JP2003008184A - Printed board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate defects of a solder ball and a connection defect without requiring mounting facility with high precision and also eliminate man-hours for visual inspection and later adjustment. SOLUTION: The printed board is composed of a printed main board 1, a pair of pads 2a and 2b arranged with a prescribed space, and a pair of additional pads 2c and 2d between the pads 2a and 2b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a printed circuit board designed so that a semiconductor chip can be attached.

[0002]

2. Description of the Related Art Generally, a printed circuit board having a semiconductor chip, a resistor, a capacitor and the like mounted on the surface of a printed board on which a wiring pattern is formed is used in various electronic devices. Bakelite (a registered trademark of thermosetting phenolic resin), glass fiber, and other materials are used for this printed circuit board.

An example of a conventional method of mounting the printed circuit board and the semiconductor chip 4 on the printed circuit board will be described below with reference to the drawings.

FIG. 28 is a plan view showing an example of the structure of a conventional printed circuit board of this type.
FIG. 3 is a sectional view of a part of a printed circuit board of this type.

This printed circuit board comprises a printed circuit board body 1
And a pair of pads 2a and 2b provided on the surface of the printed circuit board body 1 at a predetermined interval, and a solder resist 3 provided on a portion of the printed circuit board other than the pads 2a and 2b. It is configured.

The printed circuit board body 1 is a plate-like member made of an electrically insulating material having a substantially rectangular planar shape.

Each of the pads 2a and 2b has a substantially rectangular planar shape, and has electrodes 5a of the semiconductor chip 4 to be attached,
It is provided with a predetermined interval according to the distance between 5b.

Further, on the surfaces of these pads 2a, 2b, the oxidation of the pads 2a, 2b during heating is prevented, the surface tension of the melted solder is lowered, and the spreading and spreading of the solder is promoted. Flux is applied from.

The solder resist 3 is soldered on portions other than the pads 2a and 2b on the printed circuit board in order to prevent oxidation of a wiring pattern or the like (not shown) provided on the printed circuit board or to prevent short circuit of the wiring pattern. It is covered so as not to be covered.

FIG. 30 is a plan view showing an example of a semiconductor chip 4 attached to a printed circuit board of this type.
FIG. 3 is a side view of the semiconductor chip 4.

The semiconductor chip 4 is a semiconductor chip body 4a.
The electrodes 5a and 5b are provided on both ends of the.

The electrodes 5a and 5b have a substantially rectangular planar shape and a substantially U-shaped cross section.

FIG. 32 is a plan view showing an example of the structure of the printed circuit board after mounting the semiconductor chip 4, and FIG. 33 is a cross-sectional view of part of the side surface of the printed circuit board after mounting the semiconductor chip 4 and the semiconductor chip 4. FIG. 3 is a schematic diagram showing a configuration example of the side surface of FIG.

As a method of mounting the semiconductor chip 4 configured as described above on a printed circuit board, first, solder is applied in advance on the surface of a pad provided on the printed circuit board.

In the next step, the pad 2 is placed on the printed circuit board.
From the same side as the surface on which a and 2b are provided, the semiconductor chip 4
The electrodes 5a, 5b and the pad 2a of the printed circuit board,
Attach so that it overlaps with 2b.

In the next step, the semiconductor chip 4 and the printed board are simultaneously heated to a temperature higher than the melting point of the solder by a reflow device (not shown), so that the melted solder 6a spreads on the pads 2a and 2b.

When the heating is stopped in this state, the electrodes 5a and 5b on the semiconductor chip 4 side and the pads 2a on the printed circuit board side,
2b is soldered to the semiconductor chip 4 so that the semiconductor chip 4 can be energized through the pads 2a and 2b. This completes the mounting of the semiconductor chip 4 on the printed board.

[0018]

However, in such a printed circuit board, there is a possibility that a short circuit or a connection failure may occur due to excess solder.

Excessive solder means pads and semiconductor chips 4.
It refers to an excess amount of solder that exceeds the amount required to be used for joining with, and solder balls 6b are generated by this excess solder.

FIG. 34 is a plan view showing an example of the structure of a printed circuit board having solder balls 6b, and FIG.
It is a schematic diagram showing an example of composition of a side surface section of a part of a printed circuit board which has produced solder ball 6b, and a side surface of semiconductor chip 4.

On the other hand, FIG. 36 is a plan view showing an example of the structure of a printed circuit board which has a problem due to poor connection.
FIG. 37 is a schematic view showing a configuration example of a cross section of a part of the side surface of the printed circuit board and a side surface of the semiconductor chip 4, which are defective due to poor connection.

The problem that a short circuit is caused by the excess solder 6c when the semiconductor chip 4 is mounted on the printed circuit board is
The solder applied to the lower portion of the semiconductor chip 4 is melted by the heating of a reflow device (not shown),
By forming the solder balls 6b on the side surface of the semiconductor chip 4 as the surplus solder 6c which cannot be completely returned while being squeezed by the weight of the semiconductor chip 4 and protruding from the pads 2a and 2b to the center side of the semiconductor chip 4, as shown in FIG. Can occur.

The solder balls 6b are the flux residues 7 only, and are used for the printed circuit board body 1 or the solder resist 3.
Since it is fixed to the surface of the semiconductor chip 4, it may fall off from the side surface of the semiconductor chip 4 when vibration or impact is applied to this printed circuit board, or when the flux residue 7 reaches a temperature at which it softens. . When the dropped solder ball 6b moves to a location where insulation is required, there is a possibility that a short circuit may occur.

When the solder balls 6b are generated,
After removing with a needle or the like (not shown), the surface of the printed board must be cleaned to completely remove the solder balls 6b. However, with the miniaturization and high density of the semiconductor chip 4, the solder balls 6b are miniaturized, and a great deal of labor is required to be found by visual inspection and to completely remove the solder balls 6b.

In order to prevent the generation of the solder balls 6b, a metal mask (not shown) is used, the size of the pads 2a, 2b is reduced to reduce the excess solder 6c, or high precision mounting equipment is introduced. Must be taken, or measures such as whether to install solder printing equipment must be taken. However, these measures require a great deal of labor.

On the other hand, the defect due to the poor connection is that the pad at one end of the semiconductor chip 4 (for example, 2a) is the solder 6a due to misalignment of the semiconductor chip 4, misalignment of the solder print, or blur of the solder print. It can occur when there is not enough contact.

In this state, when it is heated to a temperature higher than the melting point of the solder by a reflow device (not shown), the semiconductor chip 4 is attracted by the surface tension of the solder 6a that joins the pad 2b at the other end and the solder 6a The pad 2a with insufficient contact is lifted up, and the soldering work is completed in a state where the pad 2a at one end is not connected, resulting in a defective connection.

When a connection failure occurs, the semiconductor chip 4 must be removed and attached again using a soldering iron (not shown) or the like. However, the semiconductor chip 4
Along with the miniaturization and high density of the device, a great deal of labor is required for finding and repairing a portion having a defect due to poor connection by visual inspection.

Further, in order to prevent the connection failure, whether highly accurate mounting equipment or solder printing equipment is installed,
It is necessary to take measures such as expanding the opening size of a metal mask (not shown) or expanding the sizes of the pads 2a and 2b to the central portion of the semiconductor chip 4. However,
Widen the opening size of the metal mask and use the pads 2a, 2b
If measures such as expanding the size of the solder to the central portion of the semiconductor chip 4 are taken, the amount of solder increases and the excess solder 6c
As a result, solder balls 6b may be generated. Further, if the opening size of the metal mask is changed, the amount of solder applied on the printed circuit board must be adjusted.

Therefore, the present invention has been made in view of the above circumstances, eliminates the problems caused by solder balls and defective connections, eliminates the need for highly accurate mounting equipment, and eliminates the labor required for visual inspection and repair work. It is an object of the present invention to provide a printed circuit board that can be manufactured.

[0031]

The essence of the present invention is to eliminate excessive solder on the printed circuit board, thereby eliminating problems due to solder balls and poor connection, and eliminating the need for high-precision mounting equipment and performing visual inspection. In addition, it is possible to eliminate the labor required for the repair work.

Here, the structure for fixing the excess solder may be a structure for holding the surplus solder on the surface or accommodating the surplus solder inside, for example, on the side surface of both sides of the semiconductor chip to be mounted on the printed board. There is a method of providing at least a pair of pads, a through hole, a via hole, etc. at a predetermined interval, or a method of providing at least one groove between each pad.

The essence of the present invention as described above is specifically realized by taking the following means.

The invention according to claim 1 is a printed circuit board to which a semiconductor chip can be attached, wherein a predetermined portion is provided on the surface of the printed circuit board body for attaching the printed circuit board body and electrodes of the semiconductor chip to the printed circuit board body. It is a printed circuit board provided with a pair of 1st pads provided at intervals, and a 1st surplus solder fixed part provided between each 1st pad.

Therefore, in the printed circuit board according to the first aspect of the present invention, since the above means is provided, the excess solder is bonded to the first excess solder fixing portion at the time of mounting the semiconductor chip, which is strong and does not drop off. Since it is fixed as solder on the printed circuit board body, the soldering quality can be ensured and the labor required for visual confirmation of solder balls or repair work can be reduced.

The invention according to claim 2 is the printed circuit board according to claim 1, wherein a first wiring pattern for connecting each first pad and the first surplus solder fixing portion is added. .

Therefore, the printed circuit board of the invention according to claim 2 is provided with the above-mentioned means.
In addition to the effect of the invention according to (1), the continuity test can be easily performed by using the first surplus solder fixing portion.

According to a third aspect of the present invention, in the printed circuit board according to the first or second aspect, the first surplus solder fixing portions are provided on the surface of the main body of the printed circuit board at a predetermined interval. And a printed circuit board which is at least a pair of second pads.

Therefore, the printed circuit board of the invention according to claim 3 is provided with the above-mentioned means.
Alternatively, the operation of the invention according to claim 2 can be easily and surely realized.

According to a fourth aspect of the present invention, in the printed circuit board according to the first aspect, the first excess solder-bonded portions are provided on the surface of the printed circuit board main body at a predetermined interval with a predetermined distance therebetween. It is a printed circuit board that is a through hole.

Therefore, in the printed circuit board according to the fourth aspect of the present invention, since the above means is provided, excess solder is bonded to each through hole when the semiconductor chip is mounted, and the printed circuit board is a strong solder that does not fall off. Since it is held on the upper side, the soldering quality can be secured, and the labor required for visually confirming or reworking the solder balls can be reduced.

According to a fifth aspect of the present invention, in the printed circuit board according to the second aspect, the first surplus solder fixing portions are at least one pair provided on the surface of the main body of the printed circuit board at a predetermined interval. It is a printed circuit board that is a via hole.

Therefore, in the printed circuit board according to the fifth aspect of the present invention, since the above means is provided, excess solder is bonded to the via hole when the semiconductor chip is mounted, and the solder is strong and does not fall off on the printed circuit board. Since it is held, the soldering quality can be ensured, and the labor required for visually confirming the solder balls or the work of reworking can be reduced.

According to a sixth aspect of the present invention, in the printed circuit board according to the first or second aspect, each first pad is extended on the surface of the printed circuit board body and in the same direction as the excess solder fixing portion. And a printed circuit board having a planar shape with a first extension.

Therefore, in the printed circuit board according to the sixth aspect of the present invention, since the contact area between the semiconductor chip and the solder can be sufficiently secured by providing the above means, even if some mounting misalignment occurs, No connection failure will occur and the soldering quality can be maintained when mounting the semiconductor chip.

According to a seventh aspect of the present invention, in the printed circuit board according to the first aspect, each first pad has a planar shape having a second extension extending in the same direction as the semiconductor chip. The first excess solder-bonded portion is
It is a printed circuit board which is at least one groove provided between each 1st pad.

Therefore, in the printed circuit board according to the seventh aspect of the present invention, since the above means is provided, when the semiconductor chip is mounted, the semiconductor chip and the solder are soldered by the second extension portions provided in each first pad. A large contact area with the semiconductor chip can be ensured, and defects due to poor contact can be prevented, and since excess solder flows into the groove provided between the first pads, solder balls are not generated and the semiconductor chip The quality of soldering at the time of mounting can be improved.

According to an eighth aspect of the present invention, there is provided a printed circuit board capable of selectively mounting a plurality of semiconductor chips, wherein the printed circuit board main body and the printed circuit board main body for attaching electrodes of each semiconductor chip to the printed circuit board main body. A pair of third pads provided on the surface of the printed circuit board with a predetermined space therebetween, and at least a pair of third pads provided on the surface of the printed circuit board body with a predetermined space and having a size different from each other. A pair of fourth pads, a second wiring pattern connecting the third pads to the fourth pads, and a plurality of individual wirings provided corresponding to each third pad and each fourth pad And a second surplus solder fixing portion of

Therefore, in the printed circuit board of the invention according to the eighth aspect, since the above-mentioned means is provided, the excess solder is joined at the third pads and the fourth pads to form a strong solder which does not fall off. Since it is held on the surface of the printed circuit board, the soldering quality can be ensured and the labor required for visually checking or reworking the solder balls can be reduced.

Further, the size of the semiconductor chip to be mounted can be arbitrarily selected by the manufacturer, and the labor required for introducing highly accurate mounting equipment can be omitted.

According to a ninth aspect of the present invention, in the printed circuit board according to the eighth aspect, the third pad and the fourth pad are respectively corresponding to the third pad and the fourth pad. It is a printed circuit board to which a plurality of third wiring patterns for individually connecting a plurality of individually provided second surplus solder fixing portions are added.

Therefore, in the printed circuit board of the invention according to the ninth aspect, by providing the above means, in addition to the function of the eighth aspect, the continuity test can be easily and easily performed by using each second excess solder fixing portion. It can be done reliably.

According to a tenth aspect of the present invention, a printed circuit board main body and a pair of fifth electrodes provided on the surface of the printed circuit board main body at predetermined intervals for attaching the electrodes of the semiconductor chip to the printed circuit board main body. And a fifth pad having a third extension extending on both sides of the semiconductor chip and a fourth extension extending in the same direction as the semiconductor chip. It is a printed circuit board having a planar shape provided.

Therefore, in the printed circuit board according to the tenth aspect of the present invention, since the above means is provided, excess solder is soldered at each of these extension portions when the semiconductor chip is mounted. Even when added or even when the temperature is high, excess solder does not fall off, it is possible to prevent the generation of solder balls, and since it is possible to secure a wide contact area between the solder and the semiconductor chip, it is possible to prevent problems due to poor connection, It is possible to maintain the quality of soldering when mounting a semiconductor chip.

[0055]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

The same parts as those in the above-mentioned drawings are designated by the same reference numerals and detailed description thereof will be omitted.
The different parts will be described. It should be noted that, in each of the following embodiments, duplicate description will be omitted in the same manner.

(First Embodiment) FIG. 1 is a plan view showing an example of the structure of a printed circuit board according to the first embodiment of the present invention, and FIG. 2 shows an example of the structure of this printed circuit board. It is sectional drawing of a part.

FIG. 3 is a plan view showing a configuration example of the printed circuit board after mounting the semiconductor chip 4, and FIG. 4 is a cross-sectional view of a part of the side surface of the printed circuit board after mounting the semiconductor chip 4 and the semiconductor. It is a schematic diagram showing an example of composition with a side of chip 4.

The printed circuit board of the present embodiment includes a printed circuit board main body 1, a pair of pads 2a and 2b (first pads) provided on the printed circuit board main body 1 with a predetermined space, and these pads. Between the pads 2a and 2b, a pair of additional pads 2c and 2d (first surplus solder fixing portion and second pad) provided on both side surfaces of the semiconductor chip 4 to be mounted with a predetermined interval. The printed circuit board is composed of a solder resist 3 which is covered on portions other than the pads.

The printed circuit board body 1 is a plate-like member made of an electrically insulating material having a substantially rectangular plane shape.

The plane shape of the printed circuit board body 1 is
It can be changed to any shape.

The size of the printed circuit board body 1 can be changed to any size.

Further, the printed circuit board body 1 is not limited to the printed circuit board body 1 having a single layer structure, but can be changed to a multi-layered printed circuit board structure.

Each of the pads 2a and 2b is a plate-like member made of a conductive material having a substantially rectangular plane shape, and from the viewpoint of attaching the electrodes 5a and 5b of the semiconductor chip 4, the electrodes 5a and 5b of the semiconductor chip 4 are attached. Are arranged at a predetermined interval that is the same as or slightly narrower than the interval.

The planar shape of each pad 2a, 2b is
Not limited to a substantially rectangular shape, a substantially polygonal shape, a substantially square shape,
It can be transformed into any shape such as a substantially circular shape, a substantially elliptical shape, and a fan shape.

Additional pads 2c, 2d (second pad)
Is a plate-like member made of a conductive material having a substantially circular planar shape, and holds the excess solder 6c at the time of mounting the semiconductor chip 4 and is provided on both sides of the semiconductor chip 4 so as to prevent generation of the solder balls 6b. It is arranged at a predetermined interval.

Further, the planar shape of these additional pads 2c, 2d (second pad) is formed in a substantially circular shape from the viewpoint of fixing the surplus solder 6c on the surface by the surface tension of the solder.

The planar shape of each additional pad 2c, 2d is not limited to a substantially circular shape, but can be modified to any shape such as a substantially elliptical shape, a substantially polygonal shape, a substantially square shape, a substantially rectangular shape. .

Further, the additional pads 2c and 2d are not limited to one pair, but can be changed to a plurality of pairs.

The solder resist 3 is the printed circuit board body 1.
In order to prevent oxidation of a wiring pattern (not shown) provided on the surface of, or to prevent a short circuit of the wiring pattern,
Pads 2a, 2b, 2 on the surface of the printed circuit board body 1
The parts other than c and 2d are covered so as not to be covered with solder.

Next, the operation of the printed circuit board of this embodiment having the above-described structure will be described.

When the semiconductor chip 4 is mounted on the printed circuit board by the same method as the conventional one, the surplus solder 6c protruding from the pair of pads (first pads) 2a, 2b becomes the additional pads (second pads) 2c, 2d. Since it spreads upward and is soldered onto these additional pads 2c and 2d, it will not fall off even if shock or vibration is applied to the printed circuit board.

As described above, according to this embodiment, the additional pad 2c provided between the pair of pads 2a and 2b,
Since the excess solder 6c is held by 2d, even if an impact or the like is applied to the printed circuit board, the solder does not fall off, and it is possible to prevent a short circuit from occurring.

Further, according to this embodiment, the additional pad 2
By disposing c and 2d on both side surfaces of the semiconductor chip 4 at a predetermined interval, the surplus solder is held on these additional pads 2c and 2d, so that the generation of the solder ball 6b can be prevented. As a result, since it is possible to prevent a short circuit from occurring, it is possible to eliminate the need for highly accurate mounting equipment, and it is possible to save the labor required for visual confirmation inspection, repair work, and the like.

(Second Embodiment) FIG. 5 is a plan view showing a configuration example of a printed circuit board according to a second embodiment of the present invention, and FIG. 6 is a print after mounting the semiconductor chip 4. It is a top view which shows the structural example of a board | substrate.

The printed circuit board of the present embodiment, like the printed circuit board of the first embodiment, is intended to prevent the generation of solder balls 6b due to the excess solder 6c and to facilitate the continuity test. Specifically, the pair of pads 2a and 2b (first pad) and the pair of additional pads 2c and 2d (first excess solder fixing portion) provided at a predetermined interval in the first embodiment. In addition, wiring patterns (first wiring patterns) 8a and 8b for mutually connecting the second pads) are added to the printed circuit board according to the first embodiment.

Here, the pad 2a and the additional pad 2c are connected by the wiring pattern 8a.

On the other hand, the pad 2b and the additional pad 2d are
They are connected by the wiring pattern 8b.

The size of the printed circuit board body 1 can be changed to an arbitrary size, and the planar shape of the printed circuit board body 1 is not limited to a substantially rectangular shape, but may be a substantially square shape, a substantially polygonal shape, or the like. It can be changed to any shape.

Further, the printed circuit board body 1 is not limited to the printed circuit board body 1 having a single layer structure, but can be modified to a multilayer circuit board.

According to the printed circuit board having the above-described structure, in addition to the effects of the first embodiment, the pair of additional pads 2c and 2d and the pair of pads 2a and 2b become the wiring patterns 8a and 8b. Therefore, the continuity test can be easily performed by using these additional pads 2c and 2d.

(Third Embodiment) FIG. 7 is a plan view showing a configuration example of a printed circuit board according to a third embodiment of the present invention, and FIG. 8 is an example of the configuration of this printed circuit board. It is sectional drawing of a part.

FIG. 9 is a plan view showing a structural example of the printed circuit board after mounting the semiconductor chip 4, and FIG.
3 is a schematic diagram showing a configuration example of a side surface of a part of the printed circuit board after mounting the semiconductor chip 4 and a side surface of the semiconductor chip 4. FIG.

The printed circuit board of this embodiment is similar to the first embodiment in that the solder balls 6 made of the excess solder 6c are used.
In order to prevent the occurrence of b, specifically, in place of the pair of additional pads 2c and 2d (first surplus solder fixing portions), the side surfaces on both sides of the substantially central portion of the semiconductor chip 4 to be mounted are mounted. A pair of through holes 9 provided at a predetermined interval
a and 9b (first surplus solder fixing portion) are provided.

The through holes 9a and 9b are through holes having a substantially circular plane shape, and are plated with a conductive material inside from the viewpoint of ensuring conductivity.

The number of through holes 9a and 9b is not limited to one pair, but can be changed to a plurality of pairs such as two pairs.

The planar shape of each through hole 9a, 9b can be changed to any shape such as a substantially elliptical shape or a polygonal shape.

The size of the printed circuit board body 1 can be changed to an arbitrary size, and the planar shape of the printed circuit board body 1 is not limited to a substantially rectangular shape, but may be a substantially square shape, a polygonal shape, or the like. The shape can be changed.

The printed circuit board body 1 is not limited to the printed circuit board body 1 having a single layer structure, but can be modified to have a multilayer printed circuit board.

According to the printed circuit board having the above-described structure, when the semiconductor chip 4 is mounted, the excess solder 6c flows into the pair of through holes 9a and 9b and is held by being solder-bonded. It is possible to prevent a problem that 6c does not drop out and causes a short circuit.

As a result, highly accurate mounting equipment required for mounting the semiconductor chip 4 on the printed circuit board can be dispensed with, and the labor required for visual confirmation inspection and rework can be omitted.

(Fourth Embodiment) FIG. 11 is a plan view showing a configuration example of a printed circuit board according to a fourth embodiment of the present invention, and FIG. 12 is an example of the configuration of this printed circuit board. It is sectional drawing of a part.

FIG. 13 is a plan view showing an example of the structure of the printed circuit board after the semiconductor chip 4 is mounted.
FIG. 3 is a schematic diagram showing a configuration example of a side surface cross section of a printed circuit board after mounting the semiconductor chip 4 and a side surface of the semiconductor chip 4.

The printed circuit board according to the present embodiment is not limited to the printed circuit board having the single layer structure of the second embodiment, but is intended to be applied to the multilayer printed circuit board 1a. Instead of the additional pads 2c and 2d (first surplus solder fixing portion), the wiring pattern 8 of the first layer 1b of the multilayer printed circuit board 1a including the three layers 1b, 1c and 1d.
c, 8d and the wiring patterns 8e, 8f of the second layer 1c are connected to each other, and substantially circular-shaped planes provided at predetermined intervals on both side surfaces of the semiconductor chip 4 to be mounted at a substantially central portion. The configuration is such that a pair of shaped via holes 10a and 10b (first excess solder fixing portions) are provided.

The via holes 10a and 10b are different from each other.
It is a connection hole for electrically connecting the metal wiring of the layer.
The via hole may be simply referred to as a via or a via hole.

The structure of the multilayer printed circuit board 1a is 3
The number of layers is not limited to this, and the number of layers can be changed.

The plane shape of each via hole 10a, 10b is not limited to a substantially circular shape, but can be changed to any shape such as a substantially rectangular shape, a substantially polygonal shape, or a substantially square shape.

According to the printed circuit board having the above-described structure, the pair of via holes 10a and 10b provided on the both side surfaces of the substantially central portion of the semiconductor chip 4 at predetermined intervals.
Since the excess solder 6c is held by the above, the excess solder 6c does not fall off even when a shock or vibration is applied to the printed circuit board, so that it is possible to prevent a short circuit from occurring.

As a result, highly accurate mounting equipment required for mounting the semiconductor chip 4 on the printed circuit board can be dispensed with, and labor required for visual confirmation inspection and repair work can be omitted.

(Fifth Embodiment) FIG. 15 is a plan view showing a structural example of a printed circuit board according to a fifth embodiment of the present invention, and FIG. 16 is a print after mounting the semiconductor chip 4. It is a top view which shows the structural example of a board | substrate.

The printed circuit board of this embodiment is different from the first embodiment in that the pair of pads 2a and 2b (first pad) are changed in plane shape so that the semiconductor chip 4 can be soldered to the printed circuit board. This is intended to maintain quality, and specifically, in order to secure a wide contact area between the semiconductor chip 4 and the solder, instead of the substantially rectangular pads (first pads) 2a and 2b, Pad 2 having an extension portion (first extension portion) 11a extending in the direction of the pad of the semiconductor chip 4 to the substantially central portion of the semiconductor chip 4
e and 2f are replaced.

The size of the printed circuit board body 1 can be changed to an arbitrary size, and the plane shape is not limited to a substantially rectangular shape, but can be changed to an arbitrary shape such as a substantially square shape or a substantially polygonal shape. It is possible.

Further, the printed circuit board body 1 is not limited to the printed circuit board body 1 having a single layer structure, but can be changed to a multi-layered printed circuit board structure.

According to the printed circuit board having the above-described structure, when the semiconductor chip 4 is mounted, the excess solder 6c is solder-bonded at the extended portions (first extended portions) 11a of the pads 2e and 2f, so that impact or Even when vibration or the like is applied to the printed circuit board, the excess solder 6c does not drop off.

As a result, it is possible to prevent a defect that causes a short circuit and surely achieve the same effect as that of the first embodiment.

According to the present embodiment, the excess solder 6c
, Each pad 2 having an extension portion (first extension portion) 11a
Soldering by e and 2f makes it possible to secure a wide contact area between the semiconductor chip 4 and the solder.

As a result, even if there is some mounting misalignment of the semiconductor chip 4, solder printing blurring, printing misalignment, and the like, it is possible to prevent problems due to poor contact.

(Sixth Embodiment) FIG. 17 is a plan view showing a structural example of a printed circuit board according to a sixth embodiment of the present invention, and FIG. 18 is a print after mounting the semiconductor chip 4. It is a top view which shows the structural example of a board | substrate.

The printed circuit board of the present embodiment is intended to facilitate the continuity test of the printed circuit board of the fifth embodiment. Specifically, the printed circuit board of the fifth embodiment has a pair of printed circuit boards. Wiring patterns (first wiring patterns) 8 for connecting between the pads (first pads) 2e, 2f and the pair of additional pads (second pads) 2c, 2d.
g and 8h are added.

Here, the pad 2e is connected to the additional pad 2c with the wiring pattern 8g.

The pad 2f is connected to the additional pad 2d with the wiring pattern 8h.

The size of the printed circuit board body 1 can be changed to an arbitrary size, and the plane shape is not limited to a substantially rectangular shape, but can be changed to an arbitrary shape such as a substantially square shape or a substantially polygonal shape. It is possible.

Further, the printed circuit board body 1 is not limited to the printed circuit board body 1 having a single layer structure, but can be changed to one composed of a multilayer printed circuit board.

According to the printed circuit board having the above-described structure, in addition to the effect of the fifth embodiment, the continuity test can be performed easily and surely by using the pair of additional pads (second pads) 2c and 2d. Can be done.

(Seventh Embodiment) FIG. 19 is a plan view showing a configuration example of a printed circuit board according to a seventh embodiment of the present invention, and FIG. 20 is a print after mounting the semiconductor chip 4. It is a top view which shows the structural example of a board | substrate. In addition, FIG.
FIG. 3 is a schematic diagram showing a configuration example of a side surface cross section of a printed circuit board after mounting the semiconductor chip 4 and a side surface of the semiconductor chip 4.

The printed circuit board according to the present embodiment is provided at a predetermined interval from the printed circuit board body 1, forms a pair, is in the same direction as the semiconductor chip 4 to be attached, and is substantially in the center of the semiconductor chip 4. Pad (first pad) 2e, which is a plate-shaped member made of a planar conductive material, having an extended portion (second extended portion) 11b extended to
2f and a recess 1 provided in the approximate center of each pad 2e, 2f
It is composed of a groove 12 (first surplus solder fixing portion) and a solder resist 3 which covers the pads 2e and 2f of the printed board and a portion other than the groove 12.

The recess 12b of the groove 12 has a structure comprising a bottom surface 12a and a wall which stands upright from the bottom surface.

The length of each side of the bottom surface 12a of the groove 12 can be changed to any length.

The shape of the recess 12b of the groove 12 is not limited to a substantially rectangular parallelepiped shape, and may have a curved surface on any surface.

The planar shape of each pad 2e, 2f is
Not limited to the shape having the extension portion (second extension portion) 11b,
The shape can be changed to any shape such as a substantially rectangular shape, a substantially trapezoidal shape, a substantially square shape, and a substantially polygonal shape.

Incidentally, in the present embodiment, the pair of pads 2
Although one groove 12 is provided in the substantially central portion between e and 2f, the position where the groove 12 is provided is not limited to the approximately central portion, and may be recessed anywhere between the pads 2e and 2f. . Further, the number of the grooves 12 is not limited to one as in the present embodiment,
It can be changed to an arbitrary number such as two or three.

The size and plane shape of the printed circuit board body 1 can be changed to any size and shape.

Further, the printed circuit board body 1 is not limited to the printed circuit board body 1 having a single layer structure, but can be changed to one having a multilayer printed circuit board.

According to the printed circuit board having the above-described structure, when the semiconductor chip 4 is mounted on the printed circuit board, the surplus solder 6c flows into the groove 12 to be accommodated inside the groove 12, and the semiconductor chip 4 is mounted at the time of mounting. Serves as a cover for the groove 12, so that the excess solder 6c cannot be exposed on the surface of the printed circuit board, and the excess solder 6c prevents the solder balls 6
It is possible to prevent b from being generated. As a result,
It is possible to prevent a defect that causes a short circuit.

Further, according to the present embodiment, each pad (first pad) having the extension portion (second extension portion) 11b.
The contact areas between the semiconductor chip 4 and the solder can be widely secured by 2e and 2f, and even if there is some mounting misalignment of the semiconductor chip 4, solder print blurring, solder print misalignment, etc. It can be prevented.

(Eighth Embodiment) FIG. 22 is a plan view showing a structural example of a printed circuit board according to an eighth embodiment of the present invention, and FIG. 23 is a print after mounting the semiconductor chip 4. It is a top view which shows the structural example of a board | substrate.

The printed circuit board of the present embodiment has a printed circuit board body 1 and three pairs of mutually-sized ones which are provided with a predetermined interval so that three types of semiconductor chips of different sizes can be selected. Third pads 2g, 2h of a plate-like member made of a conductive material having different substantially U-shaped plane shapes
And the fourth pads 2i to 2l and three pairs of different sizes, which are provided at predetermined side intervals on the side surfaces of the respective semiconductor chips in correspondence with the three types of semiconductor chips of different sizes. 2d to 2r, which are plate-like members made of a conductive material having a substantially circular planar shape and made of a conductive material, and a second wiring pattern 8i for mutually connecting each pair of pads. , 8j and the solder resist 3 covered on the portions other than the pads of this printed circuit board.
It consists of and.

Each of the pads 2g to 2j has a substantially U-shaped planar shape having two extension portions extended to both side surfaces of the semiconductor chip 4 to be attached from the viewpoint of fixing the excess solder 6c on the side surface. There is.

Further, each pad 2k, 2l has an extended portion extending in the substantially central portion of the semiconductor chip 4 in the same direction as the semiconductor chip 4 to be attached from the viewpoint of stably holding the attached semiconductor chip 4 by soldering. It has a planar shape.

Here, the pad 2g and the pad 2h, the pad 2i and the pad 2j, and the 2k and the pad 2l are mirror images of each other.

Further, the pad 2g, the pad 2i, and the pad 2k are connected by the wiring pattern 8i.

On the other hand, the pad 2h, the pad 2j, and the pad 2l are connected by the wiring pattern 8j.

The size of the printed circuit board body 1 can be changed to any size.

Further, the printed circuit board body 1 is not limited to the printed circuit board body 1 having a single layer structure, but can be changed to one composed of a multilayer printed circuit board.

In this embodiment, since the semiconductor chip is mounted on the printed circuit board, the number of selectable semiconductor chips is three. However, the present invention is not limited to this, and two, four, or five types can be arbitrarily changed. Is.

The third and fourth pads 2g to 2
The shape of l is not limited to the substantially U-shape, but can be changed to any shape such as a substantially rectangular shape, a substantially square shape, and a substantially polygonal shape, and the shape of each pair of pads may be different from each other. .

The plane shape of each additional pad (second surplus solder fixing portion) 2m to 2r is not limited to a substantially circular shape,
The shape can be changed to any shape such as a substantially elliptical shape, a substantially rectangular shape, a substantially trapezoidal shape, and a substantially polygonal shape.

According to the printed circuit board having the above-described structure, in addition to the effect similar to that of the first embodiment, the semiconductor chip 4 to be mounted can be arbitrarily selected by the manufacturer, so that the relatively large semiconductor chip 4 can be selected. By doing so, highly accurate mounting equipment can be eliminated.

Further, according to the present embodiment, since the semiconductor chip 4 can be arbitrarily selected, the inventory of the semiconductor chips 4
The lead time required for manufacturing can be shortened and the cost can be reduced regardless of availability.

(Ninth Embodiment) FIG. 24 is a plan view showing a structural example of a printed circuit board according to a ninth embodiment of the present invention, and FIG. 25 is a print after mounting the semiconductor chip 4. It is a top view which shows the structural example of a board | substrate.

The printed circuit board of this embodiment is intended to facilitate the continuity test of the printed circuit board of the eighth embodiment. Specifically, each of the third pads 2g, 2
h, the respective fourth pads 2i to 2l, and the respective semiconductor chips 4 corresponding to the respective pads, when mounted, the additional pads (the first pad) provided on both side surfaces of the semiconductor chip 4 with a predetermined space therebetween. 2 surplus solder fixing portions) 2m to 2r and each two wiring patterns (third wiring pattern) 8k to 8
This is a configuration in which p is provided.

Here, the pad 2g and the additional pad 2m are connected by the wiring pattern 8k. The pad 2h and the additional pad 2n are connected by the wiring pattern 8l. The pad 2i and the additional pad 2o are connected by the wiring pattern 8m. The pad 2j and the additional pad 2p are connected by the wiring pattern 8n. Pad 2k and additional pad 2
and q are connected by a wiring pattern 8o. Pad 2l
And the additional pad 2r are connected by a wiring pattern 8p.

The size of the printed circuit board body 1 can be changed to any size.

Further, the printed circuit board main body 1 is not limited to the printed circuit board main body 1 having a single layer structure, but can be changed to one composed of a multilayer printed circuit board.

According to the printed circuit board having the above structure, in addition to the effect of the eighth embodiment, the continuity test is facilitated by using each additional pad (second surplus solder fixing portion) 2m to 2r. Can be done.

(Tenth Embodiment) FIG. 26 is a plan view showing a structural example of a printed circuit board according to a tenth embodiment of the present invention, and FIG. 27 is a print after mounting the semiconductor chip 4. It is a top view which shows the structural example of a board | substrate.

The printed circuit board of this embodiment is composed of the printed circuit board body 1 and the electrodes 5a and 5b of the semiconductor chip 4.
And a solder resist 3 provided on a portion other than the pads 2s and 2t of the printed circuit board. ing.

Here, each of the pads 2s and 2t has an extended portion (third extended portion) 11c extended to both sides of the semiconductor chip 4 from the viewpoint of holding the excess solder 6c on the side surface of the semiconductor chip 4, and the semiconductor. An extension portion (fourth extension portion) extended in the same direction as the semiconductor chip 4 and to the substantially central portion of the semiconductor chip 4 from the viewpoint of ensuring a large contact area between the chip 4 and the solder and maintaining soldering quality. 11d is a plate-shaped member made of a planar conductive material.

The planar shape of each pad 2s, 2t is
The planar shape is not limited to the planar shape in this embodiment as long as the planar shape has the extension.

The size of the printed circuit board body 1 can be changed to any size.

Further, the printed circuit board body 1 is not limited to the printed circuit board body 1 having a single layer structure, but can be changed to one composed of a multilayer printed circuit board.

According to the printed circuit board having the above-described structure, the surplus solder 6c is soldered to the pads (fifth pads) 2s and 2t having the extension portions 11c and 11d. It is possible to secure a wide contact area.

Further, according to the present embodiment, when the semiconductor chip 4 is mounted, the solder is held by the extension portion (third extension portion) 11c, so that the generation of the solder ball 6b is prevented and a short circuit occurs. It is possible to prevent problems.

Furthermore, according to the present embodiment, the contact area between the semiconductor chip 4 and the solder can be secured by the extended portion (fourth extended portion) 11d extended to the substantially central portion of the semiconductor chip 4. Even if there is some misalignment of the semiconductor chip 4, solder printing blurring, solder printing misalignment, and the like, it is possible to prevent problems due to contact failure.

Furthermore, according to the present embodiment, by providing the extension portions 11c and 11d on the pads 2s and 2t, the same defect prevention effect as in the first to seventh embodiments can be realized, and the additional pads, Through holes, via holes, etc. can be omitted.

The present invention is not limited to the above-mentioned respective embodiments, and can be variously modified at the stage of implementation without departing from the spirit of the invention.

Further, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements. For example, even if some constituent elements are deleted from all the constituent elements shown in the embodiment, the problem described in the section of the problem to be solved by the invention can be solved, and it is described in the section of the effect of the invention. When the effect of being obtained is obtained, a configuration in which this constituent element is deleted can be extracted as an invention.

[0158]

As described above in detail, according to the present invention, defects due to solder balls and poor connection can be eliminated, and
It is possible to provide a printed circuit board that does not require high-precision mounting equipment and does not require labor for visual inspection and repair work.

[Brief description of drawings]

FIG. 1 is a plan view showing a configuration example of a printed circuit board according to a first embodiment of the present invention.

FIG. 2 is a partial cross-sectional view of a configuration example of a printed circuit board according to this embodiment.

FIG. 3 is a plan view showing a configuration example of a printed circuit board after mounting a semiconductor chip.

FIG. 4 is a schematic diagram showing a configuration example of a side surface of a part of a printed circuit board after mounting a semiconductor chip and a side surface of the semiconductor chip.

FIG. 5 is a plan view showing a configuration example of a printed circuit board according to a second embodiment of the present invention.

FIG. 6 is a plan view showing a configuration example of a printed circuit board after mounting a semiconductor chip.

FIG. 7 is a plan view showing a configuration example of a printed circuit board according to a third embodiment of the present invention.

FIG. 8 is a partial cross-sectional view of a configuration example of this printed circuit board.

FIG. 9 is a plan view showing a configuration example of a printed circuit board after mounting a semiconductor chip.

FIG. 10 is a schematic view showing a configuration example of a side surface of a part of a printed circuit board after mounting a semiconductor chip and a side surface of the semiconductor chip.

FIG. 11 is a plan view showing a configuration example of a printed circuit board according to a fourth embodiment of the present invention.

FIG. 12 is a partial cross-sectional view of a configuration example of this printed circuit board.

FIG. 13 is a plan view showing a configuration example of a printed circuit board after mounting a semiconductor chip.

FIG. 14 is a schematic diagram showing a configuration example of a cross section of a side surface of a printed circuit board after mounting a semiconductor chip and a side surface of the semiconductor chip.

FIG. 15 is a plan view showing a configuration example of a printed circuit board according to a fifth embodiment of the present invention.

FIG. 16 is a plan view showing a configuration example of a printed circuit board after mounting a semiconductor chip.

FIG. 17 is a plan view showing a configuration example of a printed circuit board according to a sixth embodiment of the present invention.

FIG. 18 is a plan view showing a configuration example of a printed circuit board after mounting a semiconductor chip.

FIG. 19 is a plan view showing a configuration example of a printed circuit board according to a seventh embodiment of the present invention.

FIG. 20 is a plan view showing a configuration example of a printed circuit board after mounting a semiconductor chip.

FIG. 21 is a schematic diagram showing a configuration example of a side surface cross section of a printed circuit board after mounting a semiconductor chip and a side surface of the semiconductor chip.

FIG. 22 is a plan view showing a configuration example of a printed circuit board according to an eighth embodiment of the invention.

FIG. 23 is a plan view showing a configuration example of a printed circuit board after mounting a semiconductor chip.

FIG. 24 is a plan view showing a configuration example of a printed circuit board according to a ninth embodiment of the invention.

FIG. 25 is a plan view showing a configuration example of a printed circuit board after mounting a semiconductor chip.

FIG. 26 is a plan view showing a configuration example of a printed circuit board according to a tenth embodiment of the invention.

FIG. 27 is a plan view showing a configuration example of a printed circuit board after mounting a semiconductor chip.

FIG. 28 is a plan view showing a configuration example of a printed circuit board of this type which has been conventionally used.

FIG. 29 is a partial cross-sectional view of a printed circuit board of this type.

FIG. 30 is a plan view showing an example of a semiconductor chip mounted on a printed circuit board of this type.

FIG. 31 is a side view of the semiconductor chip.

FIG. 32 is a plan view showing a configuration example of a printed circuit board after mounting a semiconductor chip.

FIG. 33 is a schematic diagram showing a configuration example of a side cross section of a part of a printed circuit board after mounting a semiconductor chip and a side surface of the semiconductor chip.

FIG. 34 is a plan view showing a configuration example of a printed circuit board having solder balls.

FIG. 35 is a schematic diagram showing a configuration of a side surface of a part of a printed circuit board having a solder ball and a side surface of a semiconductor chip.

FIG. 36 is a plan view showing a configuration example of a printed circuit board having a problem due to poor connection.

FIG. 37 is a schematic view showing a configuration example of a cross section of a side surface of a part of a printed circuit board and a side surface of a semiconductor chip in which a defect due to poor connection occurs.

[Explanation of symbols]

1: Printed circuit board body 1a: multilayer printed circuit board 1b: the first layer 1c: second layer 1d: the third layer 2a: pad 2b: Pad 2c: additional pad 2d: additional pad 2e: Pad 2f: Pad 2g: Pad 2h: Pad 2i: Pad 2j: pad 2k: Pad 2l: Pad 2m: additional pad 2n: additional pad 2o: additional pad 2p: additional pad 2q: Additional pad 2r: additional pad 2s: Pad 2t: Pad 3: Solder resist 4: Semiconductor chip 4a: semiconductor chip body 5a: electrode 5b: electrode 6a: Solder 6b: Solder ball 6c: surplus solder 7: Flux residue 8a: Wiring pattern 8b: Wiring pattern 8c: Wiring pattern 8d: Wiring pattern 8e: Wiring pattern 8f: Wiring pattern 8g: Wiring pattern 8h: Wiring pattern 8i: Wiring pattern 8j: Wiring pattern 8k: Wiring pattern 8l: Wiring pattern 8m: Wiring pattern 8n: Wiring pattern 8o: Wiring pattern 8p: Wiring pattern 9a: Through hole 9b: Through hole 10a: Beer hole 10b: Beer hole 11a: first extension 11b: second extension 11c: Third extension 11d: fourth extension 12: groove 12a: bottom 12b: invagination

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Manabu Katabuchi             1-24 East, 2-24 Harumi-cho, Fuchu-shi, Tokyo             Shiba IT Control System Co., Ltd.             In the company (72) Inventor Yuuji Saito             No. 1 Toshiba-cho, Fuchu-shi, Tokyo Toshiba Corporation             Fuchu Office F-term (reference) 5E319 AA03 AB05 AC01 AC15 BB05                       CC33 GG05

Claims (10)

[Claims] 1. A printed circuit board to which a semiconductor chip can be attached, the printed circuit board body having a predetermined space on the surface of the printed circuit board body for attaching electrodes of the semiconductor chip to the printed circuit board body. A printed circuit board comprising a pair of first pads provided as described above, and a first surplus solder fixing portion provided between the first pads. 2. The printed circuit board according to claim 1, further comprising a first wiring pattern for connecting each of the first pads and the first surplus solder fixing portion. 3. The printed circuit board according to claim 1 or 2, wherein the first excess solder-bonded portions are provided on the surface of the printed circuit board body at a predetermined interval. A printed circuit board, which is a second pad. 4. The printed circuit board according to claim 1, wherein the first excess solder fixing portion is at least a pair of through holes provided on the surface of the printed circuit board body with a predetermined space. A printed circuit board characterized by the above. 5. The printed circuit board according to claim 2, wherein the first surplus solder fixing portion is at least a pair of via holes provided on the surface of the printed circuit board body with a predetermined space. Printed circuit board characterized by. 6. The printed circuit board according to claim 1, wherein each of the first pads extends on the surface of the printed circuit board body and in the same direction as the excess solder fixing portion. A printed circuit board having a planar shape including an extension of the printed circuit board. 7. The printed circuit board according to claim 1, wherein each of the first pads has a planar shape including a second extension portion extended in the same direction as the semiconductor chip, The printed board, wherein the first excess solder fixing portion is at least one groove provided between the first pads. 8. A printed circuit board to which a plurality of semiconductor chips can be selectively attached, the printed circuit board body, and a surface of the printed circuit board body for attaching electrodes of each semiconductor chip to the printed circuit board body. A pair of third pads provided at a predetermined interval on the surface of the printed circuit board body, and at least a pair of third pads different in size from the third pad. A fourth pad, and a second pad that connects the third pad and the fourth pad.
And a plurality of second surplus solder fixing portions that are individually provided corresponding to the third pads and the fourth pads, respectively. 9. The printed circuit board according to claim 8, wherein the third pads and the fourth pads are individually and individually corresponding to the third pads and the fourth pads. A printed circuit board, wherein a plurality of third wiring patterns for individually connecting the plurality of second surplus solder fixing portions provided are added. 10. A printed circuit board body, and a pair of fifth pads provided on the surface of the printed circuit board body at predetermined intervals for attaching electrodes of a semiconductor chip to the printed circuit board body. A printed circuit board comprising: the fifth pad, a third extension portion extending on both sides of the semiconductor chip,
A printed circuit board having a planar shape including a fourth extension extending in the same direction as the semiconductor chip.