JP2003007647A - Dicing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a dicing apparatus having a processor which draws, lays and fixes a dicing sheet enough to prevent the sheet, if it is slacked, from crumpling in a spin cleaner to avoid a chip from peeling off due to spinning. SOLUTION: A frame receiving surface 44A of a spinner frame holder 44 for mounting a frame F is formed, at a lower position than the upside of a spinner vacuum board 42 of a spinner table 41 for mounting a work, so as to vacuum chuck the work with the frame F sufficiently depressed to take in the slack of a dicing sheet S. Since the apparatus is thus structured to vacuum chuck, while eliminating the slack of the dicing sheet S, the problem of the sheet S crinkling to peel off and scatter a chip C adhered to its crinkles.

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing apparatus, and more particularly to a dicing apparatus for cutting a wafer (work) such as a semiconductor in a grid pattern. 2. Description of the Related Art A dicing apparatus includes a rotary blade.
Is a device for cutting a work (semiconductor wafer) into individual chips by rotating at a high speed. As shown in FIG. 1, a work is a dicing sheet S having a rigid frame F having an adhesive on one surface.
, The work W, the dicing sheet S and the frame F are integrally adhered, and are put into the dicing device in this state. In the dicing apparatus, as shown in FIG. 4, the work W is placed on a cutting table 23, and the cutting direction (X
Direction) and the Y-index feed of the rotary blade 21 cuts all streets in one direction (CH
1 cutting). Next, the work W is rotated 90
Then, all the streets in the direction perpendicular to the CH1 direction are cut in the same manner (CH2 cutting). In the cutting, cooling water is supplied from a cooling water nozzle 29. By the way, the thickness of the frame F to which the work W is integrally adhered is generally 1.5 mm in the case of a stainless steel frame and 3 mm in the case of a resin frame, which is thicker than the semiconductor wafer as the work. Therefore, when the work W is fully cut, it may interfere with the rotary blade 21. In particular, in the case of a dual-spindle type dicing apparatus in which two spindles each having a rotary blade attached to the tip are opposed to each other in the Y-direction, depending on the arrangement of the two spindles in the Y-direction and the method of assembling the cutting sequence, either one is required. That rotary blade may interfere with the frame. For this reason, as shown in FIG. 4, the cutting table 23 has a frame table 26 on which the frame F is placed.
The third suction plate 24 is configured to be one position lower than the upper surface. Here, when the work W is placed on the cutting table 23, the work W portion is suction-fixed by the suction plate 24 of the cutting table 23, and the frame F portion is placed on the frame receiver 26 while the dicing sheet S is stretched. Then, the frame is fixed by frame clampers 27, 27,... Attached to rotating cylinders 28, 28,. The work W placed on the cutting table 23 in this manner is
The CH1 cutting and the CH2 cutting are performed as described above without interfering between the rotary blade 21 and the frame F, and cut into individual chips. In the above cutting, the rotating blade 21 has a thickness of the work W plus 5 to 10 μm on the dicing sheet S.
Although the full cut is performed with the cut amount, the individual chips are still attached to the dicing sheet S even after being cut. Next, a transport unit (not shown) sucks the frame F and transports the work W from the cutting table 23 to the spin cleaning unit. In the spin cleaning section, as shown in FIG. 5, the work W is placed on a spinner table 41, rotated at high speed, and spin-cleaned with cleaning water. As shown in FIG. 5, the spinner table 41 is divided into a spinner suction disk 42 for sucking and fixing the portion of the work W and a spinner frame receiver 44 for mounting the frame portion. The position of the frame receiving surface 44 </ b> A of the spinner frame receiver 44 is at the same height as the upper surface of the spinner suction disk 42. However, when the work W is cut into individual chips at the processing section, the dicing sheet S is fixed to the cutting table 23 in a stretched state, and is cut. Sometimes, the dicing sheet S is slacked when the conveying means sucks the frame F and conveys the frame F to the spin cleaning unit, because the cutting is performed by cutting the frame F at 5 to 10 μm. When the frame F is placed on the spinner frame receiver 44 in a state in which the dicing sheet S is slack, wrinkles may be generated in one portion of the dicing sheet S to which the work W is stuck, as shown in FIG. is there. FIG. 5 shows the wrinkled dicing sheet.
, Divided chips C, C,... Are attached. When the spinner table 41 is rotated at a high speed while sucking the portion of the work W in this state, the chips C, C,... Adhered to the wrinkled portions are blown off by centrifugal force. Especially chip C is 1mm ×
In the case of a small size of 1 mm or less, this phenomenon easily occurs. As described above, in the conventional dicing apparatus, there is a problem that the chip C is peeled and flows out due to wrinkles due to the slack of the dicing sheet S in the spin cleaning section, and the yield is reduced. The present invention has been made in view of such circumstances, and provides a dicing apparatus in which a chip C is not peeled off in a spin cleaning section even when the dicing sheet S is stretched and placed and fixed in a processing section. According to the present invention, there is provided a dicing apparatus for dividing a work adhered to a frame via a dicing sheet into individual chips in order to achieve the above object. A processing section having a rotary blade for processing the workpiece and a cutting table for mounting the workpiece, and a spin cleaning section for mounting the processed workpiece and supplying cleaning water to a high-speed rotating spinner table to wash the workpiece. ,
A dicing apparatus having a conveying unit configured to convey the work from the cutting table to the spinner table, wherein the spinner table has a spinner suction disk for suction-mounting the work portion and a spinner frame for mounting the frame portion. And a frame receiving surface of the spinner frame receiver is positioned lower than an upper surface of the spinner suction disk. Since the present invention is configured as described above,
Even if the dicing sheet is stretched in the processing section and the slack is generated, when the work is placed on the spinner table, the dicing sheet is stretched and fixed to the spinner table in a wrinkle-free state. No chips are peeled off. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A dicing apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 2 is a front view of the dicing apparatus 10 according to the embodiment of the present invention. As shown in FIG. 2, the dicing apparatus 10 includes two spindles 22 each having a rotary blade 21 at the tip thereof, opposed to each other in the Y direction. A processing section 20 in which the cutting table 23 is cut and fed by the X table 30 in the X direction; a spin cleaning section 40 in which the processed work W is rotated and washed and dried at a high speed with washing water; Port 60 for transferring the cassette containing the paper to and from the external transfer device
And a transport unit 50 for transporting the work W to each unit inside the apparatus. FIG. 3 shows the spin cleaning section 40. The spin cleaning unit 40 includes a spin rotation unit 43 that rotates at high speed by a motor (not shown), and a spinner suction disk 42 made of a porous material that suctions a portion of the work W stuck on the dicing sheet S is provided above the spin rotation unit 43. Further, there is provided a spinner frame receiver 44 on which a portion of the frame F on which the dicing sheet S is stuck is placed. The position in the height direction of the frame receiving surface 44A where the frame F of the spinner frame receiver 44 is placed is formed at a position about 3 mm lower than the upper surface of the spinner suction disk 42. The spinner frame receiver 44 has four
The centrifugal force clampers 46, 46,... Rotatable around the rotation center 46A are provided at the positions. The centrifugal clampers 46, 46,...
This is for fixing the frame F mounted on 4 at the time of rotation. The distal end of the centrifugal force clamper 46 is a clamp portion 46B for fixing the frame F, and the opposite side of the rotation center 46A is a weight portion 46C. Centrifugal clamper 46
Is usually oriented in the vertical direction in which the weight portion 46C is positioned on the lower side, and the weight portion 46C is lifted by centrifugal force due to the high speed rotation of the spinner table, and the clamp portion 4
The frame F is fixed at 6B. The spin cleaning unit 40 further has a cleaning water nozzle 47 for supplying cleaning water from above the high-speed rotating work W, and the cleaning water nozzle 47 is connected to a nozzle rotating unit 47A that is reciprocated by a motor (not shown). The reciprocating rotation is performed so that the cleaning water is evenly distributed on the upper surface of the workpiece W that is rotating at a high speed. These spin cleaning units 40
Is covered with a spinner case 48, and the upper slide cover 49 opens and closes when the work W is loaded and unloaded. Next, the operation will be described. Since the operation of the entire dicing apparatus 10 is an operation that is generally known, the description thereof will be omitted, and the operation of the spin cleaning unit will be described. First, the work F cut into individual chips C, C,...
And is transported to the spin cleaning unit 40 by the frame suction unit 51. The transporting means 50 is configured to be capable of rotating motion and vertical motion. In the spin cleaning section 40, the slide cover 49 is open. Here, the transport means 50 places the portion of the work W on the spinner suction disk 42 of the spinner table 41 while holding the frame F, and presses the frame F against the frame receiving surface 44A of the spinner frame receiver 44. Although the dicing sheet S has been stretched once in the processing section, the sag has occurred. However, since the frame receiving surface 44A is located at a position lower than the upper surface of the spinner suction disk 42, the slack of the dicing sheet S is extended by this pressing operation. In addition, no wrinkles are formed on the portion of the work W on the spinner suction disk 42. In this state, the spinner suction disk 42 vacuum-adsorbs the portion of the work W. Next, the suction of the frame suction section 51 of the transport means 50 is released, and the slide means is retracted upward, and the slide cover 49 is closed. Next, the spin rotation unit 43 is rotated at a high speed by a motor (not shown). When the spin rotation unit 43 rotates, a centrifugal force clamper 46 provided on the spinner frame receiver 44,
.. Work to fix the frame F. On the other hand, the washing water nozzle supplies the washing water to the work W while reciprocatingly rotating along the upper surface of the work W above the work W. When the spin cleaning is performed for a predetermined time, the supply of the cleaning water from the cleaning water nozzle 47 is stopped, and dry air is supplied from the cleaning water nozzle to dry the work W. When the drying for a predetermined time is completed, the rotation of the spin rotation unit 43 is stopped, the centrifugal force clamper 46 releases the fixing of the frame F, and the suction of the spinner suction disk 42 is released. Then slide cover 4
9 is opened, the frame suction unit 51 of the transfer device 50 sucks the frame F, and unloads the work W. The above is the operation of the spin cleaning unit 40 of the dicing apparatus 10 according to the present invention. During the spin cleaning and the spin drying, the dicing sheet S has no wrinkles, so that the individual chips C, C,... Do not peel off and scatter from the dicing sheet. In the embodiment described above, the height direction of the frame receiving surface 44A of the spinner frame receiver 44 is formed at a position about 3 mm lower than the upper surface of the spinner suction disk 42. Is appropriately selected depending on the size of the frame F, the size of the work W, the thickness and the material of the dicing sheet, and the like. As described above, according to the dicing apparatus of the present invention, the mounting surface of the frame is formed at a position lower than the mounting surface of the work on the spinner table.
By pressing the frame downward, the work is sucked while the dicing sheet is stretched, so even if the dicing sheet is stretched once in the processing part and there is slack, the work can be sucked without wrinkling. As a result, chips are not peeled off and scattered by spin cleaning.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view illustrating a form of a work handled by a dicing apparatus. FIG. 2 is an overall perspective view of a dicing apparatus according to an embodiment of the present invention. FIG. FIG. 4 is a cross-sectional view illustrating a spin cleaning section of the dicing apparatus according to the embodiment. FIG. 4 is a front view illustrating a processing section of the dicing apparatus. FIG. 5 is a cross-sectional view illustrating a spin cleaning section of a conventional dicing apparatus. ... Frame, S ... Dicing sheet, W ... Work, 1
0: dicing machine, 20: processing part, 21: rotary blade, 2
3. Cutting table, 40: Spin cleaning unit, 41
... Spinner table, 42 ... Spinner suction disk, 44
... Spinner frame receiver, 44A ... Frame receiving surface, 50
... Transportation means

   ────────────────────────────────────────────────── ─── Continuation of front page    (72) Inventor Takayuki Kaneko             9-7-1 Shimorenjaku, Mitaka-shi, Tokyo Stock             Tokyo Seimitsu Co., Ltd.

Claims (1)

Claims 1. A dicing apparatus for dividing a work adhered to a frame via a dicing sheet into individual chips, comprising: a rotary blade for processing the work; and a cutting table for mounting the work. A spin cleaning unit that supplies cleaning water to a spinner table that rotates the high-speed rotating work table by mounting the processed work, and a spin cleaning unit that cleans the work from the cutting table to the spinner table. In a dicing apparatus having a conveying means for conveying, the spinner table has a spinner suction disk for suction-mounting the work portion and a spinner frame receiver for mounting the frame portion,
A dicing apparatus, wherein a frame receiving surface of the spinner frame receiver is positioned lower than an upper surface of the spinner suction disk.