JP2008114247A - Soldering method in soldering device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a soldering method in a soldering device capable of attaining the excellent deposition state of a solder and enhancing the quality by promoting the wettability of the solder. <P>SOLUTION: A core portion 2a of an end of a wire 2 with a covered portion 2b thereof being peeled is inserted in a soldering tank 3 by the predetermined length, and a solder 4 is deposited on the core portion 2a. The soldering method comprises a basic insertion-evacuation step of one reciprocation of inserting/evacuating the core portion 2a in/from the solder tank 3 by the predetermined length, and a solder deposition promoting step of moving the core portion 2a to be inserted in the solder tank 3 by the basic insertion-evacuation step in the molten solder 4 in addition to one reciprocation. The solder 4 is deposited on the core portion 2a by combining the basic insertion-evacuation step and the soldering deposition promoting step. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a soldering method in a soldering apparatus in which solder is attached to a core wire portion at an end portion of a stripped electric wire.

  2. Description of the Related Art Conventionally, there has been an electric wire processing machine that peels a coating portion at an end portion of an electric wire, attaches a flux liquid to the exposed core wire portion, and then inserts the solder into the solder bath and attaches the solder to the core wire portion.

  When the harness is manufactured, a predetermined amount of the electric wire is fed along the feed line by the length measuring unit, and the electric wire is gripped by each clamp arranged along the feed line. Thereafter, the electric wire is cut by the cutter unit, and the covering portion of the cut end portion of the electric wire is peeled off.

  Next, the end portion of the peeled electric wire is moved to the position of the flux unit, and the core wire portion is immersed in the flux tank of the flux unit. Thereafter, the electric wire having the flux liquid adhered thereto is moved to a solder unit position as a soldering device, and the core wire portion is immersed in the solder tank of the solder unit, and the solder is attached to the core wire portion.

  As shown in FIG. 6, the soldering method in such a soldering apparatus is such that the rotating arm 1 is rotated while the electric wire 2 is transferred to the chuck portion 1a of the rotating arm 1 that can be rotated. A method of attaching solder to the core wire portion 2a by inserting the core wire portion 2a at the end of the electric wire 2 into the melted solder 4 in the solder tank 3 by being operated and then retracted to the initial position. Alternatively, as shown in FIG. 7, the wire 2 is fed and retracted by rotating the feed roller 8 by releasing the gripping of the wire 2 by the clamp 7 of the wire feeding unit 6. Various soldering methods such as a method of attaching solder to the portion 2a have been proposed (see, for example, Patent Document 1 to Patent Document 3).

JP 2002-289315 A Japanese Patent Laid-Open No. 10-216932 Japanese Utility Model Publication No. 4-55788

  Then, according to the conventional soldering method as described above, the core wire portion 2a of the electric wire 2 is inserted into the solder 4 of the solder tank 3 for a predetermined length and then retracted only once. It was supposed to be a method of soldering processing.

  However, depending on the nature of the solder and the state of the metal surface of the core portion of the electric wire, the wettability of the solder may be poor. As a result, the soldering state may be uneven or weakly adhered, leading to deterioration in quality.

  SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a soldering method in a soldering apparatus that promotes the wettability of solder, improves the adhesion state of the solder, and improves the quality.

  The technical means for solving the above problems is a soldering method in a soldering apparatus in which a set length is inserted into a solder tank and the solder wire is attached to the core wire part by inserting the core wire part of the end of the electric wire with the covering part peeled off. The core wire portion is inserted into the solder tank with a set length to be retracted, and the reciprocating basic insertion / retraction operation step and the core wire portion inserted into the solder bath by the basic insertion / retraction operation step are dissolved. A solder adhesion promoting operation step that moves in addition to the one reciprocation in the solder, and the solder is adhered to the core wire portion by combining the basic insertion / retraction operation step and the solder adhesion promotion operation step.

  The solder adhesion promoting operation step may be a method of swinging the core portion of the electric wire.

  Further, the solder adhesion promoting operation step may be a method of rotating the electric wire around the axis of the core wire portion.

  As described above, according to the soldering method in the soldering apparatus of the present invention, the reciprocating basic insertion / retraction operation step of inserting the core wire portion into the solder tank for a set length and retracting, and the basic insertion / retraction operation step A solder adhesion promoting operation step for moving the core wire portion inserted into the solder tank in the melted solder in addition to the one reciprocation, and combining the basic insertion retraction operation step and the solder adhesion promotion operation step into the core wire portion. This is a method of attaching solder. In addition to the simple reciprocating operation of insertion and retraction as in the conventional case, it is combined with the process of moving the core part in the melted solder. There is an advantage that it can be promoted, the adhesion state of solder becomes good, and the quality can be improved.

  Moreover, it can provide favorably by the method of rocking | fluctuating the core wire part of an electric wire, and the method of rotating an electric wire around the axial center of a core wire part as a solder adhesion promotion operation | movement process.

  Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an explanatory view of a main part of a soldering apparatus. For example, it may be appropriately employed in an electric wire processing machine for carrying out the above-described process, and a soldering-only apparatus.

  According to this soldering apparatus, the core wire portion 2a at the end of the electric wire 2 from which the covering portion 2b has been peeled is disposed along the axial direction of the core wire portion 2a having a predetermined length set in advance with respect to the solder tank 3. The reciprocating basic insertion / retraction operation step of inserting and then retreating to the initial position, and the core wire portion inserted into the solder 4 melted in the solder tank 3 by this basic insertion / retraction operation step, In addition to the reciprocation, the solder adhesion promoting operation step is further provided.

  This solder adhesion promoting operation step is a method of swinging the core wire portion 2a of the electric wire 2, and in this embodiment, as an example of the method of swinging, the electric wire 2 is moved forward and backward in the axial direction of the core wire portion 2a. It is supposed to be a way to move it.

  Then, the basic insertion / retraction operation step and the solder adhesion promoting operation step are combined to immerse the core wire portion 2a in the solder 4 of the solder tank 3 and attach the solder 4 to the core wire portion 2a.

  That is, in this embodiment, when the core wire portion 2a of the electric wire 2 is inserted into the solder 4 in the basic insertion / retraction operation step, the fine movement advance / retreat operation of, for example, 2 mm forward and 1 mm backward is performed by the solder adhesion promotion operation step. Is repeated every 0.3 seconds, and the core wire portion 2a is inserted and dipped to the target set length, and then retracted to the initial position. In addition, when the target set length is inserted and then retracted to the initial position, the solder adhesion promoting operation process may be continued, or the solder adhesion promoting operation process may be stopped. May be determined as appropriate.

  Therefore, according to the soldering method of the present embodiment, the core wire portion 2a is inserted into the solder 4 of the solder tank 3 to the target set length while repeating the fine movement forward and backward movement, and the electric wire 2 is still Even if there is a possibility that the solder 4 may be repelled between the core wire portion 2a and the solder 4 that are not attached, the familiarity of the solder 4 with respect to the core wire portion 2a is improved by repeating the forward and backward movement of the fine movement. As a result, the wettability of the solder 4 is promoted, and an excellent adhesion (solder plating) state of the solder 4 is obtained here, thereby improving the quality.

  For such an advance / retreat operation of the electric wire 2, a method based on a control that repeats the feeding / retreating operation by the conventional feeding roller 8 may be appropriately employed. A similar soldering method can also be provided by appropriately adopting a method by controlling the forward / reverse rotation operation by the conventional rotation arm 1 described above.

  Therefore, in the conventional soldering apparatus, there is an advantage that it can be easily provided by changing the control operation for inserting and retracting the core wire portion 2a at the end of the electric wire 2 with respect to the solder tank 3.

  Moreover, in the said embodiment, although it is set as the method of moving the electric wire 2 back and forth finely in a solder adhesion promotion operation process, the method of repeating the same reciprocating operation same as a basic insertion retraction operation process once or several times may be used. .

  In this case, after inserting the core wire portion 2a into the solder 4 of the solder tank 3 to the set length, the operation of retreating to the outside of the solder tank 3 is performed a plurality of times. Compared with the case of only the reciprocating method, the wettability of the solder 4 is promoted, and the same advantages can be exhibited.

  FIG. 2 shows a second embodiment, and the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  That is, in the present embodiment, in the basic insertion / retraction operation step, the core wire portion 2a at the end of the electric wire 2 is inserted into the solder tank 3 for a predetermined length, and then retracted to the initial position. As another example of the method of swinging the core wire portion 2a, the solder adhesion promoting operation step is a slight reciprocation method in the direction perpendicular to the axial direction of the core wire portion 2a (left and right direction in the figure). This is a method of reciprocating the distance. Therefore, in the basic insertion / retraction operation process, when inserting the core part 2a of the electric wire 2 into the solder 4, the core part 2a is inserted and submerged to a target set length while repeating fine movement in the left-right direction, Then, it is set as the method of retracting to an initial position.

  In this case, the core wire portion 2a is inserted into the solder 4 of the solder tank 3 to the desired set length while repeating the left and right movements of fine movement, and the core wire portion 2a to which the electric wire 2 has not yet adhered is the same as described above. Even if there is a possibility that the solder 4 may be repelled between the solder 4 and the solder 4, the solder 4 becomes more familiar with the core wire portion 2 a due to repeated fine movements of the left and right movements, and the solder 4 becomes wet. As a result, a good adhesion state of the solder 4 can be obtained and the quality can be improved.

  For such a left-right operation of the electric wire 2, a structure capable of controlling the above-described conventional rotating arm 1 and electric wire feeding unit 6 to reciprocate slightly in the lateral direction may be appropriately employed.

  FIG. 3 shows a third embodiment, and the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  That is, in the present embodiment, in the basic insertion / retraction operation step, the core wire portion 2a at the end of the electric wire 2 is inserted into the solder tank 3 for a predetermined length, and then retracted to the initial position. A reciprocating method is used, and the solder adhesion promoting operation step is a method of imparting vibration to the core wire portion 2a of the electric wire 2 as still another example of the method of swinging the core wire portion 2a. Therefore, in the basic insertion / retraction operation step, when the core wire portion 2a of the electric wire 2 is inserted into the solder 4, the core wire portion 2a is made up to a target set length in a state where vibration is applied to the core wire portion 2a of the electric wire 2. Is inserted and soaked, and then retracted to the initial position.

  In this case, it is a method of inserting the core wire portion 2a to the target set length while applying vibration to the core wire portion 2a of the electric wire 2 in the solder 4 of the solder tank 3, and the electric wire 2 still adheres as described above. Even if there is a possibility that the solder 4 may be repelled between the core wire portion 2a and the solder 4 that are not, the applied vibration improves the familiarity of the solder 4 with the core wire portion 2a. The wettability of No. 4 is promoted, and a good adhesion state of the solder 4 is obtained here, so that the quality can be improved.

  Such vibration may be ultrasonic vibration or fine vibration.

  And the operation | movement which provides a vibration to the electric wire 2 should just employ | adopt suitably the structure etc. which connect the above-mentioned conventional rotation arm 1 and the electric wire feeding part 6, and a vibration generator and an ultrasonic generator.

  Also in the second and third embodiments, as in the first embodiment, the solder adhesion promoting operation process is continued when the target set length is inserted and then retracted to the initial position. Control may be used, or control for stopping the solder adhesion promoting operation process may be performed, and may be determined as necessary.

  In each of the above embodiments, as a method of swinging the core wire portion 2a of the electric wire 2, a swing method of moving forward and backward in the axial direction of the core wire portion 2a, or a reciprocation in a direction orthogonal to the axial direction of the core wire portion 2a. Although a swinging method for moving and a swinging method for applying vibration to the core wire portion 2a are shown, a pitching motion such as a pendulum motion, a rolling motion, or a combination thereof may be used.

  In this case, when the core part 2a of the electric wire 2 is inserted into the solder 4 in the basic insertion / retraction operation step, the target setting is performed while the core part 2a is swung by a pitching motion or a rolling motion. The core wire portion 2a is inserted and immersed until the length, and then retracted to the initial position.

  Therefore, the core wire portion 2a is inserted into the solder 4 of the solder tank 3 to the desired set length while being rocked by a pitching motion or a rolling motion, and the electric wire 2 still adheres as described above. Even if there is a possibility that the solder 4 may be repelled between the non-core wire portion 2a and the solder 4, the above-mentioned swinging of the solder 4 improves the familiarity of the solder 4 with the core wire portion 2a. The wettability of the solder 4 is promoted, and a good adhesion state of the solder 4 can be obtained here, thereby improving the quality.

  For such a swinging operation, a structure that supports the above-described conventional rotating arm 1 and electric wire feeding unit 6 so as to be freely rotatable can be appropriately employed.

  FIG. 4 shows a fourth embodiment, and the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  That is, in the present embodiment, in the basic insertion / retraction operation step, the core wire portion 2a at the end of the electric wire 2 is inserted into the solder tank 3 for a predetermined length, and then retracted to the initial position. The solder adhesion promoting operation step is a method of rotating the electric wire 2 eccentrically around the axis of the core wire portion 2a. Therefore, in the basic insertion / retraction operation process, when the core wire portion 2a of the electric wire 2 is inserted into the solder 4, the electric wire 2 is eccentrically rotated around the axis of the core wire portion 2a, and is rotated in a spiral manner here. However, the core wire portion 2a is inserted and dipped to the target set length, and then retracted to the initial position.

  In this case, the core wire portion 2a is inserted into the solder 4 of the solder tank 3 to the desired set length while rotating in a spiral manner, and as described above, the core wire portion 2a to which the electric wire 2 is not yet attached. Even if there is a possibility that the solder 4 may be repelled between the solder 4 and the solder 4, the familiar rotation of the solder 4 with respect to the core wire portion 2 a is improved by the helical rotation, and the wettability of the solder 4 is promoted. Thus, a good adhesion state of the solder 4 can be obtained, and the quality can be improved.

  Such a rotating operation of the electric wire 2 may be appropriately adopted such that the chuck portion 1a of the conventional rotating arm 1 is rotatably supported.

  In addition, when inserting the core part 2a into the solder tank 3, or when retracting to the initial position, the direction of rotation may be configured so as to be able to control forward / reverse switching.

  Also in the fourth embodiment, as in the first embodiment, when the target set length is inserted and then retracted to the initial position, the solder adhesion promoting operation process may be continued, or It is good also as control which stops a solder adhesion promotion operation process, and should just decide suitably if needed.

  Furthermore, in the basic insertion / retraction operation step, the insertion step may be temporarily stopped and then eccentrically rotated about the axis.

  FIG. 5 shows a fifth embodiment, and the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  That is, also in this embodiment, as in the fourth embodiment, the basic insertion / retraction operation step inserts the core wire portion 2a at the end of the electric wire 2 into the solder tank 3 for a predetermined length, Thereafter, the reciprocation method is a reciprocating method of retracting to the initial position, and the solder adhesion promoting operation step is a method of rotating the electric wire 2 around the axis of the core wire portion 2a.

  In the basic insertion / retraction operation step, after inserting the core wire portion 2a of the electric wire 2 into the solder 4 for a set length, the electric wire 2 is rotated around the axis of the core wire portion 2a by the solder adhesion promoting operation step, and thereafter The method is to retract to the initial position.

  In this case, the core wire portion 2a is rotated around its axis in the solder 4 while being inserted into the solder 4 of the solder tank 3 up to a desired set length. Even if there is a possibility that the solder 4 may be repelled between the core wire portion 2a and the solder 4 which are not yet connected, the familiarity of the solder 4 with respect to the core wire portion 2a is improved by the rotation of the core wire portion 2a. The wettability of the solder 4 is promoted, and a good adhesion state of the solder 4 can be obtained here, so that the quality can be improved.

  In this case, the direction of rotation of the electric wire 2 may be configured to be controllable for forward / reverse switching.

  Moreover, in each said embodiment, although the method which inserts the core part 2a in the state inclined appropriately angle with respect to the solder 4 liquid level in the solder tank 3 is shown, with respect to the liquid level of the solder 4 It is good also as a method of inserting the core part 2a from right above.

  In this case, there is an advantage that the contact distance of the boundary portion between the core wire portion 2a and the solder 4 at the time of insertion is shortened, so that the phenomenon of the solder 4 is reduced and the adhesion state of the solder 4 is improved.

  In addition, although the various methods of moving the core wire part 2a in the solder 4 are illustrated as the solder adhesion promoting operation process, other moving methods or moving methods obtained by further combining the moving methods may be used. There is no limitation on the form.

It is principal part operation | movement explanatory drawing concerning the 1st Embodiment of this invention. It is principal part operation explanatory drawing concerning 2nd Embodiment. It is principal part operation explanatory drawing concerning 3rd Embodiment. It is principal part operation | movement explanatory drawing concerning 4th Embodiment. It is principal part operation | movement explanatory drawing concerning 5th Embodiment. It is conventional principal part operation explanatory drawing. It is conventional principal part operation explanatory drawing.

Explanation of symbols

2 Electric wire 2a Core wire part 2b Covering part 3 Solder tank 4 Solder

Claims (3)

In the soldering method in the soldering apparatus in which the core wire part of the end of the wire stripped of the covering part is inserted into the solder tank for a set length, and the solder is attached to the core wire part,
One reciprocal basic insertion / retraction operation step of inserting and retracting the core wire portion with a set length with respect to the solder tank;
A solder adhesion promoting operation step of moving the core wire portion inserted into the solder tank by the basic insertion / retraction operation step in addition to the reciprocation in the melted solder;
A soldering method in a soldering apparatus, wherein the solder is attached to the core wire portion by combining the basic insertion / retraction operation step and the solder adhesion promoting operation step. The soldering method in the soldering apparatus according to claim 1,
A soldering method in a soldering apparatus, wherein the solder adhesion promoting operation step swings the core portion of the electric wire. The soldering method in the soldering apparatus according to claim 1,
The soldering promoting method includes a soldering method in a soldering device, wherein the electric wire is rotated about an axis of the core wire portion.

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