storage part 30 are communicated/connected, the control part switches the state to a mold cooling state. On the other hand, after the control part changes the mold cooling state to a cooling/heating switching state in which a high-temperature medium sending route 11, the pipe line, a recovered medium storage part 60, and the high-temperature medium storage part 20 are communicated/connected, the control part switches the state to the mold heating state. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention provides a mold temperature control apparatus comprising a high temperature medium supply unit that circulates and supplies a high temperature medium to a medium flow path provided in a mold, and a low temperature medium supply unit that circulates and supplies a low temperature medium to the medium flow path. About.

2. Description of the Related Art Conventionally, a mold temperature control device including a high-temperature medium supply unit that circulates and supplies a high-temperature medium to a medium flow path provided in a mold, and a low-temperature medium supply unit that circulates and supplies a low-temperature medium to the medium flow path ( A mold temperature control system) has been proposed. According to such a mold temperature control device, by heating the mold, the solidification of the molten resin injected into the mold cavity can be delayed, and the transferability of the cavity surface to the molded product can be delayed. (Transfer rate) could be improved. In addition, by cooling the mold after filling with the molten resin, the molten resin can be quickly solidified and the molding cycle can be shortened.
In such a mold temperature control device, when the mold heating process is conventionally switched from a mold heating process that circulates and supplies a high-temperature medium to a mold cooling process that circulates and supplies a low-temperature medium, the mold medium flow path and each path The amount of heat of the high-temperature medium remaining in is discarded and heat loss increases. Further, even when the mold cooling process is switched to the mold heating process, the medium flow path of the mold and the low temperature medium remaining in each path are returned to the high temperature medium storage unit, and the high temperature medium supply unit There was a problem that the thermal efficiency was lowered.

In Patent Document 1 below, heating includes a feed pipe line and a return pipe path connected to a heat medium flow path of a mold, and a cooling unit and a heating unit are connected to these through a water feed path, a return path, and a circulation path, respectively. Cooling devices have been proposed. Moreover, in this heating / cooling device, a temporary water storage pipe line provided with a pair of heat medium temporary water storage tanks is connected to the return pipe line.
In this heating / cooling device, when switching from hot water to cold water, the return pipe connected to the heat medium flow path of the mold is connected to the temporary water storage tank and pushed out of the heat medium flow path of the mold by feeding cold water. The hot water is sent to a temporary storage tank. By supplying this hot water, the cold water previously stored in the temporary water storage tank is pushed out and returned to the cold water circulation path via the cold water return path. On the other hand, when switching from cold water to hot water, the return pipe connected to the heat medium flow path of the mold is connected to a temporary water storage tank, and the cold water pushed out of the heat medium flow path of the mold by feeding hot water Into the temporary storage tank. With this cold water feeding, the hot water previously stored in the temporary water storage tank is pushed out and returned to the hot water circulation path via the hot water return path.

Patent Document 2 below proposes a mold temperature control device in which a high-temperature water tank and a low-temperature water tank each having a temperature controller are respectively connected to a mold fluid passage by a supply system and a return system. ing. In this mold temperature control device, a heat recovery tank is provided between the high temperature water tank and the low temperature water tank.
In this mold temperature adjusting device, when switching from heating to cooling, the high temperature water remaining in the fluid passage of the mold is recovered to the heat recovery tank via the high temperature water tank by supplying the low temperature water. Moreover, it is set as the structure which returns the low temperature water stored by the lower part side of the heat recovery tank to a low temperature water tank with supply of this high temperature water. On the other hand, when switching from cooling to heating, the low temperature water is sent to the lower side of the heat recovery tank, so that the high temperature water on the upper side of the heat recovery tank is sent to the high temperature water tank. The high temperature water is supplied from the high temperature water tank to the fluid passage of the mold along with this feeding, so that the low temperature water remaining in the fluid passage of the mold is collected in the low temperature water tank.

JP 2003-145599 A Japanese Patent No. 4421318

  However, in the conventional mold temperature control apparatus as described in each of the above patent documents, the mold is connected to the medium flow path of the mold via a relatively long medium supply line or return medium line. . In such a case, when switching from the supply of the high temperature medium to the supply of the low temperature medium and when switching from the supply of the low temperature medium to the supply of the high temperature medium, the high temperature medium or the low temperature medium remaining in the medium flow path of the mold In addition to this, the amount of high-temperature medium or low-temperature medium remaining in each pipe line is relatively large, and the amount of the medium is also taken into account to make the temporary water storage tank and heat recovery tank relatively large, and the medium remaining. Therefore, further improvement has been desired.

  The present invention has been made in view of the above circumstances, and provides a mold temperature control device that can reduce the amount of one medium collected when switching from one medium to the other medium and improve the thermal efficiency. It is aimed.

In order to achieve the above object, a mold temperature control device according to the present invention has a high temperature medium storage section for storing a high temperature medium, and is provided in the mold via a high temperature medium feeding path and a high temperature medium return path. A high-temperature medium supply unit that circulates and supplies the high-temperature medium to the medium flow path formed, and a low-temperature medium storage unit that stores the low-temperature medium, and is connected to the medium flow path via the low-temperature medium feeding path and the low-temperature medium return path. A mold temperature control device including a low temperature medium supply unit that circulates and supplies a low temperature medium, and is installed close to an inlet side of the medium flow path, and the high temperature medium supply path and the low temperature medium supply path Are connected in close proximity to the outlet side of the medium flow path, the high temperature medium return path and the low temperature medium return path, a medium-return-side switch connecting section for switchably communicated with the outlet of the medium flow path, Provided at the outlet side of the serial-medium flow paths, a temperature sensor for detecting the temperature of the medium, the medium-return-side switch connection unit is connected via line to each of the high-temperature medium reservoir and said low temperature medium reservoir A recovery medium storage unit, an on-off valve that opens and closes a pipe line connected to the recovery medium storage unit, and a control unit that controls the on-off valve and each switching connection unit. From the mold heating state in which a high-temperature medium is circulated and supplied to the medium flow path, the medium recovery that connects the low-temperature medium feeding path, the medium flow path, the return-side switching connection part, and the recovery medium storage part conduit, the collection medium storage unit, a heating and cooling switching state the medium discharge pipe and the low temperature medium reservoir connecting said with the recovery medium reservoir low temperature medium reservoir were connected communication, of the temperature sensor A high-temperature medium with a preset detection temperature When substantially below the middle of switching the set temperature of the set temperature and the set temperature of the preset low temperature medium from heating and cooling switching state, the low temperature medium into circularly supplying mold cooling state to the medium flow path On the other hand, from this mold cooling state, the high temperature medium feeding path, the medium flow path, the recovery medium storage section and the high temperature medium storage section are connected to the cooling / heating switching state, and the temperature sensor When the detected temperature exceeds the switching set temperature, the cooling / heating switching state is switched to the mold heating state.

In the present invention configured as described above, from the mold heating state, after switching to the heating / cooling switching state, the mold cooling state is switched to the cooling / heating switching state from the mold cooling state. After that, the mold is switched to the heating state.
In the heating / cooling switching state, the low-temperature medium feeding path, the medium flow path, the recovery medium storage section, and the low-temperature medium storage section are connected in communication. Thereby, by supplying the low temperature medium, the high temperature medium remaining in the medium flow path of the mold or the like is sent to the recovery medium storage unit, and with this supply, the low temperature medium stored in the recovery medium storage unit is It is sent to the low temperature medium storage unit. Therefore, the remaining high-temperature medium is not directly fed to the low-temperature medium storage unit, and the thermal efficiency in the low-temperature medium storage unit can be improved.
On the other hand, in the cooling / heating switching state, the high-temperature medium feeding path, the medium flow path, the recovery medium storage section, and the high-temperature medium storage section are connected in communication. As a result, the supply of the high-temperature medium discharges the low-temperature medium remaining in the medium flow passage of the mold and the like, and the high-temperature medium storage section in which the amount of the medium is reduced is stored in the recovered medium storage in the heating / cooling switching state. The hot medium stored (recovered) in the part is replenished. Therefore, the remaining low-temperature medium is not directly fed to the high-temperature medium storage unit, and the heat amount of the high-temperature medium recovered in the recovery medium storage unit can be used effectively, and the thermal efficiency in the high-temperature medium storage unit is improved. Can be improved.

In addition, the medium-side switching connection for switching the high-temperature medium feeding path and the low-temperature medium feeding path to the inlet of the mold medium flow path, and the high-temperature medium returning path and the low-temperature medium returning path are connected to the mold. The return side switching connection portion that switches to and communicates with the outlet of the medium flow passage of the mold is installed close to the inlet side and the outlet side of the medium flow passage, respectively. The recovery medium storage unit is connected via a pipe line. Therefore, it is possible to reduce the amount of one medium collected when switching from one medium to the other medium. That is, when switching from the mold heating state to the mold cooling state, in addition to the high-temperature medium remaining in the medium flow path of the mold, the high-temperature medium feed line and the low-temperature medium feed side The part from the part where the pipes merge and switch between them to the inlet of the medium flow path of the mold (common pipe on the medium feeding side) and the outlet of the medium flow path of the mold from the outlet side of the high-temperature medium The high-temperature medium remains also in the part (the return-side common pipe) that branches into the pipe and the return-side pipe of the low-temperature medium and switches between them. On the other hand, when switching from the mold cooling state to the mold heating state, similarly, in addition to the low-temperature medium remaining in the medium flow path of the mold, the medium supply side common pipe and the medium return side common pipe However, the low temperature medium remains. In the present invention configured as described above, the medium transmission side switching connection part and the medium return side switching connection part are installed close to the inlet side and the outlet side of the mold, respectively. Since the recovery medium storage section is connected via the pipe, the volume corresponding to the volume of the medium-feeding common pipe and the medium-returning-side common pipe can be made relatively small, and the medium remaining in these The amount (residual medium amount) can be reduced. As a result, the amount of medium to be recovered, that is, at least the residual medium amount can be reduced, the thermal efficiency in each medium storage unit can be effectively improved, and the size of the recovery medium storage unit can be reduced. You can also plan. Thereby, load reduction to heat exchangers, such as a heater of each medium storage part, and a cooler, and size reduction of these can be achieved. That is, the temperature of the high-temperature medium and the low-temperature medium is adjusted so as to become a preset temperature in each medium storage unit, but by reducing the amount of medium collected at each switching, each Since it is possible to reduce the amount of medium flowing into each medium storage section at the time of switching, it is possible to reduce the load on the heat exchanger and to reduce the size thereof, and to save power. .
Furthermore, since the amount of the medium to be recovered can be reduced, the time required for switching from the heating / cooling switching state to the mold cooling state and switching from the cooling / heating switching state to the mold heating state is reduced. Therefore, the molding cycle can be shortened.
In addition, a temperature sensor that detects the temperature of the medium is provided on the outlet side of the medium flow path, and when the detected temperature of the temperature sensor falls below a predetermined first switching set temperature that is set in advance by the control unit, While switching from the heating / cooling switching state to the mold cooling state, when the temperature detected by the temperature sensor exceeds a predetermined second switching set temperature, the mold heating state is switched from the cooling / heating switching state. The first switching set temperature and the second switching set temperature are set to a substantially intermediate temperature between the preset temperature of the high temperature medium and the preset temperature of the low temperature medium.
Thereby, compared with the case where switching control is performed based on time, flow volume, etc., the thermal efficiency in each medium storage part can be improved more safely, for example. In other words, when the mold heating state is switched to the mold cooling state, the low temperature medium is supplied to the medium flow path of the mold, but the heat medium remaining in the above portion and the heat capacity are relatively large. Due to the heat transfer from the mold, the temperature on the outlet side of the mold gradually decreases from the set temperature of the high temperature medium, although it is relatively instantaneous. On the other hand, when switching from the mold cooling state to the mold heating state, the high temperature medium is supplied to the medium flow path of the mold, but the passage of the low temperature medium remaining in the part and the transmission from the mold are the same. Due to the heat, the temperature on the outlet side of the mold gradually rises from the set temperature of the low temperature medium, although it is relatively instantaneous. By monitoring the temperature on the outlet side of the medium flow path of such a mold and controlling the switching to each of the above states, when recovering the high-temperature medium, the temperature is higher than a predetermined temperature (first switching set temperature). The recovery of a medium having a low temperature can be safely and reliably prevented, while the recovery of a medium having a temperature higher than a predetermined temperature (second switching set temperature) can be safely and reliably prevented when recovering a low temperature medium. As a result, it is possible to safely reduce the load on the heat exchanger such as a heater or a cooler of each medium storage unit, and it is possible to safely improve the thermal efficiency in each medium storage unit.
Moreover, the thermal efficiency in each medium storage part can be improved safely with simple control. In other words, although it is possible to set each switching set temperature to a different temperature, in this case, the load on the heat exchanger such as a heater or a cooler of each medium storage unit tends to increase. There is a case. As described above, each switching set temperature is set to a temperature substantially intermediate between the setting temperatures of the high-temperature medium and the low-temperature medium, so that safe and simple switching control is executed to such an extent that the thermal efficiency in each medium storage unit is not impaired. be able to. In other words, according to the above configuration, it is possible to prevent the medium having a temperature lower than the substantially intermediate temperature from being supplied to the high-temperature medium storage unit, and the medium having a temperature higher than the substantially intermediate temperature can be stored in the low-temperature medium. It can prevent being fed to the department. In other words, in order to reduce the load on the high temperature side and improve the thermal efficiency, for example, the predetermined first switching set temperature may be set to a relatively high temperature range. The medium remaining in the part or the medium to be discharged tends to remain relatively high, and when this medium is switched to the mold cooling state, the medium is returned to the low temperature side. The load may increase. On the other hand, the converse is also the same, but by adopting the above-described configuration, it is possible to reliably return a medium at a relatively low temperature at a relatively low temperature to each side, and reduce the load on each medium storage unit in a well-balanced manner. be able to. As a result, it can also be expected to shorten the molding cycle.

In the present invention, a branch is provided from the low-temperature medium feeding path, a medium feeding pipe for feeding the low-temperature medium to the recovery medium storage section, and this pipe is opened and closed and controlled by the control section. It is good also as a structure further provided with the on-off valve. In this case, the control unit controls the switching connection units and the on-off valves, and in the cooling / heating switching state, the low-temperature medium return path, the low-temperature medium storage section, and the medium feed pipe line The medium flow path and the recovery medium storage section may be connected in communication.
With this configuration, in the cooling / heating switching state, the supply of the high-temperature medium causes the low-temperature medium remaining in the medium flow path of the mold to be supplied to the low-temperature medium storage unit, and the low-temperature medium storage unit The low temperature medium is supplied to the recovery medium storage section via the low temperature medium supply path and the medium supply pipe. In addition, the high temperature medium stored in the recovery medium storage section in the heating / cooling switching state is replenished to the high temperature medium storage section where the amount of the medium decreases with the supply of the high temperature medium. In other words, according to the above configuration, the high-temperature medium recovered in the heating / cooling switching state and the low-temperature medium recovered in the cooling / heating switching state are connected to each recovery unit (the high-temperature medium is stored in the recovery medium through separate pipes). Part, the low temperature medium can be fed to the low temperature medium storage part). Therefore, for example, compared with a case where these are fed and collected using a pipe line connecting the return-side switching connection unit and the collection medium storage unit, the collected high-temperature medium is collected. It is possible to prevent the low-temperature medium from being mixed in the pipe line, and to more effectively improve the thermal efficiency in each medium reservoir.

Moreover, in this invention, it is good also as a structure fixed to each of the inlet side of the said medium flow path, and the said outlet side switching connection part and the said return side switching connection part.
With such a configuration, the amount of medium remaining in the above-described part (the amount of remaining medium) at each switching can be greatly reduced, and the amount of medium to be collected can be more effectively reduced.
Further, in the present invention, the return side switching connection portion is connected to a pipe connected to an outlet of a plurality of medium flow paths provided in the mold, and the high temperature medium return path, A low-temperature medium return path and the medium recovery line are connected to each other, and a hollow confluence branch part fixed to one side of the mold is provided. And a hollow shape that is connected to the inlets of a plurality of medium flow passages provided in the mold and fixed to the other side of the mold while being connected to the low-temperature medium feeding path. May be provided.

Moreover, in this invention, you may further provide the heater which heats the medium stored by the said collection | recovery medium storage part.
With such a configuration, the medium stored in the recovery medium storage unit can be preliminarily raised or kept warm before being supplied to the high temperature medium storage unit. Therefore, the time for heating the replenished high temperature medium to the preset temperature of the high temperature medium set in the high temperature medium storage unit can be shortened, and the molding cycle can be further shortened. Further, as described above, since the amount of medium collected in the collection medium storage unit can be reduced, even when such a heater is provided, heating with a relatively small size and low power consumption (electric capacity) is possible. As a whole, power saving can be expected.

Further, in the present invention, the recovery medium storage part has a vertically long cylindrical shape, the upper end part is connected to the return medium side switching connection part and the pipe line connected to the high temperature medium storage part, and the lower end You may connect the pipe line connected to the said low-temperature medium storage part to a part.
With such a configuration, a high-temperature medium can be stored from the upper side of the recovery medium storage unit, and a high-temperature medium can be supplied from the upper side to the high-temperature medium storage unit. It can be improved effectively.

In the present invention, the collection medium storage part may be formed in a long pipe shape.
With such a configuration, it is possible to effectively reduce the mixing of the high-temperature medium and the low-temperature medium collected and fed into the collection medium storage unit.

  The mold temperature control apparatus according to the present invention is configured as described above, so that it is possible to reduce the amount of one medium collected when switching from one medium to the other medium, and to improve thermal efficiency. Can do.

It is a schematic block diagram which shows typically an example of the metal mold | die temperature control apparatus which concerns on one Embodiment of this invention. It is a schematic perspective view which shows typically an example of the switching connection part with which the same mold temperature control apparatus is provided. It is a schematic time chart which shows an example of the basic operation | movement performed with the same mold temperature control apparatus. (A) is a schematic block diagram explaining operation | movement of the metal mold | die heating process performed with the same mold temperature control apparatus, (b) is operation | movement of the heating / cooling switching process performed with the same mold temperature control apparatus. It is a schematic block diagram explaining these. (A) is a schematic block diagram explaining operation | movement of the mold cooling process performed with the same mold temperature control apparatus, (b) is the operation | movement of the cooling / heating switching process performed with the same mold temperature control apparatus. It is a schematic block diagram explaining these. It is a schematic block diagram which shows typically an example of the metal mold | die temperature control apparatus which concerns on other embodiment of this invention.

Embodiments of the present invention will be described below with reference to the drawings.
1-5 is explanatory drawing for demonstrating the metal mold | die temperature control apparatus which concerns on 1st Embodiment.
In FIGS. 1 and 4 to 6, a pipeline (pipe) through which a medium flows is schematically shown by a solid line.

  As shown in FIG. 1, the mold temperature control apparatus 1 according to this embodiment includes a high-temperature medium supply unit 2 that circulates and supplies a high-temperature medium to a medium flow path 80 provided in the mold 8, and a medium flow path 80. A low temperature medium supply unit 3 that circulates and supplies a low temperature medium, a medium supply side switching connection unit 4 that is installed in the vicinity of the inlet 81 side of the medium flow path 80, and a port that is close to the outlet 82 side of the medium flow path 80. And a control panel 7 having a control unit (CPU) 70 for controlling each unit.

  The mold 8 heated and cooled by the mold temperature control device 1 may be any type, and may generally have a fixed mold and a movable mold. In such a mold 8, a resin or the like melted by a cylinder or the like of an injection molding machine (not shown) is injected into a cavity or the like formed by a fixed mold and a movable mold from a nozzle or the like, and a molded product is filled. Molded. The mold 8 is provided with a medium flow path 80 through which a medium for increasing or decreasing the temperature of the mold 8 flows. Reference numeral 83 denotes a temperature sensor that detects the temperature of the mold 8. Based on the temperature detected by the temperature sensor 83, switching from a mold heating process to a heating / cooling switching process, which will be described later, and a mold are performed. Switching from the cooling process to the cooling / heating switching process may be executed. Such switching may be switched in conjunction with the molding operation of the injection molding machine.

The high-temperature medium supply unit 2 includes a high-temperature medium storage unit 20 that stores a high-temperature medium, a heater 21 that serves as a heating unit that heats the medium stored in the high-temperature medium storage unit 20, a high-temperature medium feeding path 11 and a high-temperature medium. A high-temperature medium circulation pump 22 for circulatingly supplying a high-temperature medium to a medium flow path 80 provided in the mold 8 via the medium return path 12 is provided. In the example of the figure, an example of a multistage system in which a heater 21 such as a sheathed heater is provided in each storage pipe of the high-temperature medium storage unit 20 including a plurality of high-temperature medium storage pipes is shown. For example, a single heater may be provided.
A temperature sensor 23 for detecting the temperature of the high-temperature medium is provided at an appropriate position such as the outlet side of the high-temperature medium storage unit 20, and the temperature sensor 23 detects the temperature of the high-temperature medium so that the temperature becomes a preset temperature. Based on the temperature, the energization of the heater 21 is controlled by the control unit 70 described later. The set temperature of the high-temperature medium depends on the temperature of the resin that is melted and filled, the set temperature of the mold 8, and the like, but may be, for example, about 60 ° C to 200 ° C, or about 120 ° C to 180 ° C. It is good.
The discharge pressure of the high-temperature medium circulation pump 22 depends on pressure loss factors such as the type of medium and the diameter and length of each pipe line. For example, when water (fresh water) is used as a medium, the boiling point of atmospheric pressure If it is necessary to heat the medium to a higher temperature, the pressure in the system on the high temperature side may be maintained so that the medium does not boil according to the temperature. Although not shown, a pressure gauge or the like for detecting the pressure in the system is provided at an appropriate place. Further, the medium is not limited to water, and other mediums such as oil-based and alcohol-based media may be adopted.

The high-temperature medium supply unit 2 is provided with a medium connection port 24 and a medium connection port 25 to which the high-temperature medium supply path 11 and the high-temperature medium return path 12 are connected. The medium delivery port 24 and the medium outlet of the high temperature medium reservoir 20 are connected by a high temperature medium delivery path 11a, and the medium return port 25 and the medium inlet of the high temperature medium reservoir 20 are connected to the high temperature medium return path 12a. Connected by. Further, the above-described high-temperature medium circulation pump 22 is disposed in the high-temperature medium conveyance path 11a, and the intermediate portion of the high-temperature medium conveyance path 11a on the downstream side (discharge side) of the high-temperature medium circulation pump 22 The middle part of the medium return path 12 a is connected by a high temperature medium bypass line 13. The high temperature medium bypass pipe 13 is provided with a high temperature bypass valve (open / close valve) V3.
Further, a recovery medium storage unit 60 of the recovery medium storage unit 6 is connected to the high temperature medium storage unit 20 via a pipe line (medium supply pipe line) 10. Details of the recovery medium storage unit 6 will be described later.
Note that the high-temperature medium supply unit 2, the heater 21, the high-temperature medium circulation pump 22, the recovery medium storage unit 6, and the like are not illustrated, but the casing (casing) of the high-temperature medium supply unit 2 is omitted. ).

  The low-temperature medium supply unit 3 includes a low-temperature medium storage unit 30 that stores a low-temperature medium, a cooler 31 that serves as a cooling unit that cools the medium stored in the low-temperature medium storage unit 30, a low-temperature medium feeding path 14, and a low temperature medium. A low-temperature medium circulation pump 32 is provided for circulating and supplying a low-temperature medium to a medium flow path 80 provided in the mold 8 via the medium return path 15. In the illustrated example, the cooler 31 returns the medium received from the tank-shaped low-temperature medium storage unit 30 that stores the low-temperature medium by heat exchange. Such a cooler 31 may be of a gas type, an air-cooled type, a water-cooled type, etc., and the low temperature medium is indirectly exchanged with the refrigerant while circulating the low temperature medium stored in the low temperature medium storage unit 30. May be maintained at a predetermined temperature. That is, in the present embodiment, during operation of the mold temperature control apparatus 1, a closed path (closed loop) is formed so as to prevent the medium from flowing into and out of the system in principle. According to this, quality (water quality) management of the medium can be performed, and generation of scales and the like can be prevented.

The cooler 31 is not limited to the one cooled by heat exchange with the medium stored in the low-temperature medium storage unit 3. When the medium is water, the cold water is allowed to overflow from the low-temperature medium storage unit as necessary. It is good also as an aspect which maintains a low-temperature medium at predetermined | prescribed temperature by supplying (direct cooling).
Further, in each of the medium storage units 20 and 30 on the high temperature side and the low temperature side, an increase or a shortage of the medium is detected or regulated by a level meter, a float switch, or the like so that the medium is maintained at a predetermined level. Or may be replenished.

Similarly to the above, a temperature sensor 33 for detecting the temperature of the low-temperature medium is provided at an appropriate place such as the outlet side of the low-temperature medium storage unit 30 and this temperature sensor is set so that the low-temperature medium has a preset temperature. Based on the detected temperature 33, the operation of the compressor, condenser, pump, water supply means, etc. of the cooler 31 is controlled by the control unit 70 described later. The set temperature of the low-temperature medium may be, for example, about 5 ° C to 35 ° C.
The discharge pressure of the low-temperature medium circulation pump 32 depends on pressure loss factors such as the type of medium and the diameter and length of each pipe, as described above. For example, when water is used as the medium, When the high temperature side is maintained at a high pressure, the pressure becomes higher than the pressure on the high temperature side so that the low temperature medium can be circulated and fed when switched to each state as described later. Thus, the pressure in the system on the low temperature side may be maintained. Although not shown, a pressure gauge or the like for detecting the pressure in the system is provided at an appropriate place.

  The low-temperature medium supply unit 3 is provided with a medium connection port 34 and a medium connection port 35 to which the low-temperature medium supply path 14 and the low-temperature medium return path 15 are connected. The medium delivery port 34 and the medium outlet of the low temperature medium reservoir 30 are connected by a low temperature medium delivery path 14a, and the medium return port 35 and the medium inlet of the low temperature medium reservoir 30 are a low temperature medium return path 15a. Connected by. In addition, the low-temperature medium circulation pump 32 described above is disposed in the low-temperature medium conveyance path 14 a, and an intermediate portion of the low-temperature medium conveyance path 14 a on the downstream side (discharge side) of the low-temperature medium circulation pump 32 and a low temperature The low temperature medium bypass conduit 16 is connected to the midway part of the medium return medium path 15a. The low temperature medium bypass pipe 16 is provided with a low temperature bypass valve (open / close valve) V6. In each figure, a member indicated by reference numeral 15b provided in the low-temperature medium return passage 15a is a relief valve for maintaining the pressure in the system.

Note that the low-temperature medium storage unit 30, the cooler 31, the low-temperature medium circulation pump 32, and the like of the low-temperature medium supply unit 3 are not illustrated, but are housed in a casing (casing) of the low-temperature medium supply unit 3. Yes.
Alternatively, instead of an aspect in which each of the high-temperature medium supply unit 2 and the low-temperature medium supply unit 3 has an independent casing, a medium in which the above-described units included in the high-temperature medium supply unit 2 and the low-temperature medium supply unit 3 are accommodated in one casing. It is good also as a supply apparatus.
The flow rate of the medium to be discharged (medium-feeding) from the circulation pump 22, 32 of the respective medium supply unit 2 and 3, 100L / min (about 0.00167m 3 / sec) ~200L / min (about 0.00333M 3 / Second). The circulation pumps 22 and 32 may be operated at all times in principle while the apparatus 1 is in operation.

The medium feeding side switching connecting portion 4 is installed in the vicinity of the inlet 81 side of the medium flow path 80 of the mold 8, and the high temperature medium feeding path 11 and the low temperature medium feeding path 14 are connected to the inlet 81 of the medium flow path 80. It is set as the structure connected so that it can switch to. In the example shown in the figure, switching valves (open / close valves) V1 and V4 that switchably connect the high-temperature medium transport path 11 and the low-temperature medium transport path 14 to the inlet 81 of the medium flow path 80 are provided.
The return medium side switching connection portion 5 is installed close to the outlet 82 side of the medium flow path 80 of the mold 8, and the high temperature medium return path 12 and the low temperature medium return path 15 are connected to the outlet 82 of the medium flow path 80. It is set as the structure connected so that it can switch to. In the illustrated example, switching valves (open / close valves) V2 and V5 are provided so as to connect the high temperature medium return path 12 and the low temperature medium return path 15 to the outlet 82 of the medium flow path 80 in a switchable manner.

An example of a specific structure of the medium transmission side switching connection portion 4 and the medium returning side switching connection portion 5 will be described with reference to FIG.
In FIG. 2, the medium return side switching connection portion 5 is shown, and the medium return side switching connection portion 5 in the illustrated example is fixed to the outlet 82 side of the medium flow path 80 of the mold 8.
This return side switching connection 5 joins a plurality of medium flow paths 80 into a hollow confluence branch section (manifold section) 50 that branches into the return paths 12, 15 and a medium recovery pipe line 17 described later. The merging / branching portion 50 is fixed to one side portion of the mold 8. Any structure may be used for fixing the merging / branching portion 50 to the mold 8. For example, a flange or the like is provided in the merging / branching portion 50, and a bolt or the like is provided in a female screw hole or the like provided in one side of the die 8. May be fastened and fixed detachably.

Further, the junction branching section 50 has a plurality of mold side connection ports 51 to which pipes connected to the outlets 82 of the plurality of medium flow passages 80 are connected, and one port of the high temperature return valve (open / close valve) V2. , A low temperature return connection port 53 to which one port of the low temperature return valve (open / close valve) V5 is connected, and a connection port to which one end of the medium recovery line 17 is connected. 54 is provided. The other ports of the high temperature return valve V2 and the low temperature return valve V5 are connected to the high temperature medium return path 12 and the low temperature medium return path 15, respectively.
In addition, a temperature sensor 55 that detects the temperature of the medium discharged from the outlet 82 of the medium flow path 80 of the mold 8 is provided in the junction branching section 50.
The volume of the junction branching portion 50 depends on the number and volume of the medium flow passages 80 of the mold 8, but is, for example, about 0.2 L (200 cm 3 ) to 1.0 L (1000 cm 3 ), preferably 0. .2L (200cm 3) ~0.5L may be (500cm 3) about.

  In addition, although the reference code is attached in parentheses in FIG. 2 and the detailed description thereof is omitted, the medium transmission side switching connection portion 4 has a structure substantially similar to the above-described medium return side switching connection portion 5. A hollow confluence branch (manifold) 40 is provided which is fixed to the other side of the mold 8 and joins the medium transmission paths 11 and 14 to branch into a plurality of medium flow passages 80. The junction branch 40 is connected to the same mold side connection port, one port of the high temperature transfer valve (open / close valve) V1, and one of the low temperature transfer valve (open / close valve) V4. A low-temperature medium delivery port to which the port is connected is provided. The other ports of the high temperature delivery valve V1 and the low temperature delivery valve V4 are connected to the high temperature medium delivery path 11 and the low temperature medium delivery path 14, respectively.

By making the medium-side switching connection 4 and the return-side switching connection 5 fixed to the inlet 81 side and the outlet 82 side of the medium flow path 80 of the mold 8 as described above, The volume corresponding to the common side conduit and the return side common conduit can be made extremely small.
In addition, as the medium sending side switching connection part 4 and the medium returning side switching connection part 5 are not limited to those fixed as described above, each of the inlet 81 side and the outlet 82 side of the medium flow path 80 of the mold 8 is provided. Any device may be used as long as it is installed in the vicinity. For example, a frame or the like may be installed in the vicinity of the mold 8 and installed on the frame. Alternatively, it may be placed on the floor below the mold 8 or the like. Even such a thing corresponds to the above-mentioned medium-side common pipe and the above-mentioned common-side pipe on the return side, as compared to the conventional apparatus in the vicinity or switching between the high temperature side and the low temperature side in the apparatus. The volume can be made relatively small.

  Further, FIG. 2 shows an example in which the medium return side switching connection portion 5 (medium feeding side switching connection portion 4) is fixed to one of the molds composed of a fixed die and a movable die. For example, in the case where heating and cooling of the mold 8 are alternately performed using the mold temperature control apparatus 1 as in the present embodiment, only the cavity surface on one side of the mold is a decorative product. In many cases, the transfer is performed as a surface, and in this case, the transfer accuracy of the cavity surface on the other side is not required to be so high. In such a case, as shown in FIG. 2, the return side switching connection portion 5 (the feeding side switching connection portion 4) is fixed only to one of the molds (the decorative surface side) consisting of a fixed die and a movable die. (May be installed in close proximity). Alternatively, as shown in FIG. 1, the pipes connected to the inlet and the outlet of the other medium flow path 80 may be further connected to each other and may be connected to the medium flow paths of both molds. Furthermore, you may make it install the medium transmission side switching connection part 4 and the medium return side switching connection part 5 in each of both metal mold | dies.

  In this embodiment, the recovery medium storage unit 6 is incorporated in the casing of the high-temperature medium supply unit 2 as shown in FIG. 1, and collects the recovery medium storage for storing the medium to be recovered and fed as will be described later. Part 60 is provided. In the present embodiment, the collection medium storage unit 60 has a cylindrical shape (tank type) that is long in the vertical direction, and the volume thereof includes at least the volume of the medium flow path 80 of the mold 8. It is good also as a volume according to the volume equivalent to the said residual medium amount from each medium delivery valve V1, V4 of the switching connection part 4 to each return valve V2, V5 of the return side switching connection part 5. The volume of the collection medium storage unit 60 may be approximately the amount of the residual medium, but may be a volume that can accommodate a plurality of types of molds (that is, molds having different medium flow path volumes). Further, as in the basic operation example described later, when each switching is executed based on the temperature detected by the temperature sensor 55 provided on the outlet 82 side of the medium flow path 80 of the mold 8, recovery or feeding is performed. It is good also as a volume which can store the medium to be stored. That is, it is good also as a capacity | capacitance which can store the medium collect | recovered thru | or supplied until it reaches each switching preset temperature mentioned later including the said residual medium amount.

In the present embodiment, a heat insulating material 63 is provided on the outer periphery of the collection medium storage unit 60 so as to be covered. By providing such a heat insulating material 63, heat radiation of the recovery medium storage unit 60 can be prevented, and the amount of heat of the high temperature medium recovered can be used more effectively as will be described later.
In the present embodiment, a heater 64 is provided as a heating unit that heats the medium stored in the recovery medium storage unit 60. The heater 64 is composed of a sheathed heater or the like, as described above, and is provided in the collection medium storage unit 60.
Reference numeral 65 denotes a temperature sensor that detects the temperature of the medium stored in the recovery medium storage unit 60, and the energization of the heater 64 of the recovery medium storage unit 60 based on the temperature detected by the temperature sensor 65. Etc. may be controlled by the control unit 70 described later.
Further, the heating means is not limited to the one provided so as to house the heater, and may be provided on the outer periphery of the collection medium storage unit. In this case, a heat insulating material or the like may be further provided on the outer periphery thereof.

  One end of the recovery medium storage unit 60 is connected to the medium recovery pipe line 17 and one end of the high temperature medium storage unit 20 connected to the connection port 54 (see FIG. 2) of the return medium switching connection unit 5. A connection port 61 is provided for connection to the medium supply conduit 10 to which the section is connected. In the illustrated example, the other ends of the medium recovery pipe 17 and the medium supply pipe 10 are merged, and the merged pipe is connected to the connection port 61 at the upper end of the collection medium storage section 60. ing. The medium recovery line 17 and the medium supply line 10 are provided with a medium recovery line opening / closing valve V7 and a medium supply line opening / closing valve V10, respectively.

On the other hand, at the lower end of the recovery medium reservoir 60, the medium discharge pipe 18 having one end connected to the low temperature medium reservoir 30 and the medium feed having one end connected to the low temperature medium feed path 14 are provided. A connection port 62 to which the pipe line 19 is connected is provided. In the illustrated example, the other ends of the medium discharge pipe 18 and the medium feeding pipe 19 are joined together, and the joined pipe is connected to the connection port 62 at the lower end of the recovery medium storage section 60. Show.
In the illustrated example, the medium discharge pipe 18 has one end introduced into the low-temperature medium storage unit 30 opened to the atmosphere, and the other end side is connected to the recovery medium storage unit 60 and the medium discharge pipe 18a. The example branched to the supply / exhaust pipe line 18c connected to the medium storage part 20 is shown. A relief valve 18b for maintaining the pressure in the system on the high temperature side is provided on the one end side of the branch portion.
A medium discharge pipe opening / closing valve V8 is provided in the medium discharge pipe 18a.
The supply / discharge pipe 18c is provided with a supply / discharge valve 18d, a safety valve for preventing an abnormal increase in pressure in the system, a relief valve for releasing the volume expansion of the medium in the system on the high temperature side to the low temperature side, and the like. The supply / discharge valve 18d is closed at all times during operation of the device 1, and when supplying the medium into the high-temperature medium supply unit 2 before or after the operation of the device 1, for example. Alternatively, it is opened when the medium is discharged from the high temperature medium supply unit 2, and the system of the high temperature medium supply unit 2 is opened to the atmosphere.

The medium feeding line 19 is provided to be branched from the low temperature medium feeding path 14, and feeds the low temperature medium fed through the low temperature medium feeding path 14 to the recovery medium storage unit 60. . The medium feed line 19 is provided with a medium feed line opening / closing valve V9.
In addition, as the on-off valves V1 to V10 provided in each of the above-described medium transmission paths, each return path, and each pipe line, an electromagnetic valve, an air operated electromagnetic valve, a motor drive valve, or the like is controlled by a control unit 70 described later. Any device capable of opening / closing control may be used. When an air operated solenoid valve is employed, it may be connected to a compressed air source that supplies compressed air for driving via a filter, a regulator, or the like.
In addition, each of the above-described on-off valves V1 to V10 is illustrated as a single on-off valve in the illustrated example, but any one can be used as long as it can execute each switching state described later. Instead of such a single on-off valve, a three-way switching valve or other multi-port multi-position switching valve may be provided at an appropriate position.

The control panel 7 has time measuring means, an arithmetic processing unit, and the like, and controls the above-described on-off valves, devices, and units of the mold temperature control apparatus 1 according to a predetermined program, and signal lines to the CPU 70. A storage unit 71 and a display operation unit 72 are connected to each other through the. The CPU 70 is connected to the on-off valves, devices, and various sensors described above via signal lines and the like.
The display operation unit 72 sets and inputs various setting operations, pre-setting input items (mold setting temperature, high temperature medium setting temperature, low temperature medium setting temperature, and switching setting temperature described later), and the like. Display setting conditions and various operation modes.
The storage unit 71 includes various memories and the like, such as a control program for executing various operations such as setting conditions and input values set and input by operation of the display operation unit 72, and basic operations described later. Various programs, various preset operation conditions, various data tables, and the like are stored.
The control panel 7 may be incorporated in the casing of the high-temperature medium supply unit 2 or the low-temperature medium supply unit 3, or may be installed on the top or side of the casing.

Next, an example of a basic operation executed in the mold temperature control apparatus 1 having the above configuration will be described with reference to FIGS.
In the graph shown in FIG. 3, the horizontal axis is the time axis, the vertical axis is the detected temperature of the temperature sensor 55 provided in the return side switching connection portion 5, and the transition is schematically shown. A valve opening / closing operation and ON / OFF operation of each device are schematically illustrated.
4 and 5, the open / close valve in the open state is shown in white, the open / close valve in the closed state is shown in black, the high-temperature medium flow and the like are indicated by a dotted line, and the low-temperature medium flow and the like are indicated by a one-dot chain line.

<Mold heating process>
When the mold 8 is heated by circulating and supplying a high-temperature medium to the medium flow path 80 provided in the mold 8, the opening / closing control (or switching control) of each on-off valve is performed by the control unit 70. Heated.
That is, as shown in FIG. 3 and FIG. 4A, on the high temperature side, the high temperature medium delivery valve V1 and the high temperature return valve V2 are opened, the high temperature bypass valve V3 is closed, and the high temperature medium reservoir 20 and the mold 8 are closed. The medium flow path 80 is communicated with the high-temperature medium feeding path 11, the high-temperature medium returning path 12, and the switching connection portions 4 and 5. In this mold heating process, the on-off valves V7, V8, V9, and V10 provided in the pipes 17, 18, 19, and 10 connected to the recovery medium storage unit 60 are closed.
On the other hand, on the low temperature side, the low temperature medium delivery valve V4 and the low temperature medium return valve V5 are closed, the low temperature bypass valve V6 is opened, and the low temperature medium reservoir 30 and the low temperature medium bypass line 16 are connected to the low temperature medium conveyance path 14a and the low temperature medium. It communicates via the medium return path 15a.
Further, in this mold heating step, the heater 64 of the recovery medium storage unit 60 is in a stopped state.

In this mold heating process, the high temperature medium is circulated and supplied to the medium flow path 80 of the mold 8 on the high temperature side by the circulation pumps 22 and 32 provided in the medium supply units 2 and 3, thereby heating the mold 8. On the other hand, on the low temperature side, the low temperature medium is circulated through the low temperature medium bypass line 16.
In this mold heating step, the temperature detected by the temperature sensor 55 that detects the temperature of the medium discharged from the outlet 82 of the medium flow path 80 of the mold 8 is such that the molten resin is injected into the cavity of the mold 8. It slightly rises and falls depending on the filling, pressure holding process, etc., but changes at a preset temperature (for example, 150 ° C.) of the high-temperature medium.
In this mold heating process, the low temperature medium is stored in the recovery medium storage unit 60 by supplying the low temperature medium in the cooling / heating switching process to be described later, which is executed before the mold heating process. It is in the state.
In the initial operation after the apparatus 1 is started, the supply / discharge valve 18d is opened as described above, the medium is supplied to each of the medium storage units 20, 60, 30 and the like and stored to a predetermined level. A mold heating step may be performed.

<Heating / cooling switching process>
In the present embodiment, the heating / cooling switching step is executed after the mold heating step. That is, from the mold heating state, each on-off valve is controlled to be opened / closed (or switched) by the controller 70, and the low-temperature medium feeding path 14, the medium flow path 80 of the mold 8, the recovery medium storage section 60, and The heating / cooling switching state is established in which the low-temperature medium storage unit 30 is connected in communication.
That is, as shown in FIG. 3 and FIG. 4B, the high temperature transfer valve V1 and the high temperature return valve V2 are closed, the high temperature bypass valve V3 is opened, and the high temperature medium storage unit 20 and the high temperature medium bypass pipe 13 are opened. Are communicated with each other via the high-temperature medium feeding path 11a and the high-temperature medium returning path 12a. Further, the low temperature bypass valve V6 is closed, and the low temperature medium delivery valve V4, the medium recovery line on / off valve V7, and the medium discharge line on / off valve V8 are opened.

  In the heating / cooling switching step, the high temperature medium is circulated through the high temperature medium bypass pipe 13 on the high temperature side by the circulation pumps 22 and 32 provided in the medium supply units 2 and 3. On the other hand, on the low temperature side, a low temperature medium is supplied to the medium flow path 80 of the mold 8 via the low temperature medium feeding path 14, and the high temperature medium in the medium flow path 80 is included along with the supply of the low temperature medium. A high-temperature medium corresponding to at least the remaining medium amount remaining from the medium-feeding side switching connection unit 4 to the medium-returning side switching connection unit 5 is fed toward the collection medium storage unit 60 via the medium collection line 17. The Then, the high temperature medium is supplied from the upper end of the recovery medium storage unit 60 into the recovery medium storage unit 60, whereby the low temperature medium stored in the recovery medium storage unit 60 is supplied from the lower end of the recovery medium storage unit 60. It is discharged and fed to the low temperature medium storage unit 30 via the medium discharge line 18. That is, in this heating / cooling switching step, the low temperature medium stored in the recovery medium storage unit 60 is discharged so as to be replaced with the high temperature medium, and the high temperature medium is stored (recovered) in the recovery medium storage unit 60. Is done.

In this heating / cooling switching step, the temperature detected by the temperature sensor 55 that detects the temperature of the medium discharged from the outlet 82 of the medium flow path 80 of the mold 8 is the set temperature of the high temperature medium by supplying the low temperature medium. Decreases from the degree.
In this operation example, when the temperature detected by the temperature sensor 55 falls below a predetermined first switching set temperature (switching set temperature, threshold), the heating / cooling switching state is switched to the mold cooling state described later. I am doing so.

<Mold cooling process>
As described above, when the temperature detected by the temperature sensor 55 falls below a predetermined first switching set temperature, the on / off valves are controlled by the control unit 70 as shown in FIGS. 3 and 5A. (Or switching control) to switch from the heating / cooling switching state to the mold cooling state, and execute the mold cooling step. In this mold cooling state, the low temperature return valve V5 is opened, and the medium recovery line open / close valve V7 and the medium discharge line open / close valve V8 are closed. In this operation example, when switching from the heating / cooling switching state to the mold cooling state, the heater 64 of the recovery medium storage unit 60 is activated, and the high-temperature medium recovered in the heating / cooling switching step Is preheated or kept warm.

In this mold cooling step, the low temperature medium is circulated and supplied to the medium flow passage 80 of the mold 8 on the low temperature side by the circulation pumps 22 and 32 provided in the medium supply units 2 and 3, thereby cooling the mold 8. On the other hand, on the high temperature side, the high temperature medium is circulated through the high temperature medium bypass conduit 13 as in the heating / cooling switching step.
Further, the temperature detected by the temperature sensor 55 that detects the temperature of the medium discharged from the outlet 82 of the medium flow path 80 of the mold 8 is further lowered from the predetermined first switching set temperature by the supply of the low temperature medium, It changes at a preset temperature (for example, 10 ° C.) of the low temperature medium set in advance.

<Cooling / heating switching process>
In the present embodiment, the cooling / heating switching step is executed after the mold cooling step. That is, from the mold cooling state, each on-off valve is controlled to be opened / closed (or switched) by the control unit 70, and the high-temperature medium feeding path 11, the medium flow path 80 of the mold 8, the recovery medium storage part 60, and The cooling / heating switching state is established in which the high-temperature medium storage unit 20 is connected in communication. In the present embodiment, as described above, the medium feeding pipe 19 provided by branching from the low temperature medium feeding path 14 is provided, and in this cooling / heating switching state, the low temperature medium returning path 15, The medium flow path 80 of the mold 8 and the recovery medium storage section 60 are connected to each other through the low temperature medium storage section 30, the low temperature medium supply path 14, and the medium supply pipe path 19.
That is, as shown in FIGS. 3 and 5 (b), the high temperature delivery valve V1 is opened, the high temperature bypass valve V3 and the low temperature delivery valve V4 are closed, and the medium feeding line opening / closing valve V9 and the medium supply line are closed. The on-off valve V10 is opened.
Further, in this operation example, when switching from the mold cooling state to the cooling / heating switching state, the heater 64 of the recovery medium storage unit 60 is stopped.

In this cooling / heating switching step, the high-temperature medium from the high-temperature medium storage unit 20 is supplied toward the medium flow path 80 of the mold 8 by the circulation pumps 22 and 32 provided in the respective medium supply units 2 and 3. Along with the supply of the high-temperature medium, the low-temperature medium corresponding to at least the above-described residual medium amount including the low-temperature medium in the medium flow path 80 and remaining from the medium-side switching connection 4 to the medium-side switching connection 5 It is fed toward the low-temperature medium storage unit 30 via the medium return path 15. Further, the low-temperature medium from the low-temperature medium storage unit 30 is fed toward the recovery medium storage unit 60 via the low-temperature medium supply path 14 and the medium supply pipe 19 and recovered from the lower end of the recovery medium storage unit 60. It is supplied into the medium storage unit 60. Further, the high temperature medium stored in the recovery medium storage unit 60 is discharged from the upper end of the recovery medium storage unit 60 and supplied to the high temperature medium storage unit 20 via the medium supply line 10.
That is, the low temperature medium that has passed through the medium flow path 80 of the mold 8 and the like is supplied to the low temperature medium storage unit 30 along with the supply of the high temperature medium, and the medium decreases with the supply to the high temperature medium storage unit 20. With the supply of the low temperature medium from the low temperature medium storage unit 30 to the recovery medium storage unit 60, the high temperature medium stored (collected) in the recovery medium storage unit 60 is replenished. That is, in this cooling / heating switching step, the high temperature medium stored in the recovery medium storage unit 60 is discharged so as to be replaced with the low temperature medium, and the low temperature medium is stored in the recovery medium storage unit 60.

In this cooling / heating switching step, the temperature detected by the temperature sensor 55 that detects the temperature of the medium discharged from the outlet 82 of the medium flow path 80 of the mold 8 is the set temperature of the low temperature medium by supplying the high temperature medium. Rise from the degree.
In this operation example, when the temperature detected by the temperature sensor 55 exceeds a preset second switching setting temperature (switching setting temperature, threshold), the cooling / heating switching state is switched to the mold heating state. I have to.
The predetermined first switching set temperature and the predetermined second switching set temperature may be different switching set temperatures, but in this operation example, as shown in FIG. The temperature (threshold value) is approximately in the middle of a preset temperature of the low-temperature medium. For example, when the high temperature medium set temperature is 150 ° C. and the low temperature medium set temperature is 10 ° C. as described above, the switching set temperature may be 80 ° C.

As described above, when the temperature detected by the temperature sensor 55 exceeds the preset switching temperature, the cooling / heating switching state is switched to the mold heating state, that is, in FIGS. 3 and 4A. As shown, the high temperature return valve V2 is opened, the low temperature return valve V5 is closed, the low temperature bypass valve V6 is opened, the medium feed line opening / closing valve V9 and the medium supply line opening / closing valve V10 are closed, Perform the mold heating process.
In the same manner, the mold heating process, the heating / cooling switching process, the mold cooling process, and the cooling / heating switching process are repeated in this order in conjunction with the molding operation of the injection molding machine. The

As described above, according to the mold temperature control apparatus 1 according to the present embodiment, the thermal efficiency in the medium storage units 20 and 30 of the medium supply units 2 and 3 can be improved.
In addition, the amount of one medium collected when switching from one medium to the other medium can be reduced. That is, it is possible to greatly reduce the amount of residual medium corresponding to the amount of medium remaining in the conventional medium-side common conduit and the medium-side common conduit, and as a result, the amount of medium to be recovered, that is, at least The amount of the residual medium can be reduced, the thermal efficiency in each of the medium storage units 20 and 30 can be effectively improved, and the collection medium storage unit 60 can be downsized. Thereby, the load to heat exchangers, such as the heater 21 and the cooler 31, of each medium storage part 20 and 30 can be reduced, and these can be reduced in size. In other words, by reducing the amount of medium collected at each switching, it is possible to reduce the amount of medium flowing into (replenishing or feeding) each medium storage unit 20, 30 at each switching. It is possible to reduce the load on the heat exchangers 21 and 31 and to reduce the size thereof, and to save power.
Furthermore, since the amount of the medium to be recovered can be reduced, the time required for switching from the heating / cooling switching state to the mold cooling state and switching from the cooling / heating switching state to the mold heating state is reduced. Therefore, the molding cycle can be shortened.

  Further, in the present embodiment, a branch is provided from the low-temperature medium feeding path 14, a medium feeding pipe 19 that feeds the low-temperature medium to the recovery medium storage section 60, and a control section that opens and closes the pipe. And the opening / closing valve V9 controlled by 70, and in the cooling / heating switching state, the medium of the mold 8 is passed through the low-temperature medium return path 15, the low-temperature medium storage section 30, and the medium feed line 19. The flow path 80 and the recovery medium storage unit 60 are connected in communication. Therefore, the high-temperature medium recovered in the heating / cooling switching state and the low-temperature medium recovered in the cooling / heating switching state are connected to each recovery unit (high-temperature medium is recovered medium storage unit 60, The low temperature medium can be fed to the low temperature medium storage unit 30). Therefore, for example, compared with the case where these are fed and collected using the pipe line 17 that connects the return-side switching connection unit 5 and the collection medium storage unit 60, respectively, the recovered high-temperature medium And the recovered low-temperature medium can be prevented from being mixed in the pipe line, and the thermal efficiency in each of the medium storage units 20 and 30 can be improved more effectively.

Furthermore, in the present embodiment, since the heater 64 for heating the medium stored in the recovery medium storage unit 60 is provided, the replenishment (recovery) is performed in the recovery medium storage unit 60 before the hot medium storage unit 20 is replenished. ) Can be preheated or kept warm. Therefore, the time for heating the replenished high-temperature medium to the set temperature in the high-temperature medium storage unit 20 can be shortened, and the molding cycle can be further shortened. In addition, as described above, the amount of medium collected in the collection medium storage unit 60 can be reduced, so even when such a heater 64 is provided, it is relatively small and consumes less power (electric capacity). A small heater 64 can be employed, and overall power saving can be expected.
Furthermore, in the present embodiment, the recovery medium storage unit 60 has a vertically long cylindrical shape, the medium recovery line 17 and the medium supply line 10 are connected to the upper end, and the medium discharge pipe is connected to the lower end. The path 18 is connected. Therefore, a high-temperature medium can be stored from the upper side of the recovery medium storage unit 60, and a high-temperature medium can be replenished to the high-temperature medium storage unit 20 from the upper side. Can be improved. Furthermore, in the present embodiment, since the medium feeding conduit 19 provided as described above is connected to the lower end portion of the recovery medium storage unit 60, the recovery medium storage unit 60 has a high-temperature medium from its upper end portion. The low temperature medium flows in and out from its lower end. Therefore, the thermal efficiency in each medium storage part 20 and 30 can be improved more effectively.

Further, in the above operation example, switching from the heating / cooling switching state to the mold cooling state based on the temperature detected by the temperature sensor 55 that detects the temperature of the medium on the outlet 82 side of the medium flow path 80 of the mold 8, In addition, switching from the cooling / heating switching state to the mold heating state is executed. Therefore, for example, the thermal efficiency in each of the medium storage units 20 and 30 can be improved more safely than when switching control is performed based on time, flow rate, or the like. That is, by monitoring the temperature on the outlet 82 side of the medium flow path 80 of the mold 8 that moves up and down as described above in accordance with the switching to each state, the switching to each of the above states is controlled to recover the high-temperature medium. In this case, recovery of a medium having a temperature lower than a predetermined temperature (first switching set temperature) can be safely and reliably prevented, while when recovering a low-temperature medium, the recovery from a predetermined temperature (second switching set temperature) can be prevented. In addition, it is possible to safely and reliably prevent recovery of a medium having a high temperature. As a result, it is possible to safely reduce the load on the heat exchangers such as the heater 21 and the cooler 31 of each medium storage unit 20, 30, and to improve the thermal efficiency in each medium storage unit 20, 30 safely. Can do.
Further, in the above operation example, the first switching set temperature and the second switching set temperature are set to a substantially intermediate temperature between the preset temperature of the high temperature medium and the preset temperature of the low temperature medium. Therefore, the thermal efficiency in each medium storage part 20 and 30 can be improved safely with simple control. That is, it is possible to prevent the medium having a temperature lower than the approximately intermediate temperature from being supplied to the high temperature medium storage unit, and to supply the medium having a temperature higher than the approximately intermediate temperature to the low temperature medium storage unit. Can be prevented. In other words, a medium having a relatively low temperature at a relatively low load can be reliably returned to each side, and the load on each medium storage unit 20, 30 can be reduced in a well-balanced manner. As a result, it can also be expected to shorten the molding cycle.

  In the above operation example, when switching from the heating / cooling switching state to the mold cooling state, and when switching from the cooling / heating switching state to the mold heating state, the switching set temperature is the preset temperature of the high-temperature medium. Although an example in which the temperature is set approximately in the middle of the set temperature of the low-temperature medium is shown, the present invention is not limited to such a mode. The predetermined first switching set temperature and the predetermined second switching set temperature may be different from each other. For example, the predetermined first switching set temperature is set to a value obtained by subtracting a preset threshold from the preset temperature of the hot medium, or the predetermined second switching set temperature is set to a preset low temperature medium. A value obtained by adding a preset threshold value to the temperature may be used.

  Further, in the above operation example, switching from the heating / cooling switching state to the mold cooling state based on the temperature detected by the temperature sensor 55 that detects the temperature of the medium on the outlet 82 side of the medium flow path 80 of the mold 8, In addition, although an example is shown in which switching from the cooling / heating switching state to the mold heating state is performed, the present invention is not limited to such an embodiment. While the heating / cooling switching state is continued so that the temperature of the medium on the outlet 82 side of the medium flow path 80 of the mold 8 is lower than a predetermined temperature, the medium of the mold 8 is switched to the mold cooling state. You may make it switch to the said metal mold | die heating state, after continuing the said cooling and heating switching state so that the temperature of the medium by the side of the exit 82 of the flow path 80 may exceed predetermined temperature. In this case, regardless of the temperature detected by the temperature sensor 55, for example, based on various conditions such as the set temperature of each medium, the set flow rate of each medium, the piping route, and the like, the medium is discharged from the outlet of the medium flow path at each switching. A mode in which the switching time, the switching flow rate, and the like are set in advance so that the medium to be set at the predetermined temperature is monitored by a timer or a flow meter, and the switching control is performed.

Further, instead of such a mode, it is possible to recover a high-temperature medium or a low-temperature medium corresponding to the residual medium amount based on various conditions such as the residual medium amount, a set flow rate of each medium, and a piping route. As described above, the switching time, the switching flow rate, and the like may be set in advance, and these may be monitored by a timer or a flow meter to perform switching control.
That is, from the mold heating state, the heating / cooling switching state is established in which the low-temperature medium feeding path 14, the medium flow path 80 of the mold 8, the recovery medium storage unit 60, and the low-temperature medium storage unit 30 are connected in communication. Later, while switching to the mold cooling state, from this mold cooling state, the high-temperature medium feeding path 11, the medium flow path 80 of the mold 8, the recovery medium storage part 60 and the high-temperature medium storage part 20 are connected in communication. After switching to the cooling / heating switching state, switching to the mold heating state may be performed.
Moreover, although the example which provided the heater 64 which heats the medium stored by the collection | recovery medium storage part 60 is shown in this embodiment, you may make it not provide such a heater.

Next, another embodiment of the mold temperature control device according to the present invention will be described with reference to the drawings.
FIG. 6 is an explanatory diagram for explaining a mold temperature control apparatus according to the second embodiment.
Note that differences from the first embodiment will be mainly described, and the same components will be denoted by the same reference numerals, and description thereof will be omitted or simplified. Also, description of similar operation examples will be omitted or briefly described.

The mold temperature control apparatus 1A according to the present embodiment includes a configuration of a recovery medium storage unit 6A provided in the high temperature medium supply unit 2A and connection of a pipe line connected to a recovery medium storage unit 60A included in the recovery medium storage unit 6A. The aspect is mainly different from the first embodiment.
In the present embodiment, as shown in FIG. 6, the recovery medium storage section 60 </ b> A is formed in a long pipe shape. By using such a long tubular recovery medium storage unit 60A, the mixing of the high-temperature medium and the low-temperature medium recovered or fed to the recovery medium storage unit 60A is effectively reduced. be able to.
In the present embodiment, the volume of the recovery medium storage unit 60A is set to a volume corresponding to the residual medium amount.
In the present embodiment, the medium recovery conduit 17 and the medium supply conduit 19 are connected to one end 61A of the recovery medium reservoir 60A, and the medium discharge conduit is connected to the other end 62A of the recovery medium reservoir 60A. The example which connected 18 and the medium supply line 10 is shown.

In the mold temperature control apparatus 1A according to the present embodiment having the above-described configuration, instead of the switching control based on the temperature detected by the temperature sensor 55 described above, various types such as the residual medium amount, the set flow rate of each medium, and the piping path are various. Based on the conditions, the switching time, switching flow rate, etc. are set in advance so that the high temperature medium or low temperature medium corresponding to the above residual medium amount can be recovered, and these are monitored by a timer or a flow meter. -It is good also as an operation | movement aspect which performs switching control so that switching from a cooling switching state to a mold cooling state and switching from a cooling / heating switching state to a mold heating state may be performed. In this case, the temperature sensor 55 may not be provided.
That is, in this embodiment as well, as in the first embodiment, the amount of the remaining medium can be reduced. Therefore, at least when recovery of each medium corresponding to the amount of the remaining medium is completed, the heating / cooling switching state is started. Switching to the mold cooling state and switching from the cooling / heating switching state to the mold heating state may be performed. According to this, compared with the basic operation example described in the first embodiment, a higher temperature medium can be recovered in the recovery medium storage unit 60A, and the high temperature medium can be supplied to the high temperature medium storage unit 20. . In addition, the molding cycle can be further shortened as compared with the basic operation example described in the first embodiment.

In addition, you may make it provide the heat insulating material similar to the above in the outer periphery of the collection | recovery medium storage part 60A.
Moreover, you may make it wind the linear heater as a heater of a collection medium storage part around the outer periphery of the collection medium storage part 60A. Alternatively, in addition to or in addition to this, a linear heater as a heater of the collection medium storage unit may be disposed inside thereof.
Further, a plurality of pipe-shaped collection medium storage portions may be detachably connected by joints or the like, and the collection medium storage portion may be changed to have a volume corresponding to the amount of residual medium. Good.
Furthermore, the connection mode between the recovery medium storage unit 60A and the pipes 17, 18, 19, and 10 may be the same connection mode as in the first embodiment. In this case, it is good also as an operation | movement aspect which performs switching control similar to the basic operation example of the said 1st Embodiment. Further, in this case, similarly to the first embodiment, the volume of the recovery medium storage unit 60A includes the residual medium amount and can store the medium to be recovered or fed before reaching each switching set temperature. It may be a large volume.
Furthermore, you may make it apply the connection aspect of the collection | recovery medium storage part demonstrated in this embodiment, and each pipe line to the metal mold | die temperature control apparatus which concerns on the said 1st Embodiment.

In each of the above-described embodiments, the mold temperature control devices 1 and 1A including the above-described units have been described. However, the high-temperature medium supply device 2 (2A) including the high-temperature medium storage unit 20 and the like, Low temperature medium supply device 3 having medium storage unit 30 and the like, medium side switching connection unit (medium side valve unit) 4, medium return side switching connection unit (medium return side valve unit) 5, and recovery medium storage The mold temperature control system 1 (1A) including the recovery medium storage unit 6 (6A) having the unit 60 (60A) and the like and the control unit 7 having the control unit 70 and the like may be grasped. .
In addition, as a low-temperature medium storage unit of the low-temperature medium supply unit, for example, grasp a cooling tower or the like installed in a factory or the like as a low-temperature medium storage unit, and arrange a pump, a cooler, etc. upstream of this mold, These may constitute a low-temperature medium supply unit.
Furthermore, in each said embodiment, in order to collect | recover efficiently the calorie | heat amount of the collect | recovered high temperature medium, the example which provided the collection medium storage unit 6 (6A) in the high temperature medium supply part 2 (2A) is shown. However, it is good also as what is installed as an apparatus different from the high temperature medium supply part 2 (2A).

Furthermore, in each of the above embodiments, an example is shown in which a medium feeding pipe branched from the low-temperature medium feeding path and connected to the recovery medium storage section is provided. However, such a medium feeding pipe is provided. It may not be possible. In this case, in the cooling / heating switching state, the medium flow path 80 of the mold 8 and the recovery medium storage unit 60 (60A) may be connected to each other via the medium recovery pipe line 17.
Moreover, in each said embodiment, although the collection medium storage part made into the elongate cylindrical shape or the elongate pipe line shape was illustrated to each, as a collection medium storage part, in such an aspect, The shape is not limited, and any shape may be used as long as the collected medium can be stored.

1,1A Mold Temperature Control Device 10 Medium Replenishment Pipeline (Pipeline connecting recovery medium reservoir and high temperature medium reservoir)
DESCRIPTION OF SYMBOLS 11 High temperature medium feeding path 12 High temperature medium returning path 14 Low temperature medium feeding path 15 Low temperature medium returning path 17 Medium collection | recovery line (Pipe line which connects a return side switching connection part and a collection | recovery medium storage part)
18 Medium discharge pipe (pipe line connecting the recovery medium storage part and the low-temperature medium storage part)
DESCRIPTION OF SYMBOLS 19 Medium supply line 2,2A High temperature medium supply part 20 High temperature medium storage part 3 Low temperature medium supply part 30 Low temperature medium storage part 4 Medium transmission side switching connection part 5 Return medium side switching connection part 55 Temperature sensor 60, 60A Recovery medium Reservoir 64 Heater 8 Mold 80 Medium flow passage 81 Medium flow passage inlet 82 Medium flow passage outlet V7 Medium recovery line open / close valve V8 Medium discharge line open / close valve V9 Medium feed line open / close valve V10 Medium supply pipe Road open / close valve

Claims (7)

  1. A high-temperature medium supply unit that has a high-temperature medium storage unit that stores a high-temperature medium, and circulates the high-temperature medium to a medium flow path provided in the mold via the high-temperature medium feeding path and the high-temperature medium return path; A mold temperature control device having a low-temperature medium storage section for storing a medium, and a low-temperature medium supply section that circulates and supplies the low-temperature medium to the medium flow path via a low-temperature medium feeding path and a low-temperature medium return path Because
    A medium-side switching connecting portion that is installed in the vicinity of the inlet side of the medium flow path, and communicates the high-temperature medium feeding path and the low-temperature medium feeding path to the inlet of the medium flow path in a switchable manner; A return side switching connecting portion that is installed close to the outlet side of the medium flow path and connects the high temperature medium return path and the low temperature medium return path to the outlet of the medium flow path in a switchable manner; and the medium A temperature sensor for detecting the temperature of the medium provided on the outlet side of the flow path, and a recovery connected to each of the return medium side switching connection portion, the high temperature medium storage portion, and the low temperature medium storage portion via pipes A medium storage unit, an on-off valve that opens and closes a pipe connected to the recovery medium storage unit, and a control unit that controls the on-off valve and each switching connection unit,
    From the mold heating state in which the high-temperature medium is circulated and supplied to the medium flow path, the control unit includes the low-temperature medium feeding path, the medium flow path, the return-side switching connection section, and the recovery medium storage section. A heating / cooling switching state in which the medium recovery pipe to be connected, the recovery medium storage , the medium discharge pipe connecting the recovery medium storage and the low-temperature medium storage, and the low-temperature medium storage are connected to each other , When the temperature detected by the temperature sensor is lower than a preset switching temperature between a preset temperature of the high temperature medium and a preset temperature of the low temperature medium, the medium is switched from the heating / cooling switching state to the medium. While switching to the mold cooling state in which the low temperature medium is circulated and supplied to the flow path, the high temperature medium feeding path, the medium flow path, the recovery medium storage section, and the high temperature medium storage section are communicated from this mold cooling state. Connected cold And heating the switched state, when the detected temperature of the temperature sensor exceeds the switch setting temperature from the cooling-heating changeover state, the mold temperature adjusting apparatus, characterized in that switching to the mold heated state.
  2. In claim 1,
    A medium supply pipe that branches off from the low-temperature medium supply path, and that supplies a low-temperature medium to the recovery medium storage section; and an on-off valve that opens and closes the pipe and is controlled by the control section Further comprising
    In the cooling / heating switching state, the control unit communicates the medium flow path and the recovery medium storage unit via the low-temperature medium return channel, the low-temperature medium storage unit, and the medium feeding pipe. A mold temperature control device characterized in that
  3. In claim 1 or 2,
    The mold temperature control device, wherein the medium feeding side switching connecting portion and the medium returning side switching connecting portion are fixed to each of an inlet side and an outlet side of the medium flow passage.
  4. In claim 3 ,
    The return side switching connection portion is connected to pipes connected to the outlets of a plurality of medium flow paths provided in the mold, and the high temperature medium return path, the low temperature medium return path, and the A medium recovery conduit is connected, and comprises a hollow confluence branch fixed to one side of the mold,
    The medium-side switching connection portion is connected to the high-temperature medium conveyance path and the low-temperature medium conveyance path, and connected to pipes connected to the inlets of a plurality of medium flow paths provided in the mold. is, mold temperature control device, characterized that you have a hollow-shaped confluent branch portion fixed to the other side of the mold.
  5. In any one of Claims 1 thru | or 4 ,
    The mold temperature control apparatus further comprising a heater for heating the medium stored in the recovery medium storage unit.
  6. In any one of Claims 1 thru | or 5 ,
    The recovery medium storage unit has a vertically long cylindrical shape, an upper end is connected to the return side switching connection unit and a pipe connected to the high temperature medium storage unit, and a lower end is the low temperature A mold temperature control device, characterized in that a pipe connected to a medium reservoir is connected.
  7. In any one of Claims 1 thru | or 5 ,
    The mold temperature control device, wherein the recovery medium storage part is formed in a long pipe shape.
JP2010191770A 2010-08-30 2010-08-30 Mold temperature controller Active JP5294501B2 (en)

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JP6198596B2 (en) * 2013-12-11 2017-09-20 株式会社松井製作所 Medium supply device
KR101491609B1 (en) 2014-05-23 2015-02-11 주식회사세진바이오텍 Heating and cooling device for mold
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