JP2003008196A - Method and machine for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and a machine for mounting an electronic component in which a high end electronic component having bumps of narrow pitch can be mounted. SOLUTION: Each solder bump 1b of an electronic component 1 sucked by the suction nozzle 11 of a head tool 3 is abutted against each solder part 2 of a circuit board 4 and then each solder bump 1b and each solder part 2 are fused by heating. Suction holding of the electronic component 1 by the suction nozzle 11 of the head tool 3 is not released during fusion of solder but released after the fused solder is cooled.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for mounting electronic components on a circuit board, and particularly to an electronic component such as an IC chip having narrow pitch bumps on a circuit board by a flip chip bonding method. The present invention relates to a mounting method and mounting device for electronic components that can be mounted.

[0002]

2. Description of the Related Art Conventionally, various methods for mounting electronic components of this type have been known. As an example of a conventional electronic component mounting method using a flip chip bonding method, a method of temporarily soldering a plurality of electronic components onto a circuit board and then collectively reflowing solder to mount the electronic components (hereinafter, collectively reflow mounting Method)) is shown in FIG.

As shown in FIG. 11A, the pads 8 which are a plurality of electrodes on the upper surface of a plate-shaped circuit board 84.
The cream solder is supplied onto the surface 4a by printing or the like to form the solder portion 82 on each pad 84a of the circuit board 84.

Next, in FIG. 11B, the electronic component 81 in which the solder bumps 81b are bonded to the plurality of electrodes 81a on the bonding surface is sucked by the tool 83 on the back surface which is the surface without the electrodes 81a. After being held and aligned so that the solder bumps 81b of the electronic component 81 can be bonded to the solder portions 82 on the circuit board 84, the solder bumps 81b of the electronic component 81 are attached to the solder portions 82 of the circuit board 84. Pressurize to perform temporary joining. When mounting a plurality of electronic components 81 on the circuit board 84, these operations are repeated to mount each electronic component 81 on the circuit board 84. The term “temporary joining” as used herein means that the joining of the electronic component 81 and the circuit board 84 can be released by destroying the electronic component 81 and the circuit board 84 by applying an external force to the electronic component 81 or the circuit board 84. Shows possible joints.

After that, the circuit board 84 to which the electronic components 81 are temporarily joined is conveyed to the solder reflow working unit. Figure 1
As shown in 1 (c), in the solder reflow working unit,
The electronic components 81 and the circuit board 84 are heated by the heat source, and the solder portions 82 and the solder bumps 81b are melted. When the plurality of electronic components 81 are temporarily joined on the circuit board 84, the solder is reflowed all at once in the solder reflow working unit.

Thereafter, as shown in FIG. 11D, in the circuit board 84 taken out from the solder reflow working section, the molten solder is cooled and solidified, so that each electrode 81a of each electronic component 81 is connected to the circuit. The pads 84a of the board 84 are permanently joined via solder, and the electronic components 81 are collectively mounted on the circuit board 84. Here, the main bonding is a bonding performed by applying heat to the electronic component 81 and the circuit board 84 in the temporary bonding state to melt and solidify the solder, and the electronic component 81 or the circuit board 84. It is difficult to easily release the joined state by applying external force to the joint.

In such a collective reflow mounting method, after a large number of electronic components 81 have been temporarily joined, the solder can be melted in a lump and each electronic component 81 can be permanently joined to the circuit board 84 for mounting. Since the mounting work of the electronic components can be efficiently performed, the mounting cost of each electronic component 81 on the circuit board 84 can be suppressed.

However, in such a method, after each electronic component 81 is temporarily joined to the circuit board 84, the solder is melted to perform the main joining, so that the circuit board 84 to which each electronic component 81 is temporarily joined is formed. It is necessary to convey to the solder reflow work part, and due to the vibration etc. generated during the conveyance during this conveyance,
When the joint position of each electronic component 81 with respect to the circuit board 84 is displaced and the solder is reflowed as it is, each electronic component 8
In some cases, the connection of No. 1 to the circuit board 84 may be defective. For electronic components that do not require high bonding position accuracy, such as general-purpose electronic components, the bonding position deviation that occurs in the batch reflow mounting method did not pose a problem, but particularly high bonding position accuracy is required. In electronic parts such as IC chips, there may be a problem.

As an example of a conventional flip chip bonding method for mounting electronic components that solves the problems in such a batch reflow mounting method, the electronic components are individually soldered by heating and pressing them on a circuit board. FIG. 12 shows a method of reflowing and mounting an electronic component (hereinafter referred to as a conventional local reflow mounting method).

As shown in FIG. 12A, a pad 9 which is a plurality of electrodes on the upper surface of a plate-shaped circuit board 94.
Cream solder is supplied onto the surface 4a by printing or the like to form the solder portion 92 on each pad 94a of the circuit board 94.

Next, as shown in FIG. 12B, the electronic component 91 in which the solder bumps 91b are bonded to the plurality of electrodes 91a on the bonding surface has a back surface which is a surface without each electrode 91a as a tool. After the solder bumps 91b of the electronic component 91 are aligned so that the solder bumps 91b of the electronic component 91 can be joined to the solder portions 92 of the circuit board 94, the solder bumps 91b of the electronic component 91 are soldered to the solder of the circuit board 94. Pressure is applied to the portion 92 while heating to melt each solder portion 92 and each solder bump 91b.

Next, as shown in FIG. 12C, the suction holding of the electronic component 91 by the tool 93 is released while the solder is in a molten state. As a result, the self-alignment effect due to the surface tension of the molten solder can be obtained.

Thereafter, as shown in FIG. 12 (d), the melted solder is solidified so that each electrode 91a of the electronic component 91 is bonded to each pad 94a of the circuit board 94 via the solder, and the electronic component 91 are individually mounted on the circuit board 94. When a plurality of electronic components 91 are mounted on the circuit board 94, these operations are repeated to individually mount each electronic component 91 on the circuit board 94.

In such a local reflow mounting method, the electronic component 91 is sucked and held by the tool 93,
The solder bumps 91b of the electronic component 91 are heated and pressed by the tool 93 to the solder portions 92 of the circuit board 94, and then the electronic component 9 is applied by the tool 93 during the molten state of the solder.
Since the adsorption and holding to 1 is released, the self-alignment effect due to the surface tension of the molten solder is obtained, and even if the accuracy of the joining position of the electronic component 91 by the tool 93 is somewhat poor, the self-alignment effect results in a poor joining. It was possible to obtain a welding position accuracy that does not become bad.

[0015]

However, in a high-end electronic component having a narrow bump pitch among electronic components such as an IC chip, the bump pitch becomes a narrow pitch of, for example, 150 μm or less. In the case of electronic components having bumps, rather than the self-alignment effect in the above-mentioned local reflow mounting method, the bonding position of the electronic components by vacuum break blow that occurs when releasing the suction holding to the electronic components during melting of the solder It is required to have a high bonding position accuracy such that the amount of deviation of the distance becomes a problem, for example, a bonding position accuracy of ± 5 μm or less. Therefore, in the mounting method of the electronic component by the above-mentioned local reflow mounting method that releases the suction and holding to the electronic component by the tool while the solder is in the molten state, such a narrow pitch bump is provided and a high bonding position is provided. There is a problem that it cannot be applied to the mounting of high-end electronic components that require high accuracy.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to solve the above problems and to provide a mounting method and a mounting device for an electronic component capable of mounting a high-end electronic component having bumps with a narrow pitch.

[0017]

In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, the plurality of electrodes of the electronic component held by the component holding member and the plurality of electrodes of the circuit board are brought into contact with each other with the joining material interposed therebetween, and the joining material is abutted. A method for mounting an electronic component is provided, which comprises heating and melting, and cooling and solidifying, and then releasing the suction holding of the electronic component by the component holding member.

According to the second aspect of the present invention, an electronic component having a plurality of electrodes is sucked and held by a component holding member so that the electrodes of the electronic component and the plurality of electrodes of the circuit board can be joined. Aligning, lowering the component holding member while adsorbing and holding the electronic component, contacting the electrodes of the electronic component and the electrodes of the circuit board with a bonding material interposed therebetween, the bonding Provided is a method for mounting an electronic component, which comprises heating and melting a material, cooling and solidifying the material, and then releasing suction holding of the electronic component by the component holding member.

According to the third aspect of the present invention, the bonding material is previously supplied to at least one of the electrodes of the electronic component or the electrodes of the circuit board. Alternatively, a method for mounting the electronic component according to the second aspect is provided.

According to a fourth aspect of the present invention, there is provided a method of mounting an electronic component according to any one of the first to third aspects, wherein the joining material is solder.

According to a fifth aspect of the present invention, flux is previously supplied to the electrodes of the electronic component, the electrodes of the circuit board, or the bonding material. A method for mounting an electronic component according to any one of aspects is provided.

According to a sixth aspect of the present invention, the bonding material is a solder bump formed on each electrode of the electronic component, or a solder bump formed on each electrode of the electronic component and the circuit board. The method for mounting an electronic component according to the first aspect, the second aspect, or the fourth aspect, which is the solder portion formed on each of the electrodes.

According to the seventh aspect of the present invention, the electronic component is structured such that the electronic component is sucked and held by the component holding member, and the plurality of electrodes of the electronic component and the plurality of electrodes of the circuit board are joined with the joining material interposed therebetween. A mounting device for sucking and holding the electronic component on the component holding member, an elevating mechanism for lowering or raising the component holding member, a mount for arranging the circuit board, and the bonding material. A heating mechanism for heating the
A cooling mechanism for cooling the bonding material, the suction holding mechanism,
A control unit that controls the elevating mechanism, the heating mechanism, and the cooling mechanism, wherein the control unit controls the elevating mechanism to place the electronic component sucked and held by the component holding member on the circuit board. While contacting, the heating mechanism is controlled to heat and melt the bonding material, and then the cooling mechanism is controlled to cool and solidify the bonding material, and after the bonding material is solidified, Provided is an electronic component mounting apparatus, which controls the suction holding mechanism to release the suction holding of the electronic component.

According to the eighth aspect of the present invention, the electronic component is sucked and held by the component holding member, and the plurality of electrodes of the electronic component and the plurality of electrodes of the circuit board are brought into contact with each other with the joining material interposed therebetween, A mounting device for an electronic component, wherein the bonding material is heated and melted, and the electrodes of the electronic component are bonded to the electrodes of the circuit board with the bonding material interposed therebetween. A suction holding mechanism for holding an electronic component by suction, a lifting mechanism for lowering or raising the component holding member, a heating mechanism for heating the bonding material, a cooling mechanism for cooling the bonding material, the suction holding mechanism, A control unit that controls the lifting mechanism, the heating mechanism, and the cooling mechanism, the control unit controls the heating mechanism to heat and melt the bonding material, and then controls the cooling mechanism. The above bonding material The control unit controls the suction holding mechanism to suck and hold the electronic component by the suction holding mechanism even while the bonding material is being melted by the heating mechanism, and the control is performed. Provided is a mounting device for an electronic component, which is configured to release the suction-holding to the electronic component by the suction-holding mechanism after solidification by cooling the cooling mechanism to the bonding material by the section. .

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION An electronic component mounting method and mounting apparatus according to the present invention are configured such that a plurality of electrodes of an electronic component are brought into contact with a plurality of electrodes of a circuit board via a bonding material to melt each bonding material. The present invention relates to a mounting method and a mounting apparatus for an electronic component, which is solidified and then bonded to a circuit board through each bonding material, and a mounting method and a mounting apparatus for an electronic component according to an embodiment of the present invention will be described with reference to the drawings. Will be described in detail.

As shown in FIG. 1, an electronic component mounting apparatus 10
1, a head tool 3, which is an example of a component holding member for mounting electronic components, is fixed to a nut portion of an X-direction moving mechanism 22, and the X-direction moving mechanism 22 rotates a ball screw shaft by a motor. By this, the head tool 3 fixed to the nut portion screwed on the ball screw shaft is moved in the X1 direction to the right in the X direction in the drawing or the X2 direction to the left. Further, as shown in FIG. 3, which is a schematic cross-sectional view of the head tool 3, the electronic component mounting apparatus 101 includes an elevating unit 2 that is an example of an elevating mechanism that lowers or raises the head tool 3.
1 is provided. Furthermore, head tool 3
Is a suction nozzle 11 that is an example of a suction holding mechanism that holds an electronic component by suction at its tip, and this suction nozzle 11
Ceramic heater 1 which is an example of a heating mechanism for heating an electronic component sucked and held by the suction nozzle 11 by heating
2 and a cooling blow nozzle 19 which is an example of a cooling mechanism for cooling the electronic component heated by the ceramic heater 12. Here, the heating mechanism is, for example, a ceramic heater 12 provided in the head tool 3.
However, instead of the ceramic heater 12,
The electronic component mounting apparatus may include a heating unit included in the gantry unit on which the circuit board is arranged, or a heating unit that heats the electronic component and the circuit board by blowing hot air. A detailed description of the structure of the head tool 3 will be given later.

In FIG. 1, the slide base 6 is fixed to a nut portion of a Y-direction moving mechanism 23, and the Y-direction moving mechanism 23 rotates a ball screw shaft by a motor so that the nut screwed to the ball screw shaft is engaged. The slide base 6 fixed to the section is moved in the Y direction shown in the Y direction to the right or the Y2 direction to the left. A plurality of electronic components 1 are supplied to a parts tray 5 fixed on a slide base 6, and a circuit board 4 is positioned and fixed on a stage 7 which is an example of a pedestal part fixed on the slide base 6. ing. The X direction and the Y direction in FIG. 1 are orthogonal to each other.

Further, the electronic component mounting apparatus 101 is provided with a control unit 9 which is a control unit for controlling each component in the electronic component mounting apparatus 101, and the moving operation of the elevating unit 21 and the X-direction moving mechanism 22 are performed. Movement operation, Y-direction movement mechanism 2
3, the suction operation of the suction nozzle 11 of the head tool 3, and the ceramic heater 12 of the head tool 3.
The heating operation of is controlled by the controller 9.

FIG. 2 is a cross-sectional view of the electronic component 1 and the circuit board 4 schematically showing the mounting method of the electronic component according to the above embodiment. As shown in FIG. 2B, the rectangular plate-shaped electronic component 1 has a large number of electrodes 1a on the bonding surface, and each electrode 1a has a solder bump 1 as a bonding material.
b is formed in advance. Further, as shown in FIG. 2A, the rectangular plate-shaped circuit board 4 has pads 4a which are a large number of electrodes on the upper surface, and solder which is a bonding material is printed on each pad 4a by printing or the like. Solder part 2 supplied in advance
Are formed. Moreover, each pad 4a of the circuit board 4 is arranged at a position corresponding to each electrode 1a of the electronic component 1 so that each electrode 1a of the electronic component 1 and each pad 4a of the circuit substrate 4 can be joined. Here, the electronic component 1 has a high joint of ± 5 μm or less such as a high-end IC chip having a bump pitch of 150 μm or less, which is a pitch between solder bumps 1 b formed on the electrodes 1 a. It is a high-end electronic component that requires positional accuracy.

Next, a method of mounting the electronic component 1 on the circuit board 4 using the electronic component mounting apparatus 101 will be described.

First, in FIG. 1, a slide base 6 to which a parts tray 5 on which a plurality of electronic components 1 are supplied and arranged is fixed is moved to Y1 by a Y-direction moving mechanism 23.
Or it is moved in the Y2 direction and the X direction moving mechanism 2
2, the head tool 3 is moved in the X1 or X2 direction so that one electronic component 1 arranged in the parts tray 5 can be sucked by the suction nozzle 11 at the tip of the head tool 3. Tool 3 its electronic components 1
Align to. After that, the elevation tool 21 lowers the head tool 3, the adsorption nozzle 11 of the head tool 3 adsorbs and holds the rear surface of the electronic component 1 which is a surface without the electrodes 1a, and the elevation tool 21 raises the head tool 3. Then, the electronic component 1 is taken out from the parts tray 5.
Here, the case where the electronic component 1 is arranged on the parts tray 5 with the back surface facing up has been described. However, even when the electronic component 1 is arranged with the back surface facing down, the head of the electronic component 1 is arranged. By providing a reversing mechanism for reversing the electronic component 1 before the tool 3 is suction-held by the suction nozzle 11, the suction nozzle 11 can suction-hold the back surface of the electronic component 1. Instead of supplying each electronic component 1 from the parts tray 5, a wafer supply unit may be provided to supply each electronic component 1 from the wafer.

Next, referring to FIG. 1, the slide base 6 fixing the stage 7 to which the circuit board 4 is fixed.
Is moved in the Y1 or Y2 direction by the Y-direction moving mechanism 23, and the head tool 3 that holds the electronic component 1 by suction is moved in the X1 or X2 direction by the X-direction moving mechanism 22. As shown, each solder bump 1b formed on each electrode 1a of the electronic component 1 can be joined to each solder portion 2 on each pad 4a of the circuit board 4,
The electronic component 1 and the circuit board 4 are aligned.

After that, as shown in FIG. 2 (c), the head tool 3 is moved down by the elevating part 21, and the suction nozzle 11
Each solder bump 1b of the electronic component 1 sucked and held by the solder bump 1b
Are brought into contact with each solder portion 2 of the circuit board 4 fixed to the stage 7.

After this contact, as shown in FIG.
The ceramic heater 12 of the head tool 3 heats the suction nozzle 11, and the solder bumps 1b of the electronic component 1 suction-held by the suction nozzle 11 and the circuit board 4 abutting on each solder bump. Each solder part 2 is heated. Further, the heating temperature of the suction nozzle 11 by the ceramic heater 12 is raised to a temperature above the melting point of the solder forming each solder bump 1b and above the melting point of the solder forming each solder portion 2, The solder bump 1b and each solder portion 2 are melted.

After that, as shown in FIG. 2 (e), after the heating by the ceramic heater 12 is stopped, the molten solder is cooled by blowing from the cooling blow nozzle 19, so that the solder is solidified and the Each electrode 1 of component 1
a and each pad 4a of the circuit board 4 are joined via solder. Instead of forcibly cooling the molten solder by the cooling blow nozzle 19, the molten solder may be naturally cooled to solidify the solder.

After that, as shown in FIG. 2 (f), the suction holding of the tip of the head tool 3 by the suction nozzle 11 to the electronic component 1 is released, and the head tool 3 is raised by the elevating part 21. When a plurality of electronic components 1 are mounted on the circuit board 4, these operations are repeated for each electronic component 1 and each electronic component 1 is individually mounted on the circuit board 4.

In the above, when the bonding material is each solder bump 1b previously formed on each electrode 1a of the electronic component 1 and each solder portion 2 previously formed on each pad 4a of the circuit board 4. However, the bonding material may be only the solder bumps 1b previously formed on the electrodes 1a of the electronic component 1.

Further, the oxide film on the surface of each bonding portion is removed on each electrode 1a of the electronic component 1, each pad 4a of the circuit board 4, or each solder bump 1b or each solder portion 2 which is a bonding material. However, a flux capable of improving the wettability of the molten solder may be applied in advance and supplied. Depending on the type of flux applied and supplied, the electronic component 1 may be mounted on the circuit board 4 and then the applied flux may be removed by cleaning.

Next, the structure of the head tool 3 in the electronic component mounting apparatus 101 will be described in detail with reference to FIG. 3 which is a sectional view schematically showing the structure of the head tool 3.

In FIG. 3, the head tool 3 supports the head tool tip portion 3a for performing operations such as adsorption and holding to the electronic component 1 and heating, and the head tool tip portion 3a, and raises and lowers the head tool 3. The head tool main body portion 3b is formed.

The head tool tip portion 3a has a suction nozzle 11 capable of sucking and holding the electronic component 1 from the tip side thereof, a ceramic heater 12 for heating the electronic component 1 sucked and held by the suction nozzle 11, and this ceramic. Heater 12
Water jacket 13, which is a cooling unit that shuts off heat so that the generated heat is not transferred to the head tool body 3b,
Further, a cooling blow nozzle 19 configured by a shaft 17 attached to the upper portion of the water jacket 13 and cooling the electronic component 1 heated by the ceramic heater 12 by blowing is attached around the lower portion of the shaft 17.

The head tool body 3b includes a frame 16 for supporting the head tool tip 3a, and a frame 1
6 is composed of a load cell 14 attached.

The frame 16 has a substantially U-shape formed by a rigid body, and has an upper frame 16a for supporting the load cell 14 and a shaft 17 of the head tool tip 3a.
Is supported by a self-weight canceling spring 15 which is an elastic body attached to the lower portion of a spring receiving portion 18 having an annular projection shape provided on the side portion of the shaft 17 so as to wind the outer periphery of the shaft 17, and Lower frame 16 for guiding the vertical movement of 17
b, and a cylindrical intermediate frame 16c that supports the upper frame 16a and the lower frame 16b.

The shaft 17 has a step portion 17c near the middle in the axial direction, and with the step portion 17c as a boundary,
The shaft lower part 17b of the shaft 17 has a smaller diameter than the shaft upper part 17a. Further, the lower shaft portion 17b penetrates a hole 16d formed in a lower frame 16b that supports the shaft 17 through a self-weight counterbalance spring 15, and the hole 16d of the lower frame 16b moves up and down the shaft 17. Is formed so that it can be guided and has a diameter smaller than the diameter of the shaft upper portion 17a of the shaft 17. As a result, the shaft 17 is supported by the lower frame 16b via the self-weight offset spring 15 and can be vertically moved by being guided by the hole 16d of the lower frame 16b, and the self-weight offset spring 15 is damaged due to damage or the like. Even when it becomes impossible to support the shaft 17, the periphery of the hole 16d of the lower frame 16b can support the shaft 17 by the step portion 17c of the shaft 17 so that the shaft 17 does not fall. .

Further, the shaft lower part 17b is provided with an outer ring and a shaft of a ball spline, the lower frame 16b is provided with a bearing inside the hole 16d, and the outer ring of the ball spline is mounted inside the bearing, whereby the shaft 17 is While being supported by the lower frame 16b, it can rotate about an axis and can move up and down in the axial direction.

The intermediate frame 16c has both ends of its cylindrical shape fixed to the nut portion 21b of the elevating portion 21, and the ball screw shaft 21a screwed into the nut portion 21b of the elevating portion 21 is rotated by the motor 21m. As a result, the intermediate frame 16c is moved up and down, whereby the frame 16 is moved up and down, and the entire head tool 3 is moved up and down.

The centers of the suction nozzle 11, the ceramic heater 12, the water jacket 13, the shaft 17, and the load cell 14 are coaxially arranged, and these shafts are parallel to the lifting operation axis of the lifting unit 21. Therefore, the suction nozzle 11, the ceramic heater 12, the water jacket 13, the shaft 17, and the load cell 14 can be vertically moved by the vertical movement of the vertical movement unit 21.

Further, on the lower surface which is the load detecting surface of the load cell 14, the upper end of the shaft 17 at the head tool tip portion 3a is attached to the lower frame 16b, and the shaft 17 is supported via the spring receiving portion 18 by the self-weight canceling spring. The load 15 presses and contacts the head tool 15, and the load cell 14 can detect the load acting in the upward direction of the shaft 17 of the head tool tip 3a.

Further, the shaft lower part 17 which is the periphery of the lower part of the shaft 17
cooling blow nozzle 19 mounted around b
Is formed so as to wrap around both sides of the water jacket 13 and the ceramic heater 12 located below the shaft 17, and the tip of the cooling blow nozzle 19 is directed to the electronic component suction holding surface which is the lower surface of the suction nozzle 11. And the blow from the cooling blow nozzle 19 is the suction nozzle 1.
It is possible to cool the electronic component 1 sucked and held by the device 1.

The control unit 9 also controls the suction operation of the suction nozzle 11, the heating operation of the ceramic heater 12, and the elevating unit 2.
1 is controlled so that the load detected by the load cell 14 is output to the control unit 9.

Next, a method of detecting the contact load generated when the electronic component 1 and the circuit board 4 are contacted by the load cell 14 in the head tool 3 will be described.

After the electronic component 1 and the circuit board 4 are aligned with each other, the head tool 3 is lowered by the elevating part 21 while the electronic component 1 is suction-held by the suction nozzle 11, and each solder bump 1b of the electronic component 1 is attached to the circuit board. 4 to contact each solder portion 2. At this time, a contact load is generated between each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4, and the contact load makes contact with the load detection surface of the load cell 14 of the head tool 3. The upper end of the shaft 17 of the head tool tip portion 3a at the position pushes up the load detection surface of the load cell 14, and the contact load is detected by the load cell 14.

By detecting the contact load in the load cell 14 in this manner, it is detected that the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are in contact with each other, and the load cell 14 detects the contact. The contact load thus generated is output to the control unit 9, and the elevating unit 21 is controlled by the control unit 9 so that the contact load set in advance by the control unit 9 is controlled. And the lifting portion 21 is controlled so that the contact load detected by the load cell 14 becomes a preset contact load.

The electronic component mounting method according to the present embodiment configured and implemented by the above-described mounting procedure (hereinafter, since each electronic component is individually melted, that is, reflowed, this is the local component of the above embodiment. Reflow mounting method), the mounting procedure is summarized in the flowchart shown in FIG. The operation instruction in each step is given by the controller 9.

In step SP1 in FIG. 4, the electronic component 1 is sucked and held by the head tool 3, and in step SP2, each solder bump 1b formed on each electrode 1a of the electronic component 1 and each pad 4a of the circuit board 4 is placed. The electronic component 1 and the circuit board 4 are aligned so that the solder portions 2 formed on the substrate 1 can be joined to each other. After that, step SP3
In step SP4, the head tool 3 is lowered with the electronic component 1 held by suction, and in step SP4, the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are brought into contact with each other.
It is detected by the load cell 14 of the head tool 3. Further, in step SP5, the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are melted by heating the electronic component 1 by the ceramic heater 12 of the head tool 3. Thereafter, in step SP6, cooling of the melted solder by blowing the cooling blow nozzle 19 is started, and in step SP7, the melted solder is solidified, and each electrode 1a of the electronic component 1 is connected to each pad 4b of the circuit board 4. To be joined via solder. After that, step SP8
At, the suction holding of the electronic component 1 by the head tool 3 is released. When a plurality of electronic components 1 are mounted on the circuit board 4, the steps SP1 to SP8 are repeated for each electronic component 1 to mount each electronic component 1. The cooling of the melted solder in step SP6 may be performed by natural cooling instead of cooling by blowing the cooling blow nozzle 19.

Next, the correction operation when the expansion / contraction amount of the head tool 3 due to heat is corrected will be described.

After each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4 are brought into contact with each other, the suction nozzle 11 is heated by the ceramic heater 12 of the head tool 3, and each solder bump 1b and each solder portion is heated. 2 is melted, in the head tool 3, at least the head tool tip portion 3a
Is affected by heat from the ceramic heater 12 and extends in the vertical direction, and when the heating of the ceramic heater 12 is stopped, the effect of the heat disappears and the head tool tip portion 3a contracts in the vertical direction. By such expansion and contraction of the head tool tip portion 3a in the vertical direction, the electrodes of the circuit board 4 are contacted between the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 until joining. It is difficult to keep the height of the back surface of the electronic component 1 in which each electrode 1a is in contact with 4a via each solder portion 2 and each solder bump 1b, and bump collapse or the like occurs in some cases. Depending on the joining accuracy used, it may be difficult to stabilize the joining quality of electronic components.

For the purpose of surely controlling the height of the rear surface of the electronic component 1 as described above, the head tool tip 3 is previously prepared.
The data of the change in the amount of expansion and the amount of contraction due to heat of a are set in the memory in the control unit 9, and the control unit 9 controls the ceramic heater 12, the elevating unit 21, and the cooling blow nozzle 19, and the ceramic heater 12 controls During heating, the head tool 3 is gradually raised by the elevating part 21 based on the data on the change in the amount of extension of the head tool tip 3a due to heating, and after the heating by the ceramic heater 12 is stopped, during cooling by the cooling blow nozzle 19. , The amount of expansion and contraction of the head tool tip 3a due to heat is corrected by gradually lowering the head tool 3 by the elevating part 21 based on the data of the change in the amount of contraction of the head tool tip 3a due to cooling. . Thereby, the height of the back surface of the electronic component 1 sucked and held by the suction nozzle 11 of the head tool 3 between the contact and the joining of the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4. Can be kept constant. It should be noted that the correction of the amount of expansion or the amount of contraction of the head tool 3 due to heat is required for the bonding accuracy of the electronic component 1 to the circuit board 4 and each solder bump 1b formed on each electrode 1a of the electronic component 1. It may be a case where it is determined whether or not to carry out by the number of, and only the correction of the elongation amount or the correction of the contraction amount is performed.

The procedure of the operation of correcting the amount of expansion and the amount of contraction of the head tool 3 due to the heat configured as described above is summarized as shown in FIG. FIG. 5 is a flowchart showing a mounting procedure of the mounting method of the electronic component according to the above-mentioned embodiment in FIG. 4, and between steps SP4 to SP7, steps related to the correction operation of the extension amount and the contraction amount of the head tool 3 due to heat. 6 is a flowchart showing a procedure of a correction operation in which is added. The operation instruction and judgment in each step are performed by the control unit 9.

At step SP4 in FIG. 5, each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4 are connected.
After the contact with is detected, in step SP10,
The heating of the ceramic heater 12 starts the temperature rise of the adsorption nozzle 11. Next, in step SP11, it is determined whether or not the elongation amount correction of the head tool 3 due to heat is to be performed. When the elongation amount correction is performed, it is determined in step SP12 whether or not to wait for the elongation amount correction start of the head tool 3, and when the elongation amount correction start wait is performed, in step SP13, the head tool 3 of the head tool 3 is set for the set time. If the elongation amount correction start is put in the standby state and the elongation amount correction start waiting is not performed, step S
P13 is not performed, and then, in step SP14, while gradually increasing the head tool 3 based on the change data of the elongation amount of the head tool 3 due to heat, step SP5
At, the solder bumps 1 b of the electronic component 1 and the solder portions 2 of the circuit board 4 are melted by heating the ceramic heater 12. The standby operation for starting the expansion amount correction of the head tool 3 in step SP13 is replaced by the ceramic heater 12 instead of waiting for the set time as described above.
It may be a case where the temperature of the suction nozzle 11 heated by the temperature exceeds the set temperature.

On the other hand, in step SP11, when the elongation amount correction is not performed, steps SP12 to SP14
Without performing each step up to step SP5
Is carried out.

Then, in step SP6, cooling of the melted solder is started. Next, step SP15
At, it is determined whether to perform the shrinkage amount correction of the head tool 3 by cooling. When performing the shrinkage amount correction, it is determined in step SP16 whether or not to wait for the shrinkage amount correction start of the head tool 3. When performing the shrinkage amount correction start wait, in step SP17, the head tool 3 is set for the set time. If you want to start the shrinkage correction start in the standby state and do not wait for the shrinkage correction start,
Without performing step SP17, in step SP18, the solder melted by cooling is solidified in step SP7 while gradually lowering the head tool 3 based on the shrinkage amount change data of the head tool 3 due to cooling. The standby operation for starting the correction of the shrinkage amount of the head tool 3 in step SP17 is replaced by the ceramic heater 12 instead of waiting for the set time as described above.
There may be a case where the temperature of the suction nozzle 11 heated by is lowered to the set temperature.

On the other hand, in step SP15, when the shrinkage amount correction is not performed, steps SP16 to SP18.
Without performing each step up to step SP7
Is carried out.

Next, after detecting the contact between each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4, the head tool 3 is detected.
Constant control of contact load by each solder bump 1b
The case where the tip position control of the suction nozzle 11 is performed after the melting of each solder portion 2 will be described.

After detecting the contact between each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4, the contact load detected by the load cell 14 is moved up and down so as to be a preset contact load. The section 21 is controlled by the control section 9, and a constant load is applied to the electronic component 1 and the circuit board 4 by the head tool 3, so that the head tool 3 is in a constant load control state. However, with the ceramic heater 12, the suction nozzle 1
If the head tool 3 remains in the constant load control state when the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are melted as described above, the suction nozzle 11 is heated. There is a problem in that the tip positions of the solder bumps are lowered, and the solder bumps 1b and the solder portions 2 in a molten state are excessively crushed.

In order to solve such a problem, it is necessary to surely manage the back surface height of the electronic component 1 after melting of each solder, that is, the management of the contact height position of the electronic component 1 to the circuit board 4. For that purpose, after the temperature of the adsorption nozzle 11 is started to rise by being heated by the ceramic heater 12, the above-described constant load control by the head tool 3 is performed, and the load cell 1
4, the load is detected, and when the decrease in the detected load is detected, it is determined that the melting of each solder has started, and the tip height position of the suction nozzle 11 is made constant from the above load constant control of the head tool 3. By switching to the position control, the front end height position of the suction nozzle 11 can be made constant even when each solder is melted, and the back surface height management of the electronic component 1 can be reliably performed.

The procedure of the load constant control of the head tool 3 and the tip height position control of the suction nozzle 11 configured as described above will be summarized as shown in FIG. FIG. 6 is a flowchart showing the mounting procedure of the mounting method of the electronic component according to the embodiment in FIG. 4, and during steps SP4 to SP6, constant load control of the head tool 3 and the tip height position of the suction nozzle 11 are performed. It is a flow chart which shows the procedure of control operation. The operation instruction and judgment in each step are performed by the control unit 9.

First, in step SP4 in FIG. 6, after the contact between each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4 is detected, the ceramic heater 12 is heated to adsorb it in step SP10. Nozzle 1
The temperature rise of 1 is started. Next, in step SP5a, constant load control of the head tool 3 is performed, and a constant load is applied to the electronic component 1 and the circuit board 4 by the head tool 3. While the load actually generated in the load cell 14 is detected during the constant load control, when the decrease in the detected load is detected in step SP5b due to the decrease in the load detected in the load cell 14. Is determined to have started melting of each solder, and in step SP5c, the control method is switched from the constant load control of the head tool 3 to the constant control of the tip height position of the suction nozzle 11, and step SP5d. In step SP5e, the back surface height of the electronic component 1 sucked and held by the suction nozzle 11 whose tip height position is constant becomes constant, and in step SP5e, the temperature rise of the suction nozzle 11 due to the heating stop of the ceramic heater 12 is completed. Until that time, constant control of the height position of the tip of the suction nozzle 11 is performed. Step SP5e
In, when the temperature rise of the suction nozzle 11 is completed,
In step SP6, cooling of each melted solder is started.

If no decrease in the load detected in the load cell 14 is detected in step SP5b, it is determined that the melting of each solder has not yet started, and in step SP5f, the heating of the ceramic heater 12 is stopped. It is judged whether or not the temperature rise of the suction nozzle 11 is completed, and if it is not completed, the process returns to step SP5a again, and the constant load control of the head tool 3 is continued. In step SP5f,
The suction nozzle 11 by stopping the heating of the ceramic heater 12
When the temperature rise of No. 2 is completed, the control system is switched from the above-mentioned constant load control of the head tool 3 to the constant control of the tip height position of the suction nozzle 11 in step SP5g, and the tip height position is controlled in step SP5h. The height of the back surface of the electronic component 1 sucked and held by the suction nozzle 11 is constant, and cooling of each melted solder is started in step SP6.

In step SP4, when contact between each solder bump 1b of the electronic component 1 and each solder portion of the circuit board 4 is detected, variations in the formation height of each solder bump 1b and each solder portion 2 are detected. Each solder bump 1b and each solder 2
In some cases, some of them may not come into contact with each other. For example, this is a case where the electronic component 1 has a large number of bumps of 1000 or more. In such a case, if the electronic component 1 is heated as it is, the solder portions 2 that are not in contact with each other do not conduct heat from the solder bumps 1b, and thus there is a problem that they are not melted.

For such a problem, step SP5
At the time of constant load control of the head tool 3 in a, the constant load is set to a load equal to or more than the contact load at the time of contact detection, and the load is constantly controlled to be applied to the electronic component 1 and the circuit board 4. As described above, when the contact between each solder bump 1b of the electronic component 1 and each solder portion of the circuit board 4 is detected, each solder bump 1b and each solder portion 2 may have different heights due to variations in the formation height. Even if some of the solder bumps 1b and the solders 2 are not in contact with each other, by applying the constant load, the solder bumps 1b and the solder portions 2 are brought into contact with each other. Therefore, it is possible to enhance the property and surely melt all the solder.

Next, a case where the load zero point of the load cell 14 of the head tool 3 is set will be described.

The heat generated by the ceramic heater 12 of the head tool 3 is transferred from each component of the head tool 3 and the heat of the surrounding air of the head tool 3, so that the spring of the shaft 17 at the head tool tip 3a. The self-weight offset spring 15 attached to the receiving portion 18 is affected by heat and its spring characteristics change. This allows
The self-weight canceling spring 15 whose spring characteristic has changed is the shaft 1
The pressing load in the load cell 14 generated by pressing 7 on the load detection surface of the load cell 14 changes.
In addition, the spring characteristics of the self-weight canceling spring 15 may change over time depending on the usage period of the head tool 3,
The pressing load of the self-weight canceling spring 15 in the load cell 14 changes. This weight offset spring 15
Due to the change in the pressing load on the load cell 14 due to the change in the spring characteristic, the actual contact load at the time of contact between each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4 and the load cell 14 detected. There is a problem that a difference occurs between the contact load detection values, and the actual contact load cannot be controlled according to a preset contact load.

In such a case, after the electronic component 1 sucked and held by the head tool 3 is positioned so that it can be bonded to the circuit board 4, the head tool is not contacted with the electronic component 1 and the circuit board 4. Shaft 17 at tip 3a
Is pressed against the load detection surface of the load cell 14 by the self-weight offset spring 15, and the load cell 14 detects the pressing load. The detected pressing load is output to the control unit 9, and the control unit 9 outputs this pressing load. Set the load zero point at 14. After that, head tool 3
Is lowered to mount the electronic component 1 on the circuit board 4, and all the operations are controlled by the controller 9.

As a result, the self-weight canceling spring 15 changes its spring characteristics due to the influence of heat or aging, so that the head tool tip portion 3 of the load cell 14 is changed.
Even when the pressing load by the shaft 17 at a changes, the pressing load detected by the control unit 9 is set as the load zero point in the load cell 14 every time the electronic component 1 and the circuit board 4 are aligned. By doing so, each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4
There is no difference between the actual contact load at the time of contact and the contact load detection value detected by the load cell 14,
The actual contact load can be controlled according to the preset contact load.

Next, the contact load when each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4 is contacted by the head tool 3 is detected by the load cell 14 of the head tool 3, and the head tool 3 is detected. A method of controlling the ascending / descending operation of No. 3 to control the contact load set in advance will be described based on the embodiment based on the contact load control operation flowcharts shown in FIGS. 7 and 8. The operation instruction and judgment in each step are performed by the control unit 9.

After the alignment of the electronic component 1 and the circuit board 4 is performed, the head tool 3 holding the electronic component 1 by suction starts the lowering operation by the elevating unit 21 in step SP3. While the head tool 3 is descending, step SP
In 21, it is determined whether or not the preset contact load exceeds 450 g. If it exceeds 450 g, in step SP22 the initial detected load due to contact is 2
If it is set to 00 g and is 450 g or less, the initial detected load due to contact is 100 in step SP23.
set to g. Next, in step SP24, each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4
And the set initial detection load is detected by the load cell 14, the head tool 3 that was descending is stopped in step SP25, and the head tool 3 is placed in an operation standby state for 200 ms. 3 after the stop operation of 3, the control unit 9 instructs the head tool 3 to stop the descending operation,
The head tool 3 is brought into a static state in order to eliminate the influence on the detected load of the load cell 14 due to a minute amount of descending until the head tool 3 is decelerated at the descending speed and stopped.

Next, at step SP26, it is judged whether or not the present load detected by the load cell 14 exceeds a preset abutting load of -100 g. It is judged whether or not it is approaching.

At step SP26, the present load is
If the preset contact load is greater than −100 g, the head tool 3 is allowed to stand still for 200 ms in step SP27, and then step SP2.
8, the present load is a preset contact load −5.
It is determined whether the load is 0 g or more, and if the present load is less than the preset contact load −50 g, step 2
9, the head tool 3 is moved up and down by the elevating part 21 to 1 μm.
After lowering, in step SP27, 200 ms
After passing through the static state of the head tool 3 for a while, it is again determined in step SP28 whether or not the present load is equal to or more than the preset contact load −50 g, and the present load is set to the preset contact load. This operation loop is repeatedly performed until it becomes -50 g or more.

At step SP28, the current load is
If the preset contact load is −50 g or more, in step SP30, the static state of the head tool 3 is held for a preset time, and each solder bump 1b of the electronic component 1 and the circuit board 4 are held. The control of the contact load between the solder portions 2 of the above is completed to the preset contact load, and in step SP4, the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are contacted with each other. The contact has been detected. Here, it is predicted that the preset contact load of −50 g, which is the determination criterion in step SP28, will occur when the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are in contact with each other. When the current load, which is the contact load that is generated and that is actually generated during the contact, is equal to or greater than the contact load that is predicted to occur during the contact, almost all of the electronic component 1 is Solder bump 1b
Then, almost all the solder portions 2 of the circuit board 4 are brought into contact with each other, and the contact is detected.

If the present load is equal to or less than the preset abutment load of −100 g in step SP26, the present load is further reduced to the preset abutment load of −500 g in step SP31. If it is exceeded, if it is not exceeded, then
In step SP32, it is determined stepwise whether or not the current load exceeds the preset contact load −1000 g. If the current load is equal to or less than the preset contact load-1000 g in step SP32, the load difference between the current load and the preset contact load is moved to the head tool 3 in step SP33. Converted to distance. The current load is step SP.
If the condition in 31 is satisfied, step SP
In 34, when the moving distance of the head tool 3 is 1 μm and the current load satisfies the condition in step SP32, the moving distance of the head tool 3 is set to 2 μm in step SP35. After that, in step SP36, the head tool 3 is lowered by the elevating unit 21 by the moving distance of the head tool 3 in each of the above cases, and in step SP37,
The head tool 3 is stopped and the static state is maintained for 50 ms. After that, in step SP26 again, it is determined whether or not the current load exceeds the preset contact load −100 g, and these operation loops are repeatedly performed until the condition of step SP26 is satisfied.

In the contact load control method executed by each of the above-mentioned operations, the head tool 3 is controlled for a slight descending operation, but each moving distance of the head tool 3 under each operation condition is It is set by the relationship between the minimum movable distance of the head tool 3 in the vertical direction by the elevating part 21 and the load per unit movement of the head tool that can be generated by this minimum movable distance. In the case of the above embodiment, the minimum movable distance is 1 μm, and the load per unit movement of the head tool is 100 g / μm. Therefore, for example, 100 g, which is the difference between the preset contact load and the current load, which is the condition in step SP26, is
It is set by the load per head tool unit movement. Further, also in step SP29, step SP34, and step SP35, the moving distances of the head tool 3 of 1 μm and 2 μm are respectively set from the minimum movable distance.

The numerical values such as the load, the time, and the distance described above are merely numerical values in the present embodiment, and the present embodiment is not limited to these numerical values.

Next, a case where the head tool 3 shapes each solder bump 1b of the electronic component 1 will be described.

After each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4 are brought into contact with each other, the suction nozzle 11 is heated by the ceramic heater 12 of the head tool 3, and each solder bump 1b and each solder portion is heated. When 2 is melted, the head tool 3 sucking and holding the electronic component 1 is vibrated slightly in the vertical direction or the lateral direction, so that the melted solder bumps 1b and solder portions 2 It is possible to improve the wettability of the mutual solder and to improve the joint quality between the electronic component 1 and the circuit board 4. This head tool 3
As shown in FIG. 9, the vibrating operation pattern of the shaping operation according to (3) includes patterns such as a cross shape, an O shape, and an 8-shaped shape that are used in the conventional mounting method of electronic components. Further, as parameters of each vibration operation in the shaping operation by the head tool 3, the head tool 3 in the shaping operation is used.
The number of shaping operations for moving up and down is 0 to 20 as an example.
The operation speed when the head tool 3 is moved up and down by the turning operation and the shaping operation is 0.1 to 9.9 sec as an example, and the operation amount that is the movement amount that moves the head tool 3 up and down by the shaping operation is −99 to 99 μm as an example. X head tool 3 in motion
The number of shaping vibration operations for vibrating in the Y direction is 0 as an example.
200 times are used.

Next, in the case where the respective operations of the head tool 3 described above are performed in a composite manner to mount electronic components on a circuit board, the control height of the head tool 3 shown in FIG. The suction nozzle 11 of the head tool 3 is shown in (b).
10C, and FIG. 10C is a time chart showing changes in the temperature of the suction nozzle 11 of the head tool 3 over time. Here, the control height of the head tool 3 is a relative elevation control height position of the head tool 3 by the elevation unit 21, and the tip height of the suction nozzle 11 of the head tool 3 is the relative height of the suction nozzle 11. It shows the height position of the tip. In addition, the time axis which is each horizontal axis in FIGS. 10A to 10C is the same time axis so that the above change states can be compared.

First, from the time starting point t0 to t1 in FIGS. 10A to 10C, the control height of the head tool 3 and the tip height of the suction nozzle 11 are lowered by the lowering of the head tool 3 by the elevating part 21. , It falls in the same change state. At this time, since the heating by the ceramic heater 12 has not been started yet, the temperature of the adsorption nozzle 11 is kept constant.

Next, from time t1 to t2, time t
At 1, the electronic component 1 and the circuit board 4 come into contact with each other, and the ceramic heater 12 starts heating the suction nozzle 11 to raise the temperature of the suction nozzle 11. Since the expansion amount correction operation of the head tool 3 is performed by this temperature rise, the control height of the head tool 3 is increased as set in advance, and the head tool 3 subjected to the expansion amount correction operation has the suction nozzle 11 The height of the tip becomes constant. This time t1
The melting of the solder is started in the section from t to t2.

Next, from time t2 to t4, the temperature of the suction nozzle 11 is controlled by the heating of the ceramic heater 12, and is maintained at a constant temperature. Further, both the control height of the head tool 3 and the tip height of the suction nozzle 11 are kept constant. However, since the solder bumps 1b of the electronic component 1 are shaped by the head tool 3 from the time t2 to the time t3, the head tool 3 performs a minute vibration operation, and the control height of the head tool 3 and the head tool 3 The tip heights of the suction nozzles 3 of 3 both slightly rise and fall.

Next, from time t4 to t5, cooling of the molten solder is started and the temperature of the suction nozzle 11 is lowered. Since the operation of correcting the shrinkage amount of the head tool 3 is performed by this cooling, the control height of the head tool 3 is lowered as set in advance, and the head tool 3 that has been subjected to the operation of correcting the shrinkage amount of the suction nozzle 11 is moved. The height of the tip is constant.
The molten solder is solidified in the section from time t4 to time t5.

Finally, at time t5, the suction holding by the suction nozzle 11 of the head tool 3 to the electronic component 1 is released, and then the head tool 3 is lifted by the elevating part 21, so that the control height of the head tool 3 is increased. And the height of the tip of the suction nozzle 11 rises in the same changed state.

Next, a description will be given of a case where the leveling operation for aligning the heights of the solder bumps 1b of the electronic component 1 is performed before the electronic component 1 is brought into contact with the circuit board 4.

If the height of each solder bump 1b joined to each electrode 1a of the electronic component 1 varies, when each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4 are brought into contact with each other, The contact load control is affected by the variation in the height of each solder bump 1b, and the head tool 3 cannot adsorb and hold the back surface height of the electronic component 1 which is predetermined. However, if the electronic component 1 is melted and the electronic component 1 is bonded to the circuit board 4, there is a problem in that the height of the back surface of each electronic component 1 on each circuit substrate 4 cannot be constant.

In order to cope with such a problem, before mounting the electronic component 1 on the circuit board 4 by the head tool 3, a leveling operation is performed to make the heights of the solder bumps 1b of the electronic component 1 uniform. After that, the mounting work of the electronic component 1 on the circuit board 4 is performed.

In the electronic component mounting apparatus 101 shown in FIG. 1, the leveling stage 8 is fixed to the slide base 6 which can be moved in the Y1 or Y2 direction shown by the Y-direction moving mechanism 23. Electronic component 1 to head tool 3
Of the slide base 6 to which the leveling stage 8 is fixed before the solder bumps 1b of the electronic component 1 are aligned with the solder portions 2 of the circuit board 4 so that they can be bonded to each other after being sucked and held by the suction nozzle 11. The Y-direction moving mechanism 23
By moving the head tool 3 in the X1 or X2 direction by the X-direction moving mechanism 22 while moving the electronic component 1 sucked and held by the suction nozzle 11 of the head tool 3 on the upper surface of the leveling stage 8. Align to. After that, the head tool 3 is lowered by the elevating unit 21, and the suction nozzle 11 of the head tool 3 is moved.
The solder bumps 1b of the electronic component 1 that are adsorbed and held on the upper surface of the leveling stage 8 are brought into contact with each other. The upper surface of the leveling stage 8 is composed of a glass plate having a smooth flat surface. At this time, the contact load generated by this contact is applied to the load cell 14 of the head tool 3.
And the contact load detected,
The elevating part 21 is controlled, the elevating part 21 slightly lowers the head tool 3, and the contact load is controlled so that the contact load becomes a preset contact load. The solder bumps 1b of the electronic component 1 are pressed against the upper surface of the leveling stage 8 by the controlled contact load, whereby the solder bumps 1
The height of b is constant. After that, the head tool 3 is raised by the elevating unit 21, and each solder bump 1 of the electronic component 1 suction-held by the suction nozzle 11 of the head tool 3 is held.
The electronic component 1 and the circuit board 4 are aligned so that the solder joint b can be joined to each solder portion 2 of the circuit board 4, and the mounting operation of the electronic component 1 on the circuit board 4 is performed.

According to the above embodiment, the following various effects can be obtained.

First, according to the above embodiment, the electronic component 1
After contacting each solder bump 1b with each solder portion 2 of the circuit board 4, each solder bump 1b is left in the contacted state.
Also, each solder portion 2 is melted by heating and then solidified by cooling to bond each electrode 1a of the electronic component 1 and each pad 4a of the circuit board 4 via solder. In other words, the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are contacted and joined at the same place, and the circuit board is mounted on the circuit board as in the conventional batch reflow mounting method. Temporary bonding of electronic components, which is the process that is performed between the temporary bonding of electronic components, the melting of each solder bump and each solder part, and the main bonding of electronic components to the circuit board It is possible to dispense with the step of carrying the circuit board to the solder reflow working unit in this state. Therefore, it is possible to eliminate the occurrence of the displacement of the joining position of the electronic component to the circuit board, which has occurred during the transportation, and it is possible to improve the joining quality of the electronic component to the circuit board.

After the solder bumps 1b of the electronic component 1 sucked and held by the suction nozzles 11 of the head tool 3 and the solder portions 2 of the circuit board 4 are brought into contact with each other, the solder bumps 1
b and each solder part 2 are melted by heating, and the timing of releasing the suction holding to the electronic component 1 by the suction nozzle 11 of the head tool 3 is released during the melting of the solder as in the conventional local reflow mounting method. Instead, the solder is melted and then cooled and solidified to release the solder. That is, unlike the conventional local reflow mounting method, the electronic component is not mounted by obtaining the self-alignment effect due to the surface tension of the molten solder, but the circuit board of the electronic component 1 is placed at the contact position positioned by the head tool 3. Implement to 4.
Thus, when the suction holding of the electronic component 1 by the suction nozzle 11 of the head tool 3 is released, the suction nozzle 1
The electronic device 1
It is possible to eliminate the displacement of the joining position. Therefore, rather than obtaining a self-alignment effect, an electronic component such as a high-end IC chip whose bump pitch is narrowed to 150 μm or less, for example, in which the displacement of the bonding position of the electronic component due to vacuum break blow in the suction nozzle becomes a problem. Can be mounted on the circuit board.

Further, in the head tool 3, the upper end of the shaft 17 at the head tool tip portion 3a is attached to the lower frame 16b and the spring receiving portion 18 of the shaft 17 on the lower surface which is the load detecting surface of the load cell 14, and the shaft 17 is attached. By being pressed and in contact with the self-weight canceling spring 15 supporting the head, it is possible to detect the load acting in the upward direction of the head tool tip portion 3a in the load cell 14.

As a result, when the solder bumps 1b of the electronic component 1 sucked and held by the head tool 3 and the solder portions 2 of the circuit board 4 come into contact with each other, the contact load generated between them causes the head tool 3 Since the upper end of the shaft 17 of the tip portion 3a pushes up the load detecting surface of the load cell 14, the contact load can be reliably detected by the load cell 14.

Therefore, by detecting the contact load, the controller 9 can detect that the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are in contact with each other. The abutting load controls the elevating unit 21, and the elevating unit 21 slightly lowers the head tool 3 to more accurately control the actual abutting load so that the preset abutting load is achieved. it can. Therefore, when repeatedly mounting a plurality of electronic components on the circuit board, each electronic component can be always brought into contact with the circuit board under a preset contact load, and the electronic components are bonded to the circuit board. It is possible to stabilize the quality.

In addition, when the expansion amount and the contraction amount of the head tool 3 are both corrected, only the expansion amount or the contraction amount is corrected, the expansion amount and the contraction amount are further corrected. An effect based on the embodiment in the case where both are not implemented will be described.

After the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are brought into contact with each other, the head tool tip portion 3 is formed.
a is affected by heat from the ceramic heater 12 and is extended in the vertical direction, so that the electronic component 1 and the circuit board 4
The abutment load generated between the two is affected. The influence load on the contact load due to the extension of the head tool tip portion 3a is about 3 kg. Based on this influential load, the effects of the above-described various combinations of the correction of the expansion and contraction amounts of the head tool tip portion 3a will be described below.

First, the electronic component 1 is an IC chip having each electrode 1a of 1000 bumps or more, and the head tool 3
When the elongation and shrinkage of the
For example, if the electronic component 1 is an IC chip having 2000 bump electrodes 1a, the influence load of about 3 kg due to the extension of the head tool tip portion 3a is about 1.5 g per bump. After the contact between the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4, the extension amount of the head tool tip 3a is used to determine the influence load due to the extension of the head tool tip 3a as the contact load. As a result, about 1.
An appropriate contact load of 5 g can be generated, and it becomes possible to reduce variations in melting height of each solder bump 1b and each solder portion 2.

Next, the electronic component 1 is an IC chip in which the gap width between adjacent solder bumps 1b formed on each electrode 1a is as narrow as 50 μm or less, and the head tool tip 3
When only the expansion amount correction of a is performed and the contraction amount correction is not performed, the expansion amount of the head tool tip portion 3a is corrected, and the head tool tip portions 3a come into contact with each other in a state of being pressed with an appropriate contact load set in advance. After the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are melted, the melted solder is solidified while the head tool 3 is contracted by cooling. That is, the melted solder is expanded and solidified by the amount of contraction of the head tool tip portion 3a due to cooling. For this reason, the solder bumps 1b and the solder portions 2 after being melted and solidified can have a drum shape, and thus it is possible to prevent contact between adjacent solder bumps.

Next, in the case where the electronic component 1 is an IC chip having each electrode 1a of 1000 bumps or more and the expansion amount of the head tool tip portion 3a is not corrected and only the contraction amount is corrected, for example, the electronic component is If 1 is an IC chip having 2000 bump electrodes 1a, the influence load of about 3 kg due to the extension of the head tool tip portion 3a is about 1.5 g per bump, and each solder bump 1b of the electronic component 1 and the circuit board 4 have After the contact of each solder portion 2, by utilizing the extension amount of the head tool tip portion 3a and setting the influence load due to the extension of the head tool tip portion 3a as the contact load, an appropriate amount of about 1.5 g per bump is obtained. It is possible to generate an abutting load. The IC chip is pushed by a predetermined amount by the contact load, and the contraction amount of the head tool 3 is corrected to solidify the solder of the IC chip with the tip position of the suction nozzle 11 of the head tool 3 kept constant. Therefore, it is possible to improve the management accuracy of the height of the back surface of the final IC chip after solder cooling.

Further, when the electronic component 1 is an IC chip having each electrode 1a of less than 1000 bumps and both the extension amount and the contraction amount of the head tool tip portion 3a are corrected, for example, the electronic component 1 has 100 bumps. Electrode 1a
If the IC chip has
The impact load of about 3 kg is about 30 per bump
g, and if the elongation amount is not corrected, an excessive load is applied to each solder bump 1b to cause bump crushing. Therefore, the elongation amount and contraction amount of the head tool tip portion 3a are corrected,
Enables bonding without bump collapse.

Therefore, according to the number of the solder bumps 1b formed on the electrodes 1a of the electronic component 1 to be mounted and the joining accuracy required for the electronic component 1, the head tool tip portion is removed from each of the above cases. 3a is required depending on whether the expansion amount and the contraction amount are corrected together, or only the expansion amount or the contraction amount is corrected, or whether the expansion amount and the contraction amount are not corrected. It is possible to obtain the joining quality of the electronic parts that are compatible with each other.

The numerical values of the respective loads mentioned above are numerical values as an example in the present embodiment, and the present embodiment is not limited to these numerical values.

After the temperature of the suction nozzle 11 is started to rise by being heated by the ceramic heater 12, the load cell 1 is brought into a state of constant load control by the head tool 3.
4, the load is detected, and when the decrease in the detected load is detected, it is determined that the melting of each solder has started, and the tip height position of the suction nozzle 11 is made constant from the above load constant control of the head tool 3. By switching to the position control, the tip height position of the suction nozzle 11 can be made constant even when each solder is melted. As a result, when the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are melted, the tip position of the suction nozzle 11 is lowered, so that the solder bumps 1b and the solder portions 2 in a melted state. Can be prevented from being crushed, and the back surface height of the electronic component can be surely managed even during the melting of each solder.

Further, in the above-described constant load control of the head tool 3, this constant load is set as a load equal to or more than the contact load at the time of contact detection, and this load is constantly controlled to control the electronic component 1 and the circuit board. When the contact between each solder bump 1b of the electronic component 1 and each solder portion of the circuit board 4 is detected by applying the same to each of the electronic components 1, each of the solder bumps 1b and each solder portion 2 has a variation in the formation height. Even if some of the solder bumps 1b and the solders 2 are not in contact with each other, by applying the constant load, the solder bumps 1b and the solder portions 2 are brought into contact with each other. It is possible to improve the property, it is possible to reliably melt all solder,
It is possible to increase the reliability of the bonding between the electronic component and the circuit board.

After the electronic component 1 sucked and held by the suction nozzle 11 of the head tool 3 is positioned so that it can be joined to the circuit board 4, the shaft 17 of the head tool tip 3a is loaded by the self-weight offset spring 15 into the load cell. 14
The load applied to the load detection surface of the load cell 1
4, and the detected pressing load is detected by the controller 9
By setting this pressing load as the load zero point in the load cell 14 in the control unit 9, the self-weight canceling spring 15 is affected by heat or the like and its spring characteristics change, and the head tool tip 3 of the load cell 14 is changed.
Even when the pressing load due to a changes, the actual contact load at the time of contact between each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4 and the contact detected by the load cell 14 There is no difference between the load detection values, and the actual contact load can be controlled according to the preset contact load. Therefore, when repeatedly mounting a plurality of electronic components on the circuit board, each electronic component can be always brought into contact with the circuit board under a preset contact load, and the electronic components are bonded to the circuit board. It is possible to stabilize the quality.

Further, after the contact between the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4, while the solder bumps 1b and the solder portions 2 are being melted, the head tool 3 causes each of the electronic components 1 to move. By performing the shaping operation of the solder bumps 1b, the wettability between the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 in the molten state can be improved.
Therefore, the adhesiveness of the solder to each electrode 1a of the electronic component 1 and each pad 4a of the circuit board 4 can be improved, and the reliability of the bonding between the electronic component and the circuit board can be improved. Becomes

Further, before the electronic component 1 is brought into contact with the circuit board 4, a leveling operation for aligning the heights of the solder bumps 1b of the electronic component 1 is performed, whereby the formation height of the solder bumps 1b of the electronic component 1 is increased. Even if there is variation in the height, this variation can be eliminated and the height of each solder bump 1b can be made uniform. As a result, when the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 come into contact with each other,
The influence on the contact load control due to the variation in the formation height of each solder bump 1b can be eliminated, the controllability of the contact load can be improved, and the contact load on each solder bump 1b can be made more uniform. You can call. Therefore, the electrodes 1a of the electronic component 1 and the pads 4a of the circuit board 4 can be reliably bonded to each other with a more uniform contact load via the solder.
It is possible to stabilize the joining quality between the electronic component and the circuit board.

In addition, when the back surface height accuracy of the electronic component 1 after the electronic component 1 is bonded to the circuit board 4 is required, the leveling operation is performed and the formation height of each solder bump 1b of the electronic component 1 is increased. By making the thickness uniform, it becomes possible to stabilize the back surface height of the electronic component 1 after being mounted on the circuit board 4. The leveling operation is performed, for example, in the electronic component 1 having each solder bump 1b of 1000 bumps or more.
It is effective to further stabilize the joining quality by applying the above.

By properly combining the arbitrary embodiments of the aforementioned various embodiments, the effects possessed by them can be produced.

[0118]

According to the first or second aspect of the present invention, while the electrodes of the electronic component sucked and held by the component holding member and the electrodes of the circuit board are brought into contact with each other with the bonding material interposed therebetween. , Melting the joining material between the electrodes by heating, and releasing the timing of releasing the suction holding to the electronic component by the component holding member during melting of the joining material as in the conventional local reflow mounting method. Instead of doing
Release is performed after the above-mentioned joining material is melted, then cooled and solidified. That is, the electronic component is not mounted by obtaining the self-alignment effect due to the surface tension of the bonding material in the molten state as in the conventional local reflow mounting method, but the electronic component is mounted at the contact position positioned by the component holding member. The components are mounted on the circuit board. Accordingly, the displacement of the joining position of the electronic component can be eliminated by the vacuum breaking blow that occurs when the suction holding of the electronic component by the component holding member is released. Therefore, rather than obtaining the self-alignment effect, the electronic component in which the pitch between the electrodes of the electronic component is narrowed so that the displacement of the bonding position of the electronic component due to the vacuum break blow in the component holding member becomes a problem. It becomes possible to mount the components on the circuit board.

According to the third to sixth aspects of the present invention, the joining material supplying method, the joining material constituting material, or the flux supplying method used in the conventional electronic component mounting method is applied. Therefore, it is possible to provide a mounting method of electronic components having general versatility.

According to the seventh or eighth aspect of the present invention, each electrode of the electronic component suction-held by the component-holding member by the suction-holding mechanism and each electrode of the circuit board are brought into contact with each other with the bonding material interposed. While heating, the bonding material between the electrodes is heated and melted by the heating mechanism, and the timing at which the suction holding mechanism releases the suction holding of the component holding member to the electronic component by the conventional local reflow mounting. Instead of releasing during the melting of the bonding material as in the method, the melting is performed after the bonding material is heated and melted by the heating mechanism and then solidified by the cooling of the cooling mechanism. That is, the electronic component is not mounted by obtaining the self-alignment effect due to the surface tension of the bonding material in the molten state as in the conventional local reflow mounting method, but the electronic component is mounted at the contact position positioned by the component holding member. The components are mounted on the circuit board. Accordingly, the displacement of the joining position of the electronic component can be eliminated by the vacuum breaking blow that occurs when the suction holding mechanism releases the suction holding of the component holding member to the electronic component. Therefore, rather than obtaining the self-alignment effect, an electronic device in which the pitch between the electrodes of the electronic component is narrowed so that the displacement of the bonding position of the electronic component due to the vacuum breaking blow in the suction holding mechanism becomes a problem. It becomes possible to mount the components on the circuit board.

[Brief description of drawings]

FIG. 1 is an overall perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

2A and 2B are diagrams showing a mounting method of an electronic component according to the above embodiment, FIG. 2A is a cross-sectional view of a circuit board, and FIG. 2B is an electronic component and a circuit board in a state where the electronic component is aligned with the circuit board. And (c) is a sectional view of the electronic component and the circuit board when the electronic component and the circuit board are in contact with each other, (d)
Is a cross-sectional view of the electronic component and the circuit board in a state where each solder bump of the electronic component and each solder portion of the circuit board are heated and melted, and (e) is an electronic component and the circuit in a state where the melted solder is cooled. Sectional drawing of a board | substrate, (f) is a sectional view of a circuit board in the state in which the electronic component was mounted.

FIG. 3 is a cross-sectional view of the head tool that schematically shows the structure of the head tool in the electronic component mounting apparatus according to the above embodiment.

FIG. 4 is a flowchart showing a mounting procedure in a mounting method for an electronic component according to the above embodiment.

FIG. 5 is a flowchart showing a procedure for correcting the extension amount and the contraction amount of the head tool in the electronic component mounting method according to the above embodiment.

FIG. 6 is a flowchart showing a procedure for performing constant load control of the head tool and tip position control of the suction nozzle in the electronic component mounting method according to the above embodiment.

FIG. 7 is a flowchart showing a contact load control operation procedure by a head tool in the electronic component mounting method according to the embodiment.

FIG. 8 is a flowchart showing a contact load control operation procedure by a head tool in the electronic component mounting method according to the embodiment.

FIG. 9 is a vibration operation pattern diagram of a shaping operation by a head tool in the electronic component mounting method according to the embodiment.

FIG. 10 is a time chart showing each operation of the head tool in the electronic component mounting method according to the above embodiment, where (a) is the control height of the head tool, (b) is the tip height of the suction nozzle, and FIG. 3C is a time chart showing a change state of the temperature of the adsorption nozzle with time.

FIG. 11 is a diagram showing a method of mounting electronic components by a conventional batch reflow mounting method.

FIG. 12 is a diagram showing a method of mounting electronic components by a conventional local reflow mounting method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic component, 1a ... Electrode, 1b ... Solder bump, 2 ... Solder part, 3 ... Head tool, 3a ... Head tool tip part,
3b ... Head tool main body part, 4 ... Circuit board, 4a ... Pad, 5 ... Parts tray, 6 ... Slide base, 7 ... Stage, 8 ... Leveling stage, 9 ... Control part, 11 ... Tool, 12 ... Ceramic heater, 13 ... Water jacket, 14 ... Load cell, 15 ... Self-weight offset spring, 16 ... Frame, 16a ... Upper frame, 16b ...
Lower frame, 16c ... Intermediate frame, 16d ... Hole, 1
7 ... Shaft, 17a ... Shaft upper part, 17b ... Shaft lower part, 17c ... Step part, 18 ... Spring receiving part, 19 ... Cooling blow nozzle,
21 ... Elevating part, 21a ... Ball screw shaft, 21b ... Nut part, 21m ... Motor, 22 ... X direction moving mechanism, 23 ... Y
Directional movement mechanism, 81 ... Electronic component, 81a ... Electrode, 81b
... solder bumps, 82 ... solder parts, 83 ... head tools, 8
4 ... Circuit board, 84a ... Pad, 91 ... Electronic component, 91
a ... Electrode, 91b ... Solder bump, 92 ... Solder part, 93 ...
Tool, 94 ... Circuit board, 94a ... Pad, 101 ... Electronic component mounting apparatus.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Shoichi Yamano             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Kazuya Yamamoto             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Satoshi Soda             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Takaharu Mae             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F-term (reference) 5E319 AA03 AB05 AC01 BB04 CC33                       CC58 GG09                 5F044 KK01 KK14 LL04 PP19 QQ03

Claims (8)

[Claims] 1. A bonding material (1b, 2) for connecting a plurality of electrodes (1a) of an electronic component (1) held by a component holding member (3) and a plurality of electrodes (4a) of a circuit board (4). While contacting with the interposition of the above, the joining materials (1b, 2) are heated and melted, cooled and solidified, and then the electronic component (1) is sucked and held by the component holding member (3). A method of mounting an electronic component, which is characterized by releasing. 2. An electronic component (1) having a plurality of electrodes (1a) is adsorbed and held by a component holding member (3), and the electrodes (1a) of the electronic component (1) and the circuit board (4) are The plurality of electrodes (4a) are aligned so that they can be joined to each other, and the component holding member (3) is lowered while the electronic component (1) is suction-held, and each electrode (of the electronic component (1) ( 1a) and the electrodes (4a) of the circuit board (4) are bonded to each other (1b, 2)
The above-mentioned joining materials (1b, 2) while interposing and abutting
A method for mounting an electronic component, wherein the component is held by heating, melted, cooled, and solidified, and then the suction holding of the electronic component (1) by the component holding member (3) is released. 3. The bonding material (1b, 2) is at least one of the electrodes (1a) of the electronic component (1) or the electrodes (4a) of the circuit board (4). The electronic component mounting method according to claim 1, which is supplied in advance. 4. The mounting method for an electronic component according to claim 1, wherein the bonding material (1b, 2) is solder. 5. The electrodes (1) of the electronic component (1)
a) or each of the electrodes (4a) on the circuit board (4)
The electronic component mounting method according to any one of claims 1 to 4, wherein flux is previously supplied to the top or the bonding material (1b, 2). 6. A solder bump (1) having the bonding material (1b, 2) formed on each electrode (1a) of the electronic component (1).
b) or each of the electrodes (1a) of the electronic component (1)
Solder bumps (1b) formed on the substrate and solder portions (2) formed on the electrodes (4a) of the circuit board (4).
The method of mounting an electronic component according to claim 1, 2, or 4. 7. An electronic component (1) is adsorbed and held by a component holding member (3), and a plurality of electrodes (1a) of the electronic component (1).
And a plurality of electrodes (4a) of the circuit board (4) with a bonding material (1
(b) and (2) are interposed to bond the electronic component, and a suction holding mechanism (11) for holding the electronic component (1) by the component holding member (3), and the component holding member (3). 3) a raising / lowering mechanism (21) for lowering or raising, a pedestal part (7) on which the circuit board (4) is arranged, and a heating mechanism (12) for heating the bonding materials (1b, 2).
And a cooling mechanism (19) for cooling the bonding material (1b, 2)
And a control unit (9) for controlling the suction holding mechanism (11), the elevating mechanism (21), the heating mechanism (12), and the cooling mechanism (19), and the control unit (9). Controlling the heating mechanism (12) while controlling the elevating mechanism (21) to bring the electronic component (1) sucked and held by the component holding member (3) into contact with the circuit board (4). Then, the bonding material (1b, 2) is heated and melted, and then the cooling mechanism (19) is controlled to cool and solidify the bonding material (1b, 2) and the bonding material (1b). After the solidification of 2), the suction holding mechanism (11) is controlled to release the suction holding of the electronic component (1). 8. An electronic component (1) is adsorbed and held by a component holding member (3), and a plurality of electrodes (1a) of the electronic component (1).
And a plurality of electrodes (4a) on the circuit board (4) with a bonding material (1
b, 2) while abutting with interposing them, the above-mentioned bonding material (1
b, 2) are heated and melted, and the electrodes (1a) of the electronic component (1) are inserted into the electrodes (4a) of the circuit board (4) with the bonding materials (1b, 2) interposed. A mounting apparatus for electronic components to be joined together by a suction holding mechanism (11) for sucking and holding the electronic component (1) on the component holding member (3), and lowering or raising the component holding member (3). Lifting mechanism (21) and heating mechanism (12) for heating the bonding materials (1b, 2)
And a cooling mechanism (19) for cooling the bonding material (1b, 2)
And a control unit (9) for controlling the suction holding mechanism (11), the elevating mechanism (21), the heating mechanism (12), and the cooling mechanism (19), and the control unit (9). , The heating mechanism (12) is controlled to heat and melt the bonding materials (1b, 2), and then,
By controlling the cooling mechanism (19), the bonding material (1b,
2) is configured to be cooled and solidified, and the control unit (9) controls the adsorption holding mechanism (11) so that the bonding material (1b) is melted by the heating mechanism (12). By the suction holding mechanism (11), the electronic component (1)
Is adsorbed and held, and after the control unit (9) solidifies the cooling mechanism (19) by cooling the bonding material (1b, 2) to the electronic component (1) by the adsorption holding mechanism (11). An electronic component mounting apparatus, which is configured to release suction holding.